WO2018181742A1 - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法 Download PDFInfo
- Publication number
- WO2018181742A1 WO2018181742A1 PCT/JP2018/013312 JP2018013312W WO2018181742A1 WO 2018181742 A1 WO2018181742 A1 WO 2018181742A1 JP 2018013312 W JP2018013312 W JP 2018013312W WO 2018181742 A1 WO2018181742 A1 WO 2018181742A1
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- WIPO (PCT)
- Prior art keywords
- wiring board
- printed wiring
- laser
- via hole
- manufacturing
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0035—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material of blind holes, i.e. having a metal layer at the bottom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H05K3/0038—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material combined with laser drilling through a metal layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
- H05K3/4605—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated made from inorganic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4632—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating thermoplastic or uncured resin sheets comprising printed circuits without added adhesive materials between the sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
Definitions
- the present invention relates to a method for manufacturing a printed wiring board.
- a conventional printed wiring board has a through hole or a via hole in an insulating resin base material having a conductor circuit on one side or both sides, and a conductive layer is applied to the opening by electroless plating or electrolytic plating. It forms by connecting through a conductor layer (for example, patent documents 1 and 2). In normal via hole processing, only one side is drilled.
- Patent Document 3 discloses a method of manufacturing a core substrate of a multilayer laminated wiring board having copper foil on the front and back sides of an insulating resin layer, and a step of etching the copper foil on the front and back sides of the core substrate to form a copper foil pattern; Removing the insulating resin layer exposed in the step of forming the copper foil pattern to form a connection hole for electrically connecting the copper foil patterns on the front and back of the core substrate; and the connection hole And a step of removing a resin residue and a copper residue generated at the bottom of the connection hole by using a laser as a means for removing the insulating resin layer in the step of forming the connection hole.
- the thickness of the bottom of the via hole is thinner than the core base material described in Patent Document 3, so that smear is obtained by spray cleaning. Is difficult to remove, and it is difficult to manufacture a printed wiring board for the purpose of reducing the size and performance of electronic equipment.
- the present invention has been made in view of such a problem, and an object of the present invention is to provide a method for manufacturing a printed wiring board, which is excellent in mechanical strength and makes it possible to obtain a high-density mounting board.
- a method for producing a printed wiring board using a metal-clad laminate in which metal foils are laminated on both sides of an insulating resin substrate comprises at least (1) a step of irradiating a predetermined position on the surface (A) of the metal-clad laminate with a laser to provide a via hole reaching the metal foil on the opposite surface of the surface (A); (2) irradiating a predetermined position on the surface (B) opposite to the surface (A) with a laser to provide a via hole extending to the metal foil on the opposite surface of the surface (B).
- the total number of via holes obtained by the steps (1) and (2) is 5,000,000 holes / m 2 or more, according to any one of [1] to [11] The manufacturing method of the printed wiring board of description.
- the present invention it is possible to provide a method for manufacturing a printed wiring board, which is excellent in mechanical strength and makes it possible to obtain a high-density mounting board.
- FIG. 4 is a schematic diagram of a single pulse laser with the horizontal axis representing time and the vertical axis representing light output.
- the printed wiring board in the present embodiment uses a metal-clad laminate in which metal foil is laminated on both surfaces of an insulating resin base material.
- the printed wiring board may be a laminate of metal-clad laminates.
- the protective layer containing a resin sheet may be provided on the metal foil on one side or both sides of the printed wiring board.
- the metal-clad laminate is formed by laminating metal foils on both sides of an insulating resin base material.
- an insulating resin base material is not specifically limited, Usually, a thermosetting resin, an inorganic filler, and a glass cloth are included as needed.
- the thickness of the insulating resin base material is not particularly limited, but is usually 10 to 100 ⁇ m, preferably 15 to 100 ⁇ m from the viewpoint of easy handling of the base material.
- thermosetting resin used in the present invention is not particularly limited as long as it is a non-halogen compound of a thermosetting resin used for printed wiring board materials.
- specific examples include non-halogen compounds such as cyanate ester compounds, epoxy resins, maleimide compounds, polyimide resins, and double bond-added polyphenylene ether resins, which can be used alone or in combination of two or more. is there.
- Preferred examples of the thermosetting resin include a cyanate ester compound (a) and an epoxy resin (b).
- the cyanate ester compound (a) preferably used in the present invention is not particularly limited as long as it is a non-halogen compound having two or more cyanate groups in one molecule.
