WO2018179703A1 - マスク、マスクキット、製膜方法および製膜装置 - Google Patents

マスク、マスクキット、製膜方法および製膜装置 Download PDF

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Publication number
WO2018179703A1
WO2018179703A1 PCT/JP2018/001468 JP2018001468W WO2018179703A1 WO 2018179703 A1 WO2018179703 A1 WO 2018179703A1 JP 2018001468 W JP2018001468 W JP 2018001468W WO 2018179703 A1 WO2018179703 A1 WO 2018179703A1
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WO
WIPO (PCT)
Prior art keywords
mask
substrate
base material
film
opening
Prior art date
Application number
PCT/JP2018/001468
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
祐司 ▲高▼橋
Original Assignee
株式会社カネカ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社カネカ filed Critical 株式会社カネカ
Priority to JP2019508604A priority Critical patent/JP6781336B2/ja
Priority to CN201880008517.1A priority patent/CN110225994B/zh
Publication of WO2018179703A1 publication Critical patent/WO2018179703A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
    • B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
    • B32B3/30—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by a layer formed with recesses or projections, e.g. hollows, grooves, protuberances, ribs
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding

Definitions

  • the present invention relates to a pattern forming mask and a mask kit. Furthermore, the present invention relates to a film forming method and a film forming apparatus using a mask.
  • a conductive film for a touch panel, a substrate for a display device, and the like are provided with a plurality of thin films on the substrate, and the thin films are patterned in different shapes.
  • a method for forming a patterning layer on a substrate a method of patterning by photolithography after forming a thin film is generally used.
  • patterning by photolithography is excellent in pattern accuracy, it requires a large number of processes, and productivity and yield are low, which causes an increase in manufacturing cost.
  • the layer provided under the thin film to be etched is damaged by the etching solution when the thin film is removed by etching. You may receive it.
  • Patent Document 1 discloses a method of forming a patterning layer by vacuum film formation using a mask in which an opening is formed by punching a sheet having an adhesive layer on one surface in a predetermined pattern. . Since such a flexible mask can be applied to vacuum film formation by roll-to-roll, it can be expected to reduce the cost of forming a patterned thin film.
  • Patent Document 1 As described in Patent Document 1, if a mask is attached to a substrate via an adhesive layer, positional displacement between the substrate and the mask does not occur, and therefore, an improvement in patterning accuracy is expected.
  • the mask disclosed in Patent Document 1 is attached to the substrate and a thin film is formed by sputtering or the like, the mask is peeled off from the substrate, and deposited on the substrate in the vicinity of the inner periphery of the mask opening. In some cases, the thin film peels off and is removed from the substrate together with the mask.
  • the substrate was peeled off.
  • an object of the present invention is to provide a flexible mask capable of suppressing problems such as peeling of a thin film when the mask is removed from a substrate.
  • the mask of the present invention includes a flexible mask base material provided with an opening corresponding to the pattern shape of a thin film formed on a deposition substrate.
  • the 1st main surface which is an opposing surface with a film-forming board
  • an outer peripheral non-adhesive region that does not have adhesiveness to the film-formed substrate is provided along the outer peripheral edge of the opening.
  • the release film may be detachably pasted on the first main surface of the mask base material.
  • the support base material may be detachably pasted on the second main surface of the mask base material.
  • the mask may be formed by providing an opening in the mask base material on the deposition substrate.
  • the mask kit includes a mask substrate and a support substrate.
  • the 1st main surface which is an opposing surface with a film forming substrate has adhesiveness with respect to a film forming substrate.
  • the support base material is detachably attached to the second main surface side of the mask base material.
  • the mask base material is provided with a cutting line in the entire thickness direction along the outer peripheral edge of the opening forming portion corresponding to the pattern shape of the thin film formed on the deposition substrate.
  • the first opening forming portion does not have adhesiveness to the film formation substrate.
  • the mask kit may include a plurality of mask base materials. By providing a cutting line on each of the plurality of mask base materials, a plurality of thin films having different pattern shapes can be formed using one mask kit.
  • An improvement in pattern accuracy can be expected by forming a thin film using the mask or mask kit of the present invention. Further, by using the mask or mask kit of the present invention, a thin film having various pattern shapes can be formed on the substrate by a roll-to-roll process, so that improvement in productivity can be expected.
  • FIG. 2 is a cross-sectional view taken along line AA in FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG. It is a figure showing the usage pattern of the mask of FIG.
  • FIG. 2 is a cross-sectional view taken along line AA in FIG. It is sectional drawing of the mask kit of one Embodiment. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG.
