WO2018101453A1 - Adhésif temporaire et procédé de fabrication de composant - Google Patents

Adhésif temporaire et procédé de fabrication de composant Download PDF

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Publication number
WO2018101453A1
WO2018101453A1 PCT/JP2017/043216 JP2017043216W WO2018101453A1 WO 2018101453 A1 WO2018101453 A1 WO 2018101453A1 JP 2017043216 W JP2017043216 W JP 2017043216W WO 2018101453 A1 WO2018101453 A1 WO 2018101453A1
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WO
WIPO (PCT)
Prior art keywords
temporary
adhesive
polishing
mass
precursor
Prior art date
Application number
PCT/JP2017/043216
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English (en)
Japanese (ja)
Inventor
勝 福地
政志 吉野
邦彦 小田切
章 岩崎
Original Assignee
株式会社Ｄｎｐファインケミカル
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社Ｄｎｐファインケミカル filed Critical 株式会社Ｄｎｐファインケミカル
Priority to CN201780073390.7A priority Critical patent/CN110023447A/zh
Priority to JP2018539920A priority patent/JP6403935B1/ja
Publication of WO2018101453A1 publication Critical patent/WO2018101453A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/02—Shellac
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J193/00—Adhesives based on natural resins; Adhesives based on derivatives thereof
    • C09J193/04—Rosin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention provides a temporary adhesive for temporarily adhering and fixing a component precursor to a predetermined substrate at the time of processing such as precision processing such as a polishing process, and various kinds of wafers using the temporary adhesive of the present invention.
  • the present invention relates to a component manufacturing method for manufacturing a component.
  • various parts such as polishing, cutting, drilling, grinding or cutting are performed on the part precursors.
  • a processing operation it is common to perform a processing operation in a state in which the component precursor is temporarily fixed to a processing substrate using a temporary adhesive.
  • a temporary adhesive is applied to one side of the wafer (wafer precursor) as an object to be polished, and the adhesive coating film Form.
  • a polishing step is performed in which the adhesive coating film is brought into contact with a predetermined polishing substrate, the wafer precursor is temporarily fixed, the exposed surface of the wafer precursor is polished and mirror-finished.
  • the polishing substrate is a polishing table or the like of a polishing apparatus, and may be simply referred to as “polishing table” below.
  • a substrate for temporarily fixing a component to be processed when performing various kinds of precision processing or the like may be referred to as a “processing substrate”.
  • the above content is described as an example of polishing of the wafer precursor, but a temporary adhesive may be used as appropriate in other processes such as polishing, cutting, drilling, and grinding.
  • Patent Document 1 discloses a temporary adhesive in which an alkali-soluble resin having a carboxyl group is dissolved in a mixed solvent mainly composed of methyl ethyl ketone and containing at least one of propylene glycol monomethyl ether and butyl acetate. Proposed.
  • the resin as the adhesive component include an epoxy resin to which an acid anhydride is added, a rosin resin mainly composed of abietic acid, and a styrene acrylic copolymer.
  • examples using the epoxy resin are disclosed.
  • This invention is made
  • the present invention provides a component manufacturing method including a processing step that enables precision processing for processing a component precursor such as a wafer precursor with high accuracy.
  • the temporary adhesive of the present invention comprises rosin, shellac, a lower alcohol that is an alcohol having 5 or less carbon atoms, and a polyhydric alcohol derivative that is an alcohol derivative having two or more hydroxyl groups in the molecule. To do.
  • the component manufacturing method of the present invention uses the temporary adhesive of the present invention, forms an adhesive coating film between the component precursor and the processing substrate, and temporarily fixes the component precursor to the processing substrate. And a processing step of processing the processed surface of the component precursor temporarily fixed to the processing substrate in the temporary fixing step.
  • the provisional adhesive of the present invention has the above-described configuration, so that various component precursors to be processed can be temporarily fixed to the processing substrate. Accordingly, various processes such as polishing, cutting, drilling, grinding or cutting can be performed with high accuracy on the component precursor temporarily fixed to the processing substrate using the temporary fixing adhesive of the present invention. is there.
  • the component manufacturing method of the present invention is capable of manufacturing a high-quality component whose processed surface is processed with high accuracy because the component precursor is bonded and fixed to the processing substrate using the temporary adhesive of the present invention.
  • the component manufacturing method of the present invention uses the temporary adhesive of the present invention to bond and fix the wafer precursor to the polishing table, so that the surface to be polished can be polished with high accuracy. It is possible to manufacture a high quality wafer.
  • temporary fixing refers to bonding that presupposes that a component precursor to be processed is bonded and fixed to a processing substrate in processing, and that a component manufactured from the processing substrate is peeled off after the processing.
  • Means for example, with regard to polishing of the wafer precursor, temporary fixing refers to bonding that assumes that the wafer precursor is bonded and fixed to the polishing table and the polishing step is performed, and that the wafer is removed from the polishing table after the polishing step. means.
  • the temporary adhesive of the present invention as an example of temporarily fixing an arbitrary component precursor to a processing substrate using the temporary adhesive, it relates to the manufacture of a wafer used in an integrated circuit, An example in which the wafer precursor is temporarily fixed to a polishing table and the wafer precursor is polished is mainly used.
  • the temporary adhesive of this invention can show favorable applicability
  • the temporary adhesive of the present invention can be widely used as a temporary adhesive for temporarily fixing to a substrate for processing.
