WO2018150641A1 - Matériau métallique pour composant électronique, procédé de fabrication dudit matériau métallique, et borne de connecteur, connecteur et composant électronique dans lesquels ledit matériau métallique est utilisé - Google Patents

Matériau métallique pour composant électronique, procédé de fabrication dudit matériau métallique, et borne de connecteur, connecteur et composant électronique dans lesquels ledit matériau métallique est utilisé Download PDF

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WO2018150641A1
WO2018150641A1 PCT/JP2017/038821 JP2017038821W WO2018150641A1 WO 2018150641 A1 WO2018150641 A1 WO 2018150641A1 JP 2017038821 W JP2017038821 W JP 2017038821W WO 2018150641 A1 WO2018150641 A1 WO 2018150641A1
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group
layer
metal material
treatment
constituent element
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PCT/JP2017/038821
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English (en)
Japanese (ja)
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遠藤　智
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Ｊｘ金属株式会社
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Priority to CN201780086104.0A priority Critical patent/CN110268097A/zh
Priority to KR1020197026268A priority patent/KR20190117596A/ko
Priority to EP17896426.8A priority patent/EP3584353A4/fr
Publication of WO2018150641A1 publication Critical patent/WO2018150641A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/341—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one carbide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/07—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing phosphates
    • C23C22/08—Orthophosphates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/321—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/322—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
    • C23C28/325—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer with layers graded in composition or in physical properties
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
    • C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
    • C23C28/36—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including layers graded in composition or physical properties
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D9/00—Electrolytic coating other than with metals
    • C25D9/02—Electrolytic coating other than with metals with organic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting

Definitions

  • the present invention relates to a metal material for an electronic component, a method for manufacturing the same, a connector terminal using the same, a connector, and an electronic component.
  • a connector that is a connection part for consumer and in-vehicle electronic devices uses a material in which a surface of brass or phosphor bronze is plated with Ni or Cu and further plated with Sn or Sn alloy. .
  • Sn or Sn alloy plating generally requires characteristics such as low contact resistance and high solder wettability, and in recent years, it has been required to reduce the insertion force when mating a male terminal and a female terminal formed by pressing a plating material. ing.
  • Patent Document 1 in a coating material including a conductive base material and a coating layer formed on the base material, the coating layer is formed of Sn and noble metal at least on the surface side.
  • a coating material containing an intermetallic compound is disclosed. According to this, it is described that the contact resistance is low, and it has a low friction coefficient and is effective in reducing the insertion force.
  • the coating layer contains Sn and a noble metal intermetallic compound
  • the thickness of the Ag—Sn alloy layer containing the intermetallic compound of Sn and the noble metal is preferably It is 1 ⁇ m or more and 3 ⁇ m or less.
  • the insertion force could not be lowered sufficiently with this thickness.
  • this alloy layer is in a state where intermetallic compound particles are dispersed in the Sn matrix, Sn is exposed.
  • this surface can corrode in corrosive environments. This leads to an increase in electrical resistance.
  • the conventional metal material for electronic parts having the Sn—Ag alloy / Ni base plating structure still has a problem that the insertion force cannot be lowered sufficiently.
  • the present invention has been made to solve the above-described problems, and an object of the present invention is to provide a metal material for electronic parts having low adhesion and wear properties, a connector terminal using the same, a connector, and an electronic part.
  • Adhesive wear refers to a wear phenomenon that occurs due to the fact that an adhesive portion constituting a real contact area between solids is sheared by frictional motion. When this adhesion wear increases, the insertion force when the male terminal and the female terminal are fitted together increases.
  • the inventor provided a lower layer, an intermediate layer, an upper layer, and a treatment layer with a predetermined metal on a substrate, and controlled the amount of oxide particles deposited on the surface of the treatment layer after heating.
  • the present inventors have found that a metal material for electronic parts having low adhesion wear can be produced.
  • the present invention completed based on the above knowledge is selected from a base material and an A constituent element group which is a group consisting of Ni, Cr, Mn, Fe, Co and Cu formed on the base material.
  • a constituent element group which is a group consisting of Ni, Cr, Mn, Fe, Co and Cu formed on the base material.
  • 1 selected from the group consisting of Sn and In, a group consisting of Sn and In, and a lower layer composed of one or more types, a middle layer formed on the lower layer, and a middle layer formed on the lower layer
  • An upper layer composed of an alloy of seeds or two kinds and one or more kinds selected from a C constituent element group which is a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir;
  • the treatment layer further includes one or more selected from the group consisting of S, P and N.
