WO2018107922A1 - 一种太阳能电池线路板及其制备方法以及太阳能电池 - Google Patents

一种太阳能电池线路板及其制备方法以及太阳能电池 Download PDF

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WO2018107922A1
WO2018107922A1 PCT/CN2017/109777 CN2017109777W WO2018107922A1 WO 2018107922 A1 WO2018107922 A1 WO 2018107922A1 CN 2017109777 W CN2017109777 W CN 2017109777W WO 2018107922 A1 WO2018107922 A1 WO 2018107922A1
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Prior art keywords
solar cell
copper foil
board according
circuit board
etching
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PCT/CN2017/109777
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English (en)
French (fr)
Inventor
闫勇
高小君
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苏州城邦达力材料科技有限公司
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Priority to JP2018600028U priority Critical patent/JP3224280U/ja
Publication of WO2018107922A1 publication Critical patent/WO2018107922A1/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/02016—Circuit arrangements of general character for the devices
    • H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
    • H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Definitions

  • the invention relates to the technical field of solar cells, in particular to a solar cell circuit board and a preparation method thereof.
  • Solar energy is a new type of clean and environmentally-friendly energy that can be reused and reused.
  • the development and utilization of solar energy has become an important part of the world's sustainable development strategies. Better use of solar energy is also a research content. It is also important to improve solar power generation efficiency. Research topics.
  • the object of the present invention is to provide a solar cell circuit board and a preparation method thereof, which have better oxidation resistance and solderability in a harsh environment.
  • a solar cell circuit board comprising: a solar cell sheet and a resin substrate, wherein the resin substrate is coated with an adhesive layer, the adhesive layer is compounded with a copper foil, and the copper foil is etched thereon a line, the surface of the line is plated with an oxidation resistant coating; the line is bonded to the solar cell sheet by low temperature soldering.
  • the low-temperature solder is a solder containing antimony or indium, and the melting point temperature is 95 ° C to 135 ° C.
  • the anti-oxidation coating has a zinc content of 0.5 to 25 mg/m 2 , a nickel content of 0.5 to 10 mg/m 2 , and a chromium content of 0.5 to 8 mg/m 2 .
  • the adhesive layer comprises the following components by weight: 20-100 parts of resin; 1-5 parts of curing agent; 0.1-0.5 parts of auxiliary; 0.1-0.5 parts of filler; 5-10 parts of solvent;
  • the thickness of the adhesive layer is 8 to 20 ⁇ m, preferably 8 to 16 ⁇ m, more preferably 8 to 13 ⁇ m.
  • the solvent can be water or an alcohol.
  • the resin is a mixture of one or more of polyurethane, epoxy resin, and acrylic resin.
  • the resin substrate is one or more of polyethylene naphthalate (PEN), polyethylene terephthalate (PET), and polyimide (PI).
  • PEN polyethylene naphthalate
  • PET polyethylene terephthalate
  • PI polyimide
  • the resin substrate has a thickness of 45 to 125 ⁇ m, preferably 50 to 100 ⁇ m, more preferably 50 to 80 ⁇ m.
  • the copper foil has a thickness of 10 to 45 ⁇ m, preferably 15 to 42 ⁇ m, more preferably 18 to 40 ⁇ m.
  • the copper foil is microetched prior to etching to form the line.
  • the method for preparing the above solar cell circuit board comprises the following steps:
  • the copper clad laminate has the resin substrate (2) and the copper foil (4) composited on the resin substrate (2) by the adhesive layer (6);
  • the wiring (3) plated with the oxidation-resistant plating layer (7) and the solar cell sheet (8) are joined by low-temperature soldering.
  • the flexible copper clad laminate is formed by uniformly coating an adhesive on the resin substrate (2) to form the adhesive layer (6), and then compounding the copper foil (4) And mature.
  • the top surface of the copper foil (4) is microetched before the line (3) is etched on the copper foil (4).
  • the micro-etching treatment is performed by etching the copper foil (4) in a sulfuric acid-hydrogen peroxide micro-etching solution for 30 s to 60 s, preferably 40 to 55 s, more preferably 40 to 50 s.
  • the line (3) is cleaned and dried prior to plating the anti-oxidation coating (7) on the line (3).
  • the electroplating oxidation-proof plating layer (7) can be well adhered to the surface thereof, and the plating effect is better.
  • etching the copper foil (4) to form a line (3) by bonding the copper foil (4) to the dry film (5), exposing, developing, and performing in a ferric chloride etching solution. Etching.
  • the concentration of the ferric chloride etching solution is 200-300 g/L.
  • the etching temperature is 40 to 60 ° C and the pressure is 1.5 to 3 kg/cm 2 . A good etching effect can be achieved at this temperature and pressure range.
  • the etching time is 2 to 4 minutes.
  • the above method for preparing a solar cell circuit board comprises the following steps:
  • Step A preparing an adhesive, uniformly coating an adhesive on a resin substrate to form an adhesive layer, and then composite copper foil and aging to form a flexible copper clad laminate;
  • Step B performing a micro-etching treatment on the smooth surface (S surface) of the copper foil in the step A to remove the copper foil protective layer of the copper foil to expose the copper foil base layer;
  • Step C etching the copper foil treated by the step B to form a line, cleaning and drying;
  • Step D plating an anti-oxidation coating on the line in the step C;
  • Step E The line processed by the step D is bonded to the solar cell sheet by low temperature soldering.
