CN105932144B - 一种芯片级led封装设备、方法以及荧光膜制备方法 - Google Patents
一种芯片级led封装设备、方法以及荧光膜制备方法 Download PDFInfo
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- CN105932144B CN105932144B CN201610516820.5A CN201610516820A CN105932144B CN 105932144 B CN105932144 B CN 105932144B CN 201610516820 A CN201610516820 A CN 201610516820A CN 105932144 B CN105932144 B CN 105932144B
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- fluorescent powder
- chip
- support plate
- silica gel
- glue
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- 238000002360 preparation method Methods 0.000 title claims abstract description 29
- 239000012528 membrane Substances 0.000 title abstract description 19
- 238000000034 method Methods 0.000 title abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 46
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 30
- 239000000741 silica gel Substances 0.000 claims abstract description 30
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 30
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 239000012744 reinforcing agent Substances 0.000 claims abstract description 10
- 239000007787 solid Substances 0.000 claims description 9
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 5
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 230000000630 rising effect Effects 0.000 claims 2
- 238000002156 mixing Methods 0.000 abstract description 8
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 31
- 229960001866 silicon dioxide Drugs 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 10
- 239000003795 chemical substances by application Substances 0.000 description 6
- 238000001723 curing Methods 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 239000003463 adsorbent Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610516820.5A CN105932144B (zh) | 2016-07-03 | 2016-07-03 | 一种芯片级led封装设备、方法以及荧光膜制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610516820.5A CN105932144B (zh) | 2016-07-03 | 2016-07-03 | 一种芯片级led封装设备、方法以及荧光膜制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN105932144A CN105932144A (zh) | 2016-09-07 |
CN105932144B true CN105932144B (zh) | 2018-05-01 |
Family
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CN201610516820.5A Active CN105932144B (zh) | 2016-07-03 | 2016-07-03 | 一种芯片级led封装设备、方法以及荧光膜制备方法 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106449513B (zh) * | 2016-11-11 | 2023-04-21 | 华南理工大学 | 一种防过热csp荧光膜片模压装置及方法 |
CN107546220A (zh) * | 2017-02-28 | 2018-01-05 | 江苏罗化新材料有限公司 | Led光源及其制备方法 |
CN108417683A (zh) * | 2018-01-22 | 2018-08-17 | 东莞中之光电股份有限公司 | 一种倒裝led汽车灯的封装方法 |
CN108922954A (zh) * | 2018-06-25 | 2018-11-30 | 江苏罗化新材料有限公司 | 一种双层膜cspled制作方法 |
CN115505331A (zh) * | 2022-08-29 | 2022-12-23 | 重庆翰博显示科技研发中心有限公司 | 一种发光对比度高的荧光膜制备方法及其装置 |
CN116694235A (zh) * | 2023-05-31 | 2023-09-05 | 深圳市华笙光电子有限公司 | 一种led灯专用封装胶的生产方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165797A (zh) * | 2013-03-13 | 2013-06-19 | 上海大学 | 白光led薄膜封装用荧光粉预制薄膜及其制备方法 |
CN104425689A (zh) * | 2013-08-19 | 2015-03-18 | 人科机械有限公司 | 供膜及贴膜装置、具有该装置的半导体芯片封装件制造装置以及半导体芯片封装件制造方法 |
CN104979453A (zh) * | 2014-04-08 | 2015-10-14 | 刘胜 | 在晶圆上封装直接白光led芯片的设备 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7851819B2 (en) * | 2009-02-26 | 2010-12-14 | Bridgelux, Inc. | Transparent heat spreader for LEDs |
CN103666367B (zh) * | 2012-09-19 | 2015-06-17 | 广东恒大新材料科技有限公司 | 一种led有机硅灌封胶及其应用 |
-
2016
- 2016-07-03 CN CN201610516820.5A patent/CN105932144B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165797A (zh) * | 2013-03-13 | 2013-06-19 | 上海大学 | 白光led薄膜封装用荧光粉预制薄膜及其制备方法 |
CN104425689A (zh) * | 2013-08-19 | 2015-03-18 | 人科机械有限公司 | 供膜及贴膜装置、具有该装置的半导体芯片封装件制造装置以及半导体芯片封装件制造方法 |
CN104979453A (zh) * | 2014-04-08 | 2015-10-14 | 刘胜 | 在晶圆上封装直接白光led芯片的设备 |
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CN105932144A (zh) | 2016-09-07 |
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Denomination of invention: The invention relates to a chip level LED packaging device, method and preparation method of fluorescent film Effective date of registration: 20201119 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2020980008267 |
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Date of cancellation: 20211125 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2020980008267 |
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Denomination of invention: Chip level LED packaging equipment, method and fluorescent film preparation method Effective date of registration: 20211126 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2021980013340 |
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Date of cancellation: 20211214 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2021980013340 |
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Denomination of invention: Chip level LED packaging equipment, method and fluorescent film preparation method Effective date of registration: 20211215 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2021980015047 |
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Date of cancellation: 20221115 Granted publication date: 20180501 Pledgee: Jiangsu Nantong Rural Commercial Bank Co.,Ltd. TongZhou sub branch Pledgor: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. Registration number: Y2021980015047 |
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Effective date of registration: 20230418 Address after: No. 30, Xingyu Road, Development Zone, Nantong, Jiangsu 226010 Patentee after: Luohuaxin display technology development (Jiangsu) Co.,Ltd. Address before: 226300 No. 299, Xingyuan Road, high tech Zone, Nantong City, Jiangsu Province Patentee before: JIANGSU LUOHUA NEW MATERIAL Co.,Ltd. |