WO2018086631A1 - 一种防过热 csp 荧光膜片模压装置及方法 - Google Patents

一种防过热 csp 荧光膜片模压装置及方法 Download PDF

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Publication number
WO2018086631A1
WO2018086631A1 PCT/CN2017/114151 CN2017114151W WO2018086631A1 WO 2018086631 A1 WO2018086631 A1 WO 2018086631A1 CN 2017114151 W CN2017114151 W CN 2017114151W WO 2018086631 A1 WO2018086631 A1 WO 2018086631A1
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WO
WIPO (PCT)
Prior art keywords
die
clamp
fluorescent film
pressing
mold
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PCT/CN2017/114151
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English (en)
French (fr)
Inventor
李宗涛
林庆宏
汤勇
余树东
王卉玉
梁观伟
陆龙生
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华南理工大学
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Application filed by 华南理工大学 filed Critical 华南理工大学
Priority to US16/349,589 priority Critical patent/US10962178B2/en
Publication of WO2018086631A1 publication Critical patent/WO2018086631A1/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00—Technologies relating to the processing of minerals
    • Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57—Improving the yield, e-g- reduction of reject rates

Definitions

  • the present invention relates to the field of LED packaging technology, and in particular, to an anti-overheating CSP fluorescent film molding device and method.
  • Chip size package The CSP device eliminates gold wires and has a small or no substrate, which greatly reduces device size while reducing package cost by up to 20%.
  • CSP devices have lower thermal resistance, CSP The illuminance density is improved, and the CSP's small, thin, and light features greatly enhance the flexibility of its design and application. Therefore, CSP packaging is widely used in different fields, and market demand is experiencing rapid growth.
  • CSP Phosphor coating methods include wafer level coating, dispensing, spray coating, fluorescent molding, and fluorescent film molding.
  • the dispensing method is formed by the surface tension of the fluorescent rubber itself, and is not substantially CSP due to poor consistency and uniformity.
  • Manufacturers have adopted the most commonly used processes such as spray coating, fluorescent molding and fluorescent film molding.
  • fluorescent film molding is widely used in the industry due to consistency and uniformity.
  • the fluorescent film molding process needs to be realized by a molding laminator. Due to CSP The device has multi-faceted illumination and small size, and the thickness consistency of the encapsulant is very high. Therefore, the molding process is demanding for temperature control and operator requirements. Current domestic CSP Manufacturers are less automated in this process, relying mainly on manual clamping LEDs Chip loading and unloading and adjustment of fluorescent film. During the production process, there is often a process defect in which the fluorescent film melts and flows due to overheating when it is not molded.
  • the present invention is directed to the process defects to be solved in the above production, and proposes an anti-overheating CSP.
  • the fluorescent film molding device and method solve the problem of the specific overheating of the clip and the early melting of the fluorescent film due to the difference in the operation time of the operator.
  • An object of the present invention is to overcome the above-mentioned shortcomings and deficiencies of the prior art and to provide an anti-overheating CSP fluorescent film molding apparatus and method.
  • the operation time of the chip and the fluorescent film is uncontrollable, which may cause the lower clamp to contact with the hot pressing die for a long time and overheat, and the fluorescent film melts prematurely when the mold is not closed, thereby reducing the yield.
  • the invention can effectively prevent the occurrence of such packaging defects, reduce the dependence of the molding process on the operation proficiency, and greatly improve the yield rate.
  • Anti-overheating CSP a fluorescent film molding device comprising a frame, a molding device, a force measuring device, a control device and a feeding device; the pressing device is in a frame, the force measuring device is arranged at a bottom of the pressing device; the control device and the feeding device The device is placed outside the rack; The force measuring device is implemented by a load cell and a capture card; the feed device is driven by a motor screw drive, a pneumatic drive or a hydraulic drive; and the control device is implemented by a closed loop servo control system and an industrial computer.
  • the molding device includes an upper pressing die, an upper clamping die, a lower pressing die, a guiding pillar, an elastic supporting structure and a lower clamp;
  • the upper die includes an upper die body and an upper die heating device;
  • the lower die includes a lower die body and a lower die heating device;
  • the upper die heating device is disposed in the upper die body, and is pressed Heating the upper die body during molding;
  • the lower die heating device is disposed in the lower die body, and heating the lower die body during the die pressing;
  • the upper clamp is fixed on a side of the upper die body near the lower clamp; the lower clamp is connected to the lower die body through an elastic support structure; when the mold is not clamped, the elastic support structure is not subjected to a mold force, and is separated a bottom surface of the lower clamp and an upper surface of the lower mold main body; when the mold is closed, the elastic support structure is subjected to a pressing force, and the shrinkage deformation causes the bottom surface of the lower clamp to contact the upper surface of the lower mold main body;
  • the surface is a smooth surface;
  • the upper pressing die and the lower pressing die are mounted on the guiding column, and the upper pressing die or the lower pressing die is moved on the guiding column by the control of the feeding device to realize precise positioning clamping or separation; when not clamping, the pressing is performed
  • the mold and the lower mold are in a separated state.
  • the upper clamp and the lower clamp are mounted on the micro guide post through the complementary inclined slopes at both ends of the clamp or at both ends of the clamp for precise positioning; the force measuring device is used for measuring the clamping force when clamping.