  • the copper foil in the step B is etched in a concentration of sulfuric acid-hydrogen peroxide microetching solution for 30 s to 60 s.
  • the copper foil in the step C is exposed to a dry film, exposed, developed, and etched in a ferric chloride etching solution having a concentration of 200 to 300 g/L.
  • the etching process parameters are: 40 to 60. °C, the pressure is 1.5 to 3 kg/cm 2 , and the etching time is 2 to 4 minutes.
  • the invention further relates to a solar cell comprising the solar cell circuit board described above.
  • the invention has the beneficial effects that the invention provides a solar cell circuit board and a preparation method thereof, which are simple to prepare and have better oxidation resistance and solderability in a harsh environment.
  • FIG. 1 is a schematic structural view of a solar cell circuit board connected to a solar cell sheet provided by the present invention
  • FIG. 2a is a schematic structural view of a solar cell circuit board provided by the present invention.
  • Figure 2b is a cross-sectional view taken along line A-A of Figure 2a;
  • FIG. 2c is a schematic structural view of a solar cell circuit board of FIG. 2a before etching
  • FIG. 2d is a schematic structural view of a solar cell circuit board of FIG. 2c after micro-etching
  • FIG. 2e is a schematic structural view of a solar cell circuit board of FIG. 2d after being adhered to a dry film;
  • FIG. 2f is a schematic structural view of a solar cell circuit board of FIG. 2e after etching a line;
  • FIG. 2g is a schematic structural view of a solar cell circuit board of FIG. 2f after peeling off the dry film;
  • FIG. 2h is a schematic view showing the structure of a solar cell circuit board of FIG. 2g after the copper foil is coated with an anti-oxidation coating.
  • a solar cell circuit board 1 according to the present invention comprises: a solar cell sheet 8 and a resin substrate 2 , and the resin substrate 2 is coated with an adhesive layer 6 .
  • the adhesive layer 6 is compounded with a copper foil 4, and the copper foil 4 is etched to form a line 3, and the surface of the line 3 is plated with an oxidation-resistant plating layer 7; the line 3 and the solar cell sheet 8 are joined by low-temperature soldering.
  • the solar cell sheet 8 is bonded to the line 3 by soldering, which can improve the heat dissipation function, reduce the internal resistance, and has good oxidation resistance and processability, thereby making the solar cell circuit board 1 have better oxidation resistance in a harsh environment. Sex and solderability.
  • the resin substrate 2 is polyethylene terephthalate (PET), and 8 ⁇ m of an adhesive is coated on a polyethylene terephthalate (PET) having a thickness of 50 ⁇ m to form a glue.
  • the adhesive layer 6 is further compounded with a 20 um copper foil 4 on the adhesive layer 6, and is matured to form a flexible copper clad laminate.
  • the copper foil 4 includes a copper foil base layer 41 and a copper foil protective layer 42 for preventing oxidation of the copper foil base layer 41, wherein the copper foil protective layer 42 has a zinc content of 33.68 mg/m 2 and a nickel content of 11.79 mg/ m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 50 parts by weight of the resin, 3 parts of the curing agent, 0.3 parts of the auxiliary agent, 0.3 parts of the filler, 7 parts of the solvent, and the resin is polyurethane.
  • the above flexible copper clad laminate was cut into four samples of 170 mm * 170 mm, and these samples were labeled as Sample 1, Sample 2, Sample 3, and Sample 4.
  • Three samples of sample 1, sample 2 and sample 3 were etched in a sulfuric acid-hydrogen peroxide micro-etching solution for 45 s, and then removed with water to etch away the copper foil protective layer 42 of the copper foil 4 to expose the copper foil base layer 41. , as shown in Figure 2d.
  • the element contents of Sample 1, Sample 2, and Sample 3 were measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the above four samples were subjected to a process of peeling off the dry film 5, wherein during the etching and peeling of the dry film 5, the element content loss in the copper foil protective layer 42 was reduced to: zinc content of 26.35 mg/m 2 , The nickel content was 10.41 mg/m 2 and the chromium content was 5.01 mg/m 2 .
  • the etched sample 1, sample 2, and sample 3 are plated through an oxidation preventing treatment tank to form an oxidation preventing plating layer 7, and the amounts of each element in the oxidation preventing plating layer 7 of the sample 1, the sample 2, and the sample 3 are respectively: galvanized Amount of 0mg/m 2 , 2mg/m 2 , 15mg/m 2 ; nickel plating amount 0mg/m 2 , 1mg/m 2 , 8mg/m 2 ; chrome plating amount 0mg/m 2 , 2mg/m 2 , 4mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • the structures of Sample 1, Sample 2 and Sample 3 in this process are shown in Figures 2f to 2h.
  • the resin substrate 2 is polyethylene naphthalate (PEN), and a 20 ⁇ m adhesive is coated on a polyethylene naphthalate (PEN) having a thickness of 45 ⁇ m to form an adhesive.
  • the copper foil 4 comprises a base layer 41 and a protective layer of copper foil to prevent oxidation of the base layer 41 of 42, wherein the protective foil layer 42: zinc content is 33.68mg / m 2, the nickel content is 11.79mg / m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 20 parts by weight of the resin, 1 part of the curing agent, 0.1 part of the auxiliary agent, 0.1 part of the filler, 5 parts of the solvent, and the resin is an epoxy resin.
