WO2018214798A1 - 用于检测基板的破损的装置和方法、以及基板传送系统 - Google Patents

用于检测基板的破损的装置和方法、以及基板传送系统 Download PDF

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Publication number
WO2018214798A1
WO2018214798A1 PCT/CN2018/087250 CN2018087250W WO2018214798A1 WO 2018214798 A1 WO2018214798 A1 WO 2018214798A1 CN 2018087250 W CN2018087250 W CN 2018087250W WO 2018214798 A1 WO2018214798 A1 WO 2018214798A1
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Prior art keywords
substrate
electrode
current value
detected current
broken
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PCT/CN2018/087250
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English (en)
French (fr)
Inventor
李明龙
王志强
陈荣龙
马纪艳
殷鹏飞
高鸿飞
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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BOE Technology Group Co Ltd
Hefei Xinsheng Optoelectronics Technology Co Ltd
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Priority to US16/334,450 priority Critical patent/US20200031590A1/en
Publication of WO2018214798A1 publication Critical patent/WO2018214798A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N27/00—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means
    • G01N27/02—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance
    • G01N27/22—Investigating or analysing materials by the use of electric, electrochemical, or magnetic means by investigating impedance by investigating capacitance
    • G01N27/24—Investigating the presence of flaws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G43/00—Control devices, e.g. for safety, warning or fault-correcting
    • B65G43/08—Control devices operated by article or material being fed, conveyed or discharged
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1306—Details
    • G02F1/1309—Repairing; Testing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2203/00—Indexing code relating to control or detection of the articles or the load carriers during conveying
    • B65G2203/04—Detection means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position

Definitions

  • Embodiments of the present disclosure relate to the field of liquid crystal display technology, and in particular, to an apparatus and method for detecting damage of a substrate, and a substrate transfer system.
  • Liquid crystal display devices are becoming more and more widely used in life.
  • transparent glass having a material thickness of 0.4 to 1.1 mm is generally used as a substrate of a liquid crystal display device. Due to its crisp characteristics, cracking easily occurs during the transfer of the substrate. A damaged substrate can seriously damage the conveying device, and there is also a great risk of damage to the coating device and the exposure device. Therefore, the detection of damage to the substrate is particularly important.
  • Embodiments of the present disclosure provide an apparatus and method for detecting breakage of a substrate, and a substrate transfer system.
  • an apparatus for detecting breakage of a substrate includes opposing first and second electrodes, a power source, and a detector.
  • the power source can provide an alternating voltage to the first electrode and the second electrode.
  • the detector is disposed between the power source and the first electrode or the second electrode, and can detect a current value flowing when the substrate is between the first electrode and the second electrode, and determine whether the substrate is damaged according to the detected current value.
  • the first electrode is in contact with one surface of the substrate, and the second electrode is in contact with the other surface of the substrate.
  • the first electrode and the second electrode are disposed in parallel, and a distance between the first electrode and the second electrode is greater than a thickness of the substrate.
  • the distance is 2 mm to 6 mm larger than the thickness of the substrate.
  • the first electrode and the second electrode are the same size and are determined based on the width or length of the substrate.
  • the first electrode and the second electrode are planar continuous electrodes.
  • the detector may further compare the detected current value to the current threshold range. If the detected current value is outside the current threshold range, the detector determines that the substrate is broken. If the detected current value is within the current threshold range, the detector determines that the substrate is not broken.
  • the detector may further calculate a difference between the detected current value and the normal detected current value of the same non-destructive substrate as the substrate. If the difference exceeds the threshold, the detector determines that the substrate is broken. If the difference does not exceed the threshold, the detector determines that the substrate is not broken.
  • a substrate transfer system includes a device for detecting breakage of a substrate and a device for transferring a substrate according to the first aspect of the present disclosure.
  • the means for transferring the substrate is electrically coupled to the detector and allows the substrate to be transferred between the first electrode and the second electrode, and the transfer of the substrate is stopped based on an indication from the detector indicating that the substrate is broken.
  • a method for detecting breakage of a substrate In this method, an alternating voltage is applied to a first electrode disposed above the substrate and a second electrode disposed under the substrate. Then, the current value of the current passing through the substrate is detected, and based on the detected current value, it is determined whether the substrate is broken.
  • determining whether the substrate is damaged according to the detected current value comprises: comparing the detected current value with a current threshold range; if the detected current value is outside the current threshold range, determining that the substrate is damaged; if the detected current value is at the current threshold Within the range, it is determined that the substrate is not damaged.
  • determining whether the substrate is damaged according to the detected current value includes: calculating a difference between the detected current value and a normal detected current value of the same non-destructive substrate as the substrate; and determining the substrate if the difference exceeds the threshold Damage; if the difference does not exceed the threshold, it is determined that the substrate is not broken.
  • the method further includes transferring the substrate between the first electrode and the second electrode.
  • the method further includes: stopping the transfer of the substrate after determining that the substrate is broken.
