WO2019003600A1 - Composition de résine d'étanchéité, composant électronique et procédé de fabrication de composant électronique - Google Patents

Composition de résine d'étanchéité, composant électronique et procédé de fabrication de composant électronique Download PDF

Info

Publication number
WO2019003600A1
WO2019003600A1 PCT/JP2018/016120 JP2018016120W WO2019003600A1 WO 2019003600 A1 WO2019003600 A1 WO 2019003600A1 JP 2018016120 W JP2018016120 W JP 2018016120W WO 2019003600 A1 WO2019003600 A1 WO 2019003600A1
Authority
WO
WIPO (PCT)
Prior art keywords
resin composition
film capacitor
electronic component
sealing resin
epoxy resin
Prior art date
Application number
PCT/JP2018/016120
Other languages
English (en)
Japanese (ja)
Inventor
悠香里 峯岸
Original Assignee
京セラ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 京セラ株式会社 filed Critical 京セラ株式会社
Publication of WO2019003600A1 publication Critical patent/WO2019003600A1/fr

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/09—Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/22—Expanded, porous or hollow particles
    • C08K7/24—Expanded, porous or hollow particles inorganic
    • C08K7/26—Silicon- containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/10—Housing; Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors

Definitions

  • the present invention relates to a resin composition for sealing, an electronic component and a method for manufacturing the electronic component, and in particular, a resin composition for sealing suitable for manufacturing a film capacitor excellent in low moisture permeability etc., a film capacitor and a method for manufacturing the same About.
  • the film capacitor element is housed in an injection mold having a cavity recess capable of housing a film capacitor element, and the injection molding die is clamped to inject a polyphenylene sulfide resin into the cavity.
  • a method of resin-sealing a film capacitor element housed inside to form an outer cover of the film capacitor element, and impregnating a resin between wound films of the film capacitor element for example, a patent) Reference 2.
  • an epoxy resin composition in which an inorganic water-absorbing material is added to a composition having a predetermined range of a moisture diffusion coefficient of a cured product using an epoxy resin which has low moisture permeability of the cured product and is suitable as a pre-mold type hollow package material.
  • Patent Document 3 An epoxy resin composition in which an inorganic water-absorbing material is added to a composition having a predetermined range of a moisture diffusion coefficient of a cured product using an epoxy resin which has low moisture permeability of the cured product and is suitable as a pre-mold type hollow package material.
  • a hygroscopic layer is formed on part of the conductive layer in an electronic component such as a solid electrolytic capacitor (see, for example, Patent Document 4), and silica gel or the like is contained in solid epoxy resin (for example, Patent Document 5), etc. have been proposed.
  • Japanese Examined Patent Publication 5-77324 Japanese Patent Application Laid-Open No. 7-161578 Japanese Patent Laid-Open No. 7-216196 JP, 2017-59652, A Unexamined-Japanese-Patent No. 9-286845 gazette
  • Patent Document 5 the type of the electronic component that can be sealed with a high resin viscosity is only applicable to a limited type, and application to a film capacitor element or the like is difficult.
  • the present invention has been made in view of such circumstances, and is a film capacitor excellent in reliability with no occurrence of voids, a good appearance, a low moisture permeability of a cured product, and a low rate of change in capacitance. It is an object of the present invention to provide a resin composition suitable for the production of the present invention, and a film capacitor using the resin composition.
  • the sealing resin composition of the present invention comprises (A) a liquid epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) a porous filler, and (E) the above (D) )
  • An inorganic filler other than a porous filler is contained as an essential component.
  • the electronic component of the present invention is characterized in that the electronic element is sealed with the cured product of the sealing resin composition of the present invention.
  • the sealing resin composition of the present invention is injected into the mold; It is characterized in that it is cured and molded while applying pressure.
  • a material suitable for sealing an electronic element can be provided because the moldability is excellent, the cured product has low moisture permeability, and the change rate of capacitance is small.
  • the electronic element since the electronic element is sealed with the sealing resin composition, it has low moisture permeability, a small change rate of capacitance, and reliability. Can provide excellent electronic components. Thereby, the capacitor characteristic of the electronic component can also be improved.