  • the flexible copper clad laminate was cut into four samples of 170 mm*170 mm, and the samples were etched in a sulfuric acid-hydrogen peroxide microetching solution for 30 s, and then taken out and cleaned with water to etch away the copper foil protective layer 42 of the copper foil 4.
  • the copper foil base layer 41 is exposed.
  • the element content of the four samples was measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the four samples were subjected to the step of peeling off the dry film 5, and the four samples subjected to the etching treatment were plated by an oxidation preventing treatment tank to form an oxidation preventing plating layer 7.
  • the amount of each element in the oxidation preventing plating layer 7 was: galvanizing amount: 0 mg /m 2 , 0.5 mg/m 2 , 10 mg/m 2 , 20 mg/m 2 ; nickel plating amount 0 mg/m 2 , 0.5 mg/m 2 , 5 mg/m 2 , 10 mg/m 2 ; chrome plating amount 0 mg/m 2 , 0.5 mg/m 2 , 3 mg/m 2 , 5 mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • the resin substrate 2 is polyimide (PI), and a coating layer of 12 ⁇ m is coated on a polyimide (PI) having a thickness of 45 ⁇ m to form an adhesive layer 6 and then in an adhesive.
  • a 45 um copper foil 4 is laminated on the layer 6 and cured to form a flexible copper clad laminate.
  • the copper foil 4 includes a copper foil base layer 41 and a copper foil protective layer 42 for preventing oxidation of the copper foil base layer 41, wherein the copper foil protective layer 42 has a zinc content of 33.68 mg/m 2 and a nickel content of 11.79 mg/ m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 100 parts by weight of the resin, 5 parts of curing agent, 0.5 part of auxiliary agent, 0.5 part of filler, 10 parts of solvent, and the resin is acrylic resin.
  • the flexible copper clad laminate was cut into four samples of 170 mm*170 mm, and the samples were etched in a sulfuric acid-hydrogen peroxide microetching solution for 60 s, and then removed with water to etch away the copper foil protective layer 42 of the copper foil 4.
  • the copper foil base layer 41 is exposed.
  • the element content of the four samples was measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the four samples were subjected to a step of peeling off the dry film 5, and the four samples subjected to the etching treatment were plated by an oxidation preventing treatment tank to form an oxidation preventing plating layer 7.
  • the amount of each element in the oxidation preventing plating layer 7 was galvanized by 0.6. Mg/m 2 , 0.9 mg/m 2 , 8 mg/m 2 , 15 mg/m 2 ; nickel plating amount: 0.6 mg/m 2 , 0.9 mg/m 2 , 2 mg/m 2 , 8 mg/m 2 ; chrome plating amount: 0.9 mg /m 2 , 1 mg/m 2 , 2 mg/m 2 , 4 mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • the resin substrate 2 is polyimide (PI), and a 15 ⁇ m adhesive is coated on a polyimide (PI) having a thickness of 100 ⁇ m to form an adhesive layer 6, and then in an adhesive.
  • the 18um copper foil 4 is laminated on the layer 6 and matured to form a flexible copper clad laminate.
  • the copper foil 4 includes a copper foil base layer 41 and a copper foil protective layer 42 for preventing oxidation of the copper foil base layer 41, wherein the copper foil protective layer 42 has a zinc content of 33.68 mg/m 2 and a nickel content of 11.79 mg/ m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 65 parts by weight of the resin, 4 parts of the curing agent, 0.4 parts of the auxiliary agent, 0.4 parts of the filler, 8 parts of the solvent, and the resin is an acrylic resin.
  • the flexible copper clad laminate was cut into four samples of 170 mm*170 mm, and the samples were taken out in a sulfuric acid-hydrogen peroxide microetching solution for 50 s, and then removed with water to etch away the copper foil protective layer 42 of the copper foil 4.
  • the copper foil base layer 41 is exposed.
  • the element content of the four samples was measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the four samples were subjected to a step of peeling off the dry film 5, and the four samples subjected to the etching treatment were plated by an oxidation preventing treatment tank to form an oxidation preventing plating layer 7.
  • the amount of each element in the oxidation preventing plating layer 7 was galvanized by 0.6. Mg/m 2 , 0.9 mg/m 2 , 8 mg/m 2 , 15 mg/m 2 ; nickel plating amount: 0.6 mg/m 2 , 0.9 mg/m 2 , 2 mg/m 2 , 8 mg/m 2 ; chrome plating amount: 0.9 mg /m 2 , 1 mg/m 2 , 2 mg/m 2 , 4 mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • the resin substrate 2 is polyethylene terephthalate (PET), and a 16 ⁇ m adhesive is coated on a polyethylene terephthalate (PET) having a thickness of 80 ⁇ m to form a glue.
  • the adhesive layer 6 is further laminated on the adhesive layer 6 with a 35 um copper foil 4, which is aged to form a flexible copper clad laminate.
  • the copper foil 4 includes a copper foil base layer 41 and a copper foil protective layer 42 for preventing oxidation of the copper foil base layer 41, wherein the copper foil protective layer 42 has a zinc content of 33.68 mg/m 2 and a nickel content of 11.79 mg/ m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 82 parts by weight of the resin, 3.5 parts of the curing agent, 0.35 parts of the auxiliary agent, 0.35 parts of the filler, 6.5 parts of the solvent, and the resin is polyurethane.
  • the flexible copper clad laminate was cut into four samples of 170 mm*170 mm, and the samples were etched in a sulfuric acid-hydrogen peroxide microetching solution for 35 s, and then removed with water to etch away the copper foil protective layer 42 of the copper foil 4.