  • FIG. It is a figure showing the usage condition of the mask kit of FIG. It is sectional drawing of the mask kit of one Embodiment. It is a top view of the mask kit of one Embodiment. It is sectional drawing in the AA of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a figure showing the usage condition of the mask kit of FIG. It is a block diagram of the film forming apparatus of one Embodiment.
  • FIG. 1 is a plan view of a mask according to an embodiment of the present invention.
  • a mask 100 shown in FIG. 1 is a long mask provided with a plurality of openings along the x direction.
  • a non-adhesive region 71 is provided along the outer peripheral edge of the opening 11.
  • FIG. 2 is a cross-sectional view taken along line AA of the mask 100 of FIG. 1, and the lower side of FIG. 2 is a surface facing the film formation substrate.
  • FIG. 4 is also a cross-sectional view taken along line AA in FIG. 1, and shows a mask 104 having a different form from that in FIG. 3A to 3E are conceptual diagrams showing a process of forming a patterned thin film 111 on the deposition target substrate 1 using the mask 100 of FIG.
  • the 1st main surface which is a surface facing the film forming substrate 1 has adhesiveness with respect to the film forming substrate.
  • the mask base material 30 shown in FIG. 2 has adhesiveness with a board
  • FIG. A release film 39 is detachably pasted on the first main surface of the mask base material 30, and a support base material 50 is detachably pasted on the second main surface of the mask base material 30. Has been.
  • the mask substrate 30 is provided with an opening 11.
  • the shape of the opening 11 corresponds to the pattern shape of the thin film 111 formed on the substrate.
  • a rectangular opening 11 is provided, but the shape of the opening is not particularly limited.
  • the opening 11 is provided, for example, by cutting a planar mask base material such as a film and removing a region corresponding to the opening.
  • the adhesive layer 32 is not provided on the outer peripheral non-adhesion region 71 along the outer peripheral edge of the opening 11 on the first main surface of the mask base 30. Therefore, as shown in FIG. 3C, when the mask base material 30 is stuck on the substrate 1, the outer peripheral non-adhesion region 71 does not have adhesiveness to the substrate 1.
  • the material will not be specifically limited, A metal foil, a resin film, etc. are used.
  • a flexible resin film is preferable because the material is inexpensive, excellent in workability, and can reduce scratches upon contact with the film formation substrate.
  • the resin material for the flexible resin film include polyolefins such as polyethylene and polypropylene, and polyesters such as polyethylene terephthalate.
  • the base film 31 is preferably a biaxially stretched film.
  • a high heat resistant material such as polyimide may be used as the resin material for the flexible film.
  • the mask substrate 30 may be transparent or opaque.
  • the thickness of the mask base material 30 is not particularly limited. From the viewpoint of achieving both self-supporting properties and flexibility, the thickness of the mask base material 30 is preferably about 10 to 100 ⁇ m. When the thin film 111 is formed on the deposition target substrate 1 by the roll-to-roll method, the thickness of the mask base material 30 is preferably smaller than the thickness of the substrate 1.
  • the adhesive layer 32 only needs to be able to be attached to the substrate 1 and can be peeled off from the substrate 1 after the thin film is formed, and can be composed of an adhesive used for a general adhesive tape or the like.
  • a self-adhesive film obtained by integrally molding a resin material for the base film 31 and a resin material for the adhesive layer 32 by multilayer extrusion may be used. If a film in which the base film 31 and the adhesive layer 32 are integrally molded is used as the mask base material 30, when the mask base material is peeled off from the substrate 1, adhesive residue on the substrate 1 hardly occurs, and the quality of the substrate with a thin film Can be improved.
  • the adhesive layer 32 a material whose adhesive strength is reduced by heating, UV irradiation, or the like may be used.
  • the substrate 1 and the mask base material 30 are firmly bonded to each other, and the adhesive strength is lowered after the thin film is formed, so that the mask base material 30 is removed from the surface of the substrate 1. Easy to peel off.
  • a method of pasting a pre-patterned adhesive sheet on the base film 31, no adhesive layer is provided on the region 71 on the base film 31.
  • Examples include a method of applying (printing) the material of the adhesive layer, a method of removing the adhesive layer on the region 71 after providing the adhesive layer on the entire surface of the base film 31, and the like. After a material whose adhesive strength is reduced by heating, UV irradiation, or the like is provided on the entire surface of the base film 31 as the adhesive layer 32, the adhesive force of the adhesive layer on the region 71 may be reduced to make a non-adhesive region. .
  • a covering member 35 may be provided on the adhesive layer 32 in the region 71 so that the adhesive layer 32 in the region 71 does not adhere to the substrate 1.
  • the support base material is not provided on the second main surface of the mask base material 30, but the form shown in FIG. Similarly, the support base material 50 may be stuck on the second main surface of the mask base material.
