WO2019039210A1 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
WO2019039210A1
WO2019039210A1 PCT/JP2018/028623 JP2018028623W WO2019039210A1 WO 2019039210 A1 WO2019039210 A1 WO 2019039210A1 JP 2018028623 W JP2018028623 W JP 2018028623W WO 2019039210 A1 WO2019039210 A1 WO 2019039210A1
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WO
WIPO (PCT)
Prior art keywords
resin layer
insulating resin
conductive particles
conductive film
anisotropic conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/JP2018/028623
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
太一郎 梶谷
怜司 塚尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Dexerials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to CN201880054523.0A priority Critical patent/CN110945720B/zh
Priority to US16/640,461 priority patent/US20200215785A1/en
Priority to KR1020207004220A priority patent/KR20200022510A/ko
Priority to KR1020227044578A priority patent/KR102675438B1/ko
Publication of WO2019039210A1 publication Critical patent/WO2019039210A1/ja
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
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    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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    • B32B7/04—Interconnection of layers
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
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    • H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
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    • H—ELECTRICITY
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    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to an anisotropic conductive film.
  • An anisotropic conductive film in which conductive particles are dispersed in an insulating resin layer is widely used for mounting electronic components such as IC chips.
  • conductive particles are dispersed in the insulating resin layer with high density so as to correspond to high mounting density.
  • increasing the number density of the conductive particles is a factor causing the short circuit.
  • a photopolymerizable resin layer and an insulating adhesive layer in which conductive particles are embedded in a single layer in order to reduce short circuiting and to improve workability when temporarily bonding the anisotropic conductive film to the substrate The anisotropic conductive film which laminated
  • temporary pressure bonding is performed in a state where the photopolymerizable resin layer is not polymerized and has tackiness, and then the photopolymerizable resin layer is photopolymerized to fix the conductive particles, Thereafter, the substrate and the electronic component are fully crimped.
  • the anisotropic conductive film of the 3 layer structure by which the 1st connection layer was pinched by the 2nd connection layer and 3rd connection layer which mainly consist of insulating resin have also been proposed (Patent Documents 2 and 3).
  • the anisotropic conductive film of Patent Document 2 has a structure in which the first connection layer is a single conductive particle arrayed in the planar direction of the second connection layer side of the insulating resin layer, The thickness of the insulating resin layer in the central region between adjacent conductive particles is smaller than the thickness of the insulating resin layer in the vicinity of the conductive particles.
  • the anisotropic conductive film of Patent Document 3 has a structure in which the boundary between the first connection layer and the third connection layer is undulated, and the first connection layer is on the third connection layer side of the insulating resin layer.
  • the conductive particles are arranged in a single layer in the plane direction of the above, and the thickness of the insulating resin layer in the central region between adjacent conductive particles is smaller than the thickness of the insulating resin in the vicinity of the conductive particles.
  • the conductive particles easily move at the time of temporary compression bonding of the anisotropic conductive connection, and the precise arrangement of the conductive particles before the anisotropic conductive connection is after the anisotropic conductive connection. There is a problem that it can not be maintained or the distance between the conductive particles can not be sufficiently separated.
  • the photopolymerizable resin layer is photopolymerized to bond the photopolymerized resin layer in which the conductive particles are embedded with the electronic component, the electronic component can be obtained.
  • conductive particles are dispersed in a thermally polymerizable insulating resin layer that has a high viscosity at the heating temperature at the time of anisotropic conductive connection, and conductive particles at the time of anisotropic conductive connection It is conceivable to improve the workability when sticking the anisotropic conductive film to the electronic component while suppressing the flowability. However, even if conductive particles are accurately disposed on such an insulating resin layer, if the resin layer flows at the time of anisotropic conductive connection, the conductive particles will also flow simultaneously, so that the trapping property of the conductive particles can be improved.
  • the anisotropic conductive film of the 3 layer structure of patent document 2 3 layer structure, From the viewpoint, it is required to reduce the number of manufacturing processes. Further, in the vicinity of the conductive particles on one side of the first connection layer, the whole or a part of the first connection layer bulges larger than the outer shape of the conductive particles (the insulating resin layer itself is not flat), Since the conductive particles are held at the same time, there is a concern that there are many restrictions on design in order to make the holding and immobility of the conductive particles compatible with easy holding by the terminals.
  • the light which holds the conductive particles is not necessary to have a three-layer structure.
  • An object of the present invention is to suppress unnecessary movement (flow) of conductive particles due to the flow of the insulating resin layer, to improve the capture of the conductive particles, and to reduce short circuit.
  • the inventor of the present invention provides a conductive particle dispersion layer in which conductive particles are dispersed in a photopolymerizable insulating resin layer on an anisotropic conductive film, the surface shape of the photopolymerizable insulating resin layer in the vicinity of the conductive particles.
  • the following findings (i) and (ii) were obtained, and the following finding (iii) was obtained regarding the timing of photopolymerization of the photopolymerizable insulating resin layer.
  • the surface of the photopolymerizable insulating resin layer itself on the side in which the conductive particles are embedded is flat, while (i) the conductive particles are When exposed from the photopolymerizable insulating resin layer, the surface of the photopolymerizable insulating resin layer around the conductive particles is a photopolymerizable insulating resin layer in the center between adjacent conductive particles.
  • such a slope or unevenness in the photopolymerizable insulating resin layer is the insulating resin when the conductive particles are pushed in the case of forming the conductive particle dispersion layer by pushing the conductive particles into the insulating resin layer. It has been found that the layer can be formed by adjusting the viscosity, pressing speed, temperature and the like of the layer.
  • the anisotropic conductive film is disposed on one of the electronic parts. After that, before the other electronic component is placed on it, the insulating resin of the photoconductive insulating resin layer of the anisotropic conductive film is irradiated with light to make the insulating resin at the time of anisotropic conductive connection. It has been found that it is possible to suppress an excessive decrease in the minimum melt viscosity of the above to prevent unnecessary flow of the conductive particles, and thereby to realize good conduction characteristics in the connection structure.
  • the present invention is an anisotropic conductive film having a conductive particle dispersed layer in which conductive particles are dispersed in an insulating resin layer,
  • the insulating resin layer is a layer of a photopolymerizable resin composition,
  • the surface of the insulating resin layer in the vicinity of the conductive particles provides an anisotropic conductive film having a slope or an undulation with respect to the tangent of the insulating resin layer in the central portion between adjacent conductive particles.
  • the surface of the insulating resin layer around the conductive particles is chipped in the tangent plane, and in the undulation, the insulating resin layer directly on the conductive particles It is preferable that the amount of resin be smaller than when the surface of the insulating resin layer immediately above the conductive particles is in the contact plane. Alternatively, it is preferable that a ratio (Lb / D) of the distance Lb of the deepest part of the conductive particle from the tangential plane to the diameter D of the conductive particle is 30% or more and 105% or less.
  • the photopolymerizable resin composition may be photo cationic polymerizable, photo anionic polymerizable or photo radical polymerizable, but the film-forming polymer, the photo cationic polymerizable compound, the photo cationic polymerization initiator, and the heat. It is preferable that it is a photocationic-polymerizable resin composition containing a cationic polymerization initiator.
  • a preferable photocationic polymerizable compound is at least one selected from an epoxy compound and an oxetane compound
  • a preferable photocationic polymerization initiator is an aromatic onium tetrakis (pentafluorophenyl) borate.
  • the photopolymerizable resin composition is a photoradically polymerizable resin composition
  • it contains a film-forming polymer, a photoradically polymerizable compound, a photoradical polymerization initiator, and a thermal radical polymerization initiator. Is preferred.
  • a slope or unevenness may be formed on the surface of the insulating resin layer around the conductive particles exposed from the insulating resin layer, and exposed from the insulating resin layer Alternatively, slopes or undulations may be formed on the surface of the insulating resin layer immediately above the conductive particles embedded in the insulating resin layer.
