WO2018179655A1 - Film de démoulage et procédé de fabrication de carte de circuit imprimé souple - Google Patents

Film de démoulage et procédé de fabrication de carte de circuit imprimé souple Download PDF

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Publication number
WO2018179655A1
WO2018179655A1 PCT/JP2017/047063 JP2017047063W WO2018179655A1 WO 2018179655 A1 WO2018179655 A1 WO 2018179655A1 JP 2017047063 W JP2017047063 W JP 2017047063W WO 2018179655 A1 WO2018179655 A1 WO 2018179655A1
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WIPO (PCT)
Prior art keywords
layer
release film
cushion layer
adhesive
laminate
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Application number
PCT/JP2017/047063
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English (en)
Japanese (ja)
Inventor
田中　秀明
優人 谷川
勝司 安田
喜吉 平塚
正志 中島
Original Assignee
日本メクトロン株式会社
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Publication of WO2018179655A1 publication Critical patent/WO2018179655A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a release film and a method for producing a flexible printed board.
  • the current release film is discarded when the cover film is laminated. Therefore, there is a problem that resources are wasted and the cost is increased by the need for a new release film.
  • the present invention has been made on the basis of the above circumstances. (1) To provide a release film capable of satisfactorily preventing tearing of the release film due to the spread of the end side of the cushion layer; (2) Waste of resources. It is an object of the present invention to provide at least one of a releasable release film and a method for producing a flexible printed circuit board.
  • a release film comprising: an adhesive layer that is attached to a base layer and has an exposed trap portion that protrudes from an end side of the cushion layer.
  • the adhesive layer has an acrylic resin as a main component.
  • the trap portion protrudes at least 3 mm from the end of the cushion layer.
  • the cushion layer is mainly composed of polypropylene.
  • the cushion layer is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene.
  • a cover film is temporarily adhered with respect to the base laminated body which has an insulating resin layer and a pattern layer, and a temporary adhesion body is formed.
  • a base layer mainly composed of a polyester-based resin, a cushion layer mainly composed of an olefin-based resin, a cushion layer attached to the base layer, and an end of the cushion layer
  • a second step of aligning the release film having an adhesive layer that protrudes from the portion side and has an exposed trap portion with respect to the temporary adhesive body from the cover film side The third step of laminating the cover film on the base laminate to form the laminate by heating and pressing the temporary adhesive through the film, and after the third step, In the fourth step of peeling the release film having a temperature lower than that of the laminate from the laminate, and in the release film after peeling, the cushion layer is peeled off from the adhesive layer and a new cushion layer is attached to the adhesive layer. And a step of returning to the first step again after the fifth step and repeating each step.
  • FIG. 4 is an enlarged plan view showing a state near a boundary where a pattern layer and a cover film are bonded to each other according to an embodiment of the present invention.
  • FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG.
  • FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG.
  • FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 and is a diagram showing the flow of the adhesive layer in a portion close to the pattern layer, although it is not a cross section of the pattern layer.
  • FIG. 7 is a cross-sectional view showing a state when a laminate is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used.
  • FIG. 7 is a cross-sectional view showing a state in which the laminate is cut along the line III-III shown in FIG.
  • FIG. 7 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is a view showing the flow of the adhesive layer in a portion close to the pattern layer, but not the cross section of the pattern layer It is. It is a figure which concerns on one embodiment of this invention and shows the image which peels a release film from a laminated body. It is a figure which concerns on one embodiment of this invention and shows the image which peels a cushion layer from the adhesion layer.
  • FIG. 6 is a plan view showing a state of measurement of the length of the adhesive flowing out in the laminate 50 according to the embodiment of the present invention.
  • FIG. 25 is a diagram showing the maximum flow-out length when PMP is used as a cushion layer material in Comparative Examples 31 to 35. It is a figure which concerns on one embodiment of this invention and shows about the maximum length of the outflow when CPP with a thickness of 20 ⁇ m is used as the material of the cushion layer.
  • FIG. 27 is a diagram illustrating a state in which lamination is performed from the state illustrated in FIG. 26 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed.
  • FIG. 28 is a side cross-sectional view illustrating a state where lamination is performed from the state illustrated in FIG. 27 according to an embodiment of the present invention, in which a part of the cushion layer flows out to the outside and a flow-out portion is formed.
  • the Z direction is the thickness direction of each film
  • Z1 is the back side (upper side; front side) in FIG. 1
  • Z2 is the front side (lower side; back side) in FIG.
  • FIG. 1 is a cross-sectional view showing configurations of the base laminate 10 and the cover film 20.
  • the base laminate 10 is obtained by etching a metal foil having a predetermined thickness, such as a copper clad laminate, and forming the metal foil into a desired pattern shape.
  • the base laminate 10 includes an insulating resin layer 11 and a pattern layer 12.
  • the insulating resin layer 11 is made of polyimide having a predetermined thickness and electrical insulation. Examples of the thickness of the insulating resin layer 11 include 25 ⁇ m (1 mil) and 12.5 ⁇ m (1/2 mil), but other thicknesses may be used.
