WO2018171610A1 - 显示面板及其制造方法和显示装置 - Google Patents

显示面板及其制造方法和显示装置 Download PDF

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Publication number
WO2018171610A1
WO2018171610A1 PCT/CN2018/079737 CN2018079737W WO2018171610A1 WO 2018171610 A1 WO2018171610 A1 WO 2018171610A1 CN 2018079737 W CN2018079737 W CN 2018079737W WO 2018171610 A1 WO2018171610 A1 WO 2018171610A1
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WO
WIPO (PCT)
Prior art keywords
resin
pattern
protective layer
substrate
region
Prior art date
Application number
PCT/CN2018/079737
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English (en)
French (fr)
Inventor
田鹏程
赵斌
李鑫
赵德涛
张乐
Original Assignee
京东方科技集团股份有限公司
北京京东方光电科技有限公司
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Application filed by 京东方科技集团股份有限公司, 北京京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US16/322,273 priority Critical patent/US10859877B2/en
Publication of WO2018171610A1 publication Critical patent/WO2018171610A1/zh

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306—Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133345—Insulating layers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/136209—Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2201/00—Constructional arrangements not provided for in groups G02F1/00 - G02F7/00
    • G02F2201/42—Arrangements for providing conduction through an insulating substrate

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a display panel, a method of manufacturing the same, and a display device.
  • the liquid crystal display device may include an array substrate and a color filter substrate disposed opposite to each other.
  • the array substrate can be divided into a display area and a peripheral area located around the display area.
  • a gate drive circuit Gate On Array, GOA for short
  • a metal trace connected to the gate drive circuit are formed in the peripheral area, and the gate drive circuit is formed.
  • a protective layer is placed over the metal trace.
  • the invention provides a display panel, a manufacturing method thereof and a display device, which are used for reducing the problem that the sealant is easily peeled off from the array substrate.
  • a display panel comprising:
  • the display substrate and the opposite substrate are disposed opposite to each other and a sealant is disposed therebetween, the display substrate is divided into a display area and a peripheral area located around the display area, wherein the display
  • the substrate includes:
  • a protective layer located in the display region and the peripheral region and formed between the first resin pattern and the metal pattern;
  • sealant is located in the peripheral region, and the sealant is in contact with at least a portion of the protective layer in the peripheral region.
  • the sealant is in contact with all of the protective layers in the peripheral region.
  • the display panel further includes a second resin pattern disposed on a portion of the protective layer in the peripheral region, the protective layer being further located in the second resin pattern And the first substrate;
  • the sealant is in contact with the remaining protective layer in the peripheral region where the second resin pattern is not disposed.
  • the first resin pattern and the second resin pattern are disposed in the same layer.
  • the material of the protective layer is silicon nitride.
  • the display panel further includes a gate driving circuit, wherein:
  • the gate driving circuit is located in the peripheral area,
  • the metal pattern and the gate driving circuit are formed on the same layer, and
  • the protective layer is over the gate drive circuit.
  • the display panel further includes a via hole disposed through the protective layer and the first resin pattern to reach the metal pattern and expose a portion of the metal pattern.
  • a display device including the above display panel is provided.
  • a method of manufacturing a display panel comprising:
  • Forming a display substrate wherein the display substrate is divided into a display area and a peripheral area located around the display area, and the display substrate comprises:
  • a protective layer located in the display region and the peripheral region and formed between the first resin pattern and the metal pattern;
  • the display substrate and the opposite substrate are disposed opposite to each other and a sealant is disposed between the two, the sealant is located in the peripheral region, and the sealant is at least and a portion of the peripheral region Protective layer contact.
  • preparing the display substrate comprises:
  • a first resin pattern is formed on the protective layer.
  • preparing the display substrate further comprises: forming a gate driving circuit on the first substrate, wherein:
  • the gate driving circuit is located in the peripheral area,
  • the metal pattern and the gate driving circuit are formed on the same layer, and
  • the protective layer is formed over the gate drive circuit.
  • the forming the first resin pattern on the protective layer comprises:
  • the resin portion retention region corresponds to a protective layer of the peripheral region.
  • the sealant is formed over the entire protective layer in the peripheral region.
  • thinning the resin completely remaining region further includes forming a second resin pattern, the second resin pattern being located at a partial position in the peripheral region, the resin complete retention region further corresponding to the The second resin pattern, the resin portion remaining region corresponding to a partial protective layer in the peripheral region where the second resin pattern is not formed.
  • the sealant is formed over the portion of the protective layer in the peripheral region and above the second resin pattern.
  • FIG. 1 is a schematic structural view of a display panel according to an embodiment of the invention.
  • FIG. 2 is a schematic structural view of a display panel according to an embodiment of the invention.
  • FIG. 3 is a flow chart of a method of manufacturing a display panel according to an embodiment of the invention.
  • FIG. 4a is a schematic view of forming a protective layer in accordance with an embodiment of the present invention.
  • 4b is a schematic view of forming a resin material layer according to an embodiment of the present invention.
