WO2018153151A1 - 移载台、贴附装置及其贴附方法 - Google Patents

移载台、贴附装置及其贴附方法 Download PDF

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Publication number
WO2018153151A1
WO2018153151A1 PCT/CN2017/117205 CN2017117205W WO2018153151A1 WO 2018153151 A1 WO2018153151 A1 WO 2018153151A1 CN 2017117205 W CN2017117205 W CN 2017117205W WO 2018153151 A1 WO2018153151 A1 WO 2018153151A1
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WIPO (PCT)
Prior art keywords
stage
transfer
temperature
heating
sub
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/CN2017/117205
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English (en)
French (fr)
Inventor
郭国明
段晓然
赵长凯
李全悦
李向龙
何峰
邢远祥
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
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Publication of WO2018153151A1 publication Critical patent/WO2018153151A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133528—Polarisers

Definitions

  • Embodiments of the present disclosure relate to a transfer stage, an attachment device, and a method of attaching the same.
  • liquid crystal display has many advantages such as thin and light, low power consumption, no radiation and good display effect, and has been widely used.
  • a liquid crystal display panel includes two substrates disposed opposite to each other, a liquid crystal layer disposed between the two substrates, and polarizers disposed on the two substrates, respectively.
  • the liquid crystal display panel can change the deflection characteristics of the light through the liquid crystal layer, and cooperate with the polarizer disposed on the two substrates to realize the bright state and the dark state. Therefore, in the production of the liquid crystal display panel, it is necessary to transport not only the respective substrates (for example, glass substrates) of the liquid crystal display panel to pass through a plurality of processes, but also to attach a polarizer to each of the substrates to realize a display function.
  • At least one embodiment of the present disclosure provides a transfer station, an attachment device, and a method of attaching the same.
  • At least one embodiment of the present disclosure provides a transfer station including: a stage configured to carry a loaded object; a temperature sensor disposed on the stage and configured to sense a temperature of the stage; a heating device disposed on the stage and configured to heat a load carried on the stage; and a temperature controller communicatively coupled to the temperature sensor and the heating device and configured to The temperature sensed by the temperature sensor controls the power of the heating device.
  • the heating device includes a plurality of sub-heating devices configured to perform heating independently.
  • the plurality of sub-heating devices are partitioned on the stage.
  • the plurality of sub-heating devices are in the load Nested settings on the stage.
  • the shape of the stage includes a rectangle, and each of the plurality of sub-heating devices has an L-shape and is nested along a diagonal direction of the rectangle.
  • the stage includes a plurality of L-shaped grooves, and the plurality of sub-heating devices are disposed in the plurality of L-shaped grooves.
  • the temperature sensor includes a plurality of sub-temperature sensors configured to perform temperature detection independently.
  • the plurality of sub-temperature sensors are disposed in one-to-one correspondence with the plurality of sub-heating devices.
  • the heating device includes a heating wire and a thermally conductive insulating layer disposed at a periphery of the heating wire.
  • the temperature controller is configured to control the heating device such that the temperature of the stage ranges from 50 to 60 degrees.
  • a transfer station further includes: an adsorption device disposed on the stage and configured to fix the load bearing object.
  • a transfer station further includes a driving mechanism configured to drive the stage to move.
  • At least one embodiment of the present disclosure provides an attaching apparatus comprising: a first transfer stage, the first transfer stage comprising the transfer stage according to any one of the above, the first transfer stage
  • the carried object is an object to be attached.
  • the attaching apparatus further includes a second transfer stage; and a moving mechanism configured to move the first transfer stage and the second transfer At least one of the stages to move the first transfer stage and the second transfer stage relative to each other, the second transfer stage comprising: a stage configured to carry the carried object; and a temperature sensor disposed at The stage is configured to sense a temperature of the stage; a heating device disposed on the stage and configured to heat a load carried on the stage; and a temperature controller
  • the temperature sensor and the heating device are respectively communicably connected and configured to control the power of the heating device according to a temperature sensed by the temperature sensor, and the carried object of the second transplanting station is a patching material .
  • the second transfer stage includes the transfer stage according to any one of the above.
  • the object to be attached includes a display base. a plate, the attachment material comprising a polarizer.
  • the attaching device includes a first transfer stage, a second transfer stage, and a moving mechanism
  • the first transfer stage includes any one of the above
  • the carried object includes an object to be attached
  • the second transfer stage is configured to carry an attachment material
  • the moving mechanism is configured to move the first transfer stage and the Determining at least one of the second transfer stage to bring the first transfer stage and the second transfer stage close to each other
  • the attaching method comprising: heating the waiting using the heating device and the temperature sensor Attaching an object and controlling a temperature of the object to be attached; and moving at least one of the first transfer stage and the second transfer stage using the moving mechanism to cause the first transfer stage and The second transfer stages are brought close to each other to attach the attachment material to the object to be attached.
  • the heating device and the temperature sensor are used to control the temperature range of the object to be attached to be 50-60 degrees.
  • the attaching method of the attaching device includes: according to the to-be-attached
  • the size of the attached object adjusts the operating state of the plurality of sub-heaters.
  • FIG. 1 is a schematic structural diagram of a transfer station according to an embodiment of the present disclosure
  • FIG. 2 is a schematic structural diagram of another transfer station according to an embodiment of the present disclosure.
  • FIG. 3 is a connection diagram of a temperature controller in a transfer station according to an embodiment of the present disclosure
  • FIG. 4 is a schematic plan view of a transfer station according to an embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of another transfer station according to an embodiment of the present disclosure.
  • FIG. 6 is a schematic structural view of an AA area of the transfer stage of FIG. 5;
  • FIG. 7 is a schematic structural diagram of an attaching device according to an embodiment of the present disclosure.
  • FIG. 8 is a flowchart of a method for attaching an attachment device according to an embodiment of the present disclosure.
  • Embodiments of the present disclosure provide a transfer station, an attachment device, and a method of attaching the same.
  • the transfer station comprises a stage, a temperature sensor, a heating device and a temperature controller; the stage can carry the carried object; the temperature sensor is arranged on the stage and can sense the temperature of the stage; the heating device is arranged on the stage and The object is loaded on the heating stage; the temperature controller is separately communicatively coupled to the temperature sensor and the heating device and configured to control the power of the heating device based on the temperature sensed by the temperature sensor.
