WO2019007170A1 - 路面发电组件 - Google Patents

路面发电组件 Download PDF

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Publication number
WO2019007170A1
WO2019007170A1 PCT/CN2018/089507 CN2018089507W WO2019007170A1 WO 2019007170 A1 WO2019007170 A1 WO 2019007170A1 CN 2018089507 W CN2018089507 W CN 2018089507W WO 2019007170 A1 WO2019007170 A1 WO 2019007170A1
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WO
WIPO (PCT)
Prior art keywords
glass
layer
road surface
substrate
power generating
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PCT/CN2018/089507
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English (en)
French (fr)
Inventor
王运方
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北京铂阳顶荣光伏科技有限公司
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Publication of WO2019007170A1 publication Critical patent/WO2019007170A1/zh

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    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/20—Supporting structures directly fixed to an immovable object
    • H02S20/21—Supporting structures directly fixed to an immovable object specially adapted for motorways, e.g. integrated with sound barriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0488—Double glass encapsulation, e.g. photovoltaic cells arranged between front and rear glass sheets
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C1/00—Design or layout of roads, e.g. for noise abatement, for gas absorption
    • E01C1/002—Design or lay-out of roads, e.g. street systems, cross-sections ; Design for noise abatement, e.g. sunken road
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01C—CONSTRUCTION OF, OR SURFACES FOR, ROADS, SPORTS GROUNDS, OR THE LIKE; MACHINES OR AUXILIARY TOOLS FOR CONSTRUCTION OR REPAIR
    • E01C11/00—Details of pavings
    • E01C11/24—Methods or arrangements for preventing slipperiness or protecting against influences of the weather
    • E—FIXED CONSTRUCTIONS
    • E01—CONSTRUCTION OF ROADS, RAILWAYS, OR BRIDGES
    • E01F—ADDITIONAL WORK, SUCH AS EQUIPPING ROADS OR THE CONSTRUCTION OF PLATFORMS, HELICOPTER LANDING STAGES, SIGNS, SNOW FENCES, OR THE LIKE
    • E01F11/00—Road engineering aspects of Embedding pads or other sensitive devices in paving or other road surfaces, e.g. traffic detectors, vehicle-operated pressure-sensitive actuators, devices for monitoring atmospheric or road conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0236—Special surface textures
    • H01L31/02366—Special surface textures of the substrate or of a layer on the substrate, e.g. textured ITO/glass substrate or superstrate, textured polymer layer on glass substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S20/00—Supporting structures for PV modules
    • H02S20/10—Supporting structures directly fixed to the ground
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
    • H02S30/00—Structural details of PV modules other than those related to light conversion
    • H02S30/10—Frame structures
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the present invention relates to solar power generation technology, and more particularly to a road surface power generation assembly having double glazing.
  • the solar energy application in the transportation field can also be applied to solar power generation design.
  • non-motorized roads account for a large proportion, such as parks, pedestrian streets, etc.
  • the road surface can be used for solar energy, and solar cell chips are laid thereon, which becomes an integrated carrier for functions such as landscape facilities, lighting, monitoring, and information warning.
  • An object of the present invention is to provide a road surface power generating assembly having double glazing to solve the problems in the prior art and improve the tolerance of a road surface on which a road surface power generating assembly is laid.
  • the invention provides a road surface power generation assembly, comprising: a substrate, a solar cell chip and a glass layer;
  • the glass layer includes an upper layer glass and a lower layer glass fixedly connected by a sheet-like bonding layer, and the solar cell chip is disposed between the lower layer glass and the substrate.
  • the solar cell chip is laid on the substrate and located on a side of the substrate facing the lower glass.
  • the solar cell chip is laid on the lower glass and on a side of the lower glass facing the substrate.
  • a closed cavity is provided between the substrate and the glass layer, and an inert gas is disposed in the cavity.
  • a sealant is provided on a side between the substrate and the lower glass, and a structural adhesive is provided on a side between the substrate and the upper glass.
  • a light emitting belt is disposed between the lower glass and the structural adhesive.
  • the upper surface of the upper glass is provided with an anti-slip layer, and the anti-slip layer is provided with a hard coating layer.
  • the sheet-like bonding layer is made of EVA, PVB, POE or TPO.