  • the copper foil base layer 41 is exposed.
  • the element content of the four samples was measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the four samples were subjected to a step of peeling off the dry film 5, and the four samples subjected to the etching treatment were plated by an oxidation preventing treatment tank to form an oxidation preventing plating layer 7.
  • the amount of each element in the oxidation preventing plating layer 7 was galvanized by 0.6. Mg/m 2 , 0.9 mg/m 2 , 8 mg/m 2 , 15 mg/m 2 ; nickel plating amount: 0.6 mg/m 2 , 0.9 mg/m 2 , 2 mg/m 2 , 8 mg/m 2 ; chrome plating amount: 0.9 mg /m 2 , 1 mg/m 2 , 2 mg/m 2 , 4 mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • the resin substrate 2 is polyethylene naphthalate (PEN), and a 16 ⁇ m adhesive is coated on a polyethylene naphthalate (PEN) having a thickness of 80 ⁇ m to form an adhesive.
  • Layer 6, and then 35um copper foil 4 is laminated on the adhesive layer 6, and is matured to form a flexible copper clad laminate.
  • the copper foil 4 includes a copper foil base layer 41 and a copper foil protective layer 42 for preventing oxidation of the copper foil base layer 41, wherein the copper foil protective layer 42 has a zinc content of 33.68 mg/m 2 and a nickel content of 11.79 mg/ m 2 , chromium content 7.2 mg / m 2 .
  • the adhesive layer 6 comprises 82 parts by weight of the resin, 3.5 parts of the curing agent, 0.35 parts of the auxiliary agent, 0.35 parts of the filler, 6.5 parts of the solvent, and the resin is polyurethane.
  • the flexible copper clad laminate was cut into four samples of 170 mm*170 mm, and the samples were etched in a sulfuric acid-hydrogen peroxide microetching solution for 35 s, and then removed with water to etch away the copper foil protective layer 42 of the copper foil 4.
  • the copper foil base layer 41 is exposed.
  • the element content of the four samples was measured by an EDS tester to judge whether or not the copper foil protective layer 42 was completely etched away.
  • the four samples were subjected to a step of peeling off the dry film 5, and the four samples subjected to the etching treatment were plated by an oxidation preventing treatment tank to form an oxidation preventing plating layer 7.
  • the amount of each element in the oxidation preventing plating layer 7 was galvanized by 0.6. Mg/m 2 , 0.9 mg/m 2 , 8 mg/m 2 , 15 mg/m 2 ; nickel plating amount: 0.6 mg/m 2 , 0.9 mg/m 2 , 2 mg/m 2 , 8 mg/m 2 ; chrome plating amount: 0.9 mg /m 2 , 1 mg/m 2 , 2 mg/m 2 , 4 mg/m 2 .
  • the elemental content of the oxidation-resistant plating layer 7 was measured by an EDS test.
  • Example 1 The four samples and the original sample in Example 1 were cut into a size of 5 cm*5 cm, and the low-temperature solder paste of silver 1% was heated and melted at 160 ° C to 180 ° C by coating a tin content of 42% and a cerium content of 57%. The solderability of the four samples was visually observed. The above four samples and the original samples were tested at 85 ° C and 85% RH for 24 h to visually measure oxidation resistance and solder adhesion, wherein the original sample refers to a flexible copper clad laminate.
  • the solar cell circuit board proposed by the invention has simple preparation and good oxidation resistance and solderability in a harsh environment.
  • the flexible wiring board bonds the solar cell sheet 8 to the wiring 3 by soldering, thereby improving the heat dissipation function, reducing the internal resistance, and also having good oxidation resistance and processability.
  • the present invention provides a solar cell circuit board and a preparation method thereof, which are simple to prepare and have good oxidation resistance and solderability in a harsh environment.
  • the solar cell circuit board can be used for preparing a solar cell, so that it can be used in a harsh environment, and the solar cell circuit board and the preparation method thereof can be widely applied in the field of solar cell technology, and generate great economic value.

