WO2019033961A1 - 感光组件、成像模组、智能终端及制造感光组件的方法和模具 - Google Patents

感光组件、成像模组、智能终端及制造感光组件的方法和模具 Download PDF

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Publication number
WO2019033961A1
WO2019033961A1 PCT/CN2018/099271 CN2018099271W WO2019033961A1 WO 2019033961 A1 WO2019033961 A1 WO 2019033961A1 CN 2018099271 W CN2018099271 W CN 2018099271W WO 2019033961 A1 WO2019033961 A1 WO 2019033961A1
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WIPO (PCT)
Prior art keywords
top surface
photosensitive member
molding
photosensitive
section
Prior art date
Application number
PCT/CN2018/099271
Other languages
English (en)
French (fr)
Inventor
田中武彦
陈振宇
梅哲文
Original Assignee
宁波舜宇光电信息有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN201710712589.1A external-priority patent/CN109413303B/zh
Priority claimed from CN201721042380.0U external-priority patent/CN207410417U/zh
Application filed by 宁波舜宇光电信息有限公司 filed Critical 宁波舜宇光电信息有限公司
Priority to KR1020227016983A priority Critical patent/KR102509124B1/ko
Priority to CN201880044842.3A priority patent/CN110832836B/zh
Priority to EP18845725.3A priority patent/EP3672220B1/en
Priority to JP2020509516A priority patent/JP6992163B2/ja
Priority to US16/637,895 priority patent/US11843009B2/en
Priority to KR1020207004556A priority patent/KR20200045472A/ko
Publication of WO2019033961A1 publication Critical patent/WO2019033961A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14618—Containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14336—Coating a portion of the article, e.g. the edge of the article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14627—Microlenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2793/00—Shaping techniques involving a cutting or machining operation
    • B29C2793/009—Shaping techniques involving a cutting or machining operation after shaping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2011/00—Optical elements, e.g. lenses, prisms

Definitions

  • the present disclosure relates to the field of imaging components and smart terminal technologies, and in particular, to a photosensitive component, an imaging module, an intelligent terminal, and a method and a mold for manufacturing the photosensitive component.
  • Molded camera module is a highly popular high-tech in the current market. Molding replaces the general lens holder, and the sensor chip, connecting medium and electronic components of the camera module are coated on the circuit board. , achieved good impact stability and thermal stability. At the same time, the upper surface of the molding is very flat, which can improve the mounting tilt accuracy of the lens or motor above the chip. However, the flat upper surface also brings new problems. Molding the upper lens or motor still requires the application of glue and curing of the glue by drastic changes in the external environment such as exposure or heating. On the one hand, the glue has a certain fluidity.
  • the glue at the bottom of the element is pressed to overflow in all directions, and the applied glue needs to be a closed ring, due to the conventional
  • the upper edge of the molding part is completely flat, and only the beveled or vertical side of the drafting mold cannot accommodate the glue overflowing at the starting point of the glue, and the excess glue will overflow to the side of the module and protrude outward, so that the size of the module Beyond the design range, affecting installation and use.
  • the flat surface for mounting the optical component in the molding portion is also getting smaller and smaller, and at the same time, how to maintain the tilt accuracy of the lens or the motor It is also an urgent problem to solve the problem that miniaturization of the camera module while providing a large mounting plane on the molding portion.
  • a photosensitive assembly comprising: a wiring board having a rectangular shape hard board region and including a soft board extension extending from the hard board region, wherein the hard The plate region has a press-fit side having a nip area on the press-fit side, the soft plate extending portion extending from the press-fit side, and a photosensitive member mounted on the press-fit side a hard plate region of the wiring board; and a molding portion formed on the hard plate region, surrounding the photosensitive member and extending toward the photosensitive member and contacting the photosensitive member, the molding portion having an inner side surface, An outer side surface and a top surface, and the molding portion does not cover a nip area of the hard plate region, the top surface having a flat portion; wherein a top surface of a portion of the molding portion on the pressing side a sedimentation portion located between the flat portion and the outer side surface of the molded portion and lower than the flat portion, and a portion of the molded portion on the non-pressing
  • contour of the first section of the settling portion has a first arc shape, wherein the first section is perpendicular to an edge of the hard plate region on the pressing side.
  • the molding portion includes a connection portion connecting the inner side surface and the flat portion.
  • contour of the second cross section of the connecting portion has a second arc shape, wherein the second cross section is perpendicular to the flat portion and the inner side surface adjacent to the connecting portion, and the The length of an arcuate shape is greater than the length of the second arcuate shape.
  • contour of the second cross section of the connecting portion has a second arc shape, wherein the second cross section is perpendicular to the flat portion and the inner side surface adjacent to the connecting portion, and the The radius of curvature of an arcuate shape is greater than the radius of curvature of the second arcuate shape.
  • top surface of the molding portion has a recess adjacent to the connecting portion, the contour of the third section of the recess having a right angle shape having a flatness parallel to the molding portion a side of the portion, wherein the third section is perpendicular to an inner side surface and a top surface of the molding portion.
  • the outer surface of the molding portion has a recess adjacent to the settling portion, and the contour of the third section of the recess has an arc shape, a right angle shape, or a diagonal shape, wherein the The three sections are perpendicular to the edge of the hard plate region on the press side.
  • the molding portion has an opening that exposes the photosensitive member.
  • the inner side surface of the molding portion is at an obtuse angle with a top surface of the photosensitive member.
  • the inner side surface of the molding portion is directly connected to a top surface of the photosensitive member.
  • an imaging module comprising the above-described photosensitive member and an optical assembly mounted on the photosensitive member.
  • optical component is connected to the top surface of the molding portion by an adhesive, wherein the adhesive is present on the settling portion.
  • the optical component comprises a filter component, a lens component, and a driving component.
  • the optical component comprises a lens component that is connected to a flat portion of the top surface of the molding portion by an adhesive.
  • an intelligent terminal including the imaging module described above.
  • a method of manufacturing a photosensitive member comprising: mounting a plurality of photosensitive elements on a plurality of wiring boards in a wiring board panel, respectively, the plurality of wiring boards Arranging in an array form and including a hard plate region having a press-fit side and a non-press-fit side, the hard plate region having a press-fit area on the press-fit side; attaching the flexible film to the mold, wherein The mold has a plurality of rams arranged in an array and a cavity portion surrounding the plurality of rams, the cavity portion having a side surface and a flat top surface, the side surface and the top surface Forming an open space with the indenter; pressing a mold to which the flexible film is attached on the circuit board panel on which the photosensitive element is mounted, such that each of the indenter and the plurality of photosensitive elements are respectively Aligned, and the flexible film is in contact with a nip area of each of the hard plate regions; injecting a molding
  • attaching the flexible film to the mold comprises attaching the flexible film to the mold by drawing a gas between the flexible film and the mold.
  • the mold has a protrusion at a boundary between a top surface and a side surface of the cavity portion.
  • the outline of the first section of the protrusion has an arc shape, a diagonal line or a right angle shape, wherein the first section and the corresponding hard board area are perpendicular to an edge of the pressing side.
  • a top surface of the cavity portion includes a protrusion at a position closest to the indenter.
  • the protrusion has a bottom surface and a side surface, wherein the bottom surface is parallel to a top surface of the cavity portion.
  • a side surface of the indenter forms an obtuse angle with a top surface of the cavity portion.
  • a molding die characterized by comprising a plurality of embossing heads arranged in an array and a cavity portion surrounding the plurality of embossing heads, the cavity portion having A side surface and a flat top surface, the side surface and the top surface forming an open space with the indenter.
  • the molding die has a protrusion at a boundary between a top surface and a side surface of the cavity portion.
  • the outline of the first section of the protrusion has an arc shape, a diagonal line or a right angle shape, wherein the first section and the top surface of the illustrated cavity portion are perpendicular to the side surface.
