WO2019043671A3 - 導電性ペースト、電子部品及び積層セラミックコンデンサ - Google Patents

導電性ペースト、電子部品及び積層セラミックコンデンサ

Info

Publication number
WO2019043671A3
WO2019043671A3 PCT/IB2018/058469 IB2018058469W WO2019043671A3 WO 2019043671 A3 WO2019043671 A3 WO 2019043671A3 IB 2018058469 W IB2018058469 W IB 2018058469W WO 2019043671 A3 WO2019043671 A3 WO 2019043671A3
Authority
WO
WIPO (PCT)
Prior art keywords
conductive paste
electronic component
multilayer ceramic
ceramic capacitor
dispersant
Prior art date
Application number
PCT/IB2018/058469
Other languages
English (en)
French (fr)
Other versions
WO2019043671A2 (ja
Inventor
中家香織
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to MYPI2020001023A priority Critical patent/MY201078A/en
Priority to CN201880056607.8A priority patent/CN111386579B/zh
Priority to KR1020207005891A priority patent/KR102569072B1/ko
Publication of WO2019043671A2 publication Critical patent/WO2019043671A2/ja
Publication of WO2019043671A3 publication Critical patent/WO2019043671A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Conductive Materials (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Emulsifying, Dispersing, Foam-Producing Or Wetting Agents (AREA)

Abstract

ペーストの粘度安定性に非常に優れ、かつ、ペーストの分散性に優れた導電性ペースト等を提供する。導電性粉末、セラミック粉末、分散剤、バインダー樹脂及び有機溶剤を含む導電性ペーストであって、分散剤は、分子量が５０００以下の第１の酸系分散剤及び第２の酸系分散剤を含み、第１の酸系分散剤は、分岐鎖を１つ以上有する分岐炭化水素基を有する、導電性ペーストなどにより提供。
PCT/IB2018/058469 2017-08-30 2018-10-30 導電性ペースト、電子部品及び積層セラミックコンデンサ WO2019043671A2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
MYPI2020001023A MY201078A (en) 2017-08-30 2018-10-30 Conductive paste, method for producing electronic component, and method for producing laminated ceramic capacitor
CN201880056607.8A CN111386579B (zh) 2017-08-30 2018-10-30 导电性浆料、电子部件以及叠层陶瓷电容器
KR1020207005891A KR102569072B1 (ko) 2017-08-30 2018-10-30 도전성 페이스트, 전자 부품 및 적층 세라믹 콘덴서

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-165893 2017-08-30
JP2017165893A JP7013731B2 (ja) 2017-08-30 2017-08-30 導電性ペースト、並びに、電子部品及び積層セラミックコンデンサの製造方法

Publications (2)

Publication Number Publication Date
WO2019043671A2 WO2019043671A2 (ja) 2019-03-07
WO2019043671A3 true WO2019043671A3 (ja) 2019-05-02

Family

ID=65525049

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2018/058469 WO2019043671A2 (ja) 2017-08-30 2018-10-30 導電性ペースト、電子部品及び積層セラミックコンデンサ

Country Status (5)

Country Link
JP (1) JP7013731B2 (ja)
KR (1) KR102569072B1 (ja)
CN (1) CN111386579B (ja)
MY (1) MY201078A (ja)
WO (1) WO2019043671A2 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021060540A1 (ja) * 2019-09-26 2021-04-01 住友金属鉱山株式会社 導電性組成物、導電性ペースト、電子部品、及び積層セラミックコンデンサ
CN113436886A (zh) * 2021-04-28 2021-09-24 佛山市顺德区百锐新电子材料有限公司 一种水性mlcc专用辊印镍浆及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049147A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2012174797A (ja) * 2011-02-18 2012-09-10 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP2016031912A (ja) * 2014-07-30 2016-03-07 住友金属鉱山株式会社 導電性ペーストの製造方法及びこれにより得られる導電性ペースト
JP2016035914A (ja) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 導電性ペースト
WO2017150438A1 (ja) * 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4433162B2 (ja) * 2004-02-05 2010-03-17 株式会社村田製作所 セラミックスラリー、セラミックスラリーの製造方法、及び積層セラミック電子部品の製造方法
JP3944495B2 (ja) 2004-06-28 2007-07-11 Ｔｄｋ株式会社 導電性ペースト、積層セラミック電子部品及びその製造方法
JP4930808B2 (ja) 2010-01-29 2012-05-16 住友金属鉱山株式会社 導電性ペースト
JP5556561B2 (ja) 2010-10-06 2014-07-23 住友金属鉱山株式会社 銀粉及びその製造方法
KR101198004B1 (ko) * 2010-12-10 2012-11-05 삼성전기주식회사 적층 세라믹 커패시터용 세라믹 페이스트 조성물, 이를 포함하는 적층 세라믹 커패시터 및 이들의 제조방법
JP6292014B2 (ja) 2014-05-12 2018-03-14 株式会社村田製作所 導電性ペーストおよびセラミック電子部品
JP6948111B2 (ja) * 2016-02-09 2021-10-13 ナミックス株式会社 樹脂組成物、導電性銅ペースト、および半導体装置

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049147A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2012174797A (ja) * 2011-02-18 2012-09-10 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP2016031912A (ja) * 2014-07-30 2016-03-07 住友金属鉱山株式会社 導電性ペーストの製造方法及びこれにより得られる導電性ペースト
JP2016035914A (ja) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 導電性ペースト
WO2017150438A1 (ja) * 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Also Published As

Publication number Publication date
JP2019046581A (ja) 2019-03-22
JP7013731B2 (ja) 2022-02-01
CN111386579B (zh) 2023-12-12
CN111386579A (zh) 2020-07-07
WO2019043671A2 (ja) 2019-03-07
KR102569072B1 (ko) 2023-08-21
KR20210068314A (ko) 2021-06-09
MY201078A (en) 2024-02-03

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