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Abstract

一种太阳能电池线路板（1）及其制备方法以及太阳能电池，包括：太阳能电池片（8）及树脂基材（2），树脂基材上涂布有胶黏剂层（6），胶黏剂层上复合有铜箔（4），铜箔上蚀刻形成线路（3），线路的表面镀有防氧化镀层（7）；线路与太阳能电池片通过低温焊锡接合。该太阳能电池线路板制备简单，并且在恶劣环境下具有较好的抗氧化性和可焊性。

Description

一种太阳能电池线路板及其制备方法以及太阳能电池
本申请要求于2016年12月13日提交中国专利局的申请号为201611146604.2、名称为“一种太阳能电池线路板及其制备方法”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本发明涉及太阳能电池技术领域，尤其涉及一种太阳能电池线路板及其制备方法。
背景技术
太阳能为一种新型可再生可持续利用的清洁环保型能源，开发和利用太阳能成为世界各国制定可持续发展战略的重要内容，而更好的利用太阳能也是研究内容，提高太阳能的发电效率也是重要的研究课题。
发明内容
本发明的目的在于提出一种太阳能电池线路板及其制备方法，在恶劣环境下具有较好的抗氧化性和可焊性。
为达此目的，本发明采用以下技术方案：
一种太阳能电池线路板，包括：太阳能电池片及树脂基材，所述树脂基材上涂布有胶黏剂层，所述胶黏剂层上复合有铜箔，所述铜箔上蚀刻形成线路，所述线路的表面镀有防氧化镀层；所述线路与所述太阳能电池片通过低温焊锡接合。
其中，低温焊锡是含铋或铟类的焊料，熔点温度为95℃～135℃。
可选地，所述防氧化镀层中锌含量为0.5～25mg/m2、镍含量为0.5～10mg/m2、铬含量为0.5～8mg/m2。
可选地，所述胶黏剂层包括以下重量份的组分：树脂20～100份；固化剂1～5份；助剂0.1～0.5份；填料0.1～0.5份；溶剂5～10份；所述胶黏剂层的厚度为8～20μm，优选8～16μm，更优选8～13μm。溶剂可以为水或醇类。
可选地，所述树脂为聚氨酯、环氧树脂、丙烯酸树脂中的一种或几种的混合。
可选地，所述树脂基材为聚萘二甲酸乙二醇酯(PEN)、聚对苯二甲酸乙二醇酯(PET)、聚酰亚胺(PI)中的一种或几种的混合；所述树脂基材的厚度为45～125um，优选50～100μm，更优选50～80μm。
可选地，所述铜箔的厚度为10～45um，优选15～42μm，更优选18～40μm。
可选地，所述铜箔在蚀刻形成所述线路之前进行微蚀刻处理。
上述太阳能电池线路板的制备方法，包括以下步骤：
在柔性覆铜板上的铜箔(4)上进行蚀刻成型出形成所述线路(3)，其中，所述柔性 覆铜板具有所述树脂基材(2)以及通过所述胶黏剂层(6)复合在所述树脂基材(2)上的所述铜箔(4)；
在所述线路(3)上电镀所述防氧化镀层(7)；
将电镀有所述防氧化镀层(7)的线路(3)与所述太阳能电池片(8)通过低温焊锡接合。
可选地，所述柔性覆铜板是通过以下步骤形成：在所述树脂基材(2)上均匀涂布胶黏剂形成所述胶黏剂层(6)后复合所述铜箔(4)并熟化。
可选地，在所述铜箔(4)上蚀刻所述线路(3)之前，对所述铜箔(4)的顶面进行微刻蚀处理。
可选地，进行微刻蚀处理是将所述铜箔(4)在硫酸-双氧水微蚀刻液中蚀刻30s～60s，优选40～55s，更优选40～50s。
可选地，在所述线路(3)上电镀所述防氧化镀层(7)之前，对所述线路(3)进行清洗并烘干。通过清洗和烘干使得在电镀防氧化镀层(7)时能够很好地在其表面附着，电镀效果更好。
可选地，在所述铜箔(4)上刻蚀形成线路(3)是将所述铜箔(4)经贴合干膜(5)后曝光、显影，在氯化铁蚀刻液中进行蚀刻。
可选地，所述氯化铁蚀刻液的浓度为200～300g/L。
可选地，刻蚀的温度为40～60℃，压力为1.5～3kg/cm2。在该温度以及压力范围内能够达到很好地蚀刻效果。
可选地，蚀刻时间为2～4min。
上述一种太阳能电池线路板的制备方法，包括以下步骤：
步骤A：制备胶黏剂，在树脂基材上均匀涂布胶黏剂形成胶黏剂层后复合铜箔并熟化形成柔性覆铜板；
步骤B：对所述步骤A中的铜箔的光面(S面)进行微蚀刻处理，以去除铜箔的铜箔防护层，暴露出铜箔基层；
步骤C：对经所述步骤B处理后的铜箔进行蚀刻形成线路，清洗并烘干；
步骤D：在所述步骤C中的线路上电镀防氧化镀层；
步骤E：将经所述步骤D处理后的线路与太阳能电池片通过低温焊锡接合。
可选地，所述步骤B中的铜箔在浓度为硫酸-双氧水微蚀刻液中蚀刻30s～60s。
可选地，所述步骤C中的铜箔经贴合干膜后曝光、显影，在浓度为200～300g/L的氯化铁蚀刻液中进行蚀刻，蚀刻工艺参数为：温度为40～60℃，压力为1.5～3kg/cm2，蚀刻时间为2～4min。
本发明还涉及一种太阳能电池，其包括上述的太阳能电池线路板。
本发明的有益效果为：本发明提出一种太阳能电池线路板及其制备方法，制备简单，并且在恶劣环境下具有较好的抗氧化性和可焊性。
附图说明
为了更清楚地说明本发明具体实施方式或现有技术中的技术方案，下面将对具体实施方式或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图是本发明的一些实施方式，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他的附图。
图1是本发明提供的一种太阳能电池线路板连接太阳能电池片的结构示意图；
图2a是本发明提供的一种太阳能电池线路板的结构示意图；
图2b是图2a中的A-A剖视图；
图2c是图2a中的一种太阳能电池线路板在蚀刻前的结构示意图；
图2d是图2c中的一种太阳能电池线路板在微蚀刻后的结构示意图；
图2e是图2d中的一种太阳能电池线路板在贴合干膜后的结构示意图；
图2f是图2e中的一种太阳能电池线路板在蚀刻出线路后的结构示意图；
图2g是图2f中的一种太阳能电池线路板在剥离干膜后的结构示意图；