  • the transfer stage can greatly reduce the incidence of bubbles in the process of attaching the film layer or carrying out the film layer attaching process by heating the load-bearing object, for example, the substrate, thereby achieving the effect of defoaming. And without adding additional defoaming equipment, which can reduce costs and increase production efficiency.
  • An embodiment of the present disclosure provides a transfer station.
  • 1 is a perspective view of a transfer stage according to this embodiment.
  • the transfer station includes a stage 110, a temperature sensor 120, and a heating device 130;
  • the stage 110 is configured to carry a carrier, such as a substrate;
  • the temperature sensor 120 is disposed on the stage 110 for sensing the temperature of the stage 110,
  • the stage 110 carries a supported object, such as a substrate, it can also sense being The temperature of the carrier;
  • the heating device 130 is disposed on the stage 110 for heating the carried object carried on the stage 110.
  • the load bearing material such as the substrate
  • the load bearing material can be heated, thereby greatly reducing the incidence of bubbles during the process of attaching the film layer or carrying out the film layer attaching process, thereby achieving The effect of the bubble.
  • the transfer stage provided in this embodiment is used for attaching a polarizer on a substrate
  • the substrate heated by the transfer stage has a certain temperature (greater than room temperature).
  • the temperature for example, 50-60 degrees), makes it easier for the adhesive layer to adhere to the surface of the substrate, thereby greatly reducing the incidence of bubbles.
  • the substrate to which the polarizer is attached when used to transport a substrate to which a polarizer is attached, the substrate to which the polarizer is attached always has a certain temperature (greater than room temperature) during the transfer of the transfer stage.
  • the temperature for example, 50-60 degrees
  • the proximity and clamping of the transfer stage causes the substrate to which the polarizer is attached to be subjected to two transfer stages, and the substrate to which the polarizer is attached has a certain temperature (temperature greater than room temperature, for example, 50-60 degrees)
  • the pressure is applied to the two transfer stages so that the bubbles can be completely removed.
  • the transfer station provided by the embodiment does not need to add additional defoaming equipment, and the defoaming process can be completed in the process of attaching the film layer or carrying out the film attaching process, thereby reducing the cost and increasing the production efficiency. .
  • the transfer station provided by the example of the embodiment further includes: the adsorption device 160 is disposed on the stage 110 and can be mounted on the fixed stage 110 .
  • the adsorption device 160 may be a plurality of adsorption holes disposed on the bearing surface of the stage 110, and the carrier carried on the stage 110 is fixed by vacuum suction. Thereby, the use of consumables for adsorption can be reduced, and the surface of the object to be carried carried on the stage can be prevented from leaving marks.
  • Fig. 2 is a perspective view of another transfer stage according to this embodiment.
  • the transfer stage further includes a driving mechanism 190.
  • the driving mechanism 190 is fixedly disposed opposite to the stage 110 and can drive the stage 110 to move.
  • the drive mechanism can be a robot arm, a conveyor belt, a lead screw, or the like.
  • the transfer station provided by the example of the embodiment may further include a temperature controller.
  • Fig. 3 is a diagram showing the connection relationship of a temperature controller in a transfer stage according to this embodiment.
  • temperature controller 140 is in communication with temperature sensor 120 and heating device 130, respectively, to control the power of heating device 130 based on the temperature sensed by temperature sensor 120, thereby controlling the temperature on the stage.
  • the temperature on the control stage is controlled on the control stage. The temperature of the load being carried.
  • the above-described control of the power of the heating device includes not only adjusting the power of the heating device, but also including turning the heating device off and on.
  • the temperature controller may be disposed on the stage or not on the stage, and the embodiment of the present disclosure is not limited herein.
  • the temperature controller controls the heating device so that the temperature of the stage is 50-60 degrees, and the defoaming effect can be better.
  • the heating device may include a plurality of sub-heating devices, and the plurality of sub-heating devices may be independently heated.
  • the power and the heating range of the heating device can be flexibly controlled by providing a plurality of sub-heating devices, that is, the total power of the heating device can be controlled by turning a part of the sub-heating devices on or off, or by opening or closing a part.
  • the sub-heating device controls the heating range of the heating device on the stage, thereby improving energy utilization efficiency.
  • the reliability of the transfer stage can be improved by providing a plurality of sub-heating devices that can be independently heated, and can still operate normally when a part of the sub-heating devices fails.
  • FIG. 4 is a plan view of a transfer stage according to the present embodiment.
  • the heating device 130 can include three sub-heating devices 1301, 1302, and 1303.
  • the three sub-heating devices 1301, 1302, and 1303 are all disposed on the stage 110 and can be independently heated.
  • the plurality of sub-heating devices can be partitioned on the stage, that is, the stage can be divided into a plurality of areas, and each area is provided with a sub-heating device.
  • the energy can be reduced according to the size of the carried object carried on the stage, the different objects or different combinations of different places on the stage and the other sub-heaters in the area where no carrier is disposed can be disposed. Waste, improve energy utilization efficiency.
  • the stage 110 includes a plurality of heating regions 171, 172, and 173, and sub-heating devices 1301, 1302, and 1303 are disposed in the heating regions 171, 172, and 173, respectively.
  • the carried object when the load carried on the stage, for example, the size of the substrate is similar to or equal to the size of the heating area 171, the carried object may be disposed in the heating area 171 and the sub-heating devices 1302 and 1303 are closed, thereby The energy consumption of the transfer station can be reduced, and the energy utilization efficiency can be improved.
  • the load carried on the stage for example, the size of the substrate is similar or equal to the size of the heating area 172
  • the carried object can be placed in the heating area 172 and the sub-heating devices 1301 and 1303 can be closed, thereby reducing the The energy consumption of the transfer station increases the efficiency of energy utilization.
  • the carried object when the load carried on the stage, for example, the size of the substrate is similar or equal to the size of the heating area 173, the carried object can be placed in the heating area 173 and the sub-heating devices 1301 and 1302 can be closed, thereby The energy consumption of the transfer station can be reduced, and the energy utilization efficiency can be improved.