  • 4c is a schematic view showing exposure of a resin material layer according to an embodiment of the present invention.
  • 4d is a schematic view of developing an exposure pattern according to an embodiment of the present invention.
  • 4e is a schematic view of forming a via hole according to an embodiment of the present invention.
  • 4f is a schematic view of forming a first resin pattern in accordance with an embodiment of the present invention.
  • a resin layer as a mask may be provided on the protective layer to provide full coverage of the resin layer to the display region and the peripheral region.
  • a sealant is required in the peripheral region. Since the resin layer is provided in the peripheral region, the sealant can only be in contact with the resin layer, so that the peeling of the sealant from the array substrate is liable to occur.
  • FIG. 1 is a schematic structural diagram of a display panel according to an embodiment of the invention.
  • the display panel includes a oppositely disposed opposite substrate and a display substrate, and a sealant 4 is disposed between the display substrate and the opposite substrate, and the display substrate can be divided into a display area and a periphery around the display area. region.
  • the display substrate may include a first base substrate 1, a first resin pattern 3 on the first base substrate 1 in the display region, and a display region and a peripheral region and formed on the first resin pattern 3 and the first substrate Protective layer 2 between the substrates 1.
  • the sealant 4 is located in the peripheral region, and the sealant 4 is in contact with the protective layer 2 in the peripheral region.
  • the first resin pattern 3 is located only above the protective layer 2 in the display region, and is not disposed in the peripheral region. No resin pattern is provided on the protective layer 2 in the peripheral region, and all the protective layers 2 are exposed, so that the sealant 4 is in contact with all the protective layers 2 in the peripheral region.
  • the display substrate further includes a metal pattern 5 and a gate driving circuit 6 over the first substrate substrate 1, and the protective layer 2 is located over the metal pattern 5 and the gate driving circuit 6.
  • the metal pattern 5 is located in the display area, and the gate driving circuit 6 is located in the peripheral area.
  • the metal pattern 5 and the gate driving circuit 6 may be disposed in the same layer.
  • the display panel further includes a metal trace (not shown) connected to the gate driving circuit 6, the metal trace is located in the peripheral region, and the metal trace is located on the first substrate 1 and Between the protective layers 2.
  • the via hole 7 may be provided through the protective layer 2 and the first resin pattern 3, and the via hole 7 reaches the metal pattern 5 and exposes a part of the metal pattern 5.
  • an electrode pattern (not shown) may be disposed on the first resin pattern 3, and a part of the electrode pattern is located in the via hole 7 and is in contact with the exposed metal pattern 5, thereby realizing the electrode pattern and the metal.
  • the electrode pattern may be a pixel electrode, and the material of the pixel electrode may be indium tin oxide ITO.
  • the material of the protective layer 2 may be silicon nitride SiNx.
  • the bonding force between the sealant and the protective layer 2 of the material is strong, so that the bonding force between the sealant and the display substrate can be enhanced.
  • the display substrate is an array substrate
  • the opposite substrate is a color film substrate
  • the liquid crystal 9 may be disposed between the display substrate and the opposite substrate.
  • the opposite substrate may include the second substrate 10 and the black matrix 11 and the color resist on the side of the second substrate 10 close to the first substrate 1 , wherein the black matrix 11 is in color Between color resistance.
  • there may be a plurality of color resists for example, a red color resist R, a green color resist G, and a blue color resist G, which may be sequentially arranged.
  • the side of the second base substrate 10 remote from the first base substrate 1 may be provided with a back electrode 12.
  • the back electrode 12 may be made of a transparent conductive material such as ITO.
  • a side of the first base substrate 1 remote from the second base substrate 10 may be provided with a first polarizer 13 .
  • a side of the second base substrate 10 remote from the first base substrate 1 may be provided with a second polarizer 14 .
  • the second polarizer 14 may be located on a side of the back electrode 12 remote from the second substrate 10 .
  • the first resin pattern is located in the display area, and the sealant is in contact with the protective layer in the peripheral region, thereby preventing the sealant in the peripheral region from contacting only the resin layer, and enhancing The bonding force between the sealant and the display substrate greatly reduces the problem of the peeling of the sealant from the display substrate.
  • FIG. 2 is a schematic structural diagram of a display panel according to an embodiment of the invention.
  • the display substrate may further include a second resin pattern 8.
  • the second resin pattern 8 is located above a portion of the protective layer 2 in the peripheral region, and the protective layer 2 is located between the second resin pattern 8 and the first substrate substrate 1.
  • the sealant 4 is in contact with the remaining protective layer 2 in which the second resin pattern 8 is not disposed in the peripheral region.
  • the second resin pattern 8 is disposed on a portion of the protective layer 2 in the peripheral region, and no resin pattern is disposed on the remaining portion of the protective layer 2 of the peripheral portion, and the remaining portion of the protective layer 2 is exposed, so the sealant 4 The remaining protective layer 2 is in contact with the exposed portion in the peripheral region.
