CN106684231B - 一种csp芯片级封装件及封装方法 - Google Patents
一种csp芯片级封装件及封装方法 Download PDFInfo
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- CN106684231B CN106684231B CN201611256188.1A CN201611256188A CN106684231B CN 106684231 B CN106684231 B CN 106684231B CN 201611256188 A CN201611256188 A CN 201611256188A CN 106684231 B CN106684231 B CN 106684231B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 238000000034 method Methods 0.000 title claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 28
- 239000000843 powder Substances 0.000 claims abstract description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000007711 solidification Methods 0.000 claims abstract description 8
- 230000008023 solidification Effects 0.000 claims abstract description 8
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 36
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 24
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 18
- 238000002360 preparation method Methods 0.000 claims description 16
- 239000000463 material Substances 0.000 claims description 13
- 229960000583 acetic acid Drugs 0.000 claims description 12
- 239000012362 glacial acetic acid Substances 0.000 claims description 12
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 11
- 238000001027 hydrothermal synthesis Methods 0.000 claims description 9
- WWILHZQYNPQALT-UHFFFAOYSA-N 2-methyl-2-morpholin-4-ylpropanal Chemical compound O=CC(C)(C)N1CCOCC1 WWILHZQYNPQALT-UHFFFAOYSA-N 0.000 claims description 8
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 claims description 7
- 230000008020 evaporation Effects 0.000 claims description 7
- 238000001704 evaporation Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000002518 antifoaming agent Substances 0.000 claims description 6
- 239000012948 isocyanate Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 5
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 239000013530 defoamer Substances 0.000 claims description 3
- 239000008367 deionised water Substances 0.000 claims description 3
- 229910021641 deionized water Inorganic materials 0.000 claims description 3
- 239000011261 inert gas Substances 0.000 claims description 3
- 238000010792 warming Methods 0.000 claims description 3
- 241000196324 Embryophyta Species 0.000 claims description 2
- 244000061406 Indigofera viscosa Species 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- BDZBKCUKTQZUTL-UHFFFAOYSA-N triethyl phosphite Chemical group CCOP(OCC)OCC BDZBKCUKTQZUTL-UHFFFAOYSA-N 0.000 claims description 2
- 239000007788 liquid Substances 0.000 claims 3
- 150000004985 diamines Chemical class 0.000 claims 1
- 238000001802 infusion Methods 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 238000009877 rendering Methods 0.000 abstract description 4
- 241001062009 Indigofera Species 0.000 abstract description 2
- 238000005516 engineering process Methods 0.000 description 11
- 238000005538 encapsulation Methods 0.000 description 9
- 238000012360 testing method Methods 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000011160 research Methods 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 229940106691 bisphenol a Drugs 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- 244000247747 Coptis groenlandica Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical group [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000005424 photoluminescence Methods 0.000 description 1
- -1 polyoxy Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Abstract
Description
Claims (5)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201611256188.1A CN106684231B (zh) | 2016-12-30 | 2016-12-30 | 一种csp芯片级封装件及封装方法 |
PCT/CN2017/110638 WO2018121104A1 (zh) | 2016-12-30 | 2017-11-13 | 一种csp芯片级封装件及封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201611256188.1A CN106684231B (zh) | 2016-12-30 | 2016-12-30 | 一种csp芯片级封装件及封装方法 |
Publications (2)
Publication Number | Publication Date |
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CN106684231A CN106684231A (zh) | 2017-05-17 |
CN106684231B true CN106684231B (zh) | 2018-08-21 |
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Family Applications (1)
