WO2018105316A1 - Broche de sondage et support de circuit intégré - Google Patents

Broche de sondage et support de circuit intégré Download PDF

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Publication number
WO2018105316A1
WO2018105316A1 PCT/JP2017/040683 JP2017040683W WO2018105316A1 WO 2018105316 A1 WO2018105316 A1 WO 2018105316A1 JP 2017040683 W JP2017040683 W JP 2017040683W WO 2018105316 A1 WO2018105316 A1 WO 2018105316A1
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WO
WIPO (PCT)
Prior art keywords
contact
contact portion
coil spring
conductive
probe pin
Prior art date
Application number
PCT/JP2017/040683
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English (en)
Japanese (ja)
Inventor
大熊　真史
Original Assignee
株式会社ネバーグ
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ネバーグ filed Critical 株式会社ネバーグ
Publication of WO2018105316A1 publication Critical patent/WO2018105316A1/fr

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
    • H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
    • H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket

Definitions

  • the present invention relates to a probe pin and an IC socket used for inspection of an IC (Integrated Circuit).
  • an inspection connected to each terminal of the IC and an inspection device (IC tester) for inspecting the IC while suppressing electrical connection between adjacent terminals in the IC.
  • Probe pins are used to electrically connect the electrodes corresponding to the respective terminals on the circuit board.
  • a typical configuration of the probe pin includes a tubular body that is opened while being partially closed at both ends, a coil spring disposed inside the tubular body, and the partially closed portion that is urged by the coil spring. And two contact members partially protruding from the tubular body in a state of being locked to each other.
  • a probe pin constituted by two plate-like contact members obtained by pressing or etching a plate material and a coil spring. Since the tubular body is not necessary, the cost of parts of the probe pin can be reduced.
  • each terminal of the IC to be inspected is generally a solder ball or a lead frame solder-plated or tin-plated, and the surface is oxidized. Since the oxidized surface has a large electric resistance, a probe pin for inspecting an IC has a structure in which, for example, the tip of the probe pin is processed into a sharp protrusion to break through the oxide film.
  • a method for removing the oxide film a method is known in which a contact portion of a contact member that contacts an IC terminal is slid on the surface of the IC terminal. The sliding of the contact portion is effective even with very little (about 10 ⁇ m), and sliding the contact portion is called a wiping operation. Examples of probe pins having such a wiping operation include the probe pins disclosed in Patent Literature 1 and Patent Literature 2.
  • the probe pin disclosed in Patent Document 1 is a probe pin having a sleeve made of a conductive metal, a spring accommodated in an axial direction in the sleeve, and a plunger made of a conductive metal, and the plunger is attached to the sleeve.
  • An elongated guide hole that restricts the axial movement of the guide is formed, the guide hole extends at a constant inclination angle with respect to the axial direction of the sleeve, and a protrusion that is inserted into the guide hole is formed on the plunger.
  • the plunger of the pin moves in the axial direction, the plunger can be given a wiping operation such as a rotational motion and a horizontal motion.
  • the probe pin disclosed in Patent Document 2 includes a plunger having a contact portion with which the electrode portion of the semiconductor element is contacted, and a coil spring that biases the plunger toward the electrode portion of the semiconductor element.
  • a cantilever-shaped contact piece that is provided on the plunger and extends in the axial direction of the probe receiving hole, and the contact piece protrudes in a direction perpendicular to the axial direction at a position closer to the contact portion than the probe receiving hole
  • the probe pin is located outside the probe receiving hole when viewed in the axial direction and the plunger is displaced in the axial direction against the urging force of the coil spring.
  • Is a socket for a semiconductor element wherein the contact piece is displaced in a direction orthogonal to the axial direction by sliding in contact with the edge of the accommodation hole.
  • an object of the present invention is to provide a probe pin that solves the above-described problems, performs a wiping operation when the probe pin is used, and is excellent in economy.
  • An anisotropic conductive member having a rod-shaped general shape and having a conductive direction along its long axis, and having a winding axis along the conductive direction, and at least one rough
  • a coil spring having a winding portion
  • a plate shape having a long axis along the conductive direction, and a plate width direction perpendicular to the first electrode contact portion and the long axis direction at one end in the direction along the long axis
  • a conductive first contact having a first flange portion that protrudes including the component, and a plate shape having a long axis along the conductive direction, and a second end at one end in the direction along the long axis.
  • a conductive second contact having an electrode contact portion and a second flange portion projecting including a component in the plate width direction orthogonal to the major axis direction, and the anisotropic conductive member comprises: Side on which the contact member is located in the conductive direction Has a substrate contact portion so as to include an opposite end portion, and the first contact has a portion including a first internal contact portion located on the other end side in the direction along the long axis, A portion including the first internal contact portion is inserted into the coil spring from an end portion of the coil spring that is distal to the substrate contact portion, and is locked to the coil spring at the first flange portion.
  • the two contacts have a portion including a second internal contact portion located on the other end side in the direction along the long axis, and the portion including the second internal contact portion is far from the substrate contact portion in the coil spring. Inserted into the coil spring from the end on the upper side, locked to the coil spring at the second flange portion, and the first contact and the second contact are arranged side by side in the plate thickness direction, In the direction of conduction
  • the anisotropic conductive member is provided between the rough winding portion and the substrate contact portion in the conductive direction, and is coaxially positioned in the rough winding portion and the conductive direction. And a force for compressing the coil spring in a direction along the conductive direction with the first electrode contact portion, the second electrode contact portion, and the substrate contact portion as contact portions.
  • the first contact is capable of inclining in a first direction that is one of the plate width directions while contacting the coil spring or the conductive cylindrical body in the first internal contact portion.
  • the second contact is in contact with the coil spring or the conductive cylindrical body at the second internal contact portion, and is the second of the other in the plate width direction and opposite to the first direction. It can be tilted
  • An anisotropic conductive member characterized by that.
  • the coil spring includes a first rough winding portion positioned on the side where the contact member is inserted, and a tight winding that is extended to an end portion of the first rough winding portion that is proximal to the substrate contact portion.
  • the coil spring includes a first rough winding portion positioned on a side where the contact member is inserted, and the conductive cylindrical body is an end proximal to the substrate contact portion in the first rough winding portion.
  • the conductive cylindrical body has a columnar shape, and includes a hollow portion having an opening at least on an end opposite to the substrate contact portion side, and the first internal contact portion and the second internal contact portion.
  • the shape of the coil spring, the contact, and the conductive cylindrical body is set so that at least one of the internal contact portions can contact the inner surface of the hollow portion in use, according to (4) above.
  • the anisotropic conductive member according to any one of (5).
  • the conductive cylindrical body has an enlarged diameter portion whose inner diameter is larger than the inner diameter of the first coarsely wound portion, and at least one of the first internal contact portion and the second internal contact portion is used.
  • the conductive cylindrical body has a reduced diameter portion whose inner diameter is smaller than the inner diameter of the first rough winding portion, and at least one of the first internal contact portion and the second internal contact portion is used.
  • the first rough winding portion has an enlarged diameter portion in which an inner diameter in the vicinity of the end portion on the conductive cylindrical body side is larger than an inner diameter in the vicinity of the other end portion, and the first internal contact portion and the first 2.
  • the first rough winding portion includes a reduced diameter portion in which an inner diameter in the vicinity of the end portion of the conductive cylindrical body is smaller than an inner diameter in the vicinity of the other end portion, and the first internal contact portion and the first 2.
  • the conductive cylindrical body has a tapered portion whose inner diameter gradually changes in the vicinity of the end on the substrate contact portion side, and at least one of the first internal contact portion and the second internal contact portion is used.
  • the first electrode contact portion protrudes including a component in a direction along the conductive direction at a position offset in the first direction from a center line in the major axis direction of the first contact; And the second electrode contact portion protrudes including a component in a direction along the conductive direction at a position offset in the second direction from the long-axis center line of the second contact.
  • the anisotropic conductive member according to any one of (1) to (15), wherein
  • the first flange portion includes a first projecting portion projecting in the first direction and a first opposing projecting portion projecting in the second direction, and the first electrode contact portion of the coil spring.
  • the arrangement of the conductive direction of the first projecting portion and the first opposing projecting portion is set so that the end on the side is preferentially locked by the first opposing projecting portion; and
  • the second flange portion has a second projecting portion projecting in the second direction and a second opposing projecting portion projecting in the first direction, and an end portion of the coil spring on the second electrode contact portion side
  • the arrangement of the conductive direction of the second projecting portion and the second opposing projecting portion satisfies at least one of the above, so that the second projecting portion is preferentially locked by the second facing projecting portion,
  • the anisotropic conductive member according to any one of 1) to (16).