  • the base material and one or two selected from the A constituent element group which is a group consisting of Ni, Cr, Mn, Fe, Co, and Cu, formed on the base material.
  • a lower layer composed of at least seeds, an intermediate layer formed on the lower layer, and one or two selected from the B constituent element group, which is a group consisting of Sn and In, formed on the intermediate layer;
  • An upper layer made of an alloy of one or more selected from the C constituent element group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir, and the middle layer
  • a phosphoric acid ester treatment liquid is used as a metal material composed of one or more selected from the A constituent element group and one or two selected from the B constituent element group.
  • the phosphate ester-based treatment liquid includes at least one phosphate ester represented by the following general formulas [1] and [2]; A phosphate ester-based solution containing at least one selected from the group of cyclic organic compounds represented by general formulas [3] and [4].
  • R 1 and R 2 each represent a substituted alkyl, and M represents hydrogen or an alkali metal.
  • R 1 represents hydrogen, alkyl, or substituted alkyl
  • R 2 represents an alkali metal
  • R 3 represents an alkali metal or hydrogen
  • R 4 represents —SH, an amino group substituted with an alkyl group or an aryl group, or alkyl-substituted imidazolylalkyl
  • R 5 and R 6 represent —NH 2 , —SH or —SM (M represents an alkali metal).
  • a connector terminal provided with the metal material for electronic parts of the present invention at a contact portion.
  • the present invention is a connector provided with the connector terminal of the present invention.
  • the present invention is an FFC terminal provided with a metal material for electronic parts of the present invention at a contact portion.
  • the present invention is an FPC terminal provided with a metal material for electronic parts of the present invention at a contact portion.
  • the present invention is an FFC including the FFC terminal of the present invention.
  • the present invention is an FPC provided with the FPC terminal of the present invention.
  • the present invention is an electronic component including the metal material for an electronic component of the present invention on an external connection electrode.
  • a female terminal connection portion is provided on one side of a mounting portion to be attached to the housing, and a substrate connection portion is provided on the other side, and the substrate connection portion is press-fitted into a through hole formed in the substrate.
  • the press-fit terminal attached to the substrate is an electronic component comprising the metal material for electronic component of the present invention.
  • the electronic component metal material 10 has a lower layer 12 formed on a substrate 11, an intermediate layer 13 formed on the lower layer 12, and an upper layer 14 formed on the intermediate layer 13. Yes.
  • Base material ⁇ Configuration of metal materials for electronic parts> (Base material)
  • metal base materials such as copper and a copper alloy, Fe-type material, stainless steel, titanium and a titanium alloy, aluminum, and an aluminum alloy
  • a metal base and a resin layer may be combined. Examples of composites of metal layers and resin layers include electrode portions on FPC or FFC substrates.
  • the upper layer 14 is composed of one or two selected from the group consisting of Sn and In which is a group consisting of B, and a group C consisting of a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os and Ir It is comprised with the alloy with the 1 type (s) or 2 or more types selected from the group.
  • Sn and In are oxidizable metals, but are relatively soft among metals. Therefore, even if an oxide film is formed on the Sn and In surfaces, for example, when a male terminal and a female terminal are mated using a metal material for electronic parts as a contact material, the oxide film is easily scraped, and the contact becomes metal-to-metal. Therefore, low contact resistance is obtained.
  • Sn and In are excellent in gas corrosion resistance against gases such as chlorine gas, sulfurous acid gas, and hydrogen sulfide gas.
  • upper layer 14 is inferior in gas corrosion resistance
  • lower layer 12 is inferior in gas corrosion resistance
  • copper and a copper alloy inferior in gas corrosion resistance are used for the base material 11, there exists a function which improves the gas corrosion resistance of the metal material for electronic components.
  • Sn and In Sn is preferable because In is strictly regulated based on the technical guidelines for preventing health problems of the Ministry of Health, Labor and Welfare.
  • Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir are characterized by relatively heat resistance among metals. Therefore, it suppresses that the composition of the base material 11 and the lower layer 12 diffuses to the upper layer 14 side, and improves heat resistance. Further, these metals form a compound with Sn or In in the upper layer 14 to suppress the formation of an oxide film of Sn or In and improve solder wettability.
  • Ag Au, Pt, Pd, Ru, Rh, Os, and Ir
  • Ag is more desirable from the viewpoint of conductivity. Ag has high conductivity. For example, when Ag is used for high frequency signal applications, the impedance resistance is lowered due to the skin effect.
  • the upper layer 14 preferably has a ⁇ (zeta) phase which is a SnAg alloy containing 11.8 to 22.9 at% of Sn.
