WO2019064896A1 - Moteur - Google Patents

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Publication number
WO2019064896A1
WO2019064896A1 PCT/JP2018/028636 JP2018028636W WO2019064896A1 WO 2019064896 A1 WO2019064896 A1 WO 2019064896A1 JP 2018028636 W JP2018028636 W JP 2018028636W WO 2019064896 A1 WO2019064896 A1 WO 2019064896A1
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WO
WIPO (PCT)
Prior art keywords
heat sink
capacitor
circuit board
housing
motor
Prior art date
Application number
PCT/JP2018/028636
Other languages
English (en)
Japanese (ja)
Inventor
小川　裕史
佳明 山下
Original Assignee
日本電産株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電産株式会社 filed Critical 日本電産株式会社
Priority to CN201880053564.8A priority Critical patent/CN111033964B/zh
Priority to JP2019544352A priority patent/JPWO2019064896A1/ja
Publication of WO2019064896A1 publication Critical patent/WO2019064896A1/fr

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K11/00—Structural association of dynamo-electric machines with electric components or with devices for shielding, monitoring or protection
    • H02K11/30—Structural association with control circuits or drive circuits
    • H02K11/33—Drive circuits, e.g. power electronics
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K5/00—Casings; Enclosures; Supports
    • H02K5/04—Casings or enclosures characterised by the shape, form or construction thereof
    • H02K5/22—Auxiliary parts of casings not covered by groups H02K5/06-H02K5/20, e.g. shaped to form connection boxes or terminal boxes