  • An end winding portion is provided at an end of the first rough winding portion on the side where the contact is inserted, and the first contact is between the first flange portion and the first internal contact portion.
  • a projection portion wherein the second projection portion is inserted into a gap between the coil wires of the coil spring and located closer to the substrate contact portion than the end turn portion, and the second contact with respect to the coil spring Regulated relative position At least one meeting the anisotropically conductive member according to any one of the above (2) to (17) of be.
  • the anisotropic conductive member according to any one of (1) to (19), a plate-like first housing having a plurality of first through holes penetrating in the conductive direction, and the conductive direction
  • a plate-like second housing having a plurality of second through-holes penetrating through the first housing and the second housing, wherein the first through-hole and the second through-hole communicate with each other.
  • the anisotropic conductive member is disposed in each of the through holes so that a part of the contact side is located in the first through hole.
  • the first electrode contact portion and the second electrode contact portion protrude from the first housing.
  • a member made of an insulating rigid body, having a through hole in an array corresponding to the terminal of the IC to be inspected, and a member for holding the probe pin in the through hole is called a housing
  • An assembly in which the probe pin is held in the housing is called an IC socket.
  • FIG. 1A is a cross-sectional view of the probe pin 1 according to the first embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 11, and FIG. It is sectional drawing in the surface perpendicular
  • FIG.1 (c) is a partial enlarged view of Fig.1 (a).
  • FIG. 1D is an external view of the probe pin 1
  • FIG. 1E is an external view of the first contact 11 and the second contact 12.
  • 2A is a cross-sectional view showing a state in which the IC socket 2 holding the probe pin 1 according to the first embodiment of the present invention is placed on the inspection substrate 1000, and FIG. FIG.
  • FIG. 3 is an enlarged view of a part of FIG.
  • FIG. 3 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 2 reaches the state of inspecting the IC 2000 as the measurement object.
  • FIG. 4 is a cross-sectional view showing a state where the IC socket 2 of FIG. 2 is inspecting the IC 2000 that is a measurement object. It is sectional drawing which shows the state which inspects IC2000 which is the measuring object by the IC socket 2 holding the probe pin 1 which concerns on the modification of 1st Embodiment of this invention.
  • FIG. 3 is an enlarged view of a part of FIG.
  • FIG. 3 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 2 reaches the state of inspecting the IC 2000 as the measurement object.
  • FIG. 4 is a cross-sectional view showing a state where the IC socket 2 of FIG. 2 is inspecting the IC 2000 that is a measurement object.
  • FIG. 6A is a cross-sectional view of a probe pin 1 according to a modification of the first embodiment of the present invention on a plane parallel to the plate surface of the plate-like body of the first contact 11, and FIG. These are sectional views in a plane perpendicular to the plate surface of the plate-like body of the first contact 11.
  • FIG. 6C is an external view of the probe pin 1
  • FIG. 6D is an external view of the first contact 11 and the second contact 12.
  • FIG. 7A is a cross-sectional view of the probe pin 3 according to the second embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 31, and FIG. FIG.
  • FIG. 3 is a cross-sectional view of a plane perpendicular to the plate surface of the plate-like body of one contact 31.
  • FIG. 7C is an external view of the probe pin 3.
  • FIG. 8A is a cross-sectional view of the probe pin 4 according to the third embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 41, and
  • FIG. 4 is a cross-sectional view of a plane perpendicular to the plate surface of a plate-like body of one contact 41;
  • FIG. 8C is an external view of the probe pin 4.
  • FIG. 9 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 4 according to the second embodiment of the present invention is placed on the inspection substrate 1000.
  • FIG. 10 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 9 reaches the state of inspecting the IC 2000 as the measurement object.
  • FIG. 11 is a cross-sectional view showing a state where the IC socket 2 of FIG. 9 is inspecting the IC 2000 that is a measurement object.
  • 12A is a cross-sectional view of the probe pin 5 according to the fourth embodiment of the present invention on a plane parallel to the plate surface of the plate-like body of the first contact 51
  • FIG. FIG. 6 is a cross-sectional view of a plane perpendicular to the plate surface of the plate-like body of one contact 51.
  • FIG. 12C is an external view of the probe pin 5.
  • FIG. 13 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 5 according to the fourth embodiment of the present invention is placed on the inspection substrate 1000.
  • FIG. 14 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 13 reaches the state of inspecting the IC 2000 that is the measurement object.
  • FIG. 15 is a cross-sectional view showing a state where the IC socket 2 of FIG. 13 is inspecting the IC 2000 that is a measurement object.
  • FIG. 16A is a cross-sectional view of the probe pin 6 according to the fifth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 61, and FIG. FIG.
  • FIG. 5 is a cross-sectional view of a surface of a contact 61 perpendicular to the plate surface of a plate-like body.
  • FIG. 16C is an external view of the probe pin 6
  • FIG. 16D is an external view of the first contact 61 and the second contact 62.
  • FIG. 17 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 6 according to the fifth embodiment of the present invention is placed on the inspection substrate 1000.
  • FIG. 18 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 17 reaches the state of inspecting the IC 2000 as the measurement object.
  • FIG. 19 is a cross-sectional view showing a state in which the IC socket 2 of FIG.
  • FIG. 17 is inspecting the IC 2000 that is a measurement object.
  • FIG. 20A is a cross-sectional view of the probe pin 6 according to a modification of the fifth embodiment of the present invention on a plane parallel to the plate surface of the plate-like body of the first contact 61, and FIG. These are sectional views in a plane perpendicular to the plate surface of the plate-like body of the first contact 61.
  • FIG. 20C is an external view of the plunger 64 in the initial state.
  • FIG. 21A is a cross-sectional view of the probe pin 7 according to the sixth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 71, and FIG.
  • FIG.21 (c) is a partial enlarged view of Fig.21 (a).
  • FIG. 21D is an external view of the probe pin 7
  • FIG. 21E is an external view of the first contact 71 and the second contact 72.
  • FIG. 22A is a cross-sectional view showing a state where the IC socket 2 holding the probe pin 7 according to the sixth embodiment of the present invention is placed on the inspection substrate 1000, and FIG. It is a one part enlarged view of Fig.22 (a).
  • FIG. 23 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG.
  • FIG. 22 reaches the state of inspecting the IC 2000 that is the measurement object.
  • FIG. 24 is a cross-sectional view showing a state where the IC socket 2 of FIG. 22 is inspecting the IC 2000 that is a measurement object.
  • FIG. 25A is a cross-sectional view of the probe pin 8 according to the seventh embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 81
  • FIG. 4 is a cross-sectional view of a surface of a contact 81 perpendicular to a plate surface of a plate-like body.
  • FIG. FIG. 25C is an external view of the probe pin 8
  • FIG. 25D is an external view of the first contact 81 and the second contact 82.
  • FIG. 26 is a cross-sectional view showing a state in which the IC socket 2 holding the probe pins 8 according to the seventh embodiment of the present invention is placed on the inspection substrate 1000.
  • FIG. 27 is a cross-sectional view showing one state of the process in which the IC socket 2 of FIG. 26 reaches the state of inspecting the IC 2000 as the measurement object.
  • FIG. 28 is a cross-sectional view showing a state in which the IC socket 2 of FIG. 26 is inspecting the IC 2000 that is a measurement object.
  • FIG. 29A is a cross-sectional view of the probe pin 9 according to the eighth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 91, and FIG. FIG.
  • FIG. 6 is a cross-sectional view of a plane perpendicular to the plate surface of a plate-like body of one contact 91;
  • FIG. 29C is an external view of the probe pin 9.
  • FIG. 30 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 9 according to the eighth embodiment of the present invention is placed on the inspection substrate 1000.
  • the probe pin 1 according to the first embodiment of the present invention includes a first contact 11, a second contact 12, a coil spring 13, and a plunger 14.
  • FIG. 1A is a cross-sectional view of the probe pin 1 according to the first embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 11, and
  • FIG. 3 is a cross-sectional view in a plane perpendicular to the plate surface of the plate-like body of one contact 11.
  • FIG. 1C is an enlarged view of a part of FIG.
  • FIG. 1D is an external view of the probe pin 1
  • FIG. 1E is an external view of the first contact 11 and the second contact 12.
  • the first contact 11 and the second contact 12 are made of a plate-like body having a substantially uniform plate thickness.