  • the base film 31 and the adhesive layer 32 are integrally molded as the mask base material 30
  • the method of attaching the covering member 35 to the predetermined region 71 of the self-adhesive film in which the adhesive layer is integrally formed on the surface of the base film does not require the formation of the adhesive layer on the base material or the patterning operation of the adhesive layer. Therefore, the material is inexpensive and the mask formation process can be simplified.
  • the covering member 35 is such that the first main surface can be bonded to the adhesive layer 32 of the mask base material 30 and the second main surface, which is the opposite surface of the first main surface, does not adhere to the film-forming substrate 1. That's fine.
  • a self-adhesive film having an adhesive layer on one side may be disposed and adhered so that the adhesive surface faces the mask substrate 30.
  • the adhesive layer 32 before being attached to the substrate 1 can be protected.
  • the support base material 50 on the second main surface of the mask base material 30 the surface of the mask base material 30 can be protected.
  • the support base material 50 on the second main surface of the mask base material 30 even when the area of the opening 11 of the mask base material 30 is large, the self-supporting property of the mask can be maintained. Can be carried out stably.
  • the shape of the opening 11 is stabilized by providing the support base material 50, the pattern accuracy of the thin film 111 formed on the substrate 1 can be improved.
  • the release film 39 and the support substrate 50 are not particularly limited as long as they are flexible.
  • the release film 39 may be subjected to a release treatment on the second main surface that is the surface facing the mask substrate 30. By releasing the surface of the release film 39, the release from the mask base material 30 becomes easy.
  • the support base material 50 is preferably provided with an adhesive layer 52 on the second main surface that is the surface facing the mask base material 30. By providing the adhesive layer 52 on the surface of the support base material 50, the relative position with respect to the mask base material 30 can be easily fixed, and the shape of the opening can be kept constant even when the area of the opening 11 is large.
  • the support substrate 50 the same film material as that of the mask substrate 30 may be used.
  • FIGS. 3A to 3E are conceptual diagrams showing a process of forming a patterned thin film 111 on the deposition target substrate 1 using the mask 100 of FIG.
  • the film formation substrate 1 may be a rigid substrate or a flexible substrate.
  • a flexible substrate is preferable because continuous film formation by a roll-to-roll method is possible.
  • Another thin film may be provided in advance on the surface of the substrate 1 to be deposited.
  • the release film 39 When the release film 39 is provided on the first main surface of the mask base material 30, the release film is first peeled to expose the adhesive layer 32 of the mask base material 30 (FIG. 3A). At this time, if the support base material 50 is provided on the second main surface of the mask base material 30, the self-supporting property of the mask is maintained even after the release film 39 is peeled off. Can be
  • the 1st main surface of the mask base material 30 is stuck on the to-be-film-formed board
  • the position of the mask base material 30 on the substrate 1 is fixed by the adhesive layer 32 provided on the first main surface of the mask base material 30. Therefore, the relative position between the substrate 1 and the mask base material 30 can be kept constant even when film formation is performed while moving the substrate as in the roll-to-roll process.
  • the non-adhesive region 71 at the outer peripheral edge of the opening 11 of the mask the mask base material and the substrate are in contact with each other, but they are not joined.
  • the support base material 50 is provided on the second main surface of the mask base material 30, even if the adhesive layer 52 of the support base material 50 and the substrate 1 are adhered in the region where the opening 11 is provided. Good.
  • the substrate 1 is exposed under the opening 11 by peeling and removing the supporting base material 50 stuck on the second main surface (FIG. 3C).
  • the adhesive force between the substrate 1 and the adhesive layer 32 of the mask base material 30 is determined by the mask base. It is preferable that the adhesive strength between the second main surface of the material 30 and the adhesive layer 52 of the supporting base material 50 is larger.
  • the adhesive force between the substrate 1 and the adhesive layer 32 may be relatively increased by using a material having a higher adhesive force than the adhesive layer 52 of the support base material 50 as the adhesive layer 32 of the mask base material 30.
  • the adhesive strength of the pressure-sensitive adhesive layer 32 may be improved by making the thickness of the pressure-sensitive adhesive layer 32 of the mask base material 30 larger than the thickness of the pressure-sensitive adhesive layer 52 of the support base material 50.
  • the adhesive force of the adhesive layer 32 of the mask base material 30 and the adhesive force of the adhesive layer 52 of the support base material 50 may be equal.
  • the adhesive force between the second main surface of the mask base material 30 and the pressure-sensitive adhesive layer 52 may be relatively reduced by releasing the second main surface of the mask base material 30.
  • a thin film 111 is deposited on the substrate 1 exposed under the opening 11 (FIG. 3D).