  • top surface of the cavity portion includes a protrusion at a position closest to the indenter.
  • the protrusion has a bottom surface and a side surface, wherein the bottom surface is parallel to a top surface of the cavity portion.
  • a side surface of the indenter forms an obtuse angle with a top surface of the cavity portion.
  • the photosensitive member provided by the present disclosure and the photosensitive member manufactured by the method of the present disclosure can provide a large overflow space for the photosensitive member to have a stable outer size, and provide the largest possible portion in the molding portion while providing the overflow space.
  • a flat top surface that facilitates automatic alignment of the components mounted thereon and enhances the lateral bond strength of the components mounted above.
  • FIG. 1 is a top plan view of a photosensitive assembly in accordance with an embodiment of the present disclosure
  • FIG. 2 is a cross-sectional view of the photosensitive member taken along line I-I' of FIG. 1 in accordance with an embodiment of the present disclosure
  • FIG. 3 illustrates an exploded perspective view of a photosensitive assembly in accordance with an embodiment of the present disclosure
  • FIG. 4 illustrates a cross-sectional view of the photosensitive member taken along line I-I' of FIG. 1 according to an exemplary embodiment of the present disclosure
  • FIG. 5 illustrates a cross-sectional view of the photosensitive member taken along line I-I' of FIG. 1 according to an exemplary embodiment of the present disclosure
  • FIG. 6 illustrates an imaging module in accordance with an embodiment of the present disclosure
  • FIG. 7 illustrates a perspective view of a molding die in accordance with an embodiment of the present disclosure
  • FIG. 8-10 illustrate cross-sectional views of a molding die taken along line II-II' in Fig. 7 in accordance with an embodiment of the present disclosure
  • FIG. 11 shows a flow chart of a method of manufacturing a photosensitive member in accordance with an embodiment of the present disclosure
  • FIG. 12 illustrates a circuit board panel mounted with a plurality of circuit boards in accordance with an embodiment of the present disclosure
  • FIG. 13 illustrates a cross-sectional view of a molding die to which a flexible film is adsorbed according to an embodiment of the present disclosure
  • FIG. 14 illustrates an illustration of a wiring board panel and a molding die after pressing a mold on a wiring board panel according to an embodiment of the present disclosure
  • FIG. 15 illustrates an illustration of filling a molding material in a confined space between a mold and a wiring board panel in accordance with an embodiment of the present disclosure
  • FIG. 16 illustrates a diagram of a photosensitive member after removal of a mold and a flexible film, in accordance with an embodiment of the present disclosure
  • Figure 17 shows a diagram of obtaining a single photosensitive member from a wiring board by cutting.
  • first, second, etc. are used to distinguish one feature from another, and do not represent any limitation of the feature.
  • first subject discussed below may also be referred to as a second subject, without departing from the teachings of the present application.
  • FIG. 1 shows a top view of a photosensitive assembly according to an embodiment of the present disclosure
  • FIG. 2 shows a cross-sectional view of the photosensitive assembly taken along line II' of FIG. 1 according to an embodiment of the present disclosure
  • FIG. 3 shows An exploded perspective view of the photosensitive member of FIG. 1 in accordance with an embodiment of the present disclosure.
  • the photosensitive member 100 includes a wiring board 101, a photosensitive member 102, and a molding portion 103.
  • the wiring board 101 may have a multi-layered structure, for example, a multilayer structure in which a hard board, a soft board, and a hard board are stacked in this order, but the present disclosure is not limited thereto.
  • the circuit board 101 includes a rectangular hard board area 104 and a soft board extending portion 105 extending from one side of the hard board area 104.
  • the side to which the soft board extending portion 105 is connected may be referred to as a soft board.
  • the soft board extension 105 extends in the Y-axis direction, and the soft board side of the hard board area 104 extends along the X-axis.
  • the other side of the hard-board area 104 to which the soft board extension 105 is not connected may be referred to as a non-soft board. side.
  • the wiring board 101 has a nip area 108 on the soft board side of the hard board region 104, which is located on the soft board side of the wiring board 101, and is not covered by the molding portion 103. .
  • the photosensitive member 102 may be mounted on the wiring board 101, for example, may be installed at a central position of the hard board region 104, but the present disclosure is not limited thereto. Photosensitive element 102 can be used to convert light into an electrical signal.
  • a molding portion 103 may be formed on the hard plate region 104, surround the photosensitive member 102 and extend toward the photosensitive member 102 and contact the photosensitive member 102. Further, the molding portion 103 has an inner side surface S1031, an outer side surface S1032, and a top surface S1033 (refer to FIG. 3), and the molding portion 103 does not cover the nip region 108, and the top surface S1033 has a flat portion 106 which is A flat portion in the top surface S1033 of the molded portion 103 for mounting a component such as a lens assembly or a filter assembly that requires high stability and flatness of the mounting plane.
  • the flat portion 106 on the portion of the molding portion 103 extending in the X-axis direction is shown in Fig. 2, the flat portion 106 may be present on the top surface S1033 of the molding portion 103 around the photosensitive member 102.
  • the inner side surface S1031 and the outer side surface S1032 of the molded portion 103 surround the photosensitive member 102.
  • the top surface S1033 of the portion of the molding portion 103 on the pressing side has a sedimentation portion 107 which is located between the flat portion 106 and the outer side surface S1032 of the top surface S1033 and lower than the flat portion 106.
  • FIG. 2 shows an enlarged view of the settling portion 107, which may be a portion between the point a and the point b, wherein the point a is the plane of extension of the outer side surface S1032 (from which it is inclined with respect to the Z axis)
  • the dotted line indicates the position at which the molding portion 103 intersects
  • the point b is the position at which the flat portion 106 extends (indicated by a broken line parallel to the Y-axis in the portion A of Fig. 2) and the molding portion 103.
  • the settling portion 107 is lower than the flat portion 106, when the optical component is mounted on the molding portion 103 by an adhesive, the sedimentation portion 107 can accommodate the adhesive that overflows between the flat portion 106 and the optical component, By the action of the overflow tank, the settling portion 107 can provide a large overflow space so that the photosensitive member 100 can have a stable outer size.
  • the molded portion 103 may have a chevron shape with an opening in the middle of the molded portion 103 to expose the photosensitive member 102.
  • the molding portion 103 may not have the sedimentation portion 107, and the outer side surface S1032 of the molding portion 103 is perpendicular to the flat portion 106.
  • the outer side surface S1032 of the molding portion 103 is perpendicular to the flat portion 106.
  • the outer side surface S1032 of the molding portion 103 may be perpendicular to the flat portion 106 in a portion of the molding portion 103 corresponding to at least two of the non-pressing sides. This arrangement can provide as large a flat top surface as possible while a portion of the top surface has a settling portion to accommodate the overflow.
  • the contour of the settling portion 107 can have a first arcuate shape that can have a first length, ie, an arc length from point a to point b.
  • connection portion 109 connecting the both between the flat portion 106 of the molded portion 103 and the inner side surface S1031, and as described above, the flat portion 106 and the inner side surface S1031 surround the photosensitive member 102, Therefore, the connecting portion 109 can also surround the photosensitive member 102.
  • the connecting portion 109 may be a portion between the c point and the d point, wherein the c point is a position at which the extending plane of the flat portion 106 intersects the molding portion 103, and the d point is The position where the extending plane of the inner side surface S1031 intersects with the molding portion 103.
  • the connecting portion 109 has a second arc shape having a second length, that is, an arc length from point c to point d.
  • the settling portion 107 may have a first radius of curvature
  • the connecting portion 109 may have a second radius of curvature
  • the first arc length can be greater than the second arc length, or the first radius of curvature can be greater than the second radius of curvature.
  • the first arc shape and the second arc shape may be part of a circle or have a varying radius of curvature, when the first arc shape or the second arc shape has a varying radius of curvature due to manufacturing processes and errors, etc.