  • one plate material may be pressed or etched, or may be formed by thick plating by an electroforming plating method.
  • the first contact 11 includes a first electrode contact portion 111 for contacting an electrode attached to an IC that is a measurement object at one end. Further, the first contact 11 includes a first flange portion 112 in the vicinity of the first electrode contact portion 111 that protrudes from the outer surface in the plate width direction. Further, the first contact 11 includes a first arm portion 113 extending from the first flange portion 112 to the opposite side to the first electrode contact portion 111 at the other end portion. The first arm 113 includes a first internal contact portion 114 projecting over a certain length on one side surface (plate thickness surface) in the vicinity of the end portion, and further, in the vicinity of the end portion on the first flange portion 112 side.
  • the 1st projection part 115 is provided in the one side surface (plate thickness surface). That is, the first internal contact portion 114 and the first protrusion 115 are provided on the same side surface of the first arm portion 113. Further, the corner of the first internal contact portion 114 is formed to be slightly round.
  • the tip portion 116 of the first electrode contact portion 111 is composed of one contact portion having a slightly rounded tip, and the contact portion is a first internal contact with respect to the center line in the extending direction of the first arm portion 113. It is eccentric with a fixed length on the side opposite to the portion 114.
  • the second contact 12 has substantially the same shape as the first contact 11 described above.
  • the coil spring 13 includes a first coarsely wound portion 131 at one end and a tightly wound portion 132 at the other end.
  • the first coarsely wound portion 131 is a portion in which the wire material forming the coil spring 13 is wound at an interval so that the coil spring 13 can be compressed.
  • the tightly wound portion 132 is a portion in which the wire forming the coil spring 13 is wound in close contact with no gap.
  • the tightly wound portion 132 is connected to the first coarsely wound portion 131, has a fixed length of the first small diameter portion 133 having substantially the same outer diameter as the first coarsely wound portion 131, and A large-diameter portion 134 that is connected to one small-diameter portion 133 and is expanded over a certain length is provided.
  • a stepped portion 135 is formed at the boundary between the first small diameter portion 133 and the large diameter portion 134.
  • the plunger 14 is a cylindrical body in the probe pin 1 illustrated in FIG.
  • the plunger 14 is provided with a substrate contact portion 141 for contacting an electrode attached to the inspection substrate at one end. Further, a third flange portion 142 is provided in the vicinity of the substrate contact portion 141 so as to protrude from the outer surface of the substrate contact portion 141 in the outer peripheral direction. Furthermore, the plunger 14 includes a press-fit portion 143 that protrudes from the third flange portion 142 to the side opposite to the substrate contact portion 141 at the other end portion.
  • the plunger 14 may be a plate-like body.
  • the first arm portion 113 included in the first contact 11 is referred to as the first electrode contact portion 111. It inserts into the internal diameter side of the 1st rough winding part 131 with which the coil spring 13 is provided from the edge part on the opposite side. Similarly, the second arm portion 123 provided in the second contact 12 is also inserted into the inner diameter side of the first rough winding portion 131 provided in the coil spring 13.
  • the first contact 11 and the second contact 12 are inserted in directions in which the respective plate surfaces face each other and the electrode contact portions are separated from each other. Accordingly, the respective internal contact portions are also arranged in a direction away from each other.
  • first protrusion 115 provided in the first contact 11 and the second protrusion 125 provided in the second contact 12 are wire rods that form the coil spring 13 in the vicinity of the end portion of the coil spring 13 on the first rough winding portion 131 side, respectively. Lock in the gap.
  • the first projecting portion 115 and the second projecting portion 125 are provided for the purpose of preventing the first contact 11 and the second contact 12 from falling off from the coil spring 13. Since the first contact 11 and the second contact 12 are not likely to fall off from the coil spring 13 in the state of being held in the through-hole 210 provided in the first and second protrusions 115 and 125, the first and second protrusions 115 and 125 may be omitted. Good. Further, the first projecting portion 115 and the second projecting portion 125 may be provided at any position of the first arm portion 113 and the second arm portion 123 as long as there is no possibility of hindering the wiping operation of the probe pin 1 described later. Good.
  • the plunger 14 press-fits the press-fit portion 143 into the end portion of the coil spring 13 on the side of the tightly wound portion 132.
  • the press-fitting part 143 may be inserted only at the end of the tightly wound part 132 side.
  • a tightly wound portion (end turn portion) of about one turn called end turn is formed at the end of the coarse turn portion of the coil spring.
  • a single turn winding portion 131 ⁇ / b> Z is formed at the end portion on the first rough winding portion 131 side.
  • the end of the coil spring 13 on which the end turn 131Z is formed is closer to the height of the opposite end turn 131Z, as shown in FIG. 1C.
  • a height difference of about 1 ⁇ 2 of the diameter of the wire forming 13 is generated.
  • the end of the first flange portion 112 included in the first contact 11 opposite to the first electrode contact portion 111 is in contact with one end of the end of the coil spring 13 and the other end is a coil spring. 13 and a gap are generated. Further, when the end winding portion is not formed at the end portion of the coil spring 13 on the first coarse winding portion 131 side, a height difference of about 1 ⁇ 2 of the winding pitch of the rough winding portion is generated at this end portion. In the probe pin according to the present invention, it is desirable that the difference in height at the end portion of the coil spring is small. Therefore, it is desirable that an end winding portion is formed at the end portion of the coil spring on the coarse winding portion side.
  • 2A is a cross-sectional view showing a state in which the IC socket 2 holding the probe pin 1 according to the first embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. FIG. 3 is an enlarged view of a part of FIG.
  • FIG. 3 is a cross-sectional view showing one state of the process in which the IC socket 2 reaches the state of inspecting the IC 2000 that is the measurement object.
  • FIG. 4 is a cross-sectional view showing a state where the IC socket 2 is inspecting an IC 2000 that is a measurement object.
  • the electrodes attached to the IC 2000 are pad-like electrodes. As will be described later, the electrodes attached to the IC 2000 may be solder balls.
  • the IC socket 2 holds the probe pin 1 at a position corresponding to an electrode attached to the IC 2000 that is a measurement object, by each of the plurality of through holes 210 provided in the housing 21.
  • the housing 21 is divided into two in the main surface inward direction.
  • the through hole 210 has a first opening 211 provided on the surface facing the measurement object IC 2000 and a second opening 212 provided on the surface facing the inspection substrate 1000 so that the diameters of the first opening 211 and the first opening 211 are the same. It is formed smaller than the hole diameter of the hollow part 213 provided between the second opening part 212.
  • a first in-hole step 214 is provided at the boundary between the first opening 211 and the hollow 213, and a second in-hole step 215 is provided at the boundary between the second opening 212 and the hollow 213.
  • the first in-hole step portion 214 is engaged with the first flange portion 112, and the second in-hole step portion 215 is engaged with the third flange portion 142.
  • the probe pin 1 is held in the through hole 210.
  • the second flange portion 122 provided in the second contact 12 is similarly locked to the step portion 214 in the first hole.
  • the IC socket 2 is designed so that the coil spring 13 included in the probe pin 1 is slightly compressed in a state where the IC socket 2 is placed on the inspection substrate 1000, that is, in a state shown in FIG.
  • contact pressure is always applied to the contact portion between the substrate contact portion 131 and the inspection substrate 1000. It is preferable because dust and the like are prevented from adhering.
  • preloading is preferably performed, it may not be performed.
  • the end of the coil spring 13 on the first coarsely wound portion 131 side in the state shown in FIG. 2A will be described in detail with reference to FIG.
  • the coil spring 13 is slightly compressed in the state shown in FIG.
  • the end of the coil spring 13 on the first coarsely wound portion 131 side is on the side facing the coil spring 13 of the first flange portion 112 provided in the first contact 11 and the second flange portion 122 provided in the second contact 12. It is pressed to the end.
  • the end portions of the first flange portion 112 and the second flange portion 122 are substantially the same height. Located in.
  • the height means a distance from the reference plane (for example, the plate surface of the inspection substrate 1000) in the expansion / contraction direction of the probe pin (that is, the expansion / contraction direction of the coil spring).
  • the portion in contact with the first flange portion 112 and the portion in contact with the second flange portion 122 at the end of the coil spring 13 on the first rough winding portion 131 side are: , Become the same height.
  • the coil spring 13 has a step corresponding to about 1 ⁇ 2 of the wire diameter at the end on the first rough winding portion 131 side in the initial state, but is pressed at the same height.
