WO2019041883A1 - 光源结构、电子装置及光源结构制作方法 - Google Patents

光源结构、电子装置及光源结构制作方法 Download PDF

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Publication number
WO2019041883A1
WO2019041883A1 PCT/CN2018/086430 CN2018086430W WO2019041883A1 WO 2019041883 A1 WO2019041883 A1 WO 2019041883A1 CN 2018086430 W CN2018086430 W CN 2018086430W WO 2019041883 A1 WO2019041883 A1 WO 2019041883A1
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WIPO (PCT)
Prior art keywords
circuit board
substrate
printed circuit
light source
source structure
Prior art date
Application number
PCT/CN2018/086430
Other languages
English (en)
French (fr)
Inventor
王振
孙海威
桑建
马俊杰
张树柏
李中华
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/320,163 priority Critical patent/US20210336104A1/en
Publication of WO2019041883A1 publication Critical patent/WO2019041883A1/zh

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Definitions

  • At least one embodiment of the present disclosure is directed to a light source structure, an electronic device, and a method of fabricating a light source structure.
  • Surface-mounting technology is usually a method of mounting a leadless or short-lead surface-mounting device (such as a light-emitting device) on a printed circuit board (PCB) surface or other surface by soldering (such as reflow soldering or dip soldering). Circuit mounting technology.
  • Assembly of light source structures for some electronic devices, such as display devices often employs surface assembly techniques. With the rapid development of the display industry, the optical performance requirements of the display device are getting higher and higher, and the performance requirements of the light source structure are getting higher and higher, and the light source assembly process also affects the performance of the light source structure.
  • At least one embodiment of the present disclosure provides a light source structure including a light emitting unit, a printed circuit board, and an adhesive layer.
  • the light emitting unit includes a substrate and at least one light emitting element disposed on the substrate; the printed circuit board has a first surface, wherein the light emitting unit is disposed on the first surface of the printed circuit board through the substrate; the adhesive layer is disposed on the substrate and the printed circuit board Between the first surfaces, the substrate and the printed circuit board are bonded.
  • At least one groove is disposed in a region overlapping the substrate on the printed circuit board, and the adhesive layer is disposed in the at least one groove.
  • a surface of the bonding layer facing the substrate is substantially flush with a first surface of the printed circuit board.
  • the adhesive layer is a double-sided tape.
  • an electrode pin is disposed on the substrate, and a contact point is disposed on the printed circuit board, and the electrode pin is electrically connected to the contact point.
  • the electrode pins are soldered to the contact points.
  • the printed circuit board is a flexible circuit board.
  • the light emitting element is a light emitting diode device.
  • the planar shape of the light source structure is elongated or planar.
  • the LED device is a flip chip, and the electrode configured as the LED device is directly electrically connected to the substrate.
  • the light emitting unit further includes a fluorescent layer covering the at least one light emitting diode device and the substrate.
  • At least one embodiment of the present disclosure further provides an electronic device including any of the light source structures provided by the embodiments of the present disclosure.
  • an electronic device is a display device, and a light source structure is configured as a backlight of the display device.
  • At least one embodiment of the present disclosure also provides a method of fabricating a light source structure, the method comprising providing a printed circuit board and a light emitting unit, wherein the printed circuit board has a first surface, the light emitting unit comprises a substrate and at least one disposed on the substrate a light-emitting element; an adhesive layer disposed at a position overlapping the substrate of the first surface of the printed circuit board; the light-emitting unit being disposed on the printed circuit board through the substrate, the adhesive layer bonding the substrate to the printed circuit board; and the light emitting The unit is electrically connected to the printed circuit board.
  • the method for fabricating a light source structure further includes: providing a groove at a position overlapping the substrate of the printed circuit board; and disposing the adhesive layer in the groove and facing the substrate toward the substrate; The surface is substantially flush with the first surface of the printed circuit board.
  • a substrate in a method for fabricating a light source structure according to an embodiment of the present disclosure, includes an electrode lead, and a first surface of the printed circuit board is provided with a contact point; and electrically connecting the LED package structure to the printed circuit board includes connecting the electrode lead Contact spot welding.
  • 1 is a schematic view showing the structure of a light source
  • FIG. 2 is a schematic plan view showing a structure of a light source according to an embodiment of the present disclosure
  • Figure 3A is a schematic cross-sectional view taken along line I-I' of Figure 2;
  • Figure 3B is another schematic cross-sectional view taken along line I-I' of Figure 2;
  • FIG. 4 is a schematic diagram of an electronic device according to an embodiment of the present disclosure.
  • 5A-5F are schematic diagrams showing a method for fabricating a light source structure according to an embodiment of the present disclosure
  • 6A-6B are schematic diagrams showing another method of fabricating a light source structure according to an embodiment of the present disclosure.
  • Fig. 1 is a schematic view showing the structure of a light source.
  • the light source structure comprises a light-emitting device, a printed circuit board 4' and an adhesive 7'.
  • the light emitting device includes a substrate 1', a light emitting diode 2' disposed on the substrate 1', and a fluorescent layer 3', and the fluorescent layer 3' covers the light emitting diode 2'.
  • the light emitting device is disposed on the printed circuit board 4'.
  • An electrode pin 5' is disposed on the substrate 1', a pad is disposed on the printed circuit board 4', and the electrode pin 5' is soldered to the pad on the printed circuit board 4' to realize the electrode pin 5' and the printing
  • the circuit board 4' is electrically connected to electrically connect the light emitting diodes to the printed circuit board 4'.
  • the light emitting device further includes a solder 6' which is connected to the pad of the printed circuit board 4' by solder 6' during soldering.
  • the printed circuit board 4' is further provided with an adhesive 7', which is located around the light-emitting device and covers a part of the printed circuit board for bonding the printed circuit board to the device to be mounted with the light source structure, for example Lighting device, display device, and the like.
  • the fixture can be used to restrict the movement of the substrate 1 relative to the printed circuit board 4'.
  • the fixture can refer to conventional techniques in the art.
  • the fixture can limit the movement of the substrate 1 relative to the printed circuit board 4'. .
  • the solder 6' is in a molten state, and it is easy to flow into the gap between the substrate 1 and the printed circuit board 4', so that after the soldering is finished, the gap is in the gap.
