WO2019019231A1 - 一种显示面板的切割方法以及显示面板 - Google Patents

一种显示面板的切割方法以及显示面板 Download PDF

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Publication number
WO2019019231A1
WO2019019231A1 PCT/CN2017/097862 CN2017097862W WO2019019231A1 WO 2019019231 A1 WO2019019231 A1 WO 2019019231A1 CN 2017097862 W CN2017097862 W CN 2017097862W WO 2019019231 A1 WO2019019231 A1 WO 2019019231A1
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WIPO (PCT)
Prior art keywords
display panel
cutting
sub
polarizer
board
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PCT/CN2017/097862
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English (en)
French (fr)
Inventor
金映秀
Original Assignee
武汉华星光电半导体显示技术有限公司
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Application filed by 武汉华星光电半导体显示技术有限公司 filed Critical 武汉华星光电半导体显示技术有限公司
Priority to US15/556,591 priority Critical patent/US10290835B2/en
Publication of WO2019019231A1 publication Critical patent/WO2019019231A1/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/8791—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/868—Arrangements for polarized light emission
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate

Definitions

  • the present invention relates to the field of display panels, and in particular to a method of cutting a display panel and a display panel.
  • Organic Light-Emitting Diode is also known as organic electro-laser display and organic light-emitting semiconductor.
  • OLED organic electro-laser display
  • organic light-emitting semiconductor The characteristic of OLED is that it emits light itself, unlike TFT LCD (thin film transistor liquid crystal display) requires backlight, so the visibility and brightness are high, followed by low voltage demand and high power saving efficiency, plus fast response, light weight, thin thickness, simple structure, low cost, etc. for One of the most promising products of the 21st century.
  • the technical problem to be solved by the present invention is to provide a cutting method for a display panel and a display panel, which can reduce the cutting process in the process of the display panel.
  • a technical solution adopted by the present invention is to provide a cutting method for a display panel, the method comprising:
  • Another technical solution adopted by the present invention is to provide a cutting method for a display panel, the method comprising:
  • Another technical solution adopted by the present invention is to provide a display panel which is cut by the following method:
  • the invention has the beneficial effects that the cutting of the display panel sub-board and the cutting of the polarizer are divided into two steps compared with the prior art, and the present invention attaches to the display panel sub-board before cutting the display panel sub-board.
  • the polarizer, and then the integrated cutting of the display panel sub-board and the polarizer, can reduce the cutting process in the display panel process.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for cutting a display panel according to the present invention
  • FIG. 2 is a schematic structural view of a flow of the cutting method shown in FIG. 1;
  • FIG. 3 is a schematic flow chart of a second embodiment of a method for cutting a display panel according to the present invention.
  • FIG. 4 is a schematic structural view of a flow of the cutting method shown in FIG. 3;
  • FIG. 5 is a schematic flow chart of a third embodiment of a method for cutting a display panel according to the present invention.
  • FIG. 6 is a schematic structural view of a flow of the cutting method shown in FIG. 5;
  • FIG. 7 is a schematic flow chart of a fourth embodiment of a method for cutting a display panel according to the present invention.
  • Figure 8 is a schematic structural view of the flow of the cutting method shown in Figure 7;
  • FIG. 9 is a schematic structural view of an embodiment of a display panel of the present invention.
  • the cutting method of the display panel according to the first embodiment of the present invention includes: providing a display panel motherboard; on the display panel motherboard Forming a plurality of display panel sub-boards; cutting the display panel mother board to separate the display panel sub-board from the display panel mother board; attaching a polarizer on the display panel sub-board; and then performing the display panel sub-board and the polarizer One cut.
  • FIG. 1 is a schematic flow chart of a first embodiment of a method for cutting a display panel according to the present invention
  • FIG. 2 is a schematic structural view of a flow of the cutting method shown in FIG.
  • S101 providing a display panel motherboard 201, forming a plurality of display panel daughter boards 202 on the display panel motherboard 201;
  • the display panel mother board 201 performs a vapor deposition process and a packaging process to form a plurality of display panel sub-boards 202.
  • the evaporation process and the packaging process are conventionally used by those skilled in the art. I will not repeat them here.
  • the number of the display panel sub-boards 202 is determined according to the final size of the display panel product and the size of the display panel motherboard 201, which is not limited herein.
  • the display panel motherboard 201 is cut along the second cutting line 203 to separate the display panel daughter board 202 from the display panel motherboard 201.
  • the display panel motherboard 201 may be performed using a diamond cutter. The cutting process or the cutting of the display panel mother substrate 201 using a laser is not limited herein.