  • the ratio (La / D) of the layer thickness La of the insulating resin layer to the conductive particle diameter D is preferably 0.6 to 10, and it is preferable that the conductive particles be disposed in non-contact with each other. Furthermore, it is preferable that the closest inter-particle distance of the conductive particles be 0.5 times to 4 times the diameter of the conductive particles.
  • the second insulating resin layer may be laminated on the surface opposite to the surface on which the slope or unevenness of the insulating resin layer is formed;
  • the second insulating resin layer may be laminated on the surface on which the slope or unevenness of the conductive resin layer is formed.
  • the minimum melt viscosity of the second insulating resin layer is preferably lower than the minimum melt viscosity of the insulating resin layer.
  • the CV value of the particle diameter of the conductive particles is preferably 20% or less.
  • the anisotropic conductive film of the present invention can be produced by a production method comprising the step of forming a conductive particle dispersion layer in which conductive particles are dispersed in an insulating resin layer.
  • the step of forming the conductive particle dispersion layer is a step of holding the conductive particles in the state of being dispersed on the surface of the insulating resin layer made of the photopolymerizable resin composition, and the conductive particles held on the surface of the insulating resin layer
  • the surface of the insulating resin layer in the vicinity of the conductive particles is an insulating resin in a central portion between adjacent conductive particles.
  • the viscosity, pressing speed or temperature of the insulating resin layer when the conductive particles are pushed in is adjusted so as to have a slope or an undulation with respect to the tangent of the layer. More specifically, in the step of pushing the conductive particles into the insulating resin layer, preferably, in the slope, the surface of the insulating resin layer around the conductive particles is chipped with respect to the tangent plane, and in the relief, The amount of resin in the insulating resin layer immediately above the conductive particles is made smaller than when the surface of the insulating resin layer directly above the conductive particles is in the contact plane.
  • the ratio (Lb / D) of the distance Lb of the deepest part of the conductive particle from the tangential plane to the diameter D of the conductive particle is set to 30% to 105%.
  • the conductive particles are kept to a minimum, and the exposure of the conductive particles from the resin layer is large, so that low temperature and low pressure mounting becomes easier, 60% If the content is 105% or less, the conductive particles are more easily held, and the state of the conductive particles captured before and after the connection is easily maintained.
  • the CV value of the particle diameter of the photopolymerizable resin composition and the conductive particles is as described above.
  • the conductive particles are held in a predetermined arrangement on the surface of the photopolymerizable insulating resin layer.
  • the conductive particles are preferably pressed into the photopolymerizable insulating resin layer with a flat plate or a roller.
  • the transfer type is filled with the conductive particles, and the conductive particles are transferred to the photopolymerizable insulating resin layer, whereby the conductive resin is conductive on the surface of the insulating resin layer. It is preferred to hold the particles in a predetermined arrangement.
  • the present invention also provides a connection structure in which the first electronic component and the second electronic component are anisotropically conductively connected by the above-described anisotropic conductive film.
  • the anisotropic conductive film is disposed to the first electronic component from the side of the conductive particle dispersion layer on which the slope or unevenness is formed or not formed.
  • the second electronic component is disposed on the particle dispersion layer, and heat is applied to the first electronic component and the second electronic component by conducting heat and pressure on the second electronic component with the thermocompression bonding tool.
  • the anisotropic conductive film is arranged from the side of the conductive particle dispersion layer on which the slope or unevenness is formed, and in the light irradiation step, the anisotropic conductive film for the first electronic component. It is preferable to perform light irradiation from the side.
  • the anisotropic conductive film of the present invention has a conductive particle dispersed layer in which conductive particles are dispersed in a photopolymerizable insulating resin layer.
  • the surface of the insulating resin layer in the vicinity of the conductive particles is inclined with respect to the tangent of the insulating resin layer in the central portion between adjacent conductive particles, or a relief is formed.
  • the insulating resin layer around the exposed conductive particles is inclined, and the conductive particles are photopolymerizable insulating resin
  • the insulating resin layer immediately above the conductive particles may be uneven or the conductive particles may be in contact with the insulating resin layer at one point.
  • the resin is formed along the outer periphery of the conductive particles depending on the degree of embedding in the vicinity of the conductive particles. (See, for example, FIGS. 4 and 6) or flat as the tendency of the entire insulating resin, but in the vicinity of the conductive particles, the insulating resin is drawn to the embedded of the conductive particles and is internally There may be intruding cases (see, for example, FIG. 1B, FIG. 2). Intrusion into the interior also includes the appearance of a cliff due to the embedding of the conductive particles in the resin (FIG. 3).
  • the slope is a slope formed by the insulating resin being drawn into and embedded in the conductive particles, and the undulation means such a slope followed by the conductive particle. And the insulating resin layer deposited on it (the slope may disappear due to deposition).
  • the conductive particles are held in a state in which the conductive particles are partially or entirely embedded in the insulating resin by forming the slope or unevenness in the insulating resin, and the influence of the flow of the resin at the time of connection, etc. Can be minimized, and the capture of conductive particles at the time of connection will be improved.
  • the amount of insulating resin in the vicinity of the conductive particles is reduced at least in part of the film surface to be connected to the terminal (the amount of insulating resin in the thickness direction of the conductive particles decreases).
  • the terminal and the conductive particle can be easily in direct contact with each other. That is, the resin which interferes with the conductive particles with respect to the pressing at the time of connection is absent or reduced, and the resin is configured with the minimum amount of resin.
  • the insulating resin has a surface drop generally along the outline of the conductive particles, it will not cause excessive bumps.
  • the resin in this case can hold conductive particles, it tends to have a relatively high viscosity, and the amount of resin on the film surface to be the connection surface with the terminal, particularly directly on the conductive particles, is small. It becomes preferable.
  • the absence of a relatively high viscosity resin holding the conductive particles along the contour of the conductive particles is also preferable for the same reason.
  • the present invention follows these configurations.
  • the effect of pressing can be easily developed, and the effect of facilitating the quality judgment in manufacturing the anisotropic conductive film can also be expected by observing the appearance. .
  • direct contact between the terminals and the conductive particles is expected to be effective in improving the conduction characteristics and in uniformity of pressing.
  • the retention of the conductive particles by the insulating resin having a relatively high viscosity and the absence, reduction or deformation of the resin immediately above the film surface direction of the conductive particles are compatible with each other, whereby the conductive particles are uniformly captured and pressed.
  • the conditions for achieving good conductivity and conduction characteristics are established.
  • the relatively high viscosity resin itself is made thin, it is easy to take a margin for the heating and pressurizing conditions of the connection tool. In this case, it is desirable that the variation in the diameter of the conductive particles be small in order to exert more effects. This is because the degree of inclination and unevenness varies from one conductive particle to another as the variation of the conductive particle diameter increases.
  • the conductive particles When the insulating resin layer around the conductive particles exposed from the insulating resin layer has a slope, the conductive particles may be held between the terminals at the time of anisotropic conductive connection at the slope portion, or may be flattened. Insulating resin is less likely to be an obstacle to trying. In addition, since the amount of resin around the conductive particles is reduced due to the inclination, the resin flow leading to unnecessary flow of the conductive particles is reduced. Thus, the capture of the conductive particles at the terminals is improved, and the conduction reliability is improved.
  • the trapping property of the conductive particles is improved, and since the conductive particles on the terminals are difficult to flow, the arrangement of the conductive particles can be precisely controlled. Therefore, it can be used, for example, for connection of fine pitch electronic components having a terminal width of 6 ⁇ m to 50 ⁇ m and an inter-terminal space of 6 ⁇ m to 50 ⁇ m.