  • FIG. 1 illustrates a schematic structural view of an apparatus for detecting breakage of a substrate according to an embodiment of the present disclosure
  • FIG. 2 illustrates a schematic diagram of non-contact detection of a device for detecting damage of a substrate in accordance with an embodiment of the present disclosure
  • Figure 3 is a graph showing the relative dielectric constant of a glass substrate
  • FIG. 4 illustrates a schematic diagram of contact detection for detecting a breakage of a substrate in accordance with an embodiment of the present disclosure
  • FIG. 5 illustrates a schematic structural view of a substrate transfer system according to an embodiment of the present disclosure
  • FIG. 6 illustrates a schematic flow chart of a method for detecting breakage of a substrate in accordance with an embodiment of the present disclosure.
  • the terms “mounted”, “connected”, and “coupled” are to be understood broadly, and may be fixed connections, for example, It may be a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium.
  • the specific meanings of the above terms in the present disclosure can be understood in the specific circumstances by those skilled in the art.
  • the detection technology of substrate damage mainly includes image analysis and detection technology and optical fiber sensor detection technology.
  • the substrate is scanned during the substrate transfer process, and then the acquired image is analyzed to determine whether the edge of the substrate has defects.
  • the detection technology has a limited detection range and can only detect the edge portion of the substrate, and cannot perform comprehensive inspection on the substrate.
  • false detection is likely to occur when the surface of the substrate is stained. That is to say, the detection technique is susceptible to false detection or missed detection due to the influence of the cleanliness of the substrate.
  • a reflective fiber optic sensor is mounted on each side of the unit.
  • the condition of the substrate on the two straight lines can be detected according to the intensity of the light received by the receiving end.
  • Such a detection means is also susceptible to false detection or missed detection due to the influence of the cleanliness of the substrate, and is also susceptible to false detection or missed detection due to the influence of the cleanliness of the sensor.
  • the above two detection methods are susceptible to false detection or missed detection due to the influence of the cleanliness of the substrate or the sensor.
  • the detection range is only the edge of the substrate, and the detection of the overall damage of the substrate cannot be performed.
  • Embodiments of the present disclosure propose a device for detecting damage of a substrate (hereinafter also referred to as "substrate detecting device”) and a method, and a substrate transfer system for detecting damage of the entire substrate and avoiding detection
  • substrate detecting device a device for detecting damage of a substrate
  • substrate transfer system for detecting damage of the entire substrate and avoiding detection
  • the result is affected by substrate cleanliness or sensor cleanliness, which improves the accuracy of the test results.
  • FIG. 1 shows a schematic structural view of a substrate detecting apparatus 100 according to an embodiment of the present disclosure.
  • the substrate detecting device 100 may include a first electrode 101 and a second electrode 102, a power source 103, and a detector 104 which are disposed opposite each other.
  • the first electrode 101 and the second electrode 102 may be planar continuous electrodes, such as flat electrodes. Further, the sizes of the first electrode 101 and the second electrode 102 may be the same and determined based on the width or length of the substrate.
  • the substrate detecting device 100 the substrate to be detected can be placed between the first electrode 101 and the second electrode 102.
  • the first electrode 101 may be located above the substrate to be inspected, and the second electrode 102 may be located below the substrate to be inspected.
  • the power source 103 can be coupled to the first electrode 101 and the second electrode 102 for supplying an alternating voltage to the first electrode 101 and the second electrode 102.
  • the alternating voltage provided is a high frequency voltage, and the frequency range may be, for example, 1 kHz to 1 MHz.
  • the detector 104 can be disposed between the power source 103 and any one of the electrodes (the first electrode 101 or the second electrode 102).
  • the detector 104 may detect a current value flowing when the substrate is between the first electrode 101 and the second electrode 102, and determine whether the substrate is damaged according to the detected current value.
  • the detector 104 can be disposed, for example, between the power source 103 and the first electrode 101. Since the substrate has a capacitive characteristic as a poor conductor of electricity, it can pass an alternating current, and thus a current loop is formed between the first electrode 101, the detector 104, the power source 103, the second electrode 102, and the substrate as a capacitive load.
  • the dielectric constant of the substrate will change, and the impedance to the AC voltage will also change, resulting in a change in the AC current passing through the substrate. According to the change of the current in the loop in which the substrate is detected, it can be determined whether the substrate under the AC voltage is damaged. Since any part of the substrate plane is damaged, the dielectric constant of the damaged portion changes. Therefore, the application of the AC voltage can detect the damaged portion for the entire substrate plane, and is no longer limited to the detection of the edge of the substrate. In addition, the stain on the substrate has a very small influence on the dielectric constant of the substrate. Therefore, under the action of the alternating voltage, the change of the alternating current on the substrate is also very small, and the detection result can be prevented from being affected by the cleanliness of the substrate, thereby improving the accuracy of the detection result.
  • detector 104 may compare the detected current value to a current threshold range. If the detected current value is outside the current threshold range, the detector 104 can determine that the substrate is broken. If the detected current value is within the current threshold range, the detector 104 can determine that the substrate is not damaged.