  • the two contact portions that are in contact with the first flange portion 112 and the second flange portion 122 in the coil spring 13 have two contact points because one contact portion is contracted more (or less) than the other contact portion.
  • the parts are the same height. Therefore, strictly speaking, the contact portion on the more contracted side has a slightly higher contact pressure than the other contact portion.
  • the IC socket placed on the inspection substrate 1000 is not connected to each electrode of the IC 2000 to be inspected by an external device or a cover attached to the IC socket 2 in the use state shown in FIG. Is fixed so as to press the first electrode contact portion 111 and the second electrode contact portion 121 of each probe pin 1 of the IC socket to a certain height.
  • portions that fix the IC 2000 such as an external device or a cover attached to the IC socket are omitted.
  • the coil spring 13 included in the probe pin 1 is compressed to a predetermined length.
  • the distal end portion 116 of the first electrode contact portion 111 included in the first contact 11 and the distal end portion 126 of the second electrode contact portion 121 included in the second contact 12 are extending directions of the arm portions included in the respective contacts. It is eccentric with respect to the center line.
  • the center line of the arm portion of the first contact 11 is indicated by a one-dot chain line, and the eccentric direction of the first electrode contact portion 111 is indicated by a white arrow.
  • the second contact 12 is slightly inclined in the eccentric direction.
  • the first contact 11 is a side surface (plate) opposite to the eccentric direction in the vicinity of the end of the first arm portion 113.
  • (Thick surface) is provided with the first internal contact portion 114
  • the second contact 12 is provided with the second internal contact portion 124 on the side surface opposite to the eccentric direction in the vicinity of the end portion of the second arm portion 123.
  • the internal contact portion 114 and the second internal contact portion 124 are in sliding contact with the mutually opposing inner side surfaces of the first small diameter portion 133 of the tightly wound portion 131 of the coil spring 13.
  • the distal end portion 116 of the first electrode contact portion 111 included in the first contact 11 and the distal end portion 126 of the second electrode contact portion 121 included in the second contact 12 are eccentric on the respective electrodes of the IC 2000 to be inspected.
  • Slide in the direction. In FIG. 4, the sliding direction of the first electrode contact portion 111 is indicated by a solid arrow.
  • This sliding is a wiping operation.
  • the IC socket 2 shown in FIG. 4 is the object to be measured while being further displaced in the direction of the inspection substrate 1000 while being in sliding contact with the mutually opposed inner surfaces of the large diameter portion 134 of the 13 tightly wound portions 132.
  • the IC2000 is inspected.
  • the electrode attached to the IC 2000 that is the inspection target of the probe pin 1 according to the first embodiment of the present invention may be a solder ball.
  • FIG. 5 is a cross-sectional view showing a state in which the IC socket 2 is inspecting the IC 2000 as a measurement object when the electrode attached to the IC 2000 is the solder ball SB.
  • the electrode attached to the IC 2000 is a solder ball SB
  • the first electrode contact portion 111 of the first contact 11 and the second electrode contact portion 121 of the second contact 12 are tapered.
  • the plate-shaped surface formed in the shape comes into contact with the surface of the solder ball SB. Therefore, in the case where the electrode attached to the IC 2000 shown in FIGS.
  • the first electrode contact portion 111 and the tip end portion of the second electrode contact portion 121 that are eccentric are pressed, and the first electrode contact portion is pressed.
  • the contact 11 and the second contact 12 are inclined, when the electrode attached to the IC 2000 shown in FIG. 5 is a solder ball, the tapered portions of the first electrode contact portion 111 and the second electrode contact portion 121 are pressed. As a result, the first contact 11 and the second contact 12 are inclined.
  • the tapered portions of the first electrode contact portion 111 and the second electrode contact portion 121 may be sharply processed by pressing or the like.
  • 6A shows a surface parallel to the plate surface of the plate-like body of the first contact 11 of the probe pin 1 when the tapered portions of the first electrode contact portion 111 and the second electrode contact portion 121 are sharply processed.
  • FIG. 6B is a cross-sectional view taken along a plane perpendicular to the plate surface of the plate-like body of the first contact 11.
  • FIG. 6C is an external view of the probe pin 1
  • FIG. 6D is an external view of the first contact 11 and the second contact 12.
  • the electrode attached to the IC 2000 is the solder ball SB
  • an oxide film is formed on the surface of the solder ball SB.
  • This oxide film has high electric resistance and high hardness.
  • the inside of the oxide film of the solder ball SB has a low hardness.
  • the tapered portions of the first electrode contact portion 111 and the second electrode contact portion 121 that are sharply processed slide on the surface of the solder ball SB, the oxide film of the solder ball SB is cut and the first electrode is cut.
  • the tapered portions of the contact portion 111 and the second electrode contact portion 121 are in contact with a portion having a low electrical resistance inside the oxide film and a low hardness.
  • the wiping operation generally means an operation of scraping the oxide film by sliding the contact portion.
  • the operation of cutting the oxide film by sliding the contact portion is also wiped. Include in action.
  • Such a wiping operation for tearing the oxide film is expected to tear the oxide film with a lower load than when the sharp tapered portion having the same shape is pressed against the solder ball SB. Further, it is expected that the solder attached to the contact portion of the electrode contact portion is removed by the sliding of the contact portion of the electrode contact portion (self-cleaning effect).
  • the probe pin 3 according to the second embodiment of the present invention includes a first contact 31, a second contact 32, a coil spring 33, a plunger 34, and a barrel 35.
  • FIG. 7A is a cross-sectional view of the probe pin 3 according to the second embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 31, and
  • FIG. 3 is a cross-sectional view of a plane perpendicular to the plate surface of the plate-like body of one contact 31.
  • FIG. 7C is an external view of the probe pin 3.
  • the first coarsely wound portion and the tightly wound portion are made of the same wire and are connected to each other, but the first coarsely wound portion and the tightly wound portion are made of different members. May be.
  • the tightly wound portion may be composed of wire materials having different wire diameters, or may be composed of a pipe material instead of the closely wound material composed of the wire material.
  • the probe pin 3 according to the second embodiment shown in FIG. 7 includes a barrel 35 made of a pipe material. Below, a different part from 1st Embodiment is demonstrated about 2nd Embodiment. Since the structure, manufacturing method, and the like not particularly described are the same as those of the probe pin 1 according to the first embodiment described above, the description thereof is omitted here.
  • the coil spring 33 provided in the probe pin 3 according to the second embodiment of the present invention includes a first coarsely wound portion 331 at one end. Further, the other end portion is provided with a tightly wound portion 332 that is connected to the first coarsely wound portion 331 and holds the barrel 35.
  • the tightly wound portion 332 is a portion that holds the barrel 35, and may be constituted by a coarsely wound portion. The shape is arbitrary as long as it can hold the barrel 35.
  • the barrel 35 is formed of a cylindrical pipe material, and includes a press-fit portion 3510 that is press-fitted into a tightly wound portion 332 included in the coil spring 33 at one end.
  • a plunger 34 is press-fitted into the other end.
  • the barrel 35 is formed with a small inner diameter in the vicinity of the end portion on the coil spring 33 side over a certain length, and constitutes a first narrow-diameter portion 353. Further, the inner diameter is increased toward the end portion on the plunger 34 side to constitute a large diameter portion 354.
  • a stepped portion 355 is formed at the boundary between the first small diameter portion 353 and the large diameter portion 354.
  • the barrel 35 may be configured by tightly winding wire. That is, the barrel 35 is a conductive cylindrical body, and the tightly wound portion 131 of the coil spring 13 included in the probe pin 1 described above is also a conductive cylindrical body.
  • the plunger 34 and the barrel 35 may be integrated. That is, the barrel 35 may include a hollow portion having an opening at one end and a substrate contact portion at the other end.
  • the probe pin 4 according to the third embodiment of the present invention includes a first contact 41, a second contact 42, a coil spring 43, and a plunger 44.
  • FIG. 8A is a cross-sectional view of the probe pin 4 according to the third embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 41
  • FIG. 4 is a cross-sectional view of a plane perpendicular to the plate surface of a plate-like body of one contact 41
  • FIG. 8C is an external view of the probe pin 4.
  • FIG. 9 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 4 according to the third embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. 10 is a cross-sectional view of the IC socket 2 of FIG. It is sectional drawing which shows one state of the process which leads to the state which test
  • FIG. 11 is a cross-sectional view showing a state where the IC socket 2 of FIG. 9 is inspecting the IC 2000 that is a measurement object.