  • the distance between the bottom surface of the lower clamp and the upper surface of the lower mold main body is 1 to 10 mm.
  • the contact area of the bottom surface of the lower jig and the upper surface of the lower die body is greater than 90% of the area of the lower bottom surface of the lower jig.
  • the contact of the elastic supporting structure connecting the lower clamp is a point contact or a line contact, and the contact area is not more than 5% of the upper surface area of the lower stamper main body.
  • the contact of the elastic support structure to the lower mold body is point contact or line contact, and the contact area is not more than 5% of the upper surface area of the lower mold body.
  • the elastic supporting structure is a spiral spring, a spring piece, an elastic original or an elastic device; the elastic supporting structure has a rigidity perpendicular to the molding direction of more than 1000 N/cm, and the rigidity along the molding direction is 10-25N/cm, the stiffness in both directions does not exceed 5% when the temperature varies by less than 120 °C.
  • An anti-overheating CSP fluorescent film molding method based on the device according to any of the above, comprising the steps of:
  • the feeding device controls only the upper pressing die to move downward or only the lower pressing die to move upward, so that the upper pressing die and the lower pressing die are close to each other, and the force measuring device measures the clamping force in real time;
  • the feeding device controls the separation of the upper and lower molds, and the molded LED chip is removed to complete the molding.
  • the preheating is to preheat to and maintain the temperature at 78-82 °C.
  • the feed speed of only the downward movement of the upper die or the upward movement of the lower die is controlled to be 5-10 cm/s. .
  • the clamping process starts from the first inflection point to the air pressure phase; the first inflection point to the second inflection point is the molded elastic support structure stage; the second inflection point to the end of the molding is the molded fluorescent film stage; the second inflection point is the temperature rising starting point, and the temperature is raised
  • the post temperature is the melting temperature of the fluorescent film.
  • the pressurization is pressurization to 1000-2000 Pa; 118-122 ° C; the holding pressure is 2-3 min.
  • the present invention has the following advantages and effects:
  • the present invention is easy to control LEDs when operating the LED chip and placing the fluorescent film
  • the specific temperature of the clip is prevented from being overheated by contact with the heat source for a long time, and the fluorescent film can be prevented from flowing in advance, the operation difficulty of the process is lowered, and the yield of the process is improved;
  • the elastic support structure of the device of the invention has an anti-overheating function and an LED
  • the operating time of fixed and fluorescent diaphragm adjustment increases the operability of the process and reduces the operator's training cost
  • the invention increases the stage of compressing the elastic support structure, so that the clamping force of the molding increases with a relatively smooth growth, reduces the force impact of the clamping device, reduces the impact wear of the device, and improves the service life of the molding device;
  • the compression elastic support structure and the molded fluorescent film of the invention have obvious mutations of the first-order derivative of the clamping force measured by the force measuring device, which is favorable for determining the starting point of the molded fluorescent film, and is convenient for selecting the starting point of the mold heating temperature. And the control of the holding time, improve the molding quality and yield of the process.
  • FIG. 1 is a schematic view of an overheat prevention CSP fluorescent film molding device according to the present invention.
  • FIG. 2 is a schematic view showing the clamping of the LED chip and the fluorescent film in the molding device in the device of the present invention
  • Figure 3a is a schematic view showing the positioning of the upper and lower clamps of the apparatus of the present invention through the inclined faces at both ends of the clamp;
  • Figure 3b is a schematic view showing the positioning of the upper and lower clamps on the micro-column by the two ends of the clamp in the device of the present invention
  • Figure 4a is a schematic view showing the elastic support structure in the device of the present invention as a spring
  • Figure 4b is a schematic view showing the elastic support structure of the device of the present invention as a spring slide ball
  • Figure 4c is a schematic view showing the elastic support structure in the device of the present invention as a curved leaf spring
  • Figure 4d is a schematic view showing the elastic support structure in the device of the present invention as a folded leaf spring
  • Figure 5a is a schematic view showing a pressure-pressing stage in the molding process of the device of the present invention.
  • Figure 5b is a schematic view showing the stage of the molded elastic support structure in the molding process of the device of the present invention.
  • Figure 5c is a schematic illustration of the stage of the molded fluorescent film during the molding of the apparatus of the present invention.
  • FIG. 1 is a schematic view of an overheat-proof CSP fluorescent film molding device according to the present invention, including a frame 12 and a molding device 13
  • the molding device 13 includes an upper pressing die, an upper clamp 3, a lower pressing die, a guide post 4, an elastic support structure 10 and a lower clamp 5;
  • the die-cutting device 13 is shown with a schematic diagram of the LED chip 9 and the fluorescent film 8 as shown in Fig. 2, the LED chip 9 is clamped on the upper surface of the lower jig 5, and the fluorescent film 8 is placed on the LED. Above the chip 9;
  • the upper die includes an upper die body 1 and an upper die heating device 2; the lower die includes a lower die body 6 and a lower die heating device 7
  • the upper die heating device 2 is disposed in the upper die body 1, and heats the upper die body 1 when the die is pressed;
  • the lower die heating device 7 is disposed in the lower die body 6, and the lower die body is pressed during the die 6 Heating;
  • the upper clamp 3 is fixed to the side of the upper die body 1 close to the lower clamp 5; the lower clamp 5 and the lower die body 6
  • the elastic support structure 10 is connected; when the mold is not clamped, the elastic support structure 10 is not subjected to the mold clamping force, and the bottom surface of the lower clamp 5 and the upper surface of the lower mold main body 6 are separated; when the mold is closed, the elastic support structure 10 Due to the clamping force, the shrinkage deformation causes the bottom surface of the lower jig 5 to contact the upper surface of the lower die body 6; the upper surface of the lower jig 5 is a smooth surface;
  • the upper and lower stampers are mounted on the guide post 4, and the upper or lower stamper is guided on the guide post 4 by the control of the feed device 16.