图2h是图2g中的一种太阳能电池线路板在铜箔镀防氧化镀层后的结构示意图。
图中：1-太阳能电池线路板；2-树脂基材；3-线路；41-铜箔基层；42-铜箔防护层；4-铜箔；5-干膜；6-胶黏剂层；7-防氧化镀层；8-太阳能电池片。
具体实施方式
下面将结合附图对本发明的技术方案进行清楚、完整地描述，显然，所描述的实施例是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
如图1、图2a及图2b所示，本发明提出的一种太阳能电池线路板1，包括：太阳能电池片8及树脂基材2，树脂基材2上涂布有胶黏剂层6，胶黏剂层6上复合有铜箔4，铜箔4上蚀刻形成线路3，线路3的表面镀有防氧化镀层7；线路3与太阳能电池片8通过低温焊锡接合。通过焊锡将太阳能电池片8与线路3接合，既可以提高散热功能、减少内阻，还具有很好防氧化性和加工性，进而使得太阳能电池线路板1在恶劣环境下具有较好的抗氧化性和可焊性。
实施例1
本实施例中，树脂基材2为聚对苯二甲酸乙二醇酯(PET)，在厚度为50um的聚对苯 二甲酸乙二醇酯(PET)上涂布8μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合20um铜箔4，经熟化形成柔性覆铜板。如图2c所示。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为78μm，TD＝340mm、MD＝340mm。其中，胶黏剂层6按重量份数计包括树脂50份；固化剂3份；助剂0.3份；填料0.3份；溶剂7份；树脂为聚氨酯。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品标记为：样品1、样品2、样品3及样品4。将样品1、样品2及样品3三个样品在硫酸-双氧水微蚀刻液中蚀刻45s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41，如图2d所示。用EDS测试仪测定样品1、样品2及样品3的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度50℃压力为2KG/cm2下通过浓度为250mol/L氯化铁蚀刻液中蚀刻3min后取出，以蚀刻出线路3，用清水清洗干净后干燥，得到4个170mm*170mm样品。其中，样品1、样品2及样品3的结构如图2e所示。
将上述4个样品进行剥离干膜5工序，其中，样品4在蚀刻及剥离干膜5的过程中，其铜箔防护层42中的元素含量损耗，降为：锌含量26.35mg/m2、镍含量10.41mg/m2、铬含量5.01mg/m2。将上述经过蚀刻处理的样品1、样品2及样品3通过防氧化处理槽进行电镀，形成防氧化镀层7，样品1、样品2及样品3的防氧化镀层7中各元素量分别为：镀锌量0mg/m2，2mg/m2，15mg/m2；镀镍量0mg/m2，1mg/m2，8mg/m2；镀铬量0mg/m2，2mg/m2，4mg/m2。通过EDS测试测定防氧化镀层7的元素含量。在该过程中样品1、样品2及样品3的结构如图2f至图2h所示。
实施例2
本实施例中，树脂基材2为聚萘二甲酸乙二醇酯(PEN)，在厚度为45um的聚萘二甲酸乙二醇酯(PEN)上涂布20μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合10um铜箔4，经熟化形成柔性覆铜板。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为75μm，TD＝340mm、MD＝340mm。
其中，胶黏剂层6按重量份数计包括树脂20份；固化剂1份；助剂0.1份；填料0.1份；溶剂5份；树脂为环氧树脂。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品在硫酸-双氧水微蚀刻液中蚀刻30s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41。用EDS测试仪测定4个样品的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度40℃压力为1.5KG/cm2下通过浓度为200mol/L氯化铁蚀刻液中蚀刻2min后取出，以蚀刻出线路3，用清水清洗干净，得到4个170mm*170mm样品。
将上述4个样品进行剥离干膜5工序，将上述经过蚀刻处理的4个样品通过防氧化处理槽进行电镀，形成防氧化镀层7，防氧化镀层7中各元素量分别为：镀锌量0mg/m2，0.5mg/m2，10mg/m2，20mg/m2；镀镍量0mg/m2，0.5mg/m2，5mg/m2，10mg/m2；镀铬量0mg/m2，0.5mg/m2，3mg/m2，5mg/m2。通过EDS测试测定防氧化镀层7的元素含量。
实施例3
本实施例中，树脂基材2为聚酰亚胺(PI)，在厚度为45um的聚酰亚胺(PI)上涂布12μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合45um铜箔4，经熟化形成柔性覆铜板。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为102μm，TD＝340mm、MD＝340mm。
其中，胶黏剂层6按重量份数计包括树脂100份；固化剂5份；助剂0.5份；填料0.5份；溶剂10份；树脂为丙烯酸树脂。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品在硫酸-双氧水微蚀刻液中蚀刻60s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41。用EDS测试仪测定4个样品的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度60℃压力为1.5KG/cm2下通过浓度为200mol/L氯化铁蚀刻液中蚀刻4min后取出，以蚀刻出线路3，用清水清洗干净，得到4个170mm*170mm样品。