  • the second resin pattern 8 is located at a position close to the display area in the peripheral region, and the second resin pattern 8 is connected to the first resin pattern 3. In another embodiment, the second resin pattern 8 may also be located at other locations in the peripheral region, which are not enumerated here.
  • the first resin pattern 3 may be disposed in the same layer as the second resin pattern 8.
  • the first resin pattern is located in the display area
  • the second resin pattern is located at a partial position in the peripheral area
  • the portion of the sealant and the peripheral region where the second resin pattern is not disposed The contact of the protective layer avoids the contact between the sealant and the resin layer in the peripheral region, and enhances the bonding force between the sealant and the display substrate, thereby greatly reducing the problem that the sealant is peeled off from the array substrate.
  • Another embodiment of the present invention provides a display device including a display panel.
  • the display panel in this embodiment may be a display panel provided in the embodiment described with reference to FIG. 1 or FIG. 2 .
  • the display panel in this embodiment may be a display panel provided in the embodiment described with reference to FIG. 1 or FIG. 2 .
  • the first resin pattern is located in the display area, and the sealant is in contact with the protective layer in the peripheral region, thereby preventing the sealant in the peripheral region from contacting only the resin layer, and enhancing the seal.
  • the bonding force between the sealant and the display substrate greatly reduces the problem of peeling off the sealant from the display substrate.
  • FIG. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention. As shown in FIG. 3, the method includes the following steps.
  • a display substrate is prepared, and the display substrate may be divided into a display area and a peripheral area located around the display area, and the display substrate includes a first base substrate, a protective layer, and a first resin pattern.
  • the protective layer is located in the display region and the peripheral region and is formed between the first resin pattern and the first substrate, and the first resin pattern is located in the display region.
  • step 10 may further include step 101 of forming a protective layer on the first substrate.
  • FIG. 4a is a schematic diagram of forming a protective layer in accordance with an embodiment.
  • a protective layer 2 is formed on the first base substrate 1.
  • a metal pattern 5 and a gate driving circuit 6 are formed over the first substrate 1, and a protective layer 2 may be formed over the metal pattern 5 and the gate driving circuit 6.
  • the metal pattern 5 is located in the display region
  • the gate driving circuit 6 is located in the peripheral region
  • the metal pattern 5 and the gate driving circuit 6 may be formed in the same layer.
  • Step 10 may further include the step 102 of forming a first resin pattern on the protective layer.
  • Step 102 specifically includes:
  • a resin material layer is formed on the protective layer.
  • FIG. 4b is a schematic view of forming a layer of a resin material according to an embodiment. As shown in FIG. 4b, a resin material layer 15 is formed on the protective layer 2. In the present embodiment, the resin material layer 15 is formed of a photosensitive resin.
  • the resin material layer is exposed through a mask to form an exposure pattern, the exposure pattern including a resin removal region, a resin portion retention region, and a resin complete retention region, wherein the resin portion retention region includes a removable portion and retention section.
  • FIG. 4c is a schematic view of exposing a layer of a resin material according to an embodiment.
  • the resin material layer 15 is exposed through the masking plate 16 to form an exposure pattern including a resin removal region 151, a resin portion retention region 152, and a resin complete retention region 153.
  • the portion of the mask 16 corresponding to the peripheral region is a Half Tone Mask (HTM), and the halftone mask is used to form the resin portion retention region 152, and the rest of the mask 16 It is used to form the resin removal region 151 and the resin complete retention region 153.
  • HTM Half Tone Mask
  • the exposure pattern is developed to remove the removable portion of the resin removal region and the resin portion retention region.
  • Figure 4d is a schematic illustration of developing an exposure pattern in accordance with an embodiment. As shown in Fig. 4d, the exposure pattern is developed to remove the removable portions of the exposed resin removal region 151 and the resin portion retention region 152, leaving the unexposed portions of the uncompleted resin-completed region 153 and the resin portion-retained region 152. Reserved part.
  • the protective layer corresponding to the fully exposed resin removal region is etched to form via holes.
  • FIG. 4e is a schematic illustration of forming vias in accordance with an embodiment.
  • the protective layer 2 corresponding to the resin removal region 151 is etched to form via holes 7.
  • the remaining portion of the resin portion retention region 152 of the peripheral region ensures that the protective layer 2 located below it in the peripheral region is not etched away.
  • the resin removal region 151 corresponds to the via hole 7.
  • the remaining portion of the resin portion remaining region is removed by an ashing process to expose the protective layer located in the peripheral region, and the resin-retained region is thinned to form a first resin pattern.
  • FIG. 4f is a schematic view of forming a first resin pattern according to an embodiment.
  • the remaining portion of the resin portion remaining region 152 is removed by an ashing process to expose the protective layer 2 of the peripheral region, and the resin completely remaining region 153 is thinned to form the first resin pattern 3.
  • the resin complete retention region 153 corresponds to the first resin pattern 3
  • the resin portion retention region 152 corresponds to the protective layer 2 of the peripheral region.