  • the effective connection terminal width (of the pair of terminals facing at the time of connection, the width of the overlapping portion in plan view Is 3 ⁇ m or more and the shortest inter-terminal distance is 3 ⁇ m or more, electronic components can be connected without causing a short circuit.
  • the arrangement of the conductive particles can be precisely controlled, when connecting electronic components of normal pitch, various electronic properties such as dispersion (independency of individual conductive particles), regularity of arrangement, interparticle distance, etc. can be obtained. It becomes possible to correspond to the layout of the terminal of the part.
  • the insulating resin layer immediately above the conductive particles embedded in the insulating resin layer has an unevenness, the position of the conductive particles can be clearly seen by the appearance observation of the anisotropic conductive film, so product inspection is easy. Also, it becomes easy to confirm which film surface of the anisotropic conductive film is to be bonded to the substrate at the time of anisotropic conductive connection.
  • anisotropic conductive film of the present invention it is not always necessary to photopolymerize the photopolymerizable insulating resin layer for fixing the arrangement of the conductive particles, so anisotropic conductive connection Sometimes the insulating resin layer may have tackiness. For this reason, the workability at the time of temporarily pressure-bonding the anisotropic conductive film and the substrate is improved, and the workability is also improved at the time of pressure-bonding the electronic component after the temporary pressure-bonding.
  • the insulating resin layer when the conductive particles are embedded in the insulating resin layer so that the above-mentioned inclination or unevenness is formed in the insulating resin layer. Adjust the viscosity, pressing speed, temperature, etc. Therefore, the anisotropic conductive film of this invention which exhibits the above-mentioned effect can be manufactured easily.
  • the insulating resin layer which comprises the anisotropic conductive film of this invention is comprised from the photopolymerizable resin composition. For this reason, after arranging an anisotropic conductive film in one electronic component, when producing an attachment electrically-conductively connecting electronic components using the anisotropic conductive film of this invention and manufacturing a connection structure, By irradiating the photopolymerizable insulating resin layer of the anisotropic conductive film with light before placing the other electronic component thereon, the minimum melt viscosity of the insulating resin at the time of anisotropic conductive connection Can be suppressed to prevent unnecessary flow of the conductive particles, whereby good connection characteristics can be realized in the connection structure.
  • FIG. 1A is a plan view showing the arrangement of conductive particles in the anisotropic conductive film 10A of the example.
  • FIG. 1B is a cross-sectional view of the anisotropic conductive film 10A of the example.
  • FIG. 2 is a cross-sectional view of the anisotropic conductive film 10B of the example.
  • FIG. 3 is a cross-sectional view of the anisotropic conductive film 10C in a state in which it can be said that it is in the middle between “tilt” and “relief” formed in the insulating resin layer.
  • FIG. 4 is a cross-sectional view of the anisotropic conductive film 10D of the example.
  • FIG. 5 is a cross-sectional view of the anisotropic conductive film 10E of the example.
  • FIG. 6 is a cross-sectional view of the anisotropic conductive film 10F of the example.
  • FIG. 7 is a cross-sectional view of the anisotropic conductive film 10G of the example.
  • FIG. 8 is a cross-sectional view of the anisotropic conductive film 10X of the comparative example.
  • FIG. 9 is a cross-sectional view of the anisotropic conductive film 10H of the example.
  • FIG. 10 is a cross-sectional view of the anisotropic conductive film 10I of the example.
  • FIG. 1A is a plan view for explaining the particle arrangement of the anisotropic conductive film 10A according to an embodiment of the present invention
  • FIG. 1B is a cross-sectional view thereof taken along the line XX.
  • the anisotropic conductive film 10A may be, for example, in the form of a long film having a length of 5 m or more, or may be a wound body wound around a winding core.
  • the anisotropic conductive film 10A is composed of the conductive particle dispersion layer 3.
  • the conductive particles 1 are regularly dispersed in a state in which the conductive particles 1 are exposed on one side of the photopolymerizable insulating resin layer 2. ing.
  • the conductive particles 1 are not in contact with each other in plan view of the film, and the conductive particles 1 are regularly dispersed in the film thickness direction without overlapping with each other, and the single layer has uniform positions in the film thickness direction of the conductive particles 1
  • a slope 2b is formed with respect to the tangent plane 2p of the insulating resin layer 2 at the center between adjacent conductive particles.
  • unevenness 2c may be formed on the surface of the insulating resin layer immediately above the conductive particles 1 embedded in the insulating resin layer 2 (FIG. 4). , Figure 6).
  • “inclination” means that the flatness of the surface of the insulating resin layer in the vicinity of the conductive particles 1 is impaired, a part of the resin layer is chipped with respect to the tangent plane 2p, and the resin amount is reduced Mean that In other words, in the slope, the surface of the insulating resin layer around the conductive particles is missing with respect to the tangent plane.
  • “relief” means that the surface of the insulating resin layer immediately above the conductive particles has a waviness, and the amount of resin is reduced due to the presence of a portion having a difference in elevation like the waviness.
  • the resin amount of the insulating resin layer immediately above the conductive particles is smaller than when the surface of the insulating resin layer directly above the conductive particles is in the tangential plane.
  • the dispersed state of the conductive particles in the present invention includes the state in which the conductive particles 1 are randomly dispersed and the state in which the conductive particles 1 are dispersed in a regular arrangement.
  • the conductive particles are preferably arranged in non-contact with each other, and the number ratio is preferably 95% or more, more preferably 98% or more, and still more preferably 99.5% or more.
  • the number ratio in the regular arrangement in the dispersed state, two or more conductive particles (in other words, aggregated conductive particles) in contact are counted as one.
  • the positions in the film thickness direction are aligned.
  • alignment of the conductive particles 1 in the film thickness direction is not limited to alignment to a single depth in the film thickness direction, and the interface between the front and back of the insulating resin layer 2 or the vicinity thereof In each of the embodiments, the conductive particles are present.
  • the electrically-conductive particle 1 is regularly arranged by planar view of a film from the point of making capture
  • the arrangement aspect is not particularly limited because it depends on the terminal and bump layout.
  • FIG. 1A in plan view of the film it may be a square lattice arrangement.
  • a lattice arrangement such as a rectangular lattice, an orthorhombic lattice, a hexagonal lattice, or a triangular lattice can be mentioned. Plural grids of different shapes may be combined.
  • the regular arrangement is not limited to the lattice arrangement as described above.
  • particle rows in which conductive particles are linearly arranged at predetermined intervals may be arranged at predetermined intervals.
  • the conductive particles 1 By setting the conductive particles 1 in non-contact with each other and arranging them regularly in a lattice or the like, it is possible to uniformly apply pressure to each conductive particle 1 at the time of anisotropic conductive connection, and to reduce variations in conduction resistance.
  • the regular arrangement can be confirmed, for example, by observing whether or not predetermined particle arrangements are repeated in the longitudinal direction of the film.
  • the conductive particles should be regularly arranged and dispersed randomly if there are conductive particles to the extent that they do not interfere with conduction. It may be Also in this case, it is preferable to be independent as described above. It is because inspection and control at the time of anisotropic conductive film manufacture become easy.
  • the conductive particles are regularly arranged, if there is a lattice axis or an arrangement axis of the arrangement, it may be parallel to the longitudinal direction of the anisotropic conductive film or a direction orthogonal to the longitudinal direction, anisotropic conduction It may intersect with the longitudinal direction of the film, and can be determined according to the terminal width to be connected, the terminal pitch, the layout, and the like. For example, in the case of forming an anisotropic conductive film for fine pitch, as shown in FIG.
  • the lattice axis A of the conductive particles 1 is made oblique with respect to the longitudinal direction of the anisotropic conductive film 10A
  • the angle ⁇ between the longitudinal direction of the terminals 20 connected by the film 10A (the short direction of the film) and the grating axis A is 6 ° to 84 °, preferably 11 ° to 74 °.
