WO2019024141A1 - 柔性显示器件的制备方法、柔性显示器件及显示器 - Google Patents

柔性显示器件的制备方法、柔性显示器件及显示器 Download PDF

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Publication number
WO2019024141A1
WO2019024141A1 PCT/CN2017/098436 CN2017098436W WO2019024141A1 WO 2019024141 A1 WO2019024141 A1 WO 2019024141A1 CN 2017098436 W CN2017098436 W CN 2017098436W WO 2019024141 A1 WO2019024141 A1 WO 2019024141A1
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Prior art keywords
substrate
separation layer
flexible substrate
flexible
display device
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PCT/CN2017/098436
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English (en)
French (fr)
Inventor
白思航
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
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Priority to US15/735,894 priority Critical patent/US10658592B2/en
Publication of WO2019024141A1 publication Critical patent/WO2019024141A1/zh
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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to the field of semiconductor manufacturing technology, and in particular, to a method for fabricating a flexible display device, a flexible display device, and a display.
  • a commonly used flexible display device is manufactured by depositing a flexible plastic film substrate, such as a polyimide film (PI film for short), on a glass substrate to fix the flexible substrate, and then continue to deposit other layers, and finally adopt Laser laser stripping (LLO) separation method separates the glass substrate and the flexible substrate, however, the electrostatic interaction between the flexible substrate and the glass substrate is strong, and the flexible substrate is used in the process of using the existing manufacturing process. Causes electrostatic damage and affects performance.
  • PI film polyimide film
  • the technical problem to be solved by the present invention is to provide a method for preparing a flexible display device, a flexible display device and a display, which can solve the problem that the flexible substrate is easily damaged in the prior art.
  • the present invention adopts a technical solution to provide a flexible display device including: a flexible substrate and a display component disposed on a surface of the flexible substrate; wherein the flexible display device Obtaining a separation layer on one surface of the substrate; preparing a flexible substrate on the surface of the separation layer away from the substrate; preparing the display assembly on the surface of the flexible substrate away from the separation layer; separating the flexible substrate from the separation layer, Obtaining a flexible display device; the adhesion of the flexible substrate to the surface of the substrate is greater than the adhesion of the separation layer to the surface of the flexible substrate, and the adhesion of the separation layer to the surface of the substrate is greater than the adhesion of the separation layer to the surface of the flexible substrate Attaching force; wherein the flexible substrate is mechanically separated from the surface in contact with the separation layer; the display assembly comprises: an inorganic film layer, a flexible substrate, a barrier layer, a buffer layer sequentially deposited on a surface of the flexible substrate away from the separation layer
  • another technical solution adopted by the present invention is to provide a method for preparing a flexible display device, comprising: preparing a separation layer on a surface of a substrate; preparing a flexible substrate on a surface of the separation layer away from the substrate; Forming the display assembly away from the surface of the separation layer; separating the flexible substrate from the separation layer to obtain a flexible display device; wherein the adhesion of the flexible substrate to the surface of the substrate is greater than the adhesion of the separation layer to the surface of the flexible substrate The adhesion of the separation layer to the surface of the substrate is greater than the adhesion of the separation layer to the surface of the flexible substrate.
  • the flexible display device includes: a flexible substrate and a display component disposed on a surface of the flexible substrate;
  • the flexible display device is obtained by preparing a separation layer on a surface of a substrate, preparing a flexible substrate on a surface of the separation layer away from the substrate, preparing a display component on a surface of the flexible substrate away from the separation layer, and separating the flexible substrate from the surface Layer separation to obtain a flexible display device; adhesion of the flexible substrate to the surface of the substrate is greater than adhesion of the separation layer to the surface of the flexible substrate, and adhesion of the separation layer to the surface of the substrate is greater than that of the separation layer and the surface of the flexible substrate Adhesion. .
  • the present invention prepares a separation layer between the substrate and the flexible substrate, wherein the adhesion of the flexible substrate to the surface of the substrate is greater than that of the separation layer and the flexible substrate surface. Adhesion, the adhesion of the separation layer to the surface of the substrate is greater than the adhesion of the separation layer to the surface of the flexible substrate, so that the separation layer can be separated from the flexible substrate relatively easily, so as to separate the flexible substrate from the substrate.