  • the configuration of the probe pin 4 according to the third embodiment may be implemented in the probe pin 1 according to the first embodiment or may be implemented in the probe pin 3 according to the second embodiment.
  • the coil spring 43 includes a stepped portion 435 in the first coarsely wound portion 431. That is, the coil spring 43 is provided with the first rough winding portion 431 at one end, the close winding portion 432 at the other end, and the end portion of the first rough winding portion 431 on the close winding portion 432 side is constant.
  • the tightly wound portion 432 is expanded over the length and connected to the end portion of the expanded first coarsely wound portion 431 and has substantially the same outer diameter as the end portion of the expanded first coarsely wound portion 431. Is provided.
  • a portion having a small outer diameter in the first coarsely wound portion 431 is a first small diameter portion 433, and a portion where the diameter is increased is a large diameter portion 434. It is formed.
  • the internal contact portion of the first contact and the second contact is the tightly wound portion of the coil spring. What is necessary is just to contact the inner surface.
  • the wiping operation is performed by inspecting an IC whose probe pin is a measurement object from a state where the IC socket holding the probe pin is placed on the inspection substrate (the state shown in FIG. 9 in the third embodiment). What is necessary is just to be performed in the process to reach a state (state shown in FIG. 11 in the third embodiment).
  • the probe pin 4 according to the third embodiment of the present invention as shown in FIG.
  • the coil spring 43 includes a stepped portion 435 in the first coarsely wound portion 431, so that the first contact 41 and the second contact 42 are A wiping operation is performed before contacting the tightly wound portion 432 of the coil spring 43.
  • the operation from the state shown in FIG. 9 to the state shown in FIG. 11 through the state shown in FIG. 10 will be described below.
  • the first internal contact portion 414 and the second internal contact portion 424 are opposed to the first narrow diameter portion 433 of the first rough winding portion 432 provided in the coil spring 43, respectively. In sliding contact with the inner surface.
  • the first internal contact portion 414 and the second internal contact portion The 424 is displaced in the direction of the inspection substrate 1000 while being in sliding contact along the mutually opposing inner surfaces of the first coarsely wound portion 432 of the coil spring 43.
  • the first contact 41 and the second contact 42 are Similarly to the probe pin 1 according to the first embodiment, the probe pins 1 are further inclined in the eccentric direction.
  • the tip part 416 of the first electrode contact part 411 provided in the first contact 41 and the tip part 426 of the second electrode contact part 421 provided in the second contact 42 are the same as the probe pin 1 according to the first embodiment.
  • 11 is a state in which the IC socket 2 shown in FIG. 11 is inspecting the IC 2000 as a measurement object while being slidably contacted along the mutually facing inner side surfaces of the closely wound portion 432 of the 43 To.
  • the probe pin 5 according to the fourth embodiment of the present invention includes a first contact 51, a second contact 52, a coil spring 53, and a plunger 54.
  • 12A is a cross-sectional view of the probe pin 5 according to the fourth embodiment of the present invention on a plane parallel to the plate surface of the plate-like body of the first contact 51, and FIG. It is sectional drawing in a surface perpendicular
  • FIG. FIG. 12C is an external view of the proben 5.
  • FIG. 13 is a cross-sectional view showing a state in which the IC socket 2 holding the probe pins 5 according to the fourth embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. 14 is a cross-sectional view of the IC socket 2 of FIG. It is sectional drawing which shows one state of the process which leads to the state which test
  • FIG. 15 is a cross-sectional view showing a state where the IC socket 2 of FIG. 13 is inspecting the IC 2000 that is a measurement object.
  • the configuration of the probe pin 5 according to the fourth embodiment may be implemented in the probe pin 1 according to the first embodiment or may be implemented in the probe pin 3 according to the second embodiment.
  • the fourth embodiment will be described with respect to portions different from the first embodiment and the second embodiment. Since the structure, manufacturing method, and the like that are not particularly described are the same as those of the probe pin 1 according to the first embodiment or the probe pin 3 according to the second embodiment, description thereof is omitted here.
  • the coil spring 53 is a tapered portion having a certain length in the vicinity of the end portion of the tightly wound portion 532 on the first coarsely wound portion 531 side. 536. That is, the coil spring 53 includes a first coarsely wound portion 531 at one end, a tightly wound portion 532 at the other end, and the end of the tightly wound portion 532 on the first coarsely wound portion 531 side is constant. The diameter is gradually increased over the length, and a tapered portion 536 is formed. Further, the tightly wound portion 532 includes a large-diameter portion 534 that is connected to the tapered portion 536 and has substantially the same outer diameter as the end portion of the tapered portion 536 that is gradually expanded in diameter.
  • the wiping operation starts from the state where the IC socket holding the probe pin is placed on the inspection substrate (the state shown in FIG. 13 in the fourth embodiment). What is necessary is just to be performed in the process which reaches the state (in the fourth embodiment, the state shown in FIG. 15) inspecting the IC that is the measurement object.
  • the probe pin is more excellent in high frequency characteristics as the entire length of the probe pin is shorter.
  • the probe pin is inspected from the state in which the probe pin is movable, that is, the IC socket holding the probe pin is placed on the inspection substrate. It is required to reduce the amount of displacement of the height of the probe pin until reaching the state. (In general, this displacement is called a stroke.)
  • each electrode of the IC 2000 to be inspected slightly pressed the first electrode contact portion 111 and the second electrode contact portion 121 of each probe pin 1 of the IC socket.
  • the wiping operation is not started.
  • each component constituting the probe pin 1 has a manufacturing dimensional tolerance.
  • the socket 2 that holds the probe pin 1 also has manufacturing tolerances.
  • the movable range of the probe pin 1 is designed to be large, and the wiping operation is performed approximately in the middle of the movable range. Should be designed as follows. Since the probe pin 1 designed in this way has a large movable range, the entire length becomes long.
  • the coil spring 53 includes a tapered portion 536, the first contact 51 and the second contact 52 are within the movable range of the probe pin 5. Even if the wiping operation is gradually performed and the movable range of the probe pin 5 is designed to be small, a wiping operation corresponding to the displacement amount of the probe pin 5 can be obtained. The operation from the state shown in FIG. 13 to the state shown in FIG. 15 through the state shown in FIG. 14 will be described below.
  • the first internal contact portion 514 of the first contact 51 and the second internal contact of the second contact 52 in a state where the IC socket 2 holding the probe pin 5 is placed on the inspection substrate 1000.
  • the part 524 is located in the vicinity of the end of the tapered part 536 provided in the coil spring 53 on the first coarsely wound part 531 side.
  • the tapered portion 536 extends to the end portion of the first coarsely wound portion 531, but for the reason of manufacturing the coil spring 53, the tightly wound portion 532.
  • One or two tightly wound portions having substantially the same outer diameter as the first coarsely wound portion 531 may be provided at the end of the first coarsely wound portion 531 side.
  • the first internal contact portion 514 and the second internal contact portion 524 are respectively provided on the first coarsely wound portion 531 side of the tapered portion 536 provided in the tightly wound portion 532 of the coil spring 53. In contact with the inner surfaces facing each other in the vicinity of the end of each.
  • the probe pin 5 according to the fourth embodiment of the present invention may inspect the IC 2000 that is the measurement object in any state in the process from this state to the state of FIG. 15 described below.
  • This sliding is a wiping operation. That is, in the probe 5 according to the fourth embodiment, when each electrode of the IC 2000 to be inspected presses the first electrode contact portion 511 and the second electrode contact portion 521 of each probe pin 5 of the IC socket, the pressing amount (stroke) The wiping operation of the sliding amount corresponding to the amount) is performed.
  • the probe pin 6 according to the fifth embodiment of the present invention includes a first contact 61, a second contact 62, a coil spring 63, and a plunger 64.
  • FIG. 16A is a cross-sectional view of the probe pin 6 according to the fifth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 61
  • FIG. FIG. 5 is a cross-sectional view of a surface of a contact 61 perpendicular to the plate surface of a plate-like body.
  • FIG. 16C is an external view of the probe pin 6
  • FIG. 16D is an external view of the first contact 71 and the second contact 72.
  • the configuration of the probe pin 6 according to the fifth embodiment may be implemented in the probe pin 1 according to the first embodiment, may be implemented in the probe pin 3 according to the second embodiment, You may implement in the probe pin 4 which concerns on 3rd Embodiment, and you may implement in the probe pin 5 which concerns on 4th Embodiment. Below, the case where it implements in the probe pin 1 which concerns on 1st Embodiment as an example is illustrated.
