WO2018107739A1 - 掩膜框架、掩膜框架的制造方法以及掩膜板 - Google Patents

掩膜框架、掩膜框架的制造方法以及掩膜板 Download PDF

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Publication number
WO2018107739A1
WO2018107739A1 PCT/CN2017/092798 CN2017092798W WO2018107739A1 WO 2018107739 A1 WO2018107739 A1 WO 2018107739A1 CN 2017092798 W CN2017092798 W CN 2017092798W WO 2018107739 A1 WO2018107739 A1 WO 2018107739A1
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WIPO (PCT)
Prior art keywords
mask
pair
receiving
positioning
frame
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Ceased
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PCT/CN2017/092798
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English (en)
French (fr)
Inventor
林治明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US15/743,440 priority Critical patent/US10570499B2/en
Publication of WO2018107739A1 publication Critical patent/WO2018107739A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C21/00—Accessories or implements for use in connection with applying liquids or other fluent materials to surfaces, not provided for in groups B05C1/00 - B05C19/00
    • B05C21/005—Masking devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask

Definitions

  • the present invention relates to the field of vapor deposition equipment, and in particular to a mask frame, a method of fabricating the mask frame, and a mask comprising the mask frame.
  • an evaporation process is required.
  • a mask is required.
  • evaporation is usually performed on a large mother board, and then the mother board is cut into a plurality of small array substrates.
  • the mask comprises a mask frame and a plurality of mask strips secured to the mask frame. A plurality of through holes are formed in the mask strip. The evaporation material is deposited on the mother board through the via holes to obtain a corresponding pattern.
  • Figure 1 shows a schematic view of the main frame of the mask frame.
  • the main frame is formed with a vapor deposition zone A extending through the main frame 100 in a thickness direction, and the main frame 100 is provided with a plurality of pairs of first receiving grooves 110, two of each pair of first receiving grooves.
  • the first receiving grooves 110 are respectively located on both sides of the first direction (up and down direction in FIG. 1) of the vapor deposition zone A.
  • three pairs of first receiving grooves 110 are provided on the main frame.
  • the first receiving groove is for receiving both ends of the shielding strip. Specifically, the two ends of the shielding strip are respectively disposed in the corresponding two first receiving slots.
  • the shielding strip is welded in the receiving groove.
  • the sidewall of the receiving groove is usually used as a reference for registration.
  • the side wall of the accommodating groove is difficult to recognize, and the alignment is likely to be inaccurate.
  • the occlusion strip may be damaged when the mask is used for a period of time.
  • the occlusion strip needs to be replaced at this time.
  • the damaged shielding strip needs to be removed, and then the solder joints in the first receiving groove are polished, and then the damaged shielding strip is welded.
  • the first The grinding of the solder joints in a receiving groove makes it easy to make the side walls of the first receiving groove rounded, which is more difficult to identify.
  • a mask frame includes a main frame and a plurality of shielding strips, and the main frame is formed with a vapor deposition zone extending through the main frame in a thickness direction, and the main frame is provided with a plurality of pairs of first receiving grooves, each of which is disposed Two of the first receiving grooves in the first receiving groove are respectively located on two sides of the first direction of the vapor deposition zone, and each of the shielding strips corresponds to a pair of the first receiving grooves, the shielding strip
  • the two ends are respectively disposed in the corresponding two first receiving slots, wherein the mask frame includes at least one pair of first positioning holes, and each pair of the first positioning holes corresponds to a pair of the first receiving slots, And the two first positioning holes of each of the pair of first positioning holes respectively correspond to the positions of the two first receiving slots in the corresponding pair of first receiving slots.
  • the main frame is provided with a plurality of pairs of second receiving grooves and a plurality of supporting strips, and two of the second receiving grooves of each pair of the second receiving grooves are respectively located in the vapor deposition zone Two sides of the second direction, the first direction and the second direction are perpendicular to each other, each support bar corresponds to a pair of second receiving grooves, and two ends of the support bar are respectively disposed in the corresponding two second Accommodate the tank.
  • the mask frame includes at least one pair of second positioning holes, each pair of the second positioning holes corresponding to a pair of the second receiving grooves, and two of each pair of the second positioning holes The second positioning holes respectively correspond to the positions of the two second receiving slots in the corresponding pair of second receiving slots.
  • the main frame includes a frame body and an open mask, and the first positioning hole and the second positioning hole are formed on the open mask, and the frame body surrounds the In the vapor deposition zone, the first receiving groove is formed on the frame body, and the frame body is further formed with a third receiving groove surrounding the evaporation zone, and the open mask A diaphragm is disposed in the third receiving groove.
  • the main frame includes a frame body and two first positioning strips, and the first positioning strip is formed with a plurality of the first positioning holes, the frame body surrounds the evaporation zone, a first receiving groove is formed on the frame body, a fourth receiving groove is formed on each side of the first direction of the vapor deposition zone, and two of the first positioning bars are respectively disposed on the two of the fourth Accommodate the tank.
  • the main frame further includes two second positioning strips, and the second positioning strip is formed with a plurality of the second positioning holes, and the second receiving groove is formed on the frame body.
  • a fifth receiving groove is formed on each of two sides of the second direction of the vapor deposition zone, and two of the second positioning bars are respectively disposed in the two of the fifth receiving grooves.
  • the main frame includes a frame body, the frame body surrounds the evaporation zone, and the first receiving groove, the second receiving groove, the first positioning hole, and the second positioning Holes are formed on the frame body.
  • the shielding strip and the surface of the support strip provided on the mask frame are formed as a flat mounting surface.
  • a mask is provided.
  • the mask includes a mask frame and a plurality of mask strips, wherein the mask frame is the mask frame provided by the present invention, and the plurality of mask strips are fixed on the main frame, One of the mask strips is disposed between two adjacent mask strips, and an edge region of the mask strip overlaps the mask strip.