Definitions

  • the present invention relates to a motor.
  • Patent Document 1 discloses a motor drive device in which an electric field capacitor (capacitor) is housed in a housing portion of an electronic controller unit (ECU) housing.
  • ECU electronic controller unit
  • one aspect of the present invention aims to provide a motor that promotes heat dissipation of a circuit board around the capacitor in addition to heat dissipation of the capacitor itself.
  • a motor body having a rotor rotatable with respect to a central axis and a stator radially opposed to the rotor, and electrically connected to the motor body, the planar direction And a heat sink directly or indirectly in contact with the circuit board, wherein the circuit board is on one side of the circuit board.
  • the heat sink has a first surface and a second surface on the other side, and the second surface has a capacitor overlap region overlapping with the capacitor when viewed from the direction orthogonal to the plane direction of the circuit board, the heat sink Covers at least a part of the side surface of the capacitor on one side of the circuit board and covers the capacitor overlap region on the other side of the circuit board.
  • a motor that promotes heat dissipation of the circuit board around the capacitor in addition to heat dissipation of the capacitor itself.
  • FIG. 1 is a perspective view of a motor according to an embodiment, showing a state in which a lid is removed upward from a housing.
  • FIG. 2 is a cross-sectional view of the motor taken along line II-II of FIG.
  • FIG. 3 is an enlarged view of a V region of FIG.
  • FIG. 4 corresponds to a first modification of the configuration shown in FIG.
  • FIG. 5 corresponds to a second modification of the configuration shown in FIG. 6
  • FIG. 6 is a cross-sectional view of a third modification of the motor of FIG. 1 and corresponds to the third modification of the configuration shown in FIG.
  • an XYZ coordinate system is shown as a three-dimensional orthogonal coordinate system as appropriate.
  • the direction is parallel to the axial direction of the central axis J described later.
  • the X-axis direction is a direction orthogonal to the Z-axis direction.
  • the Y-axis direction is orthogonal to both the X-axis direction and the Z-axis direction.
  • the positive side in the Z-axis direction (+ Z side) is referred to as “upper side”
  • the negative side in the Z-axis direction ( ⁇ Z side) is referred to as “lower side”.
  • the upper side and the lower side are names used merely for explanation, and do not limit the actual positional relationship or direction.
  • a direction (Z-axis direction) parallel to the central axis J of the motor body 2 described in the latter part is simply referred to as “axial direction”
  • a radial direction centered on the central axis J is simply “diameter
  • the circumferential direction around the central axis J, that is, around the axis of the central axis J, is simply referred to as “direction”.
  • the “plan view” means a state viewed from the upper side along the axial direction.
  • FIG. 1 is a perspective view of the motor 1 according to the present embodiment, showing a state in which a lid 40 described later is removed upward from a housing (heat sink, first heat sink, part of the heat sink) 50 .
  • FIG. 2 is a cross-sectional view of the motor 1 taken along the line II-II in FIG.
  • FIG. 3 is a cross-sectional view of the motor 1 and is an enlarged view of a V region of FIG.
  • FIG. 4 is a cross-sectional view of a first modified example of the motor 1.
  • FIG. 5 is a cross-sectional view of a second modified example of the motor 1.
  • FIG. 6 is a cross-sectional view of a third modified example of the motor 1. 4 to 6 correspond to the cross-sectional views shown in FIG.
  • the motor 1 includes a motor body 2, an upper bearing 7A, a lower bearing 7B, a bearing holder 30, a circuit board 60, and a housing (heat sink, first heat sink, a part of the heat sink And a top heat sink (heat sink, second heat sink, another part of the heat sink) 80, and a lid 40.
  • the motor 1 has the housing 50 which accommodates the stator 25 and the circuit board 60 which will be described later.
  • An element housing 55 functioning as a part of the heat sink is located inside the housing 50.
  • the upper heat sink 80, which functions as another part of the heat sink, is exposed to the outside of the housing 50.
  • the element accommodating portion 55 is located inside the housing 50, and the stator 25 and the circuit board 60 are accommodated in the housing 50, whereby the components of the motor 1 can be integrated to save space and the size of the motor 1 can be suppressed. .
  • the heat from the element housing portion 55 and the heat from the capacitor overlap area 61X can be smoothly dissipated to the outside of the motor 1.
  • the motor body 2 has a rotor 20 and a stator 25.
  • the rotor 20 rotates about a central axis J extending along the vertical direction (axial direction).
  • the rotor 20 has a shaft 21, a rotor core 22, and a rotor magnet 23.
  • the shaft 21 extends along the central axis J.
  • the shaft 21 is rotatably supported around the central axis J by the upper bearing 7A and the lower bearing 7B.
  • the rotor core 22 is fixed to the shaft 21.
  • the rotor core 22 circumferentially surrounds the shaft 21.
  • the rotor magnet 23 is fixed to the rotor core 22. More specifically, the rotor magnet 23 is fixed to the outer surface of the rotor core 22 along the circumferential direction.
  • the rotor core 22 and the rotor magnet 23 rotate with the shaft 21.
  • the stator 25 is located radially outward of the rotor 20.
  • the stator 25 faces the rotor 20 in the radial direction via a gap, and surrounds the radially outer side of the rotor 20.
  • the stator 25 has a stator core 27, an insulator 28 and a coil 29.
  • the insulator 28 is made of an insulating material.
  • the insulator 28 covers at least a part of the stator core 27.
  • the coil 29 excites the stator core 27.
  • the coil 29 is configured by winding a coil wire (not shown). The coil wire is wound around the teeth portion of the stator core 27 through the insulator 28.
  • the end of the coil wire is drawn upward and passes through a through hole provided in the bearing holder 30 to be connected to the circuit board 60.
  • a bus bar is provided between the motor body 2 and the bearing holder 30, the end of the coil wire is connected to the bus bar and the bus bar is connected to the circuit board 60. That is, the motor body 2 has a rotor 20 rotatable with respect to the central axis J and a stator 25 radially opposed to the rotor 20.
  • the upper bearing 7A rotatably supports the upper end portion of the shaft 21.
  • the upper bearing 7A is located above the stator 25.
  • the upper bearing 7A is supported by the bearing holder 30.
  • the lower bearing 7B rotatably supports the lower end portion of the shaft 21.
  • the lower bearing 7B is located below the stator 25.
  • the lower bearing 7B is supported by the lower bearing holding portion 54c of the housing 50.
  • the upper bearing 7A and the lower bearing 7B are ball bearings.
  • the types of the upper bearing 7A and the lower bearing 7B are not particularly limited, and may be other types of bearings.
  • the housing 50 is located below the circuit board 60.
