WO2019041864A1 - 薄膜封装结构及薄膜封装方法和显示面板 - Google Patents
薄膜封装结构及薄膜封装方法和显示面板 Download PDFInfo
- Publication number
- WO2019041864A1 WO2019041864A1 PCT/CN2018/085052 CN2018085052W WO2019041864A1 WO 2019041864 A1 WO2019041864 A1 WO 2019041864A1 CN 2018085052 W CN2018085052 W CN 2018085052W WO 2019041864 A1 WO2019041864 A1 WO 2019041864A1
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- Prior art keywords
- thin film
- groove structure
- display area
- structures
- encapsulation
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Links
- 239000010409 thin film Substances 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000005538 encapsulation Methods 0.000 claims description 33
- 239000003292 glue Substances 0.000 claims description 30
- 239000010408 film Substances 0.000 claims description 23
- 239000010410 layer Substances 0.000 abstract description 60
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 19
- 229910052760 oxygen Inorganic materials 0.000 abstract description 19
- 239000001301 oxygen Substances 0.000 abstract description 19
- 238000005452 bending Methods 0.000 abstract description 9
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000012790 adhesive layer Substances 0.000 abstract 4
- 229920006280 packaging film Polymers 0.000 abstract 2
- 239000012785 packaging film Substances 0.000 abstract 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 230000000694 effects Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000012044 organic layer Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
- H01L25/0655—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
Definitions
- the groove structure is a discontinuous groove structure that is disposed within the dam structure.
- FIG. 5 is a schematic top plan view of an organic rubber layer according to another embodiment of the present invention.
- FIG. 8 is a schematic top plan view of an organic rubber layer according to another embodiment of the present invention.
- FIG. 1 is a schematic top plan view of a display panel provided by the present invention.
- Figure 2 is a schematic cross-sectional view taken along line II-II of Figure 1.
- the present invention further provides a display panel 10 including a base substrate 12 including a display area 101 and a non-display area 102 surrounding the display area 101.
- a light emitting device 18 is disposed on the display region 101 of the base substrate 12, and the package film layer 16 is covered on the base substrate 12.
- the non-display region 102 and the light emitting device 18 are covered with the encapsulation film layer 16.
- the encapsulation film layer 16 includes an alternating stack of an inorganic layer and an organic layer.
- the thin film encapsulation structure includes a base substrate 12, an organic glue layer 14 and an encapsulation film layer 16, and an organic glue layer 14 is disposed on the base substrate 12, and the encapsulation film layer 16 covers the base substrate 12 and the organic glue layer 14.
- the organic glue layer 14 is disposed in the non-display area 102 and is formed with a groove structure 142 and a bank structure 144 defined by the groove structure 142.
- the groove structure 142 and the bank structure 144 are disposed around the display area 101, and the groove structure 142 is disposed.
- At least one of the dam structure 144 and the dam structure 144 is a meandering extension structure or a grid-like structure. Wherein, the groove structure 142 and the dam structure 144 are disposed in a "mouth" shape around the display area 101.
- the groove structure 142 is formed in the non-display area 102 of the base substrate 12 by the organic glue layer 14 to make the path of water and oxygen diffusion more tortuous, that is, the water oxygen permeation path is extended, and the packaging effect of the display panel 10 is improved.
- the meandering groove structure 142, or the discretely distributed groove structure 142 the bending stress of the edge region of the display panel 10 during bending is reduced or dispersed, thereby effectively improving the bending of the edge region of the display panel 10. performance.
- the groove structure 142 and the dam structure 144 are arranged in a nested manner to occupy a smaller space around the display area 101, which can improve the non-display area 102 formed by blocking a plurality of sets of retaining wall structures around the screen body to block water oxygen.