  • the detector 104 can detect in advance the normal detection current value of the same non-destructive substrate as the substrate to be detected, for example, the non-destructive substrate is the same material and the same thickness as the substrate to be inspected. Then, the detector 104 can calculate a difference between the detected current value of the substrate to be detected and the normal detected current value of the non-broken substrate. If the difference exceeds the first threshold, the detector 104 can determine that the substrate is broken. If the difference is below the first threshold, the detector 104 can determine that the substrate is not broken.
  • the detector 104 may continuously detect the value of the current flowing during the period during which the substrate passes between the first electrode 101 and the second electrode 102. If the magnitude of the change in the detected current during the substrate transfer period exceeds the second threshold, it is determined that the substrate is broken. If the magnitude of the change does not exceed the second threshold, it is determined that the substrate is not broken.
  • the current threshold range, the first threshold, and the second threshold described above can be set empirically.
  • the above-described power source 103 and detector 104 can be implemented in a PLC controller (Programmable Logic Controller) in order to simplify the circuit connection structure.
  • PLC controller Programmable Logic Controller
  • the first and second electrodes may or may not be in contact with the surface of the substrate located therebetween. That is to say, there may be a gap between the two electrodes and the surface of the substrate, or there may be no gap.
  • the detection method in which the electrode is in contact with the surface of the substrate can be applied to the detection of the static substrate, and the detection method in which the electrode is not in contact with the surface of the substrate and has a gap can be applied to the process of substrate transfer. The following two detection methods are described separately.
  • FIG. 2 illustrates a schematic diagram of the substrate detecting apparatus 100 performing non-contact detection according to an embodiment of the present disclosure.
  • the first electrode 101 and the second electrode 102 in the substrate detecting device 100 are disposed in parallel, and the distance between the first electrode 101 and the second electrode 102 is larger than the thickness of the substrate 200. Therefore, when the substrate 200 is positioned between the first electrode 101 and the second electrode 102, the first electrode 101 and the second electrode 102 may not contact the upper and lower surfaces of the substrate 200. Air is present between the first electrode 101 and the upper surface of the substrate 200, and air is also present between the second electrode 102 and the lower surface of the substrate 200.
  • the substrate 200 and the air between the first electrode 101 and the second electrode 102 constitute a plate capacitor.
  • the capacitance of the plate capacitor can be calculated as:
  • C is the capacitance of the plate capacitor
  • ⁇ is the relative dielectric constant of the substrate
  • ⁇ 0 is the vacuum dielectric constant
  • S is the area of the plate capacitor
  • d is the thickness of the substrate.
  • Figure 3 shows a graph of the relative dielectric constant of a glass substrate.
  • the relative dielectric constant of the glass substrate is about 5.4 to 5.6.
  • the relative dielectric constant of air and substrate is different, and the relative dielectric constant of air is 1. If the substrate is broken, the thickness d of the substrate is changed, so that the capacitance of the panel capacitor changes, and the AC impedance thereof changes. Accordingly, an alternating voltage is supplied to the first electrode 101 and the second electrode 102, and it is determined whether the substrate is intact by measuring a change in current in the circuit.
  • the distance between the first electrode 101 and the second electrode 102 is 2 mm to 6 mm larger than the thickness of the substrate.
  • the difference between the distance and the thickness is less than 6 mm so as to have a high detection sensitivity
  • the difference between the distance and the thickness of the substrate is greater than 2 mm, so as not to affect the movement of the substrate between the two electrodes.
  • the substrate to be detected may be placed at an intermediate position between the two electrodes, the distance between the upper surface of the substrate and the first electrode 101 is greater than 1 mm and less than 3 mm, and the distance between the lower surface and the second electrode 102 is greater than 1 mm and Less than 3mm.
  • FIG. 4 illustrates a schematic diagram of the substrate detecting apparatus 100 performing contact detection according to an embodiment of the present disclosure.
  • the first electrode 101 in the substrate detecting device 100 is in contact with the upper surface of the substrate 200 to be detected, and the second electrode 102 is in contact with the lower surface of the substrate 200. Since the electrode directly contacts the surface of the substrate 200 without an air medium therebetween, a high detection sensitivity can be obtained. However, since the electrode is in surface contact with the substrate 200, the substrate cannot move during the detection process, and it should be in a stationary state to prevent the electrode from scratching the substrate surface.
  • the sizes of the first electrode 101 and the second electrode 102 are the same as those of the substrate 200 to be inspected.
  • FIG. 5 shows a schematic diagram of a substrate transfer system in accordance with an embodiment of the present disclosure.
  • the substrate transfer system 400 includes a substrate detecting device 410 and a device for transferring a substrate (hereinafter referred to as "substrate transfer device") 420.
  • the substrate detecting device 410 may include a first electrode 411, a second electrode 412, a power source 413, and a detector 414.
  • the substrate detecting device 410 may be, for example, the substrate detecting device 100 shown in FIG. 1, and performs non-contact detection of the substrate as shown in FIG. 2.
  • the power source 413 can provide an alternating voltage to the first electrode 411 and the second electrode 412.