  • the housing 50 of the present embodiment is in direct contact with the circuit board 60 and functions as a heat sink for cooling the circuit board 60.
  • the housing 50 may be in direct contact with the circuit board 60 as long as the housing 50 is in thermal contact with the circuit board 60 to cool the circuit board 60. More specifically, the housing 50 may be in contact with the circuit board 60 via a heat dissipating material such as heat dissipating grease.
  • the housing 50 has a heat sink portion 53, a motor main body housing portion 54, and an element housing portion 55.
  • the housing 50 absorbs heat generated mainly by the circuit board 60 in the heat sink portion 53.
  • the housing 50 accommodates the motor body 2 in the motor body accommodating portion 54.
  • the housing 50 accommodates the capacitor 65 provided on the circuit board 60 in the element accommodating portion 55.
  • the housing 50 is configured as a single member. That is, the housing 50 has a function as a heat sink, a function of housing the motor body 2 and a function of housing the capacitor 65 in a single member.
  • the housing 50 and the element accommodating portion 55 which is a heat sink covering the capacitor 65 as a single member, it is possible to suppress the physical size of the motor 1 in the axial direction while saving the space of the heat sink.
  • the housing 50 may be a separate part in which at least one of the heat sink portion 53, the motor main body housing portion 54, and the element housing portion 55 is fastened by fastening means such as a screw. Further, the heat sink portion 53 and the motor main body housing portion 54 may be separate parts, and the heat sink portion 53 may be a part of the bearing holder 30.
  • the housing 50 is a single member, the heat of the circuit board 60 absorbed in the heat sink portion 53 can be efficiently dissipated not only in the heat sink portion 53 but also in the motor main body housing portion 54 and the element housing portion 55. . That is, according to the present embodiment, since the housing 50 is configured as a single member, the heat dissipation effect in the housing 50 is enhanced. Further, according to the present embodiment, since the housing 50 is formed of a single member, the assembly process of the motor 1 can be simplified.
  • the housing 50 is made of a metal material having high heat dissipation characteristics and sufficient rigidity.
  • the housing 50 is made of an aluminum alloy.
  • the housing 50 is manufactured by cutting a surface requiring accuracy after forming a schematic shape by die casting or the like.
  • the heat sink portion 53 extends in a direction orthogonal to the central axis J.
  • the heat sink portion 53 is located below the circuit board 60.
  • the heat sink portion 53 extends along the circuit board 60 below the circuit board 60.
  • the heat sink portion 53 is located between the motor body accommodating portion 54 and the element accommodating portion 55 in plan view, and connects the motor body accommodating portion 54 and the element accommodating portion 55.
  • the heat sink portion 53 has an upper surface 53a facing upward and a lower surface 53b facing downward.
  • a heat dissipation surface 53c is provided on the upper surface 53a of the heat sink 53.
  • the heat dissipation surface 53c is in direct contact with the lower surface (first surface) 61c of the substrate 61 of the circuit board 60 directly or indirectly via a member such as a heat dissipation material. That is, the heat sink portion 53 has a heat radiation surface 53 c in contact with the substrate body 61.
  • the heat sink portion 53 absorbs heat from the circuit board 60 at the heat dissipation surface 53 c to cool the circuit board 60.
  • the circuit board 60 has a plurality of field effect transistors 66 mounted on the upper surface (second surface) 61 d of the substrate body 61.
  • the field effect transistor 66 is also referred to as a FET (field effect transistor).
  • the field effect transistor 66 is a heating element that easily generates heat in the circuit board 60. As viewed in the axial direction, at least a portion of the field effect transistor 66 overlaps the heat dissipation surface 53c. Thereby, the heat generated by the field effect transistor 66 can be effectively transferred to the heat sink portion 53 at the heat dissipation surface 53c. Thus, the temperature of the field effect transistor 66 can be prevented from rising excessively, and the operation reliability of the field effect transistor 66 can be enhanced.
  • the heat-generating element overlapping the heat dissipation surface 53 c in the axial direction is the field effect transistor 66.
  • the heating element overlapping the heat dissipation surface 53c may be another mounted component (element).
  • the heat generating element means an element of the mounted parts that generates heat and becomes high temperature during operation.
  • the heating element in addition to the field effect transistor and the capacitor, a field effect transistor driving driver integrated circuit and a power supply integrated circuit are exemplified, but the type is not limited as long as it is an element which becomes high temperature.
  • the heat sink portion 53 is provided with a rib 56.
  • the rib 56 is located immediately below the heat dissipation surface 53 c in contact with the substrate body 61. That is, when viewed in the axial direction, at least a portion of the rib 56 overlaps the heat dissipation surface 53c.
  • the motor main body housing portion 54 has a tubular shape that opens on the upper side (+ Z side).
  • the motor body accommodating portion 54 extends downward from the heat sink portion 53.
  • the motor body accommodating portion 54 accommodates the rotor 20 and the stator 25.
  • the motor body accommodating portion 54 has a cylindrical portion 54a, a bottom portion 54b, and a lower bearing holding portion 54c.
  • the motor main body housing portion 54 may be a cylindrical member not having the bottom portion 54b. In this case, a bearing holder for holding a bearing is separately attached to the lower opening of the motor body housing portion 54.
  • the cylindrical portion 54 a surrounds the stator 25 from the radially outer side.
  • the cylindrical portion 54a is cylindrical.
  • the stator core 27 and the bearing holder 30 are fixed to the inner peripheral surface of the cylindrical portion 54a.
  • a heat sink portion 53 is connected to an outer peripheral surface of the cylindrical portion 54a, which is an upper end portion of the cylindrical portion 54a.
  • the bottom portion 54b is located at the lower end of the cylindrical portion 54a.
  • the bottom 54 b is located below the stator 25.
  • the lower bearing holding portion 54c is located at the center in plan view of the bottom portion 54b.
  • the lower bearing holding portion 54c holds the lower bearing 7B.
  • a hole 54d penetrating in the axial direction is provided at the center of the lower bearing holding portion 54c in a plan view. The lower end portion of the shaft 21 is inserted into the hole 54 d.
  • the element housing portion 55 opens on the upper side (+ Z side).
  • the element housing portion 55 extends downward from the heat sink portion 53.
  • the element housing portion 55 of the present embodiment houses three capacitors 65.
