WO2018129901A1 - 母板及其制备方法、盖板及其制备方法、显示装置 - Google Patents

母板及其制备方法、盖板及其制备方法、显示装置 Download PDF

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Publication number
WO2018129901A1
WO2018129901A1 PCT/CN2017/093829 CN2017093829W WO2018129901A1 WO 2018129901 A1 WO2018129901 A1 WO 2018129901A1 CN 2017093829 W CN2017093829 W CN 2017093829W WO 2018129901 A1 WO2018129901 A1 WO 2018129901A1
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Prior art keywords
layer
ink pattern
base substrate
substrate
pattern layer
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PCT/CN2017/093829
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English (en)
French (fr)
Inventor
毛雪
Original Assignee
京东方科技集团股份有限公司
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Priority to US15/743,474 priority Critical patent/US10643503B2/en
Publication of WO2018129901A1 publication Critical patent/WO2018129901A1/zh

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    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133305—Flexible substrates, e.g. plastics, organic film
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G02F1/133325—Assembling processes
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates

Definitions

  • the embodiment of the invention relates to a mother board, a preparation method thereof, a cover plate, a preparation method thereof and a display device.
  • Embodiments of the present invention provide a motherboard including a plurality of cover plates to be divided, a preparation method thereof, a cover plate including a hardened layer, a preparation method thereof, and a display device, and the embodiment of the present invention can prevent the upper surface of the cover plate from being decorated There is a gap between the edges of the ink to cause bubbles in the adhesive layer.
  • the thinner adhesive layer can be used to fit the cover and the display panel to avoid increasing the thickness of the display module as a whole.
  • an embodiment of the present invention provides a method for preparing a mother board, the method comprising: forming an ink pattern layer on a substrate, the ink pattern layer including a plurality of hollow regions; A hardening liquid covering the ink pattern layer is formed on the substrate; the hardened liquid is cured to form a hardened layer covering the ink pattern layer.
  • the hardening liquid is formed using a coating process.
  • the coating process includes any one of a slit coating process, a spray coating process, and a spin coating process.
  • the hardening liquid is photocurable, and the hardening liquid is cured by ultraviolet light irradiation to form a hardened layer covering the ink pattern layer; or the hardening liquid is a heat curing type, and is heated. The hardened liquid is cured to form a hardened layer covering the ink pattern layer.
  • an ink pattern layer is formed on a base substrate by a decoration process, and the decoration process includes any one of ink screen printing, thermal transfer, electroplating, and wire drawing.
  • the preparation method further includes forming a protective layer on the hardened layer; the protective layer Includes an antifouling layer and/or an anti-reflective layer.
  • the entire surface of the hardened layer away from the substrate substrate is a flat surface.
  • an embodiment of the present invention further provides a motherboard including: a substrate substrate; an ink pattern layer disposed on the substrate substrate, the ink pattern layer including a plurality of hollow regions; A hardened layer on the base substrate and covering the ink pattern layer.
  • the embodiment of the invention further provides a method for preparing a cover plate, the preparation method comprising: cutting the mother board to form a plurality of cover plates.
  • the embodiment of the present invention further provides a cover plate, comprising: a base substrate; an ink pattern disposed in a frame region of the base substrate; and disposed on the base substrate and covering the ink pattern Hardened layer.
  • the base substrate is a flexible base substrate.
  • the flexible substrate substrate is a polarizer.
  • the flexible base substrate comprises at least one of polyethylene terephthalate, polycarbonate, cellulose triacetate, cycloolefin polymer, polyimide, and polyethylene naphthalate. Materials.
  • the thickness of the base substrate ranges from 5 to 500 ⁇ m.
  • the ink pattern has a thickness ranging from 5 to 50 ⁇ m.
  • the hardened layer includes at least one of polymethyl methacrylate, polyethylene terephthalate, polyurethane, silica gel, and an organic composite.
  • the embodiment of the present invention further provides a display device, including: a display panel; the cover plate; the adhesive layer for bonding the cover plate and the display panel; wherein The glue layer is disposed on a side of the substrate in the cover plate away from the ink pattern.
  • FIG. 1 is an exploded perspective view of a flexible display device
  • FIG. 2 is a partial cross-sectional structural view of the flexible display device shown in FIG. 1 after being attached;
  • FIG. 3 is a partial cross-sectional structural view 2 of the flexible display device shown in FIG. 1 after being attached;
  • FIG. 4a is a partial cross-sectional structural view of a motherboard according to an embodiment of the present invention.
  • 4b is a partial cross-sectional structural view of a motherboard according to an embodiment of the present invention.
  • 4c is a schematic top plan view of a mother board when a hardened layer is not formed according to an embodiment of the present invention
  • FIG. 5 is a flowchart of a method for preparing a motherboard according to an embodiment of the present invention.