- Specific examples include bisphenol A type cyanate ester compound, phenol novolac type cyanate ester compound, bisphenol E type cyanate ester compound, naphthalene skeleton-containing cyanate ester compound, biphenyl skeleton-containing cyanate ester compound and the like. Or it is also possible to use 2 or more types in combination.
- More preferable examples include 2,2-bis (4-cyanatophenyl) propane, bis (3,5-dimethyl-4-cyanatophenyl) methane, phenol novolac type cyanate ester compound, naphthol aralkyl type Examples include cyanate ester compounds.
- the epoxy resin (b) preferably used in the present invention is not particularly limited as long as it is a non-halogen compound having two or more epoxy groups in one molecule.
- Specific examples include bisphenol A type epoxy resin, bisphenol F type epoxy resin, biphenol type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, polyfunctional phenol type epoxy resin, naphthalene skeleton containing epoxy resin, biphenyl skeleton containing An epoxy resin, a phosphorus containing epoxy resin, etc. are mentioned, It is also possible to use 1 type or in combination of 2 or more types.
- More preferable examples include bisphenol A type epoxy resins, phenol novolac type epoxy resins, biphenyl aralkyl type epoxy resins, naphthalene type epoxy resins, naphthol aralkyl type epoxy resins, and trifunctional phenol type epoxy resins.
- the inorganic filler silica, boron nitride, wollastonite, talc, kaolin, clay, mica, alumina, zirconia, titania, magnesium oxide and other metal oxides, nitrides, silicides, borides, etc. may be used. it can.
- an inorganic filler to the insulating resin substrate, it is possible to reduce the thermal expansion coefficient and improve the rigidity of the laminated board for printed wiring boards.
- the insulating resin substrate can have a low dielectric constant.
- Metal foil includes copper, gold and aluminum. Preferably, it is copper from the point of electrical conductivity.
- the thickness of the metal foil is not particularly limited, but is usually 1 to 18 ⁇ m, and preferably 1 to 12 ⁇ m from the viewpoint of easy laser drilling workability.
- the film thickness may be the same or different on both sides, but is preferably the same. According to the present embodiment, even when a thin metal foil is used, no warp occurs, the smear residue at the bottom of the via hole does not become a problem, and a large number of via holes and through holes are accurately formed at desired positions. Can be provided.
- FIG. 1 is a cross-sectional view of a copper-clad laminate before via-hole processing used in the method for manufacturing a printed wiring board in the present embodiment.
- the copper foils 13 and 15 of the double-sided copper-clad laminate 10 are roughened by black oxidation before via hole processing.
- the roughening treatment method include a method using BO-220 (trade name) manufactured by Nippon McDermitt Co., Ltd.
- via hole processing for exposing the insulating resin base material 14 and the copper foil 13 is performed in order to make electrical connection with the wiring formed in both layers.
- step (1) with respect to a predetermined position on one surface of the double-sided copper-clad laminate 10, the copper foil 13 and the insulating resin base material 14 are penetrated to the opposite surface. A via hole 11 reaching the copper foil 15 is formed. That is, in the step (1), the hole is processed so as not to penetrate the copper foil 15 while removing the copper foil 13 and the base material 14.
- the predetermined position means an appropriate position along the circuit pattern.
- a through hole may be appropriately provided as long as the effect of the present embodiment is not impaired.
- a through hole is a hole which penetrated the copper foil 13, the insulating resin base material 14, and the copper foil 15.
- the copper foil 15 and the insulating resin base material 14 are penetrated with respect to a predetermined position on the surface (copper foil 15) opposite to the surface processed in the step (1).
- a via hole 12 reaching the copper foil 13 opposite to the copper foil 15 is formed.
- the via hole formed in the step (2) may be a through hole penetrating the via hole formed in the step (1) as long as the effect of the present embodiment is not impaired.
- a via hole formed in the step (1) and a through hole that does not penetrate may be provided as long as the effect of the present embodiment is not impaired.
- via holes can be obtained by processing the metal foil and the insulating resin base at a stretch on both the front and back surfaces of the metal foil laminate. According to the present embodiment, since laser processing is performed with large energy, a via hole can be formed without a step of previously forming a copper foil pattern. In addition, the residual smear at the bottom of the via hole does not cause a problem, and even if the printed wiring board is thin, no warp occurs, and a large number of via holes and through holes can be accurately provided at desired positions.