  • the presence of the ⁇ (zeta) phase improves the gas corrosion resistance, and the appearance hardly changes even when a gas corrosion test is performed.
  • a ⁇ (zeta) phase and an ⁇ (epsilon) phase that is Ag 3 Sn exist in the upper layer 14. Due to the presence of the ⁇ (epsilon) phase, the coating becomes harder and the adhesive wear is reduced as compared with the case where only the ⁇ (zeta) phase is present in the upper layer 14. Moreover, gas corrosion resistance improves because Sn ratio of the upper layer 14 increases.
  • ⁇ (epsilon) phase that is Ag 3 Sn exists in the upper layer 14.
  • the existence of the ⁇ (epsilon) phase alone in the upper layer 14 makes the coating harder and harder than the case where the ⁇ (zeta) phase and the ⁇ (epsilon) phase of Ag 3 Sn exist in the upper layer 14. Wear is reduced. Further, the higher the Sn ratio of the upper layer 14, the better the gas corrosion resistance. It is preferable that an ⁇ (epsilon) phase that is Ag 3 Sn and ⁇ Sn that is a Sn single phase exist in the upper layer 14.
  • the upper layer 14 may have a ⁇ (zeta) phase that is a SnAg alloy containing 11.8 to 22.9 at% of Sn, an ⁇ (epsilon) phase that is Ag 3 Sn, and ⁇ Sn that is a single Sn phase. preferable.
  • the presence of the ⁇ (zeta) phase, the ⁇ (epsilon) phase that is Ag 3 Sn, and ⁇ Sn that is the Sn single phase improves the gas corrosion resistance, and the appearance changes even when a gas corrosion test is performed. It is difficult to wear and adhesion wear decreases. This configuration is not an equilibrium structure, which occurred during the diffusion process.
  • the upper layer 14 should not be present by ⁇ Sn alone. In the presence of ⁇ Sn alone, adhesion wear is large, whiskers are generated, and heat resistance, fine sliding wear resistance and the like deteriorate.
  • the upper layer 14 preferably contains 10 to 50 at% of the metal of the B constituent element group.
  • the metal of the B constituent element group is less than 10 at%, the gas corrosion resistance is poor, and when the gas corrosion test is performed, the appearance may be discolored.
  • the metal of the B constituent element group exceeds 50 at%, the proportion of the metal of the B constituent element group in the upper layer 14 increases, and adhesion wear increases, and whiskers are likely to occur. Furthermore, there are cases where the resistance to fine sliding wear is poor.
  • a treatment layer having a C content of 60 at% or more and an O content of 30 at% or less is provided on the upper layer 14.
  • the treatment layer is formed by a surface treatment such as a sealing treatment performed after the upper layer 14 is formed, and C included in the treatment layer is a component resulting from the surface treatment such as the sealing treatment.
  • the treatment layer may further include one or more selected from the group consisting of S, P, and N.
  • the treatment layer is controlled so that the area ratio of the oxide particles adhering to the surface of the treatment layer is 0.1% or less after being heated at 250 ° C. for 30 seconds.
  • Oxide particles adhering to the surface of the treated layer after the heating adversely affects the adhesion wear properties of the metal material for electronic parts, so by controlling the area ratio of the oxide particles to 0.1% or less, A metal material for electronic parts having low adhesion wear properties can be obtained.
  • the middle layer 13 is selected from one or more selected from the A constituent element group which is a group consisting of Ni, Cr, Mn, Fe, Co and Cu, and the B constituent element group which is a group consisting of Sn and In. 1 type or 2 types. Such a configuration has the effect of improving heat resistance and solder wettability.
  • the thickness of the middle layer 13 is preferably 0.01 ⁇ m or more and less than 0.40 ⁇ m.
  • Sn and In are excellent in gas corrosion resistance against gases such as chlorine gas, sulfurous acid gas, and hydrogen sulfide gas.
  • Ni is inferior in gas corrosion resistance in the lower layer 12, and copper and copper inferior in gas corrosion resistance in the base material 11.
  • Ni, Cr, Mn, Fe, Co, and Cu are hard to cause adhesive wear because the film is harder than Sn and In, and prevent the constituent metals of the base material 11 from diffusing into the upper layer 14. Improve durability, such as suppressing property deterioration and solder wettability degradation. If the thickness of the middle layer 13 is less than 0.01 ⁇ m, the film becomes hard and adhesion wear may be reduced. On the other hand, when the thickness of the middle layer 13 is 0.40 ⁇ m or more, the bending workability is lowered, the mechanical durability is lowered, and plating scraping may occur.