  • the mask region 70 since a thin film is deposited on the mask base material 30, no thin film is deposited on the substrate 1.
  • a thin film may also be deposited on the opening wall surface of the mask substrate 30.
  • the mask is peeled off from the substrate 1 to obtain a substrate 301 with a thin film in which a patterned thin film 111 is provided in a predetermined region on the substrate 1 (region corresponding to the opening 11 of the mask). (FIG. 3E).
  • a non-adhesion region 71 along the outer peripheral edge of the opening 11 of the mask since the mask and the substrate 1 are in contact with each other, no thin film is formed on the substrate 1.
  • the non-adhesive region 71 since the substrate 1 and the mask are not joined, a large force is applied to the outer periphery of the opening 11 of the mask base material 30 or in the vicinity thereof when the mask is peeled off from the substrate 1.
  • non-uniform force applied to the peeling interface can be suppressed. Therefore, when the mask is peeled and removed, the thin film 111 is cut along the wall surface of the opening, and the film remaining on the substrate due to peeling of the thin film deposited on the substrate or peeling of the film deposited on the mask region is removed. It is hard to occur. Thus, by providing a non-adhesion region along the outer peripheral edge of the opening 11 of the mask, film peeling and film residue when the mask is peeled and removed from the substrate 1 can be prevented, so that the pattern accuracy is improved.
  • the adhesion layer 32 prevents the thin film provided on the surface of the substrate 1 from being peeled off. it can.
  • the thin film provided in advance on the surface of the substrate 1 is in a pattern shape, if the region where the thin film is provided in advance is a non-adhesive region, peeling of the thin film by the adhesive layer can be prevented more reliably.
  • FIGS. 3A to 3E show an example in which a thin film is formed by sticking a mask base material 30 provided with an opening 11 in advance on the substrate 1 to be formed.
  • the mask may be formed by providing the opening 11 in the mask base material 30.
  • FIG. 5 is a cross-sectional view of one embodiment of a mask kit for forming a mask by providing an opening corresponding to the pattern shape of a thin film after being stuck on a film formation substrate.
  • the release film 39 is detachably pasted on the first main surface of the mask base material 530 in the same manner as the mask 100 shown in FIG. 2.
  • the support substrate 50 is detachably pasted on the main surface.
  • the mask base material 530 is not provided with an opening, but a cutting line 311 is provided along the outer periphery of the opening forming portion 511 corresponding to the pattern shape of the thin film 111 formed on the substrate 1 instead. It differs from the mask 100 shown in FIG.
  • the cutting line 311 is provided over the entire thickness direction of the mask base material 530 so as to surround the opening forming portion 511. Therefore, in the mask base material 530, the opening forming portion 511 (region surrounded by the cutting line 311) and the mask region 70 outside the opening forming portion 511 can be separated.
  • the mask base material 530 since the support base material 50 is stuck on the mask base material 530, the mask base material 530 includes an opening forming portion surrounded by the cutting line 311 and a region outside the cutting line 311. Integrity is maintained.
  • the method of providing the cutting line 311 on the mask base material 530 is not particularly limited.
  • the mask base material 530 and the support base material 50 are laminated from the mask base material 530 side by a cutting blade, a laser cutter, or the like.
  • the body may be half cut to form a cutting line.
  • a cutting line may be formed on the first main surface side of the supporting base material 50 (a masking surface of the mask base material), but the cutting line must be formed in the entire thickness direction of the supporting base material 50. There is no particular problem.
  • the support base material on the mask base material 530 may be replaced with another base material.
  • An adhesive layer 32 is provided on the first main surface of the mask base material 530 and is configured to be capable of being attached to the substrate 1.
  • the entire opening forming portion 511 of the mask base material 530 is not provided with an adhesive layer, and is a non-adhesive region with respect to the substrate 1. As shown in FIG. 5, the region 71 along the outer peripheral edge of the opening forming portion 511 may also be a non-bonded region with respect to the substrate 1.
  • the support base material 50 is peeled off from the mask base material 530 and the mask base material 535 of the opening forming portion 511 is removed to form the opening 11.
  • the base film 31 and the adhesive layer 32 of the mask base material 530 are the same as the base film 31 and 32 of the mask 100, these details are also omitted.
  • the release film 39 is provided on the first main surface of the mask base material 530, the release film is first peeled to expose the adhesive layer 32 of the mask base material 530 (FIG. 6A). Then, the 1st main surface of the mask base material 530 is stuck on the to-be-film-formed board
  • the opening forming portion 511 (and the region 71 along the outer periphery thereof) is a non-adhesive region, and the mask base material 530 and the substrate 1 are in contact with each other, but they are not joined.