  • the detector 414 is disposed between the power source 413 and the first electrode 411 or the second electrode 412, and can detect the value of the current flowing when the substrate 200 to be detected is between the first electrode 411 and the second electrode 412. Further, the detector 414 can determine whether the substrate 200 is broken according to the detected current value, and provide an indication to the substrate transfer device 420 that the substrate 200 is broken.
  • the substrate transfer device 420 can transfer the substrate 200 between the first electrode 411 and the second electrode 412. Further, the substrate transfer device 420 can be electrically coupled to the detector 414 and can stop transporting the substrate 200 in accordance with an indication from the detector 414 indicating that the substrate 200 is broken.
  • detector 414 can compare the detected current value to the current threshold range. If the detected current value is outside the current threshold range, the detector 414 can determine that the substrate is broken and send an indication to the substrate transfer device 420 indicating that the substrate 200 is broken. In this case, the substrate transfer device 420 stops the transfer of the substrate 200 in response to an instruction from the detector 414. If the detected current value is within the current threshold range, the detector 414 can determine that the substrate 200 is not broken.
  • the detector 414 may also calculate a difference between the detected current value and the normal detected current value of the same non-destructive substrate as the substrate. If the difference exceeds the threshold, the detector 414 determines that the substrate is broken and transmits an indication to the substrate transfer device 420 indicating that the substrate 200 is broken. In this case, the substrate transfer device 420 stops the transfer of the substrate 200 in response to an instruction from the detector 414. If the difference is below the threshold, the detector determines that the substrate 200 is not broken.
  • the substrate detecting device in the substrate transfer system, the substrate can be detected during the transfer of the substrate. In this way, it is possible to detect in time whether the transferred substrate is damaged, so as to prevent the damaged substrate from causing damage to the conveying device or the subsequent process device (for example, exposure, coating device).
  • the distance between the first electrode 411 and the second electrode 412 should be greater than the thickness of the substrate. So that there is a gap between the surface of the substrate and the two electrodes. Further, the difference between the distance between the first electrode 101 and the second electrode 102 and the thickness of the substrate may be greater than 2 mm and less than 6 mm, thereby improving sensitivity and preventing unevenness or warpage of the substrate plane during the transfer process. Scratched to the electrode.