  • FIG. 6 is a schematic diagram of a bending radius of a cover plate applied to a flexible display device according to an embodiment of the present invention
  • FIG. 7 is an exploded perspective view of a display device according to an embodiment of the present invention.
  • 01-motherboard 100-cover; 101-frame area; 10-substrate substrate; 10a-upper surface; 10b-lower surface; 20-ink pattern layer; 20a-ink pattern; 21-first extension; - a second extension; 30 - a hardened layer.
  • the flexible display device includes a flexible display panel and a cover plate (also referred to as a protective cover plate) disposed opposite to each other, and the cover plate includes, for example, a plastic substrate and the surface thereof is sequentially formed with a certain scratch resistance.
  • Hardened coating, functional layer (such as anti-reflective coating and anti-fouling coating), the back side of which is printed with black, white or other color decorative ink at the border area corresponding to the flexible display panel to block the flexible display panel in the frame area
  • the back side of the cover and the flexible display panel are bonded together by OCA adhesive (Optically Clear Adhesive, a special adhesive for bonding transparent optical components).
  • the inventors of the present application noticed that since the decorative ink has a certain thickness, when a thin OCA adhesive is used to laminate the cover and the flexible display panel, as shown in FIG. 2, the thin OCA adhesive is difficult to cover. At the edge of the decorative ink, a conforming bubble is generated at the edge, thereby affecting the overall display appearance of the flexible display device. Therefore, as shown in FIG. 3, a thick OCA glue is required to achieve a good bonding effect, thereby increasing the overall thickness of the display module.
  • the embodiment of the present invention provides a method for preparing the mother board 01 as shown in FIG. 4a to FIG. 4c.
  • the preparation method includes: step S1, forming an ink pattern layer 20 on the base substrate 10,
  • the ink pattern layer 20 includes a plurality of hollow regions;
  • step S2 for example, a coating process is used to form a hardening liquid covering the ink pattern layer 20 on the base substrate 10;
  • the mother board 01 is an entire substrate including a plurality of small cover plates to be divided. After the corresponding layers are formed on the base substrate 10, a plurality of cover plates can be formed by a cutting process. It is beneficial to display the mass production of the product.
  • the planar shape of the ink pattern layer 20 is a grid shape, and includes a plurality of first extending portions 21 and a plurality of second extending portions 22, and the first extending portion 21 and the second extending portion 22 are formed to intersect. Multiple hollowed out areas to form a grid.
  • the planar pattern of the ink pattern layer 20 formed in the motherboard 01 may be formed by connecting a plurality of horizontal and vertical portions. The pattern of the hollowed out area.
  • the hollow region corresponds to the transmission region of each of the cut cover plates 100.
  • the display device obtained by bonding the cover plate to the display panel corresponds to the display region of the display device.
  • one mother board 01 can be divided into six small cover sheets 100 along a cutting line indicated by a broken line in the drawing. That is, a cover frame area is formed in the frame area 101 of each cover plate 100.
  • the ink pattern 20a of the field 101 for decoration, and each ink pattern 20a corresponds to one hollow area.
  • the embodiment of the present invention does not limit the number, distribution, and pattern of the hollow regions in the ink pattern layer 20.
  • the ink pattern layer 20 for decoration is first prepared on the upper surface 10a of the base substrate 10, and then the cover ink is formed on the base substrate 10 by, for example, a coating process.
  • the hardened liquid of the pattern layer 20 is filled with the step difference at the edge of the ink pattern layer 20 by the fluidity of the hardening liquid, so that the hardened layer 30 as a hard coat layer formed after curing adheres well to the base substrate 10 and the ink pattern.
  • the ink pattern layer 20 for decoration is first prepared on the upper surface 10a of the base substrate 10, and then the cover ink is formed on the base substrate 10 by, for example, a coating process.
  • the hardened liquid of the pattern layer 20 is filled with the step difference at the edge of the ink pattern layer 20 by the fluidity of the hardening liquid, so that the hardened layer 30 as a hard coat layer formed after curing adheres well to the base substrate 10 and the ink pattern.
  • the hardened layer 30 as a hard coat layer formed after curing adheres well to the base substrate
  • the ink pattern layer 20 is formed on the upper surface (ie, the viewing surface, that is, the surface closer to the user) 10a of the base substrate 10, the lower surface of the base substrate 10 (ie, for performing the cover and the display panel)
  • the bonded surface of the 10b is flat and has no step, and can be bonded to the display panel through the thin OCA glue, thereby ensuring the overall thickness of the display module.
  • the ink pattern layer 20 is formed on the base substrate 10 by a decoration process.
  • the decoration process may include any one of ink screen printing, thermal transfer, electroplating, and wire drawing.
  • the coating process may include any one of a slit coating process, a spray coating process, and a spin coating process.