  • the three capacitors 65 are arranged along one direction (the Y-axis direction in this embodiment) orthogonal to the central axis J.
  • the element housing portion 55 has a longitudinal direction in which the three capacitors 65 are arranged (that is, the direction in which the second rib portion 56b extends) in plan view.
  • the dimension S1 in the longitudinal direction of the element housing portion 55 is smaller than the diameter D of the motor main body housing portion 54.
  • the dimension S1 in the longitudinal direction of the element housing portion 55 does not exceed the motor main body housing portion 54. Therefore, the dimension of the motor 1 can be suppressed in the direction orthogonal to the central axis J.
  • the capacitor 65 has a top surface 65 b facing downward and a side surface 65 a facing in a direction orthogonal to the axial direction.
  • the element housing portion 55 has a side wall portion 55a surrounding the side surface 65a of the capacitor 65, and a housing bottom portion 55b located below the capacitor 65 and axially opposed to the top surface 65b of the capacitor 65.
  • the housing 50 has the element accommodating portion 55 that accommodates the capacitor 65.
  • the capacitor 65 is a heating element that easily generates a large amount of heat in the circuit board 60 as compared to the field effect transistor 66 and other electronic components. Therefore, the heat generated in the capacitor 65 can be effectively absorbed in the element housing portion 55.
  • a heat dissipation material such as heat dissipation grease be accommodated between the side wall 55 a of the element accommodation portion 55 and the side surface 65 a of the capacitor 65.
  • heat dissipation material such as heat dissipation grease
  • the condenser 65 has an explosion-proof valve 90 at a tip 65t in a direction orthogonal to the plane direction. That is, the condenser 65 has the explosion-proof valve 90 at the tip 65 t in the axial direction of the motor body 2.
  • the outer diameter of the explosion-proof valve 90 is smaller than the diameter of the tip 65 t of the condenser 65.
  • a heat dissipation material may be disposed between the housing bottom 55 b of the element housing 55 and the top surface 65 b of the capacitor 65. The heat dissipating material is disposed to avoid at least the explosion-proof valve 90.
  • the element housing portion 55 may be configured to be opened downward without having the housing bottom portion 55b. Further, a part of the side wall 55 a of the element housing 55 may be opened in the horizontal direction. That is, the housing bottom 55 b and the side wall 55 a do not necessarily surround the top surface 65 b and the side surface 65 a of the capacitor 65. That is, the element housing portion 55 covers at least a part of the side surface 65 a of the capacitor 65 on the lower side (one side) of the circuit board 60. For example, the distance between the plurality of capacitors 65 may be wide. At this time, the element accommodating portion 55 becomes wide enough to be spaced apart from the side wall portion 55a. It may be the case where there is only one capacitor 65. In these cases, it is preferable that the element housing portion 55 cover the side surface 65 a of the capacitor 65 over the entire circumference.
  • the motor main body housing portion 54 and the element housing portion 55 separately extend downward from the heat sink portion 53. That is, the motor body accommodating portion 54 and the element accommodating portion 55 are separated from each other as viewed in the axial direction. According to the present embodiment, since the motor main body housing portion 54 and the element housing portion 55 are separately extended from the heat sink portion 53, the surface area of the outer peripheral surface of the housing 50 is increased, and the heat dissipation effect of the housing 50 can be enhanced. . As described above, the motor body housing portion 54 and the element housing portion 55 may be separate parts fixed to each other via the heat sink portion 53.
  • the housing 50 has an upper surface 50a facing upward.
  • the upper surface 50 a is provided across the motor main body housing portion 54 of the housing 50, the element housing portion 55 and the heat sink portion 53.
  • the upper surface 50 a faces the lid 40.
  • the upper surface 50a is provided with a second groove 52 extending along the outer edge of the upper surface 50a.
  • the second recessed groove 52 is recessed downward with respect to the upper surface 50a.
  • the second recessed groove 52 extends in a plane perpendicular to the central axis J with a uniform width and a uniform depth.
  • the second concave portion 52 accommodates the second convex portion 42 of the lid 40 described later.
  • the bearing holder 30 is located on the upper side (+ Z side) of the stator 25.
  • the bearing holder 30 supports the upper bearing 7A.
  • the plan view shape of the bearing holder 30 is, for example, a circular shape concentric with the central axis J.
  • the bearing holder 30 is positioned at the upper opening 54 e of the motor body housing 54 and is fixed to the inner circumferential surface of the motor body housing 54.
  • the bearing holder 30 includes a disk-shaped holder main body portion 31 having a donut shape in plan view, an upper bearing holding portion 32 positioned radially inward of the holder main body 31, and a holder positioned radially outward of the holder main body 31. And a fixing portion 33.
  • the upper bearing holder 32 holds the upper bearing 7A.
  • the upper bearing holder 32 is located at the center of the bearing holder 30 in plan view.
  • a hole 32 a penetrating in the axial direction is provided at the center of the upper bearing holder 32 in a plan view.
  • the upper end portion of the shaft 21 is inserted into the hole 32a.
  • the holder fixing portion 33 has a cylindrical shape that protrudes in the vertical direction at the radial outer edge of the holder main body 31.
  • the outer peripheral surface of the holder fixing portion 33 radially faces the inner peripheral surface of the motor main body housing portion 54.
  • the holder fixing portion 33 is fitted and fixed to the inner circumferential surface of the motor main body housing portion 54.
  • At least a part of the bearing holder 30 axially overlaps the heat sink portion 53 of the housing 50. Therefore, the space above the bearing holder 30 can be made sufficiently wide. As a result, the degree of freedom of the arrangement of the circuit board 60 located above the bearing holder 30 and the arrangement of the mounted components of the circuit board 60 can be increased.
  • the circuit board 60 is located above the motor body 2 and the bearing holder 30.
  • the circuit board 60 extends in a direction perpendicular to the central axis J (that is, a direction perpendicular to the vertical direction, a planar direction).
  • a coil wire extending from the coil 29 of the stator 25 is connected to the circuit board 60. That is, the circuit board 60 is electrically connected to the motor body 2 and extends in the planar direction.
  • the circuit board 60 supplies a current to the coil 29 to control the rotation of the rotor 20.
  • the circuit board 60 includes a substrate body 61, a plurality of (three in the present embodiment) capacitors 65, and a plurality of field effect transistors 66.