- the width is limited to achieve a narrow bezel design.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
Claims (10)
- 一种薄膜封装结构,其特征在于,所述薄膜封装结构包括衬底基板(12)、有机胶层(14)和封装膜层(16),所述有机胶层(14)设置在所述衬底基板(12)上,所述封装膜层(16)覆盖所述有机胶层(14),所述有机胶层(14)被制作形成有凹槽结构(142)。
- 根据权利要求1所述的薄膜封装结构,其特征在于,所述凹槽结构(142)为蜿蜒曲折延伸的不交叉凹槽结构。
- 根据权利要求1所述的薄膜封装结构,其特征在于,所述凹槽结构(142)为网格状的交叉凹槽结构。
- 根据权利要求1-3中任一项所述的薄膜封装结构,其特征在于,所述衬底基板(12)包括显示区域(101)和环绕所述显示区域(101)的非显示区域(102),所述有机胶层(14)还被制作形成有堤坝结构(144),所述堤坝结构(144)围绕所述显示区域(102)设置。
- 根据权利要求4所述的薄膜封装结构,其特征在于,所述堤坝结构(144)和所述凹槽结构(142)并行设置。
- 根据权利要求5所述的薄膜封装结构,其特征在于,所述凹槽结构(142)设置在所述堤坝结构(144)内。
- 根据权利要求6所述的薄膜封装结构,其特征在于,所述凹槽结构(142)为连续的凹槽结构。
- 根据权利要求6所述的薄膜封装结构,其特征在于,所述凹槽结构(142)为区隔设置在所述堤坝结构(144)内的非连续凹槽结构。
- 一种显示面板,其特征在于,采用权利要求1-8中任一项所述的薄膜封装结构。
- 一种薄膜封装方法,用于封装形成一显示面板(10),所述显示面板(10) 包括显示区域(101)和环绕所述显示区域(101)的非显示区域(102),所述薄膜封装方法包括步骤:提供一衬底基板(12);在所述衬底基板(12)上制作形成有机胶层(14),其中所述有机胶层(14)在所述非显示区域(102)被制作形成有凹槽结构(142)和由所述凹槽结构(142)限定形成的堤坝结构(144),所述凹槽结构(142)和所述堤坝结构(144)环绕所述显示区域(101)设置,所述凹槽结构(142)和所述堤坝结构(144)的至少其中之一为蜿蜒曲折延伸结构或者为网格状结构;在所述衬底基板(12)上覆盖封装膜层(16),在所述非显示区域(102)的所述封装膜层(16)填入所述凹槽结构(142)中。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2019537151A JP6865834B2 (ja) | 2017-08-31 | 2018-04-28 | 薄膜パッケージング構造、薄膜パッケージ方法及び表示パネル |
US16/324,652 US11374201B2 (en) | 2017-08-31 | 2018-04-28 | Thin film package structure, thin film package method, and display panel |
KR1020197019719A KR102245486B1 (ko) | 2017-08-31 | 2018-04-28 | 박막 패키징 구조체, 박막 패키징 방법, 및 디스플레이 패널 |
EP18850337.9A EP3553825A4 (en) | 2017-08-31 | 2018-04-28 | THIN-LAYER PACKING STRUCTURE, THIN-LAYER PACKING METHOD AND DISPLAY PANEL |
Applications Claiming Priority (2)
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CN201710772356.0A CN107689425A (zh) | 2017-08-31 | 2017-08-31 | 薄膜封装结构及薄膜封装方法和显示面板 |
CN201710772356.0 | 2017-08-31 |
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WO2019041864A1 true WO2019041864A1 (zh) | 2019-03-07 |
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PCT/CN2018/085052 WO2019041864A1 (zh) | 2017-08-31 | 2018-04-28 | 薄膜封装结构及薄膜封装方法和显示面板 |
Country Status (7)
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US (1) | US11374201B2 (zh) |
EP (1) | EP3553825A4 (zh) |
JP (1) | JP6865834B2 (zh) |
KR (1) | KR102245486B1 (zh) |
CN (1) | CN107689425A (zh) |
TW (1) | TWI725307B (zh) |
WO (1) | WO2019041864A1 (zh) |
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TWI725307B (zh) | 2021-04-21 |
JP6865834B2 (ja) | 2021-04-28 |
US11374201B2 (en) | 2022-06-28 |
EP3553825A1 (en) | 2019-10-16 |
JP2020505720A (ja) | 2020-02-20 |
CN107689425A (zh) | 2018-02-13 |
TW201842666A (zh) | 2018-12-01 |
EP3553825A4 (en) | 2020-02-19 |
KR20190089067A (ko) | 2019-07-29 |
KR102245486B1 (ko) | 2021-04-29 |
US20210336216A1 (en) | 2021-10-28 |
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