  • the upper clamp 3 and the lower clamp 5 are mounted on the micro guide post through the complementary inclined slopes at both ends of the clamp or the clamps for precise positioning;
  • the schematic diagram of the positioning of the upper clamp and the lower clamp through the inclined plane at both ends of the clamp is shown in Fig. 3a, and the schematic diagram of the upper clamp and the lower clamp being positioned on the micro guide pillar through the two ends of the clamp is shown in Fig. 3b;
  • the distance between the bottom surface of the lower jig 5 and the upper surface of the lower mold main body 6 is 1 to 10 mm; when the mold is closed, the lower clamp 5
  • the contact area between the bottom surface and the upper surface of the lower die body 6 is greater than 90% of the area of the lower bottom surface of the lower jig 5;
  • Elastic support structure 10 The contact of the lower clamp 5 is a point contact or a line contact, and the contact area is not larger than the upper surface area of the lower mold main body 6. 5%; elastic support structure 10 The contact of the lower mold main body 6 is point contact or line contact, and the contact area is not more than 5% of the upper surface area of the lower mold main body 6;
  • the elastic support structure 10 is a spiral spring, a spring piece, an elastic original or an elastic device; the elastic support structure is Schematic diagram of spring, spring ball, curved leaf spring and folded leaf spring are shown in Figure 4a ⁇ Figure 4d respectively; elastic support structure 10 is perpendicular to the molding direction with stiffness greater than 1000N/cm The stiffness along the molding direction is 10-25 N/cm, and the stiffness in both directions does not exceed 5% when the temperature varies from less than 120 °C.
  • the elastic supporting structure is a spring piece, and the rigidity of the spring piece in the direction of the die is 10 N/cm; the spring piece is connected to the lower piece
  • the contact of 5 is a line contact, the contact area is 3% of the area of the upper surface of the lower stamper body 6, and the contact of the stamper body 6 under the spring piece is a line contact, and the contact area is the area of the upper surface of the lower stamper body 6. 3%;
  • the contact area between the bottom surface of the lower jig 5 and the upper surface of the lower mold main body 6 is 95% of the area of the lower bottom surface of the lower jig 5.
  • the CSP fluorescent film molding is carried out by using the above-mentioned anti-overheating CSP fluorescent film molding device.
  • the LED chip 9 is mounted on the upper surface of the lower jig 5, and the fluorescent film 8 is placed on the LED chip. Above 9
  • Feeding device 16 Control only the upper die moves downwards, so that the upper die and the lower die are close to each other. , the feed speed of only moving the upper die is controlled at 5 cm/s, and the force measuring device 14 measures the clamping force;
  • Feeding device 16 Controls the separation of the upper and lower stampers, removes the molded LED chip, and completes the molding process.
  • the thickness of the product is uniform, the concentration of the phosphor is evenly distributed, the spatial light color distribution is good, and the process defects caused by the overheating of the fluorescent film are not present.
  • the elastic supporting structure is a spring piece, and the rigidity of the spring piece in the direction of the die is 25 N/cm; the spring piece is connected to the lower piece
  • the contact of 5 is a line contact, the contact area is 5% of the area of the upper surface of the lower stamper body 6, and the contact of the stamper body 6 under the spring piece is a line contact, and the contact area is the area of the upper surface of the lower stamper body 6. 5%;
  • the contact area between the bottom surface of the lower jig 5 and the upper surface of the lower mold main body 6 is 90% of the area of the lower bottom surface of the lower jig 5.
  • the CSP fluorescent film molding is carried out by using the above-mentioned anti-overheating CSP fluorescent film molding device.
  • the LED chip 9 is mounted on the upper surface of the lower jig 5, and the fluorescent film 8 is placed on the LED chip. Above 9
  • Feeding device 16 Control only the upper die moves downwards, so that the upper die and the lower die are close to each other. , only the moving speed of the upper or lower die is controlled to be 10 cm/s, and the force measuring device 14 measures the clamping force;
  • Feeding device 16 Controls the separation of the upper and lower stampers, removes the molded LED chip, and completes the molding process.
  • the thickness of the product is uniform, the concentration of the phosphor is evenly distributed, the spatial light color distribution is good, and the process defects caused by the overheating of the fluorescent film are not present.
  • the elastic supporting structure is a spring piece, and the rigidity of the spring piece in the direction of the die is 20 N/cm; the spring piece is connected to the lower piece
  • the contact of 5 is a line contact, the contact area is 5% of the area of the upper surface of the lower stamper body 6, and the contact of the stamper body 6 under the spring piece is a line contact, and the contact area is the area of the upper surface of the lower stamper body 6. 5%;
  • the contact area between the bottom surface of the lower jig 5 and the upper surface of the lower mold main body 6 is 93% of the area of the lower bottom surface of the lower jig 5.