  • the second cutting line 203 may be disposed along the contour of the perimeter of the display panel sub-board 202.
  • a polarizer 204 is attached to the display panel sub-board 202 to help the display panel sub-plate 202 to be imaged.
  • the polarizer 204 may be the most intermediate PVA (polyvinyl alcohol), two layers of TAC (triacetate). Prime), PSA Film (pressure sensitive adhesive), Release film (release film) and Protective Film (protective film), of course, as understood by those skilled in the art, the polarizer 204 may be other structures, as long as it can function as a polarizer 204 as described in the present embodiment.
  • the display panel sub-board 202 and the polarizer 204 are cut along the first cutting line 205, and the first cutting line 205 is arranged along the outline of the display panel sub-board 202.
  • the display panel sub-board 202 and the polarizer 204 are cut, and the cutting precision is higher than the cutting manner of the display panel motherboard 201.
  • the display panel sub-board 202 may be cut by laser. , or other cutting methods with high cutting precision, are not limited herein.
  • the graphic formed by the first cutting line 205 may be any polygonal shape, such as a square, a regular hexagon, etc.
  • the first cutting line 205 is arranged along the contour of the display panel sub-plate 202, and the first cutting line 205 surrounds the formed graphic.
  • the pattern formed by the first cutting line 205 is square, and so on.
  • the first cutting line 205 is for further planning the outline shape of the display panel sub-board 202
  • the second cutting line 203 is for planning the approximate position of the display panel sub-board 202 on the display panel mother board 201, so the second cutting line
  • the area of the pattern formed by the enclosing 203 is larger than the area of the pattern formed by the first cutting line 205.
  • the present invention attaches a polarizer on the display panel sub-board before cutting the display panel sub-board, and combines the cutting process of the display sub-board and the cutting process of the polarizer into one process, which can reduce the display panel process.
  • the cutting process in the middle is the middle.
  • FIG. 3 is a schematic flow chart of a second embodiment of a method for cutting a display panel according to the present invention
  • FIG. 4 is a schematic structural view of a flow of the cutting method shown in FIG.
  • S301 providing a display panel motherboard 401, forming a plurality of display panel daughter boards 402 on the display panel motherboard 401;
  • the display panel mother board 401 performs a vapor deposition process and a packaging process to form a plurality of display panel sub-boards 402.
  • the evaporation process and the packaging process are conventionally used by those skilled in the art. I will not repeat them here.
  • the number of the display panel sub-boards 402 is determined according to the final size of the display panel product and the size of the display panel motherboard 401, which is not limited herein.
  • the display panel motherboard 401 is cut along the second cutting line 403 to separate the display panel daughter board 402 from the display panel motherboard 401.
  • the display panel motherboard 401 can be performed using a diamond cutter. The cutting process is performed, or the display panel mother board 401 is cut by using a laser, which is not limited herein.
  • the second cutting line 403 may be disposed along the contour of the perimeter of the display panel sub-board 402.
  • the display panel sub-board 402 is cut to form a plurality of sub-display panels 404.
  • the display panel sub-board 402 may be cut using a diamond cutter, or the laser-to-display panel sub-board 402 may be used. Cutting is performed, which is not limited herein.
  • a set of display panel sub-boards 402 need to be cut into multi-component display panels 404 according to production requirements, for example, a set of 60-inch display panel sub-boards 402 can be cut.
  • the four groups of 30-inch sub-display panels 404 the above examples are only for discussion of requirements, and are not pursued for their rationality and achievability.
  • a polarizer 405 is attached to the sub-display panel 404 to assist in imaging the sub-display panel 404.
  • the polarizer 405 may be the most intermediate PVA (polyvinyl alcohol), two layers of TAC (triacetate). , PSA Film (pressure sensitive adhesive), Release film (release film) and Protective Film (protective film), of course, as understood by those skilled in the art, the polarizer may be other structures, as long as it can function as a polarizer as described in the present embodiment.
  • the halved display panel 404 and the polarizer 405 are cut along the first cutting line 406, and the first cutting line 406 is arranged along the outline of the sub-display panel 404.
  • the display panel 404 and the polarizer 405 are cut, and the cutting precision is higher than that of the display panel 401.
  • the laser halving display panel 404 and the polarizer 405 may be used. Cutting, or other cutting methods with high cutting precision, are not limited herein.
  • the graphic formed by the first cutting line 406 may be an arbitrary polygon, such as a square, a regular hexagon, etc., the first cutting line 406 is arranged along the contour of the sub-display panel 404, and the first cutting line 406 is surrounded by the formed graphic.