  • the carried object carried on the stage for example, the size of the substrate and the combination of different areas on the stage (for example, the area 171 and the area 172)
  • the energy consumption can be reduced by turning off the sub-heaters in other areas, and the energy utilization efficiency is increased.
  • embodiments of the present disclosure include, but are not limited to, the case where the transfer station described above includes three sub-heating devices, and the number of sub-heating devices can be set according to actual conditions.
  • FIG. 5 is a plan view of another transfer stage according to the present embodiment.
  • the heating device 130 can also include four sub-heating devices 1301, 1302, 1303, and 1304.
  • Four sub-heating devices 1301, 1302, 1303, and 1304 are disposed on the stage 110 and can be independently heated.
  • a plurality of sub-heating devices are nested on the stage, that is, the sub-heating device can be disposed in another sub-heating device.
  • the sub-heating device 1303 is disposed inside the area enclosed by the sub-heating device 1304, the sub-heating device 1302 is disposed inside the area surrounded by the sub-heating device 1302, and the sub-heating device 1301 is disposed in the sub-heating Within device 1302.
  • the four sub-heating devices 1301, 1302, 1303, and 1304 can be used for heating, thereby improving heating. Uniformity; and, when the load carried on the stage 110, for example, the size of the substrate is only close to or equal to the area enclosed by a sub-heating device, it can be lowered by closing the sub-heating device outside the area.
  • the energy consumption of the transfer station increases the efficiency of energy utilization.
  • the shape of the stage 110 may include a rectangle, and the shape of each of the sub-heating devices 1301, 1302, 1303, and 1304 may be L-shaped and nested along the diagonal direction of the rectangle.
  • the embodiments of the present disclosure include but are not limited thereto, and the shape of the stage may be other shapes, such as a circle, a hexagon, an octagon, etc.; the shape of each sub-heating device may also be a ring shape, a line shape, or the like.
  • the temperature sensor may also include a plurality of sub-temperature sensors, and the plurality of sub-temperature sensors may independently perform temperature detection.
  • the temperature of different positions on the stage can be sensed by the plurality of sub-temperature sensors, so that the temperature controller can improve the temperature uniformity of the entire stage by controlling the power at different positions on the stage of the heating device, thereby The defoaming effect of the stage can be improved, and on the other hand, various defects caused by temperature unevenness on the carrier can be avoided.
  • temperature sensor 120 can include four sub-temperature sensors 1201, 1202, 1203, and 1204.
  • the four sub-temperature sensors 1201, 1202, 1203, and 1204 may be disposed in one-to-one correspondence with the sub-heating devices 301, 1302, 1303, and 1304 so that the temperatures within the heating ranges of the sub-heating devices 301, 1302, 1303, and 1304 may be detected, respectively.
  • the sub-heating devices 1301, 1302, 1303, and 1304 are L-shaped, and the four sub-temperature sensors 1201, 1202, 1203, and 1204 are disposed at the sub-heating devices 1301, 1302, 1303, and 1304, respectively.
  • the corners of the shape are used to better detect the temperature within the heating range of the sub-heating devices 301, 1302, 1303, and 1304.
  • FIG. 6 is a perspective view of the AA area of the transfer stage shown in FIG. 5.
  • a groove 150 may be disposed on the stage 110 for accommodating the heating device 130.
  • the trench 160 can include a plurality of sub-trench, such as sub-grooves 1501, 1502, 1503, and 1504 to accommodate sub-heating devices 1301, 1302, 1303, and 1304, respectively.
  • the heating device 130 may include a heating wire 135 and a thermally conductive insulating layer 137 disposed on the periphery of the heating wire 135.
  • the material of the heating wire 135 includes a nickel-chromium alloy
  • the material of the thermally conductive insulating layer 137 includes a flexible mica plate.
  • the heating device can have a good heat conduction effect under the premise of ensuring safety.
  • the nickel-chromium alloy has the characteristics that the structure is not easily changed, the plasticity is good, the repair is easy, the non-magnetic property, the corrosion resistance is strong, and the service life is long, the heating device is more suitable for application in the manufacture of the display panel.
  • the attaching device includes a first transfer station 100.
  • the first transfer stage 100 includes a stage 110, a temperature sensor 120, and a heating device 130.
  • the stage 110 is used to carry an object to be attached, such as a substrate.
  • the temperature sensor 120 is disposed on the stage 110 for sensing the temperature of the stage 110.
  • the heating device 130 is configured.
  • the object to be carried on the stage 110 is heated; the object to be carried by the first table 100 is an object to be attached.
  • the attaching device further includes a second transfer stage; and a moving mechanism configured to move at least one of the first transfer stage and the second transfer stage to enable The first transfer stage and the second transfer stage move relative to each other, and the second transfer stage comprises: a stage configured to carry the carried object; a temperature sensor disposed on the stage and configured to sense the stage a heating device disposed on the stage and configured to carry the load carried on the heating stage; and a temperature controller communicatively coupled to the temperature sensor and the heating device and configured to be controlled according to the temperature sensed by the temperature sensor
  • the power of the heating device, and the load of the second transfer table is a patch material.
  • the attachment device includes a first transfer stage 100 and a second transfer stage 200, and a moving mechanism 300.
  • the first transfer stage 100 includes a stage 110, a temperature sensor 120, and a heating device 130.
  • the stage 110 is used to carry an object to be attached, such as a substrate.
  • the temperature sensor 120 is disposed on the stage 110 for sensing the stage 110.
  • the stage 110 when the stage 110 carries an object to be attached, such as a base When the board is used, the temperature of the object to be attached may also be sensed; the heating device 130 is disposed on the stage 110 for heating the carried object carried on the stage 110; the second transfer stage 200 may be equipped with the attached material;
  • the mechanism 300 can move at least one of the first transfer stage 100 and the second transfer stage 200 to move the first transfer stage 100 and the second transfer stage 200 relative to each other, for example, as shown in FIG. 7, the movement mechanism 300
  • the second transfer stage 200 is fixed relative to the second transfer stage 200 so as to move the second transfer stage 200 close to the first transfer stage 100.
  • embodiments of the present disclosure include but are not limited thereto, and the moving mechanism is also relatively fixed with the first transfer stage.
  • the first transfer stage can be moved.
