WO2019047244A1 - 机械手臂、曝光机前单元和温度控制方法 - Google Patents

机械手臂、曝光机前单元和温度控制方法 Download PDF

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Publication number
WO2019047244A1
WO2019047244A1 PCT/CN2017/101308 CN2017101308W WO2019047244A1 WO 2019047244 A1 WO2019047244 A1 WO 2019047244A1 CN 2017101308 W CN2017101308 W CN 2017101308W WO 2019047244 A1 WO2019047244 A1 WO 2019047244A1
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Prior art keywords
temperature
unit
exposure machine
temperature control
mechanical arm
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Ceased
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PCT/CN2017/101308
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English (en)
French (fr)
Inventor
黄顺宏
朱广飞
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Shenzhen Royole Technologies Co Ltd
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Shenzhen Royole Technologies Co Ltd
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Priority to PCT/CN2017/101308 priority Critical patent/WO2019047244A1/zh
Priority to CN201780058780.7A priority patent/CN109789568A/zh
Publication of WO2019047244A1 publication Critical patent/WO2019047244A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor

Definitions

  • the present invention relates to exposure techniques, and more particularly to a robotic arm, an exposure machine front unit, and a temperature control method.
  • the exposure machine is used for exposing the glass substrate to transfer the pattern on the mask onto the glass substrate coated with the photoresist.
  • the temperature of the glass substrate needs to be controlled to ensure the temperature of the photoresist.
  • temperature control during transmission becomes an urgent problem to be solved.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention is required to provide a robot arm, an exposure machine front unit, and a temperature control method.
  • the robot arm of the embodiment of the present invention is used for an exposure machine front unit, the exposure machine front unit includes a temperature control unit and a transmission unit, and the robot arm is located in the transmission unit, and the robot arm includes:
  • a body capable of supporting a glass substrate and transferring the glass substrate located in the temperature control unit to the exposure machine
  • a temperature sensor disposed on the body for monitoring a temperature within the transfer unit.
  • a transfer unit comprising a robotic arm as described above.
  • a temperature control method is used for an exposure machine front unit, and the exposure machine front unit
  • the exposure machine front unit A temperature control unit and a transfer unit are included, the transfer unit includes a robot arm, the robot arm is located in the transfer unit, the robot arm includes a body and a temperature sensor disposed on the body; the body is configured to The glass substrate located in the temperature control unit is transferred to the exposure machine; the temperature control method includes the following steps:
  • the temperature within the transfer unit is adjusted when the temperature is abnormal.
  • the mechanical arm, the pre-exposure unit and the temperature control method of the embodiments of the present invention monitor the temperature during the glass substrate transfer process to ensure that the temperature is within the process specification, thereby effectively preventing the temperature change from affecting the exposure accuracy.
  • FIG. 1 is a schematic view showing the structure of a robot arm according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a front unit of an exposure machine according to an embodiment of the present invention.
  • FIG. 3 is a flow chart showing a temperature control method according to an embodiment of the present invention.
  • FIG. 4 is a schematic view showing the structure of a robot arm according to some embodiments of the present invention.
  • FIG. 5 is a schematic flow diagram of a temperature control method in accordance with some embodiments of the present invention.
  • first and second are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
  • features defining “first” or “second” may include one or more of the described features either explicitly or implicitly.
  • the meaning of "a plurality" is two or more unless specifically and specifically defined otherwise.
  • a temperature control method is used for an exposure machine front unit, and the temperature control method includes the following steps:
  • the robot arm 10 of the embodiment of the present invention is used to expose the pre-machine unit 1000, and the pre-exposure unit 1000 includes a transfer unit 100 and a temperature control unit 200.
  • the robot arm 10 is located within the transfer unit 100.
  • the robot arm 10 includes a body 12 and a temperature sensor 14. Wherein, the body 12 can support the glass substrate and transfer the glass substrate located in the temperature control unit 200 to the exposure machine via the transfer unit 100.
  • the temperature sensor 14 is used to monitor the temperature within the transfer unit 100.
  • the temperature control method of the embodiment of the present invention can be implemented by the exposure machine front unit 1000 of the embodiment of the present invention and applied to the exposure machine front unit 1000.
  • the exposure machine is used for exposing the glass substrate to transfer the pattern on the mask onto the glass substrate coated with the photoresist.