  • the sealing resin composition of the present embodiment includes (A) liquid epoxy resin, (B) curing agent, (C) curing accelerator, and (D) porous filler (E).
  • the inorganic filler other than the (D) porous filler is contained as an essential component, and each of these components will be described below.
  • the liquid epoxy resin (A) used in the present embodiment is a liquid epoxy resin having one or more epoxy groups per molecule at room temperature, and preferably two or more epoxy groups per molecule.
  • examples of such an epoxy resin include bisphenol A epoxy resin, bisphenol F epoxy resin, bisphenol AD epoxy resin, novolac epoxy resin, glycidyl ester epoxy resin, alicyclic epoxy resin, glycidyl ether and the like. Be These can be used alone or in combination of two or more.
  • any curing agent for the liquid epoxy resin (A) may be used without particular limitation as long as it is conventionally used as a curing agent for epoxy resin. be able to.
  • the (B) curing agent include an acid anhydride curing agent, an amine curing agent, a phenol resin curing agent and the like. These can be used singly or in combination of two or more.
  • the acid anhydride curing agent examples include tetrahydrophthalic anhydride, methyltetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride, etc.
  • Specific examples of the amine curing agent Examples include isophorone diamine, 1,3-bis (aminomethyl) cyclohexane, bis (4-aminocyclohexyl) methane, norbornene diamine, 1,2-diaminocyclohexane, laromine and the like.
  • HN2000, HN5500 manufactured by Hitachi Chemical
  • ancamine 1618, ancamine 2074, ancamine 2228 manufactured by Air Products Japan
  • Daitoclar F-5194 Daitoclar B-1616 (made by Daito Sangyo)
  • Fujicure FXD -821 Fujicure 4233 (manufactured by Fuji Kasei Kogyo Co., Ltd.)
  • JER cure 113 manufactured by Mitsubishi Chemical Corporation
  • Lamillon C-260 manufactured by BASF Corporation
  • the amount of the curing agent (B) is preferably in the range of 0.7 to 1.3 equivalents of the curable functional group of the cured product (B) per equivalent of the epoxy group of the liquid epoxy resin (A).
  • the range of 9 to 1.1 equivalents is more preferable. If the above range is exceeded, properties such as heat resistance, mechanical properties and moisture resistance of the cured product may be reduced.
  • the curing accelerator (C) used in the present embodiment is a known curing accelerator used in an epoxy resin curing system.
  • Examples of the curing accelerator (C) include aromatic dimethylurea, aliphatic dimethylurea, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), and 3- (3-chloro-4).
  • urea such as 2,4-bis (3,3-dimethylureido) toluene, benzyldimethylamine, 1,8-diazabicyclo (5.4.0) undecen-7
  • Tertiary amine compounds such as triethylamine, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-phenylimidazole, 2 Imidazole compounds such as -phenyl-4-methylimidazole, triphenylphosphine salts etc. Phosphine salt compounds, and the like.
  • These curing accelerators may be used alone or in combination of two or more.
  • an imidazole-based curing accelerator can be preferably used from the viewpoint of low moisture permeability and humidity resistance.
  • the compounding amount of the (C) curing accelerator is 100 parts by mass of the total amount of the (A) liquid epoxy resin and the (B) curing agent from the viewpoint of the balance between the curing accelerating property and the physical properties of the cured resin, etc. It is usually in the range of about 0.1 to 10 parts by mass, preferably 0.4 to 5 parts by mass.
  • the (D) porous filler used in the present embodiment is a substance that can be used as a filler having a large number of fine pores, and has a specific surface area of 50 to 20000 m 2 / g and an average pore size of 0.1 nm to 1000 nm.
  • the (D) porous filler for example, silica gel, cellulose, zeolite, molecular sieve, diatomaceous earth, perlite, etc. can be used without particular limitation as long as it is a porous filler having the above characteristics, and silica gel is preferable.
  • the (D) porous filler preferably has a specific surface area of 100 to 10000 m 2 / g and an average pore diameter of 1 to 50 nm, and a specific surface area of 400 to 1000 m 2 / g and an average pore diameter of 1 to 20 nm More preferable.
  • the adsorption efficiency will be low, and if it is more than 10000 m 2 / g, the flowability at the time of injection may be reduced and unfilled parts may be generated. .
  • the average pore diameter of the (D) porous filler is less than 1 nm, the adsorption efficiency is low, and when it is more than 50 nm, good mechanical properties may not be obtained.
  • the specific surface area was calculated by the BET method by measuring the amount of adsorption by the gas adsorption method.
  • the average pore diameter was also measured using the specific surface area and total pore volume calculated from the BET method by measuring the adsorption amount by the gas adsorption method.