  • the object to be attached for example, the substrate
  • the object to be attached may be heated by the first transfer stage, thereby greatly reducing the incidence of bubbles in the process of attaching the attached material to the object to be attached.
  • the substrate heated by the first transfer stage has a certain temperature (temperature greater than room temperature, For example, 50-60 degrees), so that the adhesive layer can be more easily adhered to the surface of the substrate, thereby greatly reducing the incidence of bubbles.
  • the substrate to which the polarizer is attached is subjected to the first transfer stage and the second transfer stage, and is attached with polarized light.
  • the substrate of the sheet has a certain temperature (temperature greater than room temperature, for example, 50-60 degrees) and is subjected to pressure by the first transfer stage and the second transfer stage, so that the bubbles can be completely removed. Therefore, the attaching device provided in the embodiment does not need to add an additional defoaming device, and the defoaming process can be completed in the process of attaching, thereby reducing the cost and increasing the production efficiency.
  • the first transfer stage in the attachment device provided by the first embodiment of the present embodiment may further include an adsorption device.
  • an adsorption device for the specific configuration and the beneficial effects, refer to the related description in the first embodiment, and details are not described herein again.
  • the first transfer station in the attachment device provided by the first embodiment of the present embodiment may further include a temperature controller.
  • a temperature controller for example, the specific configuration and the beneficial effects, refer to the related description in the first embodiment, and details are not described herein again.
  • the heating means may include a plurality of sub-heating means, and the plurality of sub-heating means may independently perform heating.
  • the plurality of sub-heating means may independently perform heating.
  • the temperature sensor may also include a plurality of sub-temperature sensors, and the plurality of sub-temperature sensors may independently perform temperature detection.
  • the plurality of sub-temperature sensors may independently perform temperature detection.
  • the heating device may include a heating wire and a heat conductive insulating layer disposed on the periphery of the heating wire, and the material of the heating wire includes a nickel-chromium alloy, a thermal conductive insulating layer. Materials include flexible mica boards. The specific settings and benefits can be seen in the implementation. The related description in the first example will not be repeated here.
  • the second transfer stage may have the same structure as the first transfer stage described in any of the above examples.
  • the second transfer stage can heat the attached material, so that during the attaching process, the attached material also has a certain temperature (temperature greater than room temperature, for example, 50-60 degrees), thereby further greatly reducing the air bubbles. The incidence of this, in order to achieve a better defoaming effect.
  • An embodiment of the present disclosure provides a method for attaching an attachment device.
  • the attachment device is the attachment device described in any of the above embodiments.