  • the pattern layer 12 is a portion obtained by patterning a metal foil having a predetermined thickness such as a copper foil into a desired pattern shape by using a normal photofabrication technique such as etching.
  • Examples of the thickness of the pattern layer 12 include 35 ⁇ m (1 oz), 17.5 ⁇ m (1/2 oz), and 12 ⁇ m (1/3 oz), but other thicknesses may be used.
  • the base laminate 10 may have other layers.
  • an adhesive for adhering these is provided between the insulating resin layer 11 and the pattern layer 12 (not shown).
  • the thickness of the adhesive may be 10 ⁇ m or 12 ⁇ m, for example, but the thickness can be set as appropriate.
  • the cover film 20 laminated on the base laminate 10 described above has a cover layer 21 and an adhesive layer 22.
  • the cover layer 21 is made of polyimide. Examples of the thickness of the cover layer 21 include 25 ⁇ m (1 mil) and 12.5 ⁇ m (1/2 mil), but other thicknesses may be used.
  • the adhesive layer 22 is mainly made of, for example, an epoxy adhesive, but a polyurethane adhesive or an acrylic adhesive may also be used.
  • the adhesive layer 22 has a thickness of 28 ⁇ m, for example, but may have a thickness other than this.
  • the cover film 20 has an opening 23.
  • the opening 23 is a portion that has been drilled with, for example, a laser.
  • FIG. 2 is a cross-sectional view showing the configuration of the release film 30.
  • the release film 30 has a base layer 31, an adhesive layer 32, and a cushion layer 33.
  • the base layer 31 is composed mainly of a polyester resin.
  • polyester resins include those containing PET (PolyethylenelyTerephthalate) as the main component, those containing PBT (Polybutylene Terephtalate) as the main component, those containing PTT (Polytrimethylene Terephtalate) as the main component, and PEN (Polyethylene Naphthalate).
  • PET PolyethylenelyTerephthalate
  • PBT Polybutylene Terephtalate
  • PTT Polytrimethylene Terephtalate
  • PEN Polyethylene Naphthalate
  • a main component of PBN Polybutylene Naphthalate
  • those containing PET as a main component are particularly preferred from the viewpoint of availability.
  • those listed or other than listed may be used as the main component.
  • the adhesive layer 32 includes, for example, an acrylic adhesive mainly composed of an acrylic resin.
  • the pressure-sensitive adhesive layer 32 is not limited to an acrylic pressure-sensitive adhesive, and is mainly composed of a rubber-based pressure-sensitive adhesive in which a tackifier is added to natural rubber, a silicone-based pressure-sensitive adhesive in which a tackifier is added to silicone rubber, and polyurethane. Examples include urethane-based pressure-sensitive adhesives. Among these, an acrylic pressure-sensitive adhesive is preferable because it is easily available and can be repeatedly used.
  • the cushion layer 33 covers the cover film 20 from the cover film 20 side (upper side; Z1 side) when laminating the cover film 20 and the base laminate 10 by heating and pressurization, This is a portion that follows the unevenness of the base laminate 10. That is, when laminating the cover film 20 on the base laminate 10, it is a part that prevents the adhesive material from flowing out of the adhesive material layer 22 by following the unevenness existing therebetween.
  • the cushion layer 33 is mainly composed of an olefin resin.
  • olefin resins include polypropylene resins, polyethylene resins, and polypentene resins.
  • a polypropylene resin and a polyethylene resin are preferable in that the flow of the adhesive layer 22 can be satisfactorily suppressed.
  • polypropylene resins CPP (Cast Polypropylene) and IPP (Inflation Polypropylene) have a good surface slipperiness, and even if the release film 30 is peeled off after lamination, a laminate is obtained. This is particularly preferable because generation of 50 wrinkles can be prevented.
  • polyethylene resins LDPE (Low Density Polyethylene) has good surface slipperiness, and even if the release film 30 is peeled off after lamination, generation of wrinkles in the laminate 50 can be prevented. Is particularly preferred.
  • the adhesive layer 32 has a portion that is not adhered to the cushion layer 33. That is, as shown in FIG. 2, the adhesive layer 32 has a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed to the outside.
  • the trap portion 34 is a portion that traps (holds) the cushion layer 33 that spreads during lamination on the end side of the cushion layer 33. This prevents the cushion layer 33 from unnecessarily spreading and prevents a thin portion from being formed in the cushion layer 33.
  • the trap portion 34 may have any size as long as it can trap the spread cushion layer 33 well, but in a direction along the surface of the release film 30 (a direction orthogonal to the Z direction). It is preferable that it exists 3 mm or more.
  • FIG. 3 is a cross-sectional view showing the configuration of the temporary adhesive body 40.
  • the adhesive layer 22 is not sufficiently deformed, and is thus only partially bonded to the base laminate 10.
  • FIG. 3 shows a state in which the adhesive layer 22 has not reached the surface of the insulating resin layer 11 as such an image.
  • FIG. 4 is a cross-sectional view showing the configuration of the laminate 50.
  • FIG. 5 is a plan view showing a state in which the laminate 50 is viewed from the upper side (Z1 side).
  • FIG. 4 shows a state cut along line II in FIG.
