WO2018181933A1 - ヒートシンク - Google Patents

ヒートシンク Download PDF

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Publication number
WO2018181933A1
WO2018181933A1 PCT/JP2018/013709 JP2018013709W WO2018181933A1 WO 2018181933 A1 WO2018181933 A1 WO 2018181933A1 JP 2018013709 W JP2018013709 W JP 2018013709W WO 2018181933 A1 WO2018181933 A1 WO 2018181933A1
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WO
WIPO (PCT)
Prior art keywords
heat
receiving plate
container
heat pipe
pipe
Prior art date
Application number
PCT/JP2018/013709
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
博史 青木
義勝 稲垣
川畑　賢也
岡田　博
大輝 竹村
Original Assignee
古河電気工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 古河電気工業株式会社 filed Critical 古河電気工業株式会社
Priority to CN201890000636.8U priority Critical patent/CN211575950U/zh
Publication of WO2018181933A1 publication Critical patent/WO2018181933A1/ja
Priority to US16/586,799 priority patent/US20200025460A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes

Definitions

  • the present invention relates to a heat sink that is provided with a heat receiving plate formed of a material having high thermal conductivity and can suppress the occurrence of hot spots on the heat pipe.
  • a heat sink may be used as a method for cooling a heating element such as an electronic component.
  • Patent Document 1 A cast-in heat sink has been proposed (Patent Document 1).
  • Patent Document 1 since the heat pipe is cast by the metal base portion, the thermal conductivity between the heat pipe and the base portion is improved, and as a result, the heat dissipation efficiency of the heat sink is improved. is there.
  • an object of the present invention is to provide a heat sink that exhibits excellent cooling performance by suppressing the occurrence of hot spots in a heat pipe.
  • An aspect of the present invention includes a heat receiving plate to which a heating element is thermally connected, and a heat pipe thermally connected to the heat receiving plate, and the heat conductivity of the heat receiving plate is a container of the heat pipe.
  • the heat sink is higher than the thermal conductivity of the material.
  • the heating element is cooled by thermally connecting the heating element to be cooled to the heat receiving plate of the heat sink.
  • the heat of the heating element is transferred from the heating element to the heat receiving plate, the heat transferred to the heat receiving plate is transferred from the heat receiving plate to the heat pipe, and the heat transferred to the heat pipe is due to the heat transport function of the heat pipe, Released to the outside environment of the heat sink.
  • the heat of the heating element is released to the external environment through the heat receiving plate and the heat pipe, thereby cooling the heating element.
  • a heat pipe is thermally connected with a heat generating body through a heat receiving plate.
  • the heat pipe and the heat receiving plate are formed of materials having different thermal conductivities, and are separate members.
  • An aspect of the present invention is a heat sink in which a partial region of the container is thermally connected to the heat receiving plate.
  • connected the heat receiving plate exist in the container of a heat pipe.
  • the heat conductivity of the heat receiving plate is 200 W / (m ⁇ K) or more and 1500 W / (m ⁇ K) or less, and the heat conductivity of the material of the container is 10 W / (m ⁇ K) or more.
  • the heat sink is 450 W / (m ⁇ K) or less.
  • the heat receiving plate uses a material having a thermal conductivity higher than that of the heat pipe container material.
  • thermal conductivity means thermal conductivity at 25 ° C.
  • the material of the container is at least one selected from the group consisting of stainless steel, titanium, titanium alloy, aluminum, aluminum alloy, nickel, nickel alloy, iron, iron alloy, copper, and copper alloy.
  • a heat sink is provided.
  • An aspect of the present invention is a heat sink in which the heat receiving plate is at least one selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, silver, silver alloy, graphite, and carbon material.
  • An aspect of the present invention is a heat sink in which the length of the heat receiving plate in the longitudinal direction is 0.01 to 0.5 times the length of the container in the longitudinal direction.
  • An aspect of the present invention is a heat sink in which the length of the heat receiving plate in the short direction is 0.01 to 1.0 times the length of the container in the short direction.
  • An aspect of the present invention is a heat sink in which the area of the heat receiving plate in plan view is 0.005 to 1.0 times the area of the container in plan view.