  • the road surface power generating assembly as described above, wherein, preferably, the upper glass and the lower glass have a thickness of 3-15 mm; the sheet bonding layer has a thickness of 0.1-2 mm; The height is 8-20mm.
  • the upper glass and the lower glass have a thickness of 10 mm, and the cavity has a height of 12.5 mm.
  • the solar cell chip is effectively protected by providing a glass layer, and the tolerance of the road surface on which the road surface power generating component is laid is improved.
  • the double-glazed glass can be combined by hot pressing, which effectively prevents breakage and does not fall off, thereby improving safety.
  • the double-glazed glass is connected by a sheet-like adhesive layer to realize a soft connection, which improves the toughness of the glass and improves the cushioning effect.
  • FIG. 1 is a schematic structural view of a road surface power generating assembly with double glazing according to an embodiment of the present invention
  • Figure 2 is an enlarged view of A in Figure 1.
  • FIG. 1 is a schematic structural diagram of a road surface power generating assembly with double-layer glass according to an embodiment of the present invention.
  • the embodiment of the present invention provides a road surface power generating assembly including a substrate 1, a solar cell chip 2, and a glass layer.
  • the glass layer includes an upper layer glass 4 and a lower layer glass 5, and the upper layer glass 4 and the lower layer glass 5 are fixedly connected by a sheet-like bonding layer 3, and the solar cell chip 2 is disposed between the lower layer glass 5 and the substrate 1.
  • the material of the sheet-like bonding layer 3 may be EVA (English name: ethylene-vinyl acetate copo; Chinese full name: ethylene-vinyl acetate copolymer), PVB (English full name: polyvinyl butyral; Chinese full name: polyvinyl butyral) , POE (English full name: Polyolyaltha Olfin; Chinese full name: polyethylene octene coelastomer) or TPO (English full name: Thermoplastic polyolefin; Chinese full name: thermoplastic polyolefin elastomer).
  • the thickness of the upper glass 4 and the lower glass 5 is 3-15 mm, preferably 10 mm; the thickness of the sheet bonding layer is 0.1-2 mm.
  • the solar cell chip is effectively protected by providing a glass layer, and the tolerance of the road surface on which the road surface power generation component is paved is improved.
  • the double-glazed glass can be combined by hot pressing, which effectively prevents breakage and does not fall off, thereby improving safety.
  • the double-glazed glass is connected by a sheet-like adhesive layer to realize a soft connection, which improves the toughness of the glass and improves the cushioning effect.
  • the road surface power generating assembly provided by the embodiment of the present invention is used for mounting on a road surface.
  • the substrate 1 is disposed on a road surface
  • the solar cell chip 2 is located between the substrate 1 and the lower glass 5.
  • the solar cell chip 2 may be laid on the substrate 1 and located on the side of the substrate 1 facing the lower glass 5.
  • the solar cell chip 2 may be laid on the lower glass 5 and on the side of the lower glass 5 facing the substrate 1.
  • the solar cell chip 2 and the substrate 1 or the lower glass 5 may be fixed by butyl bonding or may be fixed by other means.
  • a closed cavity 6 is provided between the substrate 1 and the glass layer, and further, an inert gas is provided in the cavity 6.
  • the inert gas is disposed to prevent moisture from entering the cavity 6, thereby preventing the solar cell chip 2 from being affected by moisture and impairing performance.
  • the height of the cavity 6 is 8-20 mm, preferably 12.5 mm.
  • the closed cavity 6 can be realized by providing a sealant 7 on the side between the substrate 1 and the lower glass 5, and a structural adhesive 8 on the side between the substrate 1 and the upper glass 4, with reference to FIG. 1 and figure 2.
  • the sealant 7 can be made of butyl rubber
  • the structural adhesive 8 can be made of silicone structural adhesive 8.
  • a light-emitting strip 9 may be disposed between the lower glass 5 and the structural adhesive 8 described above.
  • an anti-slip layer is provided on the upper surface of the upper glass 4, and the anti-slip layer can be formed by acid etching.
  • a hard coating is provided on the anti-slip layer to increase the wear resistance of the upper glass 4.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Photovoltaic Devices (AREA)
  • Road Signs Or Road Markings (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Floor Finish (AREA)
  • Road Paving Structures (AREA)
  • Laminated Bodies (AREA)

Abstract

本发明提供了一种路面发电组件，包括：基板、太阳能电池芯片和玻璃层；所述玻璃层包括通过片状粘接层固定连接的上层玻璃和下层玻璃，所述太阳能电池芯片设置在所述下层玻璃和所述基板之间。本发明提供的路面发电组件通过设置玻璃层有效地对太阳能电池芯片进行保护，提高了路面发电组件在路面上的耐受度，并通过设置双层的玻璃，双层玻璃之间可通过热压结合，有效地防止破碎，不会脱落，提高了安全性。另外，双层玻璃之间通过片状粘接层进行连接，实现了软性连接，对玻璃的韧性有所提高，提高了缓冲的效果。

