WO2019007174A1 - 路面发电组件 - Google Patents
路面发电组件 Download PDFInfo
- Publication number
- WO2019007174A1 WO2019007174A1 PCT/CN2018/089524 CN2018089524W WO2019007174A1 WO 2019007174 A1 WO2019007174 A1 WO 2019007174A1 CN 2018089524 W CN2018089524 W CN 2018089524W WO 2019007174 A1 WO2019007174 A1 WO 2019007174A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- glass
- substrate
- road surface
- support member
- layer
- Prior art date
Links
- 238000010248 power generation Methods 0.000 title abstract description 16
- 239000011521 glass Substances 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 239000000853 adhesive Substances 0.000 claims description 8
- 230000001070 adhesive effect Effects 0.000 claims description 8
- 239000000565 sealant Substances 0.000 claims description 4
- 238000005485 electric heating Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract description 8
- 230000031700 light absorption Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 49
- 230000000694 effects Effects 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 230000020169 heat generation Effects 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 3
- 229920005549 butyl rubber Polymers 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S30/00—Structural details of PV modules other than those related to light conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S10/00—PV power plants; Combinations of PV energy systems with other systems for the generation of electric power
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/10—Cleaning arrangements
- H02S40/12—Means for removing snow
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/20—Optical components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/02—Heaters specially designed for de-icing or protection against icing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Definitions
- the present invention relates to solar power generation technology, and more particularly to a road surface power generation assembly.
- the present invention provides a road surface power generating assembly, comprising: a glass layer, a substrate, a heat generating support member, and a solar cell chip; the solar cell chip being disposed between the glass layer and the substrate; the heat generating support member Standing between the glass layer and the substrate, and the heat-generating support member is located between adjacent solar cell chips.
- the heat generating support member has a strip shape.
- the heat generating support member is in a block shape, a sheet shape, or a spherical shape.
- a lower portion of the heat generating support member directly contacts the substrate, and an upper portion of the heat generating support member is supported on the glass layer.
- the glass layer comprises an upper layer glass and a lower layer glass fixedly connected by a sheet-like bonding layer, and an upper portion of the heat generating support member is supported on a bottom surface of the lower layer glass .
- the solar cell chips are laid on the substrate and located on a side of the substrate facing the lower glass.
- the solar cell chips are laid on a side of the lower glass facing the substrate.
- the heat generating support member is an electric heating cable.
- a closed cavity is provided between the substrate and the glass layer.
- the road surface power generating assembly as described above, wherein, preferably, a side of the substrate and the lower glass is provided with a sealant, and a structural adhesive is disposed between the substrate and the upper glass, the lower layer A light-emitting strip is disposed between the glass and the structural adhesive.
- the upper surface of the upper glass is provided with an anti-slip layer.
- the road surface power generation assembly provided by the present invention heats the glass layer by providing a heat-generating support member between the glass layer and the substrate, and avoiding the solar cell chip, thereby melting the snow and ice on the glass layer and improving the solar cell chip.
- the light absorption rate increases the power generation efficiency.
- FIG. 1 is a schematic structural diagram of a road surface power generating assembly according to an embodiment of the present invention
- Figure 2 is an enlarged view of A in Figure 1.
- FIG. 1 is a schematic structural view of a road surface power generating assembly according to an embodiment of the present invention
- FIG. 2 is an enlarged view of a portion A in FIG.
- Embodiments of the present invention provide a road surface power generation assembly including a glass layer 3, two or more solar battery chips 2, a substrate 1 and a heat generating support member 4.
- the substrate 1 is used for setting on the road surface as a mounting base for the entire road surface power generation assembly.
- the solar cell chip 2 is disposed between the glass layer 3 and the substrate 1
- the heat-generating support member 4 is disposed between the glass layer 3 and the substrate 1
- the heat-generating support member 4 is located between the adjacent two solar cell chips 2
- the glass layer 3 is heated to melt the snow and ice on the glass layer 3.
- the road surface power generating assembly provided by the embodiment of the present invention can heat the glass layer 3 by disposing the heat generating support member 4 between the glass layer 3 and the substrate 1 and avoiding the solar cell chip 2, thereby enabling the snow and ice on the glass layer 3.
- the melting increases the light absorption rate of the solar cell chip 2, thereby improving the power generation efficiency.
- the heat-generating support member 4 may be in the form of a strip, and its cross section may be any shape such as a square, a rectangle, a ring, a circle, a hexagon, a pentagram, or the like.
- the heat-generating support member 4 may be in the form of a block, a sheet, a sphere, or the like, and it is within the scope of the present invention as long as the heat-generating support member 4 capable of generating heat is satisfied.