  • the support base material 50 attached to the second main surface of the mask base material 530 is peeled and removed (FIG. 6C). Similar to the embodiment shown in FIG. 3C, the adhesive layer 32 between the substrate 1 and the mask base material 530 can be easily peeled off while maintaining the state where the mask base material 530 is stuck on the substrate 1. Is preferably larger than the adhesive force between the second main surface of the mask base material 530 and the adhesive layer 52 of the support base material 50.
  • the opening forming portion 511 (region surrounded by the cutting line 311) is a non-adhesive region with respect to the substrate 1.
  • the entire surface of the second main surface of the mask base material 530 is adhered to the support base material 50 by the adhesive layer 52. Therefore, in the opening forming portion 511, the adhesive force between the first main surface of the mask base material 530 and the substrate 1 is substantially zero, and the second main surface of the mask base material 530 and the adhesive layer of the support base material 50 Smaller than the adhesive strength with 52.
  • the mask base material 530 is attached onto the substrate 1 in the mask region 70.
  • the supporting base material 50 is peeled from the mask base material 530 while maintaining the worn state. Even when the first main surface of the mask base material 530 and the substrate 1 are not joined in the region 71 along the outer peripheral edge of the opening forming portion 511, the mask base material 530 and the substrate 1 are joined in the outer peripheral region. Therefore, the mask base material 530 in the region 71 remains on the substrate 1.
  • the mask base material 535 of the opening forming portion 511 is separated from the adhesion region 536 of the mask base material 530 by the cutting line, it is removed from the substrate 1 together with the support base material 50. Therefore, as shown in FIG. 6C, the region on the substrate 1 where the mask base material 530 is not provided is the opening 11.
  • a thin film is formed and the mask is peeled off from the substrate 1 in the same manner as in FIGS. 3D and 3E.
  • a substrate with a thin film in which a thin film on a pattern is provided in a region corresponding to the opening forming portion is obtained.
  • the region 71 along the outer peripheral edge of the mask opening 11 is a non-adhesive region, it is possible to prevent film peeling and film residue when the mask is peeled off from the substrate 1 and to improve pattern accuracy.
  • the method of setting the opening forming portion 511 and the region 71 along the outer peripheral edge thereof as a non-adhesive region is not limited to the method in which the mask base material 530 is not provided with an adhesive layer.
  • the adhesive layer 32 After a material whose adhesive strength is reduced by heating, UV irradiation, or the like is provided as the adhesive layer 32 on the entire surface of the base film 31, the adhesive strength of the adhesive layer in the opening forming portion 511 and the region 71 along the outer peripheral edge thereof. It is good also as a non-adhesion area
  • the covering member 7 may be provided by attaching a covering member 735 to the opening forming portion 711 as in the mask kit 107 shown in FIG.
  • the covering member 735 is preferably provided also in the region 71 along the outer peripheral edge of the opening forming portion.
  • the covering member 735 is provided with cutting lines 371 in the entire thickness direction along the outer peripheral edge of the opening forming portion, similarly to the mask base material 530.
  • the support substrate 50 is peeled and removed from the second main surface of the mask substrate 530 by providing the cutting line 371 on the covering member 35, the mask base attached to the support substrate 50 is used in the opening forming portion 711. Since the covering member 735 adhered to the material 530 and the mask base material is removed, the opening 11 is formed and the substrate 1 is exposed.
  • a patterned thin film can be formed on the substrate. Attaching a mask on a substrate (or forming a mask on a substrate using a mask kit) using a plurality of masks having different opening shapes, forming a thin film on a substrate exposed under the opening, and on the substrate By repeatedly removing the mask from the substrate, a multilayer film including a plurality of thin films having different pattern shapes can be formed on the substrate. By providing a non-adhesion region along the outer peripheral edge of the opening of the mask, even when a multilayer film is formed, peeling of the previously formed thin film from the substrate can be suppressed when peeling the mask from the substrate.
  • FIG. 8 is a plan view of the multilayer patterning mask kit.
  • FIG. 9 is a cross-sectional view taken along line AA of the mask kit 108 of FIG.
  • the mask kit 108 has a second opening forming portion 812 on the inner periphery of the first opening forming portion 811. That is, the second opening forming portion 812 is a region provided inside the first opening forming portion 811.
  • the mask kit 108 shown in the cross-sectional view of FIG. 9 has a release film 39 detachably pasted on the first main surface of the mask base material 830 in the same manner as the mask kit 105 shown in FIG.
  • the support base material 50 is attached to the second main surface side of 830 so as to be peelable.
  • the mask kit 108 is shown in FIG. 5 in that a second mask base material 840 provided with a second cutting line 412 is disposed between the first mask base material 830 and the support base material 50. It is different from 105.