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CN201611256188.1A Active CN106684231B (zh) | 2016-12-30 | 2016-12-30 | 一种csp芯片级封装件及封装方法 |
Country Status (2)
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CN (1) | CN106684231B (zh) |
WO (1) | WO2018121104A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN106684231B (zh) * | 2016-12-30 | 2018-08-21 | 江苏稳润光电有限公司 | 一种csp芯片级封装件及封装方法 |
CN113637439B (zh) * | 2021-08-03 | 2022-11-18 | 四川天邑康和通信股份有限公司 | 应用于光模块核心光器件封装的胶水及其制备方法 |
CN113956839B (zh) * | 2021-11-05 | 2023-06-13 | 南京科矽新材料科技有限公司 | 一种大功率led倒装芯片封装用荧光膜粘接剂 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102827342B (zh) * | 2012-02-03 | 2014-06-04 | 黑龙江省科学院石油化学研究院 | 含有环氧基的异氰酸酯化丙烯酸酯单体的应用 |
CN103012747A (zh) * | 2012-12-28 | 2013-04-03 | 艾达索高新材料无锡有限公司 | 可降解混合多胺类环氧树脂固化剂、制备及其复合材料回收 |
CN103390719A (zh) * | 2012-05-09 | 2013-11-13 | 五邑大学 | 一种用于白光led模组芯片的荧光膜 |
CN102637792A (zh) * | 2012-05-14 | 2012-08-15 | 上海祥羚光电科技发展有限公司 | 一种白光led用荧光粉预制薄膜的制备方法 |
CN103094461B (zh) * | 2013-01-08 | 2016-03-30 | 江苏脉锐光电科技有限公司 | 光学波长转换组件、其制备方法及白光发光装置 |
CN103123950B (zh) * | 2013-02-06 | 2016-01-20 | 深圳市蓝科电子有限公司 | 一种led光源的封装结构及封装方法 |
CN103311417A (zh) * | 2013-06-04 | 2013-09-18 | 左洪波 | 一种大功率led荧光粉涂覆方法 |
CN104031642B (zh) * | 2014-06-24 | 2016-03-30 | 山西大学 | 一种荧光碳量子点及其制备方法和应用 |
CN104253194A (zh) * | 2014-09-18 | 2014-12-31 | 易美芯光(北京)科技有限公司 | 一种芯片尺寸白光led的封装结构及方法 |
JP6398626B2 (ja) * | 2014-11-07 | 2018-10-03 | 日亜化学工業株式会社 | 発光装置の製造方法 |
CN105990503A (zh) * | 2015-02-04 | 2016-10-05 | 晶能光电(江西)有限公司 | 一种白光led芯片的制备方法 |
CN104868041B (zh) * | 2015-06-10 | 2017-08-11 | 吉林大学 | 全碳基量子点混合荧光粉led及其制备方法 |
CN105244427B (zh) * | 2015-10-08 | 2018-06-15 | 五邑大学 | 一种白光led荧光膜以及基于荧光膜的led |
CN105304793B (zh) * | 2015-10-08 | 2018-01-16 | 五邑大学 | 一种隔离式液体封装led及其制备方法 |
CN106047281A (zh) * | 2016-05-27 | 2016-10-26 | 李红玉 | 一种电力电子器件用密封胶 |
CN106098903A (zh) * | 2016-08-03 | 2016-11-09 | 深圳市兆驰节能照明股份有限公司 | 多面出光csp光源及其制造方法 |
CN106684231B (zh) * | 2016-12-30 | 2018-08-21 | 江苏稳润光电有限公司 | 一种csp芯片级封装件及封装方法 |
-
2016
- 2016-12-30 CN CN201611256188.1A patent/CN106684231B/zh active Active
-
2017
- 2017-11-13 WO PCT/CN2017/110638 patent/WO2018121104A1/zh active Application Filing
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Publication number | Publication date |
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CN106684231A (zh) | 2017-05-17 |
WO2018121104A1 (zh) | 2018-07-05 |
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PB01 | Publication | ||
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip scale package (CSP) piece and package method Effective date of registration: 20190520 Granted publication date: 20180821 Pledgee: The Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch of science and technology Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: 2019990000450 |
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Date of cancellation: 20210629 Granted publication date: 20180821 Pledgee: The Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch of science and technology Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: 2019990000450 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A CSP chip level package and its packaging method Effective date of registration: 20210706 Granted publication date: 20180821 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2021320000116 |
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Date of cancellation: 20230626 Granted publication date: 20180821 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2021320000116 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A CSP chip level packaging component and packaging method Effective date of registration: 20230807 Granted publication date: 20180821 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2023980051059 |
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Granted publication date: 20180821 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2023980051059 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A CSP chip level package and packaging method Granted publication date: 20180821 Pledgee: Bank of Jiangsu Limited by Share Ltd. Zhenjiang branch Pledgor: JIANGSU WENRUN OPTOELECTRONIC Co.,Ltd. Registration number: Y2024980035799 |