  • the remaining portions of the resin-retained region 153 and the resin portion-retained region 152 are integrally thinned by the ashing process, so that the remaining portion of the resin portion-retained region 152 is completely removed, and the resin-completed region 153 is thinned.
  • the first resin pattern 3 is formed later.
  • the second resin pattern 8 may be formed by thinning the resin-retained region, the second resin pattern being located at a portion of the peripheral region, the resin The completely reserved region also corresponds to the second resin pattern, and the resin portion remaining region corresponds to a partial protective layer in the peripheral region where the second resin pattern is not formed.
  • step 102 may further include forming an electrode pattern (not shown) on the first resin pattern 3. A part of the electrode pattern is located in the via hole 7 and is in contact with the exposed metal pattern 5, thereby achieving connection of the electrode pattern with the metal pattern 5.
  • the method of manufacturing the display panel according to the embodiment further includes preparing the opposite substrate at step 20.
  • the manufacturing method of the display panel according to the embodiment further includes, at step 30, disposing the display substrate and the opposite substrate oppositely and providing a sealant between the sealant, the sealant is located in the peripheral region, the sealant and the peripheral region The protective layer in contact.
  • the sealant is formed over all of the protective layers in the peripheral region to contact all of the protective layers in the peripheral region.
  • a sealant is formed over the partial protective layer of the peripheral region where the second resin pattern is not formed and over the second resin pattern.
  • the manufacturing method of the display panel provided in this embodiment can be used to manufacture the display panel provided according to the embodiment described in FIG. 1.
  • the manufacturing method of the display panel provided in this embodiment can be used to manufacture the display panel provided according to the embodiment described in FIG. 1.
  • the display panel provided according to the embodiment described in FIG. 1.