  • a hardening liquid layer may also be formed using a process other than the coating process.
  • the hardening liquid is a photocurable hardening liquid in step S3
  • the hardening liquid may be cured by, for example, ultraviolet light irradiation to form the hardened layer 30 covering the ink pattern layer 20.
  • the photocurable hardening liquid may be, for example, a photocuring agent added to an acrylic, silica gel or other organic composite material, and the photocuring agent can absorb ultraviolet light energy under ultraviolet light irradiation to generate active radicals or cations.
  • the characteristic is that a series of photopolymerization reactions inside the hardening liquid finally solidify to form a hardened coating.
  • the hardening liquid is a thermosetting type in step S3
  • the hardening liquid may be cured by heating to form the hardened layer 30 covering the ink pattern layer 20.
  • the material of the thermosetting hardening liquid may be, for example, a thermosetting phenol resin material, and the thermosetting phenol resin is gradually hardened by chemical change after heating, and does not soften again when heated again.
  • the method may further include step S4, as shown in FIG. 5, on the hardened layer 30 (ie, one of the hardened layer 30 away from the decorative ink layer 20).
  • Side continue to form a protective layer.
  • the protective layer may include an anti-fouling layer (Anti-Fingerprint and Scratch, abbreviated as AF/AS) and/or an anti-reflection layer (Anti-Reflection, abbreviated as AR).
  • the coating process of the protective layer may include any one of thermal evaporation, electron beam evaporation, magnetron sputtering, and wet spraying.
  • the AF/AS antifouling layer is usually placed on the outermost layer of the base substrate 10 to prevent the oil stain such as a fingerprint from affecting the antireflection effect of the antireflection layer.
  • the embodiment of the present invention further provides a motherboard 01 including a plurality of cover plates 100 to be divided by the above preparation method.
  • the motherboard 01 includes a base substrate. 10.
  • the hardened layer 30 is adjacent to the ink pattern layer 20 and the entire upper surface of the hardened layer 30 (i.e., the surface away from the base substrate 10) is a flat surface.
  • the ink pattern layer 20 is formed on the upper surface 10a of the base substrate 10, the entire lower surface 10b of the base substrate 10 is flat without any step, and can be bonded to the display panel by the thin OCA glue. In order to ensure the overall thinness of the display module.
  • the layers in the mother board 01 will be further described below.
  • the thickness of the base substrate 10 ranges from 5 to 500 ⁇ m, and for example, the base substrate 10 is a flexible substrate. Since the lower surface of the mother board 01 (see the lower surface 10a of the base substrate 10) obtained by the above-described preparation method provided by the embodiment of the present invention is flat without any step, the OCA adhesive having a thin thickness can be used after being cut into a small-sized cover sheet.
  • the flexible display panel is attached to the flexible display panel. As shown in FIG. 6, the formed flexible display device has a small overall thickness, and a small bending radius (labeled as R in the figure) can be obtained when bending.
  • the flexible base substrate may include polyethylene terephthalate (PET), polycarbonate (Polycarbonate, PC), and triacetate cellulose (TAC). At least one of a cycloolefin polymer (COP), a polyimide (Polyimide, abbreviated as PI), and a polyethylene naphthalate two formic acid glycolester (PEN) material.
  • PET polyethylene terephthalate
  • PC polycarbonate
  • TAC triacetate cellulose
  • COP cycloolefin polymer
  • PI polyimide
  • PEN polyethylene naphthalate two formic acid glycolester
  • the plastic substrate is a polarizer
  • the transmittance of the polarizer is usually only 42% to 44%
  • the appearance looks gray, if the cover is desired
  • the protection function is integrated with the polarizer function.
  • the color of the decorative ink seen from the upper surface side of the polarizer is polarized. It is difficult to achieve the decorative effect of white ink or other color inks by the influence of the transmittance of the sheet, and only the dark ink of dark color can be applied.
  • the ink pattern layer 20 is above the base substrate 10 (ie, on the viewing side of the base substrate 10, also on the side of the base substrate 10 away from the display panel). ), will not be limited by the polarizer transmittance. Therefore, for example, in at least one embodiment of the present invention, the base substrate 10 (for example, the flexible base substrate) may also be a polarizer, thereby achieving the effect of integrating the polarizer and the protective cover, thereby further simplifying the cover structure. Reduce the overall thickness of the display module.
  • the ink pattern layer 20 may be a black ink, a white ink, or an ink of other colors, as long as it can block a structure such as a circuit that is opaque in the frame area of the display panel to achieve a decorative effect.
  • the thickness of the ink pattern layer 20 is, for example, 5 to 50 ⁇ m.
  • the hardened layer 30 may include polymethyl methacrylate (ie, acrylic), polyethylene terephthalate (PET), polyurethane (PU), silica gel or organic.