  • the attachment method includes the following steps S301-S302.
  • S301 Heating the object to be attached and controlling the temperature of the object to be attached using a heating device and a temperature sensor.
  • S302 Move at least one of the first transfer stage and the second transfer stage using a moving mechanism to bring the first transfer stage and the second transfer stage close to each other to attach the attachment material to the object to be attached.
  • the object to be attached for example, the substrate
  • the object to be attached may be heated by the first transfer stage, thereby greatly reducing the incidence of bubbles in the process of attaching the attached material to the object to be attached.
  • the substrate heated by the first transfer stage has a certain temperature (temperature greater than room temperature, For example, 50-60 degrees), so that the adhesive layer can be more easily adhered to the surface of the substrate, thereby greatly reducing the incidence of bubbles.
  • the substrate to which the polarizer is attached is subjected to the first transfer stage and the second transfer stage, and is attached with polarized light.
  • the substrate of the sheet has a certain temperature (temperature greater than room temperature, for example, 50-60 degrees) and is subjected to pressure by the first transfer stage and the second transfer stage, so that the bubbles can be completely removed. Therefore, the attaching method provided in the embodiment does not need to add an additional defoaming device, and the defoaming process can be completed in the process of attaching, thereby reducing the cost and increasing the production efficiency.
  • the temperature range of the object to be attached is controlled to be 50 to 60 degrees using the heating device and the temperature sensor. Thereby, a better defoaming effect can be obtained.
  • the attaching method when the plurality of sub-heating devices of the first transfer stage are partitioned on the stage, the attaching method further includes: according to the object to be attached
  • the size of the sub-heater is adjusted, for example, a part of the sub-heater is turned off to reduce the power consumption, and the energy utilization efficiency is improved.

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Abstract

一种移载台、贴附装置及其贴附方法，移载台包括：用于承载被承载物的载台(110)；设置在载台(110)上的温度传感器(120)；设置在载台(110)上的加热装置(130)；以及温度控制器(140)。温度传感器(120)可感测载台(110)的温度，加热装置(130)可加热载台(110)上承载的被承载物，温度控制器(140)、温度传感器(120)和加热装置(130)分别通信相连并可根据温度传感器(120)感测的温度来控制加热装置(130)的功率。

Description

移载台、贴附装置及其贴附方法
本申请要求于2017年02月22日递交的中国专利申请第201710097138.1号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及一种移载台、贴附装置及其贴附方法。
背景技术
随着显示技术的不断发展，液晶显示装置(Liquid Crystal Display，LCD)具有轻薄、低功耗、无辐射以及显示效果好等众多优点，得到了广泛的应用。通常，液晶显示面板包括相对设置的两块基板、设置在两块基板之间的液晶层、以及分别设置在两块基板上的偏光片。
液晶显示面板可通过液晶层改变光的偏转特性，并配合设置在两块基板上的偏光片以实现亮态和暗态。因此，在制作液晶显示面板时，不仅需要将液晶显示面板的各基板(例如，玻璃基板)进行搬运以经过多道工序，还需要对各基板贴附偏光片以实现显示功能。
发明内容
本公开至少一个实施例提供一种移载台、贴附装置及其贴附方法。
本公开至少一个实施例提供一种移载台，其包括：载台，被配置为承载被承载物；温度传感器，设置在所述载台上并被配置为感测所述载台的温度；加热装置，设置在所述载台上并被配置加热所述载台上承载的被承载物；以及温度控制器，与所述温度传感器和所述加热装置分别通信相连并被配置为根据所述温度传感器感测的温度来控制所述加热装置的功率。
例如，在本公开一实施例提供的移载台中，所述加热装置包括多个子加热装置，所述多个子加热装置被配置为独立进行加热。
例如，在本公开一实施例提供的移载台中，所述多个子加热装置在所述载台上分区设置。
例如，在本公开一实施例提供的移载台中，所述多个子加热装置在所述载 台上嵌套设置。
例如，在本公开一实施例提供的移载台中，所述载台的形状包括矩形，各所述多个子加热装置的形状为L形并沿所述矩形的对角线方向嵌套设置。
例如，在本公开一实施例提供的移载台中，所述载台包括多个L型沟槽，所述多个子加热装置设置在所述多个L型沟槽内。