  • a method of manufacturing a mask frame including at least a pair of first positioning holes includes:
  • each pair of the first positioning holes corresponds to a pair of the first receiving slots, and two of the first positioning holes of each pair of the first positioning holes are respectively associated with a corresponding pair of first receiving slots Corresponding to the positions of the two first receiving slots;
  • the first receiving corresponding to the first positioning hole corresponds to the first positioning hole.
  • the groove is aligned with the shielding strip. After the alignment is accurate, the two ends of the shielding strip are respectively welded into the two first receiving slots of the corresponding pair of the first receiving slots.
  • the mask frame includes at least one pair of second positioning holes, each pair of the second positioning holes corresponding to a pair of the second receiving grooves, and two of each pair of the second positioning holes
  • the second positioning holes respectively correspond to the positions of the two second receiving slots in the corresponding pair of second receiving slots
  • the manufacturing method further includes:
  • the boundary of the first positioning hole is clearer and easier to identify than the side wall edge of the first receiving groove.
  • the boundary of the first positioning hole is not damaged. Therefore, when the shielding strip is aligned with respect to the first positioning hole, the shielding strip can be accurately welded in the first receiving groove, so that the edge portion of the mask strip disposed on the mask frame can be Blocking.
  • the shield strip is accurately soldered in place, a large amount of pre-bias can be provided for the design of the mask strip. Therefore, when evaporation is performed using a mask including the mask frame, a more precise pattern can be formed on the substrate.
  • Figure 1 is a schematic view of a main frame in a conventional mask frame
  • FIG. 2a is a schematic illustration of one embodiment of a main frame in a mask frame in accordance with an embodiment of the present invention
  • Figure 2b is a cross-sectional view taken along line I-I of Figure 2a;
  • Figure 3a is a schematic illustration of a main frame in a mask frame in accordance with another embodiment of the present invention.
  • Figure 3b is a cross-sectional view taken along line II-II of Figure 3a;
  • Figure 3c is a cross-sectional view taken along line III-III of Figure 3a;
  • FIG. 4 is a schematic structural view of a mask provided by the present invention.
  • a mask frame is provided.
  • the mask frame includes a main frame 200 and a plurality of shielding strips (not shown), and the main frame 200 is formed with an evaporation zone A penetrating the main frame in the thickness direction.
  • the main frame 200 is provided with a plurality of pairs of first receiving grooves, and the two first receiving grooves 210 of each pair of first receiving grooves are respectively located on both sides of the first direction (up and down direction in FIG. 2) of the vapor deposition zone A
  • Each of the shielding strips corresponds to a pair of first receiving slots.
  • the two ends of the shielding strip are respectively disposed in the corresponding two first receiving slots 210, wherein the mask frame includes at least one pair of first positioning holes 210a, and each pair of first positioning holes 210a corresponds to a pair of first The slot 210 is received, and the two first positioning holes in each pair of the first positioning holes 210a respectively correspond to the two first receiving slot positions in the corresponding pair of first receiving slots 210.
  • the first positioning hole 210a can be used as the alignment reference of the corresponding first receiving groove 210. Since the boundary of the first positioning hole 210a is a closed figure, the edge of the first positioning hole 210a is more easily recognized than the side wall edge of the first receiving groove 210. Further, by using the first positioning hole 210a as a positioning reference, it is possible to avoid the influence of the accuracy of the device on the welding accuracy and the damage to the identification boundary at the time of the grinding repair. Therefore, the shielding strip can be accurately aligned with the first positioning hole 210a before the shielding strip is welded in the first receiving groove. In this way, it is ensured that the shielding strip is accurately welded in the first receiving groove.
  • the damaged shielding strip can be removed from the first receiving slot when the shielding strip is damaged.
  • the first positioning hole is not damaged during the grinding of the solder joints in the first receiving groove. Therefore, when a new occlusion strip is replaced, the new occlusion strip can still be positioned with reference to the first locating hole, so that the occlusion strip positioning is accurately fixed on the main frame.
  • the shielding strip Since the shielding strip is accurately welded in the first receiving groove, it can be disposed in the The edge portion of the mask strip on the mask frame is shielded. In addition, since the shield strip is accurately soldered in place, a large amount of pre-bias can be provided for the design of the mask strip. Therefore, when evaporation is performed using a mask including the mask frame, a more precise pattern can be formed on the substrate.
  • each pair of first receiving slots corresponds to a corresponding pair of the first positioning holes, so that all the shielding strips can be accurately positioned.
  • a display substrate is formed by vapor deposition
  • a pattern of a plurality of display substrates is usually vapor-deposited on a single substrate having a large area.
  • the size of the main frame is required to correspond to the base substrate.
  • a plurality of mask strips are soldered to the main frame, each mask strip having a certain amount of sag.
  • a support strip can be provided on the main frame. The support strip can laterally support the mask strip, reducing the amount of sag of the mask strip, so that the mask strip and the substrate are better fitted.
  • the support strips can also be used to block some of the through holes in the mask strip.
  • the main frame is provided with a plurality of pairs of second receiving slots and a plurality of supporting strips, and two of the second receiving slots 220 of each pair of the second receiving slots are respectively located Both sides of the second direction (the left-right direction in FIG. 2) of the vapor deposition zone A, the first direction and the second direction are perpendicular to each other.
  • Each of the support bars corresponds to a pair of second receiving slots 220, and two ends of the support strips are respectively disposed in the corresponding two second receiving slots.
  • the rigidity of the main frame can be increased to prevent the main frame from being deformed, and the mask strip can be laterally supported to prevent the mask strip from being deformed.
  • the vaporized through holes in the region of the mask strip overlapping the support strip are blocked, so that the evaporated material does not pass through the support strip to reach the base substrate, so that the adjacent two display substrates can be Intervals are formed. Therefore, the provision of the support strips also facilitates vapor deposition on the base substrate to form a precise pattern.