  • a radius of curvature or a second radius of curvature may be the average radius of curvature.
  • the surface of the molded portion 103 composed of the settling portion 107, the flat portion 106 and the connecting portion 109 is such that the fluid is more inclined thereto
  • the tension of the fluid at the settling portion 107 is smaller and tends to flow toward the settling portion 107.
  • FIG. 4 is a cross-sectional view showing the photosensitive member taken along line I-I' in FIG. 1 according to an exemplary embodiment of the present disclosure.
  • the outer side surface S1032 of the molding portion 103 may have a recess portion 110 adjacent to the settling portion 107.
  • the enlarged views A-C in Fig. 4 show three embodiments of the recess 110, respectively.
  • the cross-sectional profile of the recess 110 may have a right angle shape, an arc shape, or a diagonal shape.
  • the outer side surface S1032 of the molded portion 103 further includes a recess 110 that can provide a larger spill space to better accommodate the adhesive flowing between the molded portion 103 and the optical member mounted thereon during the manufacturing process.
  • FIG. 5 illustrates a cross-sectional view of the photosensitive member taken along line II' of FIG. 1 according to an exemplary embodiment of the present disclosure, wherein the enlarged view A in FIG. 5 corresponds to the virtual view in the lower cross-sectional view of FIG. The part of the coil.
  • the top surface S1033 of the molded portion 103 has a depressed portion 111 adjacent to the connecting portion 109, and the cross-sectional profile of the depressed portion 111 may have a right-angled shape having a flat portion 106 parallel to the molded portion 103. side. That is, the depressed portion 111 has a platform parallel to the flat portion 106 for mounting an optical element such as a filter assembly that requires high flatness and stability.
  • the inner side surface S1031 of the molded portion 103 may be at an obtuse angle with the top surface of the photosensitive member 102, such that the inner side surface S1031 of the molded portion 103 may direct light incident thereon The direction of the photosensitive member 102 is reflected, so that stray light incident on the photosensitive member 102 can be effectively reduced.
  • the inner side surface S1031 of the molded portion 103 may be directly connected to the top surface of the photosensitive member 102, in this case, due to the inner side surface S1031 of the molded portion 103 and the top surface of the photosensitive member 102 There is no intermediate member therebetween, and the thickness and volume of the photosensitive member 100 can be reduced.
  • FIG. 6 illustrates an imaging module in accordance with an embodiment of the present disclosure.
  • the imaging module 600 includes the photosensitive assembly 100 described with reference to FIGS. 1 through 5 and an optical assembly 601 mounted on the photosensitive assembly 100.
  • the optical component 601 is coupled to the top surface of the molding portion 103 of the photosensitive member 100 by an adhesive 602, which may be a filter assembly, a lens assembly, a driving member such as a motor, or the like.
  • the enlarged view A in Fig. 6 corresponds to the portion in the right portion of Fig. 6 which is broken with a dotted line. Referring to the enlarged view A in FIG.
  • the adhesive 602 may be present on the settling portion 107 of the molding portion 103 due to the action of the overflow groove of the sediment portion 107.
  • the optical assembly 601 is a lens assembly
  • the optical assembly 601 is coupled to the flat portion of the molding portion 103 by the adhesive 602 because the lens assembly requires a high degree of flatness for the mounting plane.
  • the mounting area of the lens assembly is increased, and the mounting plane of the lens assembly can be completely carried.
  • the above-described imaging module 600 can be used in a smart terminal, for example, for a smartphone, a tablet, and a wearable device such as a smart watch, but the present disclosure is not limited thereto.
  • the imaging module 600 can be included in the camera of the smart phone.
  • the molding die 700 used in the method will first be described.
  • FIG. 7 shows a perspective view of a molding die 700 in accordance with an embodiment of the present disclosure.
  • Fig. 8 shows a cross-sectional view of a molding die 700 taken along line II-II' in Fig. 7 in accordance with an embodiment of the present disclosure.
  • the molding die 700 may include a plurality of embossing heads 701 arranged in an array and a cavity portion 702 surrounding the plurality of embossing heads 701.
  • the cavity portion 702 has a side surface S7021 and a flat top surface S7022, and the side surface S7021 and the top surface S7022 form an open space with the indenter 701. It should be noted that, for convenience of explanation, the upper direction of FIG.
  • the top surface S7022 of the cavity portion 702 and the side surface S7021 and the side surface S7011 of the ram 701 together form a shape corresponding to the portion of the molding portion 103 on the nip side in Fig. 2.
  • the side surface S7011 of the indenter 701 is at an obtuse angle to the top surface S7022 of the cavity portion 702 for forming the molding portion 103 shown in FIG. 2 at an obtuse angle to the top surface of the photosensitive member 102.
  • FIG. 9 illustrates a cross-sectional view of a molding die 700 taken along line II-II' in FIG. 7 perpendicular to the top surface S7022 and the side surface S7021 of the cavity portion 702, in accordance with an embodiment of the present disclosure.
  • the molding die 700 has a projection 704 at the boundary between the top surface S7022 and the side surface S7021 of the cavity portion 702.
  • the cross-sectional profile of the protrusion 704 may have an arcuate, oblique or right-angled shape, wherein in the cross-sectional view including the indenter 701 and the cavity portion 702 in FIG. 9, the cross-sectional profile of the protrusion 704 is shown.
  • a projection 704 having a cross-sectional profile of an arc shape and a diagonal shape is shown in enlarged views A and B in the lower portion of FIG.
  • the protrusion 704 having a right-angled shape is used to manufacture the recessed portion 110 shown in the enlarged view A of FIG. 4, and the protruding portion 704 having the cross-sectional profile of the curved shape and the oblique line shape is used to manufacture the enlarged view B of FIG. 4 and The recess 110 shown in C.
  • FIG. 10 illustrates a cross-sectional view of a molding die 700 taken along line II-II' in FIG. 7 in accordance with an embodiment of the present disclosure.
  • an enlarged view of the projection 705 is shown in enlarged view A of Figure 10, with the top surface S7022 of the cavity portion 702 including a projection 705 at the nearest neighbor embossing 701, the projection 705 having a bottom surface S7051 and side Surface S7052, wherein the bottom surface S7051 is parallel to the top surface S7022 of the cavity portion 702.
  • This projection 705 is used to form the recess 111 shown in FIG.
  • the protrusions 705 may surround the indenter 701.
  • FIG. 11 shows a flow chart of a method 1100 of fabricating a photosensitive assembly 100. As shown in FIG. 11, a method 1100 of fabricating a photosensitive assembly 100 can include steps 1101-1106.
  • a plurality of photosensitive elements are respectively mounted on a plurality of circuit boards in the board layout.
  • Figure 12 shows a circuit board panel 1200 having a plurality of circuit boards 1201, wherein the circuit boards 1201 are arranged in an array and include a hard board area 104 (see Figure 3) having a press side and a non-press On the side, a part of the wiring board 1201 arranged in an array is shown by a broken line in FIG.
  • the circuit board 1201 can be a hard and soft bond board.
  • a flexible film is attached to the mold, wherein the mold can be the mold 700 described with reference to Figures 7-10.
  • FIG. 13 shows a cross-sectional view of a molding die 700 in which the flexible film 1301 is adsorbed, which may correspond to a cross-sectional view of the molding die 700 shown in FIG.
  • the flexible film 1301 can be attached to the molding die 700 by vacuum suction.
  • the gas between the flexible film 1301 and the molding die 700 can be evacuated to form a vacuum, thereby attaching the flexible film 1301 to the molding die 700 and forming a corresponding surface to the bottom surface of the molding die 700. shape.