  • the pattern formed by the first cutting line 406 is square, and so on.
  • the first cutting line 406 is to further plan the outline shape of the display panel 404
  • the second cutting line 403 is to plan the approximate position of the display panel sub-board 402 on the display panel motherboard 401, so the second cutting line 403
  • the area of the pattern formed by the envelop is larger than the area of the pattern formed by the first cutting line 406.
  • FIG. 5 is a schematic flow chart of a third embodiment of the method for cutting a display panel of the present invention
  • FIG. 6 is a schematic structural view of the flow of the cutting method shown in FIG.
  • S501 providing a display panel motherboard 601, forming a plurality of display panel daughter boards 602 on the display panel motherboard 601;
  • the display panel mother board 601 performs a vapor deposition process and a packaging process to form a plurality of display panel sub-boards 602.
  • the evaporation process and the packaging process are conventional means for those skilled in the art. I will not repeat them here.
  • the number of the display panel sub-boards 602 is determined according to the final size of the display panel product and the size of the display panel motherboard 601, which is not limited herein.
  • S502 cutting the display panel motherboard 601 to separate the display panel sub-board 602 from the display panel motherboard 601;
  • the display panel motherboard 601 is cut along the second cutting line 603 to separate the display panel daughter board 602 from the display panel motherboard 601.
  • the display panel motherboard 601 can be performed using a diamond cutter. The cutting process is performed, or the display panel mother board 601 is cut by using a laser, which is not limited herein.
  • the second cutting line 603 may be disposed along a contour of the circumference of the display panel sub-board 602.
  • a first polarizer 604 is attached on the display panel sub-board 602 to help the display panel sub-board 602 to be imaged.
  • the first polarizer 604 may be the most intermediate PVA (polyvinyl alcohol), two layers of TAC. (triacetate), PSA Film (pressure sensitive adhesive), Release film (release film) and Protective Film (protective film), of course, as understood by those skilled in the art, the first polarizer 604 may be other structures, and the first polarizer 604 as described in the embodiment should be used as long as it can perform polarization.
  • the display panel sub-board 602 is cut along the third cutting line 606 to form a plurality of sub-display panels 605.
  • the third cutting line 606 is distributed along the boundary between the sub-display panels 605.
  • the display panel sub-board 602 is cut by using a diamond cutter, or the display panel sub-board 602 is cut by a laser, which is not limited herein.
  • a set of display panel sub-boards 602 are required according to production requirements.
  • the cutting is a multi-component display panel 605. For example, a set of 60-inch display panel sub-boards 602 can be cut into four sets of 30-inch sub-display panels 605.
  • the above examples are only for discussion, and are not for rationality and achievability. Investigate in depth.
  • S505 attaching a second polarizer 607 on the sub-display panel 605;
  • the second polarizer 607 has the same structure as the first polarizer 604 described above, and will not be described herein.
  • the halved display panel 605 and the second polarizer 607 are cut along the first cutting line 608, and the first cutting line 608 is arranged along the outline of the sub-display panel 605.
  • the sub-display panel 605 and the second polarizer 607 are cut, and the cutting precision is higher than the cutting manner of the display panel motherboard 601.
  • the laser halving display panel 605 and the The two polarizers 607 are cut, or other cutting methods with high cutting precision, which are not limited herein.
  • the graphic formed by the first cutting line 608 may be any polygonal shape, such as a square, a regular hexagon, etc., the first cutting line 608 is arranged along the contour of the sub-display panel 605, and the first cutting line 608 is surrounded by the formed graphic.
  • the pattern formed by the first cutting line 608 is square, and so on.
  • the first cutting line 608 is for further planning the outline shape of the display panel 605
  • the second cutting line 603 is for planning the approximate position of the display panel sub-board 602 on the display panel motherboard 601, so the second cutting line 603
  • the area of the pattern formed by the surrounding is larger than the area of the pattern formed by the first cutting line 608.
  • FIG. 7 is a schematic flow chart of a fourth embodiment of the method for cutting a display panel of the present invention
  • FIG. 8 is a schematic structural view of the flow of the cutting method shown in FIG.
  • S701 providing a display panel motherboard 801, forming a plurality of display panel daughter boards 802 on the display panel motherboard 801;
  • the display panel mother board 801 performs a vapor deposition process and a packaging process to form a plurality of display panel sub-boards 802.
  • the evaporation process and the packaging process are conventional methods for those skilled in the art. I will not repeat them here.
  • the number of the display panel sub-boards 802 is determined according to the final size of the display panel product and the size of the display panel motherboard 801, which is not limited herein.