  • the first electrode and the second electrode are the same size and are determined based on the width or length of the substrate.
  • the length of the electrode is the same as the length of the substrate in a direction perpendicular to the conveying direction.
  • FIG. 6 illustrates a schematic flow chart of a method for detecting breakage of a substrate in accordance with an embodiment of the present disclosure.
  • an alternating voltage is applied to a first electrode disposed above the substrate and a second electrode disposed under the substrate.
  • a current value of a current passing through the substrate is detected.
  • determining whether the substrate is damaged according to the detected current value may include: comparing the detected current value with a current threshold range; if the detected current value is outside the current threshold range, determining that the substrate is damaged; if the detected current value is within the current threshold range Then, it is determined that the substrate is not damaged.
  • determining whether the substrate is damaged according to the detected current value may include: calculating a current difference between the detected current value and a normal detected current value of the same non-destructive substrate as the substrate; and determining the substrate if the current difference exceeds the threshold Damage; if the current difference is below the threshold, the substrate is determined to be broken.
  • the substrate can be transferred between the first electrode and the second electrode.
  • the transfer of the substrate can be stopped.

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Abstract

用于检测基板（200）的破损的装置（100，410）和方法、以及基板传送系统（400）。装置（100，410）包括：相对设置的第一电极（101，411）和第二电极（102，412）、电源（103，413）和检测器（104，414）。电源（103，413）可向第一电极（101，411）和第二电极（102，412）提供交流电压。检测器（104，414）被设置在电源（103，413）与第一电极（101，411）或第二电极（102，412）之间，并可在基板（200）处于第一电极（101，411）和第二电极（102，412）之间时，检测流过的电流值，以及根据检测电流值确定基板（200）是否破损。

Description

用于检测基板的破损的装置和方法、以及基板传送系统
相关申请的交叉引用
本申请要求于2017年5月22日递交的申请号为201710364818.5的中国专利申请的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及液晶显示技术领域，特别地，涉及用于检测基板的破损的装置和方法、以及基板传送系统。
背景技术
液晶显示装置在生活中得到越来越广泛的应用。目前，在液晶显示及触控器件制造中，通常使用材料厚度为0.4～1.1mm的透明玻璃作为液晶显示装置的基板。由于其具有薄脆的特征，在基板的传送过程中容易发生破裂。破损的基板会严重损害传送装置，对涂布装置及曝光装置也具有巨大的损害风险。因此，对基板破损的检测就显得尤为重要。
发明内容
本公开的实施例提供了用于检测基板的破损的装置和方法、以及基板传送系统。
根据本公开的第一方面，提供了一种用于检测基板的破损的装置。该装置包括相对设置的第一电极和第二电极、电源和检测器。电源可向第一电极和第二电极提供交流电压。检测器被设置在电源与第一电极或第二电极之间，并可在基板处于第一电极和第二电极之间时，检测流过的电流值，以及根据检测电流值确定基板是否破损。
在本公开的实施例中，第一电极与基板的一个表面接触，第二电极与基板的另一表面接触。
在本公开的实施例中，第一电极和第二电极平行设置，并且第一电极和第二电极之间的距离大于基板的厚度。