- steps (1) and (2) may be performed simultaneously or sequentially. If performed simultaneously, the advantage of further reducing the warpage of the substrate can be obtained. If performed sequentially, it can be easily processed by an existing laser processing machine.
- the printed wiring board of this embodiment may be manufactured by repeatedly performing steps (1) and (2).
- the steps (1) and (2) are performed while vacuum-adsorbing the workpiece (metal foil laminate), so that the printed wiring board does not warp even if the printed wiring board is thin.
- the vacuum suction is performed using, for example, a plate having holes of ⁇ 2.5 mm at a pitch of 15 mm and suctioning by reducing the pressure.
- the degree of vacuum is not particularly limited, but is usually ⁇ 100,000 to ⁇ 100 Pa (negative pressure).
- the top diameters of the via holes obtained by the steps (1) and (2) may be different or the same, and are not particularly limited. In this embodiment, it is preferable to have at least one top diameter of 120 ⁇ m or less, and more preferably 30 to 100 ⁇ m from the viewpoint of reducing voids in filled plating. More preferably, the top diameters of the via holes are all 30 to 100 ⁇ m.
- the top diameter is preferably uniform since it has excellent mechanical strength and can provide a highly dense mounting board.
- the top diameter is an outer diameter located closest to the laser irradiation side in each via hole.
- the shape of the via hole may be the same or different. However, it is preferable that the via hole has the same and circular shape because it is excellent in mechanical strength and can provide a highly dense mounting board.
- the pitch between via holes obtained by the steps (1) and (2) may be different or the same, and is not particularly limited. In the present embodiment, it is preferable to have at least one pitch of 60 to 400 ⁇ m or less, and more preferably 100 to 400 ⁇ m from the viewpoint of reliability. More preferably, the pitch between via holes is 100 to 400 ⁇ m.
- the pitch is the shortest distance from the position of the center of gravity of the surface of each via hole or through hole to the position of the center of gravity of the surface of the adjacent via hole or through hole. That is, the pitch between via holes is the distance between adjacent via holes or through holes, and is the shortest distance.
- the total number of via holes obtained by the steps (1) and (2) is not particularly limited, but is preferably 5,000,000 holes / m 2 or more, and more preferably a reduction in warpage is remarkable. Therefore, it is 10,000,000 to 40,000,000 holes / m 2 .
- the upper limit is not particularly limited, but if it exceeds 40,000,000 holes / m 2 , it is not preferable because even if vacuum suction is performed, suction failure tends to occur and warping of the printed wiring board tends to occur. According to the production method of the present invention, a printed circuit board is not warped, has excellent mechanical strength, has a large amount of via holes, and can obtain a high-density mounting substrate.
- the via hole can be processed using a laser such as a mechanical drill, an ultraviolet laser (UV laser), and a carbon dioxide laser (CO 2 laser), and is not particularly limited.
- a laser such as a mechanical drill, an ultraviolet laser (UV laser), and a carbon dioxide laser (CO 2 laser)
- UV laser ultraviolet laser
- CO 2 laser carbon dioxide laser
- This desmear treatment is performed by wet treatment such as chemical treatment with an acid or an oxidizing agent (for example, chromic acid or permanganic acid), or dry treatment such as oxygen plasma discharge treatment, corona discharge treatment, ultraviolet laser treatment, or excimer laser treatment.
- wet treatment such as chemical treatment with an acid or an oxidizing agent (for example, chromic acid or permanganic acid)
- dry treatment such as oxygen plasma discharge treatment, corona discharge treatment, ultraviolet laser treatment, or excimer laser treatment.
- Which of these desmear treatment methods is selected depends on the type of insulating resin base material, thickness, via hole opening diameter, processing conditions such as laser irradiation conditions, and the amount of desmear that is expected to remain. Chosen in consideration.
- CO 2 laser wavelength of the pulse width by defining the total amount of energy and the number of shots needed, since it is possible to suitably form the desired via holes, it is preferable to use a CO 2 laser .
- the thickness of the insulating resin substrate (14) is 100 ⁇ m or less.
- the wavelength of the CO 2 laser is 9 to 11 ⁇ m.
- the pulse width of the CO 2 laser is not particularly limited, but is preferably 100 ⁇ sec or less, and from the viewpoint of the hole shape, 1 to 15 ⁇ m is preferable. Preferably it is seconds.