  • a first cutting line 311 is formed on the first mask base material 830 so as to surround the first opening forming portion 811. Further, a second cutting line 312 is formed so as to surround the second opening forming portion 812 located inside the first opening forming portion 811. Both the first cutting line 311 and the second cutting line 312 are provided over the entire thickness direction of the first mask base material 830. Therefore, the mask base material 830 includes the second opening forming portion 812 (region surrounded by the second cutting line 312), the first opening forming portion 811 and the region 75 outside the second opening forming portion 812 (first none). A region between the disconnection line 311 and the second cutting line 312) and a region 70 outside the first opening forming portion 811 can be separated.
  • a second cutting line 412 is formed on the second mask base 840 so as to surround the second opening forming portion 812.
  • the second cutting line 412 is provided over the entire thickness direction of the second mask substrate 840.
  • the second cutting line 312 of the first mask base material 830 and the second cutting line 412 of the second mask base material 840 are provided at the same position when the mask kit 108 is viewed in plan. That is, the cutting line 312 and the cutting line 412 are provided so as to extend on the same straight line.
  • the second mask base material 840 it is preferable to use a flexible film in which the adhesive layer 42 is provided on the first main surface of the base film 41, similarly to the support base material 50 and the first mask base material 830.
  • the second mask substrate 840 is preferably provided with the adhesive layer 42 on the entire first main surface.
  • the adhesive force between the second main surface of the first mask base material 830 and the adhesive layer 42 of the second mask base material 840 is such that the second main surface of the second mask base material 840 and the adhesive layer 52 of the support base material 50 It is preferable that it is larger than the adhesive force.
  • the adhesive force between the substrate 1 and the adhesive layer 32 of the first mask base material 830 is greater than the adhesive force between the second main surface of the first mask base material 830 and the adhesive layer 42 of the second mask base material 840.
  • By adjusting the adhesive strength of each layer so that the adhesive force decreases in order from the substrate 1 side toward the support base material 50 side, as shown in FIGS. It becomes easy to form thin films having different pattern shapes while peeling the material 840 and the first mask base material 830 in order.
  • the method for providing the cutting lines on the mask base materials 830 and 840 is not particularly limited. For example, in a state where a laminate of the second mask base material 840 and the first mask base material 830 is stuck on the first main surface of the support base material 50, half-cut is performed from the mask base material 830 side, and the mask base A first cutting line may be formed on the material 830. At this time, the first cutting line may be formed also on the first main surface side of the second mask base material 840, but the first cutting line must be formed in the entire thickness direction of the second mask base material 840. There is no particular problem.
  • the second cutting lines 312 and 412 can also be formed by half cutting.
  • the second cutting lines 312 and 412 extending on the same straight line can be formed.
  • the second cutting line may be formed also on the first main surface side of the support base material 50, but if the first cutting line is not formed in the entire thickness direction of the support base material 50, there is a special problem. There is no.
  • the supporting base material attached to the second mask base material 540 may be replaced with another base material.
  • An adhesive layer 32 is provided on the first main surface of the first mask base material 830, and is configured to be able to be stuck to the substrate 1.
  • the entirety of the first opening forming portion 811 of the first mask base material 830 is a non-bonded region with respect to the substrate 1.
  • the region 71 along the outer peripheral edge of the first opening forming portion 811 may also be a non-bonded region with respect to the substrate 1.
  • a non-adhesive region is formed by not providing the adhesive layer 32 on the first opening forming portion 811 and the region 17 on the first main surface of the first mask base material 830, but the formation method of the non-adhesive region is particularly limited. Not.
  • the first opening forming portion may be a non-adhesive region.
  • the covering member is also provided in the region 71, as in the embodiment shown in FIG. 7, the covering member is provided with a cutting line in the entire thickness direction along the outer peripheral edge of the first opening forming portion. It is preferable.
  • the support base 50 is peeled off from the second mask base 540 to form the opening 12, and the first mask base 530
  • the release film 39 is provided on the first main surface of the first mask base material 830, the release film is first peeled to expose the adhesive layer 32 of the mask base material 830 (FIG. 10A). Then, the 1st main surface of the 1st mask base material 830 is stuck on the to-be-film-formed board
  • the first opening forming portion 811, the second opening forming portion 812 inside the first opening forming portion 811, and the region 71 along the outer periphery of the first opening forming portion 811 are non-adhesive regions, and the first mask base material 830 and the substrate 1 are not joined.