  • the laminate 50 corresponds to a flexible printed board, it may be understood that what is formed through various processes on the laminate 50 corresponds to the flexible printed board.
  • the opening part 23 of the cover film 20 is aligned with the pattern part 12a (the remaining part of the metal foil) of the pattern layer 12.
  • the pattern layer 12 is electrically connected by performing a subsequent plating process on the conductive portion provided outside the opening 23. It becomes possible.
  • the opening 23 includes a portion having a depth to the pattern layer 12 (one-step opening 231) and a portion having a depth deeper than the pattern layer 12 and to the insulating resin layer 11 (two steps).
  • An opening 232 may be employed.
  • the opening 23 may have any shape.
  • it may have a slit shape as shown in FIG. 5, a circular hole shape, a rectangular shape, an elliptical shape, or other shapes.
  • FIG. 6 it is good also as a structure which the cover film 20 exists only in the one side of the pattern part 12a of the pattern layer 12, and does not exist in the other side.
  • a method for manufacturing a flexible printed board using the base laminate 10, the cover film 20, and the release film 30 having the above-described configuration will be described below.
  • the first to sixth steps are sequentially described, but it is needless to say that various steps other than these may exist.
  • the flow of the adhesive material of the adhesive material layer 22 will also be described.
  • FIG. 7 is a view showing a state of alignment between the temporary adhesive body 40 and the release film 30.
  • the mounting plate 100 is made of a resin that is more flexible than a metal such as PET (Polyethylene Terephthalate) or PBT (Polybutylene Terephthalate).
  • PET Polyethylene Terephthalate
  • PBT Polybutylene Terephthalate
  • the temporary adhesive body 40 is preheated so that it may become predetermined
  • the temporary adhesive body 40 and the release film 30 are aligned.
  • the release film 30 covers the temporary adhesive body 40.
  • the release film 30 is disposed at the position. In this alignment, the release film 30 may be in light contact with the upper surface of the temporary adhesive body 40.
  • the laminate 50 is formed by pressing the temporary adhesive 40 using the release film 30.
  • a hot plate (not shown) is disposed on the release film 30.
  • the hot plate is heated to a predetermined temperature such as 180 degrees.
  • the temperature of the hot plate may be around 180 degrees as long as the adhesive layer 22 and the cushion layer 33 are melted.
  • the temporary adhesive body 40 is pressed through the hot plate and the release film 30 with a predetermined pressing force.
  • the pressing time is, for example, about 10 seconds to 30 seconds.
  • FIG. 8 is a view showing a state after the release film 30 is pressed against the temporary adhesive body 40 via a hot plate. As shown in FIG. 8, the cushion layer 33 melts, and the cushion layer 33 follows the uneven shape on the surface side of the cover film 20. Therefore, the melted cushion layer 33 enters the opening 23 or turns around to cover the side surface at the end of the base laminate 10.
  • the adhesive layer 22 of the cover film 20 is also softened, and the adhesive constituting the adhesive layer 22 melts and flows out. Thereby, the adhesive layer 22 follows the unevenness of the surface of the base laminate 10. Therefore, the adhesive layer 22 is bonded to the base laminate 10.
  • the cushion layer 33 and the adhesive layer 22 are compared, the cushion layer 33 is first melted than the adhesive layer 22. Therefore, in the opening 23, the melted cushion layer 33 enters before the melted adhesive layer 22 and occupies the opening 23. Therefore, the flow of the adhesive layer 22 is suppressed at the opening 23. Similarly, at the end of the base laminate 10, the adhesive layer 22 is prevented from flowing out by covering the side surface before the melted adhesive layer 22 is covered.
  • FIG. 9 is an enlarged plan view showing a state near the boundary where the pattern layer 12 and the cover film 20 are bonded together.
  • FIG. 10 is a cross-sectional view showing a state when the laminate 50 is cut along the line II-II shown in FIG.
  • FIG. 11 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6, and is a view showing the flow of the adhesive layer 22 in a portion close to the cover film 20.
  • FIG. 12 is a cross-sectional view taken along the line IV-IV in FIG. 6, and is a view showing the flow of the adhesive layer 22 at a portion close to the pattern layer 12 but not the cross section of the pattern layer 12.
  • FIGS. 13 to 15 show how the adhesive material flows out of the adhesive layer 22 when Comparative Example 1 is used as a release film that is currently used.
  • the release film uses PMP (polymethylpentene) made of polymethylpentene resin at a portion corresponding to the cushion layer 33.
  • FIG. 13 is a cross-sectional view showing a state in which the laminate 50 is cut along the line II-II shown in FIG. 6 when the release film of Comparative Example 1 is used.
  • 14 is a cross-sectional view showing a state when the laminate 50 is cut along the line III-III shown in FIG. 6 when the release film of Comparative Example 1 is used, and is close to the cover film 20.
  • part. 15 is a cross-sectional view taken along the line IV-IV in FIG. 6 when the release film of Comparative Example 1 is used, and is not a cross-section of the pattern layer 12 but an adhesive in a portion close to the pattern layer 12 It is a figure which shows the outflow of the layer 22.
  • FIG. 16 is a diagram illustrating an image in which the release film 30 is peeled from the laminate 50.