  • the “plan view” means a mode that is parallel to the heat transfer direction from the heat receiving plate to the heat pipe and is viewed from the heat pipe side.
  • An aspect of the present invention is a heat sink in which the thickness of the heat receiving plate is 0.1 to 10.0 times the thickness of the container.
  • the heat pipe is thermally connected to the heat receiving plate, and the heat conductivity of the heat receiving plate is higher than the heat conductivity of the container material of the heat pipe. Since the heat transferred to the plate is transferred to the heat pipe after diffusing through the heat receiving plate, it is possible to suppress an effective evaporation part area and to prevent a hot spot from being generated in the heat pipe. That is, according to the aspect of the present invention, since heat is transmitted to the heat pipe in a state where the heat density is reduced by the heat receiving plate, it is possible to suppress the occurrence of hot spots on the heat pipe. Therefore, according to the aspect of the heat sink of the present invention, the heat load on the heat pipe can be reduced, and thus excellent cooling performance can be exhibited.
  • the heat receiving plate is disposed between the heat pipe and the heat generator, the heat pipe is provided on a part of the heat generator (for example, a peripheral portion such as a corner of the heat generator). Can be locally contacted and the heat pipe can be prevented from being deformed at the contact portion.
  • the heat pipe locally contacts the heating element, and the heat pipe is deformed at the contact portion, the heat density is increased by locally receiving heat at the deformed portion, and the heat pipe is dried out. May occur.
  • the heat receiving plate prevents local deformation of the heat pipe and contact with the local heating element, so that the heat density is reduced from the heating element. Since heat is transferred to the heat pipe, dry-out of the heat pipe can be prevented.
  • the heat sink aspect of the present invention since the partial region of the container is thermally connected to the heat receiving plate, the heat diffusion characteristics of the heat receiving plate and the heat transport function of the heat pipe are further improved. Cooling performance can be obtained.
  • the heat sink 1 includes a heat receiving plate 10, a first heat pipe 11 thermally connected to the heat receiving plate 10, and a first heat pipe 11.
  • a second heat pipe 12 thermally connected at a portion of one end portion 13 and a radiation fin 15 thermally connected to the other end portion 14 of the second heat pipe 12 are provided.
  • the heating element 100 is cooled by the heat sink 1 by being thermally connected to the heat receiving plate 10.
  • the container 16 of the first heat pipe 11 has a flat plate shape.
  • the flat container 16 is formed by overlapping one plate-like body and the other plate-like body facing the one plate-like body.
  • One plate-like body is plastically deformed so that its central portion is convex.
  • a portion of one plate-like body that is plastically deformed into a convex shape is a convex portion (not shown) of the container 16, and the inside of the convex portion is a hollow portion.
  • the internal space of the cavity is decompressed by a deaeration process, and a working fluid (not shown) is enclosed. Further, a wick structure (not shown) having a capillary force is provided inside the decompressed cavity.
  • the first heat pipe 11 in which the container 16 has a flat plate shape is a flat heat pipe, and thus is a vapor chamber.
  • the shape of the container 16 is not particularly limited, but the first heat pipe 11 has a rectangular shape in a plan view (an aspect viewed from the vertical direction with respect to the plane of the first heat pipe 11).
  • the thickness of the container 16 is not particularly limited, and examples thereof include 0.3 to 1.0 mm.
  • a flat heat receiving plate 10 is thermally connected to the container 16 of the first heat pipe 11. Further, the shape of the heat receiving plate 10 in a plan view is not particularly limited, but the heat sink 1 has a rectangular shape as shown in FIG. The heat receiving plate 10 is attached to the container 16 so that the longitudinal direction of the heat receiving plate 10 and the longitudinal direction of the container 16 are substantially parallel.
  • the entire one surface of the flat heat receiving plate 10 is thermally connected to the container 16. That is, the entire heat receiving plate 10 is provided at a position overlapping the container 16 of the first heat pipe 11 in plan view.