  • the fifth embodiment will be described with respect to parts different from the first embodiment, the second embodiment, the third embodiment, and the fourth embodiment.
  • a structure, a manufacturing method, and the like not particularly described are related to the probe pin 1 according to the first embodiment, the probe pin 3 according to the second embodiment, the probe pin 4 according to the third embodiment, or the fourth embodiment. Since it is the same as the probe pin 5, description here is abbreviate
  • the coil spring 63 included in the probe pin 6 according to the fifth embodiment of the present invention includes the second rough winding portion 637 at the end opposite to the first rough winding portion 631.
  • a second small diameter portion 638 is provided at the end of the tightly wound portion 632 on the second coarsely wound portion 637 side. That is, the coil spring 63 includes a first coarsely wound portion 631 at one end, a second coarsely wound portion 637 at the other end, and a tightly wound portion 632 in the middle.
  • the tightly wound portion 632 is connected to the first coarsely wound portion 631, has a fixed length of the first narrow diameter portion 633 having substantially the same outer diameter as the first coarsely wound portion 631, and further the first narrow diameter portion.
  • a large-diameter portion 634 that is connected to 633 and expanded over a certain length, and further connected to the large-diameter portion 634 and has a second length that is substantially the same as the first small-diameter portion 633 and has a constant length.
  • a diameter portion 638 and a second coarsely wound portion 637 connected to the second small diameter portion 638 and having substantially the same outer diameter as the second small diameter portion 638 are provided.
  • a step portion 635 is formed at the boundary between the first small diameter portion 633 and the large diameter portion 634.
  • the outer diameters of the second small diameter portion 638 and the second rough winding portion 637 are arbitrary as long as they are smaller than the outer diameter of the large diameter portion 634. (It may be the same outer diameter as the large-diameter portion 634.)
  • the plunger 64 includes a third arm portion 643 extending from the third flange portion 642 to the opposite side to the substrate contact portion 641 at the end opposite to the substrate contact portion 641.
  • a third internal contact portion 644 is provided in the vicinity of the end of the third arm portion 643 opposite to the substrate contact portion 641.
  • the shape of the third internal contact portion 644 is arbitrary as long as it can slide-contact with the inner surface of the second small diameter portion 638 included in the coil spring 63.
  • a press-fit portion 645 is provided in the vicinity of the end of the third arm portion 643 on the third flange portion 642 side.
  • the plunger 64 may be a plate-like body.
  • the above-described plunger 64 inserts the third arm portion 643 from the end opposite to the substrate contact portion 641 to the inner diameter side of the second rough winding portion 637 provided in the coil spring 63. Further, the press-fitting portion 645 is press-fitted into the end portion of the second rough winding portion 637. Note that the press-fitting portion 645 may be merely inserted into the end portion of the second rough winding portion 637 in the same manner as the plunger 14 included in the probe pin 1 described above.
  • the coil spring 63 includes the second rough winding portion 637 on the substrate contact portion 641 side, and the plunger 64 is the tightly wound portion 632 of the coil spring 63.
  • the coil spring 63 is variably inserted while being in sliding contact with the inner surface of the second small diameter portion 638.
  • both of the first rough winding portion 631 and the second rough winding portion 637 expand and contract during use of the probe pin 6 and in the course of use.
  • the coil spring 63 included in the probe pin 6 is provided.
  • the length of the first coarsely wound portion 631 is 1 ⁇ 2 of the length of the first coarsely wound portion 131 of the coil spring 13 provided in the probe pin 1 according to the first embodiment, and the first arm provided in the first contact 61.
  • the length of the second arm portion 623 included in the portion 613 and the second contact 62 is also halved.
  • the inclination of the first contact 61 and the second contact 62 is increased during the wiping operation of the probe pin 6, and the wiping is performed.
  • the amount can be increased.
  • FIG. 17 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 6 according to the fifth embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. 18 is a cross-sectional view of the IC socket 2 of FIG.
  • FIG. 19 is a cross-sectional view showing one state of the process leading to the state of inspecting the IC 2000 as the measurement object
  • FIG. 19 shows the state where the IC socket 2 of FIG. 17 is inspecting the IC 2000 as the measurement object. It is sectional drawing.
  • the first internal contact portion 614 of the first contact 61 and the second internal contact of the second contact 62 in a state where the IC socket 2 holding the probe pin 6 is placed on the inspection substrate 1000.
  • the part 624 is located in the vicinity of the end of the tightly wound part 632 included in the coil spring 63 on the first small diameter part 633 side.
  • the third internal contact portion 644 of the plunger 64 is located in the vicinity of the end portion on the second small diameter portion 638 side of the tightly wound portion 632 included in the coil spring 63.
  • the first contact 61 and the second contact 62 are respectively eccentric. Inclined further in the direction.
  • the probe pin 6 since the lengths of the first arm portion 613 and the second arm portion 623 are short as described above, the probe pin 6 is inclined more greatly than the probe pin 1 according to the first embodiment. As a result, the wiping amount of the probe pin 6 becomes larger than the wiping amount of the probe pin 1, and it can be expected that more oxide film is removed.
  • the plunger 64 included in the probe pin 6 according to the fifth embodiment may be a plate-like body.
  • the shape of the third internal contact portion 644 may be the shape illustrated in FIG.
  • FIG. 20A is a cross-sectional view of the probe pin 6 according to a modification of the fifth embodiment of the present invention on a plane parallel to the plate surface of the plate-like body of the first contact 61, and FIG. These are sectional views in a plane perpendicular to the plate surface of the plate-like body of the first contact 61.
  • FIG. 20C is an external view of the plunger 64 in the initial state.
  • the initial state means a shape when the plunger 64 is manufactured by pressing, etching, electroforming plating, or the like.
  • the plunger 64 provided in the probe pin 6 according to the modification of the fifth embodiment has a small plate width at the end opposite to the substrate contact portion 641 of the third arm portion 643.
  • Two fourth arm portions 646 extending substantially in parallel to each other are provided, and the outer surfaces (thickness surfaces) on the sides not facing each other in the vicinity of the end portions of the two fourth arm portions 646 are third internal contact portions 644.
  • the initial shape of the fourth arm portion 646 is such that the distance between the outer surfaces on the sides not facing each other (that is, the width of the internal contact portion formed by the two third internal contact portions 644) is a coil spring. It is set to be slightly larger than the inner diameter of 63 second narrow diameter portion 638.
  • the width of the internal contact portion formed by the two third internal contact portions 644 can be expanded and contracted by the elastic deformation of the fourth arm portion 646, and the third internal contact portion 644 can be expanded and contracted.
  • the probe pin 7 according to the sixth embodiment of the present invention includes a first contact 71, a second contact 72, a coil spring 73, and a plunger 74.
  • FIG. 21A is a cross-sectional view of the probe pin 7 according to the sixth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 71, and FIG. It is sectional drawing in the surface perpendicular
  • FIG. 21D is an external view of the probe pin 7, and FIG.
  • 21E is an external view of the first contact 71 and the second contact 72.
  • the configuration of the probe pin 7 according to the sixth embodiment may be implemented in the probe pin 1 according to the first embodiment, may be implemented in the probe pin 3 according to the second embodiment, It may be implemented in the probe pin 4 according to the third embodiment, may be implemented in the probe pin 5 according to the fourth embodiment, or may be implemented in the probe pin 6 according to the fifth embodiment.
  • the probe pin 1 which concerns on 1st Embodiment as an example is illustrated.
  • the sixth embodiment will be described with respect to parts different from the first embodiment, the second embodiment, the third embodiment, the fourth embodiment, and the fifth embodiment.
  • the structure, the manufacturing method, and the like not particularly described are the probe pin 1 according to the first embodiment, the probe pin 3 according to the second embodiment, the probe pin 4 according to the third embodiment, and the probe according to the fourth embodiment. Since this is the same as the pin 5 or the probe pin 6 according to the fifth embodiment, the description thereof is omitted here.
  • the first contact 71 included in the probe pin 7 according to the sixth embodiment of the present invention is different from the first electrode contact portion 711 on the first internal contact portion 714 side in the first flange portion 712.
  • a notch 717 is provided at the opposite end. That is, the first flange portion 712 included in the first contact 71 has a height of an end surface opposite to the first electrode contact portion 711 (a distance from the reference surface to the end surface) on the first internal contact portion 714 side. The end surface is different from the end surface on the other side, and the height of the end surface on the first internal contact portion 714 side is higher.