  • Composite materials or similar materials that have excellent adhesion to inks and adequately fill the gaps at the edges of the ink.
  • the thickness of the hardened layer 30 is determined by the performance parameters and the ink section difference that need to be achieved by the protective cover.
  • the embodiment of the present invention further provides a method for preparing a cover plate, comprising: cutting the above-mentioned mother board 01 to form a plurality of cover plates.
  • the cutting locations are located between adjacent hollowed out regions.
  • a laser or a cutter wheel can be used to form a plurality of cover plates.
  • the embodiment of the present invention further provides a cover plate 100 including an ink pattern 20a (shown in FIG. 4c) disposed in a frame region 101 (shown in FIG. 4c) of the base substrate 10;
  • the hard layer 30 of the ink pattern 20a is covered and covered.
  • the base substrate and the hardened layer herein are the base substrate and the hardened layer after cutting the above-mentioned mother board 01.
  • the materials and thicknesses thereof can be referred to the above for each of the mother boards 01. Floor Description, no more details here.
  • the cover plate may further include a protective layer on the side of the hardened layer 30 away from the base substrate 10, for example, the protective layer includes an antifouling layer and/or an antireflection layer.
  • the embodiment of the present invention further provides a display device.
  • the display device includes: a display panel; the cover plate 100, the ink pattern 20a of the cover plate 100 corresponds to a frame area of the display panel, and the ink pattern 20a
  • the enclosed hollow area corresponds to the entire display area of the display panel; the adhesive layer for bonding the cover 100 and the display panel (for example, OCA glue), and the glue layer is disposed on the base substrate 10 of the cover 100 away from the ink pattern 20a.
  • OCA glue for example, OCA glue
  • the ink pattern 20a and the adhesive layer are respectively located on both sides of the base substrate instead of the same side, and since the ink pattern 20a is disposed on the upper surface of the base substrate 10 in the cover 100, the cover is under The surface is flat and has no stepping. Therefore, the cover plate and the display panel can be bonded by the thin OCA glue, which ensures the overall thinness of the display module.
  • the display panel may include an oppositely disposed array substrate (which includes a plurality of pixel regions) and an opposite substrate, and a connection portion that connects the two together.
  • a liquid crystal layer or a plurality of active light emitting elements may be disposed between the array substrate and the opposite substrate.
  • the display device may be a display device such as a liquid crystal panel, a liquid crystal display, a liquid crystal television, an organic electroluminescence display panel, an organic electroluminescence display, an electronic paper, or a digital photo frame.
  • a display device such as a liquid crystal panel, a liquid crystal display, a liquid crystal television, an organic electroluminescence display panel, an organic electroluminescence display, an electronic paper, or a digital photo frame.
  • the display device is a flexible display device, which facilitates bending of the flexible display device with a smaller bend radius, extending the need for further use of the flexible display device.
  • an ink pattern layer for decoration is first prepared on the upper surface of the base substrate, and then a hardening liquid covering the ink pattern layer is formed on the base substrate by a coating process, and hardening is performed by using a coating process.
  • the fluidity of the liquid fills the step at the edge of the ink pattern layer so that the hardened layer formed as a hard coat layer after curing adheres well to the base substrate and the ink pattern layer. Since the ink pattern layer is formed on the upper surface of the base substrate, the lower surface thereof is flat without any step, and the OCA glue having a small thickness can be bonded to the display panel to ensure the thinness of the entire display module.