  • a flexible display device is obtained, which can reduce the damage of the flexible substrate, reduce the influence on the performance of the flexible display device, and improve the yield of the flexible display device.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for fabricating a flexible display device of the present invention
  • FIG. 2 is a schematic structural view of an application example of a substrate, a separation layer, and a flexible substrate laminated structure
  • step S12 in FIG. 1 is a schematic flow chart of step S12 in FIG. 1;
  • FIG. 4 is a plan view showing an application example of the substrate and the separation layer stacking structure of FIG. 2;
  • FIG. 5 is a schematic structural view of another application example of a substrate, a separation layer, and a flexible substrate laminated structure
  • FIG. 6 is a schematic structural view showing still another application example of a substrate, a separation layer, and a flexible substrate laminated structure
  • FIG. 7 is a schematic structural view showing still another application example of a substrate, a separation layer, and a flexible substrate laminated structure
  • FIG. 8 is a schematic structural view of an application example of a substrate, a separation layer, a flexible substrate, and a display assembly laminated structure
  • FIG. 9 is a schematic flow chart of step S14 in Figure 1;
  • FIG 10 is a schematic flow chart of the steps before step S141 in Figure 9;
  • Figure 11 is a schematic view showing a process of separating a flexible substrate and a separation layer by laser cutting and rolling;
  • Figure 12 is a schematic flow chart of step S141 in Figure 9;
  • FIG. 13 is a schematic structural view of an embodiment of a flexible display device of the present invention.
  • Figure 14 is a block diagram showing an embodiment of a display of the present invention.
  • FIG. 1 is a schematic flow chart of an embodiment of a method for fabricating a flexible display device according to the present invention. As shown in FIG. 1, a method for preparing a flexible display device of the present invention includes:
  • Step S11 preparing a separation layer on a surface of the substrate
  • the substrate is a hard material, and may be one or a combination of materials such as glass, metal, plastic, fiber, etc., and the separation layer has a large adhesion to the substrate and a small adhesion to the flexible substrate.
  • the material, and the separation layer is a material having a adhesion to the surface of the flexible substrate that is less than the adhesion of the flexible substrate to the surface of the substrate, such as titanium dioxide nanoparticles.
  • the substrate 100 is a glass substrate, and the material of the separation layer 101 is titanium dioxide nanoparticles; further, step S11 includes:
  • Step S111 coating a solution containing titanium dioxide nanoparticles on a surface of the substrate;
  • the titanium dioxide nanoparticles have excellent chemical stability and thermal stability, so that their morphology and properties are maintained in the subsequent high-temperature process; and the adhesion of the titanium dioxide nanoparticles to the glass substrate is greater than that of the flexible substrate. Attachment to facilitate subsequent separation from the flexible substrate.
  • Step S112 The solution is treated by a high temperature annealing process to form a separation layer.
  • the high-temperature annealing process refers to a heat treatment process in which the material is exposed to a high temperature for a long period of time and then slowly cooled.
  • the high-temperature temperature and time may be determined according to actual needs, and are not specifically limited herein.
  • a solution containing titanium dioxide nanoparticles is coated on a surface 100a of the glass substrate 100, and then the solution is treated by a high temperature annealing process, and finally a separation layer 101 made of titanium dioxide nanoparticles is formed, due to titanium dioxide.
  • the high temperature resistance of the nanoparticles, in the high temperature annealing process, the separation layer 101 formed still maintains its chemical stability and adhesion to the glass substrate.
  • the thickness of the separation layer 101 may be determined according to specific requirements, for example, 1000 to 2000 ⁇ m, which is not specifically limited herein.
  • the separation layer is formed by using a coating solution and a high temperature annealing treatment, and the technical process is mature and the cost is low.
  • the separation layer may also be fabricated by other processes such as physical or chemical deposition
  • the substrate may be made of other materials such as metal
  • the separation layer may also have a adhesion to the substrate such as silica, which is greater than the flexibility and flexibility.
  • the material of the adhesion of the substrate is not specifically limited herein.
  • Step S12 preparing a flexible substrate on a surface of the separation layer away from the substrate;
  • the material of the flexible substrate can be Polyimide (PI) or polyethylene terephthalate (Polyethylene). Terephthalate, PET), polyethylene naphthalate (Polyethylene) Naphthalate, PEN), polycarbonate (Polycarbonate, PC), polyethersulfone (PES), polyacrylate (PAR), polyetherimide (Polyetherimide), polyamide (Polyamide, PA) or poly One or a combination of one or more of ether ether ketone (PEEK) is not specifically limited herein.
  • step S12 includes:
  • Step S121 coating a polyimide film on the surface of the separation layer away from the substrate to form a flexible substrate.
  • a polyimide film is coated on the surface 101a of the separation layer 101 away from the substrate 100 to form the flexible substrate 102.
  • the coated polyimide film is subjected to coating, including blade coating, spin coating, spray coating, dip coating, screen printing, and a combination of these methods.
  • the flexible substrate can also be manufactured by other processes, which is not specifically limited herein.
  • the separation layer 101 covers a first region 1001 of a surface 100a of the substrate 100
  • the flexible substrate 102 covers a second region 1002 of a surface 100a of the substrate 100, wherein the second region 1002 It is a region where the surface 100a of the substrate 100 does not cover the separation layer 101.