  • the solder will raise the substrate 1' at this position, resulting in uneven thickness of the light source structure and reducing the production yield of the light source structure.
  • the thickness of the display device on which the light source structure is mounted is difficult to control, the thickness of the produced display device is made non-uniform, affecting the yield of the display device product.
  • At least one embodiment of the present disclosure provides a light source structure including a light emitting unit, a printed circuit board, and an adhesive layer.
  • the light emitting unit includes a substrate and at least one light emitting element on the substrate; the printed circuit board has a first surface, wherein the light emitting unit is disposed on the first surface of the printed circuit board through the substrate; and the adhesive layer is disposed on the substrate and the printed circuit board Between the first surfaces, the substrate and the printed circuit board are bonded.
  • FIG. 2 is a schematic plan view of a light source structure according to an embodiment of the present disclosure
  • FIG. 3A is a cross-sectional view taken along line II' of FIG. 2
  • FIG. 3B is a view along I of FIG. Another cross-sectional view of the -I' line.
  • the light source structure includes a light emitting unit 15, a printed circuit board 4, and an adhesive layer 8.
  • the light emitting unit 15 includes a substrate 1 and a plurality of light emitting elements 2 disposed on the substrate 1.
  • the light emitting element 2 is electrically connected to the substrate 1.
  • the printed circuit board 4 has a first surface 401, and the light emitting unit 15 is disposed on the first surface 401 of the printed circuit board through the substrate 1, that is, the substrate 1 is fixedly disposed on the first surface 401.
  • the bonding layer 8 is disposed between the substrate 1 and the first surface 401 of the printed circuit board to bond the substrate 1 and the printed circuit board 4, thereby achieving fixation of the light emitting unit 15 and the substrate 1.
  • one light emitting unit may include one or more light emitting elements.
  • a plurality of light-emitting elements are disposed, and the specific number of the light-emitting elements may be designed according to the actual requirements of the product.
  • the number of the light-emitting elements is not specifically limited in the embodiment of the present disclosure.
  • the bonding layer 8 can be a double-sided tape, such as a high temperature resistant double-sided tape, which can withstand higher temperatures during the soldering process.
  • the high temperature resistant double-sided tape may be polyethylene terephthalate (PET) high temperature tape, polyethylene (PE) foam tape, polyimide film tape, polyvinyl chloride (PVC) substrate.
  • PET polyethylene terephthalate
  • PE polyethylene
  • PE polyethylene
  • PVC polyvinyl chloride
  • Teflon high temperature tape can withstand temperatures up to about 230 ° C
  • PET high temperature tape can withstand temperatures up to about 200 ° C
  • polyimide film tape can withstand temperatures up to about 300 ° C.
  • the bonding layer 8 is not limited to the above-mentioned types, and the embodiment of the present disclosure does not limit this.
  • the substrate 1 is provided with electrode pins 5, and the printed circuit board 4 is provided with contact points, and the electrode pins 5 are electrically connected to the contact points, thereby electrically connecting the light-emitting elements 2 to the printed circuit board 4.
  • a printed circuit board 4 may be provided with pads on which the contact points are disposed.
  • the electrode lead 5 can be soldered to the contact point (reflow soldering, dip soldering or hand soldering, etc.).
  • the electrode pins 5 can be connected to the contact points by the solder 6, so that the two can be electrically conducted.
  • the solder 6 may be tin solder, silver solder, copper solder, etc., and the tin solder includes pure tin, tin-lead alloy solder, twisted solder, cadmium-added solder, silver-added solder, and copper solder.
  • the solder 6 may be other materials that can achieve the same effect, and is not limited to the above listed types, and those skilled in the art can select according to the actual requirements of the product.
  • the solder 6 is in a molten state. If there is a gap between the substrate 1 and the printed circuit board 4, the solder in a molten state easily flows into the gap between the substrate 1 and the printed circuit board 4, which will result in the light source structure 10.
  • the thickness of the position where the solder exists between the substrate 1 and the printed circuit board 4 becomes large, resulting in uneven thickness of the light source structure 10 and difficulty in controlling the thickness uniformity of the mass-produced light source structure 10, and reducing the production of the light source structure 10.
  • the rate which in turn causes the thickness of the device in which the light source structure is mounted, is difficult to control.
  • the thickness of the display device on which the light source structure is mounted is difficult to control, making the thickness of the produced display device inconsistent, affecting the yield of the display device product.
  • the gap between the substrate 1 and the printed circuit board 4 is eliminated or reduced. It is advantageous to improve or avoid the above problems in the above welding process, and to improve the structure of the light source and the device for mounting the light source structure.
  • a fixture is usually used to reduce the gap between the substrate 1 and the printed circuit board 4.
  • the fixture 1 is used to press the substrate 1 against the first surface 401 of the printed circuit board.
  • the movement of the substrate 1 relative to the printed circuit board 4 is restricted so as not to change the relative position of the two.
  • the bonding layer 8 is used to bond the substrate 1 and the printed circuit board 4, the relative positions of the two are fixed, which facilitates the subsequent processing procedure and reduces the fixture. Claim.
  • the light emitting element 2 may be a light emitting diode device.
  • the corresponding light emitting unit 15 may be a light emitting diode package structure, for example, it may be a plurality of surface mount light emitting diodes (SMD LEDs), or may be a chip on board (COB) or other forms.
  • SMD LEDs surface mount light emitting diodes
  • COB chip on board
  • the chip can be an inorganic light emitting diode, an inorganic laser diode, or an organic light emitting diode chip.
  • one LED package structure may include one or more light emitting diodes or light emitting diode chips, etc., that is, one of the above light emitting units may include one or more light emitting elements.
  • the number of the light-emitting units is not limited in the embodiment of the present disclosure, and those skilled in the art can design according to actual needs. Listed above are illustrative examples of the light-emitting element 2 and the light-emitting unit 15, but the light-emitting element 2 and the light-emitting unit are not limited to the kind.
  • the light emitting diode chip may be a flip chip, and the electrode configured as the light emitting diode chip is directly electrically connected to the substrate 1 .
  • the conventional (positively mounted) LED chip is electrically connected to the substrate 1 through a metal wire, the electrical face of the LED chip faces upward (ie, the side away from the substrate), and the electrical face of the flip-chip LED chip faces downward (ie, faces the substrate) One side) is equivalent to turning the former over.