在本公开的实施例中，该距离比基板的厚度大2mm至6mm。
在本公开的实施例中，第一电极和第二电极的尺寸相同，并且基于基板的宽度或长度确定。
在本公开的实施例中，第一电极和第二电极是平面连续电极。
在本公开的实施例中，检测器可进一步比较检测电流值与电流阈值范围。如果检测电流值在电流阈值范围之外，则检测器确定基板破损。如果检测电流值在电流阈值范围内，则检测器确定基板未破损。
在本公开的实施例中，检测器可进一步计算检测电流值和与基板相同的无破损基板的正常检测电流值之间的差值。如果差值超过阈值，则检测器确定基板破损。如果差值未超过阈值，则检测器确定基板未破损。
根据本公开的第二方面，还提供了一种基板传送系统。该系统包括根据本公开的第一方面的用于检测基板的破损的装置以及用于传送基板的装置。该用于传送基板的装置与检测器电耦接，并可使基板在第一电极和第二电极之间传送，以及根据来自检测器的表示基板破损的指示，停止传送基板。
根据本公开的第三方面，还提供了一种用于检测基板的破损的方法。在该方法中，向在基板的上方设置的第一电极和在基板的下方设置的第二电极施加交流电压。然后，检测通过基板的电流的电流值，并根据检测电流值，确定基板是否破损。
在本公开的实施例中，根据检测电流值确定基板是否破损包括：比较检测电流值与电流阈值范围；如果检测电流值在电流阈值范围之外，则确定基板破损；如果检测电流值在电流阈值范围内，则确定基板未破损。
在本公开的实施例中，根据检测电流值确定基板是否破损包括：计算检测电流值和与基板相同的无破损基板的正常检测电流值之间的差值；如果差值超过阈值，则确定基板破损；如果差值未超过阈值，则确定基板未破损。
在本公开的实施例中，该方法还包括：使基板在第一电极和第二电极之间传送。
在本公开的实施例中，该方法还包括：在确定基板破损后，停止基板的传送。
附图说明
为了更清楚地说明本公开的技术方案，下面将对实施例的附图进行简单说明，相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。应当知道，以下描述的附图仅仅是本公开的一些实施例，而非对本公开的限制。在附图中：
图1示出根据本公开的实施例的用于检测基板的破损的装置的结构示意图；
图2示出根据本公开的实施例的用于检测基板的破损的装置进行非接触式检测的示意图；
图3示出玻璃基板的相对介电常数的曲线图；
图4示出根据本公开的实施例的用于检测基板的破损的装置进行接触式检测的示意图；
图5示出根据本公开的实施例的基板传送系统的结构示意图；
图6示出根据本公开的实施例的用于检测基板的破损的方法的示意性流程图。
具体实施方式
为了使本公开的实施例的目的、技术方案和优点更加清楚，下面将结合附图，对本公开的实施例的技术方案进行清楚、完整的描述。显然，所描述的实施例仅仅是本公开的一部分实施例，而并非全部的实施例。基于所描述的实施例，本领域的普通技术人员在无需创造性劳动的前提下所获得的所有其它实施例，也都属于本公开的范围。
本技术领域技术人员可以理解，除非特意声明，这里使用的单数形式 “一”、“一个”、“所述”和“该”也可包括复数形式。这里使用的术语“和/或”包括一个或更多个相关联的列出项的全部或任一单元和全部组合。
需要说明的是，本公开实施例中所有使用“第一”和“第二”的表述仅是为了区分两个相同名称的实体或者参量。可见“第一”“第二”仅为了表述的方便，不应理解为对本公开实施例的限定，后续实施例对此不再一一说明。
在本公开的实施例的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“连接”、“耦接”应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是机械连接，也可以是电连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以具体情况理解上述术语在本公开中的具体含义。
目前，基板破损的检测技术主要包括图像分析检测技术和光纤传感器检测技术。
对于图像分析检测技术，在基板传送过程中对基板进行图像扫描，之后对获取的图像进行分析，进而判断基板边缘是否具有缺陷。该检测技术检测范围有限，只能检测基板边缘部分，无法对基板进行全面检测。此外，当基板表面有污点时容易出现误检。也就是说，该检测技术容易受到基板洁净度的影响而出现误检或漏检情况。
对于光纤传感器检测技术，在装置两侧各安装一个反射型光纤传感器。当基板经过时，根据接收端所接收的光强大小，可以检测两条直线上的基板状况。这种检测手段同样容易受到基板洁净度的影响而出现误检或漏检的情况，此外还容易受到传感器洁净度的影响而出现误检或漏检的情况。
综上，以上两种检测方法容易受到基板或传感器洁净度的影响而出现误检或漏检情况。此外，检测范围仅为基板边缘，而无法进行基板整体破损情况的检测。
本公开的实施例提出了用于检测基板的破损的装置(以下也可称为“基板检测装置”)和方法、以及基板传送系统，用以对基板整体的破损状况进行检测，并可避免检测结果受基板洁净度或传感器洁净度影响，从而提高 检测结果的准确性。
图1示出了根据本公开的实施例的基板检测装置100的结构示意图。如图1所示，基板检测装置100可包括相对设置的第一电极101和第二电极102、电源103和检测器104。
在本公开的实施例中，第一电极101和第二电极102可以是平面连续电极，例如平板状电极。此外，第一电极101和第二电极102的尺寸可以是相同的，并且基于基板的宽度或长度来确定。在使用基板检测装置100时，可将待检测基板放置在第一电极101和第二电极102之间。例如，第一电极101可位于待检测基板的上方，第二电极102可位于待检测基板的下方。
电源103可与第一电极101和第二电极102耦接，用于向第一电极101和第二电极102提供交流电压。在实施例中，所提供的交流电压为高频电压，频率范围例如可以是1kHz～1MHz。
检测器104可被设置在电源103与任意一个电极(第一电极101或第二电极102)之间。检测器104可在基板处于第一电极101和第二电极102之间时，检测流过的电流值，以及根据检测电流值确定基板是否破损。如图1所示，检测器104例如可被设置在电源103和第一电极101之间。由于基板作为电的不良导体具有电容特性，其可以通过交流电，因此在第一电极101、检测器104、电源103、第二电极102以及作为电容负载的基板之间形成电流回路。