  • the substrate main body 61 further includes electronic components (not shown) for controlling the rotation of the rotor 20.
  • the circuit board 60 is located at a position different from the motor body 2 in the axial direction.
  • the condenser 65 is located radially outward of the motor body 2.
  • the element accommodating portion 55 of the housing 50 located on the side surface 65 a of the capacitor 65 has a distance from the outer peripheral surface 54 r of the motor main body accommodating portion 54. That is, the element housing portion 55 has a space between itself and the outer peripheral surface 2 of the motor body 2. Since the circuit board 60 is located above the motor body 2 in the axial direction and the capacitor 65 is located outside the motor body 2 in the radial direction, the heat from the capacitor overlap region 61X of the capacitor 65 and the circuit board 60 is transmitted to the motor body It can be difficult to communicate to 2.
  • the space between the element accommodating portion 55 of the housing 50 and the outer peripheral surface 2 r of the motor main body 2 also suppresses the influence of the heat radiation from the element accommodating portion 55 on the motor main body 2.
  • the element housing portion 55 has a large area exposed to the outside. Thus, the heat transmitted to the element housing portion 55 can be easily dissipated to the outside.
  • the substrate body 61 is disposed to be orthogonal to the axial direction (ie, the vertical direction).
  • the substrate main body 61 has an upper surface 61 d facing upward and a lower surface 61 c facing downward.
  • the substrate main body 61 has a motor main body overlapping portion 61A overlapping with the motor main body 2 when viewed from the vertical direction, and an overhang portion 61B positioned outside the motor main body 2 when viewed from the vertical direction.
  • the overhang portion 61 ⁇ / b> B includes a capacitor overlap portion 61 ⁇ / b> C overlapping with the capacitor 65 when viewed in the vertical direction.
  • the capacitor overlap portion 61C on the upper surface 61d of the substrate body 61 is a capacitor overlap region 61X. That is, the upper surface 61 d of the substrate main body 61 has the capacitor overlap region 61 X as viewed from the upper side in the axial direction (direction orthogonal to the plane direction).
  • the capacitor 65 is mounted on the lower surface 61 c of the substrate body 61. That is, the capacitor 65 is mounted on the lower side (one side orthogonal to the plane direction) of the circuit board 60.
  • the capacitor 65 has a cylindrical shape extending along the axial direction.
  • the capacitor 65 has a top surface 65b located on the opposite side of the substrate body 61 and facing downward, and a side surface 65a facing in a direction orthogonal to the axial direction (vertical direction).
  • the capacitor 65 has the largest dimension in the axial direction (vertical direction) among the mounted components of the circuit board 60.
  • the field effect transistor 66 is mounted on the upper surface 61 d of the substrate body 61.
  • the field effect transistor 66 has a rectangular shape in plan view.
  • electronic components such as a rotation sensor and a choke coil are mounted on one or both of the upper surface 61 d and the lower surface 61 c of the substrate main body 61.
  • the capacitor 65 and the field effect transistor 66 which are heating elements are mounted on the overhang portion 61 B of the substrate main body 61.
  • An upper heat sink 80 which will be described later, is located on the upper side of the overhang portion 61B.
  • the upper heat sink 80 directly or indirectly contacts the field effect transistor 66 mounted on the overhang portion 61B and the upper surface 61d of the overhang portion 61B to cool them.
  • the heat sink portion 53 of the housing 50 and the element housing portion 55 are located below the overhang portion 61B.
  • the heat sink portion 53 and the element housing portion 55 are in direct or indirect contact with the capacitor 65 mounted on the overhang portion 61B and the lower surface 61c of the overhang portion 61B to cool them.
  • the upper heat sink 80 covers the capacitor overlap area 61 ⁇ / b> X on the upper side (the other side) of the circuit board 60. Further, according to the present embodiment, the overhang portion 61B on which the heat generating element (the capacitor 65 and the field effect transistor 66) is mounted is sandwiched between the upper heat sink 80 and the housing 50 in the vertical direction. As a result, the heating elements 65 and 66 mounted on the overhang portion 61B can be effectively cooled by the upper heat sink 80 and the housing 50.
  • the structure necessary for cooling the heat generating elements 65 and 66 can be It can be arranged offset with the main unit 2. Therefore, the dimension in the axial direction (vertical direction) of the motor 1 can be reduced. That is, the capacitor 65 is located radially outside the motor body 2. Further, the element accommodating portion 55 and the upper heat sink 80 of the housing 50 are located on the lower side and the upper side (both sides in the axial direction) of the circuit board 60.
  • the element accommodating portion 55 of the housing 50 and the upper heat sink 80 are located on the lower side and the upper side of the circuit board 60, the heat from the capacitor overlap region 61X of the capacitor 65 and the circuit board 60 is dissipated from both the lower side and the upper side be able to. Thus, the transfer of heat in the radial direction into the circuit board 60 can be suppressed.
  • the upper heat sink 80 is located on the upper side of the circuit board 60.
  • the upper heat sink 80 covers a part of the circuit board 60 from the upper side.
  • the upper heat sink 80 of the present embodiment is in direct or indirect contact with the circuit board 60 to function as an upper heat sink for cooling the circuit board 60.
  • the upper heat sink 80 may be in direct contact with the circuit board 60 or may be in indirect contact as long as the upper heat sink 80 thermally contacts the circuit board 60 and cools the circuit board 60. More specifically, the upper heat sink 80 may be in contact with the circuit board 60 via a heat dissipating material such as heat dissipating grease.
  • the upper heat sink 80 has a heat absorbing portion 85 and fins 89 a located on the upper surface 85 a of the heat absorbing portion 85.
  • the upper heat sink 80 is made of a metal material (for example, an aluminum alloy or a copper alloy) having high heat dissipation characteristics.
  • the heat absorbing portion 85 has an upper surface 85 a facing upward and a lower surface 85 b facing downward. Further, the heat absorbing portion 85 is provided with a pair of screw insertion holes. The screw insertion hole penetrates the heat absorbing portion 85 along the axial direction. Fixing screws are respectively inserted into the pair of screw insertion holes. The fixing screw is screwed to the heat sink portion 53 of the housing 50. As a result, the lower surface 85 b of the heat absorbing portion 85 is pressed against the upper surface 53 a of the heat sink portion 53, and the upper heat sink 80 is fixed to the housing 50.
  • the upper heat sink 80 and the housing 50 are in direct contact and fixed to each other.
  • the upper heat sink 80 and the housing 50 absorb heat from the circuit board 60, respectively.