- the heat generation of the heat generating support member 4 described above can be controlled by the following:
- the road surface power generating assembly can further include a temperature sensor and a control unit.
- the temperature sensor is used for sensing the ambient temperature, and may be directly disposed on the glass layer 3 for directly sensing the temperature of the glass layer 3, or may be fixed on other components of the road surface power generating assembly by means of a bracket or the like, by sensing the air.
- the temperature indirectly senses the temperature of the glass layer 3.
- the control unit is electrically connected to the heat generating support member 4 and the temperature sensor, respectively, for controlling the heat generation of the heat generating support member 4 according to the ambient temperature sensed by the temperature sensor.
- the road surface power generating assembly may further include an irradiation sensor for sensing the light intensity.
- the irradiation sensor can be directly disposed on the glass layer 3, directly sensing the light intensity of the glass layer 3, or can be fixed on other components of the road surface power generating assembly by means of a bracket or the like, by sensing the light intensity of other components.
- the light intensity of the glass layer 3 is indirectly sensed.
- the irradiation sensor is also electrically connected to the control unit, and the control unit is further configured to control the heat generation of the heat-generating support member 4 according to the light intensity sensed by the irradiation sensor.
- the heat-generating support member 4 may be an electric heating cable in the prior art. When heating is required, the heat-generating support member 4 is controlled to generate heat, and the glass layer 3 is thermally conducted to melt the snow and ice on the glass layer 3.
- the heat-generating support member 4 can achieve heat generation, but in order to achieve a better heat conduction effect, the lower portion of the heat-generating support member 4 can be directly in contact with the substrate 1, and the upper portion is supported on the glass layer 3.
- the substrate 1 can be further provided as a metal plate having good heat conductivity.
- the substrate 1 is an aluminum substrate.
- the glass layer 3 may be provided to include the upper glass 32 and the lower glass 33 fixedly connected by the sheet-like bonding layer 31, and the solar cell chip 2 may be disposed on the lower glass 33 toward the substrate 1.
- the provision of the glass layer 3 including the double glazing also improves the tolerance of the road surface.
- the material of the sheet-like bonding layer 31 may be EVA, PVB, POE or TPO.
- the thickness of the upper glass 32 and the lower glass 33 is 3-15 mm, preferably 10 mm.
- the solar cell chip 2 can also be laid on the substrate 1, specifically bonded to the substrate 1 by a butyl rubber 6, and on the side of the substrate 1 facing the lower glass 33. At this time, it is possible to provide the above-described heat-generating support member 4 to be in direct contact with the substrate 1 while avoiding the position of the solar cell chip 2. If the number of the solar cell chips 2 laid on the substrate 1 is two or more, the bottom of the heat-generating support member 4 may be disposed between the adjacent two solar cell chips 2.
- the heat-generating support member 4 is disposed at a central position of the glass layer 3, so that not only a preferable heat conduction effect but also the heat-generating support member 4 can support the large-sized glass to avoid the intermediate reception of the glass layer 3. The rupture caused by the force.
- the above-mentioned road surface power generating assembly may further include a transparent conductive heat generating film disposed between the upper glass 32 and the sheet-like adhesive layer 31; or disposed between the lower glass 33 and the sheet-like adhesive layer 31; It is disposed on the side of the lower glass 33 facing the substrate 1.
- the transparent conductive heat-generating film is disposed on the lower surface of the upper glass 32, that is, between the upper glass 32 and the sheet-like adhesive layer 31, so that not only the snow melting can be heated, but also the toughness of the glass layer 3 can be improved. Layer 3 is not easily broken and takes up less space.
- the above-described road surface power generating assembly may further include a thermal resistor 5 embedded in the substrate 1 or disposed below the substrate 1 to further improve the heating effect.
- a closed cavity 7 is provided between the substrate 1 and the glass layer 3, and further, the cavity 7 is provided with inertness. gas.
- the inert gas is disposed so as to prevent the water vapor from entering the cavity 7, thereby preventing the solar cell chip 2 from being affected by moisture and impairing performance.
- the height of the cavity 7 is 8-20 mm, preferably 12.5 mm.
- the closed cavity 7 can be realized by providing a sealant 8 on the side between the substrate 1 and the lower glass 33, and a structural adhesive 9 on the side between the substrate 1 and the upper glass 32, see FIG.
- the sealant 8 can be made of butyl rubber
- the structural adhesive 9 can be made of silicone structural glue 9.
- the light emitting belt 10 may be disposed between the lower glass 33 and the structural adhesive 9.