  • the manufacturing method of the display panel provided by this embodiment can also be used to manufacture the display panel provided according to the embodiment described in FIG. 2, and the embodiment of FIG. 2 can be manufactured only by changing the structure of the mask according to the needs of the product structure.
  • the first resin pattern is located in the display area, and the sealant is in contact with the protective layer in the peripheral region, thereby preventing the sealant in the peripheral region from contacting only the resin layer.
  • the bonding force between the sealant and the display substrate is enhanced, thereby greatly reducing the problem that the sealant is peeled off from the display substrate.
  • the structure and process of the existing display substrate are less modified, and no additional manufacturing equipment and processes are required, thereby reducing manufacturing costs.

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Liquid Crystal (AREA)

Abstract

一种显示面板及其制造方法和显示装置。该显示面板包括相对设置的对置基板和显示基板，显示基板和对置基板之间设置有封框胶（4），显示基板上形成有显示区域和位于显示区域周边的周边区域，显示基板包括第一衬底基板（1）和位于第一衬底基板（1）上的保护层（2）和第一树脂图形（3），保护层（2）位于显示区域和周边区域中，第一树脂图形（3）位于显示区域中，保护层（2）位于第一树脂图形（3）和第一衬底基板（1）之间，封框胶（4）位于周边区域中，封框胶（4）和周边区域中的保护层（2）接触。

Description

显示面板及其制造方法和显示装置
相关申请的交叉引用
本申请要求于2017年3月21日提交至中国知识产权局的中国专利申请No.201710169527.0的优先权，其全部内容以引用的方式合并于此。
技术领域
本发明涉及显示技术领域，特别涉及显示面板及其制造方法和显示装置。
背景技术
随着显示技术的发展，液晶显示装置的应用越来越广泛。液晶显示装置可包括相对设置的阵列基板和彩膜基板。阵列基板可以划分为显示区域和位于显示区域周边的周边区域，周边区域中形成有栅极驱动电路(Gate On Array，简称：GOA)和与栅极驱动电路连接的金属走线，栅极驱动电路和金属走线之上设置有保护层。
发明内容
本发明提供一种显示面板及其制造方法和显示装置，用于减少封框胶容易从阵列基板上剥离的问题。
根据本发明的一个方面，提供了一种显示面板，包括：
对置基板；以及
显示基板，所述显示基板和所述对置基板相对设置并且两者之间设置有封框胶，所述显示基板划分为显示区域和位于所述显示区域周边的周边区域，其中，所述显示基板包括：
第一衬底基板；
金属图形，其形成于第一衬底基板上；
第一树脂图形，其位于所述显示区域中的所述金属图形上；以及
保护层，其位于所述显示区域和所述周边区域中并且形成于所述第一树脂图形和所述金属图形之间；以及
过孔，其设置为贯穿所述第一树脂图形和所述保护层以到达所述金属图形并暴露出部分金属图形，
并且其中，所述封框胶位于所述周边区域中，所述封框胶至少与所述周边区域中的部分保护层接触。
根据本发明的实施例，所述封框胶和所述周边区域中的全部保护层接触。
根据本发明的实施例，所述显示面板还包括第二树脂图形，所述第二树脂图形设置于所述周边区域中的部分保护层之上，所述保护层还位于所述第二树脂图形和所述第一衬底基板之间；并且
所述封框胶和所述周边区域中未设置所述第二树脂图形的其余部分保护层接触。
根据本发明的实施例，所述第一树脂图形和所述第二树脂图形同层设置。
根据本发明的实施例，所述保护层的材料为氮化硅。
根据本发明的实施例，所述显示面板还包括栅极驱动电路，其中：
所述栅极驱动电路位于所述周边区域中，
所述金属图形和所述栅极驱动电路形成在同一层，并且
所述保护层位于所述栅极驱动电路之上。
根据本发明的实施例，所述显示面板还包括过孔，所述过孔设置为贯穿所述保护层和所述第一树脂图形以到达所述金属图形并暴露出部分金属图形。
根据本发明的另一方面，提供了一种显示装置，该显示装置包括上述显示面板。
根据本发明的另一方面，提供了一种显示面板的制造方法，包括：
制备显示基板，其中，所述显示基板划分为显示区域和位于所述显示区域周边的周边区域，并且所述显示基板包括：
第一衬底基板，
金属图形，其形成于第一衬底基板上；
第一树脂图形，其位于所述显示区域中的所述金属图形上，以及
保护层，其位于所述显示区域和所述周边区域中并且形成于所述第一树脂图形和所述金属图形之间；以及
过孔，其设置为贯穿所述第一树脂图形和所述保护层以到达所述金属图形并暴露出部分金属图形，
制备对置基板；以及