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  • Nonlinear Science (AREA)
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Abstract

一种母板（01）及其制备方法、盖板（100）及其制备方法、显示装置。母板（01）的制备方法包括：在衬底基板（10）上形成油墨图案层（20），油墨图案层（20）包括多个镂空区域（S1）；在衬底基板（01）上形成覆盖油墨图案层（20）的硬化液（S2）；固化硬化液，形成覆盖油墨图案层（20）的硬化层（30）（S3）。可避免增加显示模组整体的厚度。

Description

母板及其制备方法、盖板及其制备方法、显示装置 技术领域
本发明实施例涉及一种母板及其制备方法、盖板及其制备方法、显示装置。
背景技术
柔性显示装置由于其可自由弯曲、轻薄、防摔等特点而受到广泛关注。为了实现柔性显示装置的可弯曲性甚至达到可折叠显示的效果，需要将其模组结构尽量减薄，以实现更小弯曲半径的需求。
发明内容
本发明的实施例提供一种包括待分割的多个盖板的母板及其制备方法、包括硬化层的盖板及其制备方法、显示装置，本发明实施例可以避免盖板上表面由于装饰油墨边缘存在段差而导致的胶层出现气泡，可采用较薄的胶层贴合盖板与显示面板，避免增加显示模组整体的厚度。
第一方面、本发明实施例提供了一种母板的制备方法，所述制备方法包括：在衬底基板上形成油墨图案层，所述油墨图案层包括多个镂空区域；在所述衬底基板上形成覆盖所述油墨图案层的硬化液；固化所述硬化液，形成覆盖所述油墨图案层的硬化层。
例如，采用涂覆工艺形成所述硬化液。
例如，所述涂覆工艺包括，狭缝涂布工艺、喷涂工艺和旋涂工艺中的任一种工艺。
例如，所述硬化液为光固化型，采用紫外光照射的方式固化所述硬化液，以形成覆盖所述油墨图案层的硬化层；或者，所述硬化液为热固化型，采用加热的方式固化所述硬化液，以形成覆盖所述油墨图案层的硬化层。
例如，采用装饰工艺，在衬底基板上形成油墨图案层，所述装饰工艺包括，油墨丝网印刷、热转印、电镀、拉丝纹处理中的任一种工艺。
例如，所述制备方法还包括，在所述硬化层上形成防护层；所述防护层 包括防污层和/或防反射层。
例如，所述硬化层的远离所述衬底基板的整个表面为平面。
第二方面、本发明实施例还提供了一种母板，其包括：衬底基板；设置在所述衬底基板上的油墨图案层，所述油墨图案层包括多个镂空区域；设置在所述衬底基板上且覆盖所述油墨图案层的硬化层。
第三方面、本发明实施例还提供了一种盖板的制备方法，所述制备方法包括，对上述母板进行切割，形成多个盖板。
第四方面、本发明实施例还提供了一种盖板，其包括：衬底基板；设置在衬底基板的边框区域内的油墨图案；设置在所述衬底基板上且覆盖所述油墨图案的硬化层。
例如，所述衬底基板为柔性衬底基板。
例如，所述柔性衬底基板为偏光片。
例如，所述柔性衬底基板包括聚对苯二甲酸乙二醇酯、聚碳酸酯、三醋酸纤维素、环烯烃聚合物、聚酰亚胺和聚萘二甲酸乙二醇酯中的至少一种材料。
例如，所述衬底基板的厚度范围为5～500μm。
例如，所述油墨图案的厚度范围为5～50μm。
例如，所述硬化层包括聚甲基丙烯酸甲酯、聚对苯二甲酸乙二醇酯、聚氨基甲酸、硅胶和有机复合材料中的至少一种材料。
第五方面、本发明实施例还提供了一种显示装置，其包括：显示面板；上述所述的盖板；用于贴合所述盖板与所述显示面板的胶层；其中，所述胶层设置在所述盖板中的衬底基板远离油墨图案的一侧。
附图说明
为了更清楚地说明本发明实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本发明的一些实施例，而非对本发明的限制。
图1为一种柔性显示装置的分解示意图；
图2为图1所示的柔性显示装置贴合后的局部剖面结构示意图一；
图3为图1所示的柔性显示装置贴合后的局部剖面结构示意图二；
图4a为本发明实施例提供的一种母板的局部剖面结构示意图；
图4b为本发明实施例提供的一种母板的局部剖面结构示意图；
图4c为本发明实施例提供的一种母板未形成硬化层时的俯视结构示意图；
图5为本发明实施例提供的一种母板的制备方法的流程图；
图6为本发明实施例提供的一种盖板应用于柔性显示装置后的弯曲半径示意图；
图7为本发明实施例提供的一种显示装置的分解示意图。
附图标记说明：