  • Sn is preferable because In is strictly regulated based on the technical guideline for preventing health problems of the Ministry of Health, Labor and Welfare. Of Ni, Cr, Mn, Fe, Co and Cu, Ni is preferable. This is because Ni is hard and adhesion wear hardly occurs, and sufficient bending workability is obtained.
  • the B group element group metal is preferably 35 at% or more. If the Sn content is 35 at% or more, the film becomes hard and adhesion wear may be reduced.
  • the middle layer 13 may be composed of Ni 3 Sn and Ni 3 Sn 2 , or may be composed of Ni 3 Sn 2 or Ni 3 Sn 4 alone.
  • Ni 3 Sn, Ni 3 Sn 2 and Ni 3 Sn 4 may improve heat resistance and solder wettability. It is preferable that Ni 3 Sn 4 and ⁇ Sn which is a Sn single phase exist in the middle layer 13. The presence of these may improve the heat resistance and solder wettability as compared with the case where Ni 3 Sn 4 and Ni 3 Sn 2 exist.
  • the thickness of the upper layer 14 is preferably 0.02 ⁇ m or more and less than 1.00 ⁇ m. When the thickness of the upper layer 14 is less than 0.02 ⁇ m, the gas corrosion resistance is poor, and when the gas corrosion test is performed, the appearance is discolored.
  • the thickness of the upper layer 14 is 1.00 ⁇ m or more, the thin film lubrication effect by the hard base material 11 or the lower layer 12 is lowered and adhesion wear is increased. In addition, mechanical durability is lowered, and plating scraping is likely to occur.
  • the thickness of the upper layer 14 is preferably less than 0.50 ⁇ m.
  • the lower layer 12 is composed of one type or two or more types selected from the group A constituent elements which are groups consisting of Ni, Cr, Mn, Fe, Co, and Cu. With such a configuration, the metal element of the substrate 11 can be prevented from diffusing into the middle layer 13 and the upper layer 14.
  • the thickness of the lower layer 12 is preferably 0.05 ⁇ m or more. If the thickness of the lower layer 12 is less than 0.05 ⁇ m, the thin film lubricating effect of the hard lower layer may be reduced, and adhesion wear may increase. The constituent metal of the base material 11 is likely to diffuse into the upper layer 14, and heat resistance and solder wettability may be deteriorated. On the other hand, the thickness of the lower layer 12 is preferably less than 5.00 ⁇ m. If the thickness is 5.00 ⁇ m or more, the bending workability may be poor.
  • the lower layer 12 has a composition in which the total amount of metals of the A constituent element group is 50 mass% or more and the total amount of one or more metals selected from the group consisting of B, P, Sn and Zn is less than 50 mass%. You may have.
  • the alloy composition of the lower layer 12 has such a configuration, the lower layer 12 is further hardened, the thin film lubrication effect is further improved, and the adhesion wear is further reduced. It may further prevent the metal from diffusing into the upper layer, and may improve durability such as heat resistance and solder wettability.
  • the total amount of metals of the B constituent element group and the C constituent element group is 50 mass% or more, and As, Bi, Cd, Co, Cr, Cu, Fe, Mn, Mo, Ni, Pb, Sb, W, and
  • the total amount of one or more metals selected from the group consisting of Zn may have a composition of less than 50 mass%. Such a configuration may further reduce adhesion wear, suppress whisker generation, and improve durability such as heat resistance and solder wettability.
  • the middle layer 13 has a total amount of metals of the C constituent element group of 50 mass% or more, and Bi, Cd, Co, Cu, Fe, In, Mn, Mo, Ni, Pb, Sb, Se, Sn, W, Tl, and Zn.
  • the total amount of one or more metals selected from the group consisting of may have a composition of less than 50 mass%. Such a configuration may further reduce adhesion wear, suppress whisker generation, and improve durability such as heat resistance and solder wettability.
  • the method for producing a metal material for electronic parts according to the present invention is first selected from a base material and an A constituent element group which is a group consisting of Ni, Cr, Mn, Fe, Co and Cu formed on the base material. 1 selected from the group consisting of Sn and In, a group consisting of Sn and In, and a lower layer composed of one or more types, a middle layer formed on the lower layer, and a middle layer formed on the lower layer And an upper layer composed of an alloy of one or more selected from a group consisting of C, which is a group consisting of Ag, Au, Pt, Pd, Ru, Rh, Os, and Ir.