  • the heating element 100 to be cooled is thermally connected to the other surface of the flat heat receiving plate 10. Therefore, the heat receiving plate 10 is provided between the first heat pipe 11 and the heating element 100.
  • the area of the container 16 in plan view (bottom view) is larger than the area of the heat receiving plate 10 in plan view (bottom view), and a part of the container 16 in plan view (bottom view) is thermally connected to the heat receiving plate 10. It is connected to the.
  • the area of the heat receiving plate 10 in plan view (bottom view) is less than 1.0 times the area of the container 16 in plan view (bottom view).
  • the area of the heat receiving plate 10 in plan view (bottom view) is not particularly limited, and 0.005 to 1 of the area of the container 16 in plan view (bottom view) is obtained from the viewpoint of reliably obtaining the heat diffusion characteristics of the heat receiving plate 10. 0.0 times is preferable, and 0.1 to 1.0 times is more preferable. From the viewpoint of improving the heat diffusion characteristics of the heat receiving plate 10 and the heat transport function of the first heat pipe 11 in a well-balanced manner, 0.3 to 0.7. Double is particularly preferred.
  • the length of the heat receiving plate 10 in the longitudinal direction is shorter than the length of the container 16 in the longitudinal direction. That is, the length of the heat receiving plate 10 in the longitudinal direction is less than 1.0 times the length of the container 16 in the longitudinal direction.
  • the length in the longitudinal direction of the heat receiving plate 10 is not particularly limited, and is preferably 0.01 to 1.0 times the length in the longitudinal direction of the container 16 from the viewpoint of reliably obtaining the heat diffusion characteristics of the heat receiving plate 10. From the viewpoint of improving the heat diffusion characteristics of the heat receiving plate 10 and the heat transport function of the first heat pipe 11 in a well-balanced manner, it is more preferably 0.01 to 0.5 times, and particularly preferably 0.1 to 0.5 times.
  • the length in the longitudinal direction of the heat receiving plate 10 may be longer than the length in the longitudinal direction of the container 16.
  • the length in the longitudinal direction of the heat receiving plate 10 is 1 of the length in the longitudinal direction of the container 16. It may be more than 0.0 to 2.0 times.
  • the length perpendicular to the longitudinal direction of the heat receiving plate 10 improves the heat diffusion characteristics of the heat receiving plate 10 and the heat transport function of the first heat pipe 11 in a well-balanced manner. From the point, it is shorter than the length in the orthogonal direction (short direction) to the longitudinal direction of the container 16. That is, the length of the heat receiving plate 10 in the short direction is less than 1.0 times the length of the container 16 in the short direction.
  • the length of the heat receiving plate 10 in the short direction is not particularly limited, and is 0.01 to 1.0 times the length of the container 16 in the short direction from the viewpoint of reliably obtaining the heat diffusion characteristics of the heat receiving plate 10.
  • the ratio is preferably 0.3 to 0.7 times.
  • the thickness of the heat receiving plate 10 is not particularly limited, and is preferably 0.1 to 10.0 times the thickness of the container 16 from the viewpoint of a balance between thermal diffusion characteristics and thermal conductivity to the container 16. 0.1 to 5.0 times is more preferable, and 0.3 to 3.0 times is particularly preferable.
  • the method of thermal connection between the container 16 and the heat receiving plate 10 is not particularly limited.
  • the flat portion of the heat receiving plate 10 is in direct contact with the flat portion of the container 16, so that the container 16 (first heat pipe 11 ) And the heat receiving plate 10 are thermally connected.
  • the connection and fixing means of the heat receiving plate 10 to the container 16 are not particularly limited, and examples thereof include screwing, soldering, brazing, and welding.
  • the material of the container 16 and the heat receiving plate 10 is not particularly limited as long as the heat conductivity of the material of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16.
  • the heat conductivity of the heat receiving plate 10 is 200 W / (m ⁇ K) or more and 1500 W / (m ⁇ K) or less is preferable at 25 ° C. from the viewpoint that the thermal diffusion characteristics of the plate 10 can be reliably obtained and the material is easily available, and 300 W / (m ⁇ K).
  • To 450 W / (m ⁇ K) is particularly preferable.