  • this intermediate may be interpreted as a flexible printed circuit board.
  • the finished product of a flexible printed circuit board is obtained through various processes with respect to an intermediate.
  • FIG. 17 is a diagram illustrating an image in which the cushion layer 33 is peeled off from the adhesive layer 32.
  • FIG. 18 is a diagram illustrating an image in which a new cushion layer 33 is pasted to the adhesive layer 32, and is a diagram illustrating a state immediately before being pasted.
  • the adhesion layer 32 is adhere
  • the process returns again to the first step, and a new laminate 50 is formed. At this time, the release film 30 as a recycled product is used again in the second and subsequent steps.
  • CPP is Example 1
  • IPP is Example 2
  • LDPE is Example 3
  • TPX is Comparative Example 1
  • OPP is Comparative Example 2.
  • the base layer 31 of the release film 30 is made of PET and has a thickness of 50 ⁇ m.
  • the adhesive layer 32 has a thickness of 7 ⁇ m.
  • the release film 30 has a trap portion 34, and the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
  • an epoxy adhesive was used as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20 as an adhesive for the adhesive layer 22 of the cover film 20. Further, as an adhesive (not shown) between the insulating resin layer 11 and the pattern layer 12, an epoxy adhesive was used as an adhesive (not shown) between the insulating resin layer 11 and the pattern layer 12.
  • the thickness of the copper pattern layer 12 is 35 ⁇ m
  • the thickness of the insulating resin layer 11 made of polyimide is 25 ⁇ m
  • the copper pattern layer 12 and the insulating resin layer 11 H1 / H2 which is the ratio of the width H1 of the pattern portion 12a and the width H2 between the adjacent pattern portions 12a, is 260 ⁇ m / 140 ⁇ m.
  • the thickness of the cover layer 21 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive layer 22 is 28 ⁇ m.
  • the laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds.
  • Table 1 the maximum dimension of the adhesive on the pattern portion 12a shown in FIG. 6 was measured.
  • the cushion layer 33 was also evaluated for tearing (releasability). In this evaluation, “B” indicates that the cushion layer 33 is not torn, and “D” indicates that the cushion layer 33 is torn. In Table 1, the wrinkles of the laminated body 50 after lamination were also evaluated. In this evaluation, “B” indicates that the laminate 50 does not have wrinkles, and “D” indicates that the laminate 50 has wrinkles.
  • the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are not unsuitable as the material of the cushion layer 33 in any of the three evaluation items. Therefore, the CPP of Example 1, the IPP of Example 2, and the LDPE of Example 3 are suitable as materials for the cushion layer 33.
  • the OPP of Comparative Example 2 was wrinkled on the laminate 50 after lamination. Therefore, OPP is not suitable as a material for the cushion layer 33.
  • the flow of the adhesive material was larger than 100 ⁇ m on the pattern portion 12a, and the flow of the adhesive material was larger than 150 ⁇ m in the space 14. Therefore, PMP is not suitable as a material for the cushion layer 33.
  • the thickness of the cushion layer 33 of the release film 30 was evaluated.
  • Table 2 shows the evaluation results when the thickness of the cushion layer 33 is 20 ⁇ m (Comparative Example 3), 40 ⁇ m (Example 4), and 60 ⁇ m (Example 5).
  • the material of the cushion layer 33 is CPP
  • the length of the flow of the adhesive, the tearing of the cushion layer 33 (releasability), and the wrinkles of the laminated body 50 after the lamination are evaluated as in Table 1. evaluated.
  • the evaluation criteria are the same as in Table 1.
  • the laminating apparatus used the configuration of the materials and thicknesses of other members (cover film 20 and release film 30), the laminating conditions, and the like are the same as those in Table 1 described above. Accordingly, the release film 30 also has a trap portion 34.
  • Example 4 and Example 5 In the evaluation of Table 2 described above, regarding the flow-out of the adhesive, in Example 4 and Example 5, none of the three evaluation items is unsuitable as the material of the cushion layer 33. Therefore, in the case of 40 ⁇ m in Example 4 and 60 ⁇ m in Example 5, the thickness of the cushion layer 33 is suitable. On the other hand, in Comparative Example 3, the cushion layer 33 was torn. Therefore, in the case of 20 ⁇ m in Comparative Example 3, the thickness of the cushion layer 33 is not suitable.
  • the thickness of the copper pattern layer 12 is 12 ⁇ m, 18 ⁇ m, and 35 ⁇ m
  • the thickness of the cushion layer 33 is 20 ⁇ m, 40 ⁇ m, and 60 ⁇ m.
  • Example 3 shows the evaluation results when the thickness of the CPP (hereinafter simply referred to as CPP) which is the cushion layer 33 in Example 11 is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • CPP the thickness of the CPP
  • Example 12 the evaluation results are obtained when the thickness of the CPP is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Example 13 is an evaluation result when the thickness of the CPP is 20 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Example 14 is an evaluation result when the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Example 15 is an evaluation result when the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Example 16 is an evaluation result in the case where the thickness of the CPP is 40 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Example 17 is an evaluation result when the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Example 18 is an evaluation result in the case where the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m. Moreover, Example 18 is an evaluation result when the thickness of the CPP is 60 ⁇ m and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • Comparative Example 11 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 12 ⁇ m.