  • the temperature of the glass substrate needs to be controlled to ensure the temperature of the photoresist. To ensure that the final exposure results meet the requirements.
  • the glass substrate is placed in the temperature control unit 200, and inside the temperature control unit 200
  • airflow circulation is generated inside the temperature control unit 200 by the gas generating unit.
  • the gas generating unit includes a blowing unit and a suction unit. The airflow generated by the blowing unit is blown in from the top to the bottom, and the air suction unit sucks out the internal gas.
  • the temperature within the temperature control unit 200 is controlled by controlling the temperature of the circulating gas stream such that the temperature within the temperature control unit 200 meets the exposure requirements.
  • the airflow in the temperature control unit 200 forms a circulation and is in a sealed state, that is, the internal airflow is not subject to other disturbances, and therefore, the temperature in the temperature control unit 200 is relatively stable.
  • the transfer unit 100 When the glass substrate is transferred from the temperature control unit 200 to the transfer unit 100, the transfer unit 100 is different in structure from the temperature control unit 200.
  • the transfer unit 100 is not a closed structure, and the bottom portion is provided with a through hole communicating with an external work area, and the air flow is from the upper portion. Down to the outside and through the through hole, no circulation occurs.
  • the temperature in the transfer unit 100 can be relatively stable when the airflow is stable.
  • the external airflow when the external airflow generates an abnormality, for example, when the external airflow pressure is greater than the downward airflow pressure of the transport unit 100, the external airflow enters the transport unit 100 from the through hole, since the external airflow is different from the airflow temperature of the transport unit 100, After the airflow enters the transport unit 100, the temperature in the transport unit 100 changes, thereby affecting the temperature of the photoresist applied on the glass substrate, and the temperature change of the photoresist will affect the sensitivity. It is understood that After the exposure of the photoresist at different temperatures, the final exposure results are different, so when the temperature changes, the glass substrate may not meet the process requirements after exposure.
  • a temperature sensor 14 is provided on the body 12 of the robot arm 10 such that the temperature of the current environment within the transfer unit 100 is monitored in real time by the temperature sensor 14, and the transfer unit 100 is passed through the associated processing mechanism when the temperature is abnormal. The temperature inside is adjusted to meet the process requirements.
  • the robot arm 10, the pre-exposure unit 1000 and the temperature control method of the embodiments of the present invention monitor the temperature during the glass substrate transfer process to ensure that the temperature is within the process specification, effectively avoiding temperature changes to the exposure. Accuracy has an impact.
  • the body 12 includes a connecting end 121 and a plurality of teeth 122 extending outwardly from the connecting end 121, any two adjacent teeth 122 interval setting.
  • the plurality of teeth 122 are parallel to one another and lie in the same plane.
  • the teeth 122 extend outwardly along the connecting end 121 such that the robot arm 10 is generally in the shape of a fork.
  • the overall size of the robot arm 10 should be larger than the size of the glass substrate to provide a stable load carrying capacity, or the robot arm 10
  • the overall size design should at least center the center of the glass substrate on the robot arm 10 to ensure stability of the glass substrate during placement and transport.
  • the plurality of teeth 122 are located in the same plane, so that the surface of the robot arm 10 is flat and parallel to each other, matches the shape of the glass substrate, and can support the glass substrate.
  • the gap between the plurality of teeth 122 can circulate airflow to ensure the temperature around the glass substrate, and can also be used to set a temperature monitoring device, such as a temperature sensor 14.
  • the robotic arm 10 can also be other shapes, such as a flat plate.
  • the plurality of teeth 122 may be scattered, and when scattered, the gap between the adjacent two teeth 122 gradually increases in a direction extending outward. In this way, differently designed robotic arms 10 can provide a stable load carrying capacity for the glass substrate.
  • the temperature sensor 14 includes a plurality, and any one of the temperature sensors 14 is located between the adjacent two teeth 122.
  • the gap of the teeth 122 may be designed according to the size of the temperature sensor 14 such that the size of the temperature sensor 14 matches the gap size of the teeth 122.
  • the temperature sensor 14 can be fixed between the adjacent two teeth 122 by means of snapping, welding or bonding. Thus, the temperature sensor 14 is closer to the glass substrate, and the temperature around the glass substrate is accurately detected.
  • the temperature sensor 14 may be disposed on the bezel of the robot arm 10.