如果基板发生破损，基板的介电常数将发生改变，从而对交流电压的阻抗也会发生改变，进而导致通过基板的交流电流也发生改变。根据检测基板所在回路中电流的变化情况可以确定处于交流电压下的基板是否存在破损。由于基板平面任何部分破损，破损处的介电常数均会发生改变，因此，应用交流电压可以针对整个基板平面检测破损部位，不再限于基板边缘的检测。此外，基板上的污点对于基板的介电常数影响非常小。因此，在交流电压作用下，基板上的污点对交流电流的改变也非常小，可以避免检测结果受基板洁净度的影响，从而提高检测结果的准确性。
在本公开的实施例中，检测器104可比较检测电流值与电流阈值范围。如果检测电流值在电流阈值范围之外，则检测器104可确定基板存在破损。如果检测电流值在电流阈值范围内，则检测器104可确定基板不存在破损。
在另一实施例中，检测器104可预先检测与待检测的基板相同的无破损基板的正常检测电流值，例如无破损基板与待检测基板的材料相同、厚度相同。然后，检测器104可计算待检测基板的检测电流值和与该无破损基板的正常检测电流值之间的差值。如果差值超过第一阈值，则检测器104可确定基板存在破损。如果差值低于第一阈值，则检测器104可确定基板不存在破损。
此外，检测器104可在基板从第一电极101和第二电极102之间传送通过的时段期间连续地检测流过的电流值。如果在基板传送时段内所检测的电流的变化幅值超过第二阈值时，则确定基板存在破损。如果变化幅值未超过第二阈值，则确定基板未破损。
本领域技术人员可以知道，上述的电流阈值范围、第一阈值和第二阈值可以根据经验设定。
在本公开的实施例中，上述的电源103和检测器104可以在PLC控制器(可编程逻辑控制器)中实现，以便简化电路连接结构。
在本公开的实施例中，在使用基板检测装置100进行检测时，第一和第二电极与位于其间的基板的表面可以接触，也可以不接触。也就是说，两个电极与基板的表面之间可以有间隙，也可以没有间隙。电极与基板表面相接触的检测方式可以适用于静态基板的检测，而电极与基板表面不接触有间隙的检测方式则可以应用于基板传送的过程中。以下分别对两种检测方式进行描述。
图2示出了根据本公开实施例的基板检测装置100进行非接触式检测的示意图。如图2所示，基板检测装置100中的第一电极101和第二电极102平行设置，并且第一电极101和第二电极102之间的距离大于基板200的厚度。因此，当基板200位于第一电极101和第二电极102之间时，第一电极101和第二电极102可以与基板200的上下表面均不接触。在第一 电极101与基板200的上表面之间存在空气，并且在第二电极102与基板200的下表面之间也存在空气。
在第一电极101与第二电极102之间的基板200和空气构成平板电容器。在忽略边缘效应的情况下，平板电容器的电容可以计算为：
Figure PCTCN2018087250-appb-000001
其中，C为平板电容器的电容，ε为基板的相对介电常数，ε 0为真空介电常，S为平板电容器的面积，d为基板的厚度。
图3示出了玻璃基板的相对介电常数的曲线图。例如，在温度为50度至300度且频率在100KHz-200KHz的情况下，玻璃基板的相对介电常数大约为5.4-5.6。空气与基板的相对介电常数不同，空气的相对介电常数为1。如果基板发生破损，则基板的厚度d改变，使得平板电容器的电容发生变化，进而其交流阻抗发生变化。相应地，对第一电极101和第二电极102提供交流电压，并通过测量电路内电流的变化可确定基板是否完好。
在本公开的实施例中，第一电极101和第二电极102之间的距离比基板的厚度大2mm至6mm。其中，该距离与厚度的差值小于6mm，以便具有较高的检测灵敏度，并且该距离与基板的厚度的差值大于2mm，从而不影响基板在两个电极之间的移动。例如，可以将待检测的基板放置在两个电极的中间位置，基板的上表面与第一电极101之间的距离大于1mm且小于3mm，下表面与第二电极102之间的距离大于1mm且小于3mm。
图4示出了根据本公开的实施例的基板检测装置100进行接触式检测的示意图。如图4所示，基板检测装置100中的第一电极101与待检测的基板200的上表面接触，第二电极102与基板200的下表面接触。由于电极直接接触基板200表面，中间没有空气介质，因此可以获得较高的检测灵敏度。但是，由于电极与基板200表面接触，因此在检测过程中基板不能移动，其应处于静止状态，以免电极会划伤基板表面。
在图4所示的实施例中，第一电极101和第二电极102的尺寸与待检测基板200的尺寸相同。
进一步地，本公开的实施例提供的基板检测装置还可被应用于基板传 送系统中，以便在传送过程中对基板的整个平面进行扫描式的检测。图5示出了根据本公开的实施例的基板传送系统的示意图。基板传送系统400包括：基板检测装置410和用于传送基板的装置(以下称为“基板传送装置”)420。
基板检测装置410可包括第一电极411、第二电极412、电源413和检测器414。基板检测装置410可以例如是如图1所示的基板检测装置100，并如图2所示地对基板进行非接触式检测。在实施例中，电源413可向第一电极411和第二电极412提供交流电压。检测器414被设置在电源413与第一电极411或第二电极412之间，并可在待检测的基板200处于第一电极411和第二电极412之间时，检测流过的电流值。此外，检测器414可根据检测电流值来确定基板200是否破损，并向基板传送装置420提供表示基板200破损的指示。
基板传送装置420可使基板200在第一电极411和第二电极412之间传送。此外，基板传送装置420可与检测器414电耦接，并可根据来自检测器414的表示基板200破损的指示，停止传送基板200。
在本公开的实施例中，检测器414可比较检测电流值与电流阈值范围。如果检测电流值在电流阈值范围之外，则检测器414可确定基板破损，并向基板传送装置420发送表示基板200破损的指示。在这种情况下，基板传送装置420响应于来自检测器414的指示，停止传送基板200。如果检测电流值在电流阈值范围内，则检测器414可确定基板200未破损。
在本公开的实施例中，检测器414还可计算检测电流值和与基板相同的无破损基板的正常检测电流值之间的差值。如果差值超过阈值，则检测器414确定基板破损，并向基板传送装置420发送表示基板200破损的指示。在这种情况下，基板传送装置420响应于来自检测器414的指示，停止传送基板200。如果差值低于阈值，则检测器确定基板200未破损。
由上，通过在基板传送系统中设置基板检测装置，可以在基板的传送过程中对基板进行检测。这样，可以及时检测出传送的基板是否出现破损，以避免破损的基板对传送装置或者后续工艺装置(例如，曝光、涂布装置) 造成损害。