  • the separation layer 101 covers the first region 1001 of the surface 100a of the substrate 100.
  • the area of the first region 1001 is smaller than the area of the surface 100a of the substrate 100, and the edge of the first region 1001 and the edge of the surface 100a of the substrate 100.
  • There is a gap between the second region 1002, and the width h of the gap may be determined according to actual needs, for example, 6 to 10 mm; the flexible substrate 102 is prepared on the separation layer 101 while the flexible substrate 102 covers the gap. That is, covering the second region 1002; since the adhesion of the separation layer 101 to the flexible substrate 102 is small, and the adhesion between the flexible substrate 102 and the substrate 100 is large, the flexible substrate 102 is made during the preparation process. Covering the second region 1002 of the surface 100a of the substrate 100 can prevent the peeling phenomenon caused by the poor adhesion of the flexible substrate 102 and the separation layer 101.
  • the separation layer 101 may completely cover a surface 100a of the substrate 100, the flexible substrate 102 covers the surface 101a of the separation layer 101 away from the substrate 100, as shown in FIG. 5; or the flexible substrate 102 covers the separation layer 101.
  • the surface 101a away from the substrate 100 and the side surface 1003 of the cover substrate 100 are as shown in FIG. 6; or the flexible substrate 102 covers the surface 101a of the separation layer 101 away from the substrate 100, the side surface 1003 of the substrate 100, and the other surface 100b of the substrate 100, such as
  • the flexible substrate 102 can also partially cover the other surface 100b of the substrate 100, which will not be exemplified herein.
  • Step S13 preparing a display assembly on a surface of the flexible substrate away from the separation layer;
  • the display component fabricated on the flexible substrate comprises: at least one or a combination of an inorganic film layer, a PI film layer, a barrier layer, a buffer layer, a display panel and an encapsulation layer; wherein, the display component can be
  • the electronic component produced includes at least one of a resistor, a capacitor, an inductor, a wire, a transistor, a diode, or a combination of more than one.
  • the specific form, position and connection relationship of the electronic component can be flexibly selected and set according to specific device requirements. Not enumerated one by one.
  • the inorganic film layer 103, the flexible substrate 104, the barrier layer 105, the buffer layer 106, the display panel 107, and the inorganic substrate layer 103, the barrier layer 105, the buffer layer 106, and the display panel 107 are sequentially deposited on the surface 102a of the flexible substrate 102 away from the separation layer 101.
  • the inorganic film layer 103 is made of a silicon dioxide material
  • the flexible substrate 104 is made of a material such as PI or PET
  • the barrier layer 105 and the buffer layer 106 are made of silicon nitride or a silicon dioxide material or a combination of the two
  • the display panel 107 can be An active matrix organic light emitting diode panel (AMOLED for short)
  • the encapsulation layer 108 is made of a waterproof material.
  • the display panel may also be other types of display panels, and other display components and/or electronic components may be prepared on the flexible substrate, which are not specifically limited herein.
  • Step S14 separating the flexible substrate from the separation layer to obtain a flexible display device
  • step S14 includes:
  • Step S141 The flexible substrate is mechanically separated from the surface in contact with the separation layer to separate the flexible substrate from the substrate to obtain a flexible display device.
  • the mechanical means may be mechanical tools, or other tools or manual methods, and are not specifically limited herein.
  • the flexible substrate 102 can be removed from a simple mechanical means such as a human hand.
  • the surface 101a in contact with the separation layer 101 is torn apart to separate the flexible substrate 102 from the substrate 100, obtaining a flexible display device composed of the flexible substrate 102 and a flexible display assembly prepared thereon.
  • the method includes:
  • Step S140 cutting an edge position of the separation layer and the flexible substrate by using a laser to form a cutting line
  • the laser is cut perpendicularly to the surface 102a of the flexible substrate 102.
  • only one cutting line may be formed, or a plurality of cutting lines may be formed, or a similar structure as shown in FIG. 5, FIG. 6, or FIG. 7 may be used for cutting, which is not specifically limited herein.
  • the film shrinkage effect of the edge portion of the flexible display device is obvious, which affects the performance of the device.
  • the above method can reduce the film shrinkage of the device and improve the device performance by laser cutting the edge portion.
  • step S141 specifically includes:
  • Step S1411 separating the flexible substrate from the separation layer in the direction of the vertical cutting line by the mechanical roller.
  • the surface of the mechanical roller 30 is attached with the encapsulation layer 108, and the mechanical roller 30 is moved in the direction of the vertical cutting line A1 and/or B1 (in the direction of the arrow shown in FIG. 11) due to the separation layer.
  • the adhesion between the 101 and the flexible substrate 102 is small, less than the adhesion between the flexible substrate 102 and the substrate 100, and therefore, by moving the mechanical roller 30, a tensile force can be applied to the flexible substrate 102, overcoming the flexible liner
  • the adhesion between the bottom 102 and the separation layer 101 separates the flexible substrate 102 from the separation layer 101.
