WO2019043674A3 - 導電性ペースト、電子部品、及び積層セラミックコンデンサ - Google Patents

導電性ペースト、電子部品、及び積層セラミックコンデンサ

Info

Publication number
WO2019043674A3
WO2019043674A3 PCT/IB2018/058473 IB2018058473W WO2019043674A3 WO 2019043674 A3 WO2019043674 A3 WO 2019043674A3 IB 2018058473 W IB2018058473 W IB 2018058473W WO 2019043674 A3 WO2019043674 A3 WO 2019043674A3
Authority
WO
WIPO (PCT)
Prior art keywords
dispersant
conductive paste
acid dispersant
electronic component
multilayer ceramic
Prior art date
Application number
PCT/IB2018/058473
Other languages
English (en)
French (fr)
Other versions
WO2019043674A2 (ja
Inventor
川島剛
Original Assignee
住友金属鉱山株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2018035052A external-priority patent/JP2019046783A/ja
Application filed by 住友金属鉱山株式会社 filed Critical 住友金属鉱山株式会社
Priority to CN201880056615.2A priority Critical patent/CN111066098B/zh
Priority to KR1020207005894A priority patent/KR20200116447A/ko
Publication of WO2019043674A2 publication Critical patent/WO2019043674A2/ja
Publication of WO2019043674A3 publication Critical patent/WO2019043674A3/ja

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Conductive Materials (AREA)

Abstract

【課題】 グラビア印刷に適した粘度を有し、かつ、ペーストの分散性に優れた導電性ペースト等を提供する。【解決手段】 導電性粉末、分散剤、バインダー樹脂及び有機溶剤を含む導電性ペーストであって、分散剤は、第１の酸系分散剤及び第２の酸系分散剤を含み、第１の酸系分散剤は、分子量が５０００以下であり、かつ、分岐鎖を１つ以上有する分岐炭化水素基を有する酸系分散剤であり、第２の酸系分散剤は、前記第１の酸系分散剤以外で、カルボキシル基を有する酸系分散剤であり、バインダー樹脂は、アセタール系樹脂を含み、有機溶剤は、グリコールエーテル系溶剤を含む、導電性ペーストトなどにより提供。
PCT/IB2018/058473 2017-08-30 2018-10-30 導電性ペースト、電子部品、及び積層セラミックコンデンサ WO2019043674A2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201880056615.2A CN111066098B (zh) 2017-08-30 2018-10-30 导电性浆料、电子部件以及叠层陶瓷电容器
KR1020207005894A KR20200116447A (ko) 2017-08-30 2018-10-30 도전성 페이스트, 전자 부품, 및 적층 세라믹 콘덴서

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2017-165896 2017-08-30
JP2017165896 2017-08-30
JP2018035052A JP2019046783A (ja) 2017-08-30 2018-02-28 導電性ペースト、並びに、電子部品及び積層セラミックコンデンサの製造方法
JP2018-035052 2018-02-28

Publications (2)

Publication Number Publication Date
WO2019043674A2 WO2019043674A2 (ja) 2019-03-07
WO2019043674A3 true WO2019043674A3 (ja) 2019-05-02

Family

ID=65527172

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/IB2018/058473 WO2019043674A2 (ja) 2017-08-30 2018-10-30 導電性ペースト、電子部品、及び積層セラミックコンデンサ

Country Status (2)

Country Link
TW (1) TW201937511A (ja)
WO (1) WO2019043674A2 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113823437B (zh) * 2021-09-28 2023-02-14 大连海外华昇电子科技有限公司 一种用于mlcc凹版印刷工艺的辊印浆料及其制备工艺

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049147A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2012174797A (ja) * 2011-02-18 2012-09-10 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP2016031912A (ja) * 2014-07-30 2016-03-07 住友金属鉱山株式会社 導電性ペーストの製造方法及びこれにより得られる導電性ペースト
JP2016035914A (ja) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 導電性ペースト
WO2017150438A1 (ja) * 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006049147A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2006049148A (ja) * 2004-08-05 2006-02-16 Shoei Chem Ind Co 導電性ペースト
JP2012174797A (ja) * 2011-02-18 2012-09-10 Sumitomo Metal Mining Co Ltd 積層セラミックコンデンサ内部電極に用いられるグラビア印刷用導電性ペースト
JP2016031912A (ja) * 2014-07-30 2016-03-07 住友金属鉱山株式会社 導電性ペーストの製造方法及びこれにより得られる導電性ペースト
JP2016035914A (ja) * 2014-07-31 2016-03-17 住友金属鉱山株式会社 導電性ペースト
WO2017150438A1 (ja) * 2016-02-29 2017-09-08 住友金属鉱山株式会社 導電性ペースト、電子部品及び積層セラミックコンデンサ

Also Published As

Publication number Publication date
TW201937511A (zh) 2019-09-16
WO2019043674A2 (ja) 2019-03-07

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