例如，在本公开一实施例提供的移载台中，所述温度传感器包括多个子温度传感器，所述多个子温度传感器被配置为独立进行温度检测。
例如，在本公开一实施例提供的移载台中，所述多个子温度传感器与所述多个子加热装置一一对应设置。
例如，在本公开一实施例提供的移载台中，所述加热装置包括电热丝以及设置在所述电热丝外围的导热绝缘层。
例如，在本公开一实施例提供的移载台中，所述温度控制器被配置为控制所述加热装置以使所述载台的温度范围为50-60度。
例如，本公开一实施例提供的移载台还包括：吸附装置，设置在所述载台上并被配置为固定所述承载被承载物。
例如，本公开一实施例提供的移载台还包括：驱动机构，被配置为驱动所述载台移动。
本公开至少一个实施例提供一种贴附装置，其包括：第一移载台，所述第一移载台包括根据上述任一项所述的移载台，所述第一移栽台的所述被承载物为待贴附物体。
例如，在本公开一实施例提供的贴附装置中，所述贴附装置还包括第二移载台；以及移动机构，被配置为移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此相对运动，所述第二移载台包括：载台，被配置为承载被承载物；温度传感器，设置在所述载台上并被配置为感测所述载台的温度；加热装置，设置在所述载台上并被配置加热所述载台上承载的被承载物；以及温度控制器，与所述温度传感器和所述加热装置分别通信相连并被配置为根据所述温度传感器感测的温度来控制所述加热装置的功率，所述第二移栽台的所述被承载物为贴附材料。
例如，在本公开一实施例提供的贴附装置中，所述第二移载台包括根据上述任一项所述的移载台。
例如，在本公开一实施例提供的贴附装置中，所述待贴附物体包括显示基 板，所述贴附材料包括偏光片。
本公开至少一各实施例提供的贴附装置的贴附方法，所述贴附装置包括第一移载台、第二移载台以及移动机构，所述第一移载台包括上述任一项所述的移载台，所述被承载物包括待贴附物体，所述第二移载台被配置为搭载贴附材料，所述移动机构被配置为移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此靠近，所述贴附方法包括：使用所述加热装置和所述温度传感器加热所述待贴附物体并控制所述待贴附物体的温度；以及使用所述移动机构移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此靠近以将所述贴附材料贴附在所述待贴附物体上。
例如，在本发明一实施例提供的贴附装置的贴附方法中，使用所述加热装置和所述温度传感器控制所述待贴附物体的温度范围为50-60度。
例如，在本发明一实施例提供的贴附装置的贴附方法中，所述多个子加热装置在所述载台上分区并嵌套设置，所述贴附方法还包括：根据所述待贴附物体的尺寸调整所述多个子加热器的工作状态。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1为本公开一实施例提供的一种移载台的结构示意图；
图2为本公开一实施例提供的另一种移载台的结构示意图；
图3为本公开一实施例提供的一种移载台中温度控制器的连接关系图；
图4为本公开一实施例提供的一种移载台的平面示意图；
图5为本公开一实施例提供的另一种移载台的剖视示意图；
图6为图5中移载台的AA区域的结构示意图；
图7为本公开一实施例提供的一种贴附装置的结构示意图；以及
图8为本公开一实施例提供的一种贴附装置的贴附方法的流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开 实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。
在研究中，本申请的发明人发现：在显示装置的制备工艺中，需要使用移载台(搬送table)来将各种基板(例如，玻璃基板)在不同的加工单元进行搬运，以完成不同的加工工序。另一方面，在基板上贴附膜层时，例如，在阵列基板或彩膜基板上贴附偏光片时，不可避免地会产生各种气泡(例如，先端气泡或末端气泡)；因此，需要额外的脱泡设备来将上述的气泡去除，一方面导致成本的增加，另一方面还增加了工序，降低了生产效率。
本公开实施例提供一种移载台、贴附装置及其贴附方法。该移载台包括载台、温度传感器、加热装置以及温度控制器；载台可承载被承载物；温度传感器设置在载台上并可感测载台的温度；加热装置设置在载台上并被配置加热载台上承载的被承载物；温度控制器与温度传感器和加热装置分别通信相连并被配置为根据温度传感器感测的温度来控制加热装置的功率。由此，该移载台可通过对承载被承载物，例如基板进行加热，从而在贴附膜层或者搬运完成膜层贴附工艺的过程中大大降低气泡的发生率，从而达到脱泡的效果，并且不用增加额外的脱泡设备，从而可降低成本，增加生产效率。
下面结合附图对本公开实施例提供的移载台、贴附装置及其贴附方法进行说明。
本公开一实施例提供一种移载台。图1为根据该实施例的一种移载台的立体示意图。该移载台包括载台110、温度传感器120以及加热装置130；载台110用于承载被承载物，例如基板；温度传感器120设置在载台110上，用于感测载台110的温度，当载台110承载有被承载物，例如基板时，也可感测被 承载物的温度；加热装置130设置在载台110上，用于加热载台110上承载的被承载物。
在本实施例提供的移载台中，可通过对承载被承载物，例如基板进行加热，从而在贴附膜层或者搬运完成膜层贴附工艺的过程中大大降低气泡的发生率，从而达到脱泡的效果。例如，在本实施例提供的移载台用于在基板上贴附偏光片时，由于偏光片和基板通常通过胶层进行粘合，经过移载台加热的基板具有一定的温度(大于室温的温度，例如，50-60度)，从而可使胶层更加易于粘在基板的表面上，从而大大降低气泡的发生率。又例如，在本实施例提供的移载台用于搬运贴附有偏光片的基板时，在移载台进行搬运的整个过程中，贴附有偏光片的基板始终具有一定的温度(大于室温的温度，例如，50-60度)，同样可大大降低气泡的发生率；并且，当贴附有偏光片的基板从一个移载台转移到另一个移载台的过程中，可通过两个移载台的靠近和夹持，使得贴附有偏光片的基板受到两个移载台的作用，贴附有偏光片的基板具有一定的温度(大于室温的温度，例如，50-60度)并受到两个移载台的压力，从而可将气泡完全去除。由此，本实施例提供的移载台不用增加额外的脱泡设备，在贴附膜层或者搬运完成膜层贴附工艺的过程中便可完成脱泡工艺，从而可降低成本，增加生产效率。
例如，如图1所示，本实施例一示例提供的移载台还包括：吸附装置160吸附装置160设置在载台110上并可固定载台110上承载的被承载物。例如，吸附装置160可为设置在载台110承载面上的多个吸附孔，通过负压吸附来固定载台110上承载的被承载物。由此，既可减少用于吸附的耗材的使用，又可避免在载台上承载的被承载物的表面留下痕迹。
例如，图2为根据该实施例的另一种移载台的立体示意图。在本实施例一示例提供的移载台中，如图2所示，该移载台还包括驱动机构190，驱动机构190与载台110相对固定设置并可驱动载台110移动。例如，驱动机构可为机械臂、传送带、丝杠等。
例如，本实施例一示例提供的移载台还可包括温度控制器。图3为根据该实施例的一种移载台中温度控制器的连接关系图。如图3所示，温度控制器140与温度传感器120和加热装置130分别通信相连，从而根据温度传感器120感测的温度控制加热装置130的功率，从而控制载台上的温度。需要说明的是，当移载台承载有被承载物，例如基板时，控制载台上的温度即控制载台上承载 的被承载物的温度。另外，上述的控制加热装置的功率不仅包括调节加热装置功率的大小，也可包括关闭和开启加热装置。另外，温度控制器可设置在载台上，也可不设置在载台上，本公开实施例在此不作限制。
例如，在本实施例一示例提供的移载台中，温度控制器控制该加热装置以是载台的温度范围为50-60度，此时可具有较好的脱泡效果。
例如，在本实施例一示例提供的移载台中，加热装置可包括多个子加热装置，多个子加热装置可独立进行加热。由此，可通过设置多个子加热装置以灵活地控制加热装置的功率以及加热范围，也就是说，可以通过打开或关闭一部分子加热装置来控制加热装置总的功率，或者，通过打开或关闭一部分子加热装置来控制加热装置在载台上的加热范围，从而可提高能源的利用效率。另外，通过设置多个可独立进行加热的子加热装置还可提高该移载台的可靠性，在部分子加热装置故障时仍可正常工作。