  • the flip-chip LED chip does not need to use a metal wire, that is, the metal wire is not required to be soldered to the substrate 1, but the electrode of the LED chip can be directly soldered to the pad on the substrate 1, thereby realizing the electrode of the LED chip. Directly electrically connected to the substrate 1.
  • the flip-chip LED chip is more stable than the LED chip mounted in the package, and there is no problem of poor soldering of the wire and easy breakage.
  • the planar shape of the light source structure may be elongated or planar, which respectively satisfies the need to serve as an elongated light source and a planar light source such as a display device or a lighting device.
  • the planar shape of the light source structure is a rectangle. In other embodiments, it may be other shapes, and may be a regular figure or an irregular figure. For example, a circle, an ellipse, a fan or an irregular figure. It can be designed according to the specific needs of the device in which the light source structure is installed.
  • the printed circuit board 4 may be a rigid substrate or a flexible circuit board.
  • the flexible substrate may be a flexible circuit board based on polyimide or polyester film, which has high wiring density, light weight, and thickness. The thin and good bending characteristics can be applied to the flexible device by using the light source structure.
  • the light-emitting element 2 is a light-emitting diode chip
  • the light-emitting unit 15 further includes a fluorescent layer 3 covering at least one light-emitting diode chip and the substrate 1.
  • the phosphor type of the fluorescent layer 3 can be determined according to the light-emitting band (color of light) required for the light-emitting diode chip, so that the light emitted from the light-emitting diode chip is the desired light.
  • the light emitted by the light-emitting diodes on the light-emitting diode chip can be adjusted by the fluorescent layer 3 to be light that the human eye feels comfortable.
  • an adhesive 7 is disposed on the first surface 401 of the printed circuit board, and the adhesive 7 is disposed around the light emitting unit 15.
  • the adhesive 7 is enclosed around the light emitting unit 15, but in other embodiments of the present disclosure, the adhesive 7 may also surround the partial light emitting unit 15.
  • the adhesive 7 covers at least a portion of the printed circuit board, for example, covering the position of the printed circuit board 4 near the edge. It is used to bond the printed circuit board 4 to a device that requires the light source structure to be mounted, such as a lighting device, a display device, or the like.
  • FIG. 3B shows another light source structure according to an embodiment of the present disclosure.
  • the embodiment shown in FIG. 3B differs from the embodiment shown in FIG. 3A in that it overlaps the substrate 1 on the printed circuit board 4.
  • the area is provided with a recess 9 in which the adhesive layer 8 is disposed.
  • the substrate 1 extends in the up and down direction in FIG. 2, and the groove 9 also extends in this direction.
  • the substrate 1 can be prevented from being raised by the bonding layer 8, so that the technical problem of the above-mentioned soldering process can be solved, and the influence of the bonding layer 8 on the thickness of the light source structure 10 can be reduced, which is advantageous for obtaining a light and thin light source.
  • the surface of the bonding layer 8 that faces the substrate 1 is substantially flush with the first surface 401 of the printed circuit board.
  • a flat surface can still be formed on the printed circuit board 4, and the substrate 1 can be easily bonded to the printed circuit board 4 without increasing the thickness of the light source, which is advantageous for reducing both of them.
  • a gap between the substrate 1 and the inner side wall of the groove can be prevented, so that the solder in the soldering process can be prevented from infiltrating the gap.
  • the light source structure provided by the embodiments of the present disclosure can be applied to various electronic devices, such as lighting devices, including living lighting devices or decorative lighting devices, or the like, or the like, for example, as a backlight of the display device.
  • At least one embodiment of the present disclosure further provides an electronic device including any of the light source structures provided by the embodiments of the present disclosure.
  • the electronic device is, for example, a lighting device comprising any one of the above-mentioned light source structures, which can emit monochromatic light, such as white light, red light, green light or blue light, or emit colored light, for example, through red and green.
  • the blue (RGB) color scheme results in different colors of light.
  • the lighting device can be, for example, a lighting fixture, a display panel, a billboard, or the like.
  • the electronic device can also be a display device.
  • FIG. 4 is a schematic diagram of a display device according to an embodiment of the present disclosure.
  • the light source structure 10 can be configured as a backlight of the display device 100, for example as a side-entry backlight, disposed on one side of the display panel 12.
  • the light source structure 10 is configured such that light emitted therefrom can be incident on the display panel 12.
  • the light source structure 10 can also function as a direct type backlight.
  • the display device 100 may further include a light guiding structure 11 configured to enable light emitted from the light source structure 10 to be better incident on the display panel through the light guide plate, which is advantageous for improving light utilization efficiency.
  • a light guiding structure 11 configured to enable light emitted from the light source structure 10 to be better incident on the display panel through the light guide plate, which is advantageous for improving light utilization efficiency.
  • the display device 100 may further include a reflective structure 13 configured to be capable of changing a portion of the light emitted by the light source structure 10 or/and a portion of the light emitted through the light guiding structure 11 through the reflective structure 20 to change the exit direction, thereby enabling more The light is incident on the display panel 12, which is advantageous for improving the utilization of light.
  • a reflective structure 13 configured to be capable of changing a portion of the light emitted by the light source structure 10 or/and a portion of the light emitted through the light guiding structure 11 through the reflective structure 20 to change the exit direction, thereby enabling more The light is incident on the display panel 12, which is advantageous for improving the utilization of light.
  • the display device 100 may further include a sealant 14 disposed on the periphery of the display panel 12, the light source structure 10, and the reflective structure 13 for bonding and protecting various components of the display device 100.
  • the display device provided by the embodiment of the present disclosure may be a liquid crystal display device or other display device that requires a backlight.
  • FIG. 4 only shows the components of the display device 100 directly related to the light source structure.
  • those skilled in the art can refer to the conventional technology.
  • the respective structures in FIG. 4 are merely exemplary, and the shapes and relative positions of the respective components of the display device 100 are not limited to those shown in the drawings.
  • At least one embodiment of the present disclosure also provides a method of fabricating a light source structure, the method comprising providing a printed circuit board having a first surface, the light emitting unit comprising a substrate and at least one light emitting component disposed on the substrate The method further includes: providing an adhesive layer at a position of the first surface of the printed circuit board overlapping the substrate; placing the light emitting unit on the printed circuit board through the substrate, and bonding the substrate to the printed circuit board; And electrically connecting the light emitting unit to the printed circuit board.