  • the temporary adhesive of the present invention can exhibit good coatability even on a processing substrate. Therefore, the temporary adhesive of the present invention is applied to a processing substrate to form an adhesive coating film, and the component precursor is brought into contact with the adhesive coating film by contacting the component precursor to be processed. It can also be temporarily fixed to the processing substrate.
  • the above processing broadly includes various processing such as cutting, cutting, grinding or drilling of a temporarily secured part.
  • the component precursor refers to a component (that is, a member) before processing performed using the temporary adhesive.
  • a wafer before polishing performed using a temporary adhesive is referred to as a wafer precursor.
  • Processing in the context of the present invention refers to temporarily fixing a component precursor to a processing substrate using a temporary fixing adhesive, and modifying the component precursor in order to create a component.
  • “adding a hand” means, for example, performing one type or two or more types of operations such as polishing, grinding, cutting, drilling, and cutting on a temporarily fixed component precursor.
  • the above processing includes precision processing and general processing that does not require special precision.
  • precision machining means machining of a part that requires high precision
  • the degree of precision is not particularly limited, but includes, for example, machining that requires precision in nano units or micron units.
  • the present invention will be described by taking precision processing as an example as processing related to the present invention, but such description does not limit the present invention.
  • the present inventors diligently studied the temporary adhesive as follows in order to satisfactorily bond various component precursors to be processed to the processing substrate and enable precision processing with high accuracy.
  • the present inventors completed the temporary adhesive of the present invention showing excellent adhesion to various component precursors.
  • the temporary adhesive is literally an adhesive premised on temporary fixing. Therefore, for example, the wafer precursor bonded to the polishing table with a temporary adhesive may be peeled off from the polishing table after polishing, and the temporary adhesive remaining on the polished wafer may be removed by alkali cleaning. It is common. Therefore, it is desirable that the temporary adhesive is excellent not only in adhesiveness but also in cleanability.
  • the present inventors prepared a temporary adhesive by using rosin as an adhesive component having good cleaning properties as compared with a synthetic resin such as an epoxy resin or an acrylic resin, and mixing shellac with the rosin. .
  • adhesive is excellent also in cleaning property, and sufficient adhesiveness is ensured.
  • the wafer precursor is temporarily fixed without being inclined with respect to the polishing table (hereinafter also referred to as element 1), and the temporarily fixed wafer precursor is firmly polished during polishing.
  • the pressure during polishing is uniformly transmitted to the surface to be polished of the wafer precursor (hereinafter also referred to as element 3). is necessary.
  • wafer precursor is temporarily fixed to the polishing table without being tilted” in relation to the element 1 means that the wafer precursor surface and the polishing are reduced to such an extent that the influence on precision processing such as polishing is reduced. It means that the surface is parallel or nearly parallel, and is not limited to being physically completely parallel.
  • the film thickness difference in the surface of the adhesive coating made of the temporary adhesive applied to the wafer precursor (hereinafter also referred to as the in-plane film thickness difference) is significant, The wafer precursor surface is temporarily fixed in a tilted state, and the element 1 may not be satisfied.
  • the adhesive property of the temporary adhesive is not sufficient, a phenomenon that the wafer precursor is misaligned or the wafer precursor is detached from the polishing table while being polished under severe polishing conditions occurs. 2 may not be satisfied.
  • the non-attached portion in the thickness direction of the wafer precursor temporarily fixed to the polishing table
  • the overlapping wafer precursor regions are subjected to a relatively small pressure during polishing as compared to the surrounding regions. Therefore, the element 3 is not satisfied.
  • the non-attached portion of the temporary adhesive refers to a portion where the temporary adhesive is not applied on the application surface of the wafer precursor.
  • a temporary adhesive that has a high adhesive force and thereby satisfies the element 2 and also has good wettability and in-plane film thickness difference, thereby satisfying both the element 1 and the element 3.
  • the present inventors can process various component precursors such as a wafer precursor such as a polishing table as long as it is a temporary adhesive that includes rosin and shellac as adhesive components and satisfies all of the above elements 1 to 3. The knowledge that it was able to adhere to the substrate for use well was obtained. And after further examination based on this knowledge, the present invention was completed.
  • the temporary fixing adhesive of the present invention is a polyvalent rosin, shellac, a lower alcohol that is an alcohol having 5 or less carbon atoms (hereinafter also simply referred to as a lower alcohol), and an alcohol derivative having two or more hydroxyl groups in the molecule.
  • the temporary fixing adhesive of the present invention includes two specific types of adhesive components that can achieve a balance between adhesiveness and cleanability, and includes a specific solvent combined. With such a configuration, the present invention has good wet spreadability with respect to the wafer precursor, the in-plane film thickness difference of the adhesive coating applied to the wafer precursor is suppressed to a small level, and good adhesion is achieved.
  • the temporary adhesive shown is realized.
  • the wafer precursor formed with the adhesive coating film using the temporary adhesive of the present invention can be temporarily fixed without being inclined with respect to the polishing table (element 1), and during polishing. While maintaining the state of being firmly fixed to the polishing table (element 2), it is possible to uniformly apply the pressure during polishing to the entire area of the surface to be polished (element 3).
  • the film thickness difference of the adhesive coating film formed on the adhesive surface of the wafer precursor is large, there are the following problems. That is, the polished surface of the wafer precursor temporarily fixed to the polishing table in a state where the film thickness difference of the adhesive coating film is large is caused by a rotating polishing pad (hereinafter simply referred to as a pad) due to the film thickness difference.