  • the electrostatic damage caused by the high energy of the laser laser to the flexible substrate can be avoided, the influence on the performance of the flexible display device can be reduced, the yield of the flexible display device can be improved, and the mechanical cost can be adopted. Low, can effectively reduce manufacturing costs, and is more conducive to mass production.
  • the flexible substrate and the separation layer may be separated by other means, which are not specifically limited herein.
  • FIG. 13 is a schematic structural diagram of an embodiment of a flexible display device of the present invention.
  • the flexible display device of the present invention sequentially includes a laminated flexible substrate 102, an inorganic film layer 103, a flexible substrate 104, a barrier layer 105, a buffer layer 106, a display panel 107, and an encapsulation layer 108.
  • the flexible display device is obtained by the preparation method of the flexible display device of the present invention.
  • the material and type of each layer can be referred to the description of step S13 in the preparation method of the flexible display device of the present invention, and will not be repeated here.
  • the flexible display device may include other structures, such as other insulating layers, etc., as needed, and is not specifically limited herein.
  • the flexible display device reduces the damage of the flexible substrate in the flexible display device, reduces the influence on the performance of the flexible display device, improves the manufacturing yield of the flexible display device, and can adopt a low-cost separation method, thereby effectively reducing the manufacturing cost. More conducive to mass production.
  • FIG. 14 is a schematic structural diagram of an embodiment of a display of the present invention.
  • the display 90 of the present invention includes at least a flexible display device 901.
  • the structure of the flexible display device 901 can be referred to the embodiment of the flexible display device of the present invention as shown in FIG. 13 , and the partial structure can be adjusted according to specific conditions, which is not specifically limited herein.
  • the display of the present invention may further include other types of components such as switches, control circuits, and the like, which are not specifically limited herein.