  • a metal material is prepared in which the intermediate layer includes one or more selected from the A constituent element group and one or two selected from the B constituent element group.
  • the metal material can be formed by wet (electrical, electroless) plating, dry (sputtering, ion plating, etc.) plating, or the like.
  • the upper layer 14, the middle layer 13 and the lower layer 12 form one or more selected from the A constituent element group on the substrate 11, and then, one or two selected from the B constituent element group.
  • one or more kinds selected from the C constituent element group may be formed, and each element of the B constituent element group and the C constituent element group may be formed by diffusion.
  • the metal of the B constituent element group is Ag and the metal of the C constituent element group is Sn
  • the diffusion of Ag into Sn is fast
  • a Sn—Ag alloy layer is formed by natural diffusion.
  • the adhesion force of Sn can be further reduced, and the low whisker property and durability can be further improved.
  • heat treatment may be performed for the purpose of further suppressing adhesion wear and further improving the low whisker property and durability.
  • the heat treatment diffuses the metal of the B constituent element group and the metal of the C constituent element group so that an alloy layer can be formed more easily, the adhesion force of Sn is further reduced, and the low whisker property and durability are further improved.
  • the heat treatment may be performed in a reducing atmosphere or a non-oxidizing atmosphere.
  • process conditions temperature x time
  • this heat treatment is not particularly required.
  • the heat treatment is performed at a melting point or higher of the metal of the B constituent element group, and one or two or more alloy layers selected from the B constituent element group and one or more alloy layers selected from the A constituent element group, and When one or more alloy layers selected from the B constituent element group and one or more alloy layers selected from the C constituent element group are formed, the alloy layer can be more easily formed. Further, when the heat treatment is performed at a temperature equal to or higher than the melting point of the metal of the B constituent element group, one or two or more kinds selected from the C constituent element group and one or two alloy layers selected from the B constituent element group are formed. This makes it easier to form the alloy layer better.
  • a post-treatment is performed for the purpose of further reducing the adhesion wear property and improving the low whisker property and the durability.
  • the content of C is 60 at% or more on the surface of the metal material by providing ultrasonic treatment in a treatment solution containing 2.5 to 5.0 g / L of a phosphate ester treatment solution.
  • a treatment layer having an O content of 30 at% or less is formed.
  • the phosphoric acid ester treatment liquid is 2.5 to 5.0 g / L in the formation of the treatment layer provided on the surface of the metal material (upper surface).
  • the sealing component is finely dispersed in the treatment liquid by ultrasonic agitation to produce a strong sealing film and prevent oxidation due to heat treatment, etc.
  • the area ratio of oxide particles adhering to the surface after heating can be controlled to 0.1% or less.
  • the concentration of the phosphoric acid ester-based treatment liquid is less than 2.5 g / L, the concentration is thin and there is a problem in corrosion resistance and heat resistance, and if it exceeds 5.0 g / L, adhesion wear resistance increases.
  • the concentration of the phosphate ester treatment solution is more preferably 3.0 to 4.0 g / L.
  • the electrolytic potential at the time of forming the treatment layer is preferably 2.0 to 3.5V. If the electrolysis potential is less than 2.0V, a strong sealing film cannot be formed, which may cause problems in corrosion resistance and heat resistance, and if it exceeds 3.5V, a problem of discoloration may occur.
  • the electrolysis potential is more preferably 3.0 to 3.5V.
  • Specific post-treatment includes phosphate treatment using an inhibitor, and further includes lubrication treatment and silane coupling treatment.
  • process conditions temperature x time
  • the oxide may be removed by pickling or reverse electrolysis with the same solution as the post-treatment solution. This exposes a fresh, unoxidized alloy surface.
  • post-treatment components are adsorbed. Since the organic substance having a more specific structure adheres to the surface where the alloy is exposed than the surface where the oxide is exposed, it is expected that the lubricity and durability are further improved. Of course, if the heat treatment is performed in a reducing atmosphere, the oxide removal treatment may not be performed.
  • the surface of the upper layer 14 is performed using an aqueous solution (referred to as a phosphate ester-based solution) containing one or more phosphate esters and one or more cyclic organic compounds. It is desirable.
  • the phosphoric acid ester added to the phosphoric acid ester system liquid functions as an antioxidant and a lubricant for plating.
  • the phosphate ester used in the present invention is represented by the general formulas [1] and [2].
  • Preferable examples of the compound represented by the general formula [1] include lauryl acidic phosphoric acid monoester.
  • Preferred examples of the compound represented by the general formula [2] include lauryl acid diphosphate.