  • Comparative Example 12 is an evaluation result when PMP is used as the cushion layer 33 and the thickness of the pattern portion 12a (copper foil) is 18 ⁇ m.
  • Comparative Example 13 is an evaluation result when PMP is used and the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m.
  • the evaluation criteria are the same as in Table 1. Further, the laminating apparatus used, laminating conditions, and the like are the same as those in Table 1 described above.
  • Examples 11 to 19 when the thickness of the pattern portion 12a (copper foil) is 35 ⁇ m (Examples 13, 16, and 19), the adhesive between the insulating resin layer 11 and the pattern layer 12 is used.
  • the thickness of the adhesive is 12 ⁇ m, otherwise the thickness of the adhesive is 10 ⁇ m.
  • the thickness of the pattern layer 12 is 12 ⁇ m (Examples 11, 14, and 19)
  • the thickness of the insulating resin layer 11 is 13 ⁇ m, and otherwise, the thickness of the insulating resin layer 11 is 25 ⁇ m. It is.
  • the dimension in the height direction of the pattern layer 12 (pattern part 12a) changes, it can be said that there is no problem in suppressing the outflow.
  • the thickness of the CPP is 20 ⁇ m
  • the flow of the adhesive is suppressed to 100 ⁇ m or less. Therefore, when the CPP is used as the material of the cushion layer 33, the followability to the unevenness of the pattern layer 12 is good. It can be said that there is.
  • the flow-out of the adhesive material could be suppressed to 100 ⁇ m at any position on the pattern portion 12 a and the space 14.
  • the flow-out of the adhesive exceeded 100 ⁇ m on the pattern portion 12a.
  • the flow-out of the adhesive exceeded 150 ⁇ m. Therefore, PMP is not suitable for use in the 35 ⁇ m pattern layer 12.
  • the material of the cushion layer 33 was CPP
  • the length of the adhesive flowing out was measured as in Table 1.
  • the thickness of the used laminating apparatus and other materials (base laminate 10 and cover film 20), lamination conditions, and the like are the same as those in Table 1 described above.
  • the measurement of the flow length of the adhesive material in the laminate 50 is performed as shown in FIG. That is, as shown in FIG. 19, the maximum lengths M1 and M2 of the adhesive material flowing out on the pattern portion 12a and in the space 14 are measured. On both the pattern portion 12a and the space 14, the maximum flow lengths M1 and M2 correspond to the maximum flow length from the end of the cover film 20 (cover layer 21) in the direction away from the cover film 20. is doing.
  • FIG. 20 to FIG. 23 are graphs showing the measured maximum lengths M1 and M2.
  • FIG. 20 is a diagram showing the maximum flow lengths M1 and M2 when PMP is used as the material of the cushion layer 33.
  • the maximum length M2 of the adhesive flowing out in the space 14 is particularly long.
  • the width S of the space 14 is 140 ⁇ m (in the case of the comparative example 31 in which the width L of the pattern portion 12a is 60 ⁇ m, the comparative example 32 in the case of 160 ⁇ m, and the comparative example 33 of 260 ⁇ m), and 240 ⁇ m (the width L of the pattern portion 12a is In any case of Comparative Example 4 (260 ⁇ m) and 340 ⁇ m (Comparative Example 35 where the width L of the pattern portion 12a is 460 ⁇ m), the maximum flow-out length M2 is larger than 150 ⁇ m. For this reason, in the space 14, it is considered that the maximum flow length M2 becomes longer regardless of the width L of the pattern portion 12a, and is not suitable as a material for the cushion layer 33.
  • the maximum length M1 of the adhesive material flowing out in the pattern portion 12a is longer than that in the case of FIGS. 21 to 23 described later.
  • the width L of the pattern portion 12a is 160 ⁇ m (in the case of Comparative Examples 31 and 31 in which the width S of the space 14 is 140 ⁇ m), 260 ⁇ m (in the case of Comparative Example 33 in which the width S of the space 14 is 140 ⁇ m) and )
  • the maximum flow-out length M1 is larger than 100 ⁇ m. Therefore, when the width L of the pattern portion 12a is 160 ⁇ m, 260 ⁇ m, and 460 ⁇ m, the maximum flow length M1 is long, which is inappropriate.
  • FIG. 21 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 20 ⁇ m is used as the material of the cushion layer 33 (Examples 21 to 25).
  • FIG. 22 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 40 ⁇ m is used as the material of the cushion layer 33 (Examples 26 to 30).
  • FIG. 23 is a diagram showing the maximum flow lengths M1 and M2 when CPP having a thickness of 60 ⁇ m is used as the material of the cushion layer 33 (Examples 31 to 35).
  • L / S which is a combination of the width L and the width S, is 60 ⁇ m / 140 ⁇ m (Examples 21, 26, 31), 160 ⁇ m / 140 ⁇ m (Examples 22, 27, 32), 260 ⁇ m / 140 ⁇ m (Examples 23, 28).