  • the flexible display device used in the display of the present invention is obtained by the preparation method of the flexible display device of the present invention, so the flexible display device used in the display of the present invention can reduce the damage of the flexible substrate in the flexible display device and reduce the influence on the performance of the flexible display device.
  • the manufacturing yield of the flexible display device is improved, thereby reducing the influence on the performance of the display, improving the manufacturing yield of the display, and adopting a low-cost separation method, thereby effectively reducing the manufacturing cost and facilitating mass production.

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  • General Physics & Mathematics (AREA)
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Abstract

公开了一种柔性显示器件的制备方法、柔性显示器件及显示器，该制备方法包括：在基板（100）表面（100a）制备分离层（101）；在分离层（101）远离基板（100）的表面（101a）制备柔性衬底（102）；在柔性衬底（102）远离分离层（101）的表面制备显示组件；将柔性衬底（102）与分离层（101）分离，以获得柔性显示器件；其中，柔性衬底（102）与基板（100）表面的粘附力大于分离层（101）与柔性衬底（102）表面的粘附力，分离层（101）与基板（100）表面的粘附力大于分离层（101）与柔性衬底（102）表面的粘附力。这种方式能够提高柔性显示器件制造的良率。

Description

柔性显示器件的制备方法、柔性显示器件及显示器
【技术领域】
本发明涉及半导体制造技术领域，特别是涉及一种柔性显示器件的制备方法、柔性显示器件及显示器。
【背景技术】
目前常用的柔性显示器件的制造工艺是在玻璃基板上沉积柔性塑料薄膜衬底，例如聚酰亚胺薄膜（简称PI膜），以使该柔性衬底固定，再继续沉积其他膜层，最后采用镭射激光剥离（简称LLO）的分离方法分离玻璃基板和柔性衬底，然而该柔性衬底与玻璃基板之间的静电相互作用较强，采用现有的制造工艺的过程中会对该柔性衬底造成静电损伤，影响性能。
【发明内容】
本发明主要解决的技术问题是提供一种柔性显示器件的制备方法、柔性显示器件及显示器，能够解决现有技术中容易造成柔性衬底损伤的问题。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种柔性显示器件，该柔性显示器件包括：柔性衬底和设置于该柔性衬底一表面的显示组件；其中，该柔性显示器件通过如下制备方法获得：在基板一表面制备一分离层；在分离层远离基板的表面制备柔性衬底；在柔性衬底远离分离层的表面制备显示组件；将柔性衬底与分离层分离，以获得柔性显示器件；该柔性衬底与基板表面的粘附力大于分离层与该柔性衬底表面的粘附力，分离层与基板表面的粘附力大于分离层与该柔性衬底表面的粘附力；其中，该柔性衬底通过力学方式从与分离层接触的表面分离；该显示组件包括：在柔性衬底远离分离层的表面依次沉积的无机膜层、柔性基板、阻挡层、缓冲层、显示面板和封装层。
为解决上述技术问题，本发明采用的另一个技术方案是：提供一种柔性显示器件的制备方法，包括：在基板一表面制备一分离层；在分离层远离基板的表面制备柔性衬底；在柔性衬底远离分离层的表面制备显示组件；将柔性衬底与分离层分离，以获得柔性显示器件；其中，柔性衬底与基板表面的粘附力大于分离层与柔性衬底表面的粘附力，分离层与基板表面的粘附力大于分离层与柔性衬底表面的粘附力。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示器，至少包括柔性显示器件；该柔性显示器件包括：柔性衬底和设置于柔性衬底一表面的显示组件；其中，该柔性显示器件通过如下制备方法获得：在基板一表面制备一分离层；在分离层远离基板的表面制备柔性衬底；在柔性衬底远离分离层的表面制备显示组件；将柔性衬底与分离层分离，以获得柔性显示器件；柔性衬底与基板表面的粘附力大于分离层与柔性衬底表面的粘附力，分离层与基板表面的粘附力大于分离层与柔性衬底表面的粘附力。。
本发明的有益效果是：区别于现有技术的情况，本发明在基板和柔性衬底之间制备一分离层，其中，柔性衬底与基板表面的粘附力大于分离层与柔性衬底表面的粘附力，分离层与基板表面的粘附力大于分离层与柔性衬底表面的粘附力，从而可以比较容易地将分离层与柔性衬底分离，以实现柔性衬底与基板的分离，获得柔性显示器件，该方法可以降低柔性衬底的损伤，降低对柔性显示器件性能的影响，提高柔性显示器件制造的良率。