  • FIG. 5A-5F are schematic diagrams of a method for fabricating a light source structure according to an embodiment of the present disclosure
  • FIGS. 6A-6B are schematic diagrams showing another method for fabricating a light source structure according to an embodiment of the present disclosure.
  • a printed circuit board 4 and a light emitting unit 15 are provided.
  • the printed circuit board 4 has a first surface 401, which may be a metal-based circuit board (such as an aluminum substrate, a copper substrate, an iron substrate, etc.), a ceramic circuit board, or a flexible circuit board (for example, a polyimide or a polyester film). Substrate) and so on.
  • the light emitting unit 15 includes a substrate 1 and at least one light emitting element 2 disposed on the substrate 1, and the light emitting element 2 is electrically connected to the substrate 1.
  • the light-emitting element 2 can be a light-emitting diode device. For example, in the embodiment shown in FIG.
  • the light-emitting element 2 is a light-emitting diode chip
  • the corresponding light-emitting unit 15 can be a light-emitting diode package structure.
  • the light emitting unit 15 further includes a fluorescent layer 3 covering the light emitting diode chip and the substrate 1, so that the light emitted from the light emitting diode chip is required light.
  • Electrode pins 5 are also provided on the substrate 1 for electrical connection with the printed circuit board 4.
  • the first surface 401 of the printed circuit board is provided with contact points for soldering with the electrode pins 5 in the light emitting unit 15 in a subsequent process.
  • the method of fabricating the light source structure further includes providing an adhesive layer at a position of the first surface 401 of the printed circuit board to be overlapped with the substrate 1.
  • a groove 9 may be provided at a position on the first surface 401 of the printed circuit board to be overlapped with the substrate 1.
  • it may be formed by a photolithography process or an exposure-developing process, and those skilled in the art may select according to the material of the printed circuit board 4.
  • the method of fabricating the light source structure further includes disposing the bonding layer 8 in the recess 9 for subsequently bonding the substrate 1 and the printed circuit board 4, and causing the bonding layer 8 to face the substrate 1.
  • the surface is substantially flush with the first surface 401 of the printed circuit board. Therefore, it is possible to prevent the substrate 1 from being subsequently padded by the bonding layer 8 after the substrate 1 is disposed, thereby reducing the influence of the bonding layer 8 on the thickness of the light source structure 10, facilitating the structure of the light and thin light source, and making the light and thin structure using the light source structure.
  • Type products for the material of the bonding layer 8, please refer to the description in the first embodiment, and details are not described herein again.
  • the light-emitting unit 15 is disposed on the printed circuit board 4 such that the substrate 1 and the printed circuit board 4 are bonded by the adhesive layer 8, that is, the light-emitting unit 15 is disposed on the printed circuit board through the substrate 1.
  • the method of fabricating the light source structure further includes electrically connecting the light emitting unit 15 to the printed circuit board 14.
  • the electrically connecting 15 to the printed circuit board 14 can include soldering the electrode pins 5 to the contact points.
  • the electrode pins 5 can be connected to the contact points by the solder 6, so that both can be electrically conducted.
  • the material of the solder 6, please refer to the description in the first embodiment.
  • a fixture is usually used to reduce the gap between the substrate 1 and the printed circuit board 4.
  • the fixture 1 is used to press the substrate 1 against the first surface 401 of the printed circuit board.
  • the movement of the substrate 1 relative to the printed circuit board 4 is restricted so as not to change the relative position of the two.
  • the bonding layer 8 is used to bond the substrate 1 and the printed circuit board 4, the relative positions of the two are fixed, and the requirements for the jig can be reduced.
  • the method of fabricating the light source structure further includes disposing an adhesive 7 on the first surface 401 of the printed circuit board.
  • the adhesive 7 is arranged around the illuminating element 2 and may be partially enclosed or enclosed.
  • the adhesive 7 covers at least a portion of the printed circuit board 4, for example, covering the position of the printed circuit board 4 near the edge. It is used to bond the printed circuit board 4 to a device that requires the light source structure to be mounted, such as a lighting device, a display device, or the like.
  • FIGS. 5A-5F illustrate another method of fabricating a light source structure according to an embodiment of the present disclosure.
  • the method includes providing a printed circuit board 4 and a light emitting unit 15. This process is the same as that shown in FIG. 5A. Please refer to the above. description.
  • This method differs from the embodiment shown in FIGS. 5A-5F in that the bonding layer 8 can be directly disposed on the printed circuit board 4 as shown in FIG. 6A.
  • the light emitting unit 15 is disposed on the printed circuit board 4, and the substrate 1 and the printed circuit board 4 are bonded by the adhesive layer 8.
  • the other processes are the same as those in the embodiment shown in FIGS. 5A-5F, please refer to the above description.
  • the same or similar technical effects as the embodiment shown in Figs. 5A to 5F can also be obtained by this method.
  • the light source structure fabricated by the method can be applied to various electronic devices, such as lighting devices, including living lighting devices or decorative lighting devices, or can be applied to display devices and the like, for example, as a backlight of the display device.