  • the first polarizer 803 is attached to the display panel sub-board 802 to help the display panel sub-board 802 to image.
  • the first polarizer 803 can be the most intermediate PVA (polyvinyl alcohol), two layers of TAC. (triacetate), PSA Film (pressure sensitive adhesive), Release film (release film) and Protective Film (protective film), of course, as understood by those skilled in the art, the first polarizer 803 may be other structures, and the first polarizer 803 as described in the embodiment should be used as long as it can perform polarization.
  • the display panel sub-board 802 is cut along the third cutting line 805 to form a plurality of sub-display panels 804.
  • the third cutting line 805 is distributed along the boundary between the sub-display panels 802.
  • the display panel sub-board 802 is cut using a diamond cutter, or the display panel sub-board 802 is cut using a laser, which is not limited herein.
  • a set of display panel sub-boards 802 are required according to production requirements. Cutting into a multi-component display panel 804, for example, a set of 60-inch display panel sub-boards 802 can be cut into four sets of 30-inch sub-display panels 804.
  • the above examples are only for discussion, and are not for rationality and achievability. Investigate in depth.
  • the second polarizer 806 has the same structure as the first polarizer 803 described above, and will not be described herein.
  • the halved display panel 804 and the second polarizer 805 are cut along the first cutting line 807, and the first cutting line 807 is arranged along the outline of the sub-display panel.
  • the laser halving display panel 804 may be cut, or other cutting methods with high cutting precision, which are not limited herein.
  • the graphic formed by the first cutting line 807 may be an arbitrary polygon, such as a square, a regular hexagon, or the like.
  • the first cutting line 807 is arranged along the outline of the sub-display panel 804, and the first cutting line 807 surrounds the formed graphic.
  • the pattern formed by the first cut line 807 is square, and so on.
  • FIG. 9 is a schematic structural view of an embodiment of a display panel of the present invention.
  • the display panel 900 is cut by the display panel cutting method described in the above embodiments, and will not be described herein.