  • the mask frame includes at least one pair of second positioning holes 220a, and each pair of second positioning holes 220a corresponds to a pair of second receiving grooves 220, And two of the second positioning holes of each pair of second positioning holes respectively correspond to the positions of the two second receiving slots of the corresponding pair of second receiving slots.
  • the boundary of the second positioning hole 220a is also obviously convenient.
  • the identification facilitates the precise alignment between the support strip and the second receiving groove 220.
  • the damaged support strip can be removed, and then the solder joints in the second receiving groove are polished.
  • the second positioning hole 220a is also not damaged during the grinding of the solder joints in the second receiving groove.
  • the first positioning hole 210a and the second positioning hole 220a are formed.
  • the first positioning hole 210a may be formed at a position corresponding to the first receiving groove 210 when the main frame is machined
  • the second positioning hole 220a may be formed at a position corresponding to the second receiving groove 220.
  • first positioning hole 210a and the second positioning hole 220a may be disposed on the auxiliary frame, and then the auxiliary frame is fixed on the main frame 200 such that the position of the first positioning hole 210a is opposite to the first receiving groove 210.
  • the position of the second positioning hole 220a corresponds to the second receiving groove 220.
  • the main frame 200 includes the frame body 200a and the open mask 200b as shown in FIG. 2a.
  • the open mask 200b described herein is similar to an open mask that vaporizes a common layer and is commercially available.
  • the open mask itself has only one outer frame, and the size of the open area is comparable to the size of the vapor deposition area A.
  • the open mask itself is provided with positioning holes. Therefore, the positioning holes on the open mask can be used as the first positioning holes and the second positioning holes.
  • the frame body 200a surrounds the vapor deposition zone A.
  • the first receiving groove 210 is formed on the frame body 200a.
  • a third receiving groove surrounding the vapor deposition zone A may also be formed on the frame body 200a, and the open mask 200b is disposed in the third receiving groove.
  • the open mask 200b can be prevented from protruding from the upper surface of the frame body, so that it can be fixed to the frame body 200a.
  • the mask strip is flatter. In this way, the accuracy of the evaporation pattern is further ensured.
  • Fig. 2b is a cross-sectional view taken along line I-I of Fig. 2a. As can be seen in Figure 2b, the open mask 200b is disposed in the third receiving slot.
  • the main frame 200 includes a frame body 200a and two first positioning bars 200c.
  • a plurality of first positioning holes 210a are formed on the first positioning strip 200c.
  • the frame body 200a surrounds the vapor deposition zone A.
  • the first receiving groove 210 is formed on the frame body 200a, and both sides of the first direction of the vapor deposition zone A are respectively A fourth receiving groove is formed, and two first positioning bars 200c are respectively disposed in the two of the fourth receiving grooves.
  • Figure 3b shows a cross-sectional view taken along line II-II of Figure 3a. As can be seen in Figure 3b, the first positioning strip 200c is disposed in the fourth receiving slot.
  • a portion may be cut from an open mask to form a first positioning strip.
  • the main frame further includes two second positioning strips 200d.
  • the second positioning strips 200d are formed with a plurality of second positioning holes 220a formed on the frame body 200a.
  • a fifth receiving groove (not shown) is formed on each of the two sides of the plating zone in the second direction, and two second positioning bars 200d are respectively disposed in the two of the fifth receiving grooves.
  • a portion may be cut from the open mask to form a second positioning strip 200d.
  • Figure 3c shows a cross-sectional view taken along line III-III of Figure 3a. As can be seen in Figure 3c, the second positioning strip 200d is disposed in the fifth receiving slot.
  • the open mask is cut into four sections, forming two first locating strips and two second locating strips, respectively.
  • the depths of the third receiving groove, the fourth receiving groove, and the fifth receiving groove are both greater than the depth of the first receiving groove, and are also greater than the depth of the second receiving groove.
  • the first positioning hole and the second positioning hole may be formed directly on the frame body.
  • the main frame includes a frame body surrounding the evaporation zone, the first receiving groove, the second receiving groove, the first positioning hole and the second positioning hole Both are formed on the frame body.
  • the surfaces of the mask strip and the support strip are not higher than the surface of the main frame.
  • the thickness of the shielding strip may be less than or equal to the depth of the first receiving groove, and the thickness of the supporting strip is less than or equal to the first The depth of the two receiving slots.
  • a mask is provided. As shown in FIG. 4, the mask includes a mask frame and a plurality of mask strips 300, wherein the mask frame is the mask frame provided by the present invention, and a plurality of mask strips 300 are fixed in the same On the main frame, a shielding strip 400 is disposed between two adjacent mask strips 300, and an edge region of the mask strip 300 overlaps with the shielding strip 400.
  • the edge portion of the mask strip 300 is formed with a through hole, so that the stress distribution on the entire mask strip is uniform, and deformation or the like does not occur.
  • the shielding strip 400 can be accurately positioned in the first receiving groove. After the shielding strip 400 is accurately positioned, the evaporation material penetrating through the edge region through holes can be effectively blocked from depositing on the substrate to be processed, so that the precision of the pattern formed on the substrate can be improved.
  • the dotted line L indicates the intersection of two adjacent mask strips 300.
  • the support bar 500 can be accurately positioned in the second receiving groove.
  • the support strips and the shielding strips are accurately positioned in the mask, the gap between the mask strips can be accurately blocked, so that an accurate pattern can be formed on the base substrate.
  • a method of manufacturing a mask frame including at least one pair of first positioning holes includes:
  • each pair of the first positioning holes corresponds to a pair of the first receiving slots, and two of the first positioning holes of each pair of the first positioning holes are respectively associated with a corresponding pair of first receiving slots Corresponding to the positions of the two first receiving slots;
  • the first receiving groove corresponding to the first positioning hole is aligned with the shielding strip based on the first positioning hole, and after the alignment is accurate, the two ends of the shielding strip are respectively welded Connected to two first receiving slots in a corresponding pair of said first receiving slots.