  • the temporary adhesive of this invention fills the said element 1 and the element 3, and improves the sufficiency of the element 2 further. Therefore, the wafer precursor temporarily fixed using the temporary adhesive of the present invention can be polished with high accuracy corresponding to more severe polishing conditions.
  • the temporary fixing adhesive of the present invention that can withstand severe polishing conditions can also be used as an adhesive for temporarily fixing a wafer precursor having a Mohs hardness of 9 or more to a polishing substrate (polishing stand). That is, when polishing a hard wafer precursor (for example, a sapphire wafer) than a silicon wafer precursor that is widely used as a wafer precursor, polishing conditions become more severe. Therefore, the state of bonding and fixing the wafer precursor during polishing has a more severe effect on the polishing accuracy of the wafer precursor.
  • the temporary adhesive of the present invention satisfying the requirement 3 from the element 1 can improve the adhesion and fixing state of the wafer precursor during polishing.
  • the rosin used in the present invention is mainly composed of abietic acid having a conjugated double bond. Specifically, rosin, rosin ester, partially or hydrogenated rosin, polymerized rosin, or rosin resin and maleic thereof. Examples thereof include one or a mixture of a modified rosin with a dibasic acid such as an acid or an ester derivative thereof.
  • the rosin generally has three ring structures and a carboxyl group.
  • the rosin is mainly a natural rosin solidified in a warm bath after extracting pine resin with a solvent, or a purified or modified product thereof.
  • the present invention does not exclude the use of synthesized rosin.
  • the shellac used in the present invention is either natural shellac or synthetic shellac or a combination thereof.
  • Natural shellac is exemplified by a resinous substance extracted from scale insects and purified.
  • Examples of synthetic shellac include polyester compounds of trihydroxypalmitic acid and higher aliphatic dibasic acids.
  • the in-plane film thickness difference tends to decrease and the wet spreadability tends to improve as the rosin compounding ratio increases.
  • the adhesive strength tends to increase as the proportion of shellac increases. Based on this tendency, more appropriate polishing can be performed by appropriately changing the blending ratio of rosin and shellac in consideration of polishing conditions and the like.
  • the wafer precursor and the polishing table can be firmly bonded and fixed while ensuring good wetting and spreading properties with respect to the wafer precursor, and a temporary adhesive having a balanced performance can be provided.
  • there is more rosin than the said range it exists in the tendency for adhesive force to become small.
  • the wafer precursor can be bonded and fixed in parallel to the polishing table, and the non-attached portion of the temporary adhesive can be substantially eliminated.
  • the collision pressure between the surface to be polished and the pad can be further reduced. Therefore, the influence due to the decrease in adhesive force is compensated, and high-precision polishing can be performed.
  • the temporary adhesive of the present invention may contain rosin and shellac as adhesive components and further different adhesive components as long as they do not depart from the spirit of the present invention.
  • the temporary adhesive of the present invention includes a lower alcohol that is an alcohol having 5 or less carbon atoms as a solvent. Such lower alcohols generally have a low boiling point. Therefore, when the temporary adhesive applied to the wafer precursor is appropriately dried to form an adhesive coating film, it is easily removed by evaporation during the polishing process. From the viewpoint of a low boiling point, it is preferable to select a monovalent lower alcohol as the lower alcohol.
  • the monovalent lower alcohol here means a lower alcohol having one hydroxy group.
  • a lower alcohol having a boiling point of 140 ° C. or lower is preferred as the lower alcohol used in the present invention.
  • a temporary adhesive using only the lower alcohol as a solvent exhibits good adhesiveness. However, such temporary fixing adhesives are unlikely to exhibit desirable wetting and spreading properties, and the in-plane film thickness difference tends to increase. Therefore, the present invention uses a polyhydric alcohol derivative described later as a solvent in addition to the lower alcohol.
  • Examples of the lower alcohol include normal propyl alcohol, isopropyl alcohol, methanol, ethanol, 2-butanol, t-butanol, and isobutyl alcohol.
  • the temporary tacking adhesive of the present invention contains one or more lower alcohols.
  • the lower alcohol includes two or more solvents having different boiling points, and the boiling point of at least one of the two or more lower alcohols is 95 ° C. or lower in one preferred embodiment of the present invention. is there.
  • Many lower alcohols have relatively low boiling points. Therefore, the lower alcohol contained in the temporary adhesive is likely to evaporate from the adhesive coating film, and as a result, contributes to improvement in tackiness.
  • the temporary adhesive containing a lower alcohol has a tendency to be slightly inferior in wetting and spreading due to the low boiling point of the lower alcohol, and the in-plane film thickness difference tends to be slightly increased.
  • a temporary adhesive containing two or more solvents having different boiling points and one or more lower alcohols having a boiling point of 95 ° C. or lower is a temporary adhesive that maintains good adhesiveness. Wetting and spreading properties are good, or an increase in in-plane film thickness difference can be suppressed.
  • Examples of the lower alcohol having a boiling point of 95 ° C. or lower include methanol (boiling point 64.7 ° C.), ethanol (boiling point 78.3 ° C.), and isopropyl alcohol (boiling point 82.3 ° C.). It is not limited to.
  • Examples of the combination of the two lower alcohols include ethanol and methanol, or ethanol and isopropyl alcohol.
