AU2018100907A4 - Road surface power generation assembly - Google Patents
Road surface power generation assembly Download PDFInfo
- Publication number
- AU2018100907A4 AU2018100907A4 AU2018100907A AU2018100907A AU2018100907A4 AU 2018100907 A4 AU2018100907 A4 AU 2018100907A4 AU 2018100907 A AU2018100907 A AU 2018100907A AU 2018100907 A AU2018100907 A AU 2018100907A AU 2018100907 A4 AU2018100907 A4 AU 2018100907A4
- Authority
- AU
- Australia
- Prior art keywords
- glass layer
- power generation
- substrate
- road surface
- solar cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 238000010248 power generation Methods 0.000 title claims abstract description 36
- 239000011521 glass Substances 0.000 claims abstract description 51
- 239000000758 substrate Substances 0.000 claims abstract description 36
- 239000010410 layer Substances 0.000 claims description 48
- 239000012790 adhesive layer Substances 0.000 claims description 10
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 6
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 6
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 6
- 229920006124 polyolefin elastomer Polymers 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 5
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 claims description 4
- 230000031700 light absorption Effects 0.000 abstract description 4
- 230000002708 enhancing effect Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C11/00—Details of pavings
- E01C11/24—Methods or arrangements for preventing slipperiness or protecting against influences of the weather
- E01C11/26—Permanently installed heating or blowing devices ; Mounting thereof
-
- E—FIXED CONSTRUCTIONS
- E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
- E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
- E01C9/00—Special pavings; Pavings for special parts of roads or airfields
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/10—Supporting structures directly fixed to the ground
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S20/00—Supporting structures for PV modules
- H02S20/20—Supporting structures directly fixed to an immovable object
- H02S20/21—Supporting structures directly fixed to an immovable object specially adapted for motorways, e.g. integrated with sound barriers
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S30/00—Structural details of PV modules other than those related to light conversion
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/10—Cleaning arrangements
- H02S40/12—Means for removing snow
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/40—Thermal components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2214/00—Aspects relating to resistive heating, induction heating and heating using microwaves, covered by groups H05B3/00, H05B6/00
- H05B2214/02—Heaters specially designed for de-icing or protection against icing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structural Engineering (AREA)
- Civil Engineering (AREA)
- Architecture (AREA)
- Photovoltaic Devices (AREA)
- Road Paving Structures (AREA)
Abstract
A road surface power generation assembly is provided, which includes a glass layer, a solar cell chip, a substrate and a thermal resistor. The solar cell chip is arranged between the glass layer and the substrate. The thermal resistor is embedded in the substrate or arranged on 5 a side of the substrate away from the solar cell chip. With the road surface power generation assembly according to the present disclosure, a temperature of the entire assembly is increased by using the thermal resistor, such that frost, snow and ice accumulated on the glass layer can be melted, thereby enhancing a light absorption rate of the solar cell chip, thus a power generation performance can be improved. Figure 1 Enlarged view of part A Figure 2
Description
ROAD SURFACE POWER GENERATION ASSEMBLY
[0001] This application claims the priority to Chinese Patent Application No. 201720813685.0, titled "ROAD SURFACE POWER GENERATION ASSEMBLY WITH THERMAL RESISTOR", filed on July 6, 2017 with the State Intellectual Property Office of People's Republic of China, which is incorporated herein by reference in its entirety.
FIELD
[0002] The present disclosure relates to the field of solar power generation technologies, and in particular to a road surface power generation assembly.
BACKGROUND
[0003] With continuous development of new energy technologies, distributed solar power generation systems provide people with convenient energy supply. In view of inherent characteristics of the solar energy, a distributed solar power generation system requires a site such as a certain plane or space as the carrier.
[0004] At present, a great number of supporting electrical facilities such as facilities for lighting, monitoring, and instructing are used in the transportation field. Therefore, the demand for electricity is greatly increased. In addition to roofs of the supporting electrical facilities, there are many potential positions such as surfaces of lanes in a park and pedestrian zones, and surfaces of walkways for distributing the solar power generation systems. Road surface power generation assemblies for generating power using the solar energy can be distributed on these surfaces for powering the landscape infrastructures and supporting electrical facilities such as facilities for lighting, monitoring and instructing.
[0005] However, in high latitude areas, a road surface is generally covered by frost, snow and ice in winter, such that the light absorption rate of the solar cell chip is affected, thus the power generation performance is influenced.
SUMMARY
[0006] A road surface power generation assembly is provided according to the present disclosure, to solve the problem in the conventional technology, so as to improve the power generation performance.
[0007] A road surface power generation system is provided according to the present disclosure, which includes a glass layer, a solar cell chip, a substrate and a thermal resistor. The solar cell chip is arranged between the glass layer and the substrate. The thermal resistor is arranged on the substrate. The thermal resistor is embedded in the substrate or arranged on a side of the substrate away from the solar cell chip.
[0008] In an embodiment, the solar cell chip is arranged on the substrate.
[0009] In an embodiment, the solar cell chip is secured on the substrate by butyl sealant.