  • Fixing the upper heat sink 80 and the housing 50 in contact with each other causes heat transfer between the upper heat sink 80 and the housing 50. Therefore, when any one of the upper heat sink 80 and the housing 50 has a high temperature, the heat can be moved to the other side and the heat can also be radiated from the other side. As a result, the heat radiation efficiency is enhanced, and as a result, the cooling effect of the circuit board 60 can be enhanced.
  • a lid 40 is provided on the upper side of the upper heat sink 80.
  • the lid 40 is provided with an opening 49 penetrating in the vertical direction.
  • the upper heat sink 80 has an exposed portion 89 exposed from the opening 49 of the lid 40.
  • the exposed portion 89 is located on the upper surface 85 a of the heat absorbing portion 85.
  • the upper heat sink 80 since the upper heat sink 80 has the exposed portion 89, the upper heat sink 80 can efficiently dissipate the heat absorbed from the circuit board 60 from the exposed portion 89 to the outside of the motor 1. Thereby, the cooling efficiency of the circuit board 60 by the upper heat sink 80 can be enhanced.
  • the exposed portion 89 of the upper heat sink 80 is located immediately above the capacitor 65 or the field effect transistor 66 which is a heating element. That is, the exposed portion 89 of the upper heat sink 80 overlaps at least a part of the field effect transistor 66 when viewed in the axial direction (vertical direction). Thus, the heat transferred from the circuit board 60 to the upper heat sink 80 can be effectively dissipated at the exposed portion 89.
  • the heating elements overlapping the exposed portion 89 when viewed in the axial direction may be heating elements other than the capacitor 65 and the field effect transistor 66 (for example, a driver integrated circuit for driving a field effect transistor, an integrated circuit for power supply).
  • the fin 89 a is located at the exposed portion 89 of the upper heat sink 80.
  • the fins 89 a protrude upward from the upper surface 85 a of the heat absorbing portion 85.
  • the fin 89 a penetrates the opening 49 at the exposed portion 89.
  • a plurality of fins 89 a are provided on the upper heat sink 80.
  • the plurality of fins 89 a extend along one direction orthogonal to the vertical direction.
  • the fins 89a extend along the X-axis direction.
  • by providing the fins 89 a in the exposed portion 89 it is possible to increase the surface area of the exposed portion 89 and to enhance the heat dissipation efficiency of the upper heat sink 80 in the exposed portion 89.
  • the plurality of fins 89a since the plurality of fins 89a extend in one direction, when arranging the motor 1 in the gas flowing in one direction, the fins 89a are arranged to extend along the flow direction of the gas.
  • the heat radiation efficiency of the fins 89a can be enhanced.
  • the case where the upper heat sink 80 has the fins 89a is illustrated.
  • the upper heat sink 80 has the exposed portion 89 even if the upper heat sink 80 does not have the fins 89a, it is possible to obtain a certain effect of enhancing the heat dissipation efficiency.
  • a first concave groove 81 surrounding the exposed portion 89 is provided on the upper surface 85 a of the heat absorption portion 85 as viewed in the axial direction (vertical direction).
  • the first recessed groove portion 81 extends in a plane perpendicular to the central axis J with a uniform width and a uniform depth.
  • the first recessed groove portion 81 is recessed downward with respect to the upper surface 85 a.
  • the first convex portion 41 of the lid 40 described later is accommodated in the first concave groove 81.
  • the lid 40 is located above the housing 50, the circuit board 60, and the upper heat sink 80.
  • the lid 40 covers the top surface 50 a of the housing 50.
  • the lid 40 covers the circuit board 60 from the upper side and protects the circuit board 60.
  • the lid portion 40 covers the opening of the motor main body housing portion 54 of the housing 50 and suppresses the entry of contamination into the rotating portion of the motor main body 2 or the like.
  • the lid 40 is a flat portion 45 and an outer edge 46 located at the outer edge of the flat portion 45 and projecting downward with respect to the flat portion 45, and a connector extending upward from the flat portion 45 And a part 47.
  • the connector portion 47 has a cylindrical shape extending upward from the flat portion 45. Inside the connector portion 47, a connection terminal (not shown) extending upward from the circuit board 60 is provided. The connection terminal is connected to an external device (not shown) that supplies power to the circuit board 60.
  • the flat portion 45 extends in a direction orthogonal to the axial direction (vertical direction). That is, the flat portion 45 extends along the circuit board 60.
  • the flat portion 45 has an upper surface 45 a facing upward and a lower surface 45 b facing downward.
  • the flat portion 45 is provided with an opening 49.
  • the opening 49 is rectangular when viewed in the axial direction.
  • the fin 89 a of the upper heat sink 80 is inserted into the opening 49.
  • the upper end of the fin 89 a is located above the upper surface 45 a of the flat portion 45.
  • the lower surface 45 b of the flat portion 45 is axially separated from the heat absorbing portion 85. Therefore, the flat portion 45 does not contact the upper heat sink 80.
  • the lower surface 45 b of the flat portion 45 is provided with a first convex portion 41 projecting downward.
  • the first convex portion 41 surrounds the opening 49 as viewed in the axial direction.
  • the first convex portion 41 extends in a plane perpendicular to the central axis J with a uniform width and a uniform height.
  • the first convex portion 41 is accommodated in a first concave groove portion 81 provided in the upper heat sink 80.
  • the upper heat sink 80 is provided with an exposed portion 89 exposed from the opening 49. Therefore, the first convex portion 41 and the first concave groove portion 81 surround the exposed portion 89 when viewed from the axial direction (vertical direction).
  • a gap is provided between the inner wall surface of the first recessed groove portion 81 and the first convex portion 41.
  • the adhesive B is filled in the first recessed groove 81.
  • the element accommodating portion 55 of the housing 50 covers the side surface 65 a of the capacitor 65
  • the upper heat sink 80 covers the capacitor overlap region 61 X of the circuit board 60. That is, the side wall 55a and the housing bottom 55b are integrated as an element housing 55, the side wall 55a of the element housing 55 faces the side surface 65a of the capacitor 65, and the housing bottom 55b of the element housing 55 is a capacitor 65. Face the top surface 65b of the Further, the lower surface 85 b of the heat absorbing portion 85 of the upper heat sink 80 faces the capacitor overlap region 61 X of the circuit board 60.