  • the CSP fluorescent film molding is carried out by using the above-mentioned anti-overheating CSP fluorescent film molding device.
  • the LED chip 9 is mounted on the upper surface of the lower jig 5, and the fluorescent film 8 is placed on the LED chip. Above 9
  • Feeding device 16 Controls the separation of the upper and lower stampers, removes the molded LED chip, and completes the molding process.
  • the thickness of the product is uniform, the concentration of the phosphor is evenly distributed, the spatial light color distribution is good, and the process defects caused by the overheating of the fluorescent film are not present.
  • the present invention can be preferably carried out as described above.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)

Abstract

一种防过热CSP荧光膜片模压装置及方法。该装置包括架(12)、压模装置(13)、测力装置(14)、控制装置(15)和进给装置(16)；所述压模装置(13)包括上压模、上夹具（3）、下压模、导柱(4)、弹性支撑结构(10)和下夹具(5)。模压过程增加压缩弹性支撑结构阶段，使得模压的合模力有较为平稳的增长，减少合模装置的力冲击，便于确定模压保温起始点。有效防止下夹具长时间与发热的下压模大面积接触而过热，避免荧光膜片过热提前融化的工艺缺陷，极大提高CSP封装荧光膜片模压工艺的产品一致性和良品率。

Description

一种防过热 CSP 荧光膜片模压装置及方法
技术领域
本发明涉及 LED 封装技术领域，尤其涉及一种防过热 CSP 荧光膜片模压装置及方法。
背景技术
随着 LED 技术发展与成本压缩， LED 器件的封装体积越来越小，功率密度不断提高。 芯片尺寸封装（ CSP ） 器件可免去金线，基板极小甚至不需要基板，从而极大减小器件体积，同时降低封装成本高达 20% ；此外， CSP 器件热阻也有所降低， CSP 的发光密度得到提高，且 CSP 小、薄、轻的特点使得其设计应用的灵活性大大提高。因此， CSP 封装在不同领域得到广泛应用，市场需求正出现快速增长。
目前， CSP 荧光粉涂覆方法包括有晶圆级涂覆、点胶法、喷涂法、荧光胶模塑和荧光膜片模压。其中，点胶法是通过荧光胶自身的表面张力约束成型，因一致性和均匀性较差基本不被 CSP 厂商所采纳，目前常用的工艺主要是喷涂法、荧光胶模塑和荧光膜片模压，尤其荧光膜片模压因具有一致性和均匀性在业内被普遍采用。
CSP 器件的荧光粉涂覆工艺中，荧光膜片模压工艺需要依靠模压塑封机来实现。由于 CSP 器件具有多面发光、体积微小的特点，对封装胶体的厚度一致性要求非常高。因此，模压工艺对温度控制和操作者的要求苛刻。现阶段国内 CSP 生产厂家在该工艺的自动化程度较低，主要依靠人工装夹 LED 芯片上下料及荧光膜片的调整。生产过程中，常出现荧光膜片在未模压时，就因过热而融化流动的工艺缺陷。这是因为操作者上下料及荧光膜片调整的时间过长，导致夹具体与发热下模具大面积长时间接触而过热，引起荧光膜片长时间过热而提前融化。这大大降低了良品率，增加生产成本。
本发明针对上述生产中亟待解决的工艺缺陷，提出一种防过热 CSP 荧光膜片模压装置及方法，解决由于操作人员操作时间的差异而导致的夹具体过热、荧光膜片提前融化的工艺问题。
发明内容
本发明的目的在于克服上述现有技术的缺点和不足，提供一种防过热 CSP 荧光膜片模压装置及方法。
CSP 荧光膜片模压工序，因放置 LED 芯片和荧光膜片的操作时间不可控，易导致下夹具与发热的下压模大面积长时间接触而过热，荧光膜片在未合模时过早融化流动，从而降低良品率。本发明可有效防止此类封装缺陷的产生，降低模压工艺对操作熟练度的依赖，极大提高良品率。
一种防过热 CSP 荧光膜片模压装置，包括机架、压模装置、测力装置、控制装置和进给装置；所述压模装置在机架内，测力装置设置在压模装置的底部；控制装置和进给装置设置在机架外； 所述测力装置采用测力传感器和采集卡实现；所述进给装置采用电机丝杆驱动、气压驱动或液压驱动实现；所述控制装置采用闭环伺服控制系统和工业计算机实现。