  • the thermal conductivity of the material of the container 16 is, for example, from 10 W / (m ⁇ K) to 450 W / (m ⁇ K) at 25 ° C. from the point of heat transfer to the container 16 in a state where the heat density is reliably reduced. Is preferably 10 W / (m ⁇ K) or more and less than 200 W / (m ⁇ K), more preferably 10 W / (m ⁇ K) or more and 100 W / (m ⁇ K) or less.
  • Examples of the material of the heat receiving plate 10 include copper, copper alloy, aluminum, aluminum alloy, silver, silver alloy, graphite (for example, graphite sheet), carbon material (for example, composite member using carbon fiber), and the like. Can be mentioned.
  • Examples of the material of the container 16 include stainless steel, titanium, titanium alloy, aluminum, aluminum alloy, nickel, nickel alloy, iron, iron alloy, copper, and copper alloy. However, since the heat conductivity of the material of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16, the container 16 uses a material different from the material of the heat receiving plate 10.
  • the material of the heat receiving plate 10 is copper, copper alloy, aluminum or aluminum alloy, container from the viewpoint of weight reduction / thinning of the first heat pipe 11 and mechanical strength and heat diffusion characteristics of the heat receiving plate 10.
  • a combination of stainless steel, titanium or a titanium alloy is preferable as the material 16, and a combination where the material of the heat receiving plate 10 is copper or a copper alloy and the material of the container 16 is stainless steel is particularly preferable.
  • the surface roughness (arithmetic average roughness: Ra) of the copper or copper alloy is 0.05 to 0.2 ⁇ m.
  • the surface roughness (Ra) of stainless steel is about 0.5 ⁇ m
  • the surface roughness (Ra) of copper or copper alloy is smaller than that of stainless steel. Therefore, when the heat receiving plate 10 is thermally connected to the heating element 100 via a heat conductive grease (not shown), the heat pipe generates heat via the heat conductive grease without using the heat receiving plate 10. Compared to the case where the heat generating body 100 is thermally connected to the body 100, the thermal resistance between the heat generating body 100 and the heat sink 1 can be reduced.
  • the linear expansion coefficients of the container 16 and the heat receiving plate 10 are close to each other.
  • the container 16 is easily peeled off from the heat receiving plate 10, and when peeling occurs, the thermal resistance between the heat receiving plate 10 and the container 16 is increased.
  • a combination of stainless steel for the container 16 and copper for the heat receiving plate is particularly preferable from the viewpoint of reliably preventing peeling due to the close linear expansion coefficient.
  • the working fluid sealed in the cavity of the container 16 can be appropriately selected according to the compatibility with the material of the container 16, and examples thereof include water.
  • the wick structure include a sintered body of metal powder such as copper powder, a metal mesh made of a metal wire, a groove, and a nonwoven fabric.
  • the second heat pipe 12 is thermally connected to the longitudinal edge of the container 16 of the first heat pipe 11.
  • the container of the second heat pipe 12 is a tubular body, and one end 13 thereof is thermally connected at the longitudinal edge of the container 16 of the first heat pipe 11. One end 13 extends over the entire width of the container 16. One end 13 extends along the plane of the container 16 of the first heat pipe 11. Therefore, the second heat pipe 12 is thermally connected to the heat receiving plate 10 via the first heat pipe 11.
  • the shape of the container of the second heat pipe 12 in the radial direction is not particularly limited, and examples thereof include a round shape and an elliptical shape, and may be a flat shape obtained by flattening a tubular body.
  • the heat transport direction of the second heat pipe 12 is substantially parallel to the plane of the container 16 of the first heat pipe 11.
  • the material of the container of the second heat pipe 12 is not particularly limited, and examples thereof include copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, stainless steel, titanium, titanium alloy and the like. Further, examples of the working fluid enclosed in the second heat pipe 12 include those listed in the first heat pipe 11. In addition, examples of the wick structure housed in the second heat pipe 12 include those listed in the first heat pipe 11.
  • the means for connecting the second heat pipe 12 to the first heat pipe 11 is not particularly limited, and examples thereof include soldering, brazing, and welding.