  • R 1 and R 2 each represent a substituted alkyl, and M represents hydrogen or an alkali metal.
  • the cyclic organic compound added to the phosphate ester-based liquid functions as an antioxidant for plating.
  • a group of cyclic organic compounds used in the present invention is represented by general formulas [3] and [4].
  • Preferred examples of the group of cyclic organic compounds represented by the general formulas [3] and [4] include mercaptobenzothiazole, mercaptobenzothiazole Na salt, mercaptobenzothiazole K salt, benzotriazole, 1-methyltriazole, Examples include tolyltriazole and triazine compounds.
  • R 1 represents hydrogen, alkyl, or substituted alkyl
  • R 2 represents an alkali metal, hydrogen, alkyl, or substituted alkyl
  • R 3 represents an alkali metal or hydrogen
  • R 4 represents —SH, an amino group substituted with an alkyl group or an aryl group, or alkyl-substituted imidazolylalkyl
  • R 5 and R 6 represent —NH 2 , —SH or —SM (M represents an alkali metal).
  • the treatment is performed so that both P and N are present on the surface of the upper layer 14 after the post-treatment. If P is not present on the plating surface, the solderability is likely to deteriorate, and the lubricity of the plating material also deteriorates. On the other hand, if N is not present on the Sn or Sn alloy plating surface, the contact resistance of the plating material may easily increase in a high temperature environment.
  • the maximum height (Rz) of the surface of the upper layer 14 is preferably 3 ⁇ m or less.
  • the maximum height (Rz) of the surface of the upper layer 14 is 3 ⁇ m or less, the number of convex portions that are relatively easily corroded is reduced and smoothed, so that the gas corrosion resistance is improved.
  • the use of the metal material for electronic parts of the present invention is not particularly limited.
  • a connector terminal provided with a metal material for electronic parts in a contact part an FFC terminal or FPC terminal provided with a metal material for electronic parts in a contact part, and an electronic part Electronic parts having a metal material for an external connection electrode.
  • the external connection electrode include a connection component in which a surface treatment is performed on a tab and a material in which a surface treatment is applied to a semiconductor under bump metal.
  • a connector may be produced using the connector terminal formed in this way, and an FFC or FPC may be produced using an FFC terminal or an FPC terminal.
  • the female terminal connection portion is provided on one side of the mounting portion to be attached to the housing, and the substrate connection portion is provided on the other side.
  • the substrate connection portion is formed in a through hole formed on the substrate. You may use for the press-fit type terminal which press-fits and attaches to this board
  • both the male terminal and the female terminal may be the metal material for electronic parts of the present invention, or only one of the male terminal and the female terminal.
  • low insertion property is further improved by making both the male terminal and the female terminal into the metal material for electronic parts of the present invention.
  • Example and comparative example of this invention are shown together, these are provided in order to understand this invention better, and this invention is not intended to limit.
  • Examples 1 to 7 and Comparative Examples 1 to 6 after electrolytic degreasing, pickling, and first plating, second plating, third plating, and heat treatment under the conditions shown in Table 1, pickling or cathodic electrolysis The metal oxide layer (tin oxide layer) was removed and anodic electrolysis was performed. Note that when heat treatment is performed in a reducing atmosphere, such a metal oxide layer is not formed, and in that case, the oxide removing step does not need to be performed.
  • Heat treatment The heat treatment was performed by placing a sample on a hot plate and confirming that the surface of the hot plate reached a predetermined temperature.
  • anodic electrolysis (electrolytic potential and constant voltage electrolysis described in Table 2) was carried out for 2 seconds using the A-12: phosphate ester type treatment liquid having the concentrations shown in Table 2 as the surface treatment liquid, and the surface of the plating was surface-treated. Went.
  • ultrasonic agitation was performed during the treatment liquid building bath, and then the electrolysis was performed.
  • the ultrasonic stirring conditions for the treatment liquid were stirring by an ultrasonic disperser (ultrasonic frequency: 20 kHz, ultrasonic output: 500 W, 10 minutes). After these treatments, the sample was immersed for 2 seconds and then dried with warm air.
  • the thickness measurement of the upper layer and the middle layer of the obtained sample and the composition determination of the upper layer were performed by line analysis by STEM (scanning electron microscope) analysis.
  • the analyzed elements are upper layer, middle layer and lower layer compositions, C, S and O. These elements are designated elements. Further, the concentration (at%) of each element was analyzed with the total of the designated elements as 100%.
  • the thickness corresponds to the distance obtained from line analysis (or surface analysis).
  • JEM-2100F manufactured by JEOL Ltd. was used as the STEM apparatus.