  • the display panel 900 includes a glass substrate 901, a buffer layer 902, and an array substrate 903.
  • the buffer layer 902 is disposed on the glass substrate 901.
  • the array substrate 903 is disposed on the side of the buffer layer 902 away from the glass substrate 901.
  • the polarizing film is attached to the sub-display panel before the bi-section display panel is cut, and the cutting process and the polarizer of the sub-display panel are divided.
  • the cutting process is combined into one process, which can reduce the cutting process in the display panel process.

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Polarising Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)

Abstract

一种显示面板的切割方法以及显示面板。该方法包括：提供一显示面板母板(201)；对该显示面板母板(201)进行封装，以形成多个显示面板子板(202)；对该显示面板母板(201)进行切割，使该显示面板子板(202)与该显示面板母板(201)分离；在该显示面板子板(202)上贴附一偏光片(204)；之后沿第一切割线(205)对该显示面板子板(202)以及偏光片(204)进行一体切割。通过上述方式，能够减少显示面板制程中的切割工序。

Description

一种显示面板的切割方法以及显示面板
【技术领域】
本发明涉及显示面板领域，特别是涉及一种显示面板的切割方法以及显示面板。
【背景技术】
有机发光二极管（Organic Light-Emitting Diode）又称为有机电激光显示、有机发光半导体。OLED的特性是自己发光，不像TFT LCD（薄膜晶体管液晶显示器）需要背光，因此可视度和亮度均高，其次是电压需求低且省电效率高，加上反应快、重量轻、厚度薄，构造简单，成本低等，被视为 21世纪最具前途的产品之一。
OLED显示器的制程工序中，由于蒸镀以及封装的原因无法实现窄边框，并且因为多次进行面板切割容易损坏面板材料，导致显示面板出现断层等信赖性不良问题。
【发明内容】
有鉴于此，本发明主要解决的技术问题是提供一种显示面板的切割方法以及显示面板，能够减少显示面板制程中的切割工序。
为解决上述技术问题，本发明采用的一个技术方案是：提供一种显示面板的切割方法，该方法包括：
提供一显示面板母板；对显示面板母板进行封装，以形成多个显示面板子板；对显示面板母板进行切割，使显示面板子板与显示面板母板分离；在显示面板子板上贴附一偏光片；之后沿第一切割线对显示面板子板以及偏光片进行一体切割。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示面板的切割方法，该方法包括：
提供一显示面板母板；在显示面板母板上形成多个显示面板子板；对显示面板母板进行切割，使显示面板子板与显示面板母板分离；在显示面板子板上贴附一偏光片；之后对显示面板子板以及偏光片进行一体切割。
为解决上述技术问题，本发明采用的又一个技术方案是：提供一种显示面板，该显示面板由以下方法切割而得：
提供一显示面板母板；在显示面板母板上形成多个显示面板子板；对显示面板母板进行切割，使显示面板子板与显示面板母板分离；在显示面板子板上贴附一偏光片；之后对显示面板子板以及偏光片进行一体切割。
本发明的有益效果是：相比于现有技术显示面板子板的切割与偏光片的切割分为两道工序，本发明在对显示面板子板进行切割前，在显示面板子板上贴附偏光片，之后对显示面板子板以及偏光片进行一体切割，能够减少显示面板制程中的切割工序。
【附图说明】
图1是本发明显示面板切割方法第一实施例的流程示意图；
图2是图1所示切割方法流程的结构示意图；
图3是本发明显示面板切割方法第二实施例的流程示意图；
图4是图3所示切割方法流程的结构示意图；
图5是本发明显示面板切割方法第三实施例的流程示意图；
图6是图5所示切割方法流程的结构示意图；
图7是本发明显示面板切割方法第四实施例的流程示意图；
图8是图7所示切割方法流程的结构示意图；
图9是本发明显示面板一实施例的结构示意图。
【具体实施方式】
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述。
为解决现有技术显示面板制程中切割工序较多导致信赖性不良的问题，本发明第一实施例提供的一种显示面板的切割方法包括：提供一显示面板母板；在显示面板母板上形成多个显示面板子板；对显示面板母板进行切割，使显示面板子板与显示面板母板分离；在显示面板子板上贴附一偏光片；之后对显示面板子板以及偏光片进行一体切割。以下进行详细说明。
请参阅图1-2，图1是本发明显示面板切割方法第一实施例的流程示意图，图2是图1所示切割方法流程的结构示意图。