所述压模装置包括上压模、上夹具、下压模、导柱、弹性支撑结构和下夹具；
所述上压模包括上压模主体和上压模加热装置；所述下压模包括下压模主体和下压模加热装置；所述上压模加热装置设置在上压模主体内，压模时对上压模主体进行加热；所述下压模加热装置设置在下压模主体内，压模时对下压模主体进行加热；
所述上夹具固定在上压模主体的靠近下夹具的侧面上；所述下夹具与下压模主体通过弹性支撑结构连接；未合模时，所述弹性支撑结构未受压模力，分离下夹具的底面与下压模主体的上表面；合模时，所述弹性支撑结构受压模力，收缩变形使得下夹具的底面与下压模主体的上表面接触；所述下夹具的上表面是光滑的表面；
所述上压模和下压模安装在导柱上，通过进给装置的控制，上压模或下压模在导柱上运动并实现精准定位合模或分离；未合模时，上压模和下压模处于分离状态。
进一步地， 所述上夹具和下夹具通过夹具两端对应互补的斜面或夹具两端安装在微型导柱上进行精准定位；测力装置用于测定合模时的合模力。
进一步地，未合模时，下夹具的底面和下压模主体的上表面 分离的距离为 1~10mm ；合模时，下夹具的底面和下压模主体的上表面的接触面积大于下夹具的下底面面积的 90% 。
进一步地，所述弹性支撑结构连接下夹具的接触为点接触或线接触，接触面积不大于下压模主体的上表面面积的 5% ；弹性支撑结构连接下压模主体的接触为点接触或线接触，接触面积不大于下压模主体的上表面面积的 5% 。
进一步地，所述弹性支撑结构为螺旋型弹簧、弹簧片、具有弹性的原件或具有弹性的装置；弹性支撑结构垂直于模压方向的刚度大于 1000N/cm ，沿模压方向的刚度为 10-25N/cm ，两个方向的刚度在温度的变化范围小于 120 ℃时的变化值不超过 5% 。
一种基于上述任一项所述装置的防过热 CSP 荧光膜片模压方法，包括如下步骤：
（ 1 ）启动上压模加热装置和下压模加热装置，对上压模主体和下压模主体进行预热；
（ 2 ）将 LED 芯片装夹在下夹具的上表面，同时将荧光膜片放置于 LED 芯片的上方；
（ 3 ）进给装置控制只上压模向下运动或只下压模向上运动，使上压模和下压模相互靠近，同时测力装置实时测量合模力；
（ 4 ）保持合模状态， 上夹具靠近下夹具，上夹具与荧光膜片接触，并开始挤压下夹具，实时测量的合模力出现第一个拐点，弹性支撑结构被不断压缩，下夹具的底面不断靠近发热下压模主体的上表面； 直至 下夹具的底面接触发热的下压模主体的上表面， 实时测量的合模力出现第二个拐点时，进给装置加压，同时通过加热装置使上压模主体和下压模主体升温，保温保压；
（ 5 ）进给装置控制上压模和下压模分离，取下模压好的 LED 芯片，完成模压。
进一步地， 步骤（ 1 ）中，所述预热是预热至并维持温度为 78-82 ℃。
进一步地，步骤（ 3 ）中，只上压模向下运动或只下压模向上运动的的进给速度控制为 5-10cm/s 。
进一步地，测力装置实时测得的合模力存在两个拐点， 合模开始到第一拐点阶段为空压阶段；第一拐点到第二拐点阶段为模压弹性支撑结构阶段；第二拐点到模压结束为模压荧光膜片阶段；第二拐点为升温起始点，升温后的温度为荧光膜片融化流动温度。
进一步地， 步骤（ 4 ）中，所述加压是加压至 1000-2000Pa ；所述升温是升温至 118-122 ℃；所述保温保压的时间为 2-3min 。
本发明相对于现有技术，具有如下的优点及效果：
（ 1 ）本发明操作固定 LED 芯片和放置荧光模片时，易于控制 LED 夹具体的温度，防止长时间大面积接触热源而过热，可有效避免荧光膜片提前流动，降低了工序的操作要求难度，提高工序的良品率；
（ 2 ）本发明装置的弹性支撑结构具有防过热功能，增加了 LED 固定及荧光膜片调整的操作时间，增加工序的可操作性，降低了操作者的培训成本；
（ 3 ）本发明增加压缩弹性支撑结构阶段，使得模压的合模力增加有较为平稳的增长，减少合模装置的力冲击，降低装置的冲击磨损，提高模压装置的使用寿命；
（ 4 ）本发明压缩弹性支撑结构与模压荧光膜片，测力装置所测得的合模力对时间的一阶导数有明显突变，有利于确定模压荧光膜片的起始点，便于模具升温起始点选取和保温时间的控制，提高工序的模压质量和良品率。
附图说明
图 1 为本发明一种防过热 CSP 荧光膜片模压装置的示意图；
图 2 为本发明装置中的压模装置装夹有 LED 芯片和荧光膜片的示意图；
图 3a 为本发明装置中上夹具和下夹具通过夹具两端的斜面定位的示意图；
图 3b 为本发明装置中上夹具和下夹具通过夹具两端安装在微型导柱上定位的示意图；
图 4a 为本发明装置中的弹性支撑结构为弹簧的示意图；
图 4b 为本发明装置中的弹性支撑结构为弹簧滑球的示意图；
图 4c 为本发明装置中的弹性支撑结构为弯曲板簧的示意图；
图 4d 为本发明装置中的弹性支撑结构为折叠板簧的示意图；
图 5a 为本发明装置模压过程中的压空阶段的示意图；