  • the average particle diameter of the (D) porous filler is preferably 0.5 to 100 ⁇ m, and more preferably 1 to 50 ⁇ m.
  • the average particle diameter is obtained by measuring a particle size distribution based on volume using a laser scattering particle size distribution analyzer (for example, LA-920 (trade name, manufactured by Horiba, Ltd.) etc.) Indicates the 50% integrated value (50% particle size).
  • the porous filler (D) is preferably contained in an amount of 1 to 10% by mass, preferably 2 to 5% by mass, based on the total amount of the resin composition. If the amount of the porous filler is less than 1% by mass, the moisture permeation resistance may be insufficient. On the other hand, when it is more than 10% by mass, the viscosity of the resin composition is increased, the fluidity at the time of injection is decreased, and there is a possibility that an unfilled portion may be generated.
  • the inorganic filler other than the (E) porous filler used in the present embodiment is a known inorganic filler to be blended in the resin composition, and it is other than the above (D) porous filler It is not particularly limited.
  • the (E) inorganic filler include silica, alumina, silicon nitride, boron nitride, magnesia, boehmite, calcium carbonate, aluminum hydroxide, talc and the like.
  • silica powder is preferably used, and in particular, use of spherical silica powder is preferable.
  • the (E) inorganic filler may be used alone or in combination of two or more.
  • the compounding amount of the (E) inorganic filler is preferably 50 to 85% by mass, preferably 70 to 85% by mass, based on the total amount of the resin composition. If the compounding amount of the (E) inorganic filler is less than 50% by mass, distortion or breakage of a structure such as an electronic element or an electrode due to shrinkage of a cured product may easily occur, and moisture permeation resistance may be insufficient. On the other hand, when the compounding amount is more than 85% by mass, the flowability at the time of injection is lowered, and unfilled portions are generated, which is not preferable. The thermal shock resistance of hardened
  • the average particle diameter of the (E) inorganic filler used here is preferably 0.5 to 100 ⁇ m, more preferably 10 to 30 ⁇ m.
  • the (E) inorganic filler in the present embodiment it is preferable to use two or more types of fillers having the same material but different average particle sizes, because the flowability at the time of injection becomes good.
  • a filler based on 100% by mass of the whole (E) inorganic filler, 70 to 90% by mass of spherical fused silica having an average particle size of more than 15 ⁇ m and 25 ⁇ m or less and 10 to 30 spherical fused silica having an average particle size of 1 to 5 ⁇ m It is more preferable to contain in the range of mass%.
  • spherical fused silica it is particularly preferable to constitute the (E) inorganic filler only with the above-mentioned spherical fused silica.
  • silica powder which consists of fusion crushing silica and crystalline silica for the remaining filler It is preferable from the viewpoint of low water absorption and low moisture permeability of the cured product.
  • the total amount of the component (D) and the component (E) is preferably in the range of 51 to 95% by mass, preferably in the range of 77 to 90% by mass, based on the total weight of the resin composition. If the amount is less than 51% by mass, the low water absorption and low moisture permeability of the cured product may be insufficient. If the amount is more than 95% by mass, the flowability at the time of injection may be reduced and unfilled portions may be generated.
  • a coupling agent for example, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, etc.
  • Mold release agents eg, synthetic waxes, natural waxes, linear aliphatic metal salts, acid amides, esters, etc.
  • colorants eg, carbon black, cobalt blue, etc.
  • low stressing agents eg, silicones
  • an antifoamer, etc. may be further blended.
  • roll kneading such as a three-roll kneader or the like, or It can be easily manufactured by a conventionally known method in which the kneading treatment is carried out by mixer kneading and the like and then the pressure is removed under reduced pressure.
  • the resin composition of the present embodiment preferably has a viscosity at 60 ° C. of less than 100 Pa ⁇ s.
  • a viscosity at 60 ° C. of less than 100 Pa ⁇ s.
  • the viscosity is 100 Pa ⁇ s or more, the flowability at the time of injection in the molding operation may be reduced, and there may be an unfilled portion.
  • the gel time at 100 ° C. is preferably 5 to 30 minutes.
  • the gel time is 5 minutes or less, voids are easily generated in the cured product, and when the gel time is 30 minutes or more, the shape retention of the cured product is deteriorated.
  • an electronic component such as a film capacitor which exhibits stable capacitance, low moisture permeability and good appearance, and such an electronic component is excellent in reliability. is there.