  • first protruding portion 718 a portion of the first flange portion 712 protruding to the first internal contact portion 714 side is referred to as a first protruding portion 718, and a portion protruding to the other is referred to as a first opposing protruding portion 719.
  • the tip 716 of the first electrode contact portion 711 is slightly decentered with respect to the center line in the extending direction of the first arm portion 713 on the side opposite to the first internal contact portion 714.
  • the tip end portion 716 of the first electrode contact portion 711 does not have to be eccentric. That is, it may be on the center line in the extending direction of the first arm portion 713.
  • the first arm portion 713 may be decentered by a certain length on the opposite side of the first internal contact portion 714 with respect to the center line in the extending direction. .
  • the second contact 72 has substantially the same shape as the first contact 71 described above. Therefore, as shown in FIG. 21D, in the assembled state of the probe pin 7, the end surface on the side facing the coil spring 73 in the first protrusion 718 of the first flange portion 712 provided in the first contact 71 .
  • the end surfaces of the second projecting portions 728 of the second flange portion 722 provided in the second contact 72 on the side facing the coil spring 73 have substantially the same height.
  • the end surface of the side facing the coil spring 73 of the 1st flange part 712 and the 2nd flange part 722 is an opposite side to an internal contact part, respectively.
  • the heights of the end surfaces, that is, the end surfaces of the first opposing projecting portion 719 and the second opposing projecting portion 729 on the side facing the coil spring 73 are higher.
  • the height of the end surface opposite to the internal contact portion is higher. Therefore, when the first flange portion 712 and the second flange portion 722 press the coil spring 73, the end surfaces on the inner contact portion side press the coil spring 73, and the other end surface and the end portion of the coil spring 73 There is a gap. Accordingly, in the first contact 71, only the flange portion (first projecting portion 718) on the first internal contact portion 714 side is pressed by the coil spring 73, and the first electrode contact portion 711 is opposite to the first internal contact portion 714.
  • FIG. 22 is a cross-sectional view showing a state in which the IC socket 2 holding the probe pins 7 according to the sixth embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. 23 is a cross-sectional view of the IC socket 2 of FIG.
  • FIG. 24 is a cross-sectional view showing one state of the process leading to the state of inspecting the IC 2000 that is the measurement object
  • FIG. 24 shows the state in which the IC socket 2 of FIG. 22 is inspecting the IC 2000 that is the measurement object. It is sectional drawing.
  • the IC socket 2 illustrated in FIG. 22 is designed to perform the preload described above. Therefore, in a state where the IC socket 2 shown in FIG. 22 is placed on the inspection substrate 1000, the first flange portion 712 and the second flange portion 722 included in the probe pin 7 slightly press the coil spring 73.
  • the electrode contact portion 711 is slightly inclined to the side opposite to the first internal contact portion 714, and the second contact 72 is pressed by the coil spring 73 only at the flange portion (second protruding portion 728) on the second internal contact portion 724 side.
  • the second electrode contact portion 721 is slightly inclined to the side opposite to the second internal contact portion 724, and the first internal contact portion 714 and the second internal contact portion 724 are respectively the first narrow portions of the tightly wound portion 732 of the coil spring 73.
  • the inner surfaces of the diameter portion 733 facing each other are in contact with each other. That is, in the probe pin 7 according to the sixth embodiment of the present invention, the first contact 71 and the second contact 72 are slightly inclined when the IC socket 2 is placed on the inspection substrate 1000.
  • the front end portion 716 of the first electrode contact portion 711 included in the first contact 71 and the front end portion 726 of the second electrode contact portion 721 included in the second contact 72 are inclined on each electrode of the IC 2000 to be inspected. Slide in the direction. This sliding is a wiping operation.
  • the first electrode contact portion 711 and the second electrode contact portion 721 of each probe pin 7 are further pressed, and the first internal contact portion 714 and the second internal contact portion 724 are respectively coil springs.
  • the IC socket 2 shown in FIG. 24 is further measured in the IC 2000 as the object to be measured while being further displaced in the direction of the inspection substrate 1000 while being in sliding contact with the mutually opposing inner surfaces of the large-diameter portion 734 of the tightly wound portion 732 of 73. To the state of being inspected.
  • the first contact 71 has only the flange portion (first opposing protruding portion 718) on the first internal contact portion 714 side as the coil spring 73.
  • the first electrode contact portion 711 is inclined to the opposite side of the first internal contact portion 714
  • the second contact 72 is a flange portion (second opposing protruding portion) on the second internal contact portion 724 side. 728) is pressed by the coil spring 73, whereby the second electrode contact portion 721 is inclined to the opposite side to the second internal contact portion 724. Therefore, the tip end portion 716 of the first electrode contact portion 711 and the tip end portion 726 of the second electrode contact portion 721 do not have to be eccentric.
  • each arm portion may be on the center line in the extending direction of each arm part. Further, since the wiping direction of the first contact 71 and the second contact 72 is the same direction as the probe pin 1 according to the first embodiment, the extension of each arm portion is the same as the probe pin 1 according to the first embodiment.
  • the center line of the direction may be decentered by a certain length on the opposite side to the internal contact portion.
  • each arm portion may be eccentric to the same side as the internal contact portion with respect to the center line in the extending direction of each arm portion.
  • the first contact 71 and the second contact 72 are opposite to the wiping direction, respectively.
  • the first contact 71 and the second contact 72 are respectively connected to the internal contact portions (the first internal contact portion 714, the first internal contact portion 714, the first internal contact portion 714, and the second contact 72). 2 is inclined to the opposite side to the internal contact portion 724), and a wiping operation is performed.
  • the probe pin 8 according to the seventh embodiment of the present invention includes a first contact 81, a second contact 82, a coil spring 83, and a plunger 84.
  • FIG. 25A is a cross-sectional view of the probe pin 8 according to the seventh embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 81
  • FIG. 4 is a cross-sectional view of a surface of a contact 81 perpendicular to a plate surface of a plate-like body.
  • FIG. FIG. 25C is an external view of the probe pin 8
  • FIG. 25D is an external view of the first contact 81 and the second contact 82.
  • the configuration of the probe pin 8 according to the seventh embodiment may be implemented in the probe pin 1 according to the first embodiment, may be implemented in the probe pin 3 according to the second embodiment, It may be implemented in the probe pin 4 according to the third embodiment, may be implemented in the probe pin 5 according to the fourth embodiment, may be implemented in the probe pin 6 according to the fifth embodiment, You may implement in the probe pin 7 which concerns on 6th Embodiment. Below, the case where it implements in the probe pin 1 which concerns on 1st Embodiment as an example is illustrated.
  • the structure, the manufacturing method, and the like not particularly described are the probe pin 1 according to the first embodiment, the probe pin 3 according to the second embodiment, the probe pin 4 according to the third embodiment, and the probe according to the fourth embodiment. Since it is the same as the pin 5, the probe pin 6 according to the fifth embodiment, or the probe pin 7 according to the sixth embodiment, the description thereof is omitted here.
  • the configuration of the probe pin 8 according to the seventh embodiment may be preferably implemented in the probe pin 7 according to the sixth embodiment. The reason will be described below.
  • the coil spring 83 included in the probe pin 8 according to the seventh embodiment of the present invention includes the first coarsely wound portion 831 at one end portion and the tightly wound portion 832 at the other end portion.
  • the coil spring 83 provided in the probe pin 8 according to the present embodiment is formed by reducing the diameter of a part of the coil spring 83 by the step portion 835 provided in the coil spring 83.
  • the probe pins according to the first to sixth embodiments are formed by enlarging a part of the coil spring.) That is, the tightly wound portion 832 provided in the coil spring 83 is the first coarsely wound portion 831.
  • a step portion 835 is formed at the boundary between the large diameter portion 834 and the first small diameter portion 833.
  • the first contact 81 is designed such that the plate width of the first arm portion 813 gradually decreases from the first flange portion 812 side to the first internal contact portion 814 side.
  • the shape of the first arm portion 813 is arbitrary as long as the first internal contact portion 814 is slidable on the inner surface of the first small diameter portion 833 provided in the coil spring 83.
  • the distal end portion 816 of the first electrode contact portion 811 is opposite to the first internal contact portion 814 with respect to the center line in the extending direction of the first arm portion 813, similarly to the probe pin 1 according to the first embodiment. Eccentric to the side.
  • the second contact 82 has substantially the same shape as the first contact 81 described above.
  • the first electrode contact portion 811 and the second electrode contact portion 821 are respectively connected to the internal contact portion (first contact) in the process in which the probe pin 8 is used.