图 5b 为本发明装置模压过程中的模压弹性支撑结构阶段的示意图；
图 5c 为本发明装置模压过程中的模压荧光膜片阶段的示意图。
具体实施方式
下面结合具体实施例对本发明作进一步具体详细描述，但本发明不限于以下实施例。
如图 1 所示为 本发明一种防过热 CSP 荧光膜片模压装置的示意图， 包括机架 12 、压模装置 13 、测力装置 14 、控制装置 15 和进给装置 16 ；压模装置 13 在机架 12 内，测力装置 14 设置在压模装置 13 的底部，测力装置 14 用于测定合模时的合模力；控制装置 15 和进给装置 16 设置在机架 12 外；测力装置 14 采用测力传感器和采集卡实现；进给装置 16 采用电机丝杆驱动、气压驱动或液压驱动实现；控制装置 15 采用闭环伺服控制系统和工业计算机实现；
压模装置 13 包括上压模、上夹具 3 、下压模、导柱 4 、弹性支撑结构 10 和下夹具 5 ； 压模装置 13 装夹有 LED 芯片 9 和荧光膜片 8 的示意图如图 2 所示， LED 芯片 9 装夹在下夹具 5 的上表面，荧光膜片 8 放置于 LED 芯片 9 的上方；
上压模包括上压模主体 1 和上压模加热装置 2 ；下压模包括下压模主体 6 和下压模加热装置 7 ；上压模加热装置 2 设置在上压模主体 1 内，压模时对上压模主体 1 进行加热；下压模加热装置 7 设置在下压模主体 6 内，压模时对下压模主体 6 进行加热；
上夹具 3 固定在上压模主体 1 的靠近下夹具 5 的侧面上；下夹具 5 与下压模主体 6 通过弹性支撑结构 10 连接；未合模时，弹性支撑结构 10 未受合模力，分离下夹具 5 的底面与下压模主体 6 的上表面；合模时，弹性支撑结构 10 受合模力，收缩变形使得下夹具 5 的底面与下压模主体 6 的上表面接触；下夹具 5 的上表面是光滑的表面；
上压模和下压模安装在导柱 4 上，通过进给装置 16 的控制，上压模或下压模在导柱 4 上运动并实现精准定位合模或分离；未合模时，上压模和下压模处于分离状态；
上夹具 3 和下夹具 5 通过夹具两端对应互补的斜面或夹具两端安装在微型导柱上进行精准定位； 上夹具和下夹具通过夹具两端的斜面定位的示意图如图 3a 所示，上夹具和下夹具通过夹具两端安装在微型导柱上定位的示意图如图 3b 所示；
未合模时，下夹具 5 的底面和下压模主体 6 的上表面 分离的距离为 1~10mm ；合模时，下夹具 5 的底面和下压模主体 6 的上表面的接触面积大于下夹具 5 的下底面面积的 90% ；
弹性支撑结构 10 连接下夹具 5 的接触为点接触或线接触，接触面积不大于下压模主体 6 的上表面面积的 5% ；弹性支撑结构 10 连接下压模主体 6 的接触为点接触或线接触，接触面积不大于下压模主体 6 的上表面面积的 5% ；
弹性支撑结构 10 为螺旋型弹簧、弹簧片、具有弹性的原件或具有弹性的装置；弹性支撑结构为 弹簧、弹簧滑球、弯曲板簧和折叠板簧的示意图 分别 如图 4a~ 图 4d 所示； 弹性支撑结构 10 垂直于模压方向的刚度大于 1000N/cm ，沿模压方向的刚度为 10-25N/cm ，两个方向的刚度在温度变化范围小于 120 ℃时的变化值不超过 5% 。
实施例 1
该实施例采用的装置中，弹性支持结构为弹簧片，弹簧片沿压模方向的刚度为 10N/cm ；弹簧片 连接下夹具 5 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 3% ， 弹簧片 连接下压模主体 6 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 3% ；合模时，下夹具 5 的底面和下压模主体 6 的上表面的接触面积为下夹具 5 的下底面面积的 95% 。
采用上述的一种防过热 CSP 荧光膜片模压装置实现 CSP 荧光膜片模压。
（ 1 ） 上压模、下压模的加热装置启动，压模预热，维持温度在 78 ℃ ；
（ 2 ） 上夹具 3 与下夹具 5 通过进给装置 16 控制分离，下夹具 5 和下压模主体 6 通过弹性支撑结构分离 1mm ；
（ 3 ） 将 LED 芯片 9 装夹于下夹具 5 的上表面，同时将荧光膜片 8 放置于 LED 芯片 9 的上方；
（ 4 ） 进给装置 16 控制 只上压模向下运动，使上压模和下压模相互靠近 ，只移动上压模的进给速度控制在 5cm/s ，同时测力装置 14 时实测量合模力；
（ 5 ） 上夹具 3 靠近下夹具 5 ，过程如图 5a 所示；上夹具 3 与荧光膜片 8 接触，并开始挤压下夹具 5 ，过程如图 5b 所示，合模力出现第一个拐点，弹性支撑结构 10 被不断压缩，下夹具 5 的底面不断靠近发热的下压模主体 6 的上表面；
（ 6 ） 下夹具 5 的底面接触发热的下压模主体 6 的上表面，过程如图 5c 所示，合模力出现第二个拐点，进给装置 16 加压到 1000 Pa ；