- an anti-slip layer is provided on the upper surface of the upper glass 32, and the anti-slip layer can be formed by acid etching.
- a hard coating is provided on the anti-slip layer to increase the wear resistance of the upper glass 32.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Road Paving Structures (AREA)
- Photovoltaic Devices (AREA)
- Road Signs Or Road Markings (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720813684.6U CN206922714U (zh) | 2017-07-06 | 2017-07-06 | 具有发热功能的路面发电组件 |
CN201720813684.6 | 2017-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019007174A1 true WO2019007174A1 (zh) | 2019-01-10 |
Family
ID=61335096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2018/089524 WO2019007174A1 (zh) | 2017-07-06 | 2018-06-01 | 路面发电组件 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3218017U (ko) |
KR (1) | KR20190000157U (ko) |
CN (1) | CN206922714U (ko) |
AU (1) | AU2018100934A4 (ko) |
WO (1) | WO2019007174A1 (ko) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206922714U (zh) * | 2017-07-06 | 2018-01-23 | 北京铂阳顶荣光伏科技有限公司 | 具有发热功能的路面发电组件 |
CN207068882U (zh) * | 2017-07-06 | 2018-03-02 | 北京铂阳顶荣光伏科技有限公司 | 具有双层玻璃的路面发电组件 |
CN107222166A (zh) * | 2017-07-06 | 2017-09-29 | 北京铂阳顶荣光伏科技有限公司 | 具有发热支撑条的路面发电系统 |
CN109285903B (zh) * | 2018-08-27 | 2020-07-03 | 大连华鹰玻璃股份有限公司 | 太阳能光伏路面玻璃 |
CN109273546A (zh) * | 2018-08-27 | 2019-01-25 | 大连华鹰玻璃股份有限公司 | 太阳能除雪路面玻璃 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308187A (en) * | 1993-05-17 | 1994-05-03 | Nix Martin E | Parking lot pavement for making hot precombustion air for a fossil fuel burner |
JP2008038569A (ja) * | 2006-08-10 | 2008-02-21 | Ntt Facilities Inc | 路面誘導サイン装置 |
CN101974934A (zh) * | 2010-10-15 | 2011-02-16 | 陈瑞文 | 具有生态环保功能的太阳能地面嵌合装置 |
CN107222166A (zh) * | 2017-07-06 | 2017-09-29 | 北京铂阳顶荣光伏科技有限公司 | 具有发热支撑条的路面发电系统 |
CN206894584U (zh) * | 2017-07-06 | 2018-01-16 | 北京铂阳顶荣光伏科技有限公司 | 具有发热支撑条的路面发电系统 |
CN206922714U (zh) * | 2017-07-06 | 2018-01-23 | 北京铂阳顶荣光伏科技有限公司 | 具有发热功能的路面发电组件 |
-
2017
- 2017-07-06 CN CN201720813684.6U patent/CN206922714U/zh not_active Expired - Fee Related
-
2018
- 2018-06-01 WO PCT/CN2018/089524 patent/WO2019007174A1/zh active Application Filing
- 2018-07-04 AU AU2018100934A patent/AU2018100934A4/en not_active Ceased
- 2018-07-05 KR KR2020180003102U patent/KR20190000157U/ko not_active Application Discontinuation
- 2018-07-05 JP JP2018002559U patent/JP3218017U/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5308187A (en) * | 1993-05-17 | 1994-05-03 | Nix Martin E | Parking lot pavement for making hot precombustion air for a fossil fuel burner |
JP2008038569A (ja) * | 2006-08-10 | 2008-02-21 | Ntt Facilities Inc | 路面誘導サイン装置 |
CN101974934A (zh) * | 2010-10-15 | 2011-02-16 | 陈瑞文 | 具有生态环保功能的太阳能地面嵌合装置 |
CN107222166A (zh) * | 2017-07-06 | 2017-09-29 | 北京铂阳顶荣光伏科技有限公司 | 具有发热支撑条的路面发电系统 |
CN206894584U (zh) * | 2017-07-06 | 2018-01-16 | 北京铂阳顶荣光伏科技有限公司 | 具有发热支撑条的路面发电系统 |
CN206922714U (zh) * | 2017-07-06 | 2018-01-23 | 北京铂阳顶荣光伏科技有限公司 | 具有发热功能的路面发电组件 |
Also Published As
Publication number | Publication date |
---|---|
CN206922714U (zh) | 2018-01-23 |
AU2018100934A4 (en) | 2018-08-09 |
KR20190000157U (ko) | 2019-01-16 |
JP3218017U (ja) | 2018-09-13 |
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