Description

路面发电组件
本申请要求于2017年07月06日提交中国专利局、申请号为201720812955.6、发明名称为“具有双层玻璃的路面发电组件”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及太阳能发电技术，尤其涉及一种具有双层玻璃的路面发电组件。
背景技术
随着新能源技术的不断发展，分布式太阳能为人们提供了更为便捷的能源供应。分布式太阳能发电需要一定的平面或者立面空间作为场地载体。
目前，交通领域中使用了大量的照明、监控、指示等配套电气设施，用电需求明显，而交通领域中的太阳能应用除了服务设施屋顶面积外，尚有很多空间位置还可以应用太阳能发电设计。其中，非机动车道路占比很大，例如公园、步行街等，其路面可以进行太阳能利用，在其上铺设太阳能电池芯片，成为景观设施、照明、监控、信息警示等功能的集成载体。
但是，由于铺设了太阳能电池芯片的路面经常被踩踏和磕碰，导致路面耐受度较差，且在长时间使用后，影响太阳能电池芯片的光吸收率。
发明内容
本发明的目的是提供一种具有双层玻璃的路面发电组件，以解决现有技术中的问题，提高铺设了路面发电组件的路面的耐受度。
本发明提供了一种路面发电组件，其中，包括：基板、太阳能电池芯片和 玻璃层；
所述玻璃层包括通过片状粘接层固定连接的上层玻璃和下层玻璃，所述太阳能电池芯片设置在所述下层玻璃和所述基板之间。
如上所述的路面发电组件，其中，优选的是，所述太阳能电池芯片铺设在所述基板上，且位于所述基板朝向所述下层玻璃的一侧。
如上所述的路面发电组件，其中，优选的是，所述太阳能电池芯片铺设在所述下层玻璃上，且位于所述下层玻璃朝向所述基板的一侧。
如上所述的路面发电组件，其中，优选的是，所述基板与所述玻璃层之间设置有封闭的空腔，所述空腔内设置有惰性气体。
如上所述的路面发电组件，其中，优选的是，所述基板与所述下层玻璃之间的边侧设置有密封胶，所述基板与所述上层玻璃之间的边侧设置有结构胶。
如上所述的路面发电组件，其中，优选的是，所述下层玻璃与所述结构胶之间设置有发光带。
如上所述的路面发电组件，其中，优选的是，所述上层玻璃的上表面设置有防滑层，所述防滑层上设置有硬化涂层。
如上所述的路面发电组件，其中，优选的是，所述片状粘接层的材质为EVA、PVB、POE或TPO。
如上所述的路面发电组件，其中，优选的是，所述上层玻璃和所述下层玻璃的厚度均为3-15mm；所述片状粘接层的厚度为0.1-2mm；所述空腔的高度为8-20mm。
如上所述的路面发电组件，其中，优选的是，所述上层玻璃和所述下层玻璃的厚度均为10mm，所述空腔的高度为12.5mm。
本发明提供的路面发电组件中，通过设置玻璃层有效地对太阳能电池芯片进行保护，提高了铺设有路面发电组件的路面的耐受度。通过设置双层的玻璃，双层玻璃之间可通过热压结合，有效地防止破碎，不会脱落，提高了安全性。另外，双层玻璃之间通过片状粘接层进行连接，实现了软性连接，对玻璃的韧性有所提高，提高了缓冲的效果。
附图说明
图1为本发明实施例提供的具有双层玻璃的路面发电组件的结构示意图；
图2为图1中的A处放大图。
附图标记说明：
1-基板 2-太阳能电池芯片 3-片状粘接层 4-上层玻璃 5-下层玻璃 6-空腔 7-密封胶 8-结构胶 9-发光带
具体实施方式
下面详细描述本发明的实施例，所述实施例的示例在附图中示出，其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的，仅用于解释本发明，而不能解释为对本发明的限制。
图1为本发明实施例提供的具有双层玻璃的路面发电组件的结构示意图，本发明实施例提供了一种路面发电组件，包括基板1、太阳能电池芯片2和玻璃层。
其中，玻璃层包括上层玻璃4和下层玻璃5，上层玻璃4和下层玻璃5之间通过片状粘接层3固定连接，太阳能电池芯片2设置在下层玻璃5和基板1之间。片状粘接层3的材质可以是EVA(英文全称：ethylene-vinyl acetate copo； 中文全称：乙烯-醋酸乙烯共聚物)、PVB(英文全称：polyvinyl butyral；中文全称：聚乙烯醇缩丁醛)、POE(英文全称：Polyolyaltha Olfin；中文全称：聚乙烯辛烯共弹性体)或TPO(英文全称：Thermoplastic polyolefin；中文全称：热塑性聚烯烃弹性体)。为满足强度要求，上层玻璃4和下层玻璃5的厚度均为3-15mm，优选为10mm；片状粘接层的厚度为0.1-2mm。
本发明实施例提供的路面发电组件中，通过设置玻璃层有效地对太阳能电池芯片进行保护，提高了铺设有路面发电组件的路面的耐受度。通过设置双层的玻璃，双层玻璃之间可通过热压结合，有效地防止破碎，不会脱落，提高了安全性。另外，双层玻璃之间通过片状粘接层进行连接，实现了软性连接，对玻璃的韧性有所提高，提高了缓冲的效果。
本发明实施例提供的路面发电组件用于安装在路面上，具体地，基板1设置在路面上，而太阳能电池芯片2位于基板1与下层玻璃5之间。其中，优选地，太阳能电池芯片2可以铺设在基板1上，且位于基板1朝向下层玻璃5的一侧。或者，也可以是，将太阳能电池芯片2铺设在下层玻璃5上，且位于下层玻璃5朝向基板1的一侧。其中，太阳能电池芯片2与基板1或下层玻璃5之间可以通过丁基胶粘接固定，也可以通过其他方式固定。
为了避免玻璃层对太阳能电池芯片2的压力对太阳能电池芯片2造成损坏，优选地，在基板1与玻璃层之间设置有封闭的空腔6，进一步地，空腔6内设置有惰性气体。惰性气体的设置可以避免空腔6内进入水汽，进而避免了太阳能电池芯片2受到水汽影响而性能受损。本实施例中，空腔6的高度为8-20mm，优选为12.5mm。
上述封闭的空腔6可以通过如下方式实现：基板1与下层玻璃5之间的边 侧设置有密封胶7，基板1与上层玻璃4之间的边侧设置有结构胶8，参照图1和图2。密封胶7可以采用丁基胶，结构胶8可以采用硅酮结构胶8。
为了增加路面发电组件的夜间显示效果，可以在下层玻璃5与上述结构胶8之间设置发光带9。
进一步地，在上层玻璃4的上表面设置有防滑层，防滑层可通过酸腐蚀形成。防滑层上设置有硬化涂层，从而提高上层玻璃4的耐磨硬度。
以上依据图式所示的实施例详细说明了本发明的构造、特征及作用效果，以上所述仅为本发明的较佳实施例，但本发明不以图面所示限定实施范围，凡是依照本发明的构想所作的改变，或修改为等同变化的等效实施例，仍未超出说明书与图示所涵盖的精神时，均应在本发明的保护范围内。