  • the flexible film 1301 at the boundary between the side surface S7021 of the cavity portion 702 and the top surface S7022 may form a lower surface having an arc shape, the lower surface of the arc will
  • the aforementioned sedimentation portion 107 is formed, and the sedimentation portion 107, the flexible film 1301 also at the boundary between the top surface S7022 of the cavity portion 702 and the side surface S7011 of the indenter 701 can also form a lower surface having an arc shape.
  • step 1103 the mold to which the flexible film is attached is pressed against the wiring board panel on which the photosensitive member is mounted, so that each of the indenters and the plurality of photosensitive elements are respectively aligned, and the pressure of the flexible film and each of the hard plate regions is performed. Contact with the area.
  • FIG. 14 shows a diagram of the wiring board 1200 and the molding die 700 after the step 1103 is performed. As shown in FIG. 14, a plurality of rams 701 are respectively aligned with the photosensitive member 102, and the cavity portion 702 presses the flexible film 1301 at the nip region 108 such that the flexible film 1301 contacts the nip region 108, and the ram 701 is pressed. The flexible film 1301 causes the flexible film 1301 to contact the photosensitive member 102 such that a sealed space is formed between the molding die 700 to which the flexible film 1301 is attached and the wiring board assembly 1200.
  • step 1104 a molding material is injected into a space defined by a mold to which the flexible film is attached and a wiring board panel on which a plurality of photosensitive members are mounted to form a molded portion.
  • Fig. 15 shows a view in which the molding material 1501 is filled into the above-described sealed space, in which the molding material 1501 has a shape corresponding to the sealed space.
  • step 1105 the mold and flexible film are removed.
  • FIG. 16 shows a view after the molding die 700 and the flexible film 1301 are removed from the configuration shown in FIG. 15, in which the molding portion 103 is formed on the wiring board 1200 on which the photosensitive member 102 is mounted.
  • the photosensitive member is formed by cutting the molding portion and the wiring board at at least two non-pressing sides of each of the wiring boards in a direction perpendicular to the top surface of the wiring board.
  • Figure 17 shows a diagram of obtaining a single photosensitive component 100 from a circuit board panel by cutting. Referring to FIG. 17, the single photosensitive member 100 shown at the bottom of FIG. 17 is perpendicular to the wiring board 1200 at the three non-pressing sides of the photosensitive member 100 (ie, the three sides to which the flexible board extension is not connected).
  • both sides of the photosensitive assembly 100 can also be cut, for example, when the photosensitive assembly 100 at the four corners of the board panel is cut.
  • the flexible board extension of the photosensitive member 100 is connected to the outer frame of the circuit board assembly 1200 through a narrow connection portion, and the photosensitive member 100 is adjacent to the photosensitive member 100 on the non-pressing side of the photosensitive member 100.
  • the connection portion of the assembly is wider than the narrow connection portion because in the molding process, in order to form the molded portion 103, a flow path is required for the flow of the molding material, and the connection portion between the photosensitive members 100 functions from To the flow channel.
