TWI781213B - 異向性導電膜、連接結構體及彼等之製造方法 - Google Patents
異向性導電膜、連接結構體及彼等之製造方法 Download PDFInfo
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- TWI781213B TWI781213B TW107128572A TW107128572A TWI781213B TW I781213 B TWI781213 B TW I781213B TW 107128572 A TW107128572 A TW 107128572A TW 107128572 A TW107128572 A TW 107128572A TW I781213 B TWI781213 B TW I781213B
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- conductive particles
- resin layer
- insulating resin
- conductive film
- anisotropic conductive
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
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- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-160630 | 2017-08-23 | ||
| JP2017160630A JP7062389B2 (ja) | 2017-08-23 | 2017-08-23 | 異方性導電フィルム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201921803A TW201921803A (zh) | 2019-06-01 |
| TWI781213B true TWI781213B (zh) | 2022-10-21 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107128572A TWI781213B (zh) | 2017-08-23 | 2018-08-16 | 異向性導電膜、連接結構體及彼等之製造方法 |
| TW111136753A TWI855387B (zh) | 2017-08-23 | 2018-08-16 | 異向性導電膜、連接結構體及彼等之製造方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW111136753A TWI855387B (zh) | 2017-08-23 | 2018-08-16 | 異向性導電膜、連接結構體及彼等之製造方法 |
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| JP (1) | JP7062389B2 (https=) |
| KR (2) | KR20200022510A (https=) |
| CN (1) | CN110945720B (https=) |
| TW (2) | TWI781213B (https=) |
| WO (1) | WO2019039210A1 (https=) |
Families Citing this family (1)
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| CN116635956A (zh) * | 2020-10-22 | 2023-08-22 | 株式会社力森诺科 | 电路连接用黏合剂膜、连接结构体及连接结构体的制造方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
| JP2014044947A (ja) * | 2012-08-01 | 2014-03-13 | Dexerials Corp | 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 |
| JP2015165490A (ja) * | 2014-02-04 | 2015-09-17 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| US9585247B2 (en) * | 2012-08-03 | 2017-02-28 | Dexerials Corporation | Anisotropic conductive film and method of producing the same |
| TW201719682A (zh) * | 2015-07-13 | 2017-06-01 | 迪睿合股份有限公司 | 異向性導電膜及連接構造體 |
| EP2221926B1 (en) * | 2007-12-10 | 2017-07-19 | FUJIFILM Corporation | Anisotropic conductive joint package |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
| JP2003045236A (ja) * | 2001-08-03 | 2003-02-14 | Nec Kagoshima Ltd | 異方性導電フイルムおよびこれを用いた集積回路デバイスの接続方法 |
| JP2006032335A (ja) * | 2005-07-06 | 2006-02-02 | Hitachi Chem Co Ltd | 異方導電性接着フィルム |
| KR101240155B1 (ko) * | 2006-04-27 | 2013-03-11 | 아사히 가세이 일렉트로닉스 가부시끼가이샤 | 도전 입자 배치 시트 및 이방성 도전 필름 |
| KR101716987B1 (ko) | 2012-08-24 | 2017-03-15 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름의 제조 방법 및 이방성 도전 필름 |
| KR101716945B1 (ko) * | 2012-08-24 | 2017-03-15 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 및 그의 제조 방법 |
| JP5972844B2 (ja) * | 2012-09-18 | 2016-08-17 | デクセリアルズ株式会社 | 異方性導電フィルム、異方性導電フィルムの製造方法、接続体の製造方法、及び接続方法 |
| JP6260312B2 (ja) * | 2014-02-04 | 2018-01-17 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| JP6217422B2 (ja) * | 2014-02-04 | 2017-10-25 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| CN105940564B (zh) * | 2014-02-04 | 2020-03-24 | 迪睿合株式会社 | 各向异性导电膜及其制造方法 |
| JP6409281B2 (ja) * | 2014-02-04 | 2018-10-24 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| KR102276325B1 (ko) * | 2015-01-13 | 2021-07-13 | 데쿠세리아루즈 가부시키가이샤 | 이방 도전성 필름 |
| CN108475558B (zh) * | 2016-02-15 | 2021-11-09 | 迪睿合株式会社 | 各向异性导电膜、其制造方法和连接结构体 |
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2017
- 2017-08-23 JP JP2017160630A patent/JP7062389B2/ja active Active
-
2018
- 2018-07-31 WO PCT/JP2018/028623 patent/WO2019039210A1/ja not_active Ceased
- 2018-07-31 KR KR1020207004220A patent/KR20200022510A/ko not_active Ceased
- 2018-07-31 CN CN201880054523.0A patent/CN110945720B/zh active Active
- 2018-07-31 US US16/640,461 patent/US20200215785A1/en not_active Abandoned
- 2018-07-31 KR KR1020227044578A patent/KR102675438B1/ko active Active
- 2018-08-16 TW TW107128572A patent/TWI781213B/zh active
- 2018-08-16 TW TW111136753A patent/TWI855387B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003064324A (ja) * | 2001-06-11 | 2003-03-05 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びそれを用いた回路基板の接続方法、回路基板接続体 |
| EP2221926B1 (en) * | 2007-12-10 | 2017-07-19 | FUJIFILM Corporation | Anisotropic conductive joint package |
| JP2014044947A (ja) * | 2012-08-01 | 2014-03-13 | Dexerials Corp | 異方性導電フィルムの製造方法、異方性導電フィルム、及び接続構造体 |
| US9585247B2 (en) * | 2012-08-03 | 2017-02-28 | Dexerials Corporation | Anisotropic conductive film and method of producing the same |
| JP2015165490A (ja) * | 2014-02-04 | 2015-09-17 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
| TW201719682A (zh) * | 2015-07-13 | 2017-06-01 | 迪睿合股份有限公司 | 異向性導電膜及連接構造體 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019040703A (ja) | 2019-03-14 |
| CN110945720A (zh) | 2020-03-31 |
| JP7062389B2 (ja) | 2022-05-06 |
| KR102675438B1 (ko) | 2024-06-17 |
| TWI855387B (zh) | 2024-09-11 |
| CN110945720B (zh) | 2021-11-30 |
| TW201921803A (zh) | 2019-06-01 |
| US20200215785A1 (en) | 2020-07-09 |
| KR20200022510A (ko) | 2020-03-03 |
| KR20230008230A (ko) | 2023-01-13 |
| WO2019039210A1 (ja) | 2019-02-28 |
| TW202318726A (zh) | 2023-05-01 |
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