例如，图4为根据本实施例的一种移载台的平面示意图。如图4所示，加热装置130可包括三个子加热装置1301、1302和1303。三个子加热装置1301、1302和1303均设置在载台110上并可独立进行加热。
例如，在本实施例一示例提供的移载台中，多个子加热装置在载台上可分区设置，也就是说，可将载台划分为多个区域，每个区域设置一个子加热装置。由此，可根据载台上承载的被承载物的尺寸将被承载物设置在载台上的不同区域或不同区域的组合并关闭其他没有设置被承载物的区域中的子加热器来减少能量的浪费，提高能量的利用效率。例如，如图4所示，载台110包括多个加热区域171、172和173，子加热装置1301、1302和1303分别设置在加热区域171、172和173中。此时，当载台上承载的被承载物，例如基板的尺寸与加热区域171的尺寸相近或相等时，可将该被承载物设置在加热区域171中并关闭子加热装置1302和1303，从而可降低该移载台的能耗，提高能量的利用效率。当载台上承载的被承载物，例如基板的尺寸与加热区域172的尺寸相近或相等时，可将该被承载物设置在加热区域172中并关闭子加热装置1301和1303，从而可降低该移载台的能耗，提高能量的利用效率。同样地，当载台上承载的被承载物，例如基板的尺寸与加热区域173的尺寸相近或相等时，可将该被承载物设置在加热区域173中并关闭子加热装置1301和1302，从而可降低该移载台的能耗，提高能量的利用效率。需要说明的是，当载台上承载的被承载物，例如基板的尺寸与载台上不同区域的组合(例如，区域171和区域172 的组合)的尺寸相近或相等时，也可通过关闭其他区域中的子加热器来减少能耗，增加能量的利用效率。另外，本公开实施例包括但不限于上面所描述的移载台包括三个子加热装置的情况，子加热装置的数量可根据实际情况进行设置。
例如，图5为根据本实施例的另一种移载台的平面示意图。如图5所示，加热装置130也可包括四个子加热装置1301、1302、1303和1304。四个子加热装置1301、1302、1303和1304均设置在载台110上并可独立进行加热。
例如，在本实施例一示例提供的移载台中，如图5所示，多个子加热装置在载台上嵌套设置，也就是说，子加热装置可设置在另一个子加热装置所围成的区域内部。例如，如图5所示，子加热装置1303设置在子加热装置1304所围成的区域内部，子加热装置1302设置在子加热装置1302所围成的区域内部，子加热装置1301设置在子加热装置1302内。由此，当载台110上承载的被承载物，例如基板的尺寸与载台的尺寸相近或相等时，可将四个子加热装置1301、1302、1303和1304都用于加热，从而可提高加热的均匀性；并且，当载台110上承载的被承载物，例如基板的尺寸仅与某一个子加热装置所围成的区域相近或相等时，可通过关闭该区域外的子加热装置来降低该移载台的能耗，提高能量的利用效率。
例如，如图5所示，载台110的形状可包括矩形，此时各子加热装置1301、1302、1303和1304的形状可为L形并沿该矩形的对角线方向嵌套设置。当然，本公开实施例包括但不限于此，载台的形状还可为其他形状，例如圆形、六边形、八边形等；各子加热装置的形状也可呈环形、折线形等。
例如，在本实施例一示例提供的移载台，温度传感器也可包括多个子温度传感器，多个子温度传感器可独立进行温度检测。由此，通过多个子温度传感器可感应到载台上不同位置的温度，从而可使温度控制器通过控制加热装置载台上不同位置的功率来提高整个载台上的温度均匀度，从而一方面可提高该载台的脱泡效果，另一方面还可避免载台上的被承载物因温度不均而导致的各种不良。
例如，如图5所示，温度传感器120可包括四个子温度传感器1201、1202、1203和1204。四个子温度传感器1201、1202、1203和1204可与子加热装置301、1302、1303和1304一一对应设置，从而可分别检测子加热装置301、1302、1303和1304的加热范围内的温度。
例如，如图5所示，子加热装置1301、1302、1303和1304的形状为L形，四个子温度传感器1201、1202、1203和1204分别设置在子加热装置1301、1302、1303和1304的L形的拐角处，从而更好地检测子加热装置301、1302、1303和1304的加热范围内的温度。
例如，图6为图5所示的移载台AA区域的立体示意图。如图6所示，载台110上可设置沟槽150，用于容置加热装置130。同样地，沟槽160可包括多个子沟槽，例如子沟槽1501、1502、1503和1504以分别容纳子加热装置1301、1302、1303和1304。
例如，如图6所示，加热装置130可包括电热丝135以及设置在电热丝135外围的导热绝缘层137，电热丝135的材料包括镍铬合金，导热绝缘层137的材料包括柔性云母板。由此，该加热装置可在保证安全性的前提下具有良好的导热效果。并且，由于镍铬合金具有结构不易改变，塑性较好，易修复、无磁性、耐腐蚀性强、使用寿命长等特点，该加热装置更适宜于应用在显示面板的制造中。
本公开一实施例提供一种贴附装置。如图7所示，该贴附装置包括第一移栽台100，第一移载台100包括载台110、温度传感器120以及加热装置130；载台110用于承载待贴附物体，例如基板；温度传感器120设置在载台110上，用于感测载台110的温度，当载台110承载有待贴附物体，例如基板时，也可感测待贴附物体的温度；加热装置130设置在载台110上，用于加热载台110上承载的被承载物；第一移栽台100的所述被承载物为待贴附物体。
例如，在本公开一实施例提供的贴附装置中，贴附装置还包括第二移载台；以及移动机构，被配置为移动第一移载台和第二移载台至少之一以使第一移载台和第二移载台彼此相对运动，第二移载台包括：载台，被配置为承载被承载物；温度传感器，设置在载台上并被配置为感测载台的温度；加热装置，设置在载台上并被配置加热载台上承载的被承载物；以及温度控制器，与温度传感器和加热装置分别通信相连并被配置为根据温度传感器感测的温度来控制加热装置的功率，第二移栽台的被承载物为贴附材料。
例如，如图7所示，该贴附装置包括第一移载台100和第二移载台200以及移动机构300。第一移载台100包括载台110、温度传感器120以及加热装置130；载台110用于承载待贴附物体，例如基板；温度传感器120设置在载台110上，用于感测载台110的温度，当载台110承载有待贴附物体，例如基 板时，也可感测待贴附物体的温度；加热装置130设置在载台110上，用于加热载台110上承载的被承载物；第二移载台200可搭载贴附材料；移动机构300可移动第一移载台100和第二移载台200至少之一以使第一移载台100和第二移载台200彼此相对运动，例如，如图7所示，移动机构300与第二移载台200相对固定从而可移动第二移载台200靠近第一移载台100，当然，本公开实施例包括但不限于此，移动机构也与第一移载台相对固定从而可移动第一移载台。
在本实施例提供的贴附装置中，可通过第一移载台对待贴附物体，例如基板进行加热，从而在向待贴附物体贴附贴附材料的过程中大大降低气泡的发生率，从而达到脱泡的效果。例如，当待贴附物体为基板，贴附材料为偏光片时，由于偏光片和基板通常通过胶层进行粘合，经过第一移载台加热的基板具有一定的温度(大于室温的温度，例如，50-60度)，从而可使胶层更加易于粘在基板的表面上，从而大大降低气泡的发生率。并且，当第二移载台靠近并将贴附材料压合到第一移载台时，贴附上偏光片的基板受到第一移载台和第二移载台的作用，贴附上偏光片的基板具有一定的温度(大于室温的温度，例如，50-60度)并受到第一移载台和第二移载台的压力，从而可将气泡完全去除。由此，本实施例提供的贴附装置不用增加额外的脱泡设备，在贴附的过程中便可完成脱泡工艺，从而可降低成本，增加生产效率。
例如，本实施例一示例提供的贴附装置中的第一移载台还可包括吸附装置。其具体的设置和有益效果可参见实施例一中的相关描述，在此不再赘述。