  • the temperature sensor 14 may be disposed between the adjacent two teeth 122 and fixed by bonding. As such, the temperature sensor 14 can be stably disposed on the robot arm 10.
  • the body 12 can be provided with a plurality of temperature sensors 14 disposed between the two opposing teeth 122.
  • a temperature sensor 14 can be disposed between any adjacent two teeth 122.
  • multiple temperature sensors 14 can achieve multiple points of temperature measurement. It can be understood that during the transfer process, a slight change in temperature will affect the process parameters, that is, the temperature of the photoresist, so the temperature accuracy is 0.02 ° C, and multiple temperature sensors are disposed between the different teeth 122. At the same time of multi-point measurement, the accuracy of temperature control can be satisfied, and the temperature of the environment in which the glass substrate is placed is always ensured.
  • the transmitting unit includes an airflow generating unit, and the airflow generating unit is configured to generate a flow of the predetermined temperature, and the step S20 includes the steps of:
  • the transfer unit 100 includes an airflow generating unit.
  • the airflow generating unit is for generating a flow of the predetermined temperature.
  • the step of controlling the temperature of the airflow to adjust the temperature of the airflow to adjust the temperature in the transport unit may be implemented by the airflow generating unit, or the airflow generating unit is used for the temperature
  • the temperature of the airflow is adjusted when the difference between the output of the sensor 14 and the predetermined temperature is less than or equal to a predetermined threshold.
  • the airflow generating unit is configured to generate a gas flow of a predetermined temperature in the transfer unit 100, and the predetermined temperature is a temperature satisfying the required manufacturing temperature. Similar to the temperature control unit 200, the temperature in the transfer unit 100 is generated by the gas generating unit. The air temperature of the predetermined temperature is controlled, and the temperature setting can be set by the production personnel according to the process demand for the temperature control unit of the airflow generating unit. In some examples, the predetermined temperature may be 23 degrees Celsius. The airflow generating unit can adjust the temperature of the generated airflow within a certain range.
  • the temperature sensor 14 monitors the temperature in the transfer unit 100 in real time. When the temperature in the transfer unit 100 fluctuates from the predetermined temperature, the temperature sensor 14 feeds back the monitored value to the airflow generating unit when the current temperature deviates from the predetermined temperature and the difference is The airflow generating unit is adjustable within the predetermined range The temperature of the airflow is generated to compensate for the current temperature so that the temperature within the transfer unit 100 remains dynamically balanced, thereby controlling the temperature within the transfer unit 100 within the range required by the process.
  • step S20 further includes the steps of:
  • the alarm unit is controlled to perform an alarm when the difference between the temperature and the predetermined temperature is greater than a preset threshold.
  • the transfer unit 100 further includes an alarm unit for alerting when the difference between the output of the temperature sensor 14 and the predetermined temperature is greater than a predetermined threshold.
  • the airflow generating unit can control the temperature of the transmitting unit 100 by adjusting the temperature of the generated airflow, and when the difference is greater than the preset temperature, the airflow generating unit will not be sufficient Adjust, at this time, an alarm prompts to remind the staff of abnormal temperature to adjust the temperature manually or by other means.
  • any process or method description which is described in the flowcharts or otherwise described herein, can be understood to represent an executable instruction that includes one or more steps for implementing a particular logical function or process.
  • Modules, segments or portions of code, and the scope of preferred embodiments of the invention includes additional implementations, which may not be in the order shown or discussed, including in a substantially simultaneous manner or in reverse order depending on the functionality involved. To perform the functions, this should be understood by those skilled in the art to which the embodiments of the present invention pertain.
  • a "computer-readable medium” can be any apparatus that can contain, store, communicate, propagate, or transport a program for use in an instruction execution system, apparatus, or device, or in conjunction with the instruction execution system, apparatus, or device.
  • Non-exhaustive list of computer readable media include the following: electrical connections (electronic devices) having one or more wires, portable computer disk cartridges (magnetic devices), random access memory (RAM), Read only memory (ROM), erasable editable read only memory (EPROM or flash memory), Fiber optic devices, as well as portable compact disk read only memory (CDROM).
  • electrical connections electronic devices having one or more wires
  • portable computer disk cartridges magnetic devices
  • RAM random access memory
  • ROM Read only memory
  • EPROM or flash memory erasable editable read only memory
  • Fiber optic devices as well as portable compact disk read only memory (CDROM).
