WO2019007206A1 - 路面发电组件 - Google Patents

路面发电组件 Download PDF

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Publication number
WO2019007206A1
WO2019007206A1 PCT/CN2018/091488 CN2018091488W WO2019007206A1 WO 2019007206 A1 WO2019007206 A1 WO 2019007206A1 CN 2018091488 W CN2018091488 W CN 2018091488W WO 2019007206 A1 WO2019007206 A1 WO 2019007206A1
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WO
WIPO (PCT)
Prior art keywords
glass
substrate
solar cell
road surface
layer
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PCT/CN2018/091488
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English (en)
French (fr)
Inventor
王运方
代凤玉
霍艳寅
曹志峰
Original Assignee
北京铂阳顶荣光伏科技有限公司
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Publication of WO2019007206A1 publication Critical patent/WO2019007206A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/24—Methods or arrangements for preventing slipperiness or protecting against influences of the weather
    • E01C11/26—Permanently installed heating or blowing devices ; Mounting thereof
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C9/00—Special pavings; Pavings for special parts of roads or airfields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/10—Supporting structures directly fixed to the ground
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/20—Supporting structures directly fixed to an immovable object
    • H02S20/21—Supporting structures directly fixed to an immovable object specially adapted for motorways, e.g. integrated with sound barriers
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/10—Cleaning arrangements
    • H02S40/12—Means for removing snow
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
    • H02S40/40—Thermal components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
    • H05B2214/02—Heaters specially designed for de-icing or protection against icing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present application designs solar power generation technology, and more particularly relates to a road surface power generation assembly.
  • distributed solar power systems provide people with a convenient energy supply.
  • distributed solar power systems require a certain plane or facade space as a site carrier.
  • winter roads For areas with high latitudes, winter roads generally produce snow accumulation, which affects the light absorption rate and thus affects the power generation effect.
  • the purpose of the present application is to provide a road surface power generation assembly to solve the problems in the prior art and improve the power generation effect.
  • the application provides a road surface power generation assembly, including a glass layer, a solar cell chip, a substrate and a thermal resistor; wherein:
  • the solar cell chip is disposed between the glass layer and the substrate; the thermoelectric resistor is embedded on the substrate.
  • thermal resistance is located in the substrate or disposed on a side of the substrate remote from the solar cell chip.
  • the solar cell chip is laid on the substrate.
  • the solar cell chip is bonded to the substrate by butyl rubber.
  • the solar cell chip is disposed on a side of the glass layer adjacent to the substrate.
  • the glass layer comprises an upper layer glass and a lower layer glass, and the upper layer glass and the lower layer glass are fixedly connected by a sheet-like bonding layer;
  • the solar cell chip is disposed on a side of the lower glass adjacent to the substrate.
  • the upper glass and the lower glass have a thickness of 3-15 mm.
  • the upper glass and the lower glass each have a thickness of 10 mm.
  • the sheet-like bonding layer has a thickness of 0.1 to 2 mm.
  • the sheet-like bonding layer is made of ethylene-vinyl acetate copolymer EVA, polyvinyl butyral PVB, polyolefin elastomer POE or 2,4,6-trimethylbenzoyl- Diphenylphosphine oxide TPO.
  • the road surface power generating component with thermal resistance provided by the present application increases the temperature of the whole component by providing a thermal resistance to melt the snow and ice on the glass layer, thereby improving the light absorption rate of the solar cell chip, thereby improving the power generation performance.
  • FIG. 1 is a schematic structural diagram of a road surface power generating assembly according to an embodiment of the present application
  • Fig. 2 is an enlarged view of a portion A of Fig. 1.
  • FIG. 1 is a schematic structural view of a road surface power generating assembly according to an embodiment of the present application
  • FIG. 2 is an enlarged view of a portion A of FIG. 1 .
  • the road surface power generating assembly with thermal resistance provided by the embodiment of the present application includes a glass layer 1, a solar cell chip 2, a substrate 4, and a thermal resistor 3.
  • the solar cell chip 2 is disposed between the glass layer 1 and the substrate 4 for absorbing light energy and generating electricity.
  • the thermal resistor 3 may be embedded in the substrate 4, that is, embedded in the inside of the substrate 4, or may be disposed on the side of the substrate 4 away from the solar cell chip 2.
  • the thermal resistance 3 is disposed on the bottom of the substrate 4 as an example, but is not limited thereto.
  • the substrate 4 is preferably made of a metal material having good thermal conductivity.
  • the substrate 4 is an aluminum substrate.
  • the road surface power generation component with thermal resistance increases the temperature of the entire road surface power generation component by providing the thermal resistance 3, so that the ice and snow on the glass layer 1 is melted, thereby improving the light absorption rate of the solar cell chip 2, thereby improving Power generation performance.
  • the solar cell chip 2 can be laid on the substrate 4 or on the side of the glass layer 1 close to the substrate 4.
  • the solar cell chip 2 can be fixed in various ways. In this embodiment, the solar cell chip 2 is fixed on the substrate 4 by butyl rubber 5 or fixed on the glass layer 1 by butyl rubber.
  • the glass layer 1 comprises an upper layer glass 11 and a lower layer glass 12, the upper layer glass 11 and the lower layer glass 12 are fixedly connected by a sheet-like bonding layer 13; the solar cell chip 2 is disposed on a side of the lower layer glass 12 close to the substrate 4 .
  • the cushioning performance of the road surface power generation component can be effectively improved, and the glass layer 1 can be prevented from being broken.
  • the thickness of the upper glass 11 and the lower glass 12 may be set to be 3-15 mm, preferably 10 mm.
  • the sheet-like adhesive layer 13 may be made of EVA (ethylene-vinyl acetate copolymer), PVB (polyvinyl butyral), POE (polyolefin elastomer) or TPO (2,4,6-trimethyl). Benzoyl-diphenylphosphine oxide) having a thickness of 0.1 to 2 mm.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Structural Engineering (AREA)
  • Civil Engineering (AREA)
  • Architecture (AREA)
  • Photovoltaic Devices (AREA)
  • Road Paving Structures (AREA)