01-母板；100-盖板；101-边框区域；10-衬底基板；10a-上表面；10b-下表面；20-油墨图案层；20a-油墨图案；21-第一延伸部；22-第二延伸部；30-硬化层。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚，下面将结合本发明实施例的附图，对本发明实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本发明的一部分实施例，而不是全部的实施例。基于所描述的本发明的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本发明保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本发明所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
由于本发明实施例所涉及的盖板中各膜层的实际厚度非常微小，为了清楚起见，除非另有说明，本发明实施例附图中的各膜层厚度均被放大，不代 表实际厚度与比例。
例如，如图1所示，柔性显示装置包括相对设置的柔性显示面板和盖板(也称为保护盖板)，盖板例如包括塑料基材并且其表面依次形成有具备一定耐刮擦性能的硬化涂层、功能层(如防反射镀膜和防污镀膜)，其背面在对应于柔性显示面板的边框区域处印刷有黑色、白色或其他颜色的装饰油墨，以遮挡柔性显示面板在边框区域内的电路等结构。盖板的背侧与柔性显示面板之间通过OCA胶(Optically Clear Adhesive，用于胶结透明光学元件的特种粘胶剂)贴合在一起。
在研究中，本申请的发明人注意到，由于装饰油墨具有一定的厚度，在使用较薄的OCA胶贴合盖板与柔性显示面板时，如图2所示，较薄的OCA胶难以覆盖住装饰油墨的边缘处，会在边缘处产生贴合气泡，从而影响柔性显示装置的整体显示外观。因此，如图3所示，需要较厚的OCA胶才能达到良好的贴合效果，由此增加了显示模组整体的厚度。
本发明实施例提供了一种如图4a至图4c所示的母板01的制备方法，如图5所示，该制备方法包括：步骤S1、在衬底基板10上形成油墨图案层20，该油墨图案层20包括多个镂空区域；步骤S2、例如采用涂覆工艺，在衬底基板10上形成覆盖油墨图案层20的硬化液；步骤S3、固化上述硬化液，形成覆盖油墨图案层20的硬化层30。
需要说明的是，上述母板01即是包括有待分割的多个小块盖板的一整个基板，在衬底基板10上形成相应的各层后，通过切割工艺即可形成多个盖板，有利于显示产品的量产化。
例如，如图4c所示，油墨图案层20的平面形状为网格状，包括多个第一延伸部21和多个第二延伸部22，第一延伸部21和第二延伸部22交叉形成多个镂空区域，以形成网格状。如图4c所示，以一个母板01包括6个待分割的盖板100为例，母板01中形成的油墨图案层20的平面图案可以是由若干个横纵部分相连形成的具有6个镂空区域的图案。镂空区域即对应于切割后的每个盖板100的透过区域，盖板与显示面板贴合后得到的显示装置中，所述透过区域对应显示装置的显示区域。在衬底基板10上形成覆盖油墨图案层20的硬化层30后，可沿图中虚线所示的切割线将一个母板01分割成6个小块盖板100。即在每个盖板100的边框区域101内都形成有覆盖边框区 域101的用于装饰的油墨图案20a，并且每个油墨图案20a对应一个镂空区域。
这里，本发明实施例对上述油墨图案层20中的镂空区域的数量、分布及图案不作限定。
基于此，本发明实施例提供的上述母板制备方法，采用在衬底基板10上表面10a上先制备用于装饰的油墨图案层20，之后采用例如涂覆工艺在衬底基板10上形成覆盖油墨图案层20的硬化液，利用硬化液的流动性将油墨图案层20的边缘处的段差填平，使得固化后形成的作为硬化涂层的硬化层30良好地附着在衬底基板10以及油墨图案层20上。由于油墨图案层20形成在衬底基板10的上表面(即观看面，也即距离使用者较近的表面)10a，衬底基板10的下表面(即用于进行盖板与显示面板之间的贴合的贴合面)10b平整无段差，可通过厚度较薄的OCA胶与显示面板进行贴合，保证了显示模组整体的薄型化。
以上各步骤说明如下。
例如，在步骤S1中，可采用装饰工艺，在衬底基板10上形成油墨图案层20。例如，装饰工艺可包括油墨丝网印刷、热转印、电镀、拉丝纹处理中的任一种工艺。
例如，在步骤S2中，涂覆工艺可包括狭缝涂布工艺、喷涂工艺和旋涂工艺中的任一种工艺。在步骤S2中，也可以采用除涂覆工艺之外的工艺形成硬化液层。
例如，在步骤S3中，在硬化液为光固化型硬化液的情况下，可采用例如紫外光照射的方式固化硬化液，形成覆盖油墨图案层20的硬化层30。
例如，光固化型的硬化液例如可以是在亚克力系、硅胶系或其他有机复合材料中添加光固化剂，利用光光固化剂在紫外光照射下可吸收紫外光能量，产生活性自由基或阳离子的特性，使得硬化液内部发生一系列的光聚合反应最终固化形成硬化涂层。
例如，在步骤S3中，在硬化液为热固化型的情况下，可采用加热的方式固化硬化液，形成覆盖油墨图案层20的硬化层30。
例如，热固型硬化液的材料例如可以为热固性酚醛树脂材料，热固性酚醛树脂经加热后产生化学变化逐渐硬化成型，再次受热也不会发生软化。