  • the maximum length M1 and M2 of the adhesive material can be kept short. ing.
  • the maximum flow-out length M ⁇ b> 2 in the space 14 is significantly lower than when PMP is used as the material of the cushion layer 33. Therefore, any thickness of CPP of 20 ⁇ m to 60 ⁇ m is suitable as a material for the cushion layer 33.
  • FIG. 26 is a plan view showing the release film 30 and the insulating resin layer 11 before lamination, and is a view transparently showing the positional relationship between the cushion layer 33 and the trap portion 34.
  • FIG. 27 is a side sectional view showing the arrangement of the release film 30 and the insulating resin layer 11 before lamination.
  • FIG. 28 shows a state in which lamination is performed from the state shown in FIG. 26, and shows a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33a is formed.
  • FIG. 29 is a side sectional view showing a state in which lamination is performed from the state shown in FIG. 27, and a state in which a part of the cushion layer 33 flows out to the outside and a flow-out portion 33 a is formed.
  • the adhesive layer 32 is provided with a trap part 34 that protrudes (protrudes) beyond the end side of the cushion layer 33, and the cushion layer 33 is easily peeled off depending on the presence or absence of the trap part 34. Evaluation was made regarding the length (prevention of tearing of the cushion layer 33).
  • Example 40 the example in which the thickness of the cushion layer 33 made of CPP is 40 ⁇ m and the trap portion 34 exists is referred to as Example 40. Further, the thickness of the cushion layer 33 made of CPP is 40 ⁇ m, but the one having no trap portion 34 is used as a comparative example 40. In Example 40, the trap portion 34 protrudes 3 mm from the end portion of the cushion layer 33.
  • the base layer 31 of the release film 30 is made of PET and has a thickness of 50 ⁇ m.
  • the adhesive layer 32 has a thickness of 7 ⁇ m.
  • the thickness of the copper pattern layer 12 is 35 ⁇ m
  • the thickness of the insulating resin layer 11 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive between the copper pattern layer 12 and the insulating resin layer 11 is 12 ⁇ m.
  • the thickness of the cover layer 21 made of polyimide is 25 ⁇ m
  • the thickness of the adhesive layer 22 is 28 ⁇ m.
  • the laminating conditions when using the laminating apparatus are as follows: the heating temperature is 185 degrees, the press pressure is 2 MPa, the preheating time is 10 seconds (the preheating temperature is equal to the heating temperature), and the pressing time is 80 seconds.
  • the case where the cushion layer 33 is torn is described as “Yes”, and the case where the cushion layer 33 is not torn is described as “None”.
  • the trap part 34 prevents the formation of a part that causes the cushion layer 33 to be broken by sticking and holding the flow-out part 33 a having a thickness smaller than that of the cushion layer 33. Therefore, it is considered that the trap portion 34 is required to have a size that covers at least the flow-out portion 33a. That is, it is considered that the trap portion 34 may be at least as long as it corresponds to the dimension in which the flow-out portion 33 a flows out from the end portion of the cushion layer 33.
  • L1 1.1 mm
  • L2 1.0 mm
  • L3 1.4 mm
  • L4 1.4 mm
  • L5 1.1 mm
  • L6 1.5 mm
  • L7 1.6 mm
  • L8 1.0 mm
  • L9 1.5 mm
  • L10 0.7 mm.
  • an average value Av of these L1 to L10 was calculated, and a standard deviation ⁇ was calculated based on the average value and each dimension.
  • the probability ⁇ out of the range obtained by adding or subtracting four times the standard deviation ⁇ to the average value Av is known as 0.006%. Accordingly, 99.997% of the flow-out portion 33a is included in the value (cover rate C) obtained by adding the standard deviation ⁇ to 4 times the average value Av. Therefore, the cover rate C was calculated.
  • the average value Av of the above-mentioned L1 to L10 is calculated as 1.2 mm (calculated to the first decimal place), and the standard deviation ⁇ is calculated as 0.3 mm, so the cover ratio C is calculated as 2.4 mm. It was done. If this 2.4 mm is given a slight margin and a numerical value without the first decimal place in the dimensional unit mm is calculated, it becomes 3 mm. As described above, the dimensions of the trap portion 34 are calculated.
  • a base layer 31 mainly composed of a polyester-based resin
  • the cushion layer 33 that follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is formed with respect to the base layer 31.
  • an adhesive layer 32 having a trap portion 34 that protrudes from the end side of the cushion layer 33 and is exposed.
  • the cushion layer 33 that spreads during lamination can be trapped (held) by the trap portion 34.
  • the cushion layer 33 is unnecessarily spread, and it is possible to prevent the cushion layer 33 from being formed with a thin portion more than necessary.
  • the cushion layer 33 can be prevented from jumping out from the end portion of the release film 30. Therefore, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the cushion layer 33 follows the unevenness of the cover film 20 and the base laminate 10 while covering the cover film 20 by heating and pressurization, and the cushion layer 33 is mainly composed of an olefin resin. Therefore, it is possible to satisfactorily prevent the adhesive material from flowing out of the adhesive material layer 22. Thereby, it is possible to prevent the adhesive material that has flowed out from spreading in the pattern portion 12a and the space 14, and it is possible to prevent the spread adhesive material from becoming inoperable after the plating process.