Abstract

本申请提供了一种路面发电组件，包括玻璃层、太阳能电池芯片、基板和热电阻；所述太阳能电池芯片设置在所述玻璃层与所述基板之间；所述热电阻嵌设在所述基板中，或所述热电阻设置在所述基板远离所述太阳能电池芯片的一侧。本申请提供的具有热电阻的路面发电组件通过设置热电阻来提高整个组件温度，以使玻璃层上面的冰雪融化，提高了太阳能电池芯片的光吸收率，进而提高了发电性能。

Description

路面发电组件
本申请要求于2017年7月6日提交中国专利局、申请号为201720813685.0、发明名称为“具有热电阻的路面发电组件”的国内申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请设计太阳能发电技术，尤其涉及一种路面发电组件。
背景技术
随着新能源技术的不断发展，分布式太阳能发电系统为人们提供了便捷的能源供应。鉴于太阳能的固有特性，分布式太阳能发电系统需要一定的平面或者立面空间作为场地载体。
目前，交通领域中使用了大量的照明、监控、指示等配套电气设施，用电需求明显。除了配套电气设施的屋顶外，尚有很多位置可以安装相应的太阳能发电系统。例如公园、便道、步行街的路面可以用于进行太阳能发电，通过在其上铺设利用太阳能进行发电的路面发电组件，使其能够为景观设施、照明、监控、信息警示等配套电气设施供电。
对于纬度较高的地区，冬季的路面一般会产生积雪积霜，影响光吸收率，进而影响发电效果。
发明内容
本申请的目的是提供一种路面发电组件，以解决现有技术中的问题，提高发电效果。
本申请提供了一种路面发电组件，包括玻璃层、太阳能电池芯片、基板和热电阻；其中：
所述太阳能电池芯片设置在所述玻璃层与所述基板之间；所述热电 阻嵌设在所述基板上。
且所述热电阻位于所述基板中或设置于所述基板的远离所述太阳能电池芯片的一侧。
优选的是，所述太阳能电池芯片铺设在所述基板上。
优选的是，所述太阳能电池芯片通过丁基胶粘接在所述基板上。
优选的是，所述太阳能电池芯片设置在所述玻璃层靠近所述基板的一侧。
优选的是，所述玻璃层包括上层玻璃和下层玻璃，所述上层玻璃和所述下层玻璃通过片状粘接层固定连接；
所述太阳能电池芯片设置在下层玻璃靠近所述基板的一侧。
优选的是，所述上层玻璃和所述下层玻璃的厚度均为3-15mm。
优选的是，所述上层玻璃和所述下层玻璃的厚度均为10mm。
优选的是，所述片状粘接层的厚度为0.1-2mm。
优选的是，所述片状粘接层的材质为乙烯-醋酸乙烯酯共聚物EVA、聚乙烯醇缩丁醛PVB、聚烯烃弹性体POE或2,4,6-三甲基苯甲酰基-二苯基氧化膦TPO。
本申请提供的具有热电阻的路面发电组件通过设置热电阻来提高整个组件温度，以使玻璃层上面的冰雪融化，提高了太阳能电池芯片的光吸收率，进而提高了发电性能。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1为本申请实施例提供的路面发电组件的结构示意图；
图2为图1的A处放大图。
附图标记说明：
1-玻璃层 11-上层玻璃 12-下层玻璃 13-片状粘接层 2-太阳能电池芯片 3-热电阻 4-基板 5-丁基胶
具体实施方式
下面详细描述本申请的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本申请，而不能解释为对本申请的限制。
图1为本申请实施例提供的路面发电组件的结构示意图，图2为图1的A处放大图。
参照图1和图2所示，本申请实施例提供的具有热电阻的路面发电组件包括玻璃层1、太阳能电池芯片2、基板4和热电阻3。