- the pulse width in this embodiment is defined as the half width of the curve for a single pulse laser as shown in FIG.
- the pulse width has a time dimension and is a temporal width that means how long light is emitted.
- the total energy amount of the CO 2 laser per via hole is not particularly limited, but is preferably 0.1 to 20 mJ, From the viewpoint of the hole shape, it is preferably 0.5 to 15 mJ. If the total energy amount of the CO 2 laser is less than 0.1 mJ, a preferable via hole cannot be processed, and the smear residue cannot be suitably removed. When the total energy amount of the CO 2 laser is larger than 20 mJ, the warp of the printed wiring board increases, which is not preferable.
- the total energy amount of CO 2 laser is in the above range, so there is no warping of the printed wiring board, and the smear residue can be easily removed when desmearing. can do.
- the total amount of energy of the laser corresponds to the total amount of energy input to the printed wiring board in one laser drilling.
- the number of shots of CO 2 laser per via hole is not particularly limited, but is preferably 1 to 5 times, and is economical. From the viewpoint of processing time, it is preferably 1 to 3 times. The number of shots will be described in the processing method described later.
- Trepanning is a processing method in which drilling is performed by applying energy along the contour of a hole having a certain shape. A hole having a certain shape is cut and processed. Trepanning is preferably used when machining a hole larger than the beam diameter.
- the number of shots per round is the number of times that a single pulse laser is irradiated to the printed wiring board during one round of scanning in processing of a single hole by trepanning.
- the number of laps refers to the number of laps scanned along the outline of a hole in processing a single hole by trepanning.
- Punching is a processing method in which the same spot is irradiated with a plurality of pulse lasers. Particularly, it is suitably used when processing a deep hole.
- the number of shots is the number of times of pulsed laser applied to the printed wiring board in processing a single hole by punching.
- the total amount of energy corresponds to the total amount of energy input to the printed wiring board in one laser drilling.
- Total energy pulse energy x number of laps x number of shots per lap
- Total energy pulse energy x number of shots
- the pulse energy is energy that a single pulse laser has.
- the pulse energy corresponds to a value obtained by integrating the light output with respect to time for a single pulse laser. If the pulse energy is the same, the shorter the pulse width, the higher the peak output of light, making it easier to machine deep holes.
- the pulse frequency is the number of times that a single pulse laser is emitted per unit time.
- plating process in order to electrically connect both surfaces by filling the via hole with plating, first, an electroless plating film is formed on the inner wall of the via hole by a normal electroless plating process, and then the plating solution is jetted. It is desirable to fill and fill the via hole by an electrolytic plating method such as a sparger plating method for hitting the substrate.
- an electrolytic plating method such as a sparger plating method for hitting the substrate.
- metal plating such as copper, tin, silver, various solders, copper / tin, copper / silver, is preferable, for example, electroless copper plating or electrolytic copper plating is more preferable.
- the conductor circuit formed on both surfaces of the insulating resin base material is formed by etching the conductor layer (metal foil) formed simultaneously with the formation of the plating filled via hole or the through hole. Is desirable.
- a photosensitive dry film resist is first applied to the surface of the conductor layer, and then an etching resist is formed by exposing and developing along a predetermined circuit pattern.
- the conductor layer is etched to form a conductor circuit pattern including electrode pads.
- At least one aqueous solution selected from an aqueous solution of sulfuric acid monohydrogen peroxide, persulfate, cupric chloride, and ferric chloride can be used as the etching solution.
- the entire surface of the conductor layer is etched in advance to have a thickness of about 1 to 10 ⁇ m, more preferably about 2 to 8 ⁇ m, in order to facilitate the formation of a fine pattern. Can be thinned.
- the printed wiring board of this embodiment can also be used for forming a multilayer printed wiring board.
- the multilayer printed wiring board for example, uses the printed wiring board of this embodiment as a core substrate, and a conductor layer (metal foil) and a resin insulating layer (insulating resin base material) are alternately formed on the core substrate by a conventional method. A built-up wiring layer is formed.
- a part of the outermost conductor layer is formed on the bump connection pad at a predetermined pitch, and the pitch between adjacent plated filling via holes or through holes formed in the core substrate Is preferably formed in the same pitch as the bump connection pads.
- a double-sided copper-clad laminate 10 (CCL (registered trademark) -HL832NSF type LC-E 0.06 mmt D / D manufactured by Mitsubishi Gas Chemical) was used as a starting material.