  • FIG. 25 is a diagram illustrating a configuration of the integrated object 80 in a state where the flow-out portion 22a is formed.
  • 25 shows an anisotropic conductive property of the laminate 50 in the vicinity of the III-III cross section shown in FIG. 6 in the laminate 50 formed using the release film 30 using PMP as the cushion layer 33.
  • the image of the integrated object 80 in which the film 60 was affixed and the sticking target object 70 was affixed through the anisotropic conductive film 60 is shown.
  • the anisotropic conductive film 60 has a large number of metal particles 62 dispersed in the thermosetting resin layer 61.
  • the flow-out portion 22a is formed by melting the adhesive layer 22, the flow-out portion 22a is in a state of covering the pattern portion 12a by a predetermined amount.
  • the outflow part 22a has electrical insulation. Therefore, even if the anisotropic conductive film 60 in which the metal particles 62 are dispersed is used, there is a possibility that electrical conduction cannot be established between the conductor portion 72 and the pattern portion 12a of the pasting target 70.
  • the metal particles 62 existing in the space 14 between the adjacent pattern parts 12a are in the thickness direction of the integrated object 80. In this case, it moves to the conductor portion 72 side. Therefore, when the flow-out increases, the metal particles 62 are connected in a direction crossing the plurality of pattern portions 12a, and conductivity is exhibited even in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that shows conductivity only in the thickness direction of the integrated object 80 is hindered.
  • FIG. 24 shows a configuration when the release film 30 of the present embodiment is used.
  • FIG. 24 is a diagram illustrating a configuration of the integrated object 80 in a state where formation of the flow-out portion 22a is suppressed using the release film 30.
  • an anisotropic conductive film 60 is attached to the laminate 50 in the vicinity of the cross-section III-III shown in FIG. 6 in the laminate 50, and further attached via the anisotropic conductive film 60.
  • the metal particles 62 are applied to the application object by applying a pressing force between the laminate 50 and the application object 70 with the anisotropic conductive film 60 sandwiched between the laminate 50 and the application object 70. 70, and the metal particles 62 are also in electrical contact with the pattern portion 12a. As a result, the conductor portion 72 and the pattern portion 12a are electrically connected. Thus, when the release film 30 of this Embodiment is used, an electrical continuity state can be ensured between the conductor part 72 and the pattern part 12a as shown in FIG.
  • the metal particles 62 existing in the space 14 between the adjacent pattern portions 12 a are in the conductor portion 72 side in the thickness direction of the integrated product 80. It is possible to prevent the movement. Thereby, it becomes possible to prevent the metal particles 62 from being connected in a direction crossing the plurality of pattern portions 12a. Therefore, anisotropic conductivity that exhibits conductivity only in the thickness direction of the integrated object 80 can be ensured.
  • the miniaturization of the pattern layer 12 proceeds, if the formation of the flow-out portion 22a is not suppressed, the effective area that can be electrically connected is reduced, and the miniaturization of the pattern layer 12 is hindered.
  • the release film 30 of the present embodiment by suppressing the formation of the flow-out portion 22a using the release film 30 of the present embodiment, a wide effective area that can be electrically connected can be secured, and the pattern layer 12 can be made finer. be able to.
  • the adhesive layer 32 is mainly composed of an acrylic resin.
  • the adhesive layer 32 has an acrylic resin as a main component, sufficient adhesive force can be secured.
  • the cushion layer 33 spreading during lamination can be sufficiently trapped (held) by the trap portion 34. Therefore, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the trap portion 34 protrudes at least 3 mm or more from the end portion of the cushion layer 33.
  • the cushion layer 33 spread during lamination can be sufficiently trapped (held). Thereby, it is possible to satisfactorily prevent the cushion layer 33 from jumping out from the end portion of the release film 30. Thereby, it becomes easy to peel the release film 30 from the laminate 50. Further, when the release film 30 is peeled off from the laminate 50, the cushion layer 33 is hardly broken.
  • the cushion layer 33 is preferably composed mainly of polypropylene.
  • the cushion layer 33 has polypropylene as a main component, the formation of the flow-out portion 22a can be satisfactorily suppressed. Moreover, when peeling the cushion layer 33 from the laminated body 50 after lamination, it becomes possible to prevent that the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable.
  • the cushion layer 33 is mainly composed of unstretched polypropylene or inflation polypropylene among polypropylene.
  • the cushion layer 33 is mainly composed of polypropylene, it is possible to satisfactorily prevent the flow-out portion 22a from being formed.
  • the cushion layer 33 is torn, and the release property of the release film 30 can be made favorable.
  • the cover film 20 is temporarily bonded with respect to the base laminated body 10 which has the insulating resin layer 11 and the pattern layer 12, and temporary bonding body is carried out. 40 is formed.
  • the base layer 31 mainly composed of polyester resin
  • the cushion layer 33 mainly composed of olefin resin
  • the cushion layer 33 are bonded to the base layer 31.