在基板传送系统的实施例中，由于待检测的基板需要在第一电极411和第二电极412之间传送通过，因此，第一电极411和第二电极412之间的距离应大于基板的厚度，以使基板表面与两个电极之间存在间隙。进一步地，第一电极101和第二电极102之间的距离与基板的厚度的差值可以大于2mm且小于6mm，从而提高灵敏度，并防止因基板平面不平整或翘曲等现象在传送过程中剐蹭到电极而划伤。
在实施例中，第一电极和第二电极的尺寸相同，并且基于基板的宽度或长度确定。具体地，电极的长度与基板在垂直于传送方向的长度的尺寸相同。这样，在基板传送通过两个电极之间的过程中，可以完成对基板整个平面的检测。从而及时拦截破损的基板，避免破损的基板对传送装置或后续装置造成严重损坏，减少损失，提高生产效率。
图6示出了根据本公开的实施例的用于检测基板的破损的方法的示意性流程图。首先，在S610，向在基板的上方设置的第一电极和在基板的下方设置的第二电极施加交流电压。在S620，检测通过基板的电流的电流值。在S630，根据检测电流值，确定基板是否破损。
在实施例中，根据检测电流值确定基板是否破损可包括：比较检测电流值与电流阈值范围；如果检测电流值在电流阈值范围之外，则确定基板破损；如果检测电流值在电流阈值范围内，则确定基板未破损。
在另一实施例中，根据检测电流值确定基板是否破损可包括：计算检测电流值和与基板相同的无破损基板的正常检测电流值之间的电流差；如果电流差超过阈值，则确定基板破损；如果电流差低于阈值，确定基板破损。
进一步地，可使基板在第一电极和第二电极之间传送。另外，在确定基板破损后，可停止基板的传送。
本技术领域技术人员可以理解，本公开中已经讨论过的各种操作、方法、流程中的步骤、措施、方案可以被交替、更改、组合或删除。进一步地，具有本公开中已经讨论过的各种操作、方法、流程中的其他步骤、措 施、方案也可以被交替、更改、重排、分解、组合或删除。进一步地，现有技术中的具有与本公开中公开的各种操作、方法、流程中的步骤、措施、方案也可以被交替、更改、重排、分解、组合或删除。
所属领域的普通技术人员应当理解：以上任何实施例的讨论仅为示例性的，并非旨在暗示本公开的范围(包括权利要求)被限于这些例子；在本公开的思路下，以上实施例或者不同实施例中的技术特征之间也可以进行组合，步骤可以以任意顺序实现，并存在如上所述的本公开的不同方面的许多其它变化，为了简明它们没有在细节中提供。因此，凡在本公开的精神和原则之内，所做的任何省略、修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (17)

  1. 一种用于检测基板的破损的装置，包括：
    相对设置的第一电极和第二电极；
    电源，其被配置为向所述第一电极和所述第二电极提供交流电压；以及
    检测器，其被设置在所述电源与所述第一电极或所述第二电极之间，并被配置为当基板处于所述第一电极和所述第二电极之间时，检测流过的电流值，以及根据检测电流值确定所述基板是否破损。
  2. 根据权利要求1所述的装置，其中，所述第一电极与所述基板的一个表面接触，所述第二电极与所述基板的另一表面接触。
  3. 根据权利要求1所述的装置，其中，所述第一电极和所述第二电极平行设置，并且所述第一电极和所述第二电极之间的距离大于所述基板的厚度。
  4. 根据权利要求3所述的装置，其中，所述距离比所述基板的厚度大2mm至6mm。
  5. 根据权利要求1所述的装置，其中，所述第一电极和所述第二电极的尺寸相同并且基于所述基板的宽度或长度确定。
  6. 根据权利要求1至5中任意一所述的装置，其中，所述第一电极和所述第二电极是平面连续电极。
  7. 根据权利要求1至5中任意一项所述的装置，其中，所述检测器进一步被配置为：
    比较所述检测电流值与电流阈值范围；
    如果所述检测电流值在所述电流阈值范围之外，则确定所述基板破损；以及
    如果所述检测电流值在所述电流阈值范围内，则确定所述基板未破损。
  8. 根据权利要求1至5任意一项所述的装置，其中，所述检测器进一步被配置为：
    计算所述检测电流值和与所述基板相同的无破损基板的正常检测电流 值之间的差值；
    如果所述差值超过阈值，则确定所述基板破损；以及
    如果所述差值未超过所述阈值，则确定所述基板未破损。
  9. 一种基板传送系统，包括：
    根据权利要求1、3至5中任意一项所述的用于检测基板的破损的装置；以及
    用于传送基板的装置，其与所述检测器电耦接，并被配置为使所述基板在所述第一电极和所述第二电极之间传送，以及根据来自所述检测器的表示所述基板破损的指示，停止传送所述基板。
  10. 根据权利要求9所述的系统，其中，所述第一电极和所述第二电极是平面连续电极。
  11. 根据权利要求9或10所述的系统，其中，所述检测器进一步被配置为：
    比较所述检测电流值与电流阈值范围；
    如果所述检测电流值在所述电流阈值范围之外，则确定所述基板破损；以及
    如果所述检测电流值在所述电流阈值范围内，则确定所述基板未破损。
  12. 根据权利要求9或10所述的系统，其中，所述检测器进一步被配置为：
    计算所述检测电流值和与所述基板相同的无破损基板的正常检测电流值之间的差值；
    如果所述差值超过阈值，则确定所述基板破损；以及
    如果所述差值未超过所述阈值，则确定所述基板未破损。
  13. 一种用于检测基板的破损的方法，包括：
    向在所述基板的上方设置的第一电极和在所述基板的下方设置的第二电极施加交流电压；
    检测通过所述基板的电流的电流值；以及
    根据检测电流值，确定所述基板是否破损。
  14. 根据权利要求13所述的方法，其中，根据所述检测电流值确定所述基板是否破损包括：
    比较所述检测电流值与电流阈值范围；
    如果所述检测电流值在所述电流阈值范围之外，则确定所述基板破损；以及
    如果所述检测电流值在所述电流阈值范围内，则确定所述基板未破损。
  15. 根据权利要求13所述的方法，其中，根据所述检测电流值确定所述基板是否破损包括：
    计算所述检测电流值和与所述基板相同的无破损基板的正常检测电流值之间的差值；
    如果所述差值超过阈值，则确定所述基板破损；以及
    如果所述差值未超过所述阈值，则确定所述基板未破损。
  16. 根据权利要求13至15任意一项所述的方法，还包括：
    使所述基板在所述第一电极和所述第二电极之间传送。
  17. 根据权利要求15所述的方法，还包括：
    在确定所述基板破损后，停止所述基板的传送。
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