将所述显示基板和所述对置基板相对设置并且在两者之间设置封框胶，所述封框胶位于所述周边区域中，所述封框胶至少和所述周边区域中的部分保护层接触。
根据本发明的实施例，制备显示基板包括：
在第一衬底基板上形成保护层；以及
在所述保护层上形成第一树脂图形。
根据本发明的实施例，制备显示基板还包括：在所述第一衬底基板上形成栅极驱动电路，其中：
所述栅极驱动电路位于所述周边区域中，
所述金属图形和所述栅极驱动电路形成在同一层，并且
在所述栅极驱动电路之上形成所述保护层。
根据本发明的实施例，所述在所述保护层上形成第一树脂图形包括：
在所述保护层上形成树脂材料层；
通过掩膜板对所述树脂材料层进行曝光形成曝光图形，所述曝光图形包括树脂去除区域、树脂部分保留区域和树脂完全保留区域，其中，所述树脂部分保留区域包括可去除部分和保留部分；
对曝光图形进行显影，去除树脂去除区域和树脂部分保留区域的可去除部分；
对树脂去除区域对应的保护层进行刻蚀以形成过孔；以及
去除树脂部分保留区域的保留部分以暴露出位于周边区域的保护层，并减薄所述树脂完全保留区域以形成所述第一树脂图形，所述树脂完全保留区域对应于所述第一树脂图形，所述树脂部分保留区域对应于所述周边区域的保护层。
根据本发明的实施例，所述封框胶形成于所述周边区域中的所述全部保护层之上。
根据本发明的实施例，减薄所述树脂完全保留区域还包括形成第二树脂图形，所述第二树脂图形位于所述周边区域中的部分位置，所述树脂完全保留区域还对应于所述第二树脂图形，所述树脂部分保留区域对应于所述周边区域中未形成有所述第二树脂图形的部分保护层。
根据本发明的实施例，所述封框胶形成于所述周边区域中的所述部分保护层之上以及所述第二树脂图形之上。
附图说明
图1为根据本发明实施例的一种显示面板的结构示意图；
图2为根据本发明实施例的一种显示面板的结构示意图；
图3为根据本发明实施例的一种显示面板的制造方法的流程图；
图4a为根据本发明实施例的形成保护层的示意图；
图4b为根据本发明实施例的形成树脂材料层的示意图；
图4c为根据本发明实施例的对树脂材料层进行曝光的示意图；
图4d为根据本发明实施例的对曝光图形进行显影的示意图；
图4e为根据本发明实施例的形成过孔的示意图；
图4f为根据本发明实施例的形成第一树脂图形的示意图。
具体实施方式
为使本领域的技术人员更好地理解本发明的技术方案，下面结合附图对本发明提供的显示面板及其制造方法和显示装置进行详细描述。
在阵列基板的制造过程中，需要利用掩膜对保护层进行刻蚀。为此，可在保护层上设置作为掩膜的树脂层，以对显示区域和周边区域进行树脂层全覆盖。在阵列基板和彩色基板对盒过程中，周边区域中需要设置封框胶。由于周边区域设置有树脂层，则封框胶仅能和树脂层接触，因此容易造成封框胶从阵列基板上剥离的不良现象。
图1为根据本发明实施例提供的一种显示面板的结构示意图。如图1 所示，该显示面板包括相对设置的对置基板和显示基板，显示基板和对置基板之间设置有封框胶4，该显示基板可以划分为显示区域和位于显示区域周边的周边区域。显示基板可以包括第一衬底基板1、位于显示区域中的第一衬底基板1上的第一树脂图形3以及位于显示区域和周边区域中并且形成于第一树脂图形3和第一衬底基板1之间的保护层2。封框胶4位于周边区域中，封框胶4和周边区域中的保护层2接触。
在实施例中，第一树脂图形3仅位于显示区域中的保护层2之上，未设置于周边区域中。周边区域中的保护层2之上未设置任何树脂图形，暴露出了全部保护层2，因此封框胶4和周边区域中的全部保护层2接触。
在实施例中，显示基板还包括位于第一衬底基板1之上的金属图形5和栅极驱动电路6，保护层2位于金属图形5和栅极驱动电路6之上。其中，金属图形5位于显示区域中，栅极驱动电路6位于周边区域中。在实施例中，金属图形5和栅极驱动电路6可以同层设置。在另一实施例中，显示面板还包括与栅极驱动电路6连接的金属走线(图中未示出)，该金属走线位于周边区域中，金属走线位于第一衬底基板1和保护层2之间。
在实施例中，可以贯穿保护层2和第一树脂图形3设置过孔7，过孔7到达金属图形5且暴露出部分金属图形5。在另一实施例中，第一树脂图形3之上还可以设置有电极图形(图中未示出)，部分电极图形位于过孔7并与暴露的金属图形5接触，从而实现电极图形与金属图形5的连接。在本实施例中，电极图形可以为像素电极，像素电极的材料可以为铟锡氧化物ITO。
在实施例中，保护层2的材料可以为氮化硅SiNx。封框胶和该种材料的保护层2之间的结合力较强，从而可以增强封框胶与显示基板之间的结合力。
在实施例中，显示基板为阵列基板，对置基板为彩膜基板，显示基板和对置基板之间还可以设置有液晶9。
在实施例中，对置基板可包括第二衬底基板10和位于第二衬底基板10的靠近第一衬底基板1一侧的黑矩阵11和彩色色阻，其中，黑矩阵11位于彩色色阻之间。在该实施例中，可以有多种彩色色阻，例如，红色色阻R、绿色色阻G和蓝色色阻G，该多种彩色色阻可以依次排列。
在实施例中，第二衬底基板10的远离第一衬底基板1的一侧可以设置有背电极12。背电极12的可以由透明导电材料(例如，ITO)制成。
在实施例中，第一衬底基板1的远离第二衬底基板10的一侧可以设置有第一偏光片13。
在实施例中，第二衬底基板10的远离第一衬底基板1的一侧可以设置有第二偏光片14。在本实施例中，第二偏光片14可以位于背电极12的远离第二衬底基板10的一侧。
在根据本实施例提供的显示面板的技术方案中，第一树脂图形位于显示区域中，封框胶和周边区域中的保护层接触，避免了周边区域中封框胶仅和树脂层接触，增强了封框胶与显示基板之间的结合力，从而极大的减少了封框胶从显示基板上剥离的不良现象。