S101：提供一显示面板母板201，在显示面板母板201上形成多个显示面板子板202；
在本实施例中，显示面板母板201进行蒸镀工序以及封装工序等工序形成多个显示面板子板202，如本领域技术人员所理解，蒸镀工序以及封装工序为本领域技术人员惯用手段，在此就不再赘述。
可选地，显示面板子板202的数量根据显示面板产品的最终尺寸以及显示面板母板201的尺寸而定，在此不做限定。
S102：对显示面板母板201进行切割，使显示面板子板202与显示面板母板201分离；
在本实施例中，对显示面板母板201沿第二切割线203进行切割以使显示面板子板202与显示面板母板201分离，可选地，可以使用金刚石刀具对显示面板母板201进行切割加工，或者使用激光对显示面板母板201进行切割，在此不做限定。
可选地，第二切割线203可以沿显示面板子板202的周围轮廓布置。
S103：在显示面板子板202上贴附一偏光片204；
在本实施例中，在显示面板子板202上贴附偏光片204，以帮助显示面板子板202成像，偏光片204可以是最中间的PVA（聚乙烯醇），两层TAC（三醋酸纤维素），PSA film（压敏胶），Release film(离型膜) 和Protective film（保护膜），当然如本领域技术人员所理解，偏光片204可以是其他结构，只要能起到偏振作用都应属于本实施例中所阐述的偏光片204。
S104：对显示面板子板202以及偏光片204进行一体切割；
在本实施例中，对显示面板子板202以及偏光片204沿第一切割线205进行切割，第一切割线205为沿显示面板子板202轮廓布置。
在本实施例中对显示面板子板202以及偏光片204进行切割，其切割精度要高于上述对显示面板母板201的切割方式，可选地，可以采用激光对显示面板子板202进行切割，或者其他切割精度高的切割方式，在此不做限定。
可选地，第一切割线205包围形成的图形可以是任意多边形，如正方形，正六边形等，第一切割线205沿显示面板子板202的轮廓布置，第一切割线205包围形成的图形是根据显示面板子板202的轮廓而定，若显示面板子板202的轮廓为正方形，则第一切割线205包围形成的图形是正方形，以此类推。
可选地，第一切割线205为进一步规划显示面板子板202的轮廓形状，而第二切割线203为规划出显示面板母板201上显示面板子板202的大概位置，因此第二切割线203所包围形成的图形面积大于第一切割线205所包围形成的图形面积。
以上可以看出，本发明在对显示面板子板切割之前在显示面板子板上贴附偏光片，将显示面板子板的切割工序和偏光片的切割工序合为一道工序，能够减少显示面板制程中的切割工序。
请参阅图3-4，图3是本发明显示面板切割方法第二实施例的流程示意图，图4是图3所示切割方法流程的结构示意图。
S301：提供一显示面板母板401，在显示面板母板401上形成多个显示面板子板402；
在本实施例中，显示面板母板401进行蒸镀工序以及封装工序等工序形成多个显示面板子板402，如本领域技术人员所理解，蒸镀工序以及封装工序为本领域技术人员惯用手段，在此就不再赘述。
可选地，显示面板子板402的数量根据显示面板产品的最终尺寸以及显示面板母板401的尺寸而定，在此不做限定。
S302：对显示面板母板401进行切割，使显示面板子板402与显示面板母板401分离；
在本实施例中，对显示面板母板401沿第二切割线403进行切割以使显示面板子板402与显示面板母板401分离，可选地，可以使用金刚石刀具对显示面板母板401进行切割加工，或者使用激光对显示面板母板401进行切割，在此不做限定。
可选地，第二切割线403可以沿显示面板子板402的周围轮廓布置。
S303：对显示面板子板402进行切割，形成多个分显示面板404；
在本实施例中，对显示面板子板402进行切割，形成多个分显示面板404，可选地，可以使用金刚石刀具对显示面板子板402进行切割加工，或者使用激光对显示面板子板402进行切割，在此不做限定，如本领域技术人员所理解，一组显示面板子板402按照生产需求需要切割为多组分显示面板404，例如一组60寸的显示面板子板402可以切割为4组30寸的分显示面板404，上述举例仅为论述需求，不针对其合理性以及可实现性进行深入追究。
S304：在分显示面板404上贴附一偏光片405；
在本实施例中，在分显示面板404上贴附偏光片405，以帮助分显示面板404成像，偏光片405可以是最中间的PVA（聚乙烯醇），两层TAC（三醋酸纤维素），PSA film（压敏胶），Release film(离型膜) 和Protective film（保护膜），当然如本领域技术人员所理解，偏光片可以是其他结构，只要能起到偏振作用都应属于本实施例中所阐述的偏光片。
S305：对分显示面板404以及偏光片405进行一体切割；
在本实施例中，对分显示面板404以及偏光片405沿第一切割线406进行切割，第一切割线406为沿分显示面板404轮廓布置。
在本实施例中对分显示面板404以及偏光片405进行切割，其切割精度要高于上述对显示面板母板401的切割方式，可选地，可以采用激光对分显示面板404以及偏光片405进行切割，或者其他切割精度高的切割方式，在此不做限定。
可选地，第一切割线406包围形成的图形可以是任意多边形，如正方形，正六边形等，第一切割线406沿分显示面板404的轮廓布置，第一切割线406包围形成的图形是根据分显示面板404的轮廓而定，若分显示面板404的轮廓为正方形，则第一切割线406包围形成的图形是正方形，以此类推。