  • Examples of the combination of the three kinds of lower alcohols include ethanol, isopropyl alcohol, and methanol. In these combinations, the boiling points of all the solvents contained as the lower alcohol are 95 ° C. or less.
  • normal propyl alcohol boiling point 97.2 degreeC
  • methanol normal propyl alcohol and ethanol
  • normal propyl alcohol and ethanol are mentioned, for example.
  • examples of different embodiments of the combination of the three lower alcohols include ethanol, isopropyl alcohol, and normal propyl alcohol.
  • the boiling point of at least one lower alcohol may be 95 ° C. or lower, and the boiling point of at least one lower alcohol may exceed 95 ° C.
  • the lower alcohol contains two or more solvents having different boiling points, and the boiling point of at least one of the two or more lower alcohols is 95 ° C. or less. It is preferably included.
  • the compounding quantity of ethanol is the largest among 2 or more types of lower alcohol. This is because ethanol has good solubility in rosin or shellac and has a moderately low boiling point. Thus, since ethanol has a good balance between the solubility and the boiling point, a temporary adhesive containing ethanol as a lower alcohol tends to exhibit good adhesion without impairing wet spreadability.
  • the temporary adhesive can easily maintain good coatability even when the solid content ratio is increased, and as a result, the thickness of the adhesive coating film can be easily increased.
  • the blending amount of the ethanol is not particularly limited, the blending amount of ethanol in 100 parts by mass of the lower alcohol in the temporary adhesive (resin composition) is preferably in the range of 50 parts by mass or more and 94.5 parts by mass or less. .
  • the temporary adhesive containing ethanol in the above range preferably contains a second lower alcohol (for example, isopropyl alcohol) having a boiling point of 95 ° C. or less exceeding the boiling point of ethanol.
  • the blending amount of the second lower alcohol should be less than ethanol, but the blending amount of the second lower alcohol in 100 parts by mass of the lower alcohol in the temporary adhesive (resin composition) is 0.5 parts by mass or more and 15 parts by mass. It is preferable that it is the range below a mass part.
  • the temporary adhesive containing ethanol in the above range contains a third lower alcohol (for example, methanol) having a boiling point lower than that of ethanol.
  • the blending amount of the third lower alcohol may be less than ethanol, but the blending amount of the third lower alcohol in 100 parts by weight of the lower alcohol in the temporary adhesive (resin composition) is 5 parts by mass or more and 20 parts by mass.
  • the following range is preferable.
  • ethanol, the second lower alcohol, and the third lower alcohol are all included as the lower alcohol. It is more preferable that only is contained.
  • the content of each lower alcohol in the temporary adhesive (resin composition) is within a range of 50 parts by mass or more and 94.5 parts by mass or less of ethanol in 100 parts by mass of the lower alcohol.
  • the blending amount of the second lower alcohol is in the range of 0.5 to 15 parts by weight
  • the blending amount of the third lower alcohol is adjusted to be in the range of 5 to 20 parts by weight. Good.
  • the temporary adhesive of the present invention includes a polyhydric alcohol derivative that is an alcohol derivative having two or more hydroxyl groups in the molecule.
  • the polyhydric alcohol derivative generally has a boiling point higher than that of the lower alcohol. Therefore, the polyhydric alcohol derivative tends to remain in the adhesive coating film even after the lower alcohol is evaporated off.
  • a mixed solvent containing the lower alcohol and the polyhydric alcohol derivative as a solvent in the temporary adhesive, wetting spreadability of the temporary adhesive containing rosin and shellac as adhesive components, and in-plane film thickness difference Reduction and improvement in adhesion can be favorably achieved.
  • the temporary adhesive of the present invention contains one or more expensive alcohol derivatives.
  • polyhydric alcohol derivative it is preferable to use at least one divalent alcohol such as propylene glycol alkyl ethers or ethylene glycol alkyl ethers.
  • divalent alcohol such as propylene glycol alkyl ethers or ethylene glycol alkyl ethers.
  • These polyhydric alcohol derivatives can dissolve rosin and shellac well, and can stabilize the quality of a temporary adhesive containing rosin and shellac.
  • propylene glycol alkyl ethers examples include propylene glycol monomethyl ether, propylene glycol monoethyl ether, and propylene glycol monobutyl ether.
  • propylene glycol alkyl ethers examples include acetates such as propylene glycol monomethyl ether acetate can be used.
  • ethylene glycol alkyl ethers include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol monoethyl ether, ethylene glycol monomethyl ether, ethylene glycol monoisopropyl ether, and ethylene glycol dimethyl ether.
  • the range is preferably 75, more preferably 90/10 to 30/70, and still more preferably 85/15 to 35/65. When the blending ratio is within such a range, it is possible to easily provide a temporary adhesive that is well balanced in the three evaluations of wettability, in-plane film thickness difference, and adhesiveness.
  • the lower alcohol and the polyhydric alcohol derivative described above are not particularly limited.
  • the lower alcohol is a monovalent lower alcohol and has a boiling point of 70 ° C. or higher and 105 ° C. or lower, or the polyhydric alcohol derivative has a boiling point of 115 ° C. or higher. It is preferable to satisfy at least one of 150 ° C. and lower.
  • the boiling point of the monovalent lower alcohol having the largest blending amount among the plurality of solvents blended as the monovalent lower alcohol is at least within the above range.
  • the boiling point of the polyhydric alcohol derivative having the largest blending amount among the plurality of solvents blended as the polyhydric alcohol derivative is at least within the above range.