例如，本实施例一示例提供的贴附装置中的第一移载台还可包括温度控制器。其具体的设置和有益效果可参见实施例一中的相关描述，在此不再赘述。
例如，在本实施例一示例提供的贴附装置中的第一移载台中，加热装置可包括多个子加热装置，多个子加热装置可独立进行加热。其具体的设置和有益效果可参见实施例一中的相关描述，在此不再赘述。
例如，在本实施例一示例提供的贴附装置中的第一移载台中，温度传感器也可包括多个子温度传感器，多个子温度传感器可独立进行温度检测。其具体的设置和有益效果可参见实施例一中的相关描述，在此不再赘述。
例如，在本实施例一示例提供的贴附装置中的第一移载台中，加热装置可包括电热丝以及设置在电热丝外围的导热绝缘层，电热丝的材料包括镍铬合金，导热绝缘层的材料包括柔性云母板。其具体的设置和有益效果可参见实施 例一中的相关描述，在此不再赘述。
例如，在本实施例一示例提供的贴附装置中，第二移载台可与上述任一示例所描述第一移载台具有相同的结构。由此，第二移载台可对贴附材料进行加热，使得在贴附的过程中，贴附材料也具有一定温度(大于室温的温度，例如，50-60度)，从而进一步大大降低气泡的发生率，从而达到更好的脱泡的效果。
本公开一实施例提供一种贴附装置的贴附方法，贴附装置为上述实施例二中任一示例所描述的贴附装置，贴附方法包括以下步骤S301-S302。
S301：使用加热装置和温度传感器加热待贴附物体并控制待贴附物体的温度。
S302：使用移动机构移动第一移载台和第二移载台至少之一以使第一移载台和第二移载台彼此靠近以将贴附材料贴附在待贴附物体上。
在本实施例提供的贴附方法中，可通过第一移载台对待贴附物体，例如基板进行加热，从而在向待贴附物体贴附贴附材料的过程中大大降低气泡的发生率，从而达到脱泡的效果。例如，当待贴附物体为基板，贴附材料为偏光片时，由于偏光片和基板通常通过胶层进行粘合，经过第一移载台加热的基板具有一定的温度(大于室温的温度，例如，50-60度)，从而可使胶层更加易于粘在基板的表面上，从而大大降低气泡的发生率。并且，当第二移载台靠近并将贴附材料压合到第一移载台时，贴附上偏光片的基板受到第一移载台和第二移载台的作用，贴附上偏光片的基板具有一定的温度(大于室温的温度，例如，50-60度)并受到第一移载台和第二移载台的压力，从而可将气泡完全去除。由此，本实施例提供的贴附方法不用增加额外的脱泡设备，在贴附的过程中便可完成脱泡工艺，从而可降低成本，增加生产效率。
例如，在本实施例一示例提供的贴附装置的贴附方法中，使用加热装置和温度传感器控制待贴附物体的温度范围为50-60度。由此，可具有较佳的脱泡效果。
例如，在本实施例一示例提供的贴附装置的贴附方法中，当该第一移载台的多个子加热装置在载台上分区设置时，贴附方法还包括：根据待贴附物体的尺寸调整多个子加热器的工作状态，例如，关闭一部分子加热器，以降低功耗，提高能量利用效率，具体可参见实施例一中的相关描述，在此不再赘述。
有以下几点需要说明：
(1)本公开实施例附图中，只涉及到与本公开实施例涉及到的结构，其 他结构可参考通常设计。
(2)在不冲突的情况下，本公开同一实施例及不同实施例中的特征可以相互组合。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (18)

  1. 一种移载台，包括：
    载台，被配置为承载被承载物；
    温度传感器，设置在所述载台上并被配置为感测所述载台的温度；
    加热装置，设置在所述载台上并被配置加热所述载台上承载的被承载物；以及
    温度控制器，与所述温度传感器和所述加热装置分别通信相连并被配置为根据所述温度传感器感测的温度来控制所述加热装置的功率。
  2. 根据权利要求1所述的移载台，其中，所述加热装置包括多个子加热装置，所述多个子加热装置被配置为独立进行加热。
  3. 根据权利要求2所述的移载台，其中，所述多个子加热装置在所述载台上分区设置。
  4. 根据权利要求3所述的移载台，其中，所述多个子加热装置在所述载台上嵌套设置。
  5. 根据权利要求4所述的移载台，其中，所述载台的形状包括矩形，各所述多个子加热装置的形状为L形并沿所述矩形的对角线方向嵌套设置。
  6. 根据权利要求5所述的移载台，其中，所述载台包括多个L型沟槽，所述多个子加热装置设置在所述多个L型沟槽内。
  7. 根据权利要求2-6所述的移载台，其中，所述温度传感器包括多个子温度传感器，所述多个子温度传感器被配置为独立进行温度检测。
  8. 根据权利要求7所述的移载台，其中，所述多个子温度传感器与所述多个子加热装置一一对应设置。
  9. 根据权利要求1-8中任一项所述的移载台，其中，所述加热装置包括电热丝以及设置在所述电热丝外围的导热绝缘层。
  10. 根据权利要求1-8中任一项所述的移载台，其中，所述温度控制器被配置为控制所述加热装置以使所述载台的温度范围为50-60度。
  11. 根据权利要求1-8中任一项所述的移载台，还包括：
    吸附装置，设置在所述载台上并被配置为固定所述承载被承载物。
  12. 根据权利要求1-8中任一项所述的移载台，还包括：
    驱动机构，被配置为驱动所述载台移动。
  13. 一种贴附装置，包括：
    第一移载台，所述第一移栽台为根据权利要求1-12中任一项所述的移载台，所述第一移栽台的所述被承载物为待贴附物体。
  14. 根据权利要求13所述的贴附装置，还包括：
    第二移载台；以及
    移动机构，被配置为移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此相对运动，
    其中，所述第二移载台包括：载台，被配置为承载被承载物；温度传感器，设置在所述载台上并被配置为感测所述载台的温度；加热装置，设置在所述载台上并被配置加热所述载台上承载的被承载物；以及温度控制器，与所述温度传感器和所述加热装置分别通信相连并被配置为根据所述温度传感器感测的温度来控制所述加热装置的功率，所述第二移栽台的所述被承载物为贴附材料。
  15. 根据权利要求14所述的贴附装置，其中，所述待贴附被承载物包括显示基板，所述贴附材料包括偏光片。
  16. 一种贴附装置的贴附方法，其中，所述贴附装置包括第一移载台、第二移载台以及移动机构，所述第一移载台包括根据权利要求1-4中任一项所述的移载台，所述被承载物包括待贴附物体，所述第二移载台被配置为搭载贴附材料，所述移动机构被配置为移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此靠近，所述贴附方法包括：
    使用所述加热装置和所述温度传感器加热所述待贴附物体并控制所述待贴附物体的温度；以及
    使用所述移动机构移动所述第一移载台和所述第二移载台至少之一以使所述第一移载台和所述第二移载台彼此靠近以将所述贴附材料贴附在所述待贴附物体上。
  17. 根据权利要求16所述的贴附装置的贴附方法，其中，使用所述加热装置和所述温度传感器控制所述待贴附物体的温度范围为50-60度。
  18. 根据权利要求16或17所述的贴附装置的贴附方法，其中，所述多个子加热装置在所述载台上分区并嵌套设置，所述贴附方法还包括：
    根据所述待贴附物体的尺寸调整所述多个子加热器的工作状态。
PCT/CN2017/117205 2017-02-22 2017-12-19 移载台、贴附装置及其贴附方法 Ceased WO2018153151A1 (zh)

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CN113696468A (zh) * 2021-08-24 2021-11-26 Tcl华星光电技术有限公司 一种加热贴膜装置及加热贴膜的方法

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CN103176305A (zh) * 2013-04-16 2013-06-26 深圳市华星光电技术有限公司 偏光片贴附方法
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