  • portions of the invention may be implemented in hardware, software, firmware or a combination thereof.
  • multiple steps or methods may be implemented in software or firmware stored in a memory and executed by a suitable instruction execution system.
  • a suitable instruction execution system For example, if implemented in hardware, as in another embodiment, it can be implemented by any one or combination of the following techniques well known in the art: having logic gates for implementing logic functions on data signals. Discrete logic circuits, application specific integrated circuits with suitable combinational logic gates, programmable gate arrays (PGAs), field programmable gate arrays (FPGAs), etc.
  • the above mentioned storage medium may be a read only memory, a magnetic disk or an optical disk or the like.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)

Abstract

一种机械手臂(10)、曝光机前单元(1000)和温度控制方法。机械手臂(10)，用于曝光机前单元(1000)，曝光机前单元(1000)包括温度控制单元(200)和传送单元(100)，机械手臂(10)位于传送单元(100)内，机械手臂(10)包括：本体(12)和温度传感器(14)。本体(12)能够承托玻璃基板并将位于温度控制单元(200)内的玻璃基板传送至曝光机，温度传感器(14)设置于本体(12)上，用于监测传送单元(100)内的温度。该机械手臂(10)可使玻璃基板在传送过程中温度稳定，从而有效避免温度变化对曝光精度产生的影响。

Description

机械手臂、曝光机前单元和温度控制方法 技术领域
本发明涉及曝光技术，特别是一种机械手臂、曝光机前单元和温度控制方法。
背景技术
曝光机用于对玻璃基板进行曝光，以将掩膜上的图案转印到涂覆有光阻剂的玻璃基板上，玻璃基板在曝光前的传输过程中，需要控制温度以保证光阻的温度，从而保证最终的曝光结果满足要求，传输过程中的温度控制成为亟待解决的问题。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明需要提供一种机械手臂、曝光机前单元和温度控制方法。
本发明实施方式的机械手臂，用于曝光机前单元，所述曝光机前单元包括温度控制单元和传送单元，所述机械手臂位于所述传送单元内，所述机械手臂包括：
本体，所述本体能够承托玻璃基板并将位于所述温度控制单元内的玻璃基板传送至曝光机；和
温度传感器，所述温度传感器设置于所述本体上，用于监测所述传送单元内的温度。
本发明实施方式的曝光机前单元，包括
温度控制单元；和
传送单元，所述传送单元包括如上所述的机械手臂。
本发明实施方式的温度控制方法，用于曝光机前单元，所述曝光机前单元 包括温度控制单元和传送单元，所述传送单元包括机械手臂，所述机械手臂位于所述传送单元内，所述机械手臂包括本体和设置于所述本体上的温度传感器；所述本体用于将位于所述温度控制单元内的玻璃基板传送至曝光机；所述温度控制方法包括如下步骤：
监测所述传送单元内的温度；和
在所述温度异常时调节所述传送单元内的温度。
本发明实施方式的机械手臂、曝光机前单元和温度控制方法，在玻璃基板传送过程中，对温度进行监控，以保证温度处于制程规格内，有效避免温度变化对曝光精度产生影响。
本发明的附加方面和优点将在下面的描述中部分给出，部分将从下面的描述中变得明显，或通过本发明的实践了解到。