  • the photosensitive member 100 formed by the method of the present disclosure is particularly suitable for a miniaturized image forming apparatus in which the area of the flat portion of this portion is reduced and miniaturized in the case where the molded portion at the press-fit side has a sedimentation portion.
  • the area of the flat portion for mounting the optical component is invaluable, and the photosensitive member 100 in the present disclosure makes the flat portion by making the outer side surface of the molded portion perpendicular to the flat portion on the non-pressing side Maximize the area.
  • the shape of the top surface formed by the sedimentation portion of the molding portion together with the flat portion and the connecting portion makes the adhesive located thereon more tend to flow toward the sedimentation portion, which can prevent the adhesive from flowing to the photosensitive member side and cause the photosensitive member to be generated. malfunction.

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Abstract

公开了感光组件、成像模组、智能终端及制造感光组件的方法和模具。感光组件包括：线路板，具有矩形形状的硬板区域且包括从硬板区域延伸的软板延伸部，其中，硬板区域具有压合侧和非压合侧，硬板区域在压合侧具有压合区域；感光元件，安装在线路板的硬板区域中；以及模塑部，形成在硬板区域上，围绕感光元件并向感光元件延伸且接触感光元件，模塑部具有内侧表面、外侧表面和顶表面，且模塑部不覆盖硬板区域的压合区域，顶表面具有平坦部；其中，模塑部在压合侧的部分的顶表面具有沉降部，沉降部位于平坦部与模塑部的外侧表面之间并低于平坦部，以及模塑部在非压合侧的部分的外侧表面与平坦部垂直。

Description

感光组件、成像模组、智能终端及制造感光组件的方法和模具
相关申请的交叉引用
本申请要求于2017年8月18日向中国国家知识产权局提交的第201710712589.1号和201721042380.0号中国专利申请的优先权和权益，该申请的全部内容通过引用并入本文。
技术领域
本公开涉及成像组件及智能终端技术领域，具体地，涉及感光组件、成像模组、智能终端及制造感光组件的方法和模具。
背景技术
模塑摄像模组是当前市场中非常受热捧的一项高新技术，模塑取代了一般的镜座，将摄像模组的感光芯片，连接介质和电子元器件都包覆固定在线路板上，获得了很好的冲击稳定性和热稳定性。同时模塑上表面非常平整，可以很好地提高芯片上方镜头或马达的安装倾斜精度。但是，平整的上表面也带来了新的问题。模塑上方镜头或马达仍然需要施加胶水并通过曝光或加热等外部环境的剧烈变化来使胶水固化。一方面，胶水具有一定的流动性，在施加胶水后安装所述镜头或马达等元件时，所述元件底部的胶水受压会向各个方向溢出，同时施加的胶水需要成闭合的环形，由于常规模塑部上边缘完全平坦，仅依靠拔模的斜边或垂直边不能容纳胶水起始点大量溢出的胶水，多余的胶水就会溢到模组的侧面并向外凸出，使模组的尺寸超出设计范围，影响安装和使用。
另外，随着摄像模组的小型化，模塑部中用于安装光学组件的平坦表面也随之越来越小，同时，由于镜头或马达等对安装倾斜精度要求较高，所以如何在保持摄像模组小型化的同时在模塑部上尽可能提供较大的安装平面也是急需解决的问题。
发明内容
根据本公开的一个方面，提供了一种感光组件，其特征在于，包括：线路板，具有矩形形状的硬板区域且包括从所述硬板区域延伸的软板延伸部，其中，所述硬板区域具有压合侧和非压合侧，所述硬板区域在所述压合侧具有压合区域，所述软板延伸部从所述压合侧延伸出；感光元件，安装在所述线路板的硬板区域中；以及模塑部，形成在所述硬板区域上，围绕所述感光元件并向所述感光元件延伸且接触所述感光元件，所述模塑部具有内侧表面、外侧表面和顶表面，且所述模塑部不覆盖所述硬板区域的压合区域，所述顶表面具有平坦部；其中，所述模塑部在所述压合侧的部分的顶表面具有沉降部，所述沉降部位于所述平坦部与所述模塑部的所述外侧表面之间并低于所述平坦部，以及所述模塑部在所述非压合侧的部分的外侧表面与所述平坦部垂直。
其中，所述沉降部的第一截面的轮廓具有第一弧形形状，其中，所述第一截面与所述硬板区域在压合侧的边缘垂直。
其中，所述模塑部包括连接所述内侧表面与所述平坦部的连接部。
其中，所述连接部的第二截面的轮廓具有第二弧形形状，其中，所述第二截面垂直于与所述连接部相邻的所述平坦部与所述内侧表面，且所述第一弧形形状的长度大于所述第二弧形形状的长度。
其中，所述连接部的第二截面的轮廓具有第二弧形形状，其中，所述第二截面垂直于与所述连接部相邻的所述平坦部与所述内侧表面，且所述第一弧形形状的曲率半径大于所述第二弧形形状的曲率半径。
其中，所述模塑部的顶表面具有与所述连接部相邻的凹陷部，所述凹陷部的第三截面的轮廓具有直角形状，所述直角形状具有平行于所述模塑部的平坦部的边，其中，所述第三截面与所述模塑部的内侧表面和顶表面垂直。
其中，所述模塑部的外侧表面具有与所述沉降部相邻的凹陷部，所述凹陷部的第三截面的轮廓具有弧形形状、直角形状、或斜线形状，其中，所述第三截面与所述硬板区域在压合侧的边缘垂直。
其中，所述模塑部具有暴露所述感光元件的开口。
其中，所述模塑部的所述内侧表面与所述感光元件的顶表面成钝角。
其中，所述模塑部的所述内侧表面与所述感光元件的顶表面直接连接。
根据本公开的另一方面，提供了一种成像模组，其特征在于，包括上述的感光组件以及安装在所述感光组件上的光学组件。
其中，所述光学组件通过粘合剂与所述模塑部的所述顶表面连接，其中，在所述沉降部上存在所述粘合剂。
其中，所述光学组件包括滤光组件、镜头组件、驱动元件。
其中，所述光学组件包括镜头组件，所述镜头组件通过粘合剂与所述模塑部的所述顶表面的平坦部连接。
根据本公开的另一方面，提供了一种智能终端，包括上述的成像模组。
根据本公开的另一方面，提供了一种制造感光组件的方法，其特征在于，包括：将多个感光元件分别安装在线路板拼板中的多个线路板上，所述多个线路板以阵列形式布置且包括硬板区域，所述硬板区域具有压合侧和非压合侧，所述硬板区域在所述压合侧具有压合区域；将柔性膜附着在模具上，其中，所述模具具有以阵列形式布置的多个压头以及围绕所述多个压头的形腔部，所述形腔部具有侧表面和平坦的顶表面，所述侧表面和所述顶表面与所述压头形成开放空间；将附着有所述柔性膜的模具压在安装有所述感光元件的所述线路板拼板上，使得每个所述压头与所述多个感光元件分别对准，且所述柔性膜与每个所述硬板区域的压合区域接触；将模塑材料注入至由附着有所述柔性膜的所述模具与安装有所述多个感光元件的所述线路板拼板限定的空间中以形成模塑部，所述模塑部具有与所述空间对应的形状；将所述模具与所述柔性膜移除；以及通过沿垂直于所述线路板拼板顶表面的方向切割每个所述线路板的至少两个非压合侧处的所述模塑部和所述线路板，以形成所述感光组件。
其中，将柔性膜附着在所述模具上包括：通过抽吸所述柔性膜与所述模具之间的气体以将所述柔性膜附着在所述模具上。
其中，所述模具具有位于所述形腔部的顶表面和侧表面交界处的突出部。
其中，所述突出部的第一截面的轮廓具有弧形、斜线或直角形状， 其中，所述第一截面和对应的所述硬板区域在所述压合侧的边缘垂直。
其中，在所述模具中，所述形腔部的顶表面在最邻近所述压头处包括突出部。
其中，所述突出部具有底表面和侧表面，其中，所述底表面与所述形腔部的顶表面平行。
其中，所述压头的侧表面与所述形腔部的顶表面形成钝角。
根据本公开的另一方面，提供了一种模塑模具，其特征在于，包括具有以阵列形式布置的多个压头以及围绕所述多个压头的形腔部，所述形腔部具有侧表面和平坦的顶表面，所述侧表面和所述顶表面与所述压头形成开放空间。
