WO2018053873A1 - 电子调速器及具有该电子调速器的云台、无人飞行器 - Google Patents

电子调速器及具有该电子调速器的云台、无人飞行器 Download PDF

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Publication number
WO2018053873A1
WO2018053873A1 PCT/CN2016/100206 CN2016100206W WO2018053873A1 WO 2018053873 A1 WO2018053873 A1 WO 2018053873A1 CN 2016100206 W CN2016100206 W CN 2016100206W WO 2018053873 A1 WO2018053873 A1 WO 2018053873A1
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WO
WIPO (PCT)
Prior art keywords
metal casing
upper metal
housing
casing
electronic governor
Prior art date
Application number
PCT/CN2016/100206
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English (en)
French (fr)
Inventor
张梁
周长兴
肖乐
Original Assignee
深圳市大疆创新科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳市大疆创新科技有限公司 filed Critical 深圳市大疆创新科技有限公司
Priority to PCT/CN2016/100206 priority Critical patent/WO2018053873A1/zh
Priority to CN201680004620.XA priority patent/CN107439059B/zh
Publication of WO2018053873A1 publication Critical patent/WO2018053873A1/zh

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Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02P—CONTROL OR REGULATION OF ELECTRIC MOTORS, ELECTRIC GENERATORS OR DYNAMO-ELECTRIC CONVERTERS; CONTROLLING TRANSFORMERS, REACTORS OR CHOKE COILS
    • H02P29/00—Arrangements for regulating or controlling electric motors, appropriate for both AC and DC motors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/06—Hermetically-sealed casings
    • H05K5/064—Hermetically-sealed casings sealed by potting, e.g. waterproof resin poured in a rigid casing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]