  • the interparticle distance of the conductive particles 1 is appropriately determined in accordance with the size and the terminal pitch of the terminals connected by the anisotropic conductive film.
  • the distance between adjacent particles should be 0.5 times or more of the diameter D of the conductive particle in order to prevent the occurrence of shorts. Preferably, it is more preferably 0.7 times or more.
  • the distance between the closest particles is preferably 4 times or less of the diameter D of the conductive particle, and more preferably 3 times or less.
  • the area occupancy of the conductive particles is preferably 35% or less, more preferably 0.3 to 30%.
  • This area occupancy rate is [Number density of conductive particles in plan view] ⁇ [average of planar view area of one conductive particle] ⁇ 100 Calculated by
  • a rectangular area having a side of 100 ⁇ m or more is arbitrarily set at a plurality of places (preferably 5 or more, more preferably 10 or more), and the total area of the measurement areas is It is preferable to set it as 2 mm 2 or more.
  • the size and number of the individual regions may be appropriately adjusted according to the state of the number density.
  • the total area of the measurement areas may be 2 mm 2 or more, preferably 10 or more, and more preferably 20 or more, in a rectangular area having a length of 30 times the diameter D of the conductive particle as one side.
  • the number density is relatively large for fine pitch applications, observation images with a metallurgical microscope etc.
  • the “number density of conductive particles in plan view” in the above equation can be obtained by measuring the number density and averaging it.
  • the area of 100 ⁇ m ⁇ 100 ⁇ m is an area where one or more bumps are present in the connection target of the space between bumps of 50 ⁇ m or less.
  • the value of the number density is not particularly limited as long as the area occupancy is within the above range, but for practical use, the number density is preferably 150 to 70000 pcs / mm 2 , and particularly preferably for fine pitch applications. Is preferably 6000 to 42000 pcs / mm 2 , more preferably 10000 to 40000 pcs / mm 2 , still more preferably 15000 to 35000 pcs / mm 2 . In addition, the aspect whose number density is less than 150 pieces / mm 2 is not excluded.
  • the number density of the conductive particles may be determined by observation using a metallurgical microscope as described above, or may be determined by measuring an observation image with image analysis software (for example, WinROOF, Mitani Shoji Co., Ltd., etc.).
  • image analysis software for example, WinROOF, Mitani Shoji Co., Ltd., etc.
  • the observation method and the measurement method are not limited to the above.
  • the average of the planar view area of one electrically-conductive particle is calculated
  • Image analysis software may be used.
  • the observation method and the measurement method are not limited to the above.
  • the area occupancy rate is an index of the thrust required for the pressing jig in order to press (preferably thermo-press) the anisotropic conductive film onto the electronic component.
  • the distance between particles of conductive particles has been narrowed and the number density has been increased as long as short circuiting is not generated.
  • a pressing jig is required to press (preferably thermocompression) an anisotropic conductive film onto the electronic part.
  • the area occupancy as described above preferably 35% or less, more preferably 0.3 to 30%, it is possible to press the anisotropic conductive film to the thermocompression bonding of the electronic component. It is possible to keep the thrust required for the tool low.
  • the conductive particles 1 can be appropriately selected and used from conductive particles used in known anisotropic conductive films.
  • metal particles such as nickel, cobalt, silver, copper, gold and palladium, alloy particles such as solder, and metal-coated resin particles can be mentioned. Two or more types can also be used in combination. Among them, metal-coated resin particles are preferable from the viewpoint that the resin particles are repelled after being connected to easily maintain contact with the terminals, and the conduction performance is stabilized.
  • the surface of the conductive particles may be subjected to an insulation treatment that does not affect the conduction characteristics by a known technique.
  • the conductive particle diameter D is preferably 1 ⁇ m or more and 30 ⁇ m or less, more preferably 2.5 ⁇ m, in order to be able to cope with variations in wiring height, to suppress the rise in conduction resistance, and to suppress the occurrence of shorts.
  • the thickness is 9 ⁇ m or less. Depending on the connection object, those larger than 9 ⁇ m may be suitable.
  • the particle size of the conductive particles before being dispersed in the insulating resin layer can be measured by a general particle size distribution measuring apparatus, and the average particle size can also be determined using the particle size distribution measuring apparatus. It may be an image type or a laser type.
  • a wet flow type particle size and shape analyzer FPIA-3000 (Malvern, Inc.) can be mentioned.
  • the number of samples for measuring the conductive particle diameter D (the number of conductive particles) is preferably 1,000 or more.
  • the conductive particle diameter D in the anisotropic conductive film can be determined from electron microscopic observation such as SEM. In this case, it is desirable that the number of samples (the number of conductive particles) for measuring the conductive particle diameter D be 200 or more.
  • the variation of the particle diameter of the conductive particles constituting the anisotropic conductive film of the present invention is preferably a CV value (standard deviation / average) of 20% or less.
  • CV value standard deviation / average
  • after the connection it is possible to accurately evaluate the connection state by the indentation.
  • light irradiation to each electrically conductive particle is equalized, and the photopolymerization of the insulating resin layer is equalized.
  • the variation in particle diameter can be calculated by an image-type particle size analyzer or the like.
  • the diameter of the conductive particles as raw material particles of the anisotropic conductive film not disposed on the anisotropic conductive film may be determined, for example, using a wet flow particle size and shape analyzer FPIA-3000 (Malvern). Can.
  • FPIA-3000 wet flow particle size and shape analyzer
  • the number of conductive particles is preferably 1000 or more, more preferably 3000 or more, and particularly preferably 5000 or more, the variation of the conductive particles can be accurately grasped.
  • the conductive particles can be obtained from a plane image or a cross-sectional image as in the case of the sphericity.
  • the conductive particles constituting the anisotropic conductive film of the present invention are preferably substantially spherical.
  • a substantially true sphere as the conductive particles, for example, in manufacturing an anisotropic conductive film in which conductive particles are arranged using a transfer mold as described in JP-A-2014-60150, As the conductive particles roll smoothly on the mold, the conductive particles can be filled at a predetermined position on the transfer mold with high accuracy. Therefore, the conductive particles can be precisely arranged.
  • substantially true sphere means that the sphericity calculated by the following equation is 70 to 100.
  • So is the area of the circumscribed circle of the conductive particle in the planar image of the conductive particle
  • Si is the area of the inscribed circle of the conductive particle in the planar image of the conductive particle.
  • a planar image of the conductive particles is taken with a plane view and a cross section of the anisotropic conductive film, and the area of the circumscribed circle of 100 or more (preferably 200 or more) arbitrary conductive particles in each planar image. It is preferable to measure the area of the tangent circle, obtain the average value of the area of the circumscribed circle and the average value of the area of the inscribed circle, and use the above So and Si. Further, in any of the plane view and the cross section, the sphericity is preferably in the above range. The difference in sphericity of the field of view and the cross section is preferably within 20, and more preferably within 10.
  • the inspection at the time of production of the anisotropic conductive film is mainly performed in the plane view, and the detailed judgment of quality after the anisotropic conductive connection is performed in both the plane view and the cross section, so the difference in sphericity is preferably smaller .
  • This sphericity can also be determined using the above-mentioned wet flow type particle size and shape analyzer FPIA-3000 (Malvern) if it is a single conductive particle.
  • the conductive particles can be obtained from a planar image or a cross-sectional image of the anisotropic conductive film as in the case of the sphericity.
  • the minimum melt viscosity of the insulating resin layer 2 is not particularly limited, and can be appropriately determined according to the application target of the anisotropic conductive film, the production method of the anisotropic conductive film, and the like. For example, as long as the above-mentioned dents 2b and 2c can be formed, depending on the manufacturing method of an anisotropic conductive film, it can also be about 1000 Pa.s.
  • the insulating resin layer is a film From the viewpoint of enabling molding, it is preferable to set the minimum melt viscosity of the resin to 1100 Pa ⁇ s or more.