【附图说明】
图1是本发明柔性显示器件的制备方法一实施方式的流程示意图；
图2是基板、分离层和柔性衬底层叠结构一应用例的结构示意图；
图3是图1中步骤S12的流程示意图；
图4是图2中基板、分离层层叠结构一应用例的俯视图；
图5是基板、分离层和柔性衬底层叠结构另一应用例的结构示意图；
图6是基板、分离层和柔性衬底层叠结构再一应用例的结构示意图；
图7是基板、分离层和柔性衬底层叠结构又一应用例的结构示意图；
图8是基板、分离层、柔性衬底和显示组件层叠结构一应用例的结构示意图；
图9是图1中步骤S14的流程示意图；
图10是图9中步骤S141之前步骤流程示意图；
图11是利用激光切割及滚轴分离柔性衬底和分离层的过程示意图；
图12是图9中步骤S141的流程示意图；
图13是本发明柔性显示器件一实施方式的结构示意图；
图14是本发明显示器一实施方式的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅是本发明的一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
请参阅图1，图1是本发明柔性显示器件的制备方法一实施方式的流程示意图。如图1所示，本发明柔性显示器件的制备方法包括：
步骤S11：在基板一表面制备一分离层；
其中，基板是硬质材料，可以是玻璃、金属、塑料、纤维等材质的其中一种或一种以上的组合，分离层是与基板粘附力较大而与柔性基板粘附力较小的材质，且分离层是与柔性衬底表面的粘附力小于柔性衬底与基板表面的粘附力的材质，例如二氧化钛纳米颗粒。
结合图2所示，在一个应用例中，基板100是玻璃基板，分离层101的材质是二氧化钛纳米颗粒；进一步地，步骤S11包括：
步骤S111：在基板一表面涂布含有二氧化钛纳米颗粒的溶液；
其中，二氧化钛纳米颗粒具有优异的化学稳定性和热稳定性，使得在后续的高温制程中，仍然保持其形态和性能；并且二氧化钛纳米颗粒与玻璃基板的粘附力大于其与柔性衬底的粘附力，从而便于后续与柔性衬底分离。
步骤S112：采用高温退火工艺对该溶液进行处理，以形成分离层。
其中，高温退火工艺是指将材料曝露于高温一段很长时间后，然后再慢慢冷却的热处理制程，该高温温度和时间可以根据实际需求而定，此处不做具体限定。
具体地，如图2所示，在玻璃基板100一表面100a涂布含有二氧化钛纳米颗粒的溶液，然后采用高温退火工艺对该溶液进行处理，最后形成材质为二氧化钛纳米颗粒的分离层101，由于二氧化钛纳米颗粒的耐高温特性，在高温退火工艺制程中，形成的分离层101仍然保持其化学稳定性和与玻璃基板的粘附力。其中，该分离层101的厚度可以根据具体需求而定，例如1000~2000μm，此处不做具体限定。
上述应用例中采用涂布溶液、高温退火处理的方式形成分离层，该技术工艺成熟，成本较低。当然，在其他应用例中，分离层也可以采用物理或化学沉积等其他工艺制造，基板可以采用金属等其他材质，分离层也可以采用例如二氧化硅等与基板的粘附力大于其与柔性衬底的粘附力的材质，此处不做具体限定。
步骤S12：在分离层远离基板的表面制备柔性衬底；
其中，该柔性衬底的材质可以采用聚酰亚胺（Polyimide，PI)、聚对苯二甲酸乙二醇酯（Polyethylene terephthalate，PET）、聚萘二甲酸乙二酯（Polyethylene naphthalate，PEN）、聚碳酸酯（Polycarbonate，PC）、聚醚砜（Polyethersulfone，PES）、聚丙烯酸酯（Polyacrylate，PAR）、聚醚酰亚胺（Polyetherimide）、聚酰胺（Polyamide，PA）或者聚醚醚酮（Polyetheretherketone，PEEK）等其中一种或一种以上的组合，此处不做具体限定。
进一步地，如图3所示，步骤S12包括：
步骤S121：在分离层远离基板的表面涂布聚酰亚胺薄膜，以形成柔性衬底。
具体地，如图2所示，在分离层101远离基板100的表面101a涂布聚酰亚胺薄膜，形成该柔性衬底102。其中，涂布聚酰亚胺薄膜采用涂膜工艺（coating），包括刮涂、旋涂、喷涂、浸涂、丝网印刷以及这些方法的组合。当然，在其他应用例中，柔性衬底也可以采用其他工艺制造，此处不做具体限定。
进一步地，结合图2和图4所示，该分离层101覆盖基板100一表面100a的第一区域1001，柔性衬底102覆盖基板100一表面100a的第二区域1002，其中，第二区域1002是基板100一表面100a不覆盖分离层101的区域。
具体地，该分离层101覆盖基板100一表面100a的第一区域1001，该第一区域1001面积小于基板100一表面100a的面积，且该第一区域1001的边缘与基板100一表面100a的边缘之间存在空隙，形成该第二区域1002，该空隙的宽度h可以根据实际需求而定，例如6~10mm；在分离层101上制备该柔性衬底102同时，该柔性衬底102覆盖该空隙，即覆盖该第二区域1002；由于该分离层101与该柔性衬底102的粘附力较小，而柔性衬底102与基板100的粘附力较大，制备过程中使柔性衬底102覆盖基板100一表面100a的第二区域1002，可以防止柔性衬底102和分离层101粘附力太差造成的剥落现象。
当然，在其他实施例中，分离层101可以完全覆盖基板100一表面100a，柔性衬底102覆盖分离层101远离基板100的表面101a，如图5所示；或者柔性衬底102覆盖分离层101远离基板100的表面101a以及覆盖基板100的侧面1003，如图6所示；或者柔性衬底102覆盖分离层101远离基板100的表面101a、基板100的侧面1003以及基板100另一表面100b，如图7所示；此外，柔性衬底102还可以部分覆盖基板100另一表面100b，此处不再做一一举例。