  • the electronic component of the present embodiment has an electronic element, and the electronic element is sealed with the cured product of the sealing resin composition of the present embodiment.
  • a film capacitor element As an electronic element used here, a film capacitor element, an electrolytic capacitor element, a ceramic capacitor element, etc. are mentioned. A film capacitor element is preferable as the electronic element. Moreover, as a hardened
  • the resin composition for sealing of this embodiment is inject
  • An injection molding method may be used in which the resin composition for sealing injected into the above is molded while being cured under pressure. Except the sealing resin composition to be used, it can manufacture by a conventionally well-known method.
  • FIGS. 1A and 1B are diagrams for explaining a method of manufacturing a film capacitor of the present embodiment.
  • a mold used for manufacturing a film capacitor is composed of a lower mold 1 and an upper mold 2, and in this mold, a recess is formed in each of the lower mold 1 and the upper mold 2.
  • the recess is a cavity. The resin composition melted in this cavity is used for injection molding to produce a film capacitor.
  • the film capacitor element 3 is disposed in the recess of the lower mold 1 having a recess of a predetermined shape and temperature controlled, and the injection nozzle of the liquid epoxy resin composition 4 thereon While covering the upper mold 2 having 5 and sealing the joint with the lower mold 1 in an airtight manner, the inside of the cavity formed by the lower mold 1 and the upper mold 2 is vacuum pump etc. (not shown) The pressure is reduced by vacuum to reach 10 Torr.
  • the injection nozzle 5 is connected to a sprue for introducing the resin provided in the upper mold 2 into the cavity at the tip end portion 5c, and the entire nozzle is configured to be vertically movable up and down. Further, the nozzle tip 5c can be opened and closed by raising and lowering a plunger 5b disposed concentrically in the nozzle main pipe 5a.
  • the film capacitor 11 obtained here has, for example, as shown in FIG. 2, a configuration in which the film capacitor element 3 is covered and protected with a cured product 12 of a liquid epoxy resin composition, and the electrode 3a is The end of the end projects out of the cured product 12 so that it can be connected to other devices.
  • the film capacitor element 3 is a capacitor formed by winding a film and an electrode foil, and the metal electrodes 3a are projected in parallel from the upper and lower surfaces thereof so as to extend in the reverse direction with respect to the capacitor body.
  • the illustrated film capacitor element 3 is an example, and as the film capacitor element 3 in the present embodiment, any known film capacitor element can be used without particular limitation.
  • the supply of the liquid epoxy resin composition 4 to the film capacitor 3 and the sealing molding can be continued continuously and efficiently performed.
  • a sealed molded article free of voids and having a good appearance can be obtained.
  • a thermosetting resin after setting injection temperature to low temperature, it is preferable to be filled with a high temperature metal mold and to harden it.
  • an injection temperature of 50 to 70 ° C. is preferable. If it is less than 50 ° C., the fluidity will be poor. On the other hand, if the temperature is higher than 70 ° C., it is not preferable because a curing reaction partially proceeds in the injection nozzle.
  • the filling rate is preferably 0.2 to 5.0 L / min. It is unpreferable from the viewpoint of productivity as it is less than 0.2 L / min. On the other hand, if it is 5.0 L / min, there is a possibility that a resin winding void may occur in the sealing molded body, which is not preferable.
  • the pressure is preferably 0.2 to 10 MPa. If it is less than 0.2 MPa, unfilled parts and voids occur. On the other hand, if the pressure is higher than 10 MPa, the film capacitor element is broken.
  • the injection nozzle or the like may be equipped with a heating means such as a heater capable of heating the resin to a desired temperature for maintaining the resin.
  • the heat curing of the resin composition is preferably carried out at 90 to 110 ° C. for about 5 to 25 minutes. Within this range, the curing reaction proceeds slowly, and the voids of the film capacitor element are uniformly impregnated and filled with the resin composition.
  • the temperature of the mold is preferably 90 to 120.degree. Below 90 ° C., insufficient curing occurs. On the other hand, if the temperature is higher than 120 ° C., the film capacitor element is damaged by heat.
  • the lower mold 1 and the upper mold 2 are preferably made of a metal such as stainless steel having heat resistance and corrosion resistance.
  • the capacitor device obtained in this manner is a device that is excellent in any of various characteristics such as moisture permeability, change in capacitance, and the like, and has high reliability.