  • the boundary of the first positioning hole 210a is a closed figure, the edge of the first positioning hole 210a is more easily recognized than the side wall edge of the first receiving groove 210. Further, by using the first positioning hole 210a as a positioning reference, it is possible to avoid the influence of the accuracy of the device on the welding accuracy and the damage to the identification boundary at the time of the grinding repair. Therefore, the shielding strip can be accurately aligned with the first positioning hole 210a before the shielding strip is welded in the first receiving groove 210. In this way, it is ensured that the shielding strip is accurately welded in the first receiving groove.
  • the damaged shielding strip can be removed from the first receiving slot when the shielding strip is damaged.
  • the first positioning hole is not damaged during the grinding of the solder joints in the first receiving groove. Therefore, when a new occlusion strip is replaced, the new occlusion strip can still be positioned with reference to the first locating hole, so that the occlusion strip positioning is accurately fixed on the main frame.
  • the shielding strip is accurately welded in the first receiving groove, the edge portion of the mask strip provided on the mask frame can be blocked.
  • the shield strip is accurately soldered in place, a large amount of pre-bias can be provided for the design of the mask strip. Therefore, when evaporation is performed using a mask including the mask frame, a more precise pattern can be formed on the substrate.
  • the mask frame includes at least one pair of second positioning holes, each pair of the second positioning holes corresponding to a pair of the second receiving grooves, and each pair of the second positioning holes The two second positioning holes respectively correspond to the positions of the two second receiving slots in the corresponding pair of second receiving slots, and the manufacturing method further includes:
  • the boundary of the second positioning hole is also clearly visible for identification, which facilitates accurate alignment between the support bar and the second receiving groove.
  • the damaged support strip can be removed, and then the solder joints in the second receiving groove are polished.
  • the second positioning hole is also not damaged during the grinding of the solder joints in the second receiving groove.

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Abstract