  • the release film 30 having the adhesive layer 32 having the exposed trap portion 34 protruding from the end side of the cushion layer 33 is aligned with the temporary adhesive body 40 from the cover film 20 side.
  • the temporary adhesive body 40 is heated and pressed through the release film 30 to laminate the cover film 20 to the base laminate 10 to form the laminate 50.
  • the release film 30 having a temperature lower than that during lamination is peeled off from the laminate 50.
  • the cushion layer 33 is peeled off from the adhesive layer 32 and a new cushion layer 33 is attached to the adhesive layer 32. And after the 5th process, it returns to the 1st process again and repeats each process.
  • the trap portion 34 may protrude with respect to the end portion of the cushion layer 33 over the entire outer periphery of the release film 30, and at least a part thereof is at the end portion of the cushion layer 33. On the other hand, it may protrude.
  • the release film 30 may have any shape.
  • it may be a rectangular sheet or may be wound in a roll.
  • the cushion layer 33 divided into a predetermined dimension is formed with respect to an integrated product of the long base layer 31 and the adhesive layer 32 that can be wound in a roll shape.
  • the trap part 34 can be formed by affixing intermittently.
  • the release film 30 having a predetermined shape does not have the trap portion 34 at the beginning, and the trap layer 33 is removed from the outer peripheral edge portion of the release film 30 by a hot press or other technique, thereby trapping.
  • the part 34 may be formed.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

La présente invention concerne un film de démoulage permettant d'empêcher de manière favorable une rupture de celui-ci en raison de l'étalement d'un côté extrémité d'une couche d'amortissement. Un film de démoulage 30 utilisé lors de la stratification d'un film de couverture 20 sur un corps stratifié de base 10 ayant une couche de résine isolante 11 et une couche de motif 12 comprend : une couche de base 31 qui est principalement composée d'une résine à base de polyester ; une couche d'amortissement 33 qui est principalement composée d'une résine à base d'oléfine et qui, par chauffage et mise sous pression, suit des irrégularités du film de couverture 20 et du corps stratifié de base 10 tout en recouvrant le film de couverture 20 ; et une couche adhésive 32 qui fixe la couche d'amortissement 33 à la couche de base 31 et comprend une partie piège 34 exposée de façon à faire saillie depuis un côté extrémité de la couche d'amortissement 33.
PCT/JP2017/047063 2017-03-29 2017-12-27 Film de démoulage et procédé de fabrication de carte de circuit imprimé souple WO2018179655A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017065824A JP2018167458A (ja) 2017-03-29 2017-03-29 離型フィルムおよびフレキシブルプリント基板の製造方法
JP2017-065824 2017-03-29

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WO2018179655A1 true WO2018179655A1 (fr) 2018-10-04

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JP (1) JP2018167458A (fr)
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Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100588A (ja) * 1982-11-30 1984-06-09 日本メクトロン株式会社 回路基板へのカバ−フイルムの積層方法
JPH02175247A (ja) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd 積層体からなる離型フィルム
JPH0433855A (ja) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc 金属箔張り積層板の製法
JPH0489340U (fr) * 1990-02-16 1992-08-04
JP2003313313A (ja) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd 離型フィルム
WO2005002850A1 (fr) * 2003-07-01 2005-01-13 Sumitomo Bakelite Co., Ltd. Film de demoulage et procede de production d'une carte imprimee flexible avec ce film
JP2005212453A (ja) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd 離型フィルム及び離型フィルムの製造方法
WO2008001682A1 (fr) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film et film de démoulage
JP2010098075A (ja) * 2008-10-15 2010-04-30 Nippon Mektron Ltd フレキシブル回路基板の製造方法及びフレキシブル回路基板
JP2015083379A (ja) * 2010-03-12 2015-04-30 積水化学工業株式会社 離型フィルム及び離型フィルムの製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59100588A (ja) * 1982-11-30 1984-06-09 日本メクトロン株式会社 回路基板へのカバ−フイルムの積層方法
JPH02175247A (ja) * 1988-12-28 1990-07-06 Mitsui Petrochem Ind Ltd 積層体からなる離型フィルム
JPH0489340U (fr) * 1990-02-16 1992-08-04
JPH0433855A (ja) * 1990-05-30 1992-02-05 Dainippon Ink & Chem Inc 金属箔張り積層板の製法
JP2003313313A (ja) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd 離型フィルム
WO2005002850A1 (fr) * 2003-07-01 2005-01-13 Sumitomo Bakelite Co., Ltd. Film de demoulage et procede de production d'une carte imprimee flexible avec ce film
JP2005212453A (ja) * 2004-02-02 2005-08-11 Sekisui Chem Co Ltd 離型フィルム及び離型フィルムの製造方法
WO2008001682A1 (fr) * 2006-06-27 2008-01-03 Mitsui Chemicals, Inc. Film et film de démoulage
JP2010098075A (ja) * 2008-10-15 2010-04-30 Nippon Mektron Ltd フレキシブル回路基板の製造方法及びフレキシブル回路基板
JP2015083379A (ja) * 2010-03-12 2015-04-30 積水化学工業株式会社 離型フィルム及び離型フィルムの製造方法

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JP2018167458A (ja) 2018-11-01

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