  • Examples 1 to 9 Each raw material of the compounding composition (mass part) shown in Table 1 and Table 2 was stirred and mixed uniformly, and the liquid epoxy resin composition was prepared.
  • 12 film capacitor elements (60 mm ⁇ 35 mm, thickness 60 mm) are accommodated and arranged at predetermined positions of the lower mold recess, and the upper mold is put in place and the mold is closed.
  • the liquid epoxy resin composition prepared above was introduced into the main nozzle of the injection nozzle, and the inside of the cavity between the lower mold and the upper mold was allowed to reach 10 Torr by a vacuum pump.
  • the plunger is raised, and the resin composition is injected and filled into the cavity at a filling speed of 0.5 L / min and an injection temperature of 60 ° C.
  • the lower mold and the upper mold are heated under a predetermined pressure, 110 ° C.
  • the resin composition was heated and cured under the conditions of 20 minutes, and the electrode terminal of the film capacitor element was sandwiched between the upper mold and the lower mold without a gap. Thereafter, the mold was opened, the cured product was taken out of the mold, and post curing was performed under conditions of 100 ° C. for 2 hours to produce a film capacitor (200 mm ⁇ 250 mm, thickness 70 mm) (E-LIM ( Epoxy-Liquid Injection Molding) method.
  • E-LIM Epoxy-Liquid Injection Molding
  • each raw material component used is as follows.
  • Epoxy resin 1 R140P (Bisphenol A type epoxy resin manufactured by Mitsui Chemicals, Inc., trade name)
  • Epoxy resin 2 BREM-105 (Broked epoxy resin manufactured by Nippon Kayaku Co., Ltd., trade name)
  • Epoxy resin 3 EPOXAN (Shin-Etsu Chemical silicone modified epoxy resin, trade name)
  • Hardening agent 1 HN 2000 (Mityl tetrahydrophthalic anhydride manufactured by Hitachi Chemical Co., Ltd., trade name)
  • Curing agent 2 NH-7000 (phenol resin manufactured by Nippon Kayaku Co., Ltd., trade name)
  • Curing agent 3 XL225-3L (Phenolic resin manufactured by Mitsui Chemicals, Inc., trade name)
  • [(C) curing accelerator] 2E4MZ Imidazole manufactured by Shikoku Kasei Co., Ltd., trade name
  • Inorganic filler 1 HS-106 (Spherical fused silica manufactured by Micron, trade name; spherical, average particle diameter 18.2 ⁇ m)
  • Inorganic filler 2 SO-C6 (Spherical fused silica manufactured by Adma Fine, trade name; spherical, average particle size 2.2 ⁇ m)
  • Porous filler 1 Mizukasil P-73 (silica gel manufactured by Mizusawa Chemical Industry, trade name; average particle diameter 4 ⁇ m, specific surface area 330 m 2 / g, average pore diameter 14 nm)
  • Porous filler 2 Mizukasil P-50 (silica gel manufactured by Mizusawa Chemical Industry, trade name; average particle diameter 10 ⁇ m, specific surface area 330 m 2 / g, average pore diameter 13 nm)
  • Porous filler 3 Sycilia 730 (silica gel manufactured by Fuji Silysia Chemical Ltd., trade name; average particle diameter 4 ⁇ m, specific surface area 700 m 2 / g, average pore diameter 2.5 nm)
  • Porous filler 4 Sycyria 350 (silica gel manufactured by Fuji Silysia Chemical Ltd., trade name; average particle diameter 4 ⁇ m, specific surface area 300 m 2 / g, average pore diameter 21 nm)
  • Viscosity In accordance with the viscosity measurement method of JIS C 2105, rotor No. 1 was measured by a BROOK FIELD viscometer (part number: DV-II). The viscosity of the obtained resin composition was measured under the conditions of a temperature of 60 ° C. and a rotation speed of 10 rpm using 34 spindle.
  • the moisture permeability is small, the change rate of the capacitance after the moisture resistance test is small, and the appearance is further reduced by using the specific epoxy resin composition. It turned out that a favorable molded object is obtained.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne : une composition de résine qui a un bon aspect externe sans l'apparition de vides, qui présente une faible perméabilité à l'humidité en tant que produit durci, qui présente un faible taux de changement de capacité, et qui est appropriée pour la fabrication d'un composant électronique qui a une fiabilité supérieure ; et un composant électronique utilisant ladite composition de résine. Un condensateur à film 11 comprend : une composition de résine d'étanchéité qui contient, en tant que composants essentiels, (A) une résine époxyde liquide, (B) un agent de durcissement, (C) un accélérateur de durcissement, (D) une charge poreuse, et (E) une charge inorganique autre que la charge poreuse (D) ; un élément de condensateur à film 3 ; et un produit durci 12 de la composition de résine d'étanchéité qui scelle l'élément de condensateur à film 3.
PCT/JP2018/016120 2017-06-28 2018-04-19 Composition de résine d'étanchéité, composant électronique et procédé de fabrication de composant électronique WO2019003600A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017126024 2017-06-28
JP2017-126024 2017-06-28