  • the radiation fin 15 is attached to the other end portion 14 of the second heat pipe 12, and the radiation fin 15 is thermally connected to the other end portion 14.
  • Examples of the material of the radiation fin 15 include aluminum, an aluminum alloy, copper, a copper alloy, and the like.
  • the heat sink 1 When the heating element 100 to be cooled is attached to the heat receiving plate 10 of the heat sink 1, the heat of the heating element 100 is transmitted from the heating element 100 to the heat receiving plate 10, and the heat transmitted to the heat receiving plate 10 is the heat receiving plate 10.
  • To the heat receiving portion of the first heat pipe 11 (the portion in contact with the heat receiving plate 10).
  • the heat transferred to the heat receiving part of the first heat pipe 11 is a heat dissipating part that is a part away from the heat receiving part of the first heat pipe 11 by the heat transport function of the first heat pipe 11.
  • the first heat pipe 11 is thermally connected to the heat receiving plate 10, and the heat conductivity of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16 of the first heat pipe 11.
  • the heat transferred from the heating element 100 to the heat receiving plate 10 is preferentially diffused through the heat receiving plate 10 having a relatively high thermal conductivity. Since heat is transferred from the heat receiving plate 10 to the first heat pipe 11 after the heat diffusion in the heat receiving plate 10, it is possible to suppress the occurrence of hot spots in the first heat pipe 11. Therefore, in the heat sink 1, since the heat load to the 1st heat pipe 11 thermally connected with the heat generating body 100 via the heat receiving plate 10 can be reduced, the outstanding cooling performance can be exhibited.
  • the first heat pipe 11 locally contacts the heating element 100 (for example, contacts with peripheral portions such as corners of the heating element 100), and the first heat pipe 11 is deformed at the contact portion.
  • the deformed portion locally receives heat from the heating element 100 and the heat density increases, and the first heat pipe 11 may dry out.
  • the heat receiving plate 10 since the heat receiving plate 10 is disposed between the first heat pipe 11 and the heating element 100, the first heat pipe 11 locally contacts a part of the heating element 10, It is possible to prevent one heat pipe 11 from being deformed at the contact portion. That is, the heat receiving plate 10 also functions as a protective member for the first heat pipe 11.
  • the heat sink 1 it is possible to prevent the first heat pipe 11 from being deformed at the local contact portion with the heating element 10, so that the local heat is generated from the heating element 100 to the first heat pipe 11.
  • the heat is transferred in a state in which the increase in the heat density is prevented, and the dry-out of the first heat pipe 11 can be prevented.
  • the first heat pipe that is thermally connected to the heat receiving plate is a planar heat pipe, that is, a vapor chamber, and the number of installed heat pipes is one.
  • a plurality of (two in FIG. 4) flat types are used as the first heat pipes 21 that are thermally connected to the heat receiving plate 10.
  • a heat pipe group including heat pipes 21-1 and 21-2 is used.
  • the two flat heat pipes 21-1 and 21-2 have substantially the same shape and dimensions, and are arranged in parallel and in contact with the side surfaces, so that they are thermally connected to the heat receiving plate 10.
  • a first heat pipe 21 is formed.
  • a container formed by flattening a tubular body having a circular cross section in the radial direction is used.
  • the length of the heat receiving plate 10 in the longitudinal direction is shorter than the length of the flat heat pipes 21-1 and 21-2 in the longitudinal direction.
  • the length in the direction orthogonal to the longitudinal direction of the heat receiving plate 10 is substantially the same as the length in the direction orthogonal to the longitudinal direction of the first heat pipe 21.
  • one end of the two flat heat pipes 21-1 and 21-2 (that is, one end of the first heat pipe 21) is thermally connected to the heat receiving plate 10.
  • the other end portion that functions as a heat receiving portion and that is not connected to the heat receiving plate 10 and faces one end portion functions as a heat radiating portion.
  • a heat radiating fin 15 is attached to the other end (heat radiating portion) of the first heat pipe 21.
  • the heat sink 2 is not provided with a second heat pipe that is thermally connected to the first heat pipe 21.