例如，在上述步骤S3之后，根据用户对显示装置进一步的需求，所述方法还可包括步骤S4，如图5所示，在硬化层30上(即硬化层30的远离装饰油墨层20的一侧)继续形成防护层。例如，防护层可包括防污层(Anti-Fingerprint and Scratch，简称为AF/AS)和/或防反射层(Anti-Reflection，简称为AR)。例如，防护层的镀膜工艺可包括热蒸发、电子束蒸发、磁控溅射和湿法喷涂中的任一种工艺。
例如，在防护层包括防污层和防反射层的情况下，通常将AF/AS防污层放置在衬底基板10的最外层，以避免指纹等油污影响防反射层的防反射效果。
在上述基础上，本发明实施例还提供了一种采用上述制备方法获得的包括多个待分割盖板100的母板01，参考图4a至图4c所示，该母板01包括衬底基板10、设置在衬底基板10上的油墨图案层20以及设置在衬底基板10上且覆盖油墨图案层20的硬化层30；油墨图案层20包括多个镂空区域。例如，硬化层30与油墨图案层20相邻并且硬化层30的整个上表面(即远离衬底基板10的表面)为平面。
在本发明实施例中，由于油墨图案层20形成在衬底基板10的上表面10a，衬底基板10的整个下表面10b平整无段差，可通过厚度较薄的OCA胶与显示面板进行贴合，从而保证显示模组整体的薄型化。
下面对该母板01中的各层做进一步说明。
例如，衬底基板10的厚度范围为5～500μm，例如，衬底基板10为柔性衬底基板。由于采用本发明实施例提供的上述制备方法获得的母板01的下表面(参见衬底基板10的下表面10a)平整无段差，切割成小块的盖板后可使用厚度较薄的OCA胶与柔性显示面板进行贴合，如图6所示，形成的柔性显示装置整体厚度较小，弯曲时可获得较小的弯曲半径(图中标记为R)。
例如，柔性衬底基板可包括聚对苯二甲酸乙二醇酯(polyethylene terephthalate，简称为PET)、聚碳酸酯(Polycarbonate，简称为PC)、三醋酸纤维素(Triacetate Cellulose，简称为TAC)、环烯烃聚合物(Cycloolefin Polymer，简称为COP)、聚酰亚胺(Polyimide，简称为PI)和聚萘二甲酸乙二醇酯(Polyethylene naphthalate two formic acid glycolester，简称为PEN)中的至少一种材料。
此外，对于如图1至图3所示结构，如果塑料基板为偏光片，由于偏光片的透过率通常仅为42％～44％，外观上看起来是灰色的，如果想要将盖板的保护功能与偏光片功能集成在一体，参考图2和图3所示，在偏光片的背面涂布装饰油墨后，从偏光片的上表面一侧看到的装饰油墨的颜色就会受到偏光片透过率的影响，难以实现白色油墨或其他颜色油墨的装饰效果，只能涂布颜色较深的黑色油墨。
而采用本发明实施例提供的上述母板01，由于油墨图案层20是在衬底基板10的上方(即位于衬底基板10的观看侧，也为衬底基板10的远离显示面板的一侧)，不会受到偏光片透过率的限制。因此，例如，在本发明的至少一个实施例中，衬底基板10(例如柔性衬底基板)还可以为偏光片，从而实现偏光片与保护盖板一体化的效果，进一步简化盖板结构，降低显示模组整体厚度。
例如，油墨图案层20可以为黑色油墨、白色油墨以及其他颜色的油墨，只要可遮挡住显示面板边框区域内不透光的电路等结构以实现装饰效果即可。油墨图案层20的厚度范围例如为5～50μm。
例如，硬化层30可包括聚甲基丙烯酸甲酯(即亚克力)、聚对苯二甲酸乙二醇酯(polyethylene terephthalate，简称为PET)、聚氨基甲酸(Polyurethane，简称为PU)、硅胶或有机复合材料或类似材料，这些材料对油墨的附着性均较优，可充分地填平油墨边缘处的段差。
例如，硬化层30的厚度由保护盖板需要达到的性能参数及油墨段差决定，本发明实施例对此具体不作限定。
例如，本发明实施例还提供了一种盖板的制备方法，其包括：对上述的母板01进行切割，以形成多个盖板。在该方法中，切割位置位于相邻的镂空区域之间。
例如，可采用激光或刀轮的切割方式，以形成多个盖板。
本发明实施例还提供了一种盖板100，其包括设置在衬底基板10的边框区域101(参考图4c所示)内的油墨图案20a(参考图4c所示)；设置在衬底基板10上且覆盖油墨图案20a的硬化层30。
需要说明的是，此处的衬底基板和硬化层即为将上述母板01进行切割后的小块的衬底基板和硬化层，其材料和厚度可参见上文关于母板01中的各层 说明，此处不再赘述。
例如，该盖板还可以包括位于硬化层30的远离衬底基板10一侧的防护层，例如，防护层包括防污层和/或防反射层。
本发明实施例还提供了一种显示装置，如图7所示，该显示装置包括：显示面板；上述的盖板100，盖板100的油墨图案20a对应于显示面板的边框区域，油墨图案20a围成的镂空区域对应于显示面板的整个显示区；用于贴合盖板100与显示面板的胶层(例如为OCA胶)，胶层设置在盖板100的衬底基板10远离油墨图案20a的一侧。