将上述4个样品进行剥离干膜5工序，将上述经过蚀刻处理的4个样品通过防氧化处理槽进行电镀，形成防氧化镀层7，防氧化镀层7中各元素量分别为：镀锌量0.6mg/m2，0.9mg/m2，8mg/m2，15mg/m2；镀镍量0.6mg/m2，0.9mg/m2，2mg/m2，8mg/m2；镀铬量0.9mg/m2，1mg/m2，2mg/m2，4mg/m2。通过EDS测试测定防氧化镀层7的元素含量。
实施例4
本实施例中，树脂基材2为聚酰亚胺(PI)，在厚度为100um的聚酰亚胺(PI)上涂布15μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合18um铜箔4，经熟化形成柔性覆铜板。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为133μm，TD＝340mm、MD＝340mm。
其中，胶黏剂层6按重量份数计包括树脂65份；固化剂4份；助剂0.4份；填料0.4份；溶剂8份；树脂为丙烯酸树脂。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品在硫酸-双氧水微蚀刻液中蚀刻50s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41。用EDS测试仪测定4个样品的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度45℃压力为2.5KG/cm2下通过浓度为275mol/L氯化铁蚀刻液中蚀刻2.5min后取出，以蚀刻出线路3，用清水清洗干净，得到4个170mm*170mm样品。
将上述4个样品进行剥离干膜5工序，将上述经过蚀刻处理的4个样品通过防氧化处理槽进行电镀，形成防氧化镀层7，防氧化镀层7中各元素量分别为：镀锌量0.6mg/m2，0.9mg/m2，8mg/m2，15mg/m2；镀镍量0.6mg/m2，0.9mg/m2，2mg/m2，8mg/m2；镀铬量0.9mg/m2，1mg/m2，2mg/m2，4mg/m2。通过EDS测试测定防氧化镀层7的元素含量。
实施例5
本实施例中，树脂基材2为聚对苯二甲酸乙二醇酯(PET)，在厚度为80um的聚对苯二甲酸乙二醇酯(PET)上涂布16μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合35um铜箔4，经熟化形成柔性覆铜板。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为121μm，TD＝340mm、MD＝340mm。
其中，胶黏剂层6按重量份数计包括树脂82份；固化剂3.5份；助剂0.35份；填料0.35份；溶剂6.5份；树脂为聚氨酯。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品在硫酸-双氧水微蚀刻液中蚀刻35s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41。用EDS测试仪测定4个样品的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度50℃压力为3KG/cm2下通过浓度为250mol/L氯化铁蚀刻液中蚀刻3min后取出，以蚀刻出线路3，用清水清洗干净，得到4个170mm*170mm样品。
将上述4个样品进行剥离干膜5工序，将上述经过蚀刻处理的4个样品通过防氧化处理槽进行电镀，形成防氧化镀层7，防氧化镀层7中各元素量分别为：镀锌量0.6mg/m2，0.9mg/m2，8mg/m2，15mg/m2；镀镍量0.6mg/m2，0.9mg/m2，2mg/m2，8mg/m2；镀铬量0.9mg/m2，1mg/m2，2mg/m2，4mg/m2。通过EDS测试测定防氧化镀层7的元素含量。
实施例6
本实施例中，树脂基材2为聚萘二甲酸乙二醇酯(PEN)，在厚度为80um的聚萘二甲酸乙二醇酯(PEN)上涂布16μm的胶黏剂形成胶黏剂层6，再在胶黏剂层6上复合35um 铜箔4，经熟化形成柔性覆铜板。其中，铜箔4包括铜箔基层41及用于防止铜箔基层41氧化的铜箔防护层42，其中，铜箔防护层42中：锌含量为33.68mg/m2、镍含量为11.79mg/m2、铬含量7.2mg/m2。柔性覆铜板的厚度为121μm，TD＝340mm、MD＝340mm。
其中，胶黏剂层6按重量份数计包括树脂82份；固化剂3.5份；助剂0.35份；填料0.35份；溶剂6.5份；树脂为聚氨酯。
将上述柔性覆铜板分切为4个170mm*170mm的样品，将这些样品在硫酸-双氧水微蚀刻液中蚀刻35s后取出，用清水清洗干净，以将铜箔4的铜箔防护层42蚀刻掉，暴露出铜箔基层41。用EDS测试仪测定4个样品的元素含量，以判断其铜箔防护层42是否完全蚀刻掉。
将上述4个样品贴合40um干膜5后再进行曝光、显影，再在温度50℃压力为3KG/cm2下通过浓度为250mol/L氯化铁蚀刻液中蚀刻3min后取出，以蚀刻出线路3，用清水清洗干净，得到4个170mm*170mm样品。
将上述4个样品进行剥离干膜5工序，将上述经过蚀刻处理的4个样品通过防氧化处理槽进行电镀，形成防氧化镀层7，防氧化镀层7中各元素量分别为：镀锌量0.6mg/m2，0.9mg/m2，8mg/m2，15mg/m2；镀镍量0.6mg/m2，0.9mg/m2，2mg/m2，8mg/m2；镀铬量0.9mg/m2，1mg/m2，2mg/m2，4mg/m2。通过EDS测试测定防氧化镀层7的元素含量。
试验例
将实施例1中的4个样品及原样品裁剪为5cm*5cm的大小，通过涂布锡含量为42％、铋含量57％，银1％的低温锡膏在160℃～180℃下加热融化，目测观察4个样品的可焊锡性。再将上述4个样品及原样品进行85℃、85％RH老化24h测试，目测防氧化性和焊锡密着性，其中原样品指的是柔性覆铜板。
