JP3224280U - 太陽電池用基板及び太陽電池 - Google Patents
太陽電池用基板及び太陽電池 Download PDFInfo
- Publication number
- JP3224280U JP3224280U JP2018600028U JP2018600028U JP3224280U JP 3224280 U JP3224280 U JP 3224280U JP 2018600028 U JP2018600028 U JP 2018600028U JP 2018600028 U JP2018600028 U JP 2018600028U JP 3224280 U JP3224280 U JP 3224280U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- substrate
- etching
- line
- solar cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 54
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 121
- 239000011889 copper foil Substances 0.000 claims abstract description 106
- 239000010410 layer Substances 0.000 claims abstract description 87
- 238000007747 plating Methods 0.000 claims abstract description 57
- 239000012790 adhesive layer Substances 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 32
- 229920005989 resin Polymers 0.000 claims abstract description 32
- 239000003963 antioxidant agent Substances 0.000 claims abstract description 21
- 230000003078 antioxidant effect Effects 0.000 claims abstract description 21
- 229910000679 solder Inorganic materials 0.000 claims abstract description 15
- 238000005530 etching Methods 0.000 claims description 69
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 21
- 230000003064 anti-oxidating effect Effects 0.000 claims description 18
- 238000009713 electroplating Methods 0.000 claims description 16
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 15
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 15
- 230000001070 adhesive effect Effects 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 229910052725 zinc Inorganic materials 0.000 claims description 15
- 239000011701 zinc Substances 0.000 claims description 15
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 claims description 12
- 230000003647 oxidation Effects 0.000 claims description 11
- 238000007254 oxidation reaction Methods 0.000 claims description 11
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 10
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 10
- 229910052804 chromium Inorganic materials 0.000 claims description 9
- 239000011651 chromium Substances 0.000 claims description 9
- XEMZLVDIUVCKGL-UHFFFAOYSA-N hydrogen peroxide;sulfuric acid Chemical compound OO.OS(O)(=O)=O XEMZLVDIUVCKGL-UHFFFAOYSA-N 0.000 claims description 9
- 239000002904 solvent Substances 0.000 claims description 9
- 239000012752 auxiliary agent Substances 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 230000032683 aging Effects 0.000 claims description 7
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 6
- -1 polyethylene terephthalate Polymers 0.000 claims description 6
- 238000005304 joining Methods 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 238000001035 drying Methods 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 238000005406 washing Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 abstract description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 13
- 238000011161 development Methods 0.000 description 10
- 230000018109 developmental process Effects 0.000 description 10
- 238000005259 measurement Methods 0.000 description 7
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical group [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 239000004645 polyester resin Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/02016—Circuit arrangements of general character for the devices
- H01L31/02019—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/02021—Circuit arrangements of general character for the devices for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/83801—Soldering or alloying
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Electromagnetism (AREA)
- Laminated Bodies (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611146604.2 | 2016-12-13 | ||
| CN201611146604.2A CN106784026A (zh) | 2016-12-13 | 2016-12-13 | 一种太阳能电池线路板及其制备方法 |
| PCT/CN2017/109777 WO2018107922A1 (zh) | 2016-12-13 | 2017-11-07 | 一种太阳能电池线路板及其制备方法以及太阳能电池 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3224280U true JP3224280U (ja) | 2019-12-12 |
Family
ID=58880684
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2018600028U Active JP3224280U (ja) | 2016-12-13 | 2017-11-07 | 太陽電池用基板及び太陽電池 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3224280U (zh) |
| CN (1) | CN106784026A (zh) |
| WO (1) | WO2018107922A1 (zh) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106784026A (zh) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | 一种太阳能电池线路板及其制备方法 |
| CN106604538A (zh) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | 一种柔性线路板及其制备方法 |
| CN107325489B (zh) * | 2017-08-14 | 2019-07-16 | 通威太阳能（安徽）有限公司 | 一种防腐蚀环氧-酚醛胶及其在电池片刻蚀工艺的应用 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374388B (zh) * | 2008-03-28 | 2010-06-02 | 广州力加电子有限公司 | 一种高剥离强度的细线路挠性电路板的制作方法 |
| JP4955105B2 (ja) * | 2008-12-26 | 2012-06-20 | Ｊｘ日鉱日石金属株式会社 | 電子回路用の圧延銅箔又は電解銅箔及びこれらを用いた電子回路の形成方法 |
| CN201479455U (zh) * | 2009-04-16 | 2010-05-19 | 惠州国展电子有限公司 | 金属基柔性电路覆铜板及金属基柔性电路板 |
| CN204348742U (zh) * | 2015-01-05 | 2015-05-20 | 苏州中来光伏新材股份有限公司 | 无主栅高效率背接触太阳能电池及其组件 |
| CN105350046A (zh) * | 2015-10-23 | 2016-02-24 | 衢州顺络电路板有限公司 | 用于取代金手指的线路板及其制造方法 |
| CN106784026A (zh) * | 2016-12-13 | 2017-05-31 | 苏州城邦达力材料科技有限公司 | 一种太阳能电池线路板及其制备方法 |
| CN106604538A (zh) * | 2016-12-13 | 2017-04-26 | 苏州城邦达力材料科技有限公司 | 一种柔性线路板及其制备方法 |
-
2016
- 2016-12-13 CN CN201611146604.2A patent/CN106784026A/zh active Pending
-
2017
- 2017-11-07 JP JP2018600028U patent/JP3224280U/ja active Active
- 2017-11-07 WO PCT/CN2017/109777 patent/WO2018107922A1/zh active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018107922A1 (zh) | 2018-06-21 |
| CN106784026A (zh) | 2017-05-31 |
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