可选地，第一切割线406为进一步规划分显示面板404的轮廓形状，而第二切割线403为规划出显示面板母板401上显示面板子板402的大概位置，因此第二切割线403所包围形成的图形面积大于第一切割线406所包围形成的图形面积。
请参阅图5-6，图5是本发明显示面板切割方法第三实施例的流程示意图，图6是图5所示切割方法流程的结构示意图。
S501：提供一显示面板母板601，在显示面板母板601上形成多个显示面板子板602；
在本实施例中，显示面板母板601进行蒸镀工序以及封装工序等工序形成多个显示面板子板602，如本领域技术人员所理解，蒸镀工序以及封装工序为本领域技术人员惯用手段，在此就不再赘述。
可选地，显示面板子板602的数量根据显示面板产品的最终尺寸以及显示面板母板601的尺寸而定，在此不做限定。
S502：对显示面板母板601进行切割，使显示面板子板602与显示面板母板601分离；
在本实施例中，对显示面板母板601沿第二切割线603进行切割以使显示面板子板602与显示面板母板601分离，可选地，可以使用金刚石刀具对显示面板母板601进行切割加工，或者使用激光对显示面板母板601进行切割，在此不做限定。
可选地，第二切割线603可以沿显示面板子板602的周围轮廓布置。
S503：在显示面板子板602上贴附第一偏光片604；
在本实施例中，在显示面板子板602上贴附第一偏光片604，以帮助显示面板子板602成像，第一偏光片604可以是最中间的PVA（聚乙烯醇），两层TAC（三醋酸纤维素），PSA film（压敏胶），Release film(离型膜) 和Protective film（保护膜），当然如本领域技术人员所理解，第一偏光片604可以是其他结构，只要能起到偏振作用都应属于本实施例中所阐述的第一偏光片604。
S504：对显示面板子板602进行切割，形成多个分显示面板605；
在本实施例中，沿第三切割线606对显示面板子板602进行切割，形成多个分显示面板605，第三切割线606沿分显示面板605之间的界限分布，可选地，可以使用金刚石刀具对显示面板子板602进行切割加工，或者使用激光对显示面板子板602进行切割，在此不做限定，如本领域技术人员所理解，一组显示面板子板602按照生产需求需要切割为多组分显示面板605，例如一组60寸的显示面板子板602可以切割为4组30寸的分显示面板605，上述举例仅为论述需求，不针对其合理性以及可实现性进行深入追究。
S505：在分显示面板605上贴附第二偏光片607；
在本实施例中，第二偏光片607与上述所阐述的第一偏光片604采用相同结构，在此就不再赘述。
S506：对分显示面板605以及第二偏光片607进行一体切割；
在本实施例中，对分显示面板605以及第二偏光片607沿第一切割线608进行切割，第一切割线608为沿分显示面板605轮廓布置。
在本实施例中对分显示面板605以及第二偏光片607进行切割，其切割精度要高于上述对显示面板母板601的切割方式，可选地，可以采用激光对分显示面板605以及第二偏光片607进行切割，或者其他切割精度高的切割方式，在此不做限定。
可选地，第一切割线608包围形成的图形可以是任意多边形，如正方形，正六边形等，第一切割线608沿分显示面板605的轮廓布置，第一切割线608包围形成的图形是根据分显示面板605的轮廓而定，若分显示面板605的轮廓为正方形，则第一切割线608包围形成的图形是正方形，以此类推。
可选地，第一切割线608为进一步规划分显示面板605的轮廓形状，而第二切割线603为规划出显示面板母板601上显示面板子板602的大概位置，因此第二切割线603所包围形成的图形面积大于第一切割线608所包围形成的图形面积。
请参阅图7-8，图7是本发明显示面板切割方法第四实施例的流程示意图，图8是图7所示切割方法流程的结构示意图。
S701：提供一显示面板母板801，在显示面板母板801上形成多个显示面板子板802；
在本实施例中，显示面板母板801进行蒸镀工序以及封装工序等工序形成多个显示面板子板802，如本领域技术人员所理解，蒸镀工序以及封装工序为本领域技术人员惯用手段，在此就不再赘述。
可选地，显示面板子板802的数量根据显示面板产品的最终尺寸以及显示面板母板801的尺寸而定，在此不做限定。
S702：在显示面板子板802上贴附第一偏光片803；
在本实施例中，在显示面板子板802上贴附第一偏光片803，以帮助显示面板子板802成像，第一偏光片803可以是最中间的PVA（聚乙烯醇），两层TAC（三醋酸纤维素），PSA film（压敏胶），Release film(离型膜) 和Protective film（保护膜），当然如本领域技术人员所理解，第一偏光片803可以是其他结构，只要能起到偏振作用都应属于本实施例中所阐述的第一偏光片803。
S703：对显示面板子板802进行切割，形成多个分显示面板804；
在本实施例中，沿第三切割线805对显示面板子板802进行切割，形成多个分显示面板804，第三切割线805沿分显示面板802之间的界限分布，可选地，可以使用金刚石刀具对显示面板子板802进行切割加工，或者使用激光对显示面板子板802进行切割，在此不做限定，如本领域技术人员所理解，一组显示面板子板802按照生产需求需要切割为多组分显示面板804，例如一组60寸的显示面板子板802可以切割为4组30寸的分显示面板804，上述举例仅为论述需求，不针对其合理性以及可实现性进行深入追究。
S704：在分显示面板804上贴附第二偏光片806；
在本实施例中，第二偏光片806与上述所阐述的第一偏光片803采用相同的结构，在此就不再赘述。