其中，太阳能电池芯片2设置在玻璃层1和基板4之间，用于吸收光能后进行发电。热电阻3可以嵌设在基板4中，即嵌于基板4的内部，也可以设置在基板4远离太阳能电池芯片2的一侧。图1和图2中，以热电阻3设置在基板4底部为例，但并不以此为限。基板4优选为导热性能好的金属材质，本实施例中，基板4为铝基板。
本申请实施例提供的具有热电阻的路面发电组件通过设置热电阻3来提高整个路面发电组件的温度，以使玻璃层1上面的冰雪融化，提高了太阳能电池芯片2的光吸收率，进而提高了发电性能。
可以理解的是，太阳能电池芯片2可以铺设在基板4上，也可以设置在玻璃层1靠近基板4的一侧。太阳能电池芯片2可以通过多种方式固定，本实施例中，太阳能电池芯片2通过丁基胶5固定在基板4上，或通过丁基胶固定在玻璃层1上。
优选的是，玻璃层1包括上层玻璃11和下层玻璃12，上层玻璃11和下层玻璃12通过片状粘接层13固定连接；太阳能电池芯片2设置在下层玻璃12靠近所述基板4的一侧。通过设置双层玻璃可以有效地提 高路面发电组件的缓冲性能，避免玻璃层1破裂。
为保证玻璃层1的强度，同时尽量减少组件的整体体积，可以设置上层玻璃11和下层玻璃12的厚度均为3-15mm，优选为10mm。片状粘接层13的材质可以是EVA(乙烯-醋酸乙烯酯共聚物)、PVB(聚乙烯醇缩丁醛)、POE(聚烯烃弹性体)或TPO(2,4,6-三甲基苯甲酰基-二苯基氧化膦)，厚度为0.1-2mm。
以上依据图式所示的实施例详细说明了本申请的构造、特征及作用效果，以上所述仅为本申请的较佳实施例，但本申请不以图面所示限定实施范围，凡是依照本申请的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本申请的保护范围内。

Claims (10)

  1. 一种路面发电组件，其特征在于，包括：玻璃层、太阳能电池芯片、基板和热电阻，其中：
    所述太阳能电池芯片设置在所述玻璃层与所述基板之间；
    所述热电阻设置在所述基板上。
  2. 根据权利要求1所述的路面发电组件，其特征在于，所述太阳能电池芯片铺设在所述基板上。
  3. 根据权利要求2所述的路面发电组件，其特征在于，所述太阳能电池芯片通过丁基胶粘接在所述基板上。
  4. 根据权利要求1所述的路面发电组件，其特征在于，所述太阳能电池芯片设置在所述玻璃层靠近所述基板的一侧。
  5. 根据权利要求4所述的路面发电组件，其特征在于，所述玻璃层包括上层玻璃和下层玻璃，所述上层玻璃和所述下层玻璃通过片状粘接层固定连接；
    所述太阳能电池芯片设置在下层玻璃靠近所述基板的一侧。
  6. 根据权利要求5所述的路面发电组件，其特征在于，所述上层玻璃和所述下层玻璃的厚度均为3-15mm。
  7. 根据权利要求6所述的路面发电组件，其特征在于，所述上层玻璃和所述下层玻璃的厚度均为10mm。
  8. 根据权利要求5所述的路面发电组件，其特征在于，所述片状粘接层的厚度为0.1-2mm。
  9. 根据权利要求5所述的路面发电组件，其特征在于，所述片状粘接层的材质为乙烯-醋酸乙烯酯共聚物EVA、聚乙烯醇缩丁醛PVB、聚烯烃弹性体POE或2,4,6-三甲基苯甲酰基-二苯基氧化膦TPO。
  10. 如权利要求1所述的路面发电组件，其特征在于，所述热电阻嵌设于所述基板中，或设置在所述基板上远离所述太阳能电池芯片的一侧。
PCT/CN2018/091488 2017-07-06 2018-06-15 路面发电组件 WO2019007206A1 (zh)

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