  • the capacitor 65 supplies power to the inverter for driving the motor body 2 and a large amount of heat is generated. In addition, a relatively large amount of heat is emitted from the capacitor overlap region 61X in the planar region of the circuit board 60. Since the current flowing to the capacitor is collected in the capacitor overlap region 61X of the circuit board 60, more heat is generated. According to the present embodiment, since the housing 50 and the upper heat sink 80 cover the side surface 65 a of the capacitor 65 from which most of the heat is emitted, the heat generated by the capacitor 65 can be effectively dissipated. Further, since the upper heat sink 80 covers at least the capacitor overlap area 61X of the upper surface 61d of the circuit board 60, not only the heat generated from the capacitor 65 itself but also the heat generated from the overlap area 61X can be effectively dissipated .
  • the housing 50 can be disposed below the circuit board 60, and the upper heat sink 80 can be disposed above the circuit board 60.
  • the housing 50 is such that the heat dissipation performance of the element housing portion 55 is higher than the heat dissipation performance of the heat sink 80.
  • the shape of each component of the upper heat sink 80 can be adjusted.
  • the condenser 65 has an explosion-proof valve 90 at the upper end 65t.
  • the end 65 t of the capacitor 65 is an end in a direction orthogonal to the plane direction of the circuit board 65.
  • the element accommodating portion 55 of the housing 50 covers a portion of the side surface 65 a of the capacitor 65 except a portion where the distance between the adjacent capacitor 65 is small.
  • the side surface 65 a of the capacitor 65 may be covered over the entire circumference.
  • the element housing portion 55 of the housing 50 covers the side surface 65 a of the capacitor 65, the heat generated by the capacitor 65 can be effectively dissipated.
  • the element housing 55 does not have the housing bottom 55b. May be That is, the lower side of the capacitor 65 may be open.
  • the element accommodating portion 55 is a first portion 55A (element accommodating portion 55 on the left side of FIG. 4) and a second portion 55B (FIG. 4)
  • the side wall 55a of the capacitor 65 is covered with the element housing 55) on the right side of the drawing.
  • the first portion 55A and the second portion 55B may be a single member or may be separate members.
  • the total volume of the element housing portion 55 can be reduced, and the cost of the motor 1 can be reduced. Further, according to the present embodiment, the element housing portion 55 can be designed to avoid the explosion-proof valve 90.
  • the side surface 65a of the capacitor 65 and the capacitor overlap area 61X may be covered by the housing 50 or the upper heat sink 80.
  • the side surface 65a of the capacitor 65 is a first area 100A (see FIG. 2) extending in the circumferential direction on the side closer to the motor body 2 in the radial direction and the first area 100A on the side far from the motor body 2
  • the second region 100 ⁇ / b> B may be shifted and extended in the circumferential direction.
  • the housing 50 may cover the first area 100A of the side surface 65a of the capacitor 65
  • the upper heat sink 80 may cover the second area 100B of the side surface 65a of the capacitor 65.
  • the side wall 55 a of the element housing 55 may cover the first region 100 A of the capacitor 65, and the housing bottom 55 b of the element housing 55 may cover the top surface 65 b of the capacitor 65.
  • the upper heat sink 80 may have an extending portion 104 that extends from the radially outer end to the radially outer side of the second region 100B of the capacitor 65 and extends downward.
  • the extension portion 104 faces the second region 100 B of the capacitor 65.
  • the gap between the element accommodating portion 55 of the housing 50 and the extension portion 104 of the upper heat sink 80 is opened at the lower end.
  • the capacitor 65 can be used.
  • the heat emitted by can be dissipated effectively.
  • the side surface 65a of the capacitor 65 and the capacitor overlap area 61X may be covered by the housing 50 or the upper heat sink 80.
  • the housing bottom 55b may not be provided. That is, the lower side of the capacitor 65 may be open.
  • 5 and 6 show an example in which the capacitor 65 is disposed on the lower surface 61c so as to be flush with the radial outer end surface of the circuit board 60, but the capacitor 65 is shown in FIGS. It may be disposed radially inward of the position shown in FIG. In such a configuration, the extension portion 104 may be lowered from the radially outer end of the upper heat sink 80 and may approach the radially outer side of the second region 100B of the capacitor 65.
  • the gap between the element accommodating portion 55 of the housing 50 and the extension portion 104 of the upper heat sink 80 may be located radially inward of the position shown in FIGS. 5 and 6.
  • the capacitor 65 can be used. Heat generated can be dissipated effectively.
  • the assembly of the lid 40 is performed at the end of the assembly process of the motor 1.
  • the inside of the first recessed groove 81 of the upper heat sink 80 and the second recessed groove 52 of the housing 50 is filled with the uncured adhesive B.
  • the lid 40 is brought close to the upper heat sink 80 and the housing 50 fixed to the upper heat sink 80 from the upper side, the first convex portion 41 is inserted into the first concave groove portion 81, and the second convex portion 42 is The second groove 52 is inserted.
  • the adhesive B is cured.
  • the lid 40 is assembled to the motor 1 through the above steps.
  • the first convex portion 41 and the second convex portion 42 project in the same direction, and the first concave groove portion 81 and the second concave groove portion 52 open in the same direction.
  • the uncured adhesive B is filled in the first recessed groove portion 81 and the second recessed groove portion 52. Since the first recessed groove 81 and the second recessed groove 52 are opened in the same direction, the uncured adhesive B can be simultaneously filled in the first recessed groove 81 and the second recessed groove 52.
  • the lid 40 is lowered to set the first recessed groove 81 and the second recessed groove 52 respectively.
  • a step of housing the first protrusion 41 and the second protrusion 42 can be employed. Thereby, the assembly
  • the housing 50 and the lid 40 are fixed to each other by the snap fit portion 6.
  • a plurality of snap fit portions 6 are provided in the motor 1 along the circumferential direction.
  • the snap fit portion 6 includes a hook 43 provided on the lid 40 and a claw 58 provided on the housing 50.
  • the hooked portion 43 of the lid portion 40 extends downward in a U-shape from the outer edge portion 46.
  • the claws 58 protrude outward in the horizontal direction from the outer side surface of the housing 50.
  • the snap fit portion 6 is provided to hold the lid portion 40 from when the lid portion 40 is assembled to the housing 50 until the adhesive B is cured.
  • the lid 40 is permanently fixed to the housing 50 by the fixing function of the snap fit portion 6.
  • the rotor 20 is an inner rotor disposed radially inward of the coil 29.
  • the arrangement of the rotor 20 is not limited to this.
  • the rotor 20 may be an outer rotor disposed radially outside the coil 29.
  • Heat sink part Heat sink body part Heat sink body part
  • 53c Heat dissipation surface
  • 54e Opening
  • 61A Motor body overlap part
  • 61X ... capacitor overlap
  • 65 ... capacitors
  • B adhesives, D ... diameter, J ... central axis, S1 ... dimensions