[0010] In an embodiment, the solar cell chip is arranged on a side of the glass layer close to the substrate.
[0011] In an embodiment, the glass layer includes an upper glass layer and a lower glass layer. The upper glass layer is secured to the lower glass layer through a sheet-shaped adhesive layer. The solar cell chip is arranged on a side of the lower glass layer close to the substrate.
[0012] In an embodiment, each of the upper glass layer and the lower glass layer has a thickness ranging from 3mm to 15mm.
[0013] In an embodiment, each of the upper glass layer and the lower glass layer has a thickness of 10mm.
[0014] In an embodiment, the sheet-shaped adhesive layer has a thickness ranging from 0.1mm to 2mm.
[0015] In an embodiment, the sheet-shaped adhesive layer is made of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), polyolefin elastomer (POE) or 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide (TPO).
[0016] With the road surface power generation assembly with a thermal resistor according to the present disclosure, a temperature of the entire road surface power generation assembly is increased by using the thermal resistor, such that frost, snow and ice accumulated on the glass layer can be melted, thereby enhancing the light absorption rate of the solar cell chip, thus the power generation performance can be improved.
BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly describe the technical solution in the embodiments of the present disclosure or the technical solution in the conventional technology, drawings to be used in the embodiments of the present disclosure or in the conventional technology are briefly described hereinafter. It is apparent that the drawings described below show merely the embodiments of the present disclosure, and those skilled in the art may obtain other drawings according to the provided drawings without any creative effort.
[0018] Figure 1 is a schematic structural diagram of a road surface power generation assembly according to an embodiment of the present disclosure; and [0019] Figure 2 is an enlarged view of a part A in Figure 1.
[0020] Reference signs in the drawings are listed as follows: 1- glass layer 11-upper glass layer 12-lower glass layer 13-sheet-shaped adhesive layer 2- solar cell chip 3-thermal resistor 4-substrate 5-butyl sealant
DETAILED DESCRIPTION OF EMBODIMENTS
[0021] The embodiments of the present disclosure are described in detail hereinafter, and are illustrated in drawings, in which the same or similar reference signs represent the same or similar elements or elements with the same or similar functions throughout the description. The embodiments described in the following with reference to the drawings are only exemplary embodiments which are used to explain the present disclosure, and should not be construed to limit the present disclosure.
[0022] Figure 1 is a schematic structural diagram of a road surface power generation assembly according to an embodiment of the present disclosure, and Figure 2 is an enlarged view of a part A in Figure 1.
[0023] Referring to Figure 1 and Figure 2, a road surface power generation assembly with a thermal resistor according to an embodiment of the present disclosure includes a glass layer 1, a solar cell chip 2, a substrate 4 and a thermal resistor 3.
[0024] The solar cell chip 2 is arranged between the glass layer 1 and the substrate 4. The solar cell chip 2 absorbs light energy and generates electrical power. The thermal resistor 3 may be embedded in the substrate 4, that is, the thermal resistor 3 is embedded inside the substrate 4. Alternatively, the thermal resistor 3 may be arranged on a side of the substrate 4 away from the solar cell chip 2. In Figure 1 and Figure 2, a case where the thermal resistor 3 is arranged on a side of the substrate 4 away from the solar cell chip is taken as an example, but the present disclosure is not limited thereto. Preferably, the substrate 4 is made of a metal material with good thermal conductivity. In this embodiment, the substrate 4 is an aluminum substrate.
[0025] With the road surface power generation assembly with a thermal resistor according to the embodiment of the present disclosure, a temperature of the entire road surface power generation assembly is increased by using the thermal resistor 3, such that frost, snow and ice accumulated on the glass layer 1 can be melted, thereby enhancing the light absorption rate of the solar cell chip 2, thus the power generation performance can be improved.
[0026] It is to be understood that the solar cell chip 2 may be arranged on the substrate 4 or may be arranged on a side of the glass layer 1 close to the substrate 4. The solar cell chip 2 may be secured in various ways. In the embodiment, the solar cell chip 2 is secured on the substrate 4 by butyl sealant 5, or the solar cell chip 2 is secured on the glass layer 1 by the butyl sealant 5.
[0027] Preferably, the glass layer 1 includes an upper glass layer 11 and a lower glass layer 12. The upper glass layer 11 is secured to the lower glass layer 12 through a sheet-shaped adhesive layer 13. The solar cell chip 2 is arranged on a side of the lower glass layer 12 close to the substrate 4. By providing the two-layered glass layer, a cushioning performance of the road surface power generation assembly can be effectively improved, thereby avoiding fracturing of the glass layer 1.
[0028] In order to ensure the strength of the glass layer 1 while minimizing an overall volume of the assembly, each of the upper glass layer 11 and the lower glass layer 12 may have a thickness ranging from 3mm to 15mm. Preferably, each of the upper glass layer 11 and the lower glass layer 12 may have a thickness of 10mm. The sheet-shaped adhesive layer 13 may be made of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), polyolefin elastomer (POE) or 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide (TPO). The sheet-shaped adhesive layer 13 has a thickness ranging from 0.1mm to 2mm.