附图说明
本发明的上述优点和附加的方面从结合下面附图对实施方式的描述中将变得明显和容易理解，其中：
图1是本发明实施方式的机械手臂的结构示意图。
图2是本发明实施方式的曝光机前单元的结构示意图。
图3是本发明实施方式的温度控制方法的流程示意图。
图4是本发明某些实施方式的机械手臂的结构示意图。
图5是本发明某些实施方式的温度控制方法的流程示意图。
具体实施方式
下面详细描述本发明的实施方式，所述实施方式的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施方式是示例性的，仅用于解释本发明，而不能理解为对本发明的限制。
在本发明的描述中，需要理解的是，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本发明的描述中，“多个”的含义是两个或两个以上，除非另有明确具体的限定。
在本发明的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。
此外，本发明提供了的各种特定的工艺和材料的例子，但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。
下面将结合附图对本发明的实施例做详细的说明。
请参阅图1至图3，本发明实施方式的温度控制方法，用于曝光机前单元，温度控制方法包括如下步骤：
S10：监测传送单元内的温度；和
S20：在温度异常时调节传送单元内的温度。
本发明实施方式的机械手臂10，用于曝光机前单元1000，曝光机前单元1000包括传送单元100和温度控制单元200。机械手臂10位于传送单元100内。机械手臂10包括本体12和温度传感器14。其中，本体12能够承托玻璃基板并将位于温度控制单元200内的玻璃基板经传送单元100传送至曝光机。温度传感器14用于监测传送单元100内的温度。作为例子，本发明实施方式的温度控制方法，可以由本发明实施方式的曝光机前单元1000实现，并应用于曝光机前单元1000。
曝光机用于对玻璃基板进行曝光，以将掩膜上的图案转印到涂覆有光阻剂的玻璃基板上，玻璃基板在曝光前的传输过程中，需要控制温度以保证光阻的温度，从而保证最终的曝光结果满足要求。
初始时，玻璃基板放置于温度控制单元200内，温度控制单元200内部处 于密闭状态，通过气体发生单元在温度控制单元200内部产生气流循环。一般地，气体发生单元包括一吹气单元和一吸气单元，吹气单元产生的气流由上而下吹入，吸气单元将内部气体吸出，如此，可完成温度控制单元200内部气流循环，温度控制单元200内的温度通过控制循环气流的温度来控制，以使得温度控制单元200内的温度符合曝光的要求。
可以理解，温度控制单元200内气流形成循环，并且处于密闭状态，也即是说，内部气流不会受到其他干扰，因此，温度控制单元200内的温度相对稳定。
当玻璃基板由温度控制单元200传送至传送单元100时，传送单元100与温度控制单元200结构不同，传送单元100并不是密闭结构，其底部设置有通孔与外部的工作区连通，气流由上至下并经过通孔进入外部，不产生循环，一般情况下，在气流稳定时，传送单元100内的温度可以保持相对稳定。然而当外部气流产生异常时，例如，当外部的气流压力大于传送单元100向下的气流压力时，外部气流会从通孔进入传送单元100，由于外部气流与传送单元100的气流温度不同，因此会导致气流进入传送单元100后，传送单元100内的温度发生变化，从而影响到玻璃基板上所涂覆的光阻的温度，而光阻的温度发生改变将对感光度产生影响，可以理解，不同温度下的光阻经过曝光后，得到的最终曝光结果也不同，因此当温度发生改变时，可能会导致玻璃基板在曝光后无法满足制程需求。
本发明的实施例中，在机械手臂10的本体12上设置温度传感器14，从而通过温度传感器14实时监测传送单元100内当前环境的温度，并且在温度异常时通过相关的处理机制对传送单元100内的温度进行调节，以满足制程需求。
综上所述，本发明实施方式的机械手臂10、曝光机前单元1000和温度控制方法，在玻璃基板传送过程中，对温度进行监控，以保证温度处于制程规格内，有效避免温度变化对曝光精度产生影响。
请参阅图1及图4，在某些实施方式中，本体12包括连接端121和多个齿状物122，齿状物122从连接端121向外延伸，任意两个相邻的齿状物122间隔设置。
在这样的实施方式中，多个齿状物122间相互平行并位于同一平面内。