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Motor Or Generator Frames (AREA)

Abstract

L'invention concerne un moteur comprenant : un corps de moteur comprenant un rotor capable de tourner autour d'un axe central et un stator faisant radialement face au rotor ; une carte de circuit imprimé qui est électriquement connectée au corps de moteur et qui s'étend dans la direction du plan ; un condensateur monté sur un côté, orthogonal à la direction du plan, de la carte de circuit imprimé ; et un dissipateur thermique qui vient directement ou indirectement en contact avec la carte de circuit imprimé. La carte de circuit imprimé a une première surface sur ledit côté et une seconde surface sur l'autre côté. La seconde surface comprend une région de chevauchement de condensateur chevauchant le condensateur lorsqu'elle est vue de manière orthogonale par rapport à la direction du plan de la carte de circuit imprimé. Le dissipateur thermique recouvre au moins une partie de la surface latérale du condensateur sur ledit côté de la carte de circuit imprimé et recouvre la région de chevauchement de condensateur sur l'autre côté de la carte de circuit imprimé.
PCT/JP2018/028636 2017-09-29 2018-07-31 Moteur WO2019064896A1 (fr)

Priority Applications (2)

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CN201880053564.8A CN111033964B (zh) 2017-09-29 2018-07-31 马达
JP2019544352A JPWO2019064896A1 (ja) 2017-09-29 2018-07-31 モータ

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JP2017192188 2017-09-29
JP2017-192188 2017-09-29

Publications (1)

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WO2019064896A1 true WO2019064896A1 (fr) 2019-04-04

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JP (1) JPWO2019064896A1 (fr)
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WO (1) WO2019064896A1 (fr)

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JP2019125640A (ja) * 2018-01-15 2019-07-25 富士電機株式会社 放熱用ブロックおよび電力変換装置
JP2021044984A (ja) * 2019-09-12 2021-03-18 日本電産株式会社 モータおよび電動パワーステアリング装置
JPWO2021210117A1 (fr) * 2020-04-16 2021-10-21
EP4002968A1 (fr) * 2020-11-24 2022-05-25 STILL GmbH Onduleur et son procédé de fabrication
JP7422855B2 (ja) 2020-01-31 2024-01-26 ハンオン システムズ 電動圧縮機、インバータ製造装置及びインバータ製造方法

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WO2014188803A1 (fr) * 2013-05-21 2014-11-27 日立オートモティブシステムズ株式会社 Appareil de conversion de puissance
US20160254719A1 (en) * 2015-02-27 2016-09-01 Brose Fahrzeugteile Gmbh & Co. Kommanditgesellschaft, Wuerzburg Motor assembly

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Publication number Priority date Publication date Assignee Title
JP2019125640A (ja) * 2018-01-15 2019-07-25 富士電機株式会社 放熱用ブロックおよび電力変換装置
JP7069733B2 (ja) 2018-01-15 2022-05-18 富士電機株式会社 放熱用ブロックおよび電力変換装置
JP2021044984A (ja) * 2019-09-12 2021-03-18 日本電産株式会社 モータおよび電動パワーステアリング装置
JP7422855B2 (ja) 2020-01-31 2024-01-26 ハンオン システムズ 電動圧縮機、インバータ製造装置及びインバータ製造方法
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EP4002968A1 (fr) * 2020-11-24 2022-05-25 STILL GmbH Onduleur et son procédé de fabrication

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JPWO2019064896A1 (ja) 2020-10-22
CN111033964B (zh) 2022-09-20

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