步骤S13：在柔性衬底远离分离层的表面制备显示组件；
其中，在柔性衬底上所制作的显示组件包括：无机膜层、PI膜层、阻挡层、缓冲层、显示面板和封装层中至少一种或者一种以上的组合；其中，显示组件上可以制作的电子元件包括电阻、电容、电感、导线、晶体管、二极管中的至少一种或者一种以上的组合，电子元件的具体形式及位置、连接关系可以根据具体器件要求灵活选择和设置，在此不一一列举。
具体地，在一个应用例中，如图8所示，在柔性衬底102远离分离层101的表面102a依次沉积无机膜层103、柔性基板104、阻挡层105、缓冲层106、显示面板107和封装层108。其中，无机膜层103采用二氧化硅材料，柔性基板104采用PI或PET等材料，阻挡层105和缓冲层106采用氮化硅或二氧化硅材料或者二者层叠的结构，显示面板107可以是有源矩阵有机发光二极体面板（简称AMOLED），封装层108采用防水材料。
当然，在其他应用例中，该显示面板也可以是其他类型的显示面板，该柔性衬底上还可以制备其他显示组件和/或电子元件，此处不做具体限定。
步骤S14：将柔性衬底与分离层分离，以获得柔性显示器件；
进一步地，如图9所示，步骤S14包括：
步骤S141：通过力学方式将柔性衬底从与分离层接触的表面分离，以使得柔性衬底与基板分离，获得柔性显示器件。
其中，通过力学方式可以是采用机械工具，也可以是采用其他工具或者采用人手等方式，此处不做具体限定。
具体地，在一个应用例中，如图5所示，由于分离层101与柔性衬底102之间的粘附力较小，可以通过简单的力学方式，例如采用人手，将柔性衬底102从与分离层101接触的表面101a撕开，以使得柔性衬底102与基板100分离，获得柔性衬底102与制备于其上的柔性显示组件所组成的柔性显示器件。
在另一个应用例中，进一步地，如图10所示，步骤S141之前包括：
步骤S140：利用激光切割分离层和柔性衬底层叠的边缘位置，以形成切割线；
具体地，如图11所示，以如图8所示的结构为例，在分离层101和柔性衬底102层叠的边缘位置A和B，利用激光垂直于柔性衬底102的表面102a进行切割，形成切割线A1和B1。当然，在其他实施例中，可以只形成一条切割线，或者形成多条切割线，也可以采用如图5、图6或图7等类似的结构进行切割，此处不做具体限定。
此外，由于制备显示组件过程中存在高温工艺，柔性显示器件的边缘部分膜缩效应明显，影响器件性能，上述方法通过激光切除边缘部分，可以降低器件整体的膜缩，提高器件性能。
可选地，如图12所示，步骤S141具体包括：
步骤S1411：利用机械滚轴沿垂直切割线的方向将柔性衬底与分离层分离。
具体地，如图11所示，机械滚轴30的表面贴附封装层108，沿垂直切割线A1和/或B1的方向（如图11所示箭头方向）移动机械滚轴30，由于分离层101与柔性衬底102之间的粘附力较小，小于柔性衬底102与基板100之间的粘附力，因此，通过移动机械滚轴30可以向柔性衬底102施加拉力，克服柔性衬底102与分离层101之间的粘附力，从而将柔性衬底102与分离层101分离。
此外，通过上述力学方式的分离方法，可以避免由于镭射激光的高能量对柔性衬底造成的静电损伤，降低对柔性显示器件性能的影响，提高柔性显示器件制造的良率，同时采用力学方式成本低，可以有效降低制造成本，更利于大规模生产。
当然，在其他实施例中，也可以采用其他方式分离柔性衬底和分离层，此处不做具体限定。
请参阅图13，图13是本发明柔性显示器件一实施方式的结构示意图。如图13所示，本发明柔性显示器件依次包括层叠的柔性衬底102、无机膜层103、柔性基板104、阻挡层105、缓冲层106、显示面板107和封装层108。
其中，柔性显示器件是通过本发明柔性显示器件的制备方法获得的，各层的材质和类型可以参考本发明柔性显示器件的制备方法中步骤S13的说明，此处不再重复。
当然，在其他实施方式中，柔性显示器件还可以视具体需求包括其他结构，例如其他绝缘层等，此处不做具体限定。
通过在基板和柔性衬底之间制备一分离层，其中，分离层与基板表面的粘附力大于分离层与柔性衬底表面的粘附力，且柔性衬底与基板表面的粘附力也大于分离层与柔性衬底表面的粘附力，从而相对于现有技术，该方法可以比较容易地将分离层与柔性衬底分离，以实现柔性衬底与基板的分离，最终获得本发明实施方式的柔性显示器件，从而降低柔性显示器件中柔性衬底的损伤，降低对柔性显示器件性能的影响，提高柔性显示器件制造的良率，同时可以采用成本低的分离方法，从而有效降低制造成本，更利于大规模生产。
请参阅图14，图14是本发明显示器一实施方式的结构示意图。如图14所示，本发明显示器90至少包括柔性显示器件901。
其中，该柔性显示器件901的结构可以参考如图13所示的本发明柔性显示器件一实施方式，也可以视具体情况调整部分结构，此处不做具体限定。
当然，在其他实施方式中，本发明显示器还可以包括开关、控制电路等其他类型的部件，此处不做具体限定。
本发明显示器采用的柔性显示器件是通过本发明柔性显示器件的制备方法获得的，因此本发明显示器采用的柔性显示器件可以降低柔性显示器件中柔性衬底的损伤，降低对柔性显示器件性能的影响，提高柔性显示器件制造的良率，从而降低对显示器性能的影响，提高显示器的制造良率，同时可以采用成本低的分离方法，从而有效降低制造成本，更利于大规模生产。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (20)

  1. 一种柔性显示器件，其中，所述柔性显示器件包括：
    柔性衬底和设置于所述柔性衬底一表面的显示组件；