  • the support base material 50 pasted on the second main surface of the second mask base material 840 is peeled off at the interface between the second mask base material 840 and the adhesive layer 52, the outer sides of the second cutting lines 312 and 412 (first At the outer side of the two opening forming portion 812), the supporting base material 50 is peeled while maintaining the state where the first mask base material 830 and the second mask base material 840 are stuck on the substrate 1.
  • the second mask base material 840 is stuck to the support base material 50 via the adhesive layer 52, and the first mask base material is attached to the second mask base material 840 via the adhesive layer 42.
  • 830 is attached, the first mask base material 830 and the substrate 1 are not joined. Therefore, as shown in FIG.
  • the second mask base material 844 in the region inside the second cutting line 412 and the first mask base material 834 in the region inside the second cutting line 312 are substrates together with the support base material 50. 1 is removed from above. Therefore, a region on the substrate 1 where the mask base materials 830 and 840 are not provided becomes the second opening 12.
  • the second mask base 840 attached to the second main surface of the first mask base 830 is peeled off at the interface between the first mask base 830 and the adhesive layer 42.
  • the second mask base material 840 is maintained while the state where the first mask base material 830 is stuck on the substrate 1. It is peeled off.
  • the first mask base attached to the second mask base material 840 as shown in FIG. 10E.
  • the material 835 is removed from the substrate 1 together with the second mask base material 840. As a result, the substrate 1 in the region 75 is exposed and the first opening 11 is provided.
  • the mask is peeled off from the substrate 1 to provide a patterned second thin film 112 in a region corresponding to the second opening forming portion 812 of the mask kit.
  • a substrate 801 with a multilayer patterning thin film in which a patterned first thin film 111 is provided in a region corresponding to the first opening forming portion 811 of the mask kit so as to cover is obtained (FIG. 10G).
  • mask openings having different shapes can be formed with one kit. For this reason, alignment at the time of forming a plurality of layers having different pattern shapes is not required, so that manufacturing efficiency can be improved and alignment accuracy can be improved.
  • FIGS. 10A to G show a mode in which two types of openings 12 and 11 having different shapes are sequentially provided on the support base material 50 using a mask kit in which two layers of mask base materials 840 and 830 are stacked. It was. By using a mask kit in which three or more mask base materials are laminated, three or more types of openings having different shapes can be provided in order.
  • the mask and mask kit of the present invention are used for forming thin films having various pattern shapes.
  • the material of the thin film is not particularly limited, and examples thereof include organic materials, inorganic materials, and metal materials.
  • the thin film may be conductive or insulating, and may be a semiconductor.
  • the method for forming the thin film is not particularly limited as long as it is a dry process, and PVD methods such as vacuum deposition, sputtering, and ion plating, and various CVD methods can be applied.
  • a multilayer thin film may be formed by combining a plurality of film forming methods. Since the mask and mask kit of the present invention use a flexible substrate, they can be applied to a roll-to-roll process.
  • the mask When forming a thin film patterned by the roll-to-roll process using the mask of the present invention, first, the mask is continuously formed on the substrate by the roll-to-roll process while the substrate and the mask are respectively run. Adhere. A thin film is formed by a film-forming apparatus by roll-to-roll while running a laminate of a substrate and a mask. Thereafter, the mask is peeled from the substrate while the laminate of the substrate and the mask is run, and the substrate is wound to obtain a wound body of the substrate on which a patterned thin film is formed.
  • the laminate of the substrate and the mask may be temporarily wound into a roll before film formation. Further, after the thin film is formed on the laminate of the substrate and the mask, the laminate may be temporarily wound into a roll before peeling the mask from the substrate. On the pass line of the film forming apparatus, the attachment between the substrate and the mask, the film formation, and the peeling of the mask from the substrate may be performed continuously.
  • the substrate and the mask kit are run on the substrate continuously by the roll-to-roll process. Apply the mask kit. While the laminate is running, the support base material 50 is peeled off to expose the substrate 1 under the opening. Thereafter, as in the case of using the mask, the film is formed by roll-to-roll and the mask is peeled off to obtain a wound body of the substrate on which the thin film on the pattern is formed. Between each of these steps, the laminate may be temporarily wound up, or each step may be performed continuously.
  • a mask kit including a plurality of mask base materials having different shapes of opening formation portions as shown in FIG. 9, after forming the thin film, the mask base material is peeled off to form openings having different shapes, and then another thin film is formed.
  • a multilayer film including a plurality of thin films having different pattern shapes may be formed.
  • the substrate is unwound by peeling the mask substrate with a pass line between one film forming source and another film forming source.
  • a plurality of thin films having different pattern shapes can be formed by a single pass from winding to winding.
  • FIG. 11 shows an example of a film forming apparatus for forming a plurality of thin films having different pattern shapes in one pass.