其中，所述模塑模具具有位于所述形腔部的顶表面和侧表面交界处的突出部。
其中，所述突出部的第一截面的轮廓具有弧形、斜线或直角形状，其中，所述第一截面和所示形腔部的所述顶表面和所述侧表面垂直。
其中，所述形腔部的顶表面在最邻近所述压头处包括突出部。
其中，所述突出部具有底表面和侧表面，其中，所述底表面与所述形腔部的顶表面平行。
其中，所述压头的侧表面与所述形腔部的顶表面形成钝角。
本公开提供的感光组件以及利用本公开的方法制造的感光组件可以提供较大的溢胶空间以使得感光组件具有稳定的外部尺寸，以及在提供溢胶空间的同时在模塑部提供尽可能大的平坦顶表面，该平坦的顶表面可以便于其上方安装的部件的自动对准，以及加强上方安装的部件的横向结合强度。
附图说明
在附图中示出示例性实施方式。本文中公开的实施方式和附图应被视作说明性的，而非限制性的。在附图中：
图1是根据本公开实施方式的感光组件的俯视图；
图2是根据本公开实施方式的沿图1中的线I-I’截取的感光组件的截面图；
图3示出了根据本公开实施方式的感光组件的分解立体图；
图4示出了根据本公开示例性实施方式的沿图1中的线I-I’截取的感光组件的截面图；
图5示出了根据本公开示例性实施方式的沿图1中的线I-I’截取的感光组件的截面图；
图6示出了根据本公开实施方式的成像模组；
图7示出了根据本公开实施方式的模塑模具的立体图；
图8-10示出了根据本公开实施方式的沿图7中的线II-II’截取的模塑模具的截面图；
图11示出了根据本公开实施方式的制造感光组件的方法的流程图；
图12示出了根据本公开实施方式的安装有多个线路板的线路板拼板；
图13示出了根据本公开实施方式的吸附有柔性膜的模塑模具的截面图；
图14示出了根据本公开实施方式的在将模具压在线路板拼板上之后的线路板拼板和模塑模具的示图；
图15示出了根据本公开实施方式的在模具与线路板拼板之间的密闭空间中填充模塑材料的示图；
图16示出了根据本公开实施方式的移除模具和柔性膜之后感光组件的示图；以及
图17示出了通过切割方式从线路板拼板上获得单个感光组件的示图。
具体实施方式
为了更好地理解本申请，将参考附图对本申请的各个方面做出更详细的说明。应理解，这些详细说明只是对本申请的示例性实施方式的描述，而非以任何方式限制本申请的范围。在说明书全文中，相同的附图标号指代相同的元件。表述“和/或”包括相关联的所列项目中的一个或多个的任何和全部组合。
应注意，在本说明书中，第一、第二等的表述仅用于将一个特征 与另一个特征区分开来，而不表示对特征的任何限制。因此，在不背离本申请的教导的情况下，下文中讨论的第一主体也可被称作第二主体。
在附图中，为了便于说明，已稍微夸大了物体的厚度、尺寸和形状。附图仅为示例而并非严格按比例绘制。
还应理解的是，用语“包括”、“包括有”、“具有”、“包含”和/或“包含有”，当在本说明书中使用时表示存在所陈述的特征、整体、步骤、操作、元件和/或部件，但不排除存在或附加有一个或多个其它特征、整体、步骤、操作、元件、部件和/或它们的组合。此外，当诸如“...中的至少一个”的表述出现在所列特征的列表之后时，修饰整个所列特征，而不是修饰列表中的单独元件。此外，当描述本申请的实施方式时，使用“可以”表示“本申请的一个或多个实施方式”。并且，用语“示例性的”旨在指代示例或举例说明。当元件或层被称为位于另一元件或层“上”、“连接到”或“联接到”另一元件或层时，其可以直接位于另一元件或层上、直接连接到或直接联接到另一元件或层，或者可存在中间元件或中间层。然而，当元件或层被称为“直接”位于另一元件或层“上”、“直接连接到”或“直接联接到”另一元件或层时，则不存在中间元件或中间层。
如在本文中使用的，用语“基本上”、“大约”以及类似的用语用作表近似的用语，而不用作表程度的用语，并且旨在说明将由本领域普通技术人员认识到的、测量值或计算值中的固有偏差。
诸如“下面”、“下方”、“下部”、“上方”、“上部”等的空间相对术语可以在本文中用于描述性目的，并且从而以描述附图中所示的一个元件或特征与另一元件(多个元件)或特征(多个特征)的关系。除了附图所示的定向之外，空间相对术语旨在包括处于使用、操作和/或制造中的装置的不同定向。例如，如果附图中的装置被翻转，则被描述为在其它元件或特征“下面”或“下方”的元件将被定向在其它元件或特征“上方”。因此，示例性术语“下方”可以包括上方和下方两种定向。此外，装置可以以其它方式定向(例如，旋转90度或处于其它定向)，并且因此，本文使用的空间相对描述语被相应地解释。
除非另外限定，否则本文中使用的所有用语(包括技术用语和科学 用语)均具有与本申请所属领域普通技术人员的通常理解相同的含义。还应理解的是，用语(例如在常用词典中定义的用语)应被解释为具有与它们在相关技术的上下文中的含义一致的含义，并且将不被以理想化或过度正式意义解释，除非本文中明确如此限定。
需要说明的是，在不冲突的情况下，本申请中的实施方式及实施方式中的特征可以相互组合。下面将参考附图并结合实施方式来详细说明本申请。
图1示出了根据本公开实施方式的感光组件的俯视图，图2示出了根据本公开实施方式的沿图1中的线I-I’截取的感光组件的截面图，图3示出了根据本公开实施方式的图1中感光组件的分解立体图。参照图1-3，感光组件100包括线路板101、感光元件102以及模塑部103。
线路板101可以具有多层结构，例如，以硬板、软板和硬板的顺序堆叠的多层结构，但本公开不限于此。如图3所示，线路板101包括矩形的硬板区域104以及从硬板区域104的一侧延伸出的软板延伸部105，该连接有软板延伸部105的一侧可以称为软板侧，软板延伸部105沿Y轴方向延伸，以及硬板区域104的软板侧沿X轴延伸，另外，硬板区域104的未连接软板延伸部105的其它侧可以称为非软板侧。此外，如图1和2所示，线路板101在硬板区域104的软板侧具有压合区域108，该压合区域108位于线路板101的软板侧，并且不被模塑部103覆盖。
感光元件102可以安装在线路板101上，例如，可以安装在硬板区域104的中央位置，但本公开不限于此。感光元件102可以用于将光转化为电信号。
参照图1和图2，模塑部103可以形成在硬板区域104上，围绕感光元件102并向感光元件102延伸且接触感光元件102。此外，模塑部103具有内侧表面S1031、外侧表面S1032和顶表面S1033(参照图3)，且模塑部103不覆盖压合区域108，并且顶表面S1033具有平坦部106，该平坦部106为模塑部103的顶表面S1033中的平坦的部分，该部分用于安装镜头组件或滤光组件等对稳定性和安装平面平坦度要求较高的组件。虽然图2中仅示出了模塑部103的沿X轴方向 延伸的部分上的平坦部106，但是平坦部106可以存在于模塑部103的位于感光元件102周围的顶表面S1033上。另外，模塑部103的内侧表面S1031以及外侧表面S1032围绕感光元件102。
参照图2，模塑部103在压合侧的部分的顶表面S1033具有沉降部107，该沉降部107位于顶表面S1033的平坦部106与外侧表面S1032之间并低于平坦部106。图2的放大视图A示出了沉降部107的放大图，沉降部107可以是a点和b点之间的部分，其中，a点为外侧表面S1032的延伸平面(由相对于Z轴倾斜的虚线表示)与模塑部103相交的位置，b点为平坦部106的延伸平面(由图2的A部分中平行于Y轴的虚线表示)与模塑部103相交的位置。由于该沉降部107低于平坦部106，当光学组件通过粘合剂安装于模塑部103上时，该沉降部107可以容纳从平坦部106和光学组件之间溢出的粘合剂，起到溢胶槽的作用，该沉降部107可以提供较大的溢胶空间，以使得感光组件100可以具有稳定的外部尺寸。
如图1和图3所示，模塑部103可以具有回字形形状，模塑部103的中间具有开口以暴露感光元件102。在模塑部103的在非压合侧的部分中，模塑部103可以不具有沉降部107，并且模塑部103的外侧表面S1032与平坦部106垂直。如图2所示，在模塑部103的在Y方向上距离压合区域108最远的部分中，模塑部103的外侧表面S1032与平坦部106垂直。在一些实施方式中，在模塑部103的与非压合侧中的至少两个对应的部分中，模塑部103的外侧表面S1032可以与平坦部106垂直。该设置可以在顶表面的一部分具有沉降部以容纳溢胶的同时，提供尽可能大的平坦顶表面。
图2示出了根据本公开实施方式的沿图1中的线I-I’截取的感光组件的截面图，线I-I’沿Y方向延伸，垂直于硬板区域104在压合侧的边缘。在一些实施方式中，如图2所示，沉降部107的轮廓可以具有第一弧形形状，该第一弧形形状可以具有第一长度，即，从a点到b点的弧长。