一种掩膜框架、掩膜框架的制造方法以及掩膜板。掩膜框架包括主框架（200）和多个遮挡条（400），主框架（200）上形成有沿厚度方向贯穿主框架（200）的蒸镀区（A），主框架（200）上设置有多对第一容纳槽（210），每一对第一容纳槽（210）中的两个第一容纳槽（210）分别位于蒸镀区（A）的第一方向的两侧，每个遮挡条（400）对应一对第一容纳槽（210），遮挡条（400）的两端分别设置在相应的两个第一容纳槽（210）中。掩膜框架包括至少一对定位孔（210a），每一对定位孔（210a）对应一对第一容纳槽（210），并且每一对定位孔（210a）中的两个定位孔（210a）分别与相应的一对第一容纳槽（210）中的两个第一容纳槽（210）位置对应。由于遮挡条（400）精确地焊接在第一容纳槽（210）中，从而可以对掩膜条（300）的边缘部进行遮挡。此外，由于遮挡条（400）位置焊接精确，从而可以为掩膜条（300）的设计提供较大的预偏量。

Description

掩膜框架、掩膜框架的制造方法以及掩膜板 技术领域
本发明涉及蒸镀设备领域，具体地说，涉及一种掩膜框架、该掩膜框架的制造方法和一种包括所述掩膜框架的掩膜板。
背景技术
在形成有机发光二极管显示面板时，需要用到蒸镀工艺。在蒸镀工艺中，为了形成特定的图形，需要用到掩膜板。为了提高生产效率，通常在一个大的母板上进行蒸镀，然后将母板切割成多个小的阵列基板。相应的是，掩膜板包括掩膜框架和固定在掩膜框架上的多个掩膜条。掩膜条上形成有多个通孔。蒸镀材料透过通孔沉积在母板上，以获得相应的图形。
为了保证掩膜条上应力均匀，减少褶皱的产生，在掩膜条的边缘上也形成有通孔。但是，在沉积材料时，母板上与掩膜条的边缘对应的部分不需要沉积材料。因此，需要利用遮挡条对掩膜条的边缘进行遮挡。
图1示出了掩膜框架的主框架的示意图。如图1所示，所述主框架上形成有沿厚度方向贯穿主框架100的蒸镀区A，主框架100上设置有多对第一容纳槽110，每一对第一容纳槽中的两个第一容纳槽110分别位于蒸镀区A的第一方向(图1中的上下方向)的两侧。在图1中所示的实施方式中，主框架上设置有三对第一容纳槽110。所述第一容纳槽用于容纳遮挡条的两个端部。具体地说，所述遮挡条的两端分别设置在相应的两个第一容纳槽中。
在固定遮挡条时，首先需要对容纳槽的位置进行对位。在对位准确之后，将遮挡条焊接在容纳槽内。在对位时，通常利用容纳槽的侧壁作为对位基准。但是，容纳槽侧壁难以识别，容易造成对位不准确。此外，当掩膜板使用一段时间之后，遮挡条可能会损坏。此时需要对遮挡条进行更换。在更换时，需要将损坏了的遮挡条拆下，然后对第一容纳槽内的焊点进行打磨，再焊接没有损坏的遮挡条。但是，对第 一容纳槽内的焊点进行打磨容易使得第一容纳槽的侧壁变成圆角，更加难以识别。
因此，如何将第一容纳槽与遮挡条进行精确对位成为本领域亟待解决的技术问题。
发明内容
本发明的目的在于提供一种掩膜框架、该掩膜框架的制造方法和一种包括所述掩膜框架的掩膜板。
为了实现上述目的，作为本发明的一个方面，提供一种掩膜框架。所述掩膜框架包括主框架和多个遮挡条，所述主框架上形成有沿厚度方向贯穿所述主框架的蒸镀区，所述主框架上设置有多对第一容纳槽，每一对第一容纳槽中的两个所述第一容纳槽分别位于所述蒸镀区的第一方向的两侧，每个所述遮挡条对应一对所述第一容纳槽，所述遮挡条的两端分别设置在相应的两个第一容纳槽中，其中，所述掩膜框架包括至少一对第一定位孔，每对所述第一定位孔对应一对所述第一容纳槽，并且每一对所述第一定位孔中的两个第一定位孔分别与相应的一对第一容纳槽中的两个所述第一容纳槽位置对应。
优选的是，所述主框架上设置有多对第二容纳槽和多个支撑条，每一对所述第二容纳槽中的两个所述第二容纳槽分别位于所述蒸镀区的第二方向的两侧，所述第一方向与所述第二方向互相垂直，每个支撑条对应一对第二容纳槽，并且所述支撑条的两端分别设置在相应的两个第二容纳槽中。
优选的是，所述掩膜框架包括至少一对第二定位孔，每一对所述第二定位孔对应一对所述第二容纳槽，并且每一对所述第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应。
优选的是，所述主框架包括框架本体和开放式掩膜板，在所述开放式掩膜板上形成有所述第一定位孔和所述第二定位孔，所述框架本体环绕所述蒸镀区，所述第一容纳槽形成在所述框架本体上，所述框架本体上还形成有环绕所述蒸镀区的第三容纳槽，并且所述开放式掩 膜板设置在所述第三容纳槽中。
优选的是，所述主框架包括框架本体和两个第一定位条，所述第一定位条上形成有多个所述第一定位孔，所述框架本体环绕所述蒸镀区，所述第一容纳槽形成在所述框架本体上，所述蒸镀区的第一方向的两侧各形成一个第四容纳槽，并且两个所述第一定位条分别设置在两个所述第四容纳槽中。
优选的是，所述主框架还包括两个第二定位条，所述第二定位条上形成有多个所述第二定位孔，所述第二容纳槽形成在所述框架本体上，所述蒸镀区的第二方向的两侧各形成一个第五容纳槽，并且两个所述第二定位条分别设置在两个所述第五容纳槽中。
优选的是，所述主框架包括框架本体，所述框架本体环绕所述蒸镀区，并且所述第一容纳槽、所述第二容纳槽、所述第一定位孔和所述第二定位孔均形成在所述框架本体上。
优选的是，在所述掩膜框架上设置的所述遮挡条和所述支撑条的表面形成为平整的安装表面。
作为本发明的另一方面，提供一种掩膜板。所述掩膜板包括掩膜框架和多个掩膜条，其中，所述掩膜框架为本发明所提供的上述掩膜框架，多个所述掩膜条固定在所述主框架上，在相邻两个所述遮挡条之间设置一个所述掩膜条，并且所述掩膜条的边缘区与所述遮挡条重叠。
作为本发明的还一方面，提供一种掩膜框架的制造方法，所述掩膜框架包括至少一对第一定位孔。所述制造方法包括：
提供主框架，并且在所述主框架上形成多对第一容纳槽，其中，每一对第一容纳槽中的两个所述第一容纳槽分别位于所述蒸镀区的第一方向的两侧，每对所述第一定位孔对应一对所述第一容纳槽，并且每一对所述第一定位孔中的两个第一定位孔分别与相应的一对第一容纳槽中的两个所述第一容纳槽位置对应；以及