  • a recess 2b is formed around the exposed portion of the conductive particle 1 pressed into the insulating resin layer 2
  • it is preferably 1500 Pa ⁇ s or more, more preferably 2000 Pa ⁇ s or more, still more preferably 3000 to 15000 Pa ⁇ . s, still more preferably 3000 to 10000 Pa ⁇ s.
  • This minimum melt viscosity can be determined by using a rotary rheometer (manufactured by TA instrument) as an example, keeping constant at a measurement pressure of 5 g, and using a measurement plate having a diameter of 8 mm, more specifically, a temperature range
  • the temperature can be determined by setting the temperature rise rate to 10 ° C./min, the measurement frequency to 10 Hz, and the load fluctuation to the measurement plate to 5 g at 30 to 200 ° C.
  • the minimum melt viscosity of the insulating resin layer 2 By setting the minimum melt viscosity of the insulating resin layer 2 to a high viscosity of 1500 Pa ⁇ s or more, unnecessary movement of the conductive particles can be suppressed at the time of pressure bonding to the connection target of the anisotropic conductive film, and in particular, anisotropic conductivity It can prevent that the electrically-conductive particle which should be clamped between terminals at the time of connection flows by resin flow.
  • insulating resin layer 2 when conductive particles 1 are pressed is conductive particles 1.
  • the insulating resin layer 2 plastically deforms and dents 2 b in the insulating resin layer 2 around the conductive particles 1.
  • a viscous body is formed as a viscous body, or the conductive particles 1 are pressed so as to be embedded in the insulating resin layer 2 without exposing the conductive particles 1 from the insulating resin layer 2
  • a high viscosity viscous material is formed such that a recess 2c (FIG. 6) is formed on the surface of the insulating resin layer 2 immediately above the conductive particles 1. Therefore, the lower limit of the viscosity at 60 ° C.
  • the insulating resin layer 2 is preferably 3000 Pa ⁇ s or more, more preferably 4000 Pa ⁇ s or more, still more preferably 4500 Pa ⁇ s or more, and the upper limit is preferably 20000 Pa ⁇ s or less More preferably, it is 15000 Pa ⁇ s or less, further preferably 10000 Pa ⁇ s or less.
  • This measurement is performed by the same measurement method as the minimum melt viscosity, and the temperature can be determined by extracting a value of 60 ° C. In the present invention, the case where the viscosity at 60 ° C. is less than 3000 Pa ⁇ s is not excluded. In the case of connection by light irradiation, since low temperature mounting is required, it is desirable to lower the viscosity if the conductive particles can be held.
  • the specific viscosity of the insulating resin layer 2 when the conductive particles 1 are pressed into the insulating resin layer 2 is preferably 3000 Pa ⁇ s or more, the lower limit depending on the shape, depth, etc. of the recesses 2 b and 2 c to be formed.
  • the upper limit is preferably 20000 Pa ⁇ s or less, more preferably 15000 Pa ⁇ s or less, and still more preferably 10000 Pa ⁇ s or less.
  • such viscosity is preferably obtained at 40 to 80 ° C., more preferably 50 to 60 ° C.
  • the recess 2c (FIG. 6) is formed in the surface of the insulating resin layer 2 immediately above the conductive particle 1 embedded without being exposed from the insulating resin layer 2, thereby providing a case where there is no recess 2c.
  • the pressure at the time of pressure bonding of the anisotropic conductive film to the article tends to be concentrated on the conductive particles 1. For this reason, when the conductive particles are easily held by the terminals at the time of anisotropic conductive connection, the trapping property is improved, and the conduction performance is improved.
  • the ratio (La / D) of the layer thickness La of the photopolymerizable insulating resin layer 2 to the conductive particle diameter D is preferably 0.6 to 10.
  • the conductive particle diameter D means the average particle diameter. If the layer thickness La of the insulating resin layer 2 is too large, the conductive particles are likely to be misaligned at the time of anisotropic conductive connection, and the capture of the conductive particles at the terminal is reduced. This tendency is remarkable when La / D exceeds 10. Therefore, La / D is more preferably 8 or less, still more preferably 6 or less.
  • the conductive particles 1 can be maintained in a predetermined particle dispersion state or a predetermined arrangement by the insulating resin layer 2 It will be difficult.
  • the ratio (La / D) of the layer thickness La of the insulating resin layer 2 to the conductive particle diameter D is preferably 0.8 to 2.
  • the insulating resin layer 2 is formed of a photopolymerizable resin composition.
  • a photopolymerizable resin composition can be formed from a photocationic polymerizable resin composition, a photoradically polymerizable resin composition, or a photoanion polymerizable resin composition.
  • a thermal polymerization initiator can be contained in these photopolymerizable resin compositions as needed.
  • the photocationic polymerizable resin composition contains a film-forming polymer, a photocationic polymerizable compound, a photocationic polymerization initiator, and a thermal cationic polymerization initiator.
  • polymer for film formation As the polymer for film formation, known polymer for film formation applied to an anisotropic conductive film can be used, and a bisphenol S-type phenoxy resin, a phenoxy resin having a fluorene skeleton, polystyrene, polyacrylonitrile, polyphenylene sulfide And polytetrafluoroethylene, polycarbonate and the like, and these can be used alone or in combination of two or more.
  • bisphenol S-type phenoxy resin can be suitably used from the viewpoint of film formation state, connection reliability and the like.
  • Phenoxy resins are polyhydroxy polyethers synthesized from bisphenols and epichlorohydrin. As a specific example of a commercially available phenoxy resin, trade name "FA290" of Nippon Steel & Sumikin Chemical Co., Ltd. can be mentioned.
  • the compounding amount of the film forming polymer in the cationic photopolymerizable resin composition is a resin component (a film forming polymer, a photopolymerizable compound, a photopolymerization initiator and a thermal polymerization initiator) in order to realize an appropriate minimum melt viscosity.
  • a resin component a film forming polymer, a photopolymerizable compound, a photopolymerization initiator and a thermal polymerization initiator
  • the photocationically polymerizable compound is at least one selected from an epoxy compound and an oxetane compound.
  • the epoxy compound having 5 or less functional groups is not particularly limited, and glycidyl ether type epoxy compounds, glycidyl ester type epoxy compounds, alicyclic type epoxy compounds, bisphenol A type epoxy compounds, bisphenol F type epoxy compounds, dicyclopentadiene type epoxy compounds Novolak phenol type epoxy compounds, biphenyl type epoxy compounds, naphthalene type epoxy compounds, and the like. Among these, one type can be used alone, or two or more types can be used in combination.
  • the brand name "Epogorose EN” of Yokkaichi synthesis Co., Ltd. etc. can be mentioned.
  • the trade name "840-S” of DIC Corporation can be mentioned.
  • the trade name “HP-7200 series” of DIC Corporation can be mentioned.
  • the oxetane compounds are not particularly limited, and include biphenyl type oxetane compounds, xylylene type oxetane compounds, silsesquioxane type oxetane compounds, ether type oxetane compounds, phenol novolac type oxetane compounds, silicate type oxetane compounds, etc. Among them, one type can be used alone, or two or more types can be used in combination. As a specific example of a biphenyl type oxetane compound available on the market, the trade name “OXBP” of Ube Industries, Ltd. can be mentioned.
  • the content of the cationically polymerizable compound in the cationic photopolymerizable resin composition is preferably 10 to 70 wt%, more preferably 20 to 50 wt%, of the resin component in order to achieve a suitable minimum melt viscosity.
  • Photo cationic polymerization initiator As a photocationic polymerization initiator, although a well-known thing can be used, the onium salt which makes tetrakis (pentafluorophenyl) borate (TFPB) an anion can be used preferably. Thereby, the excessive rise of the minimum melt viscosity after photocuring can be suppressed. It is considered that this is because the TFPB has a large substituent and a large molecular weight.