图2为根据本发明实施例提供的一种显示面板的结构示意图。如图2所示，在该实施例中，显示基板还可以包括第二树脂图形8。第二树脂图形8位于周边区域中的部分保护层2之上，保护层2位于第二树脂图形8和第一衬底基板1之间。封框胶4和周边区域中未设置第二树脂图形8的其余部分保护层2接触。
在实施例中，周边区域中的部分保护层2上设置有第二树脂图形8，周边区域其余部分保护层2上未设置任何树脂图形，暴露出了其余部分保护层2，因此封框胶4在周边区域中和暴露出的其余部分保护层2接触。
在实施例中，第二树脂图形8位于周边区域中靠近显示区域的位置，第二树脂图形8和第一树脂图形3连接。在另一实施例中，第二树脂图形8还可以位于周边区域中的其它位置，此处不再一一列举。
在实施例中，第一树脂图形3可以和第二树脂图形8同层设置。
本实施例中对其余结构的描述可参见关于图一描述的实施例，此处不再赘述。
在根据本实施例提供的显示面板的技术方案中，第一树脂图形位于显示区域中，第二树脂图形位于周边区域中的部分位置，封框胶和周边区域中未设置第二树脂图形的部分保护层接触，避免了周边区域中封框胶仅和树脂层接触，增强了封框胶与显示基板之间的结合力，从而极大的减少了封框胶从阵列基板上剥离的不良现象。
本发明另一实施例提供了一种显示装置，该显示装置包括显示面板。
本实施例中的显示面板可采用关于图一或者关于图2描述的实施例提供的显示面板，具体描述可参见上述实施例，此处不再赘述。
本实施例提供的显示装置的技术方案中，第一树脂图形位于显示区域中，封框胶和周边区域中的保护层接触，避免了周边区域中封框胶仅和树脂层接触，增强了封框胶与显示基板之间的结合力，从而极大的减少了封框胶从显示基板上剥离的不良现象。
图3为根据本发明实施例提供的一种显示面板的制造方法的流程图，如图3所示，该方法包括如下步骤。
在步骤10，制备显示基板，所述显示基板可以划分为显示区域和位于所述显示区域周边的周边区域，所述显示基板包括第一衬底基板、保护层和第一树脂图形。所述保护层位于所述显示区域和所述周边区域中并且形成于所述第一树脂图形和所述第一衬底基板之间，所述第一树脂图形位于所述显示区域中。
在实施例中，步骤10还可包括步骤101，在第一衬底基板上形成保护层。
图4a为根据实施例的形成保护层的示意图。如图4a所示，在第一衬底基板1上形成保护层2。在实施例中，第一衬底基板1之上形成有金属图形5和栅极驱动电路6，可以在金属图形5和栅极驱动电路6之上形成保护层2。在实施例中，金属图形5位于所述显示区域中，栅极驱动电路6位于所述周边区域中，并且金属图形5和栅极驱动电路6可以形成在同一层。
步骤10还可包括步骤102，在保护层上形成第一树脂图形。
步骤102具体可包括：
在步骤1021处，在保护层上形成树脂材料层。
图4b为根据实施例的形成树脂材料层的示意图。如图4b所示，在保护层2上形成树脂材料层15。本实施例中，树脂材料层15由感光树脂形成。
在步骤1022处，通过掩膜板对树脂材料层进行曝光形成曝光图形，曝光图形包括树脂去除区域、树脂部分保留区域和树脂完全保留区域，其 中，所述树脂部分保留区域包括可去除部分和保留部分。
图4c为根据实施例的对树脂材料层进行曝光的示意图。如图4c所示，通过掩膜板16对树脂材料层15进行曝光形成曝光图形，该曝光图形包括树脂去除区域151、树脂部分保留区域152和树脂完全保留区域153。其中，掩膜板16中与周边区域对应的部分为半色调掩膜板(Half Tone Mask，简称：HTM)，半色调掩膜板用于形成树脂部分保留区域152，掩膜板16的其余部分用于形成树脂去除区域151和树脂完全保留区域153。
在步骤1023处，对曝光图形进行显影，去除树脂去除区域和树脂部分保留区域的可去除部分。
图4d为根据实施例的对曝光图形进行显影的示意图。如图4d所示，对曝光图形进行显影，去除曝光的树脂去除区域151和树脂部分保留区域152的可去除部分，保留未曝光的树脂完全保留区域153和树脂部分保留区域152的未曝光部分即保留部分。
在步骤1024处，对完全曝光的树脂去除区域对应的保护层进行刻蚀形成过孔。
图4e为根据实施例的形成过孔的示意图。如图4e所示，对树脂去除区域151对应的保护层2进行刻蚀形成过孔7。周边区域的树脂部分保留区域152的保留部分可保证周边区域中位于其下方的保护层2不被刻蚀掉。树脂去除区域151对应于过孔7。
在步骤1025处，通过灰化工艺去除树脂部分保留区域的保留部分以暴露出位于周边区域的保护层，并减薄所述树脂完全保留区域以形成第一树脂图形。
图4f为根据实施例的形成第一树脂图形的示意图。如图4f所示，通过灰化工艺去除树脂部分保留区域152的保留部分以暴露出周边区域的保护层2，并减薄所述树脂完全保留区域153以形成第一树脂图形3。其中，树脂完全保留区域153对应于第一树脂图形3，树脂部分保留区域152对应于周边区域的保护层2。
本步骤中，通过灰化工艺对树脂完全保留区域153和树脂部分保留区域152的保留部分进行整体减薄，使得树脂部分保留区域152的保留部分被完全去除，而树脂完全保留区域153被减薄后形成第一树脂图形3。
在根据本发明实施例的显示面板的制造方法中，减薄所述树脂完全保留区域还可以形成第二树脂图形8，所述第二树脂图形位于所述周边区域中的部分位置，所述树脂完全保留区域还对应于所述第二树脂图形，所述树脂部分保留区域对应于所述周边区域中未形成有所述第二树脂图形的部分保护层。
在实施例中，步骤102之后还可以包括在第一树脂图形3上形成电极图形(图中未示出)。部分电极图形位于过孔7并与暴露的金属图形5接触，从而实现电极图形与金属图形5的连接。
根据实施例的显示面板的制造方法还包括在步骤20处制备对置基板。
根据实施例的显示面板的制造方法还包括在步骤30处，将显示基板和对置基板相对设置并且在两者之间设置封框胶，封框胶位于周边区域中，封框胶和周边区域中的保护层接触。
在实施例中，封框胶形成于周边区域中的全部保护层之上以与周边区域中的全部保护层接触。
在另一实施例中，封框胶形成于所述周边区域中未形成有第二树脂图形的部分保护层之上以及第二树脂图形之上。
本实施例提供的显示面板的制造方法可用于制造根据图1描述的实施例提供的显示面板，对显示面板的具体描述可参见关于图1描述的实施例，此处不再赘述。
本实施例提供的显示面板的制造方法还可用于制造根据图2描述的实施例提供的显示面板，此时仅需根据产品结构的需要改变掩膜板的结构即可制造出图2的实施例中示出的显示面板。
本实施例提供的显示面板的制造方法的技术方案中，第一树脂图形位于显示区域中，封框胶和周边区域中的保护层接触，避免了周边区域中封框胶仅和树脂层接触，增强了封框胶与显示基板之间的结合力，从而极大的减少了封框胶从显示基板上剥离的不良现象。根据本实施例的技术方案对现有的显示基板的结构和工艺改动较小，无需额外增加制造设备和制程，从而降低了制造成本。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用 的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (13)

  1. 一种显示面板，包括：
    对置基板；以及
    显示基板，所述显示基板和所述对置基板相对设置并且两者之间设置有封框胶，所述显示基板划分为显示区域和位于所述显示区域周边的周边区域，其中，所述显示基板包括：
    第一衬底基板；
    金属图形，其形成于第一衬底基板上；
    第一树脂图形，其位于所述显示区域中的所述金属图形上；
    保护层，其位于所述显示区域和所述周边区域中并且形成于所述第一树脂图形和所述金属图形之间；以及
    过孔，其设置为贯穿所述第一树脂图形和所述保护层以到达所述金属图形并暴露出部分金属图形，
    并且其中，所述封框胶位于所述周边区域中，所述封框胶至少与所述周边区域中的部分保护层接触。
  2. 根据权利要求1所述的显示面板，其中，所述封框胶和所述周边区域中的全部保护层接触。
  3. 根据权利要求1所述的显示面板，还包括第二树脂图形，所述第二树脂图形设置于所述周边区域中的部分保护层之上，所述保护层还位于所述第二树脂图形和所述第一衬底基板之间；并且
    所述封框胶和所述周边区域中未设置所述第二树脂图形的其余部分保护层接触。
  4. 根据权利要求3所述的显示面板，其中，所述第一树脂图形和所述第二树脂图形同层设置。
  5. 根据权利要求1至4任一所述的显示面板，其中，所述保护层的 材料为氮化硅。
  6. 根据权利要求1所述的显示面板，还包括栅极驱动电路，其中：
    所述栅极驱动电路位于所述周边区域中，并且
    所述金属图形和所述栅极驱动电路形成在同一层；以及
    其中，所述保护层位于所述栅极驱动电路之上。
  7. 一种显示装置，包括权利要求1至6任一所述的显示面板。
  8. 一种显示面板的制造方法，包括：
    制备显示基板，其中，所述显示基板划分为显示区域和位于所述显示区域周边的周边区域，并且所述显示基板包括：
    第一衬底基板，
    金属图形，其形成于第一衬底基板上；
    第一树脂图形，其位于所述显示区域中的所述金属图形上，以及
    保护层，其位于所述显示区域和所述周边区域中并且形成于所述第一树脂图形和所述金属图形之间；以及
    过孔，其设置为贯穿所述第一树脂图形和所述保护层以到达所述金属图形并暴露出部分金属图形，
    制备对置基板；以及
    将所述显示基板和所述对置基板相对设置并且在两者之间设置封框胶，所述封框胶位于所述周边区域中，所述封框胶至少和所述周边区域中的部分保护层接触。
  9. 根据权利要求8所述的显示面板的制造方法，其中，制备显示基板还包括：在所述第一衬底基板上形成栅极驱动电路，其中：
    所述栅极驱动电路位于所述周边区域中，所述金属图形和所述栅极驱动电路形成在同一层；以及
    在所述栅极驱动电路之上形成所述保护层。
  10. 根据权利要求8所述的显示面板的制造方法，其中，形成所述第一树脂图形包括：
    在所述保护层上形成树脂材料层；
    通过掩膜板对所述树脂材料层进行曝光形成曝光图形，所述曝光图形包括树脂去除区域、树脂部分保留区域和树脂完全保留区域，其中，所述树脂部分保留区域包括可去除部分和保留部分；
    对所述曝光图形进行显影，去除所述树脂去除区域和所述树脂部分保留区域的所述可去除部分；
    对所述树脂去除区域对应的保护层进行刻蚀以形成过孔；以及
    去除所述树脂部分保留区域的所述保留部分以暴露出位于所述周边区域的保护层，并减薄所述树脂完全保留区域以形成所述第一树脂图形，所述树脂完全保留区域对应于所述第一树脂图形，所述树脂部分保留区域对应于所述周边区域的保护层。
  11. 根据权利要求8至10任一所述的显示面板的制造方法，其中，所述封框胶形成于所述周边区域中的所述全部保护层之上。
  12. 根据权利要求10所述的显示面板的制造方法，其中，减薄所述树脂完全保留区域还包括形成第二树脂图形，所述第二树脂图形位于所述周边区域中的部分位置，所述树脂完全保留区域还对应于所述第二树脂图形，所述树脂部分保留区域对应于所述周边区域中未形成有所述第二树脂图形的部分保护层。
  13. 根据权利要求12所述的显示面板的制造方法，其中，所述封框胶形成于所述周边区域中的所述部分保护层之上以及所述第二树脂图形之上。
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