齿状物122沿连接端121向外延伸，使得机械手臂10整体呈叉耙状，一般地，机械手臂10的整体尺寸应当大于玻璃基板的尺寸以提供稳定的承载能力，或者说，机械手臂10的整体尺寸设计至少应当使璃基板的重心居于机械手臂10上，从而保证玻璃基板放置以及传输过程中的稳定。多个齿状物122位于同一平面内，使得机械手臂10表面平整，并且相互平行，与玻璃基板的形状相匹配，并能承托玻璃基板。
多个齿状物122之间的间隙一来可以使得气流流通，保证玻璃基板周围的温度，同时也可用于设置温度监测装置，例如设置温度传感器14。
在另外一些示例中，机械手臂10还可以是其他形状，例如平板状。此外，多个齿状物122可以呈散射状，呈散射状时，相邻两齿状物122的间隙沿向外延伸的方向逐渐增大。如此，不同设计的机械手臂10均能为玻璃基板提供稳定的承载能力。
在某些实施方式中，温度传感器14包括多个，任意一个温度传感器14位于相邻的两个齿状物122之间。
具体地，齿状物122的间隙可根据温度传感器14的尺寸设计，以使得温度传感器14的尺寸与齿状物122的间隙尺寸相匹配。温度传感器14可以卡接、焊接或粘等方式固定在相邻的两齿状物122之间，如此，温度传感器14更加贴近玻璃基板，对玻璃基板周围的温度进行准确的检测。
在一些示例中，当机械手臂10呈平板状时，温度传感器14可设置在机械手臂10的边框上。当机械手臂10的齿状物122呈散射状时，温度传感器14可设置在相邻两齿状物122之间，并通过粘接方式固定。如此，温度传感器14可稳定设置在机械手臂10上。
在另一些示例中，本体12可设置多个温度传感器14，多个温度传感器14设置于相异的两齿状物122之间。或者说，任意相邻的两齿状物122之间均可设置一个温度传感器14。
如此，多个温度传感器14可以实现温度的多点测量。可以理解，在传送过程中，温度微小的变化都会对制程参数也即是光阻的温度产生影响，因此温度的精度要达到0.02℃，多个温度传感器设置于不同齿状物122之间在实现多点测量的同时，可以满足温度控制的精度，始终保证玻璃基板所处环境的温度符合要求。
请参阅图5，在某些实施方式中，传送单元包括气流发生单元，气流发生单元用于产生预定温度的气流，步骤S20包括步骤：
S22：当温度与预定温度的差值小于或等于预设阈值时，控制气流发生单元调节气流的温度以调节传送单元内的温度。
在某些实施方式中，传送单元100包括气流发生单元。气流发生单元用于产生预定温度的气流。当温度与预定温度的差值小于或等于预设阈值时，控制气流发生单元调节气流的温度以调节传送单元内的温度的步骤可以由气流发生单元实现，或者说，气流发生单元用于当温度传感器14的输出与预定温度的差值小于或等于预设阈值时调节气流的温度。
具体的，气流发生单元用于为传送单元100内产生预定温度的气流，预定温度也即是满足制成要求的温度，与温度控制单元200相类似，传送单元100内的温度通过气体发生单元产生预定温度的气流来控制，温度设定可由生产人员根据制程需求对气流发生单元的温控单元进行设定。在一些示例中，预定温度可以是23摄氏度。气流发生单元可在一定范围内对产生的气流温度进行调节。
温度传感器14实时监测传送单元100内的温度，当传送单元100内的温度产生波动偏离预定温度时，温度传感器14将监测值反馈给气流发生单元，当当前温度与预定温度产生偏差并且差值在预定范围内时，气流发生单元可调 节产生气流的温度以对当前温度进行补偿，使得传送单元内100内的温度保持动态的平衡，从而将传送单元100内的温度控制在制程要求的范围内。
在这样的实施方式中，进一步地，步骤S20还包括步骤：
S24：当温度与预定温度的差值大于预设阈值时控制报警单元进行报警。
在某些实施方式中，传送单元100还包括报警单元，报警单元用于当温度传感器14的输出与所述预定温度的差值大于预设阈值时进行报警。
可以理解地，当差值小于或等于预设阈值时，气流发生单元可通过调节产生气流的温度来控制传送单元100的温度，而当差值大于预设温度时，气流发生单元将不足以自行调节，此时进行报警提示，提醒工作人员温度异常，以通过人工或其他方式调节温度。
在本说明书的描述中，流程图中或在此以其他方式描述的任何过程或方法描述可以被理解为，表示包括一个或更多个用于实现特定逻辑功能或过程的步骤的可执行指令的代码的模块、片段或部分，并且本发明的优选实施方式的范围包括另外的实现，其中可以不按所示出或讨论的顺序，包括根据所涉及的功能按基本同时的方式或按相反的顺序，来执行功能，这应被本发明的实施例所属技术领域的技术人员所理解。