以所述第一定位孔为基准，对与所述第一定位孔对应的第一容纳 槽与遮挡条进行对位，在对位准确之后，将所述遮挡条的两端分别焊接在相应一对所述第一容纳槽中的两个第一容纳槽中。
优选的是，所述掩膜框架包括至少一对第二定位孔，每对所述第二定位孔对应一对所述第二容纳槽，并且每一对所述第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应，所述制造方法还包括：
以第二定位孔为基准，对与所述第二定位孔对应的第二容纳槽与支撑条进行对位，在对位准确之后，将所述支撑条的两端分别焊接在相应一对所述第二容纳槽中的两个第一容纳槽中。
与第一容纳槽的侧壁边缘相比，第一定位孔的边界更加清楚，容易识别。此外，即便在更换破损遮挡条时对第一容纳槽内的焊点进行打磨，也不会损坏第一定位孔的边界。因此，在以第一定位孔为基准对遮挡条进行对位时，可以将遮挡条精确地焊接在第一容纳槽中，从而可以对设置在所述掩膜框架上的掩膜条的边缘部进行遮挡。此外，由于遮挡条精确地焊接在适当位置上，从而可以为掩膜条的设计提供较大的预偏量。因此，在利用包括所述掩膜框架的掩膜板进行蒸镀时，可以在衬底基板上形成更加精确的图形。
附图说明
附图是用来提供对本发明的进一步理解，并且构成说明书的一部分，与下面的具体实施方式一起用于解释本发明，但并不构成对本发明的限制。在附图中：
图1是现有的掩膜框架中的主框架的示意图；
图2a是根据本发明一种实施方式的掩膜框架中的主框架的一种实施方式的示意图；
图2b是沿着图2a的I-I线截取的剖视图；
图3a是根据本发明另一种实施方式的掩膜框架中的主框架的示意图；
图3b是沿着图3a的II-II线截取的剖视图；
图3c是沿着图3a的III-III线截取的剖视图；
图4是本发明所提供的掩膜板的结构示意图。
具体实施方式
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
作为本发明的一个方面，提供一种掩膜框架。如图2所示，所述掩膜框架包括主框架200和多个遮挡条(未示出)，主框架200上形成有沿厚度方向贯穿该主框架的蒸镀区A。主框架200上设置有多对第一容纳槽，每一对第一容纳槽中的两个第一容纳槽210分别位于蒸镀区A的第一方向(图2中的上下方向)的两侧，每个所述遮挡条对应一对第一容纳槽。所述遮挡条的两端分别设置在相应的两个第一容纳槽210中，其中，所述掩膜框架包括至少一对第一定位孔210a，每对第一定位孔210a对应一对第一容纳槽210，并且每一对第一定位孔210a中的两个第一定位孔分别与相应的一对第一容纳槽210中的两个所述第一容纳槽位置对应。
在焊接遮挡条时，可以将第一定位孔210a作为相应的第一容纳槽210的对位基准。由于第一定位孔210a的边界是封闭图形，与第一容纳槽210的侧壁边缘相比，第一定位孔210a的边缘更加容易识别。此外，利用第一定位孔210a作为定位基准，可以避免设备精度对焊接精度的影响和打磨修复时对识别边界的损伤。因此，在将遮挡条焊接在第一容纳槽中之前，可以将遮挡条与第一定位孔210a进行精确地对位。这样，可以确保遮挡条精确地焊接在第一容纳槽中。
根据本本发明的实施方式，当遮挡条发生损坏时，可以将破损的遮挡条从第一容纳槽中拆除。在对第一容纳槽内的焊点进行打磨的过程中，不会损坏第一定位孔。因此，在更换新的遮挡条时，仍然可以以第一定位孔为基准对新的遮挡条进行定位，从而使遮挡条定位精确地固定在主框架上。
由于遮挡条精确地焊接在第一容纳槽中，因而可以对设置在所述 掩膜框架上的掩膜条的边缘部进行遮挡。此外，由于遮挡条精确地焊接在适当位置上，因而可以为掩膜条的设计提供较大的预偏量。因此，在利用包括所述掩膜框架的掩膜板进行蒸镀时，可以在衬底基板上形成更加精确的图形。
优选的是，每一对第一容纳槽都对应有相应的一对所述第一定位孔，从而可以对所有的遮挡条进行精确定位。
容易理解的是，在蒸镀形成显示基板时，通常在一个面积较大的衬底基板上蒸镀形成多个显示基板的图形。相应的是，需要主框架的尺寸与所述衬底基板对应。在此种情况中，所述主框架上焊接有多个掩膜条，每个掩膜条都具有一定的下垂量。为了防止掩膜条下垂量过大，需要对掩膜条进行横向支撑。优选的是，可以在主框架上设置支撑条。支撑条可以对掩膜条进行横向支撑，减少掩膜条的下垂量，使得掩膜条与基板更好的贴合。
除了支撑作用外，支撑条还可以用于遮挡掩膜条上的一些通孔。
相应的是，如图2a中所示，所述主框架上设置有多对第二容纳槽和多个支撑条，每一对所述第二容纳槽中的两个第二容纳槽220分别位于蒸镀区A的第二方向(图2中的左右方向)的两侧，所述第一方向与所述第二方向互相垂直。每个支撑条对应一对第二容纳槽220，所述支撑条的两端分别设置在相应的两个第二容纳槽中。
在设置了支撑条之后，可以增加主框架的刚性，防止主框架变形，同时还可以对掩膜条进行了横向支撑，防止掩膜条变形。此外，在掩膜条的与支撑条相重叠的区域中的蒸镀通孔被遮挡，使得蒸镀的材料不会穿过支撑条到达衬底基板上，从而可以在相邻两个显示基板之间形成间隔。因此，设置支撑条也有利于在衬底基板上蒸镀形成精确的图形。
为了将支撑条精确地设置在第二容纳槽内，优选的是，所述掩膜框架包括至少一对第二定位孔220a，每一对第二定位孔220a对应一对第二容纳槽220，并且每一对第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应。
与第一定位孔210a类似，第二定位孔220a的边界同样明显便于 识别，有利于支撑条与第二容纳槽220之间的精确对位。此外，当支撑条发生破损时，可以拆除破损的支撑条，然后对第二容纳槽内的焊点进行打磨。在对第二容纳槽内的焊点进行打磨的过程中，也不会损坏第二定位孔220a。当再次焊接新的支撑条时，仍然可以以第二定位孔220a为基准进行精确的对位。