  • the monovalent lower alcohol having a boiling point in the above range When the monovalent lower alcohol having a boiling point in the above range is included as a solvent for the temporary adhesive, the monovalent lower alcohol can be smoothly evaporated during the drying process after being applied to the wafer precursor, and the like. Easy adhesion.
  • a polyhydric alcohol derivative having a boiling point in the above range when included as a solvent for the temporary adhesive, it has good elongation when applied to the wafer precursor while maintaining good adhesion, and excellent wet spreadability.
  • the temporary adhesive can be easily adjusted. In order to obtain the above effect more sufficiently, the temporary adhesive preferably contains both the monovalent lower alcohol and the polyhydric alcohol derivative.
  • normal propyl alcohol is included as the lower alcohol and propylene glycol monomethyl ether is included as the polyhydric alcohol derivative.
  • normal propyl alcohol having a boiling point of about 97 ° C. and propylene glycol monomethyl ether having a boiling point of about 120 ° C. as a mixed solvent, a good balance of wetting and spreading, small in-plane film thickness difference, and excellent adhesion A good temporary fixing adhesive can be easily adjusted.
  • the temporary adhesive of the present invention may contain different solvents as well as the above-mentioned lower alcohol and polyhydric alcohol derivative as long as they do not depart from the spirit of the present invention.
  • the temporary adhesive may appropriately contain any additive.
  • the solid content ratio in the temporary adhesive has an influence on the film thickness of the adhesive coating film made of the temporary adhesive. That is, the general temporary adhesive has a tendency that the higher the solid content ratio, the larger the film thickness, the lower the wetting and spreading property, or the larger the in-plane film thickness difference.
  • the temporary adhesive of the present invention has an adhesive property while maintaining good wetting spreadability and small in-plane film thickness difference when the solid content ratio is increased moderately. Can be raised.
  • the temporary adhesive of the present invention is a mixture of the above-described two desirable solvents (ie, lower alcohol and polyhydric alcohol derivative) even when the solvent ratio is decreased due to the increase in the solid content ratio.
  • the temporary adhesive of the present invention has a solid content ratio in 100% by mass of the temporary adhesive from the viewpoint of increasing the adhesiveness while maintaining good wetting spreadability and a small in-plane film thickness difference.
  • it is preferable that it is the range of 25 mass% or more and 50 mass% or less, and it is more preferable that it is 35 mass% or more and 45 mass% or less.
  • the solid content ratio exceeds 25% by mass, the thickness of the adhesive coating film is large to some extent, and it becomes easy to obtain sufficiently high adhesiveness.
  • the solid content ratio is less than 50% by mass, the coatability with respect to the wafer precursor is improved, and the in-plane film thickness difference tends to be small.
  • a more preferable aspect is that the solid content ratio in 100% by mass of the temporary fixing adhesive is in the range of 35% by mass to 45% by mass, and the lower alcohol and the polyvalent
  • the lower alcohol (parts by mass) / polyhydric alcohol derivative (parts by mass) is more preferably in the range of 90/10 to 30/70, and still more preferably 85/15 to 35/65.
  • the temporary adhesive of the above aspect improves the adhesiveness by appropriately increasing the solid content ratio, and also ensures sufficient wetting spreadability by ensuring a sufficient blending amount of the polyhydric alcohol derivative which is a high boiling alcohol. Can be secured.
  • a component before processing is referred to as a component precursor
  • a processing step is performed using the component precursor
  • the obtained component is simply referred to as a component.
  • a wafer before the polishing process is referred to as a wafer precursor
  • a polishing process is performed using the wafer precursor
  • the resulting product is simply referred to as a wafer.
  • the component manufacturing method of the present invention includes a temporary fixing process and a processing process.
  • the temporary fixing step uses the temporary adhesive of the present invention described above, forms an adhesive coating film between the component precursor and the processing substrate, and temporarily fixes the component precursor on the processing substrate. It is a process to do.
  • the processing step is a step of processing the processed surface of the component precursor temporarily fixed to the processing substrate in the temporary fixing step.
  • the component manufacturing method of the present invention can be implemented as a wafer manufacturing method. That is, the wafer manufacturing method is the above-described component manufacturing method, wherein the component precursor is a wafer precursor, an adhesive coating film is formed between the wafer precursor and a polishing substrate which is a processing substrate, and polishing is performed.
  • a processing step includes a temporary fixing step of temporarily fixing the wafer precursor to the substrate, and a polishing step of polishing the surface to be polished of the wafer precursor temporarily fixed to the polishing substrate in the temporary fixing step.
  • the machining process in the present invention includes a general machining process that does not require special precision and a precision machining process that requires high precision.
  • the manufacturing method of the present invention is also used as a manufacturing method for parts made of various members such as silicon, sapphire, gallium arsenide, glass material, magnetic material, metal material, crystal, optical lens, or semiconductor device member. be able to.
  • any one or more of a grinding process, a cutting process, a drilling process, and a cutting process is mentioned as processes other than a grinding
  • the part manufacturing method of the present invention will be described by taking as an example an aspect in which the part is a wafer (that is, a wafer manufacturing method) and the processing step is a precision processing step.
  • the wafer precursor is temporarily fixed to the polishing substrate (polishing table) using the temporary adhesive of the present invention.
  • the wafer precursor can be temporarily fixed without being inclined.
  • the adhesive coating film existing between the polishing substrate and the wafer precursor has a small in-plane film thickness difference and very little or substantially no non-sticking portion of the temporary adhesive.