Publications (1)

Publication Number Publication Date
WO2019003600A1 true WO2019003600A1 (fr) 2019-01-03

Family

ID=64740545

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2018/016120 WO2019003600A1 (fr) 2017-06-28 2018-04-19 Composition de résine d'étanchéité, composant électronique et procédé de fabrication de composant électronique

Country Status (1)

Country Link
WO (1) WO2019003600A1 (fr)

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003171531A (ja) * 2001-12-03 2003-06-20 Kyocera Chemical Corp 封止用樹脂組成物および樹脂封止型半導体装置
JP2005290077A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2006274186A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2008156383A (ja) * 2006-12-20 2008-07-10 Matsushita Electric Works Ltd 液状樹脂組成物、半導体装置及びその製造方法
JP2008222961A (ja) * 2007-03-15 2008-09-25 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及びフリップチップ型半導体装置
JP2008274083A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2011099072A (ja) * 2009-11-09 2011-05-19 Sumitomo Bakelite Co Ltd 樹脂組成物、絶縁層、プリプレグ、積層板、プリント配線板および半導体装置
JP2013021342A (ja) * 2007-03-13 2013-01-31 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置
JP2015134892A (ja) * 2014-01-20 2015-07-27 京セラケミカル株式会社 液状樹脂組成物、電気部品及びその製造方法