  • the heat transferred from the heating element (not shown) to the heat receiving plate 10 diffuses through the heat receiving plate 10 having a relatively higher thermal conductivity than the container of the first heat pipe 21, and then flattened. Since the heat is transmitted to the mold heat pipes 21-1 and 21-2, the occurrence of hot spots on the flat heat pipes 21-1 and 21-2 can be suppressed.
  • the second heat pipe is thermally connected to the longitudinal edge of the container of the first heat pipe.
  • the second heat pipe 12 is thermally connected to the central portion in the longitudinal direction of the container 16 of the first heat pipe 11.
  • One end 13 of the second heat pipe 12 is thermally connected at the center in the longitudinal direction of the container 16 of the first heat pipe 11.
  • one end 13 of the second heat pipe 12 does not extend to the center of the container 16 of the first heat pipe 11, and heat is generated at the peripheral edge of the container 16 of the first heat pipe 11. Connected.
  • the radiating fin is attached to the other end of the second heat pipe.
  • the second heat pipe 12 No heat exchanging means such as radiating fins is attached to the other end portion 14.
  • the first heat pipe 11 is thermally connected to the heat receiving plate 10, and the heat conductivity of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16 of the first heat pipe 11.
  • the heat transferred from the heating element 100 to the heat receiving plate 10 is preferentially diffused through the heat receiving plate 10 having a relatively high thermal conductivity. Therefore, it is possible to suppress the occurrence of hot spots on the first heat pipe 11. From the above, even the heat sink 3 can reduce the thermal load on the first heat pipe 11 that is thermally connected to the heating element 100 via the heat receiving plate 10, so that excellent cooling performance can be exhibited.
  • one second heat pipe is thermally connected to one first heat pipe container. Instead, this is shown in FIG.
  • a plurality of (two in FIG. 6) second heat pipes 12 are thermally connected to the container 16 of one first heat pipe 11. Yes.
  • the second heat pipe 12 is thermally connected to both edges in the longitudinal direction of the container 16 of the first heat pipe 11.
  • One end 13 of the second heat pipe 12 is thermally connected to both longitudinal edges of the container 16 of the first heat pipe 11.
  • the plurality of second heat pipes 12 are thermally connected to the first heat pipe 11, so that the heat transport capability of the second heat pipe 12 is further improved.
  • the first heat pipe 11 is thermally connected to the heat receiving plate 10, and the heat conductivity of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16 of the first heat pipe 11.
  • the heat transferred from the heating element 100 to the heat receiving plate 10 is preferentially diffused through the heat receiving plate 10 having a relatively high thermal conductivity. Therefore, it is possible to suppress the occurrence of hot spots on the first heat pipe 11. From the above, even the heat sink 4 can reduce the thermal load on the first heat pipe 11 that is thermally connected to the heating element 100 via the heat receiving plate 10, so that excellent cooling performance can be exhibited.
  • the heat of the first heat pipe transmitted from the heating element is transmitted from the first heat pipe 11 to the second heat pipe.
  • the heat H of the first heat pipe 11 transmitted from the heating element 100 is the first heat pipe. 11 is transmitted not only to the second heat pipe 12 but also to the heat conductive member 41.
  • the heat conducting member 41 is thermally connected to the container 16 of the first heat pipe 11.
  • the second heat pipe 12 is thermally connected to the longitudinal center of the container 16 of the first heat pipe 11, and the heat conducting member 41 is thermally adjacent to the second heat pipe 12. It is connected to the.
  • the heat conducting member 41 is thermally connected to the container 16 of the first heat pipe 11 so that the heat conducting member 41 is located on both sides of the second heat pipe 12.
  • one end 13 of the second heat pipe 12 does not extend to the center of the container 16 of the first heat pipe 11, and heat is generated at the peripheral edge of the container 16 of the first heat pipe 11. Connected.
  • the heat conducting member 41 is, for example, a plate-like or sheet-like member, and examples of the material thereof include metals such as graphite and copper.
  • the heat conducting member 41 is thermally connected to the first heat pipe 11, so that the heat transfer characteristics from the first heat pipe 11 are further improved. .