上述原样品及样品1至样品4的可焊性、防氧化性及焊锡密着性的检测结果见下表：
Figure PCTCN2017109777-appb-000001
由上述可以看出，本发明提出的一种太阳能电池线路板，制备简单，并且在恶劣环境下具有较好的抗氧化性和可焊性。另外，该柔性线路板通过焊锡将太阳能电池片8与线路3接合，既可以提高散热功能、减少内阻，还具有很好防氧化性和加工性。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。
工业实用性：
因此，本发明提出一种太阳能电池线路板及其制备方法，制备简单，并且在恶劣环境下具有较好的抗氧化性和可焊性。该太阳能电池线路板可以用于制备太阳能电池，使得其能够在恶劣环境中使用，该太阳能电池线路板及其制备方法能够在太阳能电池技术领域得到广泛的应用，产生巨大的经济价值。

Claims (20)

  1. 一种太阳能电池线路板，其特征在于，包括：太阳能电池片(8)及树脂基材(2)，所述树脂基材(2)上涂布有胶黏剂层(6)，所述胶黏剂层(6)上复合有铜箔(4)，所述铜箔(4)上蚀刻形成线路(3)，所述线路(3)的表面镀有防氧化镀层(7)；所述线路(3)与所述太阳能电池片(8)通过低温焊锡接合。
  2. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述防氧化镀层(7)中锌含量为0.5～25mg/m2、镍含量为0.5～10mg/m2、铬含量为0.5～8mg/m2。
  3. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述胶黏剂层(6)包括以下重量份的组分：树脂20～100份；固化剂1～5份；助剂0.1～0.5份；填料0.1～0.5份；溶剂5～10份。
  4. 根据权利要求3所述的一种太阳能电池线路板，其特征在于，所述树脂为聚氨酯、环氧树脂和丙烯酸树脂中的一种或几种的混合。
  5. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述胶黏剂层(6)的厚度为8～20μm，优选8～16μm，更优选8～13μm。
  6. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述树脂基材(2)为聚萘二甲酸乙二醇酯(PEN)、聚对苯二甲酸乙二醇酯(PET)和聚酰亚胺(PI)中的一种或几种的混合。
  7. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述树脂基材(2)的厚度为45～125μm，优选50～100μm，更优选50～80μm。
  8. 根据权利要求1所述的一种太阳能电池线路板，其特征在于，所述铜箔(4)的厚度为10～45μm，优选15～42μm，更优选18～40μm。
  9. 根据权利要求1～8任意一项所述的一种太阳能电池线路板，其特征在于，所述铜箔(4)在蚀刻形成所述线路(3)之前进行微蚀刻处理。
  10. 用于权利要求1～9任意一项所述的一种太阳能电池线路板的制备方法，其特征在于，包括以下步骤：
    在柔性覆铜板上的铜箔(4)上进行蚀刻形成所述线路(3)，其中，所述柔性覆铜板具有所述树脂基材(6)以及通过所述胶黏剂层(6)复合在所述树脂基材(6)上的所述铜箔(4)；
    在所述线路(3)上电镀所述防氧化镀层(7)；
    将电镀有所述防氧化镀层(7)的线路(3)与所述太阳能电池片(8)通过低温焊锡接合。
  11. 根据权利要求10所述的一种太阳能电池线路板的制备方法，其特征在于，所述柔性覆铜板是通过以下步骤形成：在所述树脂基材(2)上均匀涂布胶黏剂形成所述胶黏剂层(6)后复合所述铜箔(4)并熟化。
  12. 根据权利要求10所述的一种太阳能电池线路板的制备方法，其特征在于，在所述铜箔(4)上蚀刻所述线路(3)之前，对所述铜箔(4)的顶面进行微刻蚀处理。
  13. 根据权利要求12所述的一种太阳能电池线路板的制备方法，其特征在于，进行微刻蚀处理是将所述铜箔(4)在硫酸-双氧水微蚀刻液中蚀刻30s～60s，优选40～55s，更优选40～50s。
  14. 根据权利要求10所述的一种太阳能电池线路板的制备方法，其特征在于，在所述线路(3)上电镀所述防氧化镀层(7)之前，对所述线路(3)进行清洗并烘干。
  15. 根据权利要求10～14任意一项所述的一种太阳能电池线路板的制备方法，其特征在于，在所述铜箔(4)上刻蚀形成线路(3)是将所述铜箔(4)经贴合干膜(5)后曝光、显影，在氯化铁蚀刻液中进行蚀刻。
  16. 根据权利要15所述的一种太阳能电池线路板的制备方法，其特征在于，所述氯化铁蚀刻液的浓度为200～300g/L。
  17. 根据权利要15所述的一种太阳能电池线路板的制备方法，其特征在于，所述刻蚀的温度为40～60℃，压力为1.5～3kg/cm2。
  18. 根据权利要15所述的一种太阳能电池线路板的制备方法，其特征在于，所述蚀刻的时间为2～4min。
  19. 用于权利要求1～9任意一项所述的一种太阳能电池线路板的制备方法，其特征在于，包括以下步骤：
    步骤A：制备胶黏剂，在树脂基材(2)上均匀涂布胶黏剂形成胶黏剂层(6)后复合铜箔(4)并熟化形成柔性覆铜板；
    步骤B：对所述步骤A中的铜箔(4)的顶面进行微蚀刻处理，以除去铜箔(4)的铜箔防护层(42)，暴露出铜箔基层(41)；
    步骤C：对经所述步骤B处理后的铜箔(4)进行蚀刻形成线路(3)，清洗并烘干；
    步骤D：在所述步骤C中的线路(3)上电镀防氧化镀层(7)；
    步骤E：将经所述步骤D处理后的线路(3)与太阳能电池片(8)通过低温焊锡接合。
  20. 一种太阳能电池，其特征在于，其包括如权利要求1～9任意一项所述的太阳能电池线路板。
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