[0029] Structure, characteristics and effects of the present disclosure are described above in detail based on the embodiments illustrated in drawings. The embodiments described above are only preferred embodiments of the present disclosure. The present disclosure is not limited to the scope of implementation as illustrated by the drawings. Any simple changes, equivalents and modifications made to the embodiments based on the technical essence of the present disclosure without departing from the technical solution of the present disclosure fall within the protection scope of the technical solution of the present disclosure.
Claims (10)
1. A road surface power generation assembly, comprising: a glass layer, a solar cell chip, a substrate and a thermal resistor, wherein the solar cell chip is arranged between the glass layer and the substrate, and the thermal resistor is arranged on the substrate.
2. The road surface power generation assembly according to claim 1, wherein the solar cell chip is arranged on the substrate.
3. The road surface power generation assembly according to claim 2, wherein the solar cell chip is secured on the substrate by butyl sealant.
4. The road surface power generation assembly according to claim 1, wherein the solar cell chip is arranged on a side of the glass layer close to the substrate.
5. The road surface power generation assembly according to claim 4, wherein the glass layer comprises an upper glass layer and a lower glass layer, the upper glass layer is secured to the lower glass layer through a sheet-shaped adhesive layer, and the solar cell chip is arranged on a side of the lower glass layer close to the substrate.
6. The road surface power generation assembly according to claim 5, wherein each of the upper glass layer and the lower glass layer has a thickness ranging from 3mm to 15mm.
7. The road surface power generation assembly according to claim 6, wherein each of the upper glass layer and the lower glass layer has a thickness of 10mm.
8. The road surface power generation assembly according to claim 5, wherein the sheet-shaped adhesive layer has a thickness ranging from 0.1mm to 2mm.
9. The road surface power generation assembly according to claim 5, wherein the sheet-shaped adhesive layer is made of ethylene-vinyl acetate copolymer (EVA), polyvinyl butyral (PVB), polyolefin elastomer (POE) or 2,4,6-trimethylbenzoyl-diphenyl phosphine oxide (TPO).
10. The road surface power generation assembly according to claim 1, wherein the thermal resistor is embedded in the substrate or arranged on a side of the substrate away from the solar cell chip.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201720813685.0U CN206894586U (en) | 2017-07-06 | 2017-07-06 | Road surface electrification component with thermal resistance |
CN201720813685.0 | 2017-07-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2018100907A4 true AU2018100907A4 (en) | 2018-08-02 |
Family
ID=61298943
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2018100907A Ceased AU2018100907A4 (en) | 2017-07-06 | 2018-06-29 | Road surface power generation assembly |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP3217962U (en) |
KR (1) | KR20190000158U (en) |
CN (1) | CN206894586U (en) |
AU (1) | AU2018100907A4 (en) |
WO (1) | WO2019007206A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206894586U (en) * | 2017-07-06 | 2018-01-16 | 北京铂阳顶荣光伏科技有限公司 | Road surface electrification component with thermal resistance |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001250973A (en) * | 2000-03-06 | 2001-09-14 | Sanyo Electric Co Ltd | Solar battery panel |
CN201340855Y (en) * | 2008-12-12 | 2009-11-04 | 广东金刚玻璃科技股份有限公司 | Solar energy photovoltaic assembly capable of removing ice and snow |
US20110192442A1 (en) * | 2010-02-08 | 2011-08-11 | Du Pont Apollo Limited | Photovoltaic module with embedded junction box and photovoltaic window with the same |
CN201854223U (en) * | 2010-10-27 | 2011-06-01 | 广州市碧日能源科技有限公司 | Solar photo-thermal semiconductor temperature-difference generating hot water system |
CN206894586U (en) * | 2017-07-06 | 2018-01-16 | 北京铂阳顶荣光伏科技有限公司 | Road surface electrification component with thermal resistance |
CN107222165A (en) * | 2017-07-06 | 2017-09-29 | 北京铂阳顶荣光伏科技有限公司 | Road surface electricity generation system with heater |
-
2017
- 2017-07-06 CN CN201720813685.0U patent/CN206894586U/en active Active
-
2018
- 2018-06-15 WO PCT/CN2018/091488 patent/WO2019007206A1/en active Application Filing
- 2018-06-29 JP JP2018002474U patent/JP3217962U/en not_active Expired - Fee Related
- 2018-06-29 AU AU2018100907A patent/AU2018100907A4/en not_active Ceased
- 2018-07-06 KR KR2020180003111U patent/KR20190000158U/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2019007206A1 (en) | 2019-01-10 |
KR20190000158U (en) | 2019-01-16 |
CN206894586U (en) | 2018-01-16 |
JP3217962U (en) | 2018-09-13 |
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FGI | Letters patent sealed or granted (innovation patent) | ||
MK21 | Patent ceased section 101c(b)/section 143a(c)/reg. 9a.4 - examination under section 101b had not been carried out within the period prescribed |