  • the acceleration voltage of this device is 200 kV.
  • the structure of the upper layer was determined by comparing the composition determined by STEM with the phase diagram.
  • the thickness of the lower layer was measured with a fluorescent X-ray film thickness meter (SEA 5100 manufactured by Seiko Instruments, collimator 0.1 mm ⁇ ).
  • the thickness measurement of the upper layer, the middle layer and the lower layer, and the determination of the composition and structure of the upper layer were averaged by evaluating 10 points.
  • the area ratio of oxide particles adhering to the surface of the treatment layer after heating at 250 ° C for 30 seconds was measured by the following method. Using a scanning electron microscope (model: SU-70) manufactured by Hitachi High-Technologies, EDS surface analysis is performed to confirm that it is an oxide, and secondary electron images are obtained using NSS (Noran System Six) particle analysis software. Having a luminance of 82% or more were recognized as oxide particles, and the area ratio was calculated. The sample was placed on a hot plate for heating, and heated for 30 seconds after the surface of the hot plate reached 250 ° C.
  • Adhesive wear resistance is to be tested with a commercially available Sn reflow plated female terminal (090 type Sumitomo TS / Yazaki 090II series female terminal non-waterproof / F090-SMTS) with a male terminal plated. Evaluated by.
  • the measuring device used for the test was 1311NR made by Ikko Engineering, and the evaluation was performed with a male spin sliding distance of 5 mm.
  • the number of samples was 5, and adhesive wear was evaluated using the insertion force.
  • As the insertion force a value obtained by averaging the maximum values of the respective samples was adopted.
  • As a blank material for adhesion wear the sample of Comparative Example 1 was adopted, and the adhesion wear property with respect to the sample of Comparative Example 1 was evaluated.
  • the test conditions and test results are shown in Tables 1-2.
  • Examples 1 to 7 were metal materials for electronic parts having excellent low adhesion wear properties.
  • the electrolytic solution for forming the treatment layer was not ultrasonically stirred, so that the area ratio of the oxide particles was large and the adhesion wear property was high.
  • Comparative Example 2 since the concentration of A-12 is low and the electrolytic potential when forming the treatment layer is low, the concentration of C in the treatment layer is low, that is, a sufficient sealing film cannot be obtained and the number of oxide particles increases. It was. For this reason, adhesion wear was high.
  • Comparative Example 4 Although the concentration of A-12 is high, the electrolytic potential at the time of forming the treatment layer is low, so the C concentration of the treatment layer is low, that is, a sufficient sealing film cannot be obtained and there are many oxide particles. became. For this reason, adhesion wear was high.
  • Comparative Example 5 since the concentration of A-12 was low, the C concentration of the treatment layer was low, that is, a sufficient sealing film was not obtained, resulting in an increase in oxide particles. For this reason, adhesion wear was high.
  • Comparative Example 6 the concentration of A-12 was low, and the C concentration of the treatment layer was low, that is, a sufficient sealing film was not obtained, resulting in an increase in oxide particles. For this reason, adhesion wear was high.

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Abstract

L'invention concerne un matériau métallique pour composant électronique, ledit matériau métallique ayant de faibles propriétés d'usure adhésive. Un matériau métallique pour composant électronique comprend : un substrat ; une couche inférieure constituée d'un ou plusieurs éléments choisis dans un groupe d'éléments constitutifs A, qui est un groupe constitué de Ni, Cr, Mn, Fe, Co et Cu, ladite couche inférieure étant formée sur le substrat ; une couche intermédiaire formée sur la couche inférieure ; une couche supérieure constituée d'un ou deux éléments choisis dans un groupe d'éléments constitutifs B, qui est un groupe constitué de Sn et In, et un élément ou un alliage d'au moins deux éléments choisis dans un groupe d'éléments constitutifs C, qui est un groupe constitué de Ag, Au, Pt, Pd, Ru, Rh, Os et Ir, ladite couche supérieure étant formée sur la couche intermédiaire ; et une couche de traitement dans laquelle la teneur en C est de 60 % at. ou plus et la teneur en O est de 30 % at. ou moins, ladite couche de traitement étant formée sur la couche supérieure. La couche intermédiaire est constituée d'un ou plusieurs éléments choisis parmi le groupe d'éléments constitutifs A et d'un ou deux éléments choisis parmi le groupe d'éléments constitutifs B, et le rapport de surface de particules d'oxyde adhérant à la surface de la couche de traitement après chauffage pendant 30 secondes à 250 °C est de 0,1 % ou moins.