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Abstract

一种光源结构、电子装置及光源结构制作方法。该光源结构(10)包括发光单元、印刷电路板(4)和粘结层(8)。发光单元包括基板(1)和至少一个设置在基板(1)上的发光元件(2)；印刷电路板(4)具有第一表面(401)，发光单元通过基板(1)设置在印刷电路板(4)的第一表面(401)上；粘结层(8)设置在基板(1)与印刷电路板(4)的第一表面(401)之间，粘结基板(1)和印刷电路板(4)。该光源结构能够改善或避免焊料进入基板和印刷电路板之间而造成光源厚度不均匀的问题，有利于提高光源结构的良率。

Description

光源结构、电子装置及光源结构制作方法
本申请要求于2017年8月31日递交的中国专利申请第201710772974.5号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开至少一实施例涉及一种光源结构、电子装置及光源结构制作方法。
背景技术
表面组装技术通常是一种将无引脚或短引线表面组装器件(例如发光器件)安装在印刷电路板(PCB)表面或其他表面上，通过焊接(例如回流焊或浸焊)等方法组装的电路装连技术。一些电子装置(例如显示装置)的光源结构的组装往往会运用表面组装技术。随着显示行业的快速发展，对显示装置的光学性能要求越来越高，对光源结构的性能要求也越来越高，而光源组装过程也会对光源结构的性能产生影响。
发明内容
本公开至少一实施例提供一种光源结构，该光源结构包括发光单元、印刷电路板和粘结层。发光单元包括基板和至少一个设置在基板上的发光元件；印刷电路板具有第一表面，其中，发光单元通过基板设置在印刷电路板的第一表面上；粘结层设置在基板与印刷电路板的第一表面之间，粘结基板和印刷电路板。
例如，本公开一实施例提供的光源结构中，在印刷电路板上与基板重叠的区域设置有至少一个凹槽，粘结层设置于该至少一个凹槽内。
例如，本公开一实施例提供的光源结构中，粘结层的朝向基板的表面与印刷电路板的第一表面基本齐平。
例如，本公开一实施例提供的光源结构中，粘结层为双面胶。
例如，本公开一实施例提供的光源结构中，基板上设置有电极引脚，印刷电路板上设置有接触点，电极引脚与接触点电连接。
例如，本公开一实施例提供的光源结构中，电极引脚与接触点焊接。
例如，本公开一实施例提供的光源结构中，印刷电路板为柔性电路板。
例如，本公开一实施例提供的光源结构中，发光元件为发光二极管器件。
例如，本公开一实施例提供的光源结构中，光源结构的平面形状为长条状或面状。
例如，本公开一实施例提供的光源结构中，发光二极管器件为倒装芯片，且配置为发光二极管器件的电极与基板直接电连接。
例如，本公开一实施例提供的光源结构中，发光单元还包括覆盖所述至少一个发光二极管器件和所述基板的荧光层。
本公开至少一实施例还提供一种电子装置，该电子装置包括本公开实施例提供的任意一种光源结构。
例如，本公开一实施例提供的电子装置为显示装置，光源结构配置为该显示装置的背光源。
本公开至少一实施例还提供一种光源结构制作方法，该方法包括提供印刷电路板和发光单元，其中，印刷电路板具有第一表面，发光单元包括基板和至少一个设置在所述基板上的发光元件；在印刷电路板的第一表面的与基板重叠的位置设置粘结层；将发光单元通过基板设置于印刷电路板上，使粘结层将基板与印刷电路板粘结；以及将发光单元与印刷电路板电连接。
例如，本公开一实施例提供的光源结构制作方法还包括：在印刷电路板的与基板重叠的位置设置凹槽；以及将粘结层设置于凹槽中，并使粘结层的朝向基板的表面与印刷电路板的第一表面基本齐平。
例如，本公开一实施例提供的光源结构制作方法中，基板包括电极引脚，印刷电路板的第一表面设置有接触点；将发光二极管封装结构与印刷电路板电连接包括将电极引脚与接触点焊接。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作 简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为一种光源结构示意图；
图2为本公开一实施例提供的一种光源结构的平面示意图；
图3A为沿图2中的I-I’线的一种剖面示意图；
图3B为沿图2中的I-I’线的另一种剖面示意图；
图4为本公开一实施例提供的一种电子装置示意图；
图5A-5F为本公开一实施例提供的一种光源结构制作方法示意图；
图6A-6B为本公开一实施例提供的另一种光源结构制作方法示意图。
附图标记
1’-基板；2’-发光二极管；3’-荧光层；4’-印刷电路板；5’-电极引脚；6’-焊锡；7’-粘结胶；1-基板；2-发光元件；3-荧光层；4-印刷电路板；401-印刷电路板的第一表面；5-电极引脚；6-焊料；7-粘结胶；8-粘结层；9-凹槽；10-光源结构；11-导光结构；12-显示面板；13-反射结构；14-封框胶；15-发光单元；100-显示装置。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。以下所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，都属于本公开保护的范围。
除非另作定义，此处使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接 的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
本公开所使用的附图的尺寸并不是严格按实际比例绘制，各个结构的具体地尺寸可根据实际需要进行确定，发光元件和电极引脚的数量也不是限定为图中所示的数量。本公开中所描述的附图仅是结构示意图。
图1为一种光源结构示意图，如图1所示，该光源结构包括发光器件、印刷电路板4’和粘结胶7’。发光器件包括基板1’、设置在基板1’上的发光二极管2’和荧光层3’，荧光层3’覆盖发光二极管2’。该发光器件设置在印刷电路板4’上。基板1’上设置有电极引脚5’，印刷电路板4’上设置有焊盘，电极引脚5’与印刷电路板4’上的焊盘焊接在一起而实现电极引脚5’与印刷电路板4’电连接，从而实现发光二极管与印刷电路板4’电连接。该发光器件还包括焊锡6’，焊接过程中采用焊锡6’将电极引脚5’和印刷电路板4’的焊盘连接。印刷电路板4’上还设置有粘结胶7’，粘结胶7’位于发光器件周围，覆盖一部分印刷电路板，用于将印刷电路板与需要安装该光源结构的装置相粘结，例如照明装置、显示装置等。