S705：对分显示面板804以及第二偏光片806进行一体切割；
在本实施例中，对分显示面板804以及第二偏光片805沿第一切割线807进行切割，第一切割线807为沿分显示面板轮廓布置。
可选地，可以采用激光对分显示面板804进行切割，或者其他切割精度高的切割方式，在此不做限定。
可选地，第一切割线807包围形成的图形可以是任意多边形，如正方形，正六边形等，第一切割线807沿分显示面板804的轮廓布置，第一切割线807包围形成的图形是根据分显示面板804的轮廓而定，若分显示面板804的轮廓为正方形，则第一切割线807包围形成的图形是正方形，以此类推。
请参阅图9，图9是本发明显示面板一实施例的结构示意图。
显示面板900由上述实施例中所阐述的显示面板切割方法切割而得，在此就不再赘述。
在本实施例中，显示面板900包括：玻璃基板901、缓冲层902以及阵列基板903，缓冲层902设于玻璃基板901上，阵列基板903设于缓冲层902的远离玻璃基板901一侧，通过上述实施例的显示面板切割方法而得的显示面板900，其缓冲层902与阵列基板903之间的贴合的稳定性可以得到保证，不会出现信赖性不良的问题。
以上可以看出，本发明当显示面板子板需要切割为多个分显示面板时，在对分显示面板切割轮廓之前在分显示面板上贴附偏光片，将分显示面板的切割工序和偏光片的切割工序合为一道工序，能够减少显示面板制程中的切割工序。
以上所述仅为本发明的实施方式，并非因此限制本发明的专利范围，凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换，或直接或间接运用在其他相关的技术领域，均同理包括在本发明的专利保护范围内。

Claims (17)

  1. 一种显示面板的切割方法，其中，
    提供一显示面板母板；
    对所述显示面板母板进行封装，以形成多个显示面板子板；
    对所述显示面板母板进行切割，使所述显示面板子板与所述显示面板母板分离；
    在所述显示面板子板上贴附一偏光片；之后
    沿第一切割线对所述显示面板子板以及偏光片进行一体切割。
  2. 根据权利要求1所述的方法，其中，所述第一切割线所围图形为多边形。
  3. 根据权利要求2所述的方法，其中，所述对所述显示面板子板以及所述偏光片进行一体切割包括：使用激光对所述显示面板子板以及所述偏光片进行一体切割。
  4. 根据权利要求1所述的方法，其中，所述对所述显示面板母板进行切割包括：沿第二切割线对所述显示面板母板进行切割。
  5. 根据权利要求4所述的方法，其中，所述第二切割线所围图形面积大于所述第一切割线所围图形面积。
  6. 根据权利要求1所述的方法，其中，所述在所述显示面板子板上贴附一偏光片之后进一步包括：对所述显示面板子板进行激光切割，形成至少两组分显示面板；之后对所述分显示面板以及偏光片进行一体切割。
  7. 根据权利要求6所述的方法，其中，
    所述对所述显示面板子板进行激光切割，形成至少两组分显示面板之后进一步包括：在所述分显示面板上贴附一偏光片；之后对所述分显示面板以及偏光片进行一体切割。
  8. 一种显示面板的切割方法，其中，
    提供一显示面板母板；
    在所述显示面板母板上形成多个显示面板子板；
    对所述显示面板母板进行切割，使所述显示面板子板与所述显示面板母板分离；
    在所述显示面板子板上贴附一偏光片；之后
    对所述显示面板子板以及偏光片进行一体切割。
  9. 根据权利要求8所述的方法，其中，所述对所述显示面板子板以及所述偏光片进行一体切割包括：沿第一切割线对所述显示面板子板以及所述偏光片进行切割。
  10. 根据权利要求9所述的方法，其中，所述第一切割线所围图形为多边形。
  11. 根据权利要求10所述的方法，其中，所述对所述显示面板子板以及所述偏光片进行一体切割包括：使用激光对所述显示面板子板以及所述偏光片进行一体切割。
  12. 根据权利要求11所述的方法，其中，所述对所述显示面板母板进行切割包括：沿第二切割线对所述显示面板母板进行切割。
  13. 根据权利要求12所述的方法，其中，所述第二切割线所围图形面积大于所述第一切割线所围图形面积。
  14. 根据权利要求8所述的方法，其中，所述在所述显示面板母板上形成多个显示面板子板的步骤具体包括：对所述显示面板母板进行封装，以形成所述多个显示面板子板。
  15. 根据权利要求8所述的方法，其中，所述在所述显示面板子板上贴附一偏光片之后进一步包括：对所述显示面板子板进行激光切割，形成至少两组分显示面板；之后对所述分显示面板以及偏光片进行一体切割。
  16. 根据权利要求15所述的方法，其中，
    所述对所述显示面板子板进行激光切割，形成至少两组分显示面板之后进一步包括：在所述分显示面板上贴附一偏光片；之后对所述分显示面板以及偏光片进行一体切割。
  17. 一种显示面板，其中，所述显示面板由以下所述显示面板的切割方法所得，所述方法包括：
    提供一显示面板母板；
    在所述显示面板母板上形成多个显示面板子板；
    对所述显示面板母板进行切割，使所述显示面板子板与所述显示面板母板分离；
    在所述显示面板子板上贴附一偏光片；之后
    对所述显示面板子板以及偏光片进行一体切割。
PCT/CN2017/097862 2017-07-24 2017-08-17 一种显示面板的切割方法以及显示面板 WO2019019231A1 (zh)

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