  • this film forming apparatus 200 film forming rolls 292 and 291 are provided in two film forming chambers 282 and 281 respectively, and sputtering targets 212 and 211 as film forming sources are arranged facing the film forming rolls 292 and 291.
  • the substrate 1 is unwound from the unwinding roll 201 and conveyed to the film forming chamber 282, and the second thin film 112 is formed on the substrate on the film forming roll 292.
  • the substrate on which the second thin film is formed is transferred to the film forming chamber 282, and the first thin film 111 is formed on the substrate on the film forming roll 291.
  • the pass line between the film forming roll 292 where the second thin film 112 is formed and the film forming roll 291 where the first thin film 111 is formed is provided with a peeling roll 224 composed of a pair of nip rolls.
  • the second mask base material 840 is peeled from the surface of the substrate.
  • the second mask base material 840 peeled from the substrate surface is taken up and collected by the take-up roll 204.
  • a peeling means is provided between the two film forming portions, and by peeling the mask base material from the substrate inline, the substrate is unwound from the unwinding roll 201, and the winding roll 209
  • the second thin film 812 and the first thin film 811 having different pattern shapes can be formed on the substrate 1 until winding.
  • three or more types of thin films having different shapes can be formed in one pass by providing a peeling means between the film forming parts.
  • the film forming apparatus can have the same configuration as a normal film forming apparatus except that a peeling means is provided between a plurality of film forming units.
  • a nip roll 225 is provided as a peeling means for peeling the support base material 50 from a mask kit provided on the base material, and the support base material 50 after peeling is a take-up roll 205. It is designed to be rolled up and collected.
  • the substrate with the mask kit attached on the substrate 1 can be set in the film forming apparatus, and the mask opening can be formed on the substrate 1 in-line. The cleanliness of the substrate surface can be maintained and the production efficiency can be improved.
  • a peeling roll 229 including a pair of nip rolls is provided between the film forming roll 292 and the winding roll 209 for winding the substrate 801 with the multilayer patterning thin film.
  • the first mask base material 830 is configured to be peeled inline.
  • affixing means for adhering the substrate 1 and the mask kit for example, a bonding roll made of a nip roll
  • a peeling means for peeling and removing the release film 39 from the surface of the mask kit 108. Etc. may be provided.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)
PCT/JP2018/001468 2017-03-29 2018-01-18 マスク、マスクキット、製膜方法および製膜装置 WO2018179703A1 (ja)

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JP2019508604A JP6781336B2 (ja) 2017-03-29 2018-01-18 マスクキット、製膜方法および製膜装置
CN201880008517.1A CN110225994B (zh) 2017-03-29 2018-01-18 掩模、掩模套件、制膜方法以及制膜装置

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021165420A (ja) * 2020-04-07 2021-10-14 株式会社アルバック 真空成膜装置及び真空成膜方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414344A (en) * 1977-07-05 1979-02-02 Matsushita Electric Ind Co Ltd Fixing method for substrate to cacuum deposition electrode attaching jig
JP2006080429A (ja) * 2004-09-13 2006-03-23 Toray Ind Inc 回路基板用部材およびその製造方法
JP2006263685A (ja) * 2005-03-25 2006-10-05 Fuji Photo Film Co Ltd マスク形成方法と、マスク用材料と、これを用いたパターン膜形成システム
JP2015067893A (ja) * 2013-09-30 2015-04-13 株式会社オプトラン 成膜用マスク及び成膜方法
JP2018056486A (ja) * 2016-09-30 2018-04-05 株式会社ディスコ マスクの形成方法及びウエーハの加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5414344A (en) * 1977-07-05 1979-02-02 Matsushita Electric Ind Co Ltd Fixing method for substrate to cacuum deposition electrode attaching jig
JP2006080429A (ja) * 2004-09-13 2006-03-23 Toray Ind Inc 回路基板用部材およびその製造方法
JP2006263685A (ja) * 2005-03-25 2006-10-05 Fuji Photo Film Co Ltd マスク形成方法と、マスク用材料と、これを用いたパターン膜形成システム
JP2015067893A (ja) * 2013-09-30 2015-04-13 株式会社オプトラン 成膜用マスク及び成膜方法
JP2018056486A (ja) * 2016-09-30 2018-04-05 株式会社ディスコ マスクの形成方法及びウエーハの加工方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021165420A (ja) * 2020-04-07 2021-10-14 株式会社アルバック 真空成膜装置及び真空成膜方法
JP7481150B2 (ja) 2020-04-07 2024-05-10 株式会社アルバック 真空成膜装置及び真空成膜方法

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CN110225994B (zh) 2022-03-11
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CN110225994A (zh) 2019-09-10

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