在上述焊接过程中，可以采用治具限制基板1相对于印刷电路板4’移动，该治具可参考本领域常规技术，例如治具可以是能够限制基板1相对于印刷电路板4’移动夹具。但是，基板1与印刷电路板4’之间存在缝隙，焊接过程中焊锡6’呈熔融状态，容易流入基板1与印刷电路板4’之间存在缝隙中，从而在焊接结束后，该缝隙中的焊锡会将该位置处的基板1’垫高，导致光源结构的厚度不均匀，降低光源结构的生产良率。并且，这样会造成安装该光源结构的装置的厚度难以控制。例如，如果安装该光源结构的显示装置的厚度难以控制，则使生产的显示装置的厚度不均一，影响显示装置产品的良率。
下面通过几个具体的实施例对本公开涉及的结构、方法及技术效果作详细说明。
本公开至少一实施例提供一种光源结构，该光源结构包括发光单元、印刷电路板和粘结层。发光单元包括基板和至少一个在基板上的发光元件；印刷电路板具有第一表面，其中，发光单元通过基板设置在印刷电路板的第一表面上；粘结层设置在基板与印刷电路板的第一表面之间，粘结基板和印刷 电路板。
示范性地，图2为本公开一实施例提供的一种光源结构的平面示意图，图3A为沿图2中的I-I’线的一种剖面示意图，图3B为沿图2中的I-I’线的另一种剖面示意图。
如图2和图3A所示，该光源结构包括发光单元15、印刷电路板4和粘结层8。发光单元15包括基板1和多个设置在基板1上的发光元件2。发光元件2与基板1电连接。印刷电路板4具有第一表面401，发光单元15通过基板1设置在该印刷电路板的第一表面401上，即基板1固定设置于第一表面401上。粘结层8设置在基板1与印刷电路板的第一表面401之间，以粘结基板1与印刷电路板4，从而实现将发光单元15和基板1的固定。这样可以使基板1与印刷电路板4之间没有缝隙，从而能够防止在后续制作工艺中基板1与印刷电路板4之间进入异物而导致使光源结构在基板1与印刷电路板4重叠的部位的厚度不均匀的问题。
需要说明的是，一个发光单元可包括一个或多个发光元件。本公开实施例中设置有多个发光元件，发光元件的具体个数可以根据产品的实际需求进行设计，本公开实施例对发光元件的个数不作具体的限定。
例如，粘结层8可以为双面胶，例如耐高温的双面胶，可以承受焊接过程中较高的温度。例如，该耐高温的双面胶可以是聚对苯二甲酸乙二醇酯(PET)高温胶带、聚乙烯(PE)泡棉胶带、聚酰亚胺薄膜胶带、聚氯乙烯(PVC)基材双面胶带、铁氟龙高温胶带或高温美纹纸胶带等，这些耐高温双面胶可以承受的温度范围因材料不同而存在差别。例如，铁氟龙高温胶带可承受的温度可至约230℃左右，PET高温胶带可承受温度至约200℃左右，聚酰亚胺薄膜胶带可承受温度至约300℃左右。当然，粘结层8不仅仅限于是以上所述种类，本公开实施例对此不作限定。
例如，基板1上设置有电极引脚5，印刷电路板4上设置有接触点，电极引脚5与所述接触点电连接，从而实现发光元件2与印刷电路板4电连接。例如，印刷电路板4上可以设置有焊盘，接触点设置于焊盘上。
例如，电极引脚5可以与所述接触点焊接(回流焊、浸焊或手工焊等)。通过焊料6将电极引脚5可以与所述接触点连接，从而能够实现将两者电导 通。例如，焊料6可以是锡焊料、银焊料、铜焊料等，锡焊料包括纯锡、锡铅合金焊锡、加锑焊锡、加镉焊锡、加银焊锡和加铜焊锡等。当然，焊料6也可以是其它能够达到相同效果的材料，不限于是以上列举种类，本领域技术人员可根据对产品的实际要求进行选择。
在焊接过程中，焊料6呈熔融状态，如果基板1和印刷电路板4之间存在缝隙，那么呈熔融状态的焊料容易流入基板1和印刷电路板4之间存在缝隙，将会导致光源结构10在基板1和印刷电路板4之间存在焊料的位置的厚度变大，造成光源结构10厚度不均匀且不容易把控批量生产的光源结构10的厚度的一致性，降低光源结构10的生产良率，进而会造成安装该光源结构的装置的厚度难以控制。例如，安装该光源结构的显示装置的厚度难以控制，使生产的显示装置的厚度不一致，影响显示装置产品的良率。而在本公开一实施例提供的光源结构中，由于通过粘结层8将基板1与印刷电路板4粘结在一起，消除或减小了基板1与印刷电路板4之间的缝隙，有利于在上述焊接过程中改善或避免上述问题，提高光源结构及安装该光源结构的装置的良率。此外，在焊接过程中，通常会采用治具来减小基板1与印刷电路板4之间的缝隙，例如采用治具尽量将基板1紧压在印刷电路板的第一表面401上。同时限制基板1相对于印刷电路板4的移动，以免两者的相对位置发生变化。在本公开一实施例中，由于采用了粘结层8将基板1与印刷电路板4粘结在一起，会使两者的相对位置固定，方便了后续加工程序，还可以降低对治具的要求。
例如，发光元件2可以为发光二极管器件。例如发光二极管或发光二极管芯片等，对应形成的发光单元15可以为发光二极管封装结构，例如其可以是多个表面贴装发光二极管(SMD LED)，也可以是板上芯片(COB)或其他形式的发光元件。该芯片可以为无机发光二极管、无机激光二极管、有机发光二极管芯片。需要说明的是，本公开一实施例中，一个发光二极管封装结构可以包括一个或多个发光二极管或发光二极管芯片等，即上述的一个发光单元可包括一个或多个发光元件。并且，本公开实施例对发光单元的个数也不作限定，本领域技术人员可以根据实际需要进行设计。以上列举的为发光元件2和发光单元15的示范性示例，但发光元件2和发光单元不仅限于是 所述种类。
例如，上述发光二极管芯片可以为倒装芯片，且配置为发光二极管芯片的电极与基板1直接电连接。传统的(正装的)发光二极管芯片通过金属线与基板1电连接，发光二极管芯片的电气面朝上(即远离基板的一侧)，而倒装发光二极管芯片的电气面朝下(即朝向基板的一侧)，相当于将前者翻转过来。例如，倒装发光二极管芯片无需采用金属线，即无需将金属线与基板1焊接，而是可以将发光二极管芯片的电极直接与基板1上的焊盘经过焊接固定，从而实现发光二极管芯片的电极与基板1直接电连接。倒装发光二极管芯片比正装的发光二极管芯片更加稳定，不会出现金属线焊接不良和容易断裂的问题。