在流程图中表示或在此以其他方式描述的逻辑和/或步骤，例如，可以被认为是用于实现逻辑功能的可执行指令的定序列表，可以具体实现在任何计算机可读介质中，以供指令执行系统、装置或设备(如基于计算机的系统、包括处理器的系统或其他可以从指令执行系统、装置或设备取指令并执行指令的系统)使用，或结合这些指令执行系统、装置或设备而使用。就本说明书而言，"计算机可读介质"可以是任何可以包含、存储、通信、传播或传输程序以供指令执行系统、装置或设备或结合这些指令执行系统、装置或设备而使用的装置。计算机可读介质的更具体的示例(非穷尽性列表)包括以下：具有一个或多个布线的电连接部(电子装置)，便携式计算机盘盒(磁装置)，随机存取存储器(RAM)，只读存储器(ROM)，可擦除可编辑只读存储器(EPROM或闪速存储器)， 光纤装置，以及便携式光盘只读存储器(CDROM)。
应当理解，本发明的各部分可以用硬件、软件、固件或它们的组合来实现。在上述实施方式中，多个步骤或方法可以用存储在存储器中且由合适的指令执行系统执行的软件或固件来实现。例如，如果用硬件来实现，和在另一实施方式中一样，可用本领域公知的下列技术中的任一项或他们的组合来实现：具有用于对数据信号实现逻辑功能的逻辑门电路的离散逻辑电路，具有合适的组合逻辑门电路的专用集成电路，可编程门阵列(PGA)，现场可编程门阵列(FPGA)等。
本技术领域的普通技术人员可以理解实现上述实施方法携带的全部或部分步骤是可以通过程序来指令相关的硬件完成，所述的程序可以存储于一种计算机可读存储介质中，该程序在执行时，包括方法实施例的步骤之一或其组合。
上述提到的存储介质可以是只读存储器，磁盘或光盘等。尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。

Claims (10)

  1. 一种机械手臂，用于曝光机前单元，其特征在于，所述曝光机前单元包括温度控制单元和传送单元，所述机械手臂位于所述传送单元内，所述机械手臂包括：
    本体，所述本体能够承托玻璃基板并将位于所述温度控制单元内的玻璃基板传送至曝光机；和
    温度传感器，所述温度传感器设置于所述本体上，用于监测所述传送单元内的温度。
  2. 如权利要求1所述的机械手臂，其特征在于,所述本体包括连接端以及从所述连接端向外延伸的多个齿状物，任意两个相邻的所述齿状物间隔设置。
  3. 如权利要求2所述的机械手臂，其特征在于,所述多个齿状物平行且位于同一平面内。
  4. 如权利要求2所述的机械手臂，其特征在于，所述温度传感器包括多个，所述任意一个温度传感器位于任意相邻的两个齿状物之间。
  5. 一种曝光机前单元，其特征在于，包括：
    温度控制单元；和
    传送单元，所述传送单元包括如权利要求1-4任一项所述的机械手臂。
  6. 如权利要求5所述的曝光机前单元，其特征在于，所述传送单元包括气流发生单元，所述气流发生单元用于产生预定温度的气流，当所述温度传感器的输出与所述预定温度的差值小于或等于预设阈值时，所述气流发生单元能 够调节所述气流的温度。
  7. 如权利要求6所述的曝光机前单元，其特征在于，所述传送单元还包括报警单元，所述报警单元用于当所述温度传感器的输出与所述预定温度的差值大于预设阈值时进行报警。
  8. 一种温度控制方法，用于曝光机前单元，其特征在于，所述曝光机前单元包括温度控制单元和传送单元，所述传送单元包括机械手臂，所述机械手臂位于所述传送单元内，所述机械手臂包括本体和设置于所述本体上的温度传感器；所述本体用于将位于所述温度控制单元内的玻璃基板传送至曝光机；所述温度控制方法包括如下步骤：
    监测所述传送单元内的温度；和
    在所述温度异常时调节所述传送单元内的温度。
  9. 如权利要求8所述的温度控制方法，其特征在于，所述传送单元包括气流发生单元，所述气流发生单元用于产生预定温度的气流，所述在所述温度异常时进行调节的步骤包括以下步骤：
    当所述温度与所述预定温度的差值小于或等于预设阈值时，控制所述气流发生单元调节所述气流的温度以调节所述传送单元内的温度。
  10. 如权利要求8所述的温度控制方法，其特征在于，所述传输单元还包括报警单元，所述控制所述温度控制单元在所述温度异常时进行调节的步骤包括以下步骤：
    当所述温度与所述预定温度的差值大于预设阈值时控制报警单元进行报警。
PCT/CN2017/101308 2017-09-11 2017-09-11 机械手臂、曝光机前单元和温度控制方法 Ceased WO2019047244A1 (zh)

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