- the insulating resin base material 14 had a thickness of 60 ⁇ m, and the copper foils 13 and 15 each had a thickness of 5 ⁇ m.
- the copper foils 13 and 15 of the double-sided copper clad laminate 10 were roughened by black oxidation treatment.
- the double-sided copper-clad laminate 10 was set in a vacuum suction unit (under vacuum) having a plate with 15 mm pitch and ⁇ 2.5 mm holes. Thereafter, carbon dioxide laser irradiation is performed on a predetermined position on one surface of the double-sided copper-clad laminate 10, penetrating the copper foil 13 and the insulating resin base material 14, and the copper foil on the opposite side of the copper foil 13 15 via holes 11 were formed (see FIG. 2).
- a carbon dioxide laser (wavelength: 9 to 11 ⁇ m) is irradiated to a predetermined position on the surface opposite to the copper foil 13 (copper foil 15) to penetrate through the copper foil 15 and the insulating resin base material 14.
- a via hole 12 reaching the copper foil 13 opposite to the copper foil 15 was formed (see FIGS. 3 and 4).
- the via hole was formed using a substrate drilling laser processing machine (ML605GTW3 (-H) 5200U (trade name)) manufactured by Mitsubishi Electric. Laser processing was performed under the following conditions. The pulse width was 6 ⁇ s, the total number of laser energies per via hole was 5.1 mJ, and the number of laser shots per via hole was one time. The top diameter of each via hole was 75 ⁇ m. Further, the pitch between via holes was all 150 to 200 ⁇ m.
- the laser-processed double-sided copper-clad laminate was placed on a flat surface, and the portion away from the flattest surface was measured with a straight scale to be 2 mm (see FIG. 5).
- the laser-processed double-sided copper-clad laminate was placed on a flat surface, and the portion away from the flattest surface was measured with a straight scale, and it was 25 mm (see FIG. 7).
- a mounting board having excellent mechanical strength and high density can be obtained, which is extremely useful industrially.
- the printed wiring board obtained by the manufacturing method of the present invention it is possible to satisfy the demand for downsizing and high performance of electronic devices.
- Double-sided copper clad laminate 11 Via hole processed from one side 12: Via hole processed from the other side (surface opposite to copper foil 11) 13: Copper foil 14: Insulating resin base material 15: Copper Foil