  • the pressure applied from the polishing pad to the wafer precursor on the surface to be polished of the wafer precursor is substantially equal to the surface to be polished of the wafer precursor.
  • the wafer manufacturing method which is an example of the present invention can appropriately combine each process for manufacturing a known wafer except that the temporary fixing process and the polishing process described above are performed.
  • a columnar body made of any wafer material such as silicon, sapphire, or a compound semiconductor such as gallium phosphide or gallium nitride is prepared.
  • the wafer precursor used for a temporary fixing process can be formed by slicing the said columnar body in moderate thickness.
  • the wafer precursor formed in this way is appropriately rough-polished with a polishing agent or the like as appropriate before being subjected to a temporary fixing step, and is surface-treated by chemical etching as necessary.
  • a temporary fixing step is performed using the wafer precursor prepared as described above.
  • the specific content of the temporary fixing step may be appropriately determined within a range in which an adhesive coating film can be formed between the polishing substrate and the wafer precursor using the temporary adhesive of the present invention.
  • a temporary adhesive is applied to one side of the wafer precursor to form an adhesive coating film, and the adhesive coating film is applied to the polishing substrate as a bonding surface.
  • the aspect (henceforth the temporary fixing process aspect 1) which temporarily fixes the said wafer precursor is mentioned.
  • a temporary adhesive is applied to a polishing substrate to form an adhesive coating film, and a wafer precursor is placed on the adhesive coating film, thereby bonding.
  • the aspect which temporarily fixes a wafer precursor to a grinding
  • the temporary fixing process mode 1 will be described as an example.
  • the temporary adhesive of the present invention is applied to one side of the wafer precursor.
  • the coating method is not particularly limited. For example, using a coating apparatus such as a spin coater, die coater, dip coater, inkjet coater, roll coater, etc., a temporary adhesive is applied to the wafer precursor to form an adhesive coating film. can do. After the adhesive coating film is formed, heating may be appropriately performed to remove the solvent contained in the adhesive coating film. The heating method is not particularly limited, but the wafer precursor on which the adhesive coating film is formed may be placed in a hot plate or oven and heated at a temperature of 100 ° C. to 120 ° C. for about 0.5 minutes to 2 minutes.
  • the application amount of the temporary adhesive may be appropriately determined in consideration of the composition of the temporary adhesive and the solid content ratio. For example, about 1 to 3 ml of a temporary adhesive may be applied to one side of a 4-inch wafer precursor.
  • the temporary adhesive used in the temporary fixing step uses the temporary adhesive of the present invention described above, and therefore, detailed description is omitted here.
  • the wafer precursor is disposed at a predetermined position of the polishing substrate in an orientation in which the adhesive coating film is opposed to the polishing substrate, and is bonded and fixed.
  • the surface temperature of the polishing substrate may be adjusted in advance to a temperature higher than the softening temperature of the mixture of rosin and shellac (for example, a temperature about 20 ° C. to 50 ° C. higher than the softening temperature).
  • a polishing step is performed.
  • known polishing means that enables polishing of the wafer precursor can be appropriately performed.
  • the surface to be polished can be polished by a pad that rotates while applying pressure to the surface to be polished of the wafer precursor.
  • the polishing conditions can be appropriately changed depending on the hardness of the wafer precursor and the required polishing accuracy. Since the said temporary fixing process is implemented using the temporary fixing adhesive of this invention, it can grind
  • the polished wafer is peeled from the polishing substrate. Peeling is generally performed by, for example, heating and melting, or using a knife or scraper to chemically or physically destroy the adhesive coating film. Thereafter, the temporary adhesive remaining on the peeled wafer is washed to clean the wafer.
  • the cleaning method is not particularly limited, for example, the wafer is immersed in a cleaning tank filled with a cleaning solution, and the temporary adhesive remaining on the wafer is dissolved and removed. As described above, a wafer polished with high accuracy can be manufactured by performing appropriate processes including the temporary fixing process and the polishing process.
  • the part manufacturing method of the present invention described above taking the wafer manufacturing method as an example does not limit the use of the temporary adhesive of the present invention.
  • the temporary adhesive of the present invention forms an adhesive coating film between various component precursors including a wafer precursor and a processing substrate. Has desirable functions. Therefore, the parts manufacturing method of the present invention can contribute to realization of high-precision precision machining of various parts as well as realization of general machining processes. Therefore, the component manufacturing method of the present invention uses the temporary adhesive of the present invention, forms an adhesive coating film between the component precursor and the processing substrate, and temporarily mounts the component precursor on the processing substrate.
  • examples and comparative examples which are temporary adhesives for wafer precursors, were prepared as follows. The following were prepared as adhesive components and adjusted at the ratios shown in Tables 1 to 3 to obtain Examples and Comparative Examples.
  • the adhesive component represents the mass part of the solid content
  • the solvent represents the mass part of the solvent used.