在本发明中，对形成第一定位孔210a和第二定位孔220a的方式并没有特殊的限制。例如，可以在加工主框架时，在第一容纳槽210相对应的位置形成第一定位孔210a，并且在第二容纳槽220相对应的位置形成第二定位孔220a。
作为选择的是，可以将第一定位孔210a和第二定位孔220a设置在辅助框架上，然后将辅助框架固定在主框架200上，使得第一定位孔210a的位置与第一容纳槽210相对应，而第二定位孔220a的位置与第二容纳槽220相对应。
为了简化制造工艺，优选的是，如图2a所示，主框架200包括框架本体200a和开放式掩膜板200b。此处所述的开放式掩膜板200b与蒸镀共有层的开放式掩膜板类似，通过商购即可获得。在这种实施方式中，开放式掩膜板本身只有一个外框架，并且开口区的大小与蒸镀区A的大小相当。此外，开放式掩膜板本身设置有定位孔。因此，可以将开放式掩膜板上的定位孔用作所述第一定位孔和所述第二定位孔。
如图2a所示，框架本体200a环绕蒸镀区A。第一容纳槽210形成在框架本体200a上。在框架本体200a上还可以形成有环绕蒸镀区A的第三容纳槽，开放式掩膜板200b设置在所述第三容纳槽中。
由于形成有第三容纳槽并且将开放式掩膜板200b设置在第三容纳槽内，因此可以防止开放式掩膜板200b从框架本体的上表面凸出，从而可以使固定在框架本体200a上的掩膜条更加平整。这样，进一步保证蒸镀图形的精确度。
图2b是沿着图2a的I-I线截取的剖视图。从图2b中可以看出，开放式掩膜板200b设置在第三容纳槽中。
作为另一种实施方式，如图3a所示，主框架200包括框架本体200a和两个第一定位条200c。该第一定位条200c上形成有多个第一定位孔210a，框架本体200a环绕蒸镀区A，第一容纳槽210形成在框架本体200a上，蒸镀区A的第一方向的两侧各形成一个第四容纳槽，并且两个第一定位条200c分别设置在两个所述第四容纳槽中。
图3b示出了沿着图3a的II-II线截取的剖视图。从图3b中可以看出，第一定位条200c设置在第四容纳槽中。
在本发明中，可从开放式掩膜板上切割一部分，以形成第一定位条。
优选的是，所述主框架还包括两个第二定位条200d，该第二定位条200d上形成有多个第二定位孔220a，第二容纳槽220形成在框架本体200a上，所述蒸镀区的第二方向的两侧各形成一个第五容纳槽(未示出)，并且两个第二定位条200d分别设置在两个所述第五容纳槽中。
在本发明中，可从开放式掩膜板上切割一部分，以形成第二定位条200d。
图3c示出了沿着图3a的III-III线截取的剖视图。从图3c中可以看出，第二定位条200d设置在第五容纳槽中。
在图3a中所示的具体实施方式中，将开放式掩膜板切割成四部分，分别形成两个第一定位条和两个第二定位条。
在本发明所提供的优选实施方式中，第三容纳槽、第四容纳槽、第五容纳槽的深度均大于第一容纳槽的深度，也均大于第二容纳槽的深度。
作为本发明的另外一种方式，可以直接在框架本体上加工形成所述第一定位孔和所述第二定位孔。具体地说，所述主框架包括框架本体，所述框架本体环绕所述蒸镀区，所述第一容纳槽、所述第二容纳槽、所述第一定位孔和所述第二定位孔均形成在所述框架本体上。
为了防止掩膜条表面出现不平整，优选的是，遮挡条和支撑条的表面均不高于所述主框架的表面。具体地说，遮挡条的厚度可以小于或者等于第一容纳槽的深度，而所述支撑条的厚度小于或等于所述第 二容纳槽的深度。
作为本发明的第二个方面，提供一种掩膜板。如图4所示，所述掩膜板包括掩膜框架和多个掩膜条300，其中，所述掩膜框架为本发明所提供的上述掩膜框架，多个掩膜条300固定在所述主框架上，在相邻两个掩膜条300之间设置一个遮挡条400，并且掩膜条300的边缘区与遮挡条400重叠。
在本发明中，掩膜条300的边缘部上形成有通孔，从而使得整个掩膜条上应力分布均匀，不会出现变形等现象。
如上文中所述，由于所述掩膜框架上设置有与所述第一容纳槽相对应的第一定位孔，因此，可以将遮挡条400精确地定位在第一容纳槽内。在遮挡条400精确定位之后，可以有效地阻挡透过边缘区通孔的蒸镀材料沉积在待加工的衬底基板上，从而可以提高形成在衬底基板上的图形的精度。
在图4中，虚线L表示的即为相邻两个掩膜条300的交接线。
由于所述掩膜框架上设置有与所述第二容纳槽对应的第二定位孔，因此，可以将支撑条500精确地定位在第二容纳槽内。
由于所述掩膜板中支撑条和遮挡条定位精确，因此，可以对掩膜条之间的间隙进行准确的遮挡，从而可以在衬底基板上形成精确的图形。
作为本发明的再一个方面，提供一种掩膜框架的制造方法，所述掩膜框架包括至少一对第一定位孔，所述制造方法包括：
提供主框架，并且在所述主框架上形成多对第一容纳槽，其中，每一对第一容纳槽中的两个所述第一容纳槽分别位于所述蒸镀区的第一方向的两侧，每对所述第一定位孔对应一对所述第一容纳槽，并且每一对所述第一定位孔中的两个第一定位孔分别与相应的一对第一容纳槽中的两个所述第一容纳槽位置对应；以及
以所述第一定位孔为基准，对与所述第一定位孔对应的第一容纳槽与遮挡条进行对位，在对位准确之后，将所述遮挡条的两端分别焊 接在相应一对所述第一容纳槽中的两个第一容纳槽中。
如上文中所述，由于第一定位孔210a的边界是封闭图形，与第一容纳槽210的侧壁边缘相比，第一定位孔210a的边缘更加容易识别。此外，利用第一定位孔210a作为定位基准，可以避免设备精度对焊接精度的影响和打磨修复时对识别边界的损伤。因此，在将遮挡条焊接在第一容纳槽210中之前，可以将遮挡条与第一定位孔210a进行精确的对位。这样，可以确保遮挡条精确地焊接在第一容纳槽中。
根据本发明的实施方式，当遮挡条发生损坏时，可以将破损的遮挡条从第一容纳槽中拆除。在对第一容纳槽内的焊点进行打磨的过程中，不会损坏第一定位孔。因此，在更换新的遮挡条时，仍然可以以第一定位孔为基准对新的遮挡条进行定位，从而使遮挡条定位精确地固定在主框架上。
由于遮挡条精确地焊接在第一容纳槽中，因而可以对设置在所述掩膜框架上的掩膜条的边缘部进行遮挡。此外，由于遮挡条精确地焊接在适当位置上，因而可以为掩膜条的设计提供较大的预偏量。因此，在利用包括所述掩膜框架的掩膜板进行蒸镀时，可以在衬底基板上形成更加精确的图形。