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
該製造方法が、少なくとも
(1)前記金属張積層板の表面(A)の所定位置にレーザーを照射して、前記表面(A)の反対面の金属箔まで至るバイアホールを設ける工程と、
(2)前記表面(A)の反対側の表面(B)の所定位置にレーザーを照射して、前記表面(B)の反対面の金属箔まで至るバイアホールを設ける工程とを含む、製造方法。
本実施形態におけるプリント配線板は、絶縁性樹脂基材の両面に金属箔が積層された金属張積層板を用いてなる。プリント配線板は、金属張積層板の積層体であってもよい。
また、プリント配線板は、片面又は両面に、金属箔上に、樹脂シートを含む保護層が設けられてもよい。
本実施形態にかかる金属張積層板について説明する。金属張積層板は、絶縁性樹脂基材の両面に金属箔が積層されてなる。
絶縁性樹脂基材は、特に限定されないが、通常、熱硬化性樹脂と、無機充填材と、必要に応じて、ガラスクロスとを含む。絶縁性樹脂基材の厚みは、特に限定されないが、通常10~100μm、好ましくは基材の取り扱いやすさの点から、15~100μmである。本実施形態によれば、厚みが薄い絶縁性樹脂基材を用いても反りが発生せず、バイアホール底にあるスミア残分が問題とならず、所望の位置に精度よく多量のバイアホール及びスルーホールを設けることができる。
次に、本実施形態におけるプリント配線板の製造方法について、実施例を参照して説明する。
図1は本実施形態におけるプリント配線板の製造方法で用いる、バイアホール加工前の銅張積層板の断面図である。
工程(1)及び(2)によって得られたバイアホールのトップ径は、異なっていてもよく同じであってもよく、特に限定されない。本実施形態においては、120μm以下のトップ径を少なくとも1つ以上有することが好ましく、より好ましくはフィルドめっきのボイドの低減の点から、30~100μmである。バイアホールのトップ径が、全て30~100μmであることが、さらに好ましい。トップ径は、機械的強度に優れ、高密度化した実装基板を好適に得ることができることから、均一であることが好ましい。トップ径とは、各バイアホールにおいて最もレーザー照射側に位置する外径のことである。
工程(1)及び(2)によって得られたバイアホール間のピッチは、異なっていてもよく同じであってもよく、特に限定されない。本実施形態においては、60~400μm以下のピッチを少なくとも1つ以上有することが好ましく、より好ましくは信頼性の点から、100~400μmである。バイアホール間のピッチが、全て100~400μmであることが、さらに好ましい。ピッチは、各バイアホール又はスルーホールの表面の重心位置から、隣接するバイアホール又はスルーホールの表面の重心位置までの最短距離である。すなわち、バイアホール間のピッチは、隣接するバイアホール又はスルーホール間の距離であって、最短の距離である。
工程(1)及び(2)によって得られたバイアホール数の合計は、特に限定されないが、5,000,000穴/m2以上であることが好ましく、より好ましくは反りの低減が顕著であることから、10,000,000~40,000,000穴/m2である。上限は、特に限定されないが、40,000,000穴/m2を超えると、たとえ、真空吸着を行っても吸着不良を引き起こし、プリント配線板の反りが発生する傾向にあるため、好ましくない。本発明の製法によれば、プリント配線板の反りを発生せず、機械的強度に優れ、多量のバイアホールを有し、高密度化した実装基板を得ることができる。
バイアホールは、メカニカルドリル、紫外線レーザー(UVレーザー)及び炭酸ガスレーザー(CO2レーザー)などのレーザーを用いて加工でき、特に限定されない。本実施形態では、精度よく小径穴の加工を施すことができ、加工速度及びコストにも優れる点から、CO2レーザーを用いることが好ましい。
これらのデスミア処理方法からいずれの方法を選択するかは、絶縁性樹脂基材の種類、厚み、バイアホールの開口径、レーザー照射条件などの加工条件に応じて、残留が予想されるデスミア量を考慮して選ばれる。
本実施形態においては、CO2レーザーの波長、パルス幅、総エネルギー量及びショット数を適宜規定することによって、所望のバイアホールを好適に形成することができため、CO2レーザーを用いることが好ましい。特に、絶縁性樹脂基材(14)の厚みが、100μm以下である場合に適している。
CO2レーザーの波長は、9~11μmである。
絶縁性樹脂基材の厚みが100μm以下のバイアホールの加工方法においては、CO2レーザーのパルス幅は、特に限定されないが、100μ秒以下であることが好ましく、穴形状の観点から、1~15μ秒であることが好ましい。本実施形態におけるパルス幅とは、図8に示すとおり、単一のパルスレーザーについて、当該曲線の半値幅と定義する。パルス幅は時間の次元を有し、どの程度の時間だけ光を出すかを意味する時間的な幅である。