  • aromatic oniums such as aromatic sulfoniums, aromatic iodoniums, aromatic diazoniums and aromatic ammoniums can be preferably employed.
  • triarylsulfonium which is aromatic sulfonium.
  • onium salts having TFPB as the anion include BASF Japan Ltd. trade name "IRGACURE 290", Fujifilm Wako Pure Chemical Industries Ltd. trade name "WPI-124", etc. be able to.
  • the content of the photocationic polymerization initiator in the photocationically polymerizable resin composition is preferably 0.1 to 10 wt% in the resin component, and more preferably 1 to 5 wt%.
  • the thermal cationic polymerization initiator is not particularly limited, and aromatic sulfonium salts, aromatic iodonium salts, aromatic diazonium salts, aromatic ammonium salts and the like can be mentioned, and among these, it is preferable to use an aromatic sulfonium salt .
  • aromatic sulfonium salt As a specific example of the commercially available aromatic sulfonium salt, the trade name “SI-60” of Sanshin Chemical Industry Co., Ltd. can be mentioned.
  • the content of the thermal cationic polymerization initiator is preferably 1 to 30 wt% of the resin component, and more preferably 5 to 20 wt%.
  • the photoradically polymerizable resin composition contains a film-forming polymer, a photoradically polymerizable compound, a photoradical polymerization initiator, and a thermal radical polymerization initiator.
  • the film-forming polymer those described for the photocationically polymerizable resin composition can be appropriately selected and used.
  • the content is also as already explained.
  • radical photopolymerizable (meth) acrylate monomers can be used as the radical photopolymerizable (meth) acrylate monomers.
  • monofunctional (meth) acrylate monomers and bifunctional or higher polyfunctional (meth) acrylate monomers can be used.
  • the content of the photoradically polymerizable compound in the photoradically polymerizable resin composition is preferably 10 to 60% by mass, more preferably 20 to 55% by mass in the resin component.
  • thermal radical polymerization initiator an organic peroxide, an azo compound, etc. can be mentioned.
  • organic peroxides that do not generate nitrogen causing air bubbles can be preferably used.
  • the amount of the thermal radical polymerization initiator used is preferably 2 to 60 parts by mass, more preferably 5 to 40 parts by mass, with respect to 100 parts by mass of the (meth) acrylate compound, from the balance of the curing rate and the product life.
  • an insulating filler such as silica (hereinafter referred to only as a filler) is added to the photopolymerizable resin composition such as the cationic photopolymerizable resin composition or the photoradical photopolymerizable resin composition. It is preferable to contain it.
  • the content of the filler is preferably 3 to 60 wt%, more preferably 10 to 55 wt%, still more preferably 20 to 50 wt%, relative to the total amount of the photopolymerizable resin composition, in order to achieve a suitable minimum melt viscosity. It is.
  • the average particle size of the filler is preferably 1 to 500 nm, more preferably 10 to 300 nm, and still more preferably 20 to 100 nm.
  • a photopolymerizable resin composition further contains a silane coupling agent.
  • silane coupling agent epoxy type, methacryloxy type, amino type, vinyl type, mercapto sulfide type, ureido type, etc. may be mentioned, and these may be used alone or two or more types may be used in combination. Good.
  • fillers softeners, accelerators, anti-aging agents, colorants (pigments, dyes), organic solvents, ion catchers and the like different from the above-mentioned insulating fillers may be contained.
  • the conductive particles 1 may be exposed from the insulating resin layer 2 in the thickness direction of the insulating resin layer 2 as described above. Although it may be embedded in the insulating resin layer 2, the distance Lb of the deepest part of the conductive particles from the tangent plane 2 p at the central part between adjacent conductive particles (hereinafter referred to as the amount of embedding) It is preferable that a ratio (Lb / D) (hereinafter, referred to as embedding ratio) to the conductive particle diameter D is 30% or more and 105% or less. The conductive particles 1 may penetrate the insulating resin layer 2 and the embedding ratio (Lb / D) in that case is 100%.
  • the conductive particles 1 are made of the insulating resin layer 2
  • the amount of resin in the insulating resin layer which acts to cause the conductive particles between the terminals to flow unnecessarily at the time of anisotropic conductive connection by facilitating maintenance of the dispersed state of particles or in a predetermined arrangement, and by making the ratio 105% or less Can be reduced.
  • the numerical value of the embedding ratio (Lb / D) is 80% or more, preferably 90% or more, more preferably 96% or more of the total number of conductive particles contained in the anisotropic conductive film. It means that it is a numerical value of the embedding rate (Lb / D). Therefore, the embedding ratio of 30% to 105% means that the embedding ratio is 80% or more, preferably 90% or more, more preferably 96% or more of the total number of conductive particles contained in the anisotropic conductive film. % Or more and 105% or less.
  • the embedding ratio (Lb / D) of all the conductive particles is uniform, the load of the pressure is uniformly applied to the conductive particles, so that the capture state of the conductive particles in the terminal becomes good, and the stability of the conduction Can be expected.
  • 200 or more conductive particles may be measured and obtained.
  • the measurement of the embedding ratio (Lb / D) can be obtained collectively for a certain number of objects by adjusting the focus in the surface view image.
  • a laser type discrimination displacement sensor manufactured by Keyence Corporation or the like may be used to measure the embedding rate (Lb / D).
  • the pushing of the conductive particles 1 is performed at 40 to 80 ° C. It can be formed by performing at 3000 to 20000 Pa ⁇ s, more preferably at 4500 to 15000 Pa ⁇ s.
  • a portion of the surface of the insulating resin layer 2 in contact with the conductive particles 1 exposed from the insulating resin layer 2 and a central portion between the adjacent conductive particles are adjacent to each other.
  • the surface 2a of the insulating resin layer has a slope 2b which is a ridge line generally along the outer shape of the conductive particle with respect to the tangent plane 2p.
  • the pushing of the conductive particles 1 is performed at 40 to 80 ° C. It can be formed by performing at 3000 to 20000 Pa ⁇ s, more preferably at 4500 to 15000 Pa ⁇ s.
  • the slope 2b and the unevenness 2c may lose
  • the unevenness 2 c does not have the trace, the conductive particles may be exposed to the insulating resin layer 2 at one point.
  • the conductive resin 1 has a shallow undulation 2c on the surface of the insulating resin layer 2 and the conductive particle 1 is insulated at one point of its top 1a. It is possible to cite those exposed from the conductive resin layer 2.
  • the anisotropic conductive films 10B, 10C, and 10D have a 100% embedding ratio, the tops 1a of the conductive particles 1 and the surface 2a of the insulating resin layer 2 are flush with each other.
  • the tops 1a of the conductive particles 1 and the surface 2a of the insulating resin layer 2 are flush, as compared to the case where the conductive particles 1 protrude from the insulating resin layer 2 as shown in FIG. 1B.
  • the amount of resin in the film thickness direction is unlikely to be non-uniform around the individual conductive particles, and the movement of the conductive particles due to resin flow can be reduced.
  • the amount of resin around the conductive particles 1 is unlikely to be uneven among the anisotropic conductive films 10D, so that the movement of the conductive particles due to the resin flow can be eliminated. Since the conductive particles 1 are exposed from the insulating resin layer 2 even if they are present, the trapping property of the conductive particles 1 in the terminal is good, and an effect that slight movement of the conductive particles is unlikely to occur can be expected. Therefore, this aspect is effective particularly when the fine pitch and the space between bumps are narrow.
  • the anisotropic conductive film 10B (FIG. 2), 10C (FIG. 3), 10D (FIG. 4) from which the shape and depth of inclination 2b and relief 2c differ differs in the time of pressing of the electrically conductive particle 1 so that it may mention later. It can manufacture by changing the viscosity etc. of the insulating resin layer 2.