例如，光源结构的平面形状可以为长条状或面状，分别能够满足充当例如显示装置或照明装置的长条形光源和面状光源的需要。图2所示的实施例中，光源结构的平面形状为矩形，在其他实施例中，其也可以为其他形状，可以为规则图形，也可以为不规则图形。例如圆形、椭圆形、扇形或不规则图形等。可以根据需要安装该光源结构的装置的具体需求进行设计。
例如，印刷电路板4可以为硬质基板或柔性电路板，例如该柔性基板可以是以聚酰亚胺或聚酯薄膜为基材的柔性电路板，其具有配线密度高、重量轻、厚度薄、弯折性好的特点，能够适用于利用该光源结构制作柔性装置。
例如，在图3A所示的实施例中，发光元件2为发光二极管芯片，发光单元15还包括覆盖至少一个发光二极管芯片和基板1的荧光层3。可根据发光二极管芯片所需的发光波段(光的颜色)确定好荧光层3的荧光粉型号，以使得发光二极管芯片发出的光为所需要的光。例如，当将该光源结构用于显示照明时，可通过荧光层3将发光二极管芯片上的发光二极管发出的光调节为人眼感觉舒适的光。在该实际应用过程中，还可以通过选择制造发光二极管的材料和利用驱动电路等来控制通过发光二极管的电流，从而控制其发出的光的波长。借此，可达到控制发光的颜色的效果，可以得到各种颜色的色光，例如这种光源结构可以用于展示板、广告牌等。
例如，在印刷电路板的第一表面401上还设置有粘结胶7，粘结胶7围绕发光单元15设置。例如，在图3A中，粘结胶7封闭式围绕发光单元15， 但在本公开的其他实施例中，粘结胶7也可以围绕部分发光单元15。粘结胶7覆盖至少部分印刷电路板，例如，覆盖印刷电路板4的靠近边缘的位置。用于将印刷电路板4与需要安装该光源结构的装置相粘结，例如照明装置、显示装置等。
在本公开的另一个实施例中，在所印刷电路板上与基板重叠的区域还可以设置有至少一个凹槽，粘结层设置于该至少一个凹槽内。例如，图3B所示的是本公开一实施例提供的另一种光源结构，图3B所示的实施例与图3A所示的实施例的区别在于，在印刷电路板4上与基板1重叠的区域设置有凹槽9，粘结层8设置于凹槽9内。如图2所示，基板1沿图2中的上下方向延伸，则所述凹槽9也沿该方向延伸。借此，能够防止基板1被粘结层8垫高，从而能够在解决上述焊接过程中的技术问题的同时，减小粘结层8对光源结构10的厚度的影响，有利于得到轻薄型光源结构以及利用该光源结构制作轻薄型产品。
例如，在图3B中，粘结层8的朝向基板1的表面与印刷电路板的第一表面401基本齐平。如此，设置粘结层8之后，仍然能够在印刷电路板4上形成平坦的表面，能够在不增加光源的厚度的同时，便于将基板1与印刷电路板4粘结，更利于减少两者之间的缝例，如可以防止基板1与凹槽内侧壁之间存在缝隙，从而能够防止上述焊接过程中的焊料渗入该缝隙。
本公开实施例提供的光源结构可以应用于各种电子装置，例如照明装置，包括生活照明装置或装饰性照明装置等、或者显示装置等，例如作为显示装置的背光源。
本公开至少一实施例还提供一种电子装置，该电子装置包括本公开实施例提供的任意一种光源结构。
该电子装置例如为照明装置，该照明装置包括上述任意一种光源结构，该照明装置可以发出单色光，例如白光、红光、绿光或蓝光等，也可以发出彩色光，例如通过红绿蓝(RGB)配色方案得到不同颜色的光。该照明装置例如可以为照明灯、展示板、广告牌等。
例如，该电子装置也可以为显示装置。图4为本公开一实施例提供的一种显示装置示意图。如图4所示，例如，光源结构10可以配置为显示装置 100的背光源，例如作为侧入式背光源，设置在显示面板12的一侧。光源结构10配置为其发出的光能够入射至显示面板12。当然，该光源结构10也可以作为直下式背光源。
例如，显示装置100还可以包括导光结构11，配置为能够使光源结构10发出的光通过导光板更好的入射至显示面板，有利于提高光的利用率。
例如，显示装置100还可以包括反射结构13，配置为能够将光源结构10发出的一部分光或/和经过导光结构11出射的一部分光经反射结构20反射后改变出射方向，从而能够使更多的光线入射至显示面板12，有利于提高光的利用率。
例如，显示装置100还可以包括封框胶14，其设置于显示面板12、光源结构10和反光结构13的外围，用于粘结固定及保护显示装置100的各个部件。
例如，本公开实施例提供的显示装置可以是液晶显示装置或其他需要背光源的显示装置。
需要说明的是，图4只示出了显示装置100的与光源结构直接相关的部件，对于其他的结构，本领域技术人员可参照常规技术。图4中的各个结构只是示范性的，显示装置100的各部件的形状和相对位置不限于是图中所示的情况。
本公开至少一实施例还提供一种光源结构制作方法，该方法包括提供印刷电路板和发光单元，印刷电路板具有第一表面，发光单元包括基板和至少一个设置在所述基板上的发光元件；该方法还包括：在印刷电路板的第一表面的与基板重叠的位置设置粘结层；将发光单元通过基板设置于印刷电路板上，使粘结层将基板与印刷电路板粘结；以及将发光单元与印刷电路板电连接。
示范性地，图5A-5F为本公开一实施例提供的一种光源结构制作方法示意图，图6A-6B为本公开一实施例提供的另一种光源结构制作方法示意图。
示范性地，如图5A所示，提供印刷电路板4和发光单元15。该印刷电路板4具有第一表面401，可以是金属基电路板(例如铝基板、铜基板、铁基板等)、陶瓷电路板或柔性电路板(例如以聚酰亚胺或聚酯薄膜等为基材) 等。发光单元15包括基板1和至少一个设置在基板1上的发光元件2，发光元件2与基板1电连接。发光元件2可以为发光二极管器件，例如，在图5A所示的实施例中，发光元件2为发光二极管芯片，对应的发光单元15可以为发光二极管封装结构。发光单元15还包括覆盖发光二极管芯片和基板1的荧光层3，可使得发光二极管芯片发出的光为所需要的光。基板1上还设置有电极引脚5，以用于与印刷电路板4电连接。印刷电路板的第一表面401设置有接触点，用于在后续工序中与发光单元15中的电极引脚5进行焊接。
光源结构制作方法还包括在印刷电路板的第一表面401的要与基板1重叠的位置设置粘结层。例如，如图5B所示，可以在印刷电路板的第一表面401上要与基板1重叠的位置设置凹槽9。例如，可以采用光刻工艺或曝光-显影工艺形成，本领域技术人员可以根据印刷电路板4的材质进行选择。