  • Adhesive component ⁇ Rosin (maleic acid-modified rosin) -Shellac (natural shellac)
  • the following was prepared as a solvent for melt
  • Breaking stress was 3 MPa or more ⁇ : Breaking stress was 2 MPa or more and less than 3 MPa x: Breaking stress was less than 2 MPa
  • In-plane film thickness difference evaluation and average film thickness measurement A single-side polished silicon wafer precursor similar to that prepared in the wet spreadability evaluation was prepared, and a coating film was formed on the polished surface under the same conditions as described above. And the film thickness of arbitrary 151 places of the coating film for adhesion
  • In-plane film thickness difference was less than 0.2 ⁇ m ⁇ : In-plane film thickness difference was 0.2 ⁇ m or more and less than 0.4 ⁇ m x: In-plane film thickness difference was 0.4 ⁇ m or more
  • Example 9 From the viewpoint of the solid content ratio in the temporary adhesive (resin composition), compared to Example 9 in which the solid content ratio was adjusted to be as low as 20% by mass or Example 10 in which the solid content ratio was adjusted to be as high as 55% by mass, In Examples 7 and 8 in which the ratio is in the range of 25% by mass or more and 50% by mass or less, both evaluations are good ( ⁇ evaluation) and particularly excellent.
  • rosin / shellac In Examples 2, 12, and 14 adjusted in the range of 40/60 to 80/20, all the evaluations were good ( ⁇ evaluation) and were particularly excellent.
  • the lower alcohol / polyhydric alcohol In terms of the solvent ratio, the lower alcohol / polyhydric alcohol is lower than Example 15 in which the lower alcohol ratio is adjusted to be as high as 95%, or in Example 16 in which the polyhydric alcohol ratio is adjusted to be as high as 75%.
  • Derivatives Examples 1 to 3, and 7 adjusted to the range of 90/10 to 30/70 were all excellent ( ⁇ evaluation) and particularly excellent.
  • Example 17 the lower alcohol / polyhydric alcohol derivative was adjusted to 80/20.
  • Examples 17 to 20 were slightly inferior in evaluation of adhesive force, wettability and in-plane film thickness difference as compared with Example 2.
  • Such evaluation was inferred as follows. That is, in Example 17, methanol having a lower boiling point was used as the lower alcohol. Therefore, Example 17 was dried before the adhesive coating film was leveled, and it was surmised that the wet spreadability was slightly inferior to Example 2, and the in-plane film thickness difference was slightly increased.
  • Example 18 isobutyl alcohol having a high boiling point was used as the lower alcohol.
  • Example 18 the adhesive coating film tended to be difficult to dry, and it was surmised that the evaluation of adhesive strength was slightly inferior to Example 2.
  • Example 19 ethylene glycol dimethyl ether having a low boiling point was used as the polyhydric alcohol derivative. Therefore, Example 19 was dried before the adhesive coating film was leveled, and it was assumed that wet spreadability was slightly inferior to Example 2, and the in-plane film thickness difference was slightly increased.
  • Example 20 propylene glycol monobutyl ether having a high boiling point was used as the polyhydric alcohol. Therefore, in Example 20, the adhesive coating film tended to be difficult to dry, and it was surmised that the evaluation of adhesive strength was slightly inferior to Example 2.
  • Examples 21, 23 to 25 show examples in which two or more kinds of lower alcohols were used.
  • the film thickness was designed to be large (refer to the value of the average film thickness)
  • the in-plane film thickness difference was as small as 0.12 ⁇ m to 0.15 ⁇ m and good. there were.
  • the adhesive strength was high, the wet spreadability was good, the in-plane film thickness difference was as small as 0.13 ⁇ m, and the balance was good, and it was a good temporary adhesive.
  • Example 23 was particularly excellent in adhesive strength among Examples 21 to 25. This reason was presumed to be because the amount of the lower alcohol blended with the polyhydric alcohol derivative in Example 23 was significantly large.
  • Comparative Examples 1 to 4 there was a tendency that the larger the rosin blending ratio, the smaller the in-plane film thickness difference and the better the wetting and spreading property. On the other hand, in Comparative Examples 1 to 4, it was shown that the adhesive strength tends to increase as the proportion of shellac increases.
  • the in-plane film thickness difference when designed with an appropriate average film thickness (specifically, about 2.8 ⁇ m), the in-plane film thickness difference is large in the comparative example. Even if it was thick, the in-plane film thickness difference could be kept small. In particular, in Examples 7 and 21 to 25, the average film thickness was 3.75 ⁇ m, the breaking stress was very high at 3.9 Mpa, and good wetting and spreading properties were shown.
  • the above embodiment includes the following technical idea.
  • the temporary fixing adhesive according to (1), wherein a blending ratio of the rosin and the shellac is in the range of rosin (parts by mass) / shellac (parts by mass) 40/60 to 80/20.
  • At least one of the lower alcohol is a monovalent lower alcohol and has a boiling point of 70 ° C. or higher and 105 ° C. or lower, or the polyhydric alcohol derivative has a boiling point of 115 ° C. or higher and 150 ° C. or lower.
  • the temporary fixing adhesive according to (1) or (2) which satisfies the above.
  • the solid content ratio in 100% by mass of the temporary adhesive is in the range of 25% by mass to 50% by mass, and the blending ratio of the lower alcohol and the polyhydric alcohol derivative is lower alcohol (parts by mass).
  • Polyhydric alcohol derivative (parts by mass) the temporary fixing adhesive according to any one of (1) to (6), which is in the range of 95/5 to 25/75.
  • the lower alcohol includes two or more solvents having different boiling points, The temporary fixing adhesive according to any one of (1) to (8), wherein a boiling point of at least one of the two or more lower alcohols is 95 ° C or lower.
  • a component manufacturing method comprising: a temporary fixing step for temporarily fixing the component precursor; and a processing step for processing a processing surface of the component precursor temporarily fixed to the processing substrate in the temporary fixing step.