（ 7 ） 在第二个合模力拐点出现时将上压模和下压模的温度升高到 118 ℃ ，保温保压 2min ，进给装置 16 控制上压模和下压模分离，取下模压好的 LED 芯片，完成模压工序。
模压得到的带荧光膜片的 CSP 产品厚度均一，荧光粉浓度分布均匀，空间光色分布良好，未出现因荧光膜片过热造成的工艺缺陷。
实施例 2
该实施例采用的装置中，弹性支持结构为弹簧片，弹簧片沿压模方向的刚度为 25N/cm ；弹簧片 连接下夹具 5 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 5% ， 弹簧片 连接下压模主体 6 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 5% ；合模时，下夹具 5 的底面和下压模主体 6 的上表面的接触面积为下夹具 5 的下底面面积的 90% 。
采用上述的一种防过热 CSP 荧光膜片模压装置实现 CSP 荧光膜片模压。
（ 1 ） 上压模、下压模的加热装置启动，压模预热，维持温度在 82 ℃ ；
（ 2 ） 上夹具 3 与下夹具 5 通过进给装置 16 控制分离，下夹具 5 和下压模主体 6 通过弹性支撑结构分离 10 mm ；
（ 3 ） 将 LED 芯片 9 装夹于下夹具 5 的上表面，同时将荧光膜片 8 放置于 LED 芯片 9 的上方；
（ 4 ） 进给装置 16 控制 只上压模向下运动，使上压模和下压模相互靠近 ，只移动上压模或下压模的进给速度控制在 10 cm/s ，同时测力装置 14 时实测量合模力；
（ 5 ） 上夹具 3 靠近下夹具 5 ，过程参见图 5a ；上夹具 3 与荧光膜片 8 接触，并开始挤压下夹具 5 ，过程参见图 5b ，合模力出现第一个拐点，弹性支撑结构 10 被不断压缩，下夹具 5 的底面不断靠近发热的下压模主体 6 的上表面；
（ 6 ） 下夹具 5 的底面接触发热的下压模主体 6 的上表面，过程参见图 5c ，合模力出现第二个拐点，进给装置 16 加压到 2000 Pa ；
（ 7 ） 在第二个合模力拐点出现时将上压模和下压模的温度升高到 122 ℃ ，保温保压 3min ，进给装置 16 控制上压模和下压模分离，取下模压好的 LED 芯片，完成模压工序。
模压得到的带荧光膜片的 CSP 产品厚度均一，荧光粉浓度分布均匀，空间光色分布良好，未出现因荧光膜片过热造成的工艺缺陷。
实施例 3
该实施例采用的装置中，弹性支持结构为弹簧片，弹簧片沿压模方向的刚度为 20N/cm ；弹簧片 连接下夹具 5 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 5% ， 弹簧片 连接下压模主体 6 的接触为线接触，接触面积为下压模主体 6 的上表面面积的 5% ；合模时，下夹具 5 的底面和下压模主体 6 的上表面的接触面积为下夹具 5 的下底面面积的 93% 。
采用上述的一种防过热 CSP 荧光膜片模压装置实现 CSP 荧光膜片模压。
（ 1 ） 上压模、下压模的加热装置启动，压模预热，维持温度在 80 ℃ ；
（ 2 ） 上夹具 3 与下夹具 5 通过进给装置 16 控制分离，下夹具 5 和下压模主体 6 通过弹性支撑结构分离 8 mm ；
（ 3 ） 将 LED 芯片 9 装夹于下夹具 5 的上表面，同时将荧光膜片 8 放置于 LED 芯片 9 的上方；
（ 4 ） 进给装置 16 控制 只下压模向上运动，使上压模和下压模相互靠近 ，只移动上压模或下压模的进给速度控制在 8 cm/s ，同时测力装置 14 时实测量合模力；
（ 5 ） 上夹具 3 靠近下夹具 5 ，过程参见图 5a ；上夹具 3 与荧光膜片 8 接触，并开始挤压下夹具 5 ，过程参见图 5b ，合模力出现第一个拐点，弹性支撑结构 10 被不断压缩，下夹具 5 的底面不断靠近发热的下压模主体 6 的上表面；
（ 6 ） 下夹具 5 的底面接触发热的下压模主体 6 的上表面，过程参见图 5c ，合模力出现第二个拐点，进给装置 16 加压到 1800 Pa ；
（ 7 ） 在第二个合模力拐点出现时将上压模和下压模的温度升高到 120 ℃ ，保温保压 3min ，进给装置 16 控制上压模和下压模分离，取下模压好的 LED 芯片，完成模压工序。
模压得到的带荧光膜片的 CSP 产品厚度均一，荧光粉浓度分布均匀，空间光色分布良好，未出现因荧光膜片过热造成的工艺缺陷。
如上所述便可较好的实现本发明。

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  1. 一种防过热 CSP 荧光膜片模压装置，其特征在于，包括机架（ 12 ）、压模装置（ 13 ）、测力装置（ 14 ）、控制装置（ 15 ）和进给装置（ 16 ）；所述压模装置（ 13 ）在机架（ 12 ）内，测力装置（ 14 ）设置在压模装置（ 13 ）的底部；控制装置（ 15 ）和进给装置（ 16 ）设置在机架（ 12 ）外；所述测力装置（ 14 ）采用测力传感器和采集卡实现；所述进给装置（ 16 ）采用电机丝杆驱动、气压驱动或液压驱动实现；所述控制装置（ 15 ）采用闭环伺服控制系统和工业计算机实现。