  • the aspect of FIG. 3 can be paraphrased in it being an intermediate state of FIG. 2 (an aspect of inclination) and FIG. 4 (an aspect of unevenness).
  • the present invention also includes the embodiment of FIG.
  • the conductive particles 1 are exposed as in the anisotropic conductive film 10E shown in FIG. 5, and the insulating resin layer around the exposed portion 2 may be a slope 2b with respect to the tangent plane 2p or a surface of the insulating resin layer 2 immediately above the conductive particle 1 with a relief 2c with respect to the tangent plane 2p.
  • An anisotropic conductive film 10E (FIG. 5) having a slope 2b in the insulating resin layer 2 around the exposed portion of the conductive particles 1 and an anisotropy 2c in the insulating resin layer 2 immediately above the conductive particles 1
  • the conductive conductive films 10F (FIG. 6) can be manufactured by changing the viscosity etc. of the insulating resin layer 2 when the conductive particles 1 are pushed in when manufacturing them.
  • the anisotropic conductive film 10E shown in FIG. 5 is used for anisotropic conductive connection, the conductive particles 1 are directly pressed from the terminals, so that the trapping property of the conductive particles in the terminals is improved. Further, when the anisotropic conductive film 10F shown in FIG.
  • the conductive particles 1 do not directly press the terminal but press via the insulating resin layer 2, but the pressing direction 8 (that is, the conductive particles 1 are embedded with an embedding ratio exceeding 100%, the conductive particles 1 are not exposed from the insulating resin layer 2, and the insulating resin layer 2 is Because the conductive particles are more susceptible to pressure, and the conductive particles 1 between the terminals are prevented from moving unnecessarily due to resin flow during anisotropic conductive connection.
  • anisotropic conduction In order to improve the capture rate of the conductive particles at the time of connection, it is preferable to set the embedding rate (Lb / D) to 60% or more.
  • the presence of the slope 2b and the unevenness 2c on the surface of the insulating resin layer 2 can be confirmed by observing the cross section of the anisotropic conductive film with a scanning electron microscope, and also in the planar visual field observation. it can. Observation of the tilt 2b and the undulation 2c is possible with an optical microscope and a metallurgical microscope. Further, the size of the inclination 2b and the unevenness 2c can also be confirmed by focus adjustment or the like at the time of image observation. The same is true even after reducing the inclination or relief by the heat press as described above. It is because a trace may remain.
  • the anisotropic conductive film according to the present invention has the insulating property on the surface of the conductive resin dispersed layer 3 on which the slope 2b of the insulating resin layer 2 is formed, as in the anisotropic conductive film 10H shown in FIG.
  • the second insulating resin layer 4 having a minimum melt viscosity lower than that of the resin layer 2 may be laminated. Further, as in the anisotropic conductive film 10I shown in FIG. 10, the minimum melt viscosity is higher than that of the insulating resin layer 2 on the surface of the conductive resin dispersed layer 3 where the slope 2b is not formed.
  • the low second insulating resin layer 4 may be laminated.
  • the second insulating resin layer 4 when anisotropically conductively connecting an electronic component using an anisotropic conductive film, the space formed by the electrodes and bumps of the electronic component is filled and adhesion is achieved. It can be improved.
  • the second insulating resin layer 4 is laminated, the second insulating resin layer 4 is added by a tool regardless of whether the second insulating resin layer 4 is on the formation surface of the slope 2b. It is preferable that it is on the side of an electronic component such as an IC chip to be pressed (in other words, it is on the side of an electronic component such as a substrate on which the insulating resin layer 2 is placed on a stage). By doing so, unnecessary movement of the conductive particles can be avoided, and the capture can be improved. The same applies to the case where the slope 2b is the unevenness 2c.
  • the minimum melt viscosity of the insulating resin layer 2 and the second insulating resin layer 4 is different, the space formed by the electrodes and bumps of the electronic component is more likely to be filled with the second insulating resin layer 4 as there is a difference. The effect of improving the adhesion between electronic components can be expected. In addition, since the amount of movement of the insulating resin layer 2 present in the conductive particle dispersion layer 3 is relatively small as the difference is made, the capture of the conductive particles in the terminal is easily improved.
  • the minimum melt viscosity ratio of the insulating resin layer 2 to the second insulating resin layer 4 is preferably 2 or more, more preferably 5 or more, and still more preferably 8 or more.
  • the preferable minimum melt viscosity of the second insulating resin layer 4 satisfies the above-mentioned ratio and is 3000 Pa ⁇ s or less, more preferably 2000 Pa ⁇ s or less, and particularly preferably 100 to 2000 Pa ⁇ s. s.
  • the second insulating resin layer 4 can be formed by adjusting the viscosity of a resin composition similar to the insulating resin layer.
  • the layer thickness of the second insulating resin layer 4 is not particularly limited because there are portions affected by the electronic components and the connection conditions, but preferably 4 to It is 20 ⁇ m. Alternatively, it is preferably 1 to 8 times the diameter of the conductive particles.
  • the minimum melt viscosity of the whole of the anisotropic conductive film 10H, 10I including the insulating resin layer 2 and the second insulating resin layer 4 is greater than 100 Pa ⁇ s because if it is too low, there is a concern that the resin will stick out. Is preferable, and 200 to 4000 Pa ⁇ s is more preferable.
  • a third insulating resin layer may be provided on the opposite side of the second insulating resin layer 4 and the insulating resin layer 2.
  • the third insulating resin layer can function as a tack layer. Similar to the second insulating resin layer, it may be provided to fill the space formed by the electrodes and bumps of the electronic component.
  • the resin composition, viscosity, and thickness of the third insulating resin layer may be the same as or different from those of the second insulating resin layer.
  • the minimum melt viscosity of the anisotropic conductive film which united the insulating resin layer 2 and the second insulating resin layer 4 and the third insulating resin layer is not particularly limited, if it is too low, there is a concern that the resin may be exposed. Therefore, the pressure is preferably higher than 100 Pa ⁇ s, and more preferably 200 to 4000 Pa ⁇ s.
  • the anisotropic conductive film of the present invention can be produced by a production method comprising the step of forming a conductive particle dispersion layer in which conductive particles are dispersed in an insulating resin layer.
  • the step of forming the conductive particle dispersion layer is a step of holding the conductive particles in the state of being dispersed on the surface of the insulating resin layer made of the photopolymerizable resin composition, and holding the conductive particles on the surface of the insulating resin layer. And pressing the conductive particles into the insulating resin layer.
  • the surface of the insulating resin layer in the vicinity of the conductive particles has an inclination or an undulation with respect to the tangent of the insulating resin layer in the central portion between adjacent conductive particles.
  • the viscosity, the pressing speed, the temperature, etc. of the insulating resin layer when the conductive particles are pushed in are adjusted.
  • the surface of the insulating resin layer around the conductive particles is chipped with respect to the tangent plane, and in the undulation, immediately above the conductive particles.
  • the amount of resin in the insulating resin layer is made smaller than when the surface of the insulating resin layer directly above the conductive particles is in the contact plane.
  • the ratio (Lb / D) of the distance Lb of the deepest part of the conductive particle from the tangential plane to the diameter D of the conductive particle is set to 30% or more and 105% or less.
  • the conductive particles 1 are held in a predetermined arrangement on the surface of the insulating resin layer 2, and the conductive particles 1 are insulating resin with a flat plate or a roller. It can be manufactured by pressing into a layer.
  • the embedding amount of the conductive particles 1 in the insulating resin layer 2 can be adjusted by the pressing force, temperature, etc. when the conductive particles 1 are pushed, and the shape and depth of the slope 2 b and the unevenness 2 c It can adjust with the viscosity of the insulating resin layer 2 at the time of pushing, pushing speed, temperature, etc.