  • the heat sink 5 not only the first heat pipe 11 but also the heat load of the second heat pipe 12 can be reduced.
  • the first heat pipe 11 is thermally connected to the heat receiving plate 10, and the heat conductivity of the heat receiving plate 10 is higher than the heat conductivity of the material of the container 16 of the first heat pipe 11.
  • the heat transferred from the heating element 100 to the heat receiving plate 10 is preferentially diffused through the heat receiving plate 10 having a relatively high thermal conductivity. Therefore, it is possible to suppress the occurrence of hot spots on the first heat pipe 11. From the above, the heat sink 5 can also reduce the heat load on the first heat pipe 11 that is thermally connected to the heating element 100 via the heat receiving plate 10, so that excellent cooling performance can be exhibited.
  • the second heat pipe is provided at the longitudinal edge or central portion (heat radiating portion) of the first heat pipe thermally connected to the heat receiving plate.
  • the second heat pipe may not be provided depending on the use situation, and the heat radiating fins may be provided on the first heat pipe.
  • the second heat pipe is further thermally connected to the flat heat pipe (first heat pipe) thermally connected to the heat receiving plate. You may connect. In this case, the second heat pipe is thermally connected to the heat receiving plate via the flat heat pipe.
  • First heat pipe 50 mm ⁇ 100 mm ⁇ 0.6 mm thick stainless steel container, working fluid is water.
  • Heat receiving plate 20 ⁇ 30 ⁇ 0.1 mm thick copper (Example 1), 20 ⁇ 30 ⁇ 0.1 mm thick stainless steel (Comparative Example 2), Comparative Example 1 has no heat receiving plate.
  • Second heat pipe copper flat container of ⁇ 6 mm ⁇ T2 mm ⁇ L100 mm, working fluid is water.
  • Second heat pipe copper flat container of ⁇ 6 mm ⁇ T2 mm ⁇ L100 mm, working fluid is water.
  • Heat radiation fin 20mm ⁇ 10mm ⁇ 2mm copper, 20 sheets ⁇ Heating element: 20W
  • the temperature measurement point is the heating element (1), directly above the part connected to the heating element among the first heat pipes (2), and the second heat pipe is attached among the first heat pipes. There were four locations on the edge (3) and the other end (4) of the second heat pipe. The temperature was measured by installing a thermocouple on the surface of the part.
  • Example 1 and Comparative Examples 1 and 2 are shown in FIG. From FIG. 8, in Example 1 using a stainless steel container and a copper heat receiving plate, the temperature of the heating element was greatly reduced. On the other hand, in Comparative Example 1 using a stainless steel container and no heat receiving plate, and in Comparative Example 2 using a stainless steel container and a stainless steel heat receiving plate, the heating element is sufficiently cooled. could not.
  • the heat sink of the present invention can suppress the occurrence of hot spots on the heat pipe, it can exhibit excellent cooling performance even if the heat generation amount of the heating element is increased, and can be used in a wide range of fields, for example,
  • the utility value is particularly high in the field of cooling electronic components mounted on mobile electronic devices such as notebook personal computers, tablet personal computers, and smart phones on which electronic components having a large calorific value are mounted.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Sustainable Development (AREA)
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US12108569B2 (en) * 2020-05-06 2024-10-01 Asia Vital Components Co., Ltd. Heat dissipation connection structure of handheld device

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JP2003336976A (ja) * 2002-05-17 2003-11-28 Furukawa Electric Co Ltd:The ヒートシンクおよびその実装構造

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JP4558086B1 (ja) * 2009-06-22 2010-10-06 株式会社東芝 電子機器
US20110168358A1 (en) * 2010-01-13 2011-07-14 Asia Vital Components Co., Ltd. Lap-joined heat pipe structure and thermal module using same
CN102768568B (zh) * 2011-05-05 2015-09-02 华硕电脑股份有限公司 散热模块及其散热方法
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JP2003336976A (ja) * 2002-05-17 2003-11-28 Furukawa Electric Co Ltd:The ヒートシンクおよびその実装構造

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