当所述掩膜框架具有较大尺寸时，需要设置支撑条对掩膜条进行支撑。在这种情况中，所述掩膜框架包括至少一对第二定位孔，每一对所述第二定位孔对应一对所述第二容纳槽，并且每一对所述第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应，所述制造方法还包括：
以第二定位孔为基准，对与所述第二定位孔对应的第二容纳槽与支撑条进行对位，在对位准确之后，将所述支撑条的两端分别焊接在相应一对所述第二容纳槽中的两个第一容纳槽中。
与第一定位孔类似，第二定位孔的边界同样明显便于识别，有利于支撑条与第二容纳槽之间的精确对位。此外，当支撑条发生破损时，可以拆除破损的支撑条，然后对第二容纳槽内的焊点进行打磨。在对第二容纳槽内的焊点进行打磨的过程中，也不会损坏第二定位孔。当再次焊接新的支撑条时，仍然可以以第二定位孔为基准进行精确的对 位。
可以理解的是，以上实施方式仅仅是为了说明本发明的原理而采用的示例性实施方式，然而本发明并不局限于此。对于本领域内的普通技术人员而言，在不脱离本发明的精神和实质的情况下，可以做出各种变型和改进，这些变型和改进也视为本发明的保护范围。

Claims (11)

  1. 一种掩膜框架，所述掩膜框架包括主框架和多个遮挡条，所述主框架上形成有沿厚度方向贯穿所述主框架的蒸镀区，所述主框架上设置有多对第一容纳槽，每一对第一容纳槽中的两个所述第一容纳槽分别位于所述蒸镀区的第一方向的两侧，每个所述遮挡条对应一对所述第一容纳槽，所述遮挡条的两端分别设置在相应的两个第一容纳槽中，其中，
    所述掩膜框架包括至少一对第一定位孔，
    每对所述第一定位孔对应一对所述第一容纳槽，并且
    每一对所述第一定位孔中的两个第一定位孔分别与相应的一对第一容纳槽中的两个所述第一容纳槽位置对应。
  2. 根据权利要求1所述的掩膜框架，其中，
    所述主框架上设置有多对第二容纳槽和多个支撑条，
    每一对所述第二容纳槽中的两个所述第二容纳槽分别位于所述蒸镀区的第二方向的两侧，
    所述第一方向与所述第二方向互相垂直，
    每个支撑条对应一对第二容纳槽，并且
    所述支撑条的两端分别设置在相应的两个第二容纳槽中。
  3. 根据权利要求2所述的掩膜框架，其中，
    所述掩膜框架包括至少一对第二定位孔，
    每一对所述第二定位孔对应一对所述第二容纳槽，并且
    每一对所述第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应。
  4. 根据权利要求3所述的掩膜框架，其中，
    所述主框架包括框架本体和开放式掩膜板，
    在所述开放式掩膜板上形成有所述第一定位孔和所述第二定位 孔，
    所述框架本体环绕所述蒸镀区，
    所述第一容纳槽形成在所述框架本体上，
    所述框架本体上还形成有环绕所述蒸镀区的第三容纳槽，并且
    所述开放式掩膜板设置在所述第三容纳槽中。
  5. 根据权利要求3所述的掩膜框架，其中，
    所述主框架包括框架本体和两个第一定位条，所述第一定位条上形成有多个所述第一定位孔，
    所述框架本体环绕所述蒸镀区，
    所述第一容纳槽形成在所述框架本体上，
    所述蒸镀区的第一方向的两侧各形成一个第四容纳槽，并且
    两个所述第一定位条分别设置在两个所述第四容纳槽中。
  6. 根据权利要求5所述的掩膜框架，其中，
    所述主框架还包括两个第二定位条，所述第二定位条上形成有多个所述第二定位孔，
    所述第二容纳槽形成在所述框架本体上，
    所述蒸镀区的第二方向的两侧各形成一个第五容纳槽，并且
    两个所述第二定位条分别设置在两个所述第五容纳槽中。
  7. 根据权利要求3所述的掩膜框架，其中，
    所述主框架包括框架本体，所述框架本体环绕所述蒸镀区，并且
    所述第一容纳槽、所述第二容纳槽、所述第一定位孔和所述第二定位孔均形成在所述框架本体上。
  8. 根据权利要求2至7中任意一项所述的掩膜框架，其中，
    所述遮挡条的厚度小于或等于所述第一容纳槽的深度，并且
    所述支撑条的厚度小于或等于所述第二容纳槽的深度。
  9. 一种掩膜板，所述掩膜板包括掩膜框架和多个掩膜条，其中，
    所述掩膜框架为根据权利要求1至8中任意一项所述的掩膜框架，
    多个所述掩膜条固定在所述主框架上，
    在相邻两个所述遮挡条之间设置一个所述掩膜条，并且
    所述掩膜条的边缘区与所述遮挡条重叠。
  10. 一种掩膜框架的制造方法，所述掩膜框架包括至少一对第一定位孔，所述制造方法包括：
    提供主框架，并且在所述主框架上形成多对第一容纳槽，其中，每一对第一容纳槽中的两个所述第一容纳槽分别位于所述蒸镀区的第一方向的两侧，每对所述第一定位孔对应一对所述第一容纳槽，并且每一对所述第一定位孔中的两个第一定位孔分别与相应的一对第一容纳槽中的两个所述第一容纳槽位置对应；以及
    以所述第一定位孔为基准，对与所述第一定位孔对应的第一容纳槽与遮挡条进行对位，在对位准确之后，将所述遮挡条的两端分别焊接在相应一对所述第一容纳槽中的两个第一容纳槽中。
  11. 根据权利要求10所述的制造方法，其中，
    所述掩膜框架包括至少一对第二定位孔，每对所述第二定位孔对应一对所述第二容纳槽，并且每一对所述第二定位孔中的两个第二定位孔分别与相应的一对第二容纳槽中的两个第二容纳槽位置对应，所述制造方法还包括：
    以第二定位孔为基准，对与所述第二定位孔对应的第二容纳槽与支撑条进行对位，在对位准确之后，将所述支撑条的两端分别焊接在相应一对所述第二容纳槽中的两个第一容纳槽中。
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