JP7062389B2 - 異方性導電フィルム - Google Patents

異方性導電フィルム Download PDF

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Publication number
JP7062389B2
JP7062389B2 JP2017160630A JP2017160630A JP7062389B2 JP 7062389 B2 JP7062389 B2 JP 7062389B2 JP 2017160630 A JP2017160630 A JP 2017160630A JP 2017160630 A JP2017160630 A JP 2017160630A JP 7062389 B2 JP7062389 B2 JP 7062389B2
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Japan
Prior art keywords
resin layer
conductive particles
insulating resin
anisotropic conductive
conductive film
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JP2017160630A
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English (en)
Japanese (ja)
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JP2019040703A (ja
JP2019040703A5 (https=
Inventor
太一郎 梶谷
怜司 塚尾
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Dexerials Corp
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Dexerials Corp
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Priority to JP2017160630A priority Critical patent/JP7062389B2/ja
Application filed by Dexerials Corp filed Critical Dexerials Corp
Priority to KR1020207004220A priority patent/KR20200022510A/ko
Priority to CN201880054523.0A priority patent/CN110945720B/zh
Priority to US16/640,461 priority patent/US20200215785A1/en
Priority to PCT/JP2018/028623 priority patent/WO2019039210A1/ja
Priority to KR1020227044578A priority patent/KR102675438B1/ko
Priority to TW111136753A priority patent/TWI855387B/zh
Priority to TW107128572A priority patent/TWI781213B/zh
Publication of JP2019040703A publication Critical patent/JP2019040703A/ja
Publication of JP2019040703A5 publication Critical patent/JP2019040703A5/ja
Application granted granted Critical
Publication of JP7062389B2 publication Critical patent/JP7062389B2/ja
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    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Wood Science & Technology (AREA)
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  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
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US16/640,461 US20200215785A1 (en) 2017-08-23 2018-07-31 Anisotropic conductive film
PCT/JP2018/028623 WO2019039210A1 (ja) 2017-08-23 2018-07-31 異方性導電フィルム
KR1020207004220A KR20200022510A (ko) 2017-08-23 2018-07-31 이방성 도전 필름
KR1020227044578A KR102675438B1 (ko) 2017-08-23 2018-07-31 이방성 도전 필름
TW111136753A TWI855387B (zh) 2017-08-23 2018-08-16 異向性導電膜、連接結構體及彼等之製造方法
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JP2003064324A (ja) 2001-06-11 2003-03-05 Hitachi Chem Co Ltd 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体
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TWI781213B (zh) 2022-10-21
CN110945720B (zh) 2021-11-30
TW201921803A (zh) 2019-06-01
US20200215785A1 (en) 2020-07-09
KR20200022510A (ko) 2020-03-03
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WO2019039210A1 (ja) 2019-02-28
TW202318726A (zh) 2023-05-01

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