    其中，所述柔性显示器件通过如下制备方法获得：在基板一表面制备一分离层；在所述分离层远离所述基板的表面制备柔性衬底；在所述柔性衬底远离所述分离层的表面制备显示组件；将所述柔性衬底与所述分离层分离，以获得柔性显示器件；
    所述柔性衬底与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力，所述分离层与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力；
    其中，所述柔性衬底通过力学方式从与所述分离层接触的表面分离；
    所述显示组件包括：在所述柔性衬底远离所述分离层的表面依次沉积的无机膜层、柔性基板、阻挡层、缓冲层、显示面板和封装层。
  2. 根据权利要求1所述的柔性显示器件，其中，所述分离层的材质是二氧化钛纳米颗粒；所述分离层是通过在所述基板一表面涂布含有所述二氧化钛纳米颗粒的溶液后，采用高温退火工艺对所述溶液进行处理后形成的。
  3. 根据权利要求1所述的柔性显示器件，其中，
    所述分离层覆盖所述基板一表面的第一区域，所述柔性衬底覆盖所述基板一表面的第二区域，其中，所述第二区域是所述基板一表面不覆盖所述分离层的区域；
    所述柔性衬底是通过机械滚轴沿垂直切割线的方向从所述分离层分离；其中，所述切割线是利用激光切割所述分离层和所述柔性衬底层叠的边缘位置形成的。
  4. 根据权利要求1所述的柔性显示器件，其中，所述柔性衬底是聚酰亚胺薄膜。
  5. 一种柔性显示器件的制备方法，其中，包括：
    在基板一表面制备一分离层；
    在所述分离层远离所述基板的表面制备柔性衬底；
    在所述柔性衬底远离所述分离层的表面制备显示组件；
    将所述柔性衬底与所述分离层分离，以获得柔性显示器件；
    其中，所述柔性衬底与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力，所述分离层与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力。
  6. 根据权利要求5所述的方法，其中，所述分离层的材质是二氧化钛纳米颗粒。
  7. 根据权利要求5所述的方法，其中，所述将所述柔性衬底与所述分离层分离包括：
    通过力学方式将所述柔性衬底从与所述分离层接触的表面分离，以使得所述柔性衬底与所述基板分离，获得所述柔性显示器件。
  8. 根据权利要求7所述的方法，其中，所述分离层覆盖所述基板一表面的第一区域，所述柔性衬底覆盖所述基板一表面的第二区域，其中，所述第二区域是所述基板一表面不覆盖所述分离层的区域。
  9. 根据权利要求8所述的方法，其中，所述将所述柔性衬底与所述分离层分离进一步包括：
    利用激光切割所述分离层和所述柔性衬底层叠的边缘位置，以形成切割线；
    所述通过力学方式将所述柔性衬底从与所述分离层接触的表面分离包括：
    利用机械滚轴沿垂直所述切割线的方向将所述柔性衬底与所述分离层分离。
  10. 根据权利要求6所述的方法，其中，所述在基板一表面制备一分离层包括：
    在所述基板一表面涂布含有所述二氧化钛纳米颗粒的溶液；
    采用高温退火工艺对所述溶液进行处理，以形成所述分离层。
  11. 根据权利要求5所述的方法，其中，所述在所述分离层远离所述基板的表面制备柔性衬底包括：
    在所述分离层远离所述基板的表面涂布聚酰亚胺薄膜，以形成所述柔性衬底。
  12. 根据权利要求5所述的方法，其中，
    所述在所述柔性衬底远离所述分离层的表面制备显示组件包括：
    在所述柔性衬底远离所述分离层的表面依次沉积无机膜层、柔性基板、阻挡层、缓冲层、显示面板和封装层。
  13. 一种显示器，其中，至少包括柔性显示器件；所述柔性显示器件包括：柔性衬底和设置于所述柔性衬底一表面的显示组件；
    其中，所述柔性显示器件通过如下制备方法获得：在基板一表面制备一分离层；在所述分离层远离所述基板的表面制备柔性衬底；在所述柔性衬底远离所述分离层的表面制备显示组件；将所述柔性衬底与所述分离层分离，以获得柔性显示器件；
    所述柔性衬底与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力，所述分离层与所述基板表面的粘附力大于所述分离层与所述柔性衬底表面的粘附力。
  14. 根据权利要求13所述的显示器，其中，所述分离层的材质是二氧化钛纳米颗粒。
  15. 根据权利要求13所述的显示器，其中，所述柔性衬底通过力学方式从与所述分离层接触的表面分离。
  16. 根据权利要求15所述的显示器，其中，所述分离层覆盖所述基板一表面的第一区域，所述柔性衬底覆盖所述基板一表面的第二区域，其中，所述第二区域是所述基板一表面不覆盖所述分离层的区域。
  17. 根据权利要求16所述的显示器，其中，
    所述柔性衬底是通过机械滚轴沿垂直切割线的方向从所述分离层分离；
    其中，所述切割线是利用激光切割所述分离层和所述柔性衬底层叠的边缘位置形成的。
  18. 根据权利要求17所述的显示器，其中，所述分离层是通过在所述基板一表面涂布含有所述二氧化钛纳米颗粒的溶液后，采用高温退火工艺对所述溶液进行处理后形成的。
  19. 根据权利要求13所述的显示器，其中，所述柔性衬底是聚酰亚胺薄膜。
  20. 根据权利要求13所述的显示器，其中，所述显示组件包括：
    在所述柔性衬底远离所述分离层的表面依次沉积的无机膜层、柔性基板、阻挡层、缓冲层、显示面板和封装层。
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