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003171531A (ja) * 2001-12-03 2003-06-20 Kyocera Chemical Corp 封止用樹脂組成物および樹脂封止型半導体装置
JP2005290077A (ja) * 2004-03-31 2005-10-20 Sumitomo Bakelite Co Ltd 半導体封止用エポキシ樹脂組成物及び半導体装置
JP2006274186A (ja) * 2005-03-30 2006-10-12 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2008156383A (ja) * 2006-12-20 2008-07-10 Matsushita Electric Works Ltd 液状樹脂組成物、半導体装置及びその製造方法
JP2013021342A (ja) * 2007-03-13 2013-01-31 Hitachi Chem Co Ltd 熱硬化性光反射用樹脂組成物、光半導体素子搭載用基板とその製造方法および光半導体装置
JP2008222961A (ja) * 2007-03-15 2008-09-25 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及びフリップチップ型半導体装置
JP2008274083A (ja) * 2007-04-27 2008-11-13 Shin Etsu Chem Co Ltd 液状エポキシ樹脂組成物及び半導体装置
JP2011099072A (ja) * 2009-11-09 2011-05-19 Sumitomo Bakelite Co Ltd 樹脂組成物、絶縁層、プリプレグ、積層板、プリント配線板および半導体装置
JP2015134892A (ja) * 2014-01-20 2015-07-27 京セラケミカル株式会社 液状樹脂組成物、電気部品及びその製造方法

Similar Documents

Publication Publication Date Title
JP5133598B2 (ja) 封止用熱硬化型接着シート
US20170282527A1 (en) Vacuum laminating apparatus and method for manufacturing semiconductor apparatus
CN105960426B (zh) 树脂组合物、树脂膜和半导体装置及其制造方法
CN105074907B (zh) 电子器件密封用树脂片以及电子器件封装体的制造方法
JP2014173063A (ja) 電子・電気部品の製造方法および電子・電気部品
JP6217099B2 (ja) エポキシ樹脂成形材料、モールドコイルの製造方法及びモールドコイル
TW201630120A (zh) 半導體裝置之製造方法及半導體裝置
US20170098551A1 (en) Base-attached encapsulant for semiconductor encapsulation, method for manufacturing base-attached encapsulant for semiconductor encapsulation, and method for manufacturing semiconductor apparatus
JP2013118338A (ja) フィルムコンデンサ用樹脂組成物及びフィルムコンデンサ
JP5935100B2 (ja) フィルムコンデンサの製造方法及びフィルムコンデンサ
JP3022135B2 (ja) エポキシ樹脂組成物
JP2019081838A (ja) 樹脂組成物、フィルムコンデンサ及びその製造方法
JP2020070421A (ja) 封止用エポキシ樹脂組成物、電子部品及び電子部品の製造方法
WO2019003600A1 (fr) Composition de résine d'étanchéité, composant électronique et procédé de fabrication de composant électronique
JP2018002923A (ja) 電子・電気部品の製造方法、射出成形用エポキシ樹脂組成物、および電子・電気部品
JP6117715B2 (ja) 真空ラミネーション装置および半導体装置の製造方法
CN103579133B (zh) 电子部件密封用树脂片、树脂密封型半导体装置、及树脂密封型半导体装置的制造方法
JP6318518B2 (ja) エポキシ樹脂成形材料、モールドコイルの製造方法及びモールドコイル
JP7249209B2 (ja) 注形用エポキシ樹脂組成物、電子部品及び電子部品の製造方法
JP2016017121A (ja) 成形用樹脂シート及び電気・電子部品
CN110168016A (zh) 液状环氧树脂密封材料及半导体装置
JP2018044072A (ja) 窒化アルミニウム含有硬化性樹脂組成物
JP6598519B2 (ja) 電子・電気部品の製造方法および電子・電気部品
JP2004168829A (ja) エポキシ樹脂組成物およびこれを用いた真空用機器
JP6655359B2 (ja) 電子・電気部品の製造方法及びエポキシ樹脂組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 18824304

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 18824304

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP