WO2018161520A1 - 一种柔性模组及其制作方法 - Google Patents

一种柔性模组及其制作方法 Download PDF

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Publication number
WO2018161520A1
WO2018161520A1 PCT/CN2017/101726 CN2017101726W WO2018161520A1 WO 2018161520 A1 WO2018161520 A1 WO 2018161520A1 CN 2017101726 W CN2017101726 W CN 2017101726W WO 2018161520 A1 WO2018161520 A1 WO 2018161520A1
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WO
WIPO (PCT)
Prior art keywords
flexible panel
flexible
glue
panel
bending
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PCT/CN2017/101726
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English (en)
French (fr)
Inventor
李红
蔡宝鸣
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京东方科技集团股份有限公司
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Application filed by 京东方科技集团股份有限公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/760,401 priority Critical patent/US11169403B2/en
Priority to EP17847761.8A priority patent/EP3594928B1/en
Publication of WO2018161520A1 publication Critical patent/WO2018161520A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Definitions

  • This document relates to, but is not limited to, liquid crystal display technology, especially a flexible module manufacturing method and a flexible module.
  • a touch touch layer
  • a polarizer POL
  • a Panel flexible panel
  • a Bottom Film a base film, which is adhered to the panel by an OCA optical adhesive
  • the Panel can be bent at its COF end (the end of the external circuit, including the FPC flexible circuit board). Due to the stress problem between the Panel and the Bottom Film at the bend (Panel stress is uneven), it may not be completely bent. Problems such as folding or metal pad (metal traces or electrodes on the Panel) can damage the Panel.
  • the present invention provides a method for fabricating a backlight module.
  • the COF end of the Panel can be bent better, and there is no problem of uneven stress after bending, and COF does not occur.
  • the problem of insufficient bending of the end and breakage of the metal Pad is more practical.
  • a method for manufacturing a flexible module comprises: attaching a base film to a back surface of a flexible panel through an adhesive layer, at least removing a base film on a back surface of a bending portion of the flexible panel, and then bending The flexible panel is folded to bend the bending zone of the flexible panel to complete the fabrication of the flexible module.
  • the step of attaching the base film to the back surface of the flexible panel by the adhesive layer comprises: forming a low surface energy layer on the back surface of the bending region of the flexible panel, and then passing the base film through the first bonding adhesive Hanging on the back side of the flexible panel; wherein the first adhesive forms the adhesive layer; and the step of removing at least the base film on the back side of the bent portion of the flexible panel Included: removing the first adhesive and the base film on the back of the bend region of the flexible panel.
  • the step of forming a low surface energy layer on the back side of the bending region of the flexible panel, and bonding the base film to the back surface of the flexible panel through the first adhesive comprises:
  • the at least one flexible panel is cut on the PI substrate.
  • the low surface energy layer is a monomolecular film layer.
  • the step of attaching the base film to the back surface of the flexible panel through the adhesive layer comprises:
  • one of the A glue and the B glue is a gum, and the other is a hardener used in combination with the gum; the A glue and the B glue that are in contact with each other are cured to form the bonding layer;
  • the step of removing at least the base film on the back side of the bent portion of the flexible panel includes: removing the B glue and the base film on the back side of the bent portion of the flexible panel.
  • the step of coating the A glue on the back side of the non-bending area of the flexible panel, and bonding the base film to the back side of the flexible panel through the B glue comprises:
  • the at least one flexible panel is cut on the PI substrate.
  • the A glue layer formed by the A glue is a monomolecular film layer.
  • the adhesive layer is an adhesive layer formed by an optical adhesive
  • the manufacturing method of the flexible module further comprises: curing the optical adhesive
  • the present invention also provides a flexible module comprising: a flexible panel having a bent portion and a non-bending region; an adhesive layer; and a base film; wherein the adhesive layer bonds the base film to the On the back side of the non-bending region of the flexible panel, and the bonding layer and the base film have a cross section at the boundary between the bent portion and the non-bending region of the flexible panel.
  • the back surface of the bending region of the flexible panel has a low surface energy layer
  • the back side of the non-bending area of the flexible panel has a bonding layer formed by the first adhesive; or the non-bending area of the flexible panel has the bonding layer formed by curing the A glue and the B glue.
  • a non-bending area on the front surface of the flexible panel is provided with a touch layer, and the touch layer is provided with a polarizer.
  • the flexible module provided by the present invention removes at least the bottom film of the back surface of the bending portion of the flexible panel, and then bends the flexible panel to make the bending region of the flexible panel (ie, flexible)
  • the COF end of the panel is bent and deformed.
  • the bending zone of the flexible panel is balanced at various positions after bending.
  • the bending zone of the flexible panel does not appear to be completely bent or flexed after being bent due to uneven stress.
  • the metal pad breaks in the bending zone on the panel, and the COF end of the flexible panel is more easily folded back, which can better realize the narrow frame.
  • FIG. 1 is a schematic structural view of a flexible module according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural view of a flexible module according to another embodiment of the present invention.
  • FIG. 3 is a schematic structural view of a PI substrate according to the present invention, which includes nine panels.
  • the manufacturing method of the flexible module comprises: attaching the base film to the back surface of the flexible panel through the adhesive layer, removing at least the bottom film of the back surface of the bending portion 11 of the flexible panel, and bending the flexible panel to make the flexible
  • the bending region 11 of the panel is bent, so that the COF end of the flexible panel is bent to the back of the flexible panel, and the connected FPC flexible circuit board is placed on the back of the flexible panel to complete the fabrication of the flexible module.
  • the manufacturing method of the flexible module removes at least the bottom film of the back surface of the bending portion of the flexible panel, and then bends the flexible panel to make the bending region of the flexible panel (ie, the COF end of the flexible panel, After the bending of the FPC is completed, the bending zone of the flexible panel is not bound by the backboard at each position after the bending, and the stress is balanced. The bending zone of the flexible panel does not appear to be completely bent due to uneven stress during bending. After the bending, the metal pad of the bending zone on the flexible panel is broken, and the COF end of the flexible panel is more easily folded back, which can better realize the narrow frame.
  • the step of attaching the base film to the back surface of the flexible panel by the adhesive layer comprises:
  • the step of removing at least the base film on the back side of the bending region of the flexible panel includes:
  • the first adhesive and the base film on the back side of the bending region 11 of the flexible panel are removed.
  • the low surface energy layer (which may be coated with a low surface energy material) and the first The adhesiveness of the adhesive is poor, and it is more advantageous to remove the adhesive layer and the base film of the bending zone 11.
  • the low surface energy layer may be a self-forming monomolecular film layer in the bending region 11 of the flexible panel, and the monomolecular film layer has a hydrophobic functional group (such as a carbon nanotube film superhydrophobic material of a columnar structure array such as a lipid or a releasing agent). ).
  • a monomolecular film layer composed of perfluorododecanoic acid is deposited on the bending region 11 of the flexible panel, and a film having a low surface energy is obtained, the surface of which is completely covered by -CF3, and the surface has a super surface. Hydrophobic properties, the bonding layer formed with the first adhesive does not bond.
  • the thickness of the monomolecular film layer is small, and the area of the bending region 11 is also small, so that no trouble is caused, and the adhesion of the base film is not affected.
  • the base film may be directly bonded to the independent flexible panel through the adhesive layer; or may be bonded to the PI substrate 2 through the adhesive layer, and then the PI substrate 2 may be cut according to the flexible panel on the PI substrate 2 (eg, The PI substrate 2 has five, six, seven or nine equal numbers of flexible panels (as shown in FIG. 3, the PI substrate in FIG. 3 includes nine flexible panels), and five or six are cut out. 7 or 9 equal numbers of flexible panels), which can improve production efficiency, as follows:
  • the low surface energy layer is a monomolecular film layer
  • the back surface of the Panel corresponds to the back surface of the formed display device
  • the front surface of the Panel corresponds to the front surface of the formed display device
  • the front side of the Panel can be provided with a fingerprint identification structure and a display.
  • a structure such as a touch layer (TFT) and a polarizer (POL) are sequentially disposed on the front surface of the non-bending area 12 of the panel, such as a structure or a touch structure.
  • the base film is attached to the flexible layer by a bonding layer
  • the steps on the back of the panel include:
  • one of the A glue and the B glue is a gum, and the other is a hardener used in combination with the gum; the A glue and the B glue that are in contact with each other are cured to form the bonding layer;
  • the step of removing at least the base film on the back side of the bending region 11 of the flexible panel includes:
  • the above operation may be performed in a separate single panel, or the above operation may be performed on the PI substrate 2, which is within the scope of protection of the present application.
  • coating the A glue on the back side of the non-bending area 12 of the flexible panel, and bonding the base film to the back surface of the flexible panel through the B glue includes:
  • the A glue is coated on the back side of the non-bending area 12 of the at least one flexible panel of the PI substrate, and the base film is bonded to the back surface of the PI substrate through the B glue; the at least one flexible panel is cut on the PI substrate.
  • the A glue layer formed by the A glue is a monomolecular film layer
  • the front surface of the flexible panel may be provided with a fingerprint identification structure, a display structure or a touch structure, etc., for example, in the front side of the non-bending area 12 of the flexible panel.
  • Structures such as a touch layer (TFT) and a polarizer (POL).
  • One of the A glue and the B glue is the same glue, and the other is the hardener used in combination with the glue.
  • the two glues are mixed and hardened and bonded; and in the bending zone of the flexible panel, since only the B glue exists, There is no A glue, so in this case, the B glue itself will not cure and bond to form a bonding layer, and it is easy to remove the B glue.
  • AB glue with acrylic, epoxy, polyurethane and other ingredients Generally used is an acrylic modified epoxy or epoxy.
  • the A component is an acrylic modified epoxy or epoxy resin, or contains a catalyst and other auxiliaries
  • the B component is a modified amine or other hardener, or contains a catalyst and other auxiliaries.
  • the two are mixed in a certain proportion, the catalyst can control the curing time, and other additives can control properties such as viscosity, steel, flexibility, adhesion and the like.
  • the first adhesive is a kind of optical glue
  • the A glue and the B glue are also one kind of optical glue.
  • the adhesive layer is a bonding layer formed by an optical adhesive
  • the manufacturing method of the flexible module further comprises: curing and curing the optical adhesive so that the back film and the flexible panel are more firmly attached on the back surface, and can be removed.
  • the base film on the back of the bend zone is made before or after the base film.
  • the flexible module provided by the present invention comprises: a panel having a bent portion 11 and a non-bending portion 12; and a bonding layer for bonding Bottom Film to the non-bending region of the Panel On the back side of the 12, the bonding layer and the Bottom Film have a section 3 at the boundary between the bending portion 11 and the non-bending portion 12 of the Panel (i.e., a section 3 structure formed after cutting); and Bottom Film.
  • the bending region 11 of the panel has no Bottom Film and a bonding layer, which is not only convenient for bending, but also has a more uniform stress in the bending region 11 after bending, and the metal pad of the bending portion 11 on the Panel does not have problems such as cracking.
  • the non-bending area 12 includes two parts, and the two parts of the non-bending area 12 are located on both sides of the bending area 11 , and the two parts of the non-bending area 12 are provided with a bonding layer and a bottom.
  • the film (the base film may be attached together or may be bonded together); or: as shown in FIG.
  • the non-bending area 12 includes two parts, and the two-part non-bending area 12 is located in the bending area 11 On both sides, the non-bending area folded along with the bending zone 11 is not provided with a base film and a bonding layer, and is folded on the bottom film of the other non-bending area after the folding (for example, bonding The base film on the back of the other non-bending zone) shares the base film.
  • the bend region 11 of the panel (the gray region in FIG. 3 is only for better display of the location of the bend region 11) has a low surface energy layer, the back of the non-bent region 12 of the flexible panel
  • the adhesive layer formed with the first adhesive; or the non-bending region 12 of the panel has a bonding layer formed by curing the A adhesive layer and the B adhesive layer.
  • the OCA and the Bottom Film are located on a back surface of the Panel, and a front surface of the Panel may be provided with a fingerprint identification structure, a display structure or a touch structure, etc., such as on the non-bending area 12 of the front surface of the Panel.
  • a touch layer on which a polarizer is compounded.
  • Touch is the touch layer
  • POL is the polarizer
  • Bottom Film is the base film.
  • OCA is an optical glue
  • Panel is a flexible panel
  • FPC is a flexible circuit board
  • metal pad is a metal trace or an electrode.
  • the method for manufacturing the flexible module removes at least the bottom film of the back surface of the bending portion of the flexible panel, and then bends the flexible panel to make the bending region of the flexible panel (ie, the flexible panel)
  • the COF end is bent and deformed.
  • the bending zone of the flexible panel is balanced at various positions after bending.
  • the bending zone of the flexible panel does not appear due to uneven stress during bending, and cannot be completely bent or bent on the flexible panel.
  • the phenomenon of metal Pad breakage in the bending zone, the COF end of the flexible panel is more easily folded back completely, and the narrow bezel can be better realized.
  • connection may be a fixed connection, a detachable connection, or an integral connection. They can be directly connected or indirectly connected through an intermediate medium.
  • connecting may be a fixed connection, a detachable connection, or an integral connection. They can be directly connected or indirectly connected through an intermediate medium.
  • specific meanings of the above terms herein may be understood on a case-by-case basis.

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Abstract

一种柔性模组及其制作方法，柔性模组的制作方法包括：通过粘结层将底膜贴覆在柔性面板的背面，至少去除柔性面板的弯折区（11）的背面的底膜，再弯折柔性面板、使得柔性面板的弯折区（11）发生弯曲以完成柔性模组的制作。柔性模组的制作方法，至少去除了柔性面板的弯折区（11）的背面的底膜，再弯折柔性面板，使得柔性面板的弯折区（11）弯曲变形，柔性面板的弯折区（11）在弯折后各位置无底膜的束缚而应力均衡，柔性面板的弯折区（11）在弯折时不会因应力不均而出现不能完全弯折或弯折后柔性面板上弯折区（11）的金属Pad断裂等现象，柔性面板的COF端更容易完全背折，可更好地实现液晶显示设备的窄边框。

Description

一种柔性模组及其制作方法 技术领域
本文涉及但不限于液晶显示技术，尤指一种柔性模组的制作方法和一种柔性模组。
背景技术
在柔性AMOLED显示器中，Touch(触摸层)、偏光片(POL)、Panel(柔性面板)、Bottom Film(底膜，通过OCA光学胶粘附在Panel上)等贴合在一起，为实现窄边框，可将Panel在其COF端(连接外部电路的一端，包括FPC柔性线路板)进行弯折，由于弯折处的Panel与Bottom Film间存在应力问题(Panel应力不均)，会出现不能完全弯折或金属Pad(Panel上的金属走线或电极)断裂等问题，会损坏Panel。
发明内容
为了解决上述技术问题中的至少之一，本文提供了一种背光模组的制作方法，Panel的COF端可更好地进行弯折，且弯折后不存在应力不均问题，不会出现COF端弯折度不足以及金属Pad断裂等的问题，其实用性更好。
为了达到本文目的，本文提供了一种柔性模组的制作方法，包括：通过粘结层将底膜贴覆在柔性面板的背面，至少去除柔性面板的弯折区的背面的底膜，再弯折柔性面板、使得柔性面板的弯折区发生弯曲以完成柔性模组的制作。
可选地，所述通过粘结层将底膜贴覆在柔性面板的背面的步骤包括：在柔性面板的弯折区的背面形成低表面能层，再将底膜通过第一粘结胶粘结在柔性面板的背面上；其中，所述第一粘结胶形成所述粘结层；所述至少去除柔性面板的弯折区背面的底膜的步骤包 括：去除柔性面板的弯折区背面的第一粘接胶和底膜。
可选地，在柔性面板的弯折区的背面形成低表面能层，再将底膜通过第一粘结胶粘结在柔性面板的背面上的步骤包括：
在PI基板的至少一个柔性面板的弯折区的背面形成低表面能层，再将底膜通过第一粘结胶粘结在PI基板的背面上；
在PI基板上裁剪所述至少一个柔性面板。
可选地，所述低表面能层为单分子膜层。
可选地，所述通过粘结层将底膜贴覆在柔性面板的背面的步骤包括：
在柔性面板的非弯折区的背面涂覆A胶，再将底膜通过B胶粘结在柔性面板的背面上；
其中，A胶和B胶中的一个为本胶、另一个为与所述本胶配合使用的硬化剂，相接触的所述A胶和所述B胶固化形成所述粘结层；所述至少去除柔性面板的弯折区背面的底膜的步骤包括：去除柔性面板的弯折区背面的B胶和底膜。
可选地，在柔性面板的非弯折区的背面涂覆A胶，再将底膜通过B胶粘结在柔性面板的背面上的步骤包括：
在PI基板的至少一个柔性面板的非弯折区的背面涂覆A胶，再将底膜通过B胶粘结在PI基板的背面上；
在PI基板上裁剪所述至少一个柔性面板。
可选地，所述A胶形成的A胶层为单分子膜层。
可选地，所述粘结层为光学胶形成的粘结层，所述柔性模组的制作方法还包括：对所述光学胶进行固化。
本发明还提供了一种柔性模组，包括：柔性面板，其上具有弯折区和非弯折区；粘结层；和底膜；其中，所述粘结层粘结底膜于所述柔性面板的非弯折区的背面上，且所述粘结层和所述底膜在所述柔性面板的弯折区和非弯折区的交界处具有断面。
可选地，所述柔性面板的弯折区的背面具有低表面能层，所述 柔性面板的非弯折区的背面具有第一粘结胶形成的粘结层；或所述柔性面板的非弯折区具有所述A胶和所述B胶固化形成的所述粘结层。
可选地，所述柔性面板的正面的非弯折区上设置有触摸层，所述触摸层上设置有偏光片。
与现有技术相比，本发明提供的柔性模组的制作方法，至少去除了柔性面板的弯折区的背面的底膜，再弯折柔性面板，使得柔性面板的弯折区(即：柔性面板的COF端)弯曲变形，柔性面板的弯折区在弯折后各位置应力均衡，柔性面板的弯折区在弯折时不会因应力不均而出现不能完全弯折或弯折后柔性面板上弯折区的金属Pad断裂等现象，柔性面板的COF端更容易完全背折，可更好地实现窄边框。
本文的其它特征和优点将在随后的说明书中阐述，并且，部分地从说明书中变得显而易见，或者通过实施本文而了解。本文的目的和其他优点可通过在说明书、权利要求书以及附图中所特别指出的结构来实现和获得。
附图说明
附图用来提供对本文技术方案的进一步理解，并且构成说明书的一部分，与本申请的实施例一起用于解释本文的技术方案，并不构成对本文技术方案的限制。
图1为本发明一个实施例所述的柔性模组的结构示意图；
图2为本发明另一个实施例所述的柔性模组的结构示意图；
图3为本发明中的PI基板的结构示意图，其上包括有9个Panel。
其中，图1至图3中附图标记与部件名称之间的对应关系为：
11弯折区，12非弯折区，2PI基板，3断面。
具体实施方式
为使本文的目的、技术方案和优点更加清楚明白，下文中将结合附图对本文的实施例进行详细说明。需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互任意组合。
在下面的描述中阐述了很多具体细节以便于充分理解本文，但是，本文还可以采用其他不同于在此描述的方式来实施，因此，本文的保护范围并不受下面公开的具体实施例的限制。
下面结合附图描述本文一些实施例的柔性模组及其制作方法。
本文提供的柔性模组的制作方法，包括：通过粘结层将底膜贴覆在柔性面板的背面，至少去除柔性面板的弯折区11的背面的底膜，再弯折柔性面板、使得柔性面板的弯折区11发生弯曲，使得柔性面板的COF端弯折到柔性面板的背面，即将连接的FPC柔性线路板置于柔性面板背面，以完成柔性模组的制作。
本发明提供的柔性模组的制作方法，至少去除了柔性面板的弯折区的背面的底膜，再弯折柔性面板，使得柔性面板的弯折区(即：柔性面板的COF端，用来完成FPC的bonding)弯曲，柔性面板的弯折区在弯折后各位置没有背板束缚而应力均衡，柔性面板的弯折区在弯折时不会因应力不均而出现不能完全弯折或弯折后柔性面板上弯折区的金属Pad断裂等现象，柔性面板的COF端更容易完全背折，可更好地实现窄边框。
本发明的一个具体实施例中，所述通过粘结层将底膜贴覆在柔性面板的背面的步骤包括：
在柔性面板的弯折区11的背面形成低表面能层，再将底膜通过第一粘结胶粘结在柔性面板的背面上；其中，所述第一粘结胶形成所述粘结层；所述至少去除柔性面板的弯折区背面的底膜的步骤包括：
去除柔性面板的弯折区11背面的第一粘接胶和底膜。
其中，低表面能层(可以是由低表面能材料涂覆而成的)与第一 粘结胶的粘结力较差，更有利于去除弯折区11的粘结层和底膜。
低表面能层可以是在柔性面板的弯折区11自主形成单分子膜层，此单分子膜层具有疏水性官能团(如脂类、脱模剂等柱状结构阵列的碳纳米管膜超疏水材料)。具体可以是在柔性面板的弯折区11上沉积一层由全氟十二烷酸组成的单分子膜层，获得了具有低表面能的膜，其表面完全由-CF3铺满，表面具有超疏水性能，与第一粘结胶形成的粘结层不会进行粘结。
而且，此单分子膜层的厚度很小、弯折区11面积也很小，因此不会引起断差，不会对底膜的贴合造成影响。
底膜可以是通过粘结层直接粘结在独立的柔性面板上；也可以是通过粘结层粘结在PI基板2上，然后根据PI基板2上的柔性面板对PI基板2进行裁剪(如PI基板2上具有5个、6个、7个或9个等数量的柔性面板(如图3所示，图3中的PI基板包括9个柔性面板)，则裁剪出5个、6个、7个或9个等数量的柔性面板)，这样可提升生产效率，具体方法如下，包括：
在PI基板2的至少一个Panel的弯折区11的背面涂覆形成低表面能层，再将Bottom Film通过第一粘结胶粘结在PI基板2的背面上；
在PI基板2上裁剪所述至少一个Panel；
去除所述至少一个Panel的弯折区11的背面的粘结层和Bottom Film，再弯折所述至少一个Panel、使得所述至少一个Panel的弯折区11发生弯曲变形，以完成至少一个柔性模组的制作。
可选地，低表面能层为单分子膜层，Panel的背面对应于制作成的显示设备的背面，Panel的正面对应于制作成的显示设备的正面，Panel的正面可设置指纹识别结构、显示结构或触摸结构等，如在Panel的非弯折区12的正面依次设置触摸层(Touch)和偏光片(POL)等结构。
本发明的另一个实施例中，所述通过粘结层将底膜贴覆在柔性 面板的背面的步骤包括：
在柔性面板的非弯折区12的背面涂覆A胶，再将底膜通过B胶粘结在柔性面板的背面上；
其中，A胶和B胶中的一个为本胶、另一个为与所述本胶配合使用的硬化剂，相接触的所述A胶和所述B胶固化形成所述粘结层；所述至少去除柔性面板的弯折区11背面的底膜的步骤包括：
去除柔性面板的弯折区11背面的B胶和底膜。
与上一实施例同理，可以在独立的单个Panel进行上述操作，也可以是在PI基板2上进行上述操作，均应属于本申请的保护范围内。
具体地，在柔性面板的非弯折区12的背面涂覆A胶，再将底膜通过B胶粘结在柔性面板的背面上包括：
在PI基板的至少一个柔性面板的非弯折区12的背面涂覆A胶，再将底膜通过B胶粘结在PI基板的背面上；在PI基板上裁剪所述至少一个柔性面板。
可选地，所述A胶形成的A胶层为单分子膜层，柔性面板的正面可设置指纹识别结构、显示结构或触摸结构等，如在柔性面板的非弯折区12的正面依次设置触摸层(Touch)和偏光片(POL)等结构。
A胶和B胶中的一个为本胶、另一个为与所述本胶配合使用的硬化剂，两种胶混合后硬化粘结；而在柔性面板的弯折区，因仅存在B胶，并没有A胶，故这种情况下B胶自身并不会固化粘结形成粘结层，很容易去除B胶。
有丙烯酸、环氧、聚氨酯等成分的AB胶。通常使用的是指丙烯酸改性环氧胶或环氧胶。A组分是丙烯酸改性环氧或环氧树脂，或含有催化剂及其他助剂，B组分是改性胺或其他硬化剂，或含有催化剂及其他助剂。二者按一定比例混合，催化剂可以控制固化时间，其他助剂可以控制如粘度、钢性、柔性、粘合性等性能。
第一粘结胶为光学胶的一种，A胶和B胶也为光学胶中的一种。所述粘结层为光学胶形成的粘结层，所述柔性模组的制作方法还包括：对所述光学胶进行固化固化使得所述底膜和柔性面板背面贴合更牢固，可以在去除弯折区背面的底膜之前或之后进行。
本发明提供的柔性模组，如图1和图2所示，包括：Panel，其上具有弯折区11和非弯折区12；粘结层，粘结Bottom Film于Panel的非弯折区12的背面上，粘结层和Bottom Film在Panel的弯折区11和非弯折区12的交界处具有断面3(即：裁切后形成的断面3结构)；和Bottom Film。
Panel的弯折区11无Bottom Film和粘结层，不仅方便于弯曲，而且弯折后弯折区11的应力也更均衡，Panel上弯折区11的金属Pad不会出现断裂等的问题。
具体可以是：如图1所示，非弯折区12包括两部分，两部分非弯折区12位于弯折区11的两侧，两部分非弯折区12均设置有粘结层和底膜(底膜可贴合在一起，也可以是粘结在一起)；也可以是：如图2所示，非弯折区12包括两部分，两部分非弯折区12位于弯折区11的两侧，随弯折区11一起翻折的非弯折区上不设置底膜和粘结层，在进行翻折后设置在另一个非弯折区背面的底膜上(如粘结在另一个非弯折区背面的底膜上)，共用底膜。
可选地，所述panel的弯折区11(图3中的灰色区域仅为更好地展示弯折区11的位置)具有低表面能层，所述柔性面板的非弯折区12的背面具有第一粘结胶形成的粘结层；或所述panel的非弯折区12具有A胶层和B胶层固化形成的粘结层。
可选地，所述OCA和所述Bottom Film位于所述Panel的背面上，所述Panel的正面可设置指纹识别结构、显示结构或触摸结构等，如在Panel的正面的非弯折区12上具有触摸层，所述触摸层上复合有偏光片。
其中，Touch为触摸层，POL为偏光片，Bottom Film为底膜， OCA为光学胶，Panel为柔性面板，FPC为柔性线路板，金属Pad为金属走线或电极。
综上所述，本发明提供的柔性模组的制作方法，至少去除了柔性面板的弯折区的背面的底膜，再弯折柔性面板，使得柔性面板的弯折区(即：柔性面板的COF端)弯曲变形，柔性面板的弯折区在弯折后各位置应力均衡，柔性面板的弯折区在弯折时不会因应力不均而出现不能完全弯折或弯折后柔性面板上弯折区的金属Pad断裂等现象，柔性面板的COF端更容易完全背折，可更好地实现窄边框。
在本文的描述中，术语“安装”、“相连”、“连接”、“固定”等均应做广义理解，例如，“连接”可以是固定连接，也可以是可拆卸连接，或一体地连接；可以是直接相连，也可以通过中间媒介间接相连。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本文中的具体含义。
在本说明书的描述中，术语“一个实施例”、“一些实施例”、“具体实施例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或特点包含于本文的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不一定指的是相同的实施例或实例。而且，描述的具体特征、结构、材料或特点可以在任何的一个或多个实施例或示例中以合适的方式结合。
虽然本文所揭露的实施方式如上，但所述的内容仅为便于理解本文而采用的实施方式，并非用以限定本文。任何本文所属领域内的技术人员，在不脱离本文所揭露的精神和范围的前提下，可以在实施的形式及细节上进行任何的修改与变化，但本文的专利保护范围，仍须以所附的权利要求书所界定的范围为准。
本申请要求于2017年3月8日递交的中国专利申请第201710135802.7号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (12)

  1. 一种柔性模组的制作方法，包括：
    通过粘结层将底膜贴覆在柔性面板的背面；
    至少去除柔性面板的弯折区背面的底膜；以及
    弯折柔性面板，使得柔性面板的弯折区发生弯曲以完成柔性模组的制作。
  2. 根据权利要求1所述的柔性模组的制作方法，其中，
    所述通过粘结层将底膜贴覆在柔性面板的背面包括：
    在柔性面板的弯折区的背面形成低表面能层，再将底膜通过第一粘结胶粘结在柔性面板的背面上；
    其中，所述第一粘结胶形成所述粘结层；
    所述至少去除柔性面板的弯折区背面的底膜包括：
    去除柔性面板的弯折区背面的第一粘接胶和底膜。
  3. 根据权利要求2所述的柔性模组的制作方法，其中，
    在柔性面板的弯折区的背面形成低表面能层，以及将底膜通过第一粘结胶粘结在柔性面板的背面上包括：
    在PI基板的至少一个柔性面板的弯折区的背面形成低表面能层，以及将底膜通过第一粘结胶粘结在PI基板的背面上；
    在PI基板上裁剪所述至少一个柔性面板。
  4. 根据权利要求2所述的柔性模组的制作方法，其中，所述低表面能层为单分子膜层。
  5. 根据权利要求1-4中任一项所述的柔性模组的制作方法，其中，
    所述通过粘结层将底膜贴覆在柔性面板的背面包括：
    在柔性面板的非弯折区的背面涂覆A胶，以及将底膜通过B胶粘结在柔性面板的背面上；
    其中，A胶和B胶中的一个为本胶、另一个为与所述本胶配合使用的硬化剂，相接触的所述A胶和所述B胶固化形成所述粘结层；
    所述至少去除柔性面板的弯折区背面的底膜包括：
    去除柔性面板的弯折区背面的B胶和底膜。
  6. 根据权利要求5所述的柔性模组的制作方法，其中，
    在柔性面板的非弯折区的背面涂覆A胶，以及将底膜通过B胶粘结在柔性面板的背面上包括：
    在PI基板的至少一个柔性面板的非弯折区的背面涂覆A胶，以及将底膜通过B胶粘结在PI基板的背面上；
    在PI基板上裁剪所述至少一个柔性面板。
  7. 根据权利要求5所述的柔性模组的制作方法，其中，所述A胶形成的A胶层为单分子膜层。
  8. 根据权利要求1-7中任一项所述的柔性模组的制作方法，其中，所述粘结层为光学胶形成的粘结层，所述柔性模组的制作方法还包括：对所述光学胶进行固化。
  9. 一种柔性模组，包括：
    柔性面板，其上具有弯折区和非弯折区；
    粘结层；和
    底膜；
    其中，所述粘结层粘结底膜于所述柔性面板的非弯折区的背面上，且所述粘结层和所述底膜在所述柔性面板的弯折区和非弯折区的交界处具有断面。
  10. 根据权利要求9所述的柔性模组，其中，所述柔性面板的 弯折区的背面具有低表面能层，所述柔性面板的非弯折区的背面具有第一粘结胶形成的粘结层。
  11. 根据权利要求9所述的柔性模组，其中，所述柔性面板的非弯折区具有A胶和B胶固化形成的所述粘结层，其中A胶和B胶中的一个为本胶，另一个为与所述本胶配合使用的硬化剂，相接触的所述A胶和所述B胶固化形成所述粘结层。
  12. 根据权利要求9-11中任一项所述的柔性模组，其中，所述柔性面板的正面的非弯折区上设置有触摸层，所述触摸层上设置有偏光片。
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