此外，如图2所示，在模塑部103的平坦部106和内侧表面S1031之间存在连接该两者的连接部109，如上文所述，平坦部106和内侧 表面S1031围绕感光元件102，所以，连接部109也可以围绕感光元件102。如图2中的放大视图A中所示，连接部109可以是c点与d点之间的部分，其中，c点是平坦部106的延伸平面与模塑部103相交的位置，d点是内侧表面S1031的延伸平面与模塑部103相交的位置。在图2的截面图中，连接部109具有第二弧形形状，该第二弧形形状具有第二长度，即从c点到d点的弧长。
另外，沉降部107可以具有第一曲率半径，并且连接部109可以具有第二曲率半径。
在一些实施方式中，第一弧长可以大于第二弧长，或者第一曲率半径可以大于第二曲率半径。第一弧形形状和第二弧形形状可以是圆的一部分或具有变化的曲率半径，当第一弧形形状或第二弧形形状由于制造工艺和误差等而具有变化的曲率半径时，第一曲率半径或第二曲率半径可以是平均曲率半径。
当第一弧长大于第二弧长或者第一曲率半径大于第二曲率半径时，由沉降部107、平坦部106和连接部109共同组成的模塑部103的表面使得位于其上流体更加趋向于流向沉降部107，因为沉降部107具有更大的曲率半径和更长的长度，流体在沉降部107处的张力更小，更趋向于向沉降部107流动。
图4是示出了根据本公开示例性实施方式的沿图1中的线I-I’截取的感光组件的截面图。
参照图2至图4，模塑部103的外侧表面S1032可以具有与沉降部107相邻的凹陷部110。图4中的放大视图A-C分别示出了凹陷部110的三种实施方式。如图4中所示，凹陷部110的截面轮廓可以具有直角形状、弧形形状、或斜线形状。模塑部103的外侧表面S1032进一步包括凹陷部110可以提供更大溢胶空间，更好地容纳在制造过程中从模塑部103与安装于其上的光学元件之间流出的粘合剂。
图5示出了根据本公开示例性实施方式的沿图1中的线I-I’截取的感光组件的截面图，其中，图5中的放大视图A对应于图5下方截面图中用虚线圈出的部分。参照图5，模塑部103的顶表面S1033具有与连接部109相邻的凹陷部111，凹陷部111的截面轮廓可以具有 直角形状，该直角形状具有平行于模塑部103的平坦部106的边。即，凹陷部111具有与平坦部106平行的平台，该平台用于安装滤光组件等对平坦度和稳定性要求较高的光学元件。
再次参照图2，在一些实施方式中，模塑部103的内侧表面S1031可以与感光元件102的顶表面成钝角，如此，模塑部103的内侧表面S1031可以将入射到其上的光朝向远离感光元件102的方向反射，从而可以有效减小入射至感光元件102的杂光。另外，在一些实施方式中，模塑部103的内侧表面S1031可以与感光元件102的顶表面直接连接，在这种情况下，由于模塑部103的内侧表面S1031与感光元件102的顶表面之间不存在中间元件，可以减小感光组件100的厚度和体积。
图6示出了根据本公开实施方式的成像模组。参照图6，成像模组600包括参照图1至图5描述的感光组件100以及安装在感光组件100上的光学组件601。光学组件601通过粘合剂602与感光组件100的模塑部103的顶表面连接，其中，光学组件601可以是滤光组件、镜头组件、诸如马达的驱动元件等。图6中的放大视图A对应于图6右侧部分中用虚线圈出的部分。参照图6中的放大视图A，由于沉降部107的溢胶槽作用，粘合剂602可以存在于模塑部103的沉降部107上。在光学组件601为镜头组件时，光学组件601通过粘合剂602与模塑部103的平坦部连接，这是因为镜头组件对于安装平面的平坦度要求较高。如图6中所示，由于模塑部在非压合侧的部分中外侧表面与平坦部垂直，所以增大了镜头组件的安装面积，可以完全承载镜头组件的安装平面。
上述成像模组600可以用于智能终端中，例如，用于智能手机、平板电脑、以及诸如智能手表的可穿戴设备等，但本公开不限于此。例如，在智能终端为智能手机的情况下，成像模组600可以包括在该智能手机的摄像头中。
在详细说明制造感光组件100的方法前，首先对该方法使用的模塑模具700进行说明。
图7示出了根据本公开实施方式的模塑模具700的立体图。图8示 出了根据本公开实施方式的沿图7中的线II-II’截取的模塑模具700的截面图。参照图7和图8，模塑模具700可包括以阵列形式布置的多个压头701以及围绕多个压头701的形腔部702。形腔部702具有侧表面S7021和平坦的顶表面S7022，并且侧表面S7021和顶表面S7022与压头701形成开放空间，需要说明的是，为了便于说明，图7的上方方向和图8的上方方向是相反的，即，图7中的开放空间朝向上方，而图8中的开放空间朝向下方。在图8中，形腔部702的顶表面S7022和侧表面S7021与压头701的侧表面S7011共同构成的形状对应于图2中的模塑部103在压合侧的部分。在一些实施方式中，压头701的侧表面S7011与形腔部702的顶表面S7022成钝角，以用于形成图2中所示的与感光元件102的顶表面成钝角的模塑部103的内侧表面S1031。
图9示出了根据本公开实施方式的沿图7中的线II-II’截取的模塑模具700的截面图，该截面图垂直于形腔部702的顶表面S7022和侧表面S7021。参照图9，在该实施方式中，模塑模具700具有位于形腔部702的顶表面S7022和侧表面S7021交界处的突出部704。如图9所示，突出部704的截面轮廓可以具有弧形、斜线或直角形状，其中，在图9中包括压头701和形腔部702的截面图中，突出部704的截面轮廓示为直角形状，并且在图9下部的放大视图A和B中示出了具有弧形形状和斜线形状的截面轮廓的突出部704。具有直角形状的突出部704用于制造图4的放大视图A中示出的凹陷部110，具有弧形形状和斜线形状的截面轮廓的突出部704分别用于制造图4的放大视图B和C中示出的凹陷部110。
图10示出了根据本公开实施方式的沿图7中的线II-II’截取的模塑模具700的截面图。参照图10，图10的放大视图A中示出了突出部705的放大视图，形腔部702的顶表面S7022在最邻近压头701处包括突出部705，突出部705具有底表面S7051和侧表面S7052，其中，底表面S7051与形腔部702的顶表面S7022平行。该突出部705用于形成图5中所示的凹陷部111。虽然在图10的截面图中仅示出了突出部705位于压头701的两侧，但是，突出部705可以围绕压头701。
现将参照图11-17详细说明制造感光组件100的方法。
图11示出了制造感光组件100的方法1100的流程图。如图11所示，制造感光组件100的方法1100可以包括步骤1101-1106。
在步骤1101中，将多个感光元件分别安装在线路板拼板中的多个线路板上。图12示出了具有多个线路板1201的线路板拼板1200，其中，线路板1201以阵列形式布置且包括硬板区域104(参见图3)，硬板区域104具有压合侧和非压合侧，图12中用虚线示出了以阵列排列的部分线路板1201。在一些实施方式中，线路板1201可以是软硬结合板。
在步骤1102中，将柔性膜附着在模具上，其中，模具可以是参照图7-10描述的模塑模具700。图13示出了吸附有柔性膜1301的模塑模具700的截面图，该截面图可以对应于图8中所示的模塑模具700的截面图。可以通过真空吸附的方式将柔性膜1301附着在模塑模具700上。在这个过程中，可以将柔性膜1301与模塑模具700之间的气体抽走，以形成真空，从而将柔性膜1301附着在模塑模具700上，并形成与模塑模具700的底表面对应的形状。由于柔性膜1301自身弹性的原因，在形腔部702的侧表面S7021与顶表面S7022(参见图8)的交界处的柔性膜1301可以形成具有弧形的下表面，该弧形的下表面将形成前述的沉降部107，并使得沉降部107，同样在形腔部702的顶表面S7022与压头701的侧表面S7011交界处的柔性膜1301也可以形成具有弧形的下表面。
在步骤1103中，将附着有柔性膜的模具压在安装有感光元件的线路板拼板上，使得每个压头与多个感光元件分别对准，且柔性膜与每个硬板区域的压合区域接触。图14示出了执行步骤1103之后的线路板拼板1200和模塑模具700的示图。如图14所示，多个压头701分别与感光元件102对准，并且形腔部702在压合区域108处按压柔性膜1301，使得柔性膜1301接触压合区域108，并且压头701按压柔性膜1301，使得柔性膜1301接触感光元件102，从而使得附着有柔性膜1301的模塑模具700与线路板拼板1200之间形成密闭空间。
在步骤1104中，将模塑材料注入至由附着有柔性膜的模具与安装有多个感光元件的线路板拼板限定的空间中以形成模塑部。图15示出了将模塑材料1501填充进上述密闭空间中的示图，其中，模塑材料1501具有与密闭空间对应的形状。