    所述压模装置（ 13 ）包括上压模、上夹具（ 3 ）、下压模、导柱（ 4 ）、弹性支撑结构（ 10 ）和下夹具（ 5 ）；
    所述上压模包括上压模主体（ 1 ）和上压模加热装置（ 2 ）；所述下压模包括下压模主体（ 6 ）和下压模加热装置（ 7 ）；所述上压模加热装置（ 2 ）设置在上压模主体（ 1 ）内，压模时对上压模主体（ 1 ）进行加热；所述下压模加热装置（ 7 ）设置在下压模主体（ 6 ）内，压模时对下压模主体（ 6 ）进行加热；
    所述上夹具（ 3 ）固定在上压模主体（ 1 ）的靠近下夹具（ 5 ）的侧面上；所述下夹具（ 5 ）与下压模主体（ 6 ）通过弹性支撑结构（ 10 ）连接；未合模时，所述弹性支撑结构（ 10 ）未受合模力，分离下夹具（ 5 ）的底面与下压模主体（ 6 ）的上表面；合模时，所述弹性支撑结构（ 10 ）受合模力，收缩变形使得下夹具（ 5 ）的底面与下压模主体（ 6 ）的上表面接触；所述下夹具（ 5 ）的上表面是光滑的表面；
    所述上压模和下压模安装在导柱（ 4 ）上，通过进给装置（ 16 ）的控制，上压模或下压模在导柱（ 4 ）上运动并实现精准定位合模或分离；未合模时，上压模和下压模处于分离状态。
  2. 根据权利要求 1 所述的一种防过热 CSP 荧光膜片模压装置，其特征在于，所述上夹具（ 3 ）和下夹具（ 5 ）通过夹具两端对应互补的斜面或夹具两端安装在微型导柱上进行精准定位；测力装置（ 14 ）用于测定合模时的合模力。
  3. 根据权利要求 1 所述的一种防过热 CSP 荧光膜片模压装置，其特征在于，未合模时，下夹具（ 5 ）的底面和下压模主体（ 6 ）的上表面 分离的距离为 1~10mm ；合模时，下夹具（ 5 ）的底面和下压模主体（ 6 ）的上表面的接触面积大于下夹具（ 5 ）的下底面面积的 90% 。
  4. 根据权利要求 1 所述的一种防过热 CSP 荧光膜片模压装置，其特征在于，所述弹性支撑结构（ 10 ）连接下夹具（ 5 ）的接触为点接触或线接触，接触面积不大于下压模主体（ 6 ）的上表面面积的 5% ；弹性支撑结构（ 10 ）连接下压模主体（ 6 ）的接触为点接触或线接触，接触面积不大于下压模主体（ 6 ）的上表面面积的 5% 。
  5. 根据权利要求 1 所述的一种防过热 CSP 荧光膜片模压装置，其特征在于，所述弹性支撑结构（ 10 ）为螺旋型弹簧、弹簧片、具有弹性的原件或具有弹性的装置；所述弹性支撑结构（ 10 ）垂直于模压方向的刚度大于 1000N/cm ，沿模压方向的刚度为 10-25N/cm ，两个方向的刚度在温度变化范围小于 120 ℃时的变化值不超过 5% 。
  6. 一种基于权利要求 1~5 任一项所述装置的防过热 CSP 荧光膜片模压方法，其特征在于，包括如下步骤：
    （ 1 ）启动上压模加热装置（ 2 ）和下压模加热装置（ 7 ），对上压模主体（ 1 ）和下压模主体（ 6 ）进行预热；
    （ 2 ）将 LED 芯片装夹在下夹具（ 5 ）的上表面，同时将荧光膜片放置于 LED 芯片的上方；
    （ 3 ）进给装置（ 16 ）控制只上压模向下运动或只下压模向上运动，使上压模和下压模相互靠近，同时测力装置（ 14 ）实时测量合模力；
    （ 4 ）保持合模状态，直至实时测量的合模力出现第二个拐点时，进给装置（ 16 ）加压，同时通过加热装置使上压模主体（ 1 ）和下压模主体（ 6 ）升温，保温保压；
    （ 5 ）进给装置（ 16 ）控制上压模和下压模分离，取下模压好的 LED 芯片，完成模压。
  7. 根据权利要求 6 所述的一种防过热 CSP 荧光膜片模压方法，其特征在于，步骤（ 1 ）中，所述预热是预热至并维持温度为 78-82 ℃。
  8. 根据权利要求 6 所述的一种防过热 CSP 荧光膜片模压方法，其特征在于，步骤（ 3 ）中，只上压模向下运动或只下压模向上运动的进给速度控制为 5-10cm/s 。
  9. 根据权利要求 6 所述的一种防过热 CSP 荧光膜片模压方法，其特征在于，测力装置（ 14 ）实时测得的合模力存在两个拐点， 合模开始到第一拐点阶段为空压阶段；第一拐点到第二拐点阶段为模压弹性支撑结构阶段；第二拐点到模压结束为模压荧光膜片阶段；第二拐点为升温起始点，升温后的温度为荧光膜片融化流动温度。
  10. 根据权利要求 6 所述的一种防过热 CSP 荧光膜片模压方法，其特征在于，步骤（ 4 ）中，所述加压是加压至 1000-2000Pa ；所述升温是升温至 118-122 ℃；所述保温保压的时间为 2-3min 。
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