在本发明实施例中，油墨图案20a与胶层分别位于衬底基板的两侧而非同一侧，并且由于油墨图案20a设置在盖板100中的衬底基板10的上表面，盖板的下表面平整无段差，因此，可通过厚度较薄的OCA胶将盖板与显示面板进行贴合，这保证了显示模组整体的薄型化。
例如，显示面板可以包括相对设置的阵列基板(其包括多个像素区域)和对置基板、以及将二者连接在一起的连接部。例如，阵列基板和对置基板之间可以设有液晶层或者多个主动发光元件(例如有机电致发光元件)。
例如，该显示装置可以为液晶面板、液晶显示器、液晶电视、有机电致发光显示面板、有机电致发光显示器、电子纸或数码相框等显示装置。
例如，显示装置为柔性显示装置，这有利于柔性显示装置以更小的弯曲半径进行弯曲，扩展了柔性显示装置的进一步使用需求。
综上所述，在本发明实施例中，采用在衬底基板上表面上先制备用于装饰的油墨图案层，之后采用涂覆工艺在衬底基板上形成覆盖油墨图案层的硬化液，利用硬化液的流动性将油墨图案层的边缘处的段差填平，使得固化后形成的作为硬化涂层的硬化层良好地附着在衬底基板以及油墨图案层上。由于油墨图案层形成在衬底基板的上表面，其下表面平整无段差，可通过厚度较薄的OCA胶与显示面板进行贴合，保证了显示模组整体的薄型化。
以上所述仅是本发明的示范性实施方式，而非用于限制本发明的保护范围，本发明的保护范围由所附的权利要求确定。
本申请要求于2017年1月12日递交的中国专利申请第201710020981.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。

Claims (17)

  1. 一种母板的制备方法，包括：
    在衬底基板上形成油墨图案层，所述油墨图案层包括多个镂空区域；
    在所述衬底基板上形成覆盖所述油墨图案层的硬化液；以及
    固化所述硬化液，形成覆盖所述油墨图案层的硬化层。
  2. 根据权利要求1所述的制备方法，其中，采用涂覆工艺形成所述硬化液。
  3. 根据权利要求2所述的制备方法，其中，所述涂覆工艺包括狭缝涂布工艺、喷涂工艺和旋涂工艺中的任一种工艺。
  4. 根据权利要求1至3中任一项所述的制备方法，其中，
    所述硬化液为光固化型，并且采用紫外光照射的方式固化所述硬化液，以形成覆盖所述油墨图案层的硬化层；
    或者，
    所述硬化液为热固化型，并且采用加热的方式固化所述硬化液，以形成覆盖所述油墨图案层的硬化层。
  5. 根据权利要求1至4中任一项所述的制备方法，其中，
    采用装饰工艺，在衬底基板上形成油墨图案层，所述装饰工艺包括油墨丝网印刷、热转印、电镀、拉丝纹处理中的任一种工艺。
  6. 根据权利要求1至5中任一项所述的制备方法，还包括：在所述硬化层上形成防护层，其中，所述防护层包括防污层和/或防反射层。
  7. 根据权利要求1至6中任一项所述的制备方法，其中，所述硬化层的远离所述衬底基板的整个表面为平面。
  8. 一种母板，包括：
    衬底基板；
    设置在所述衬底基板上的油墨图案层，其中，所述油墨图案层包括多个镂空区域；以及
    设置在所述衬底基板上且覆盖所述油墨图案层的硬化层。
  9. 一种盖板的制备方法，包括：对如权利要求8所述的母板进行切割，以形成多个盖板。
  10. 一种盖板，包括：
    衬底基板；
    设置在衬底基板的边框区域内的油墨图案；
    设置在所述衬底基板上且覆盖所述油墨图案的硬化层。
  11. 根据权利要求10所述的盖板，其中，所述衬底基板为柔性衬底基板。
  12. 根据权利要求11所述的盖板，其中，所述柔性衬底基板为偏光片。
  13. 根据权利要求10至12中任一项所述的盖板，其中，所述柔性衬底基板包括聚对苯二甲酸乙二醇酯、聚碳酸酯、三醋酸纤维素、环烯烃聚合物、聚酰亚胺和聚萘二甲酸乙二醇酯中的至少一种材料。
  14. 根据权利要求10至13中的任一项所述的盖板，其中，所述衬底基板的厚度范围为5～500μm。
  15. 根据权利要求10至14中的任一项所述的盖板，其中，所述油墨图案的厚度范围为5～50μm。
  16. 根据权利要求10至15中的任一项所述的盖板，其中，所述硬化层包括聚甲基丙烯酸甲酯、聚对苯二甲酸乙二醇酯、聚氨基甲酸、硅胶和有机复合材料中的至少一种材料。
  17. 一种显示装置，包括：
    显示面板；
    如权利要求10至16中任一项所述的盖板；以及
    用于贴合所述盖板与所述显示面板的胶层；
    其中，所述胶层设置在所述盖板中的衬底基板远离油墨图案的一侧。
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