  • a wiping operation is performed on the first internal contact portion 814 and the second internal contact portion 824) side. The operation from the state shown in FIG. 26 to the state shown in FIG. 28 through the state shown in FIG. 27 will be described below.
  • FIG. 26 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 8 according to the seventh embodiment of the present invention is placed on the inspection substrate 1000
  • FIG. 27 is a cross-sectional view of the IC socket 2 of FIG.
  • FIG. 28 is a cross-sectional view showing one state of the process leading to the state of inspecting the IC 2000 as the measurement object
  • FIG. 28 shows the state where the IC socket 2 of FIG. 26 is inspecting the IC 2000 as the measurement object. It is sectional drawing.
  • the distal end portion 816 of the first electrode contact portion 811 included in the first contact 81 and the distal end portion 826 of the second electrode contact portion 821 included in the second contact 82 are extending directions of the arm portions included in the respective contacts.
  • the center line is eccentric to the opposite side of each internal contact portion. Therefore, when each electrode of the IC 2000 to be inspected slightly presses the first electrode contact portion 811 and the second electrode contact portion 821 of each probe pin 8 of the IC socket from the state shown in FIG. 26, as shown in FIG.
  • the first contact 81 and the second contact 82 are slightly inclined in the eccentric direction, respectively, and the first internal contact portion 814 and the second internal contact portion 824 are opposed to the large diameter portion 834 of the tightly wound portion 832 of the coil spring 83, respectively. In sliding contact with the inner surface.
  • the distal end portion 816 of the first electrode contact portion 811 included in the first contact 81 and the distal end portion 826 of the second electrode contact portion 821 included in the second contact 82 are eccentric on the respective electrodes of the IC 2000 to be inspected.
  • the IC socket 2 shown in FIG. 28 is an object to be measured while being further displaced in the direction of the inspection substrate 1000 while slidingly contacting along the mutually opposing inner surfaces of the first narrow diameter portion 833 of the tightly wound portion 832 of 83. A certain IC 2000 is being inspected.
  • the probe pin 8 according to the seventh embodiment performs a wiping operation on the side opposite to the direction in which the electrode contact portion is eccentric.
  • part of the force by which each electrode of the IC 2000 to be inspected presses the first electrode contact portion 811 and the second electrode contact portion 821 of each probe pin 8 of the IC socket is the first contact 81 and the second contact 82.
  • the probe pin 8 according to the seventh embodiment performs a wiping operation against the pressure opposite to the direction in which the electrode contact portion is eccentric.
  • the configuration of the probe pin 8 according to the present embodiment may be implemented in the probe pin 7 according to the sixth embodiment.
  • the probe pin 7 according to the sixth embodiment is inclined when the first contact and the second contact are pressed by the coil spring, so that the electrode contact portion does not have to be eccentric. If the configuration of the probe pin 8 according to the present embodiment is implemented in the probe pin 7 according to the sixth embodiment, the possibility that the contact is deformed is reduced.
  • the probe pin 9 according to the eighth embodiment of the present invention includes the first contact 91, the second contact 92, and the coil spring 93, but does not have a plunger.
  • the substrate contact portion of the probe pin 9 is configured by extending a contact winding portion having a reduced diameter at an end portion on the contact winding portion side of the coil spring.
  • FIG. 29A is a cross-sectional view of the probe pin 9 according to the eighth embodiment of the present invention in a plane parallel to the plate surface of the plate-like body of the first contact 91, and FIG. FIG.
  • FIG. 29C is a cross-sectional view in a plane perpendicular to the plate surface of the plate-like body of one contact 91, and FIG. 29C is an external view of the probe pin 9.
  • the configuration of the probe pin 9 according to the eighth embodiment may be implemented in the probe pin 1 according to the first embodiment, may be implemented in the probe pin 3 according to the second embodiment, It may be implemented in the probe pin 4 according to the third embodiment, may be implemented in the probe pin 5 according to the fourth embodiment, may be implemented in the probe pin 6 according to the fifth embodiment, You may implement in the probe pin 7 which concerns on 6th Embodiment, and you may implement in the probe pin 8 which concerns on 7th Embodiment.
  • the eighth embodiment is different from the first embodiment, the second embodiment, the third embodiment, the fourth embodiment, the fifth embodiment, the sixth embodiment, and the seventh embodiment. explain.
  • the structure, the manufacturing method, and the like not particularly described are the probe pin 1 according to the first embodiment, the probe pin 3 according to the second embodiment, the probe pin 4 according to the third embodiment, and the probe according to the fourth embodiment. Since it is the same as the pin 5, the probe pin 6 according to the fifth embodiment, the probe pin 7 according to the sixth embodiment, or the probe pin 8 according to the seventh embodiment, the description thereof is omitted here.
  • the probe pin 9 according to the eighth embodiment of the present invention is formed by close winding with a smaller outer diameter than the large diameter portion 934 at the end of the large diameter portion 934 of the close winding portion 932 of the coil spring 93.
  • a formed substrate contact portion 936 is provided.
  • a locking portion 939 is formed at the boundary between the large diameter portion 934 and the substrate contact portion 936.
  • FIG. 30 is a cross-sectional view showing a state where the IC socket 2 holding the probe pins 9 according to the eighth embodiment of the present invention is placed on the inspection substrate 1000. In a state where the IC socket 2 is assembled, the step part 215 in the second hole is locked with the locking part 939.
  • the inspection target of the probe pin according to the present invention may be not an IC but an internal substrate (substrate) of the IC.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Connecting Device With Holders (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

L'invention concerne, en tant que broche de sondage qui effectue une opération d'essuyage pendant l'utilisation et qui est également économique, un élément conducteur anisotrope (broche de sondage 1) équipé d'un ressort hélicoïdal 13 et d'un élément de contact ayant un premier contact 11 et un second contact 12. Avec une première section de contact d'électrode 111 à partir du premier contact 11, une seconde section de contact d'électrode 121 à partir du second contact 12, et une section de contact de carte de base 141 servant de section de contact, lorsqu'une force comprimant le ressort hélicoïdal est communiquée dans une direction le long d'une direction conductrice, le premier contact 11 peut être actionné pour s'incliner dans une première orientation qui est l'une des directions de largeur de plaque tout en étant en contact avec le ressort hélicoïdal 13 au niveau d'une première section de contact interne 114, et le second contact 12 peut être actionné pour s'incliner dans une seconde orientation qui est dans l'autre direction de largeur de plaque et dans l'orientation opposée à partir de la première orientation, tout en étant en contact avec le ressort hélicoïdal 13 au niveau d'une seconde section de contact intérieur 124.
PCT/JP2017/040683 2016-12-05 2017-11-13 Broche de sondage et support de circuit intégré WO2018105316A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-235913 2016-12-05
JP2016235913A JP2018092813A (ja) 2016-12-05 2016-12-05 プローブピンおよびｉｃソケット

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Cited By (2)

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CN111742228A (zh) * 2019-01-31 2020-10-02 山一电机株式会社 检查用插座
WO2023182023A1 (fr) * 2022-03-25 2023-09-28 株式会社ヨコオ Sonde

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111276839B (zh) * 2020-03-02 2021-06-11 瑞声精密制造科技(常州)有限公司 传输线测试装置

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Publication number Priority date Publication date Assignee Title
JPS6398566A (ja) * 1986-10-15 1988-04-30 Seiko Epson Corp コンタクトプロ−ブ
JP4900843B2 (ja) * 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
JP2012181096A (ja) * 2011-03-01 2012-09-20 Micronics Japan Co Ltd 接触子及び電気的接続装置
JP2016008835A (ja) * 2014-06-23 2016-01-18 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6398566A (ja) * 1986-10-15 1988-04-30 Seiko Epson Corp コンタクトプロ−ブ
JP4900843B2 (ja) * 2008-12-26 2012-03-21 山一電機株式会社 半導体装置用電気接続装置及びそれに使用されるコンタクト
JP2012181096A (ja) * 2011-03-01 2012-09-20 Micronics Japan Co Ltd 接触子及び電気的接続装置
JP2016008835A (ja) * 2014-06-23 2016-01-18 株式会社日本マイクロニクス 電気的接触子及び電気的接続装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111742228A (zh) * 2019-01-31 2020-10-02 山一电机株式会社 检查用插座
CN111742228B (zh) * 2019-01-31 2023-03-21 山一电机株式会社 检查用插座
WO2023182023A1 (fr) * 2022-03-25 2023-09-28 株式会社ヨコオ Sonde

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