PCT/JP2017/038821 2017-02-15 2017-10-26 Matériau métallique pour composant électronique, procédé de fabrication dudit matériau métallique, et borne de connecteur, connecteur et composant électronique dans lesquels ledit matériau métallique est utilisé WO2018150641A1 (fr)

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CN201780086104.0A CN110268097A (zh) 2017-02-15 2017-10-26 电子部件用金属材料及其制造方法、使用了该电子部件用金属材料的连接器端子、连接器以及电子部件
KR1020197026268A KR20190117596A (ko) 2017-02-15 2017-10-26 전자 부품용 금속 재료 및 그 제조 방법, 그것을 사용한 커넥터 단자, 커넥터 및 전자 부품
EP17896426.8A EP3584353A4 (fr) 2017-02-15 2017-10-26 Matériau métallique pour composant électronique, procédé de fabrication dudit matériau métallique, et borne de connecteur, connecteur et composant électronique dans lesquels ledit matériau métallique est utilisé

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019131873A (ja) * 2018-02-01 2019-08-08 Ｊｘ金属株式会社 バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット
JP2020196910A (ja) * 2019-05-31 2020-12-10 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品
WO2021042859A1 (fr) * 2019-09-05 2021-03-11 华为技术有限公司 Broche de connecteur, connecteur et dispositif électronique
WO2021054109A1 (fr) * 2019-09-19 2021-03-25 株式会社オートネットワーク技術研究所 Borne de broche, connecteur, faisceau de câbles avec connecteur, et unité de commande
JP7353928B2 (ja) 2019-11-13 2023-10-02 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6592140B1 (ja) * 2018-05-28 2019-10-16 Ｊｘ金属株式会社 表面処理金属材料、表面処理金属材料の製造方法、及び、電子部品

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005126763A (ja) 2003-10-23 2005-05-19 Furukawa Electric Co Ltd:The 被覆材、それを用いた電気・電子部品、それを用いたゴム接点部品、及び被覆材の製造方法
JP2014041807A (ja) * 2012-06-15 2014-03-06 Jx Nippon Mining & Metals Corp 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP2015046268A (ja) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7037385B2 (en) * 1998-01-27 2006-05-02 Lord Corporation Aqueous metal treatment composition
TWI465333B (zh) * 2012-07-25 2014-12-21 Jx Nippon Mining & Metals Corp Electronic material for electronic parts and method for manufacturing the same, use of its connector terminals, connectors and electronic parts
JP6308516B2 (ja) * 2013-06-21 2018-04-11 株式会社プラズマ化学 放射線量低減用処理液の製造方法、その方法で製造された処理液を用いた、地表からの放射線量低減方法
CN103832048B (zh) * 2013-12-13 2017-03-15 华北铝业有限公司 Ctp版材及其制作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005126763A (ja) 2003-10-23 2005-05-19 Furukawa Electric Co Ltd:The 被覆材、それを用いた電気・電子部品、それを用いたゴム接点部品、及び被覆材の製造方法
JP2014041807A (ja) * 2012-06-15 2014-03-06 Jx Nippon Mining & Metals Corp 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品
JP2015046268A (ja) * 2013-08-27 2015-03-12 Jx日鉱日石金属株式会社 電子部品用金属材料及びその製造方法、それを用いたコネクタ端子、コネクタ及び電子部品

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP3584353A4

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019131873A (ja) * 2018-02-01 2019-08-08 Ｊｘ金属株式会社 バーンインテストソケット用表面処理金属材料、それを用いたバーンインテストソケット用コネクタ及びバーンインテストソケット
JP2020196910A (ja) * 2019-05-31 2020-12-10 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品
JP7306879B2 (ja) 2019-05-31 2023-07-11 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品
WO2021042859A1 (fr) * 2019-09-05 2021-03-11 华为技术有限公司 Broche de connecteur, connecteur et dispositif électronique
WO2021054109A1 (fr) * 2019-09-19 2021-03-25 株式会社オートネットワーク技術研究所 Borne de broche, connecteur, faisceau de câbles avec connecteur, et unité de commande
JP7353928B2 (ja) 2019-11-13 2023-10-02 古河電気工業株式会社 電気接点用材料およびその製造方法、コネクタ端子、コネクタならびに電子部品

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CN110268097A (zh) 2019-09-20
EP3584353A1 (fr) 2019-12-25
EP3584353A9 (fr) 2020-03-25
KR20190117596A (ko) 2019-10-16
TW201831725A (zh) 2018-09-01
JP6309124B1 (ja) 2018-04-11

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