  • a known method can be used as a method of holding the conductive particles 1 in the insulating resin layer 2.
  • conductive particles 1 can be directly sprayed on insulating resin layer 2 or conductive particles 1 can be attached as a single layer to a film that can be biaxially stretched, the film is biaxially stretched, and the stretched film is made
  • the conductive resin layer 2 holds the conductive particles 1.
  • the conductive particles 1 can be held by the insulating resin layer 2 using a transfer type.
  • the transfer mold When the conductive particles 1 are held on the insulating resin layer 2 using a transfer mold, examples of the transfer mold include inorganic materials such as silicon, various ceramics, glass, metals such as stainless steel, and organic such as various resins. With respect to materials and the like, those having an opening formed by a known opening forming method such as photolithography and the like, or those to which a printing method is applied can be used. In addition, the transfer mold can have a plate-like shape, a roll-like shape or the like. The present invention is not limited by the above method.
  • the second insulating resin layer having a viscosity lower than that of the insulating resin layer can be stacked on the surface of the insulating resin layer in which the conductive particles are pressed in, or on the surface opposite to the surface on which the conductive particles are pressed. .
  • the anisotropic conductive film be a certain length. Therefore, the anisotropic conductive film is manufactured to have a length of preferably 5 m or more, more preferably 10 m or more, and still more preferably 25 m or more. On the other hand, if the anisotropic conductive film is excessively long, the conventional connection device used when manufacturing an electronic component using the anisotropic conductive film can not be used, and the handleability is also inferior. Therefore, the length of the anisotropic conductive film is preferably 5000 m or less, more preferably 1000 m or less, and still more preferably 500 m or less. It is preferable from the point which is excellent in handleability to use such a long body of an anisotropic conductive film as a winding body wound around a core.
  • the first electronic component such as an IC chip, an IC module, or an FPC and the second electronic component such as an FPC, a glass substrate, a plastic substrate, a rigid substrate, or a ceramic substrate are anisotropically separated. It can be preferably used in producing a connection structure by conducting conductive connection. IC chips and wafers may be stacked and multilayered using the anisotropic conductive film of the present invention.
  • the electronic component connected by the anisotropic conductive film of this invention is not limited to the above-mentioned electronic component. In recent years, it can be used for various electronic components that are diversified.
  • the present invention provides a method for producing a connection structure in which electronic components are anisotropically conductively connected to each other using the anisotropic conductive film of the present invention, and a connection structure obtained thereby, that is, the anisotropy of the present invention. It also includes a connection structure in which electronic components are anisotropically conductively connected to each other by the conductive film.
  • the first electronic component and the second electronic component are anisotropically conductively connected by the anisotropic conductive film of the present invention.
  • the first electronic component include LCD (Liquid Crystal Display) panels, flat panel display (FPD) applications such as organic EL (OLED), transparent substrates such as touch panel applications, printed wiring board (PWB), etc. .
  • the material of the printed wiring board is not particularly limited.
  • glass epoxy such as FR-4 substrate may be used, and plastic such as thermoplastic resin, ceramic, etc. may also be used.
  • the transparent substrate is not particularly limited as long as it has high transparency, and examples thereof include a glass substrate and a plastic substrate.
  • the second electronic component includes a second terminal row opposed to the first terminal row.
  • the second electronic component includes an IC (Integrated Circuit), a flexible substrate (FPC: Flexible Printed Circuits), a tape carrier package (TCP) substrate, a COF (Chip On Film) in which an IC is mounted on the FPC, and the like.
  • the connection structure of this invention can be manufactured by the manufacturing method which has the following arrangement
  • the anisotropic conductive film is disposed from the side on which the slope or unevenness of the conductive particle dispersion layer is formed or not formed.
  • the conductive particle dispersion layer is disposed from the side on which the slope or unevenness is formed, the inclined or uneven portion is irradiated with light, thereby promoting the reaction of the portion having a relatively small amount of resin and pushing and holding the conductive particles. We can expect the effect to be compatible.
  • the anisotropic conductive film is arranged from the side on which the conductive particle dispersion layer is not formed with inclination or unevenness with respect to the first electronic component, the amount of resin relatively existing on the first electronic component side is It can be expected that the sandwiching state of the conductive particles is likely to become strong by irradiating the light to the large portion.
  • the conductive particle dispersion layer is photopolymerized by irradiating the anisotropic conductive film with light (so-called pre-irradiation) from the anisotropic conductive film side or the first electronic component side.
  • pre-irradiation light
  • connection at a low temperature can be easily performed, and excessive heat application to the electronic component to be connected can be avoided.
  • the reaction by light irradiation can be uniformly started to the whole anisotropic conductive film before mounting of the second electronic component, and the first electronic component can be used. It is possible to exclude the influence from the provided light shielding portion (portion related to the wiring).
  • the degree of photopolymerization of the conductive particle dispersion layer by light irradiation can be evaluated by an index of reaction rate, and is preferably 70% or more, more preferably 80% or more, and still more preferably 90% or more.
  • the upper limit is 100% or less.
  • the reaction rate can be measured using a commercially available HPLC (high performance liquid chromatograph apparatus, in terms of styrene) of the resin composition before and after photopolymerization.
  • the minimum melt viscosity of the conductive particle dispersion layer after light irradiation in this step is anisotropic.
  • the lower limit is preferably 1000 Pa.s or more, more preferably 1200 Pa.s or more, and the upper limit is preferably 8000 Pa.s or less, in order to achieve good conductive particle capture and indentation during conductive conductive connection. More preferably, it is 5000 Pa ⁇ s or less.
  • the reaching temperature of the lowest melt viscosity is preferably 60 to 100 ° C., more preferably 65 to 85 ° C.
  • the irradiation light can be selected from wavelength bands such as ultraviolet (UV), visible light, infrared (IR), etc. according to the polymerization characteristics of the photopolymerizable anisotropic conductive film. .
  • ultraviolet light with high energy usually, a wavelength of 10 nm to 400 nm is preferable.
  • the anisotropic conductive film is disposed from the side of the conductive particle dispersion layer on which the slope or unevenness is formed, and the light emitting step is applied to the first electronic component. It is preferable to perform light irradiation from the side.
  • the first electronic component and the second electronic component are disposed by disposing the second electronic component on the light-irradiated anisotropic conductive film and heating and pressing the second electronic component with a known thermocompression bonding tool.
  • the thermocompression bonding tool may be used as a crimping tool without applying a temperature to lower the temperature.
  • the anisotropic conductive connection conditions can be appropriately set according to the electronic component to be used, the anisotropic conductive film, and the like.
  • position buffer materials such as a polytetrafluoroethylene sheet, a polyimide sheet, a glass cloth, a silicone rubber, etc. between the thermocompression-bonding tool and the electronic component which should be connected, and you may thermocompression-bond.
  • Light irradiation may be performed from the first electronic component side at the time of thermocompression bonding.
  • the anisotropic conductive film of the present invention has a conductive particle dispersion layer in which conductive particles are dispersed in an insulating resin layer made of a photopolymerizable resin composition, and the surface of the insulating resin layer in the vicinity of the conductive particles is It has an inclination or an undulation with respect to the tangent of the insulating resin layer in the center between adjacent conductive particles. For this reason, when the electronic components are anisotropically conductively connected to each other to manufacture the connection structure, after the anisotropic conductive film is disposed on one of the electronic components, before the other electronic component is disposed thereon.
  • the photopolymerization insulating resin layer of the anisotropic conductive film is irradiated with light to suppress an excessive decrease in the minimum melt viscosity of the insulating resin at the time of anisotropic conductive connection. Unnecessary flow can be prevented, thereby achieving good conduction characteristics in the connection structure.
  • the anisotropic conductive film of the present invention is useful for mounting electronic components such as semiconductor devices on various substrates.

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