Claims (10)

  1. 一种路面发电组件，其特征在于，包括：基板、太阳能电池芯片和玻璃层；
    所述玻璃层包括通过片状粘接层固定连接的上层玻璃和下层玻璃，所述太阳能电池芯片设置在所述下层玻璃和所述基板之间。
  2. 根据权利要求1所述的路面发电组件，其特征在于，所述太阳能电池芯片铺设在所述基板上，且位于所述基板朝向所述下层玻璃的一侧。
  3. 根据权利要求1所述的路面发电组件，其特征在于，所述太阳能电池芯片铺设在所述下层玻璃上，且位于所述下层玻璃朝向所述基板的一侧。
  4. 根据权利要求1所述的路面发电组件，其特征在于，所述基板与所述玻璃层之间设置有封闭的空腔，所述空腔内设置有惰性气体。
  5. 根据权利要求4所述的路面发电组件，其特征在于，所述基板与所述下层玻璃之间的边侧设置有密封胶，所述基板与所述上层玻璃之间的边侧设置有结构胶。
  6. 根据权利要求5所述的路面发电组件，其特征在于，所述下层玻璃与所述结构胶之间设置有发光带。
  7. 根据权利要求1所述的路面发电组件，其特征在于，所述上层玻璃的上表面设置有防滑层，所述防滑层上设置有硬化涂层。
  8. 根据权利要求1-7任一项所述的路面发电组件，其特征在于，所述片状粘接层的材质为EVA、PVB、POE或TPO。
  9. 根据权利要求1-7任一项所述的路面发电组件，其特征在于，所述上层玻璃和所述下层玻璃的厚度均为3-15mm；所述片状粘接层的厚度为 0.1-2mm；所述空腔的高度为8-20mm。
  10. 根据权利要求9所述的路面发电组件，其特征在于，所述上层玻璃和所述下层玻璃的厚度均为10mm，所述空腔的高度为12.5mm。
PCT/CN2018/089507 2017-07-06 2018-06-01 路面发电组件 WO2019007170A1 (zh)

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