  • the component precursor is a wafer precursor, the adhesive coating film is formed between the wafer precursor and the polishing substrate which is the processing substrate, and the wafer precursor is formed on the polishing substrate.
  • the component according to (11) further comprising: a temporary fixing step for temporarily fixing a polishing step, and a polishing step for polishing a surface to be polished of the wafer precursor temporarily fixed to the polishing substrate in the temporary fixing step. Production method.

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  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

La présente invention concerne un adhésif temporaire capable de satisfaire la liaison temporaire, à un substrat d'usinage, divers précurseurs de composant sujets à l'usinage, et fournissant un procédé de fabrication d'une tranche comprenant une étape de polissage permettant le polissage à haute précision d'une surface d'une tranche à polir. L'adhésif temporaire contient de la colophane, une gomme-laque, un alcool inférieur constitué d'un alcool comprenant cinq atomes de carbone ou moins, et un dérivé d'alcool polyhydrique constitué d'un dérivé d'alcool présentant une molécule comprenant deux groupes hydroxyle ou plus. Le procédé de fabrication de composant comprend : une étape de liaison temporaire dans laquelle l'adhésif temporaire est utilisé pour former un revêtement adhésif entre un précurseur de composant et un substrat d'usinage, et le précurseur de composant étant temporairement lié au substrat d'usinage ; et une étape d'usinage dans laquelle une surface à usiner du précurseur de composant lié temporairement au substrat d'usinage dans l'étape de liaison temporaire est usinée.
PCT/JP2017/043216 2016-12-01 2017-11-30 Adhésif temporaire et procédé de fabrication de composant WO2018101453A1 (fr)

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JP2018539920A JP6403935B1 (ja) 2016-12-01 2017-11-30 仮止接着剤および部品製造方法

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109096986A (zh) * 2018-07-26 2018-12-28 昆明理工大学 一种含紫胶废弃渣胶的热熔胶粉及其制备方法
WO2020246470A1 (fr) * 2019-06-03 2020-12-10 株式会社Ｄｎｐファインケミカル Adhésif de fixation temporaire à base d'eau et procédé de fabrication de divers éléments ou pièces à l'aide dudit adhésif de fixation temporaire à base d'eau

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112662372B (zh) * 2020-12-24 2022-02-08 烟台大学 一种可多次加热使用的虫胶及其制备方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03203981A (ja) * 1989-12-29 1991-09-05 Nikka Seiko Kk ウエハーの仮着用接着剤およびその洗浄剤
JPH07179842A (ja) * 1993-12-24 1995-07-18 Tdk Corp 接着剤、その製造法、及びそれを用いた電子部品の製造法
JPH11293224A (ja) * 1998-04-07 1999-10-26 The Inctec Inc シリコンウエハー用仮着接着剤及びその精製方法
JP2000265151A (ja) * 1999-03-17 2000-09-26 The Inctec Inc 液状仮着接着剤
JP2006096881A (ja) * 2004-09-29 2006-04-13 The Inctec Inc 粉体接着剤
JP2010222426A (ja) * 2009-03-23 2010-10-07 Dnp Fine Chemicals Co Ltd 顆粒接着組成物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000256636A (ja) * 1999-03-04 2000-09-19 The Inctec Inc 液状仮着接着剤

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03203981A (ja) * 1989-12-29 1991-09-05 Nikka Seiko Kk ウエハーの仮着用接着剤およびその洗浄剤
JPH07179842A (ja) * 1993-12-24 1995-07-18 Tdk Corp 接着剤、その製造法、及びそれを用いた電子部品の製造法
JPH11293224A (ja) * 1998-04-07 1999-10-26 The Inctec Inc シリコンウエハー用仮着接着剤及びその精製方法
JP2000265151A (ja) * 1999-03-17 2000-09-26 The Inctec Inc 液状仮着接着剤
JP2006096881A (ja) * 2004-09-29 2006-04-13 The Inctec Inc 粉体接着剤
JP2010222426A (ja) * 2009-03-23 2010-10-07 Dnp Fine Chemicals Co Ltd 顆粒接着組成物

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109096986A (zh) * 2018-07-26 2018-12-28 昆明理工大学 一种含紫胶废弃渣胶的热熔胶粉及其制备方法
WO2020246470A1 (fr) * 2019-06-03 2020-12-10 株式会社Ｄｎｐファインケミカル Adhésif de fixation temporaire à base d'eau et procédé de fabrication de divers éléments ou pièces à l'aide dudit adhésif de fixation temporaire à base d'eau
JP2020196813A (ja) * 2019-06-03 2020-12-10 株式会社Ｄｎｐファインケミカル 水系仮止め接着剤及び該水系仮止め接着剤を用いた各種部材又は部品の製造方法
CN113939570A (zh) * 2019-06-03 2022-01-14 Dnp精细化工股份有限公司 水系临时固定粘接剂以及使用了该水系临时固定粘接剂的各种构件或部件的制造方法
JP7288807B2 (ja) 2019-06-03 2023-06-08 株式会社Ｄｎｐファインケミカル 水系仮止め接着剤及び該水系仮止め接着剤を用いた各種部材又は部品の製造方法
CN113939570B (zh) * 2019-06-03 2024-01-05 Dnp精细化工股份有限公司 水系临时固定粘接剂以及使用了该水系临时固定粘接剂的各种构件或部件的制造方法

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