在步骤1105中，将模具与柔性膜移除。图16示出了从图15中所示的配置中移除模塑模具700和柔性膜1301之后的示图，其中，模塑部103形成于安装有感光元件102的线路板拼板1200上。
在步骤1106中，通过沿垂直于线路板拼板顶表面的方向切割每个线路板的至少两个非压合侧处的模塑部和线路板以形成感光组件。图17示出了通过切割方式从线路板拼板上获得单个感光组件100的示图。参照图17，在图17下方示出的单个感光组件100是通过在感光组件100的三个非压合侧(即，未连接有软板延伸部的三侧)处垂直于线路板拼板1200的顶表面切割感光组件100得到的，在切割的过程中，线路板和模塑部被同时切割，所以最后得到的感光组件100在非压合侧具有互相垂直的平坦部106和外侧表面S1032(参见图2)。在一些实施方式中，也可以切割感光组件100的两个边，例如，在切割位于线路板拼板四个角处的感光组件100时。如图17中所示，感光组件100的软板延伸部通过一个狭窄的连接部与线路板拼板1200的外框连接，而在感光组件100的非压合侧，感光组件100与相邻感光组件的连接部宽于该狭窄的连接部，这是因为在模塑工艺中，为了形成模塑部103，需要有流道用于模塑材料的流动，而且感光组件100之间的连接部起到流道作用。
通过本公开的方法形成的感光组件100尤其适用于小型化的成像装置，在压合侧处的模塑部具有沉降部的情况下，这一部分的平坦部的面积被减小，而在小型化的成像装置中，用于安装光学组件的平坦部的面积是非常宝贵的，本公开中的感光组件100通过在非压合侧将模塑部的外侧表面制造成与平坦部垂直来使平坦部面积最大化。同时模塑部的沉降部与平坦部以及连接部共同形成的顶表面形状使得位于其上的粘合剂更加趋向于朝向沉降部流动，可以防止粘合剂流向感光元件一侧而导致感光元件发生故障。
应当理解，本文描述的示例性实施方式应仅以描述性意义考虑，并不是为了限制目的。每个示例性实施方式中的特征或方面的描述通常应被认为可用于其它示例性实施方式中的其它类似特征或方面。
尽管本文已经描述了某些示例性实施方式和实现方式，但是从该描述中，其它示例性实施方式和修改将是显而易见的。因此，本公开构思 不限于这些示例性实施方式，而是限于所提出的权利要求的更广泛的范围和各种明显的修改以及等同布置。

Claims (28)

  1. 一种感光组件，其特征在于，包括：
    线路板，具有矩形形状的硬板区域且包括从所述硬板区域延伸的软板延伸部，其中，所述硬板区域具有压合侧和非压合侧，所述硬板区域在所述压合侧具有压合区域，所述软板延伸部从所述压合侧延伸出；
    感光元件，安装在所述线路板的硬板区域中；以及
    模塑部，形成在所述硬板区域上，围绕所述感光元件并向所述感光元件延伸且接触所述感光元件，所述模塑部具有内侧表面、外侧表面和顶表面，且所述模塑部不覆盖所述硬板区域的压合区域，所述顶表面具有平坦部；
    其中，所述模塑部在所述压合侧的部分的顶表面具有沉降部，所述沉降部位于所述平坦部与所述模塑部的所述外侧表面之间并低于所述平坦部，以及
    所述模塑部在所述非压合侧的部分的外侧表面与所述平坦部垂直。
  2. 根据权利要求1所述的感光组件，其特征在于，所述沉降部的第一截面的轮廓具有第一弧形形状，其中，所述第一截面与所述硬板区域在压合侧的边缘垂直。
  3. 根据权利要求2所述的感光组件，其特征在于，所述模塑部包括连接所述内侧表面与所述平坦部的连接部。
  4. 根据权利要求3所述的感光组件，其特征在于，所述连接部的第二截面的轮廓具有第二弧形形状，其中，所述第二截面垂直于与所述连接部相邻的所述平坦部与所述内侧表面，且所述第一弧形形状的长度大于所述第二弧形形状的长度。
  5. 根据权利要求3所述的感光组件，其特征在于，所述连接部的第二截面的轮廓具有第二弧形形状，其中，所述第二截面垂直于与所述连接部相邻的所述平坦部与所述内侧表面，且所述第一弧形形状的曲率半径大于所述第二弧形形状的曲率半径。
  6. 根据权利要求4或5所述的感光组件，其特征在于，所述模塑部的顶表面具有与所述连接部相邻的凹陷部，所述凹陷部的第三截面的轮廓具有直角形状，所述直角形状具有平行于所述模塑部的平坦部的边，其中，所述第三截面与所述模塑部的内侧表面和顶表面垂直。
  7. 根据权利要求2所述的感光组件，其特征在于，所述模塑部的外侧表面具有与所述沉降部相邻的凹陷部，所述凹陷部的第三截面的轮廓具有弧形形状、直角形状、或斜线形状，其中，所述第三截面与所述硬板区域在压合侧的边缘垂直。
  8. 根据权利要求1所述的感光组件，其特征在于，所述模塑部具有暴露所述感光元件的开口。
  9. 根据权利要求1所述的感光组件，其特征在于，所述模塑部的所述内侧表面与所述感光元件的顶表面成钝角。
  10. 根据权利要求1所述的感光组件，其特征在于，所述模塑部的所述内侧表面与所述感光元件的顶表面直接连接。
  11. 一种成像模组，其特征在于，包括权利要求1-9中任一项所述的感光组件以及安装在所述感光组件上的光学组件。
  12. 根据权利要求10所述的成像模组，其特征在于，所述光学组件通过粘合剂与所述模塑部的所述顶表面连接，其中，在所述沉降部上存在所述粘合剂。
  13. 根据权利要求12所述的成像模组，其特征在于，所述光学组件包括滤光组件、镜头组件、驱动元件。
  14. 根据权利要求13所述的成像模组，其特征在于，所述光学组件包括镜头组件，所述镜头组件通过粘合剂与所述模塑部的所述顶表面的平坦部连接。
  15. 一种智能终端，其特征在于，包括权利要求11-14中任一项所述的成像模组。
  16. 一种制造感光组件的方法，其特征在于，包括：
    将多个感光元件分别安装在线路板拼板中的多个线路板上，所述多个线路板以阵列形式布置且包括硬板区域，所述硬板区域具有压合侧和非压合侧，所述硬板区域在所述压合侧具有压合区域；
    将柔性膜附着在模具上，其中，所述模具具有以阵列形式布置的多个压头以及围绕所述多个压头的形腔部，所述形腔部具有侧表面和平坦的顶表面，所述侧表面和所述顶表面与所述压头形成开放空间；
    将附着有所述柔性膜的模具压在安装有所述感光元件的所述线路板拼板上，使得每个所述压头与所述多个感光元件分别对准，且所述柔性膜与每个所述硬板区域的压合区域接触；
    将模塑材料注入至由附着有所述柔性膜的所述模具与安装有所述多个感光元件的所述线路板拼板限定的空间中以形成模塑部，所述模塑部具有与所述空间对应的形状；
    将所述模具与所述柔性膜移除；以及
    通过沿垂直于所述线路板拼板顶表面的方向切割每个所述线路板的至少两个非压合侧处的所述模塑部和所述线路板，以形成所述感光组件。
  17. 根据权利要求16所述方法，其特征在于，将柔性膜附着在所 述模具上包括：
    通过抽吸所述柔性膜与所述模具之间的气体以将所述柔性膜附着在所述模具上。
  18. 根据权利要求16所述方法，其特征在于，
    所述模具具有位于所述形腔部的顶表面和侧表面交界处的突出部。
  19. 根据权利要求18所述方法，其特征在于，所述突出部的第一截面的轮廓具有弧形、斜线或直角形状，其中，所述第一截面和对应的所述硬板区域在所述压合侧的边缘垂直。
  20. 根据权利要求16所述方法，其特征在于，
    在所述模具中，所述形腔部的顶表面在最邻近所述压头处包括突出部。
  21. 根据权利要求20所述方法，其特征在于，所述突出部具有底表面和侧表面，其中，所述底表面与所述形腔部的顶表面平行。
  22. 根据权利要求16所述方法，其特征在于，所述压头的侧表面与所述形腔部的顶表面形成钝角。
  23. 一种模塑模具，其特征在于，包括具有以阵列形式布置的多个压头以及围绕所述多个压头的形腔部，所述形腔部具有侧表面和平坦的顶表面，所述侧表面和所述顶表面与所述压头形成开放空间。
  24. 根据权利要求23所述的模塑模具，其特征在于，所述模塑模具具有位于所述形腔部的顶表面和侧表面交界处的突出部。
  25. 根据权利要求24所述的模塑模具，其特征在于，所述突出部 的第一截面的轮廓具有弧形、斜线或直角形状，其中，所述第一截面和所示形腔部的所述顶表面和所述侧表面垂直。
  26. 根据权利要求23所述的模塑模具，其特征在于，所述形腔部的顶表面在最邻近所述压头处包括突出部。
  27. 根据权利要求26所述的模塑模具，其特征在于，所述突出部具有底表面和侧表面，其中，所述底表面与所述形腔部的顶表面平行。
  28. 根据权利要求23所述的模塑模具，其特征在于，所述压头的侧表面与所述形腔部的顶表面形成钝角。
PCT/CN2018/099271 2017-08-18 2018-08-08 感光组件、成像模组、智能终端及制造感光组件的方法和模具 WO2019033961A1 (zh)

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