如图5C所示，光源结构制作方法还包括将粘结层8设置于凹槽9中，以用于后续粘结基板1和印刷电路板4，并且，使粘结层8的朝向基板1的表面与印刷电路板的第一表面401基本齐平。借此，能够防止后续设置基板1后基板1被粘结层8垫高，从而减小粘结层8对光源结构10的厚度的影响，有利于得到轻薄型光源结构以及利用该光源结构制作轻薄型产品。粘结层8的材料请参考实施例一中所述，在此不再赘述。
如图5D所示，将发光单元15设置在印刷电路板4上，使基板1与印刷电路板4通过粘结层8粘结，即将发光单元15通过基板1设置于所述印刷电路板上。
光源结构制作方法还包括将发光单元15与印刷电路板14电连接。例如，如图5E所示，所述将15与印刷电路板14电连接可以包括将电极引脚5与接触点焊接。通过焊料6将电极引脚5可以与接触点连接，从而能够实现将两者电导通。焊料6的材料请参考实施例一中的描述。本公开实施例提供的光源制作方法中，由于通过粘结层8将基板1与印刷电路板4粘结在一起，消除或减小了两者之间的缝隙，有利于在上述焊接过程中改善或避免在焊接过程中，呈熔融状态的焊料6流入基板1和印刷电路板4之间的缝隙，从而改善或避免由此导致的光源结构在基板1和印刷电路板4之间存在焊料的位置的厚度变大，造成光源厚度不均匀的问题，有利于提高光源结构及安装该 光源结构的装置的良率。此外，在焊接过程中，通常会采用治具来减小基板1与印刷电路板4之间的缝隙，例如采用治具尽量将基板1紧压在印刷电路板的第一表面401上。同时限制基板1相对于印刷电路板4的移动，以免两者的相对位置发生变化。在本公开实施例中，由于采用了粘结层8将基板1与印刷电路板4粘结在一起，会使两者的相对位置固定，还可以降低对治具的要求。
例如，如图5F所示，光源结构制作方法还包括在印刷电路板的第一表面401上设置粘结胶7。粘结胶7围绕发光元件2设置，可以部分围绕，也可以封闭式围绕。粘结胶7覆盖至少部分印刷电路板4，例如，覆盖印刷电路板4的靠近边缘的位置。用于将印刷电路板4与需要安装该光源结构的装置相粘结，例如照明装置、显示装置等。
图6A-6B所示的是本公开一实施例提供的另一种光源结构制作方法，该方法包括提供印刷电路板4和发光单元15，这一工序与图5A所示的相同，请参考上述描述。该方法与图5A-5F所示的实施例的区别在于，如图6A所示，可以将粘结层8直接设置在印刷电路板4上。如图6B所示，将发光单元15设置在印刷电路板4上，使基板1与印刷电路板4通过粘结层8粘结。其他工序与图5A-5F所示的实施例中的相同，请参考上述描述。采用这种方法也能够获得与图5A-5F所示的实施例相同或相近的技术效果。
利用本方法制作的光源结构可以应用于各种电子装置，例如照明装置，包括生活照明装置或装饰性照明装置等；或者可以应用于显示装置等，例如作为显示装置的背光源。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。

Claims (16)

  1. 一种光源结构，包括：
    发光单元，包括基板和至少一个在所述基板上的发光元件；
    印刷电路板，具有第一表面，其中，所述发光单元通过所述基板设置在所述印刷电路板的第一表面上；
    粘结层，设置在所述基板与所述印刷电路板的第一表面之间，粘结所述基板和所述印刷电路板。
  2. 根据权利要求1所述的光源结构，其中，在所述印刷电路板上与所述基板重叠的区域设置有至少一个凹槽，所述粘结层设置于所述至少一个凹槽内。
  3. 根据权利要求1或2所述的光源结构，其中，所述粘结层的朝向所述基板的表面与所述印刷电路板的第一表面基本齐平。
  4. 根据权利要求1-3任一所述的光源结构，其中，所述粘结层为双面胶。
  5. 根据权利要求1-4任一所述的光源结构，其中，所述基板上设置有电极引脚，所述印刷电路板上设置有接触点，所述电极引脚与所述接触点电连接。
  6. 根据权利要求5所述的光源结构，其中，所述电极引脚与所述接触点焊接。
  7. 根据权利要求1-6任一所述的光源结构，其中，所述印刷电路板为柔性电路板。
  8. 根据权利要求1-7任一所述的光源结构，其中，所述发光元件为发光二极管器件。
  9. 根据权利要求1-8任一所述的光源结构，其中，所述光源结构的平面形状为长条状或面状。
  10. 根据权利要求8所述的光源结构，其中，所述发光二极管器件为倒装芯片，且配置为所述发光二极管器件的电极与所述基板直接电连接。
  11. 根据权利要求8所述的光源结构，其中，所述发光单元还包括覆盖所述发光二极管器件和所述基板的荧光层。
  12. 一种电子装置，包括权利要求1-11任一所述的光源结构。
  13. 根据权利要求12所述的电子装置，其中，所述电子装置为显示装置，所述光源结构配置为所述显示装置的背光源。
  14. 一种光源结构制作方法，包括：
    提供印刷电路板和发光单元，其中，所述印刷电路板具有第一表面，所述发光单元包括基板和至少一个设置在所述基板上的发光元件；
    在所述印刷电路板的第一表面的与所述基板重叠的位置设置粘结层；
    将所述发光单元通过所述基板设置于所述印刷电路板上，使所述粘结层将所述基板与所述印刷电路板粘结；以及
    将所述发光单元与所述印刷电路板电连接。
  15. 根据权利要求14所述的光源结构制作方法，还包括：
    在所述印刷电路板的与所述基板重叠的位置设置凹槽；以及
    将所述粘结层设置于所述凹槽中，并使所述粘结层的朝向所述基板的表面与所述印刷电路板的第一表面基本齐平。
  16. 根据权利要求14或15所述的光源结构制作方法，其中，所述基板包括电极引脚，所述印刷电路板的第一表面设置有接触点；
    所述将所述发光单元与所述印刷电路板电连接包括将所述电极引脚与所述接触点焊接。
PCT/CN2018/086430 2017-08-31 2018-05-11 光源结构、电子装置及光源结构制作方法 WO2019041883A1 (zh)

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