絶縁性樹脂基材の厚みが100μm以下のバイアホールの加工方法においては、バイアホール1個あたりのCO2レーザーの総エネルギー量は、特に限定されないが、0.1~20mJであることが好ましく、穴形状の観点から、0.5~15mJであることが好ましい。CO2レーザーの総エネルギー量が0.1mJより小さいと、好適なバイアホールが加工できず、スミア残渣を好適に除去できないため、好ましくない。CO2レーザーの総エネルギー量が20mJより大きいと、プリント配線板の反りが大きくなるため、好ましくない。特に、CO2レーザーの総エネルギー量が上記範囲にあることで、レーザー加工後のスミア残渣が少なくなることから、プリント配線板の反りが発生せず、デスミアを行う際にスミア残渣を容易に除去することができる。なお、詳細は後述の加工方法に記載するが、レーザーの総エネルギー量とは、一回のレーザー穴あけにおいて、プリント配線基板に投入される総エネルギー量に相当する。
絶縁性樹脂基材の厚みが100μm以下のバイアホールの加工方法においては、バイアホール1個あたりのCO2レーザーのショット数は、特に限定されないが、1~5回であることが好ましく、経済性及び加工時間の観点から、1~3回であることが好ましい。ショット数については、後述の加工方法に記載する。
バイアホールの加工方法としては、トレパニング又はパンチングが挙げられる。
トレパニングにおいて、一周あたりのショット数とは、トレパニングによる単一の穴の加工において、一周のスキャンの間にプリント配線板に単一のパルスレーザーが照射される回数である。
トレパニングにおいて、周回数とは、トレパニングによる単一の穴の加工において、穴の輪郭に沿ってスキャンする周回数である。
パンチングにおいて、ショット数とは、パンチングによる単一の穴の加工において、プリント配線板に照射されるパルスレーザーの回数である。
総エネルギー量=パルスエネルギー×周回数×一周あたりのショット数
総エネルギー量=パルスエネルギー×ショット数
本実施形態において、パルス周波数とは、単一のパルスレーザーが単位時間あたりに発せられる回数である。
本実施形態において、バイアホールにめっき充填して両面を電気的に接続するには、まず、バイアホール内壁に通常の無電解めっき処理によって無電解めっき膜を形成した後、めっき液を噴流にして基板にぶつけるスパージャめっき方法等の電解めっき方法によって、バイアホール内をめっき充填することが望ましい。
上記無電解めっき又は電解めっきとしては、例えば、銅、すず、銀、各種はんだ、銅/すず、銅/銀等の金属めっきが好ましく、無電解銅めっき又は電解銅めっきがより好ましい。
図1に示すように、両面銅張積層板10(三菱ガス化学製CCL(登録商標)-HL832NSF type LC-E 0.06mmt D/D)を出発材料として用いた。前記絶縁性樹脂基材14の厚みは60μm、銅箔13、15の厚みはそれぞれ5μmであった。
パルス幅:6μs、バイアホール1個あたりのレーザーの総エネルギー数:5.1mJ、バイアホール1個あたりのレーザーのショット数:1回にて行った。
1個あたりのバイアホールのトップ径は、75μmであった。また、バイアホール間のピッチは、全て150~200μmであった。514mm×409mmの両面銅張積層板にピッチ150~200μmで、バイアホール11が8,918,972穴/m2、バイアホール12が8,918,972穴/m2、合計17,837,944穴/m2のバイアホールを形成した。
実施例のレーザー加工時、加工面を分けず、片面のみから3,750,000穴/m2のバイアホール11を形成した(図6参照)。
11:一方の面から加工するバイアホール
12:他方の面(銅箔11と反対の面)から加工するバイアホール
13:銅箔
14:絶縁性樹脂基材
15:銅箔
Claims (12)
- 絶縁性樹脂基材の両面に金属箔が積層された金属張積層板を用いた、プリント配線板の製造方法であり、
該製造方法が、少なくとも
(1)前記金属張積層板の表面(A)の所定位置にレーザーを照射して、前記表面(A)の反対面の金属箔まで至るバイアホールを設ける工程と、
(2)前記表面(A)の反対側の表面(B)の所定位置にレーザーを照射して、前記表面(B)の反対面の金属箔まで至るバイアホールを設ける工程とを含む、製造方法。 - 前記工程(1)及び(2)が、同時又は逐次的に行う、請求項1に記載のプリント配線板の製造方法。
- 前記金属が銅である、請求項1又は2に記載のプリント配線板の製造方法。
- 前記工程(1)及び(2)よって得られた前記バイアホールの少なくとも1つのトップ径が120μm以下である、請求項1~3のいずれか一項に記載のプリント配線板の製造方法。
- 前記工程(1)及び(2)によって得られた前記バイアホール間の少なくとも1つのピッチが、60~400μmである、請求項1~4のいずれか一項に記載のプリント配線板の製造方法。
- 前記レーザーが炭酸ガスレーザーである、請求項1~5のいずれか一項に記載のプリント配線板の製造方法。
- 前記レーザーのパルス幅が100μ秒以下である、請求項6に記載のプリント配線板の製造方法。
- 前記バイアホール1個あたりの前記レーザーの総エネルギー量が、0.1~20mJである、請求項6又は7に記載のプリント配線板の製造方法。
- 前記バイアホール1個あたりの前記レーザーのショット数が、1~5回である、請求項6~8のいずれか一項に記載のプリント配線板の製造方法。
- 前記絶縁性樹脂基材の厚みが、10~100μmである、請求項1~9のいずれか一項に記載のプリント配線板の製造方法。
- 前記金属箔の厚みが、両面共に、1~18μmである、請求項1~10のいずれか一項に記載のプリント配線板の製造方法。
- 前記工程(1)及び(2)よって得られた前記バイアホール数の合計が、5,000,000穴/m2以上である、請求項1~11のいずれか一項に記載のプリント配線板の製造方法。
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