Definitions

  • the invention relates to an electronic governor, and a cloud platform and an unmanned aerial vehicle having the electronic governor.
  • the electronic governor is mainly used in models such as model airplanes, car models, ship models, flying saucers, and flying discs. These models drive the motor rotation through electronic governors.
  • the complexity of the environment in which these models are used makes the environment of the motor more and more used. Harsh, this also requires its supporting electronic governor to withstand the erosion of these harsh environments, with good protection.
  • the protection performance of the electronic governor, especially the control circuit board of the electronic governor is resistant to water, dust, corrosion and corrosion.
  • An electronic governor comprising an upper metal housing; a lower metal housing abutting the upper metal housing to jointly form a housing; a control circuit board mounted in the housing, the control circuit board An electronic component is disposed thereon; and a potting material is filled in a gap between the housing and the control circuit board; wherein heat generated by the electronic component on the control circuit board is conducted through the potting material To the housing.
  • An unmanned aerial vehicle comprising: a frame; a motor mounted on the frame for providing flight power to the unmanned aerial vehicle; and an electronic governor electrically connected to the motor for controlling the
  • the electronic speed governor includes: an upper metal housing; a lower metal housing that interfaces with the upper metal housing to collectively form a housing; and a control circuit board mounted to the housing In the body, the control circuit board is provided with electronic components; and a potting material is filled in a gap between the housing and the control circuit board; heat generated by the electronic components on the control circuit board passes through The potting material is conducted to the housing.
  • a pan/tilt head comprising: a rotating shaft mechanism provided with a rotating shaft; a motor coupled to the rotating shaft for driving the rotating shaft; and an electronic governor electrically connected to the motor for controlling the motor
  • the electronic speed governor includes: an upper metal housing; a lower metal housing abutting the upper metal housing to jointly form a housing; and a control circuit board mounted in the housing
  • the control circuit board is provided with electronic components; and a potting material is filled in a gap between the housing and the control circuit board; heat generated by the electronic components on the control circuit board passes through the irrigation A sealing material is conducted to the housing.
  • the electronic governor of the present invention fills the entire casing with a potting material, so that the potting material wraps the control circuit board, and the potting material is realized together with the casing. Double protection of the control board.
  • FIG. 1 is a perspective view of an electronic governor according to a first embodiment of the present invention.
  • Figure 2 is an exploded view of the electronic governor shown in Figure 1.
  • FIG. 3 is a perspective view showing another angle of the upper metal casing of the electronic governor shown in FIG. 2.
  • FIG. 4 is a perspective view of the seal of the electronic governor shown in FIG. 2.
  • Fig. 5 is a cross-sectional view showing an electronic governor according to a second embodiment of the present invention.
  • Fig. 6 is a schematic view showing the structure of an unmanned aerial vehicle equipped with the electronic governor of the present invention.
  • Fig. 7 is a schematic structural view of a pan/tilt head including the electronic governor of the present invention.
  • Electronic governor 100 100a case 1 Upper metal housing 11 First surface 111 Second surface 112 First groove 1121 First end face 113 First escape hole 1131 Second end face 114 Third escape hole 1141 Fifth escape hole 1142 Filling hole 115 Overflow hole 116 Lower metal shell 12 Third surface 121 Fourth surface 122 Second groove 1221 Third end 123 Second escape hole 1231 Fourth end 124 Fourth escape hole 1241 Six avoidance hole 1242 Cavity 13 First perforation 14 Second perforation 15 Third perforation 16 Card slot 17 Fixed column 18 Heat dissipation structure 2 Heat sink fin twenty one Vent twenty two Seals 3 First seal segment 31 First seal 311 Connection segment 312 Second seal segment 32 Third sealing section 33 Second seal 331 Third seal 332 Fourth seal segment 34 Potting structure 4 Potting material 41 Control board 5 Electronic component 51 capacitance 6 wire 7 Thermal adhesive 8 Unmanned aerial vehicle 200 frame 210 Motor 220 Yuntai 300 Rotary shaft mechanism 310 Rotating shaft 311 Motor 320
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or the component can be present.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • An embodiment of the present invention provides an electronic governor including an upper metal housing, a lower metal housing that interfaces with the upper metal housing to collectively form a housing, and a control circuit board mounted in the housing.
  • the control circuit board is provided with an electronic component, the electronic component includes a MOS tube, and a potting material filled in a gap between the housing and the circuit board; wherein the control circuit board Heat generated by the electronic component is conducted to the housing through the potting material.
  • the electronic governor can be applied to equipment such as a cloud platform and an unmanned aerial vehicle, and is used for controlling and adjusting parameters such as the rotational speed and steering of the motor.
  • An embodiment of the present invention further provides an unmanned aerial vehicle comprising: a frame; a motor mounted on the frame for providing flight power to the unmanned aerial vehicle; and an electronic governor electrically coupled to the motor a connection for controlling a rotational speed of the motor; wherein the electronic governor includes an upper metal casing; a lower metal casing abutting the upper metal casing to jointly form a casing; and a control circuit board Installed in the housing, the control circuit board is provided with electronic components; and a potting material is filled in a gap between the housing and the control circuit board; the electronics on the control circuit board Heat generated by the element is conducted to the housing through the potting material.
  • the embodiment of the present invention further provides a pan/tilt head, comprising: a rotating shaft mechanism, a rotating shaft; a motor coupled to the rotating shaft for driving the rotating shaft; and an electronic governor electrically connected to the motor;
  • the electronic governor is configured to control an electric speed of the motor; wherein the electronic governor comprises: an upper metal casing; a lower metal casing abutting the upper metal casing to jointly form a casing; a control circuit board, the installation In the housing, the control circuit board is provided with electronic components; and a potting material is filled in a gap between the housing and the control circuit board; electronic components on the control circuit board are generated Heat is conducted to the housing through the potting material.
  • an electronic governor 100 in Embodiment 1 of the present invention includes a housing 1 and a heat dissipation structure 2 formed on the housing 1 .
  • the heat dissipation structure 2 constitutes a part of the housing 1.
  • the heat dissipation structure 2 is integrally formed with the housing 1 .
  • the electronic governor 100 of the present embodiment further includes a control circuit board installed in the housing 1 and a capacitor electrically connected to the control circuit board, the control circuit board being mounted in the housing 1, the control Electronic components, such as MOS tubes and control chips, are provided on the circuit board to facilitate the realization of various functions of the electronic governor 100. To save space, no further details are provided herein.
  • the electronic component can abut against the inner wall of the housing 1 by a thermal conductive adhesive such as a thermal conductive silicone or the like, so that the electronic component can transfer heat to the housing 1 through the thermal conductive adhesive.
  • a thermal conductive adhesive such as a thermal conductive silicone or the like
  • the housing 1 includes an upper metal housing 11 and a lower metal housing 12 .
  • the upper metal casing 11 and the lower metal casing 12 abut each other to form the casing 1 together, and form a cavity 13 therebetween.
  • the cavity 13 is configured to receive electronic components of the electronic governor 100.
  • At least one of the upper metal casing 11 and the lower metal casing 12 is provided with the heat dissipation structure 2.
  • the upper metal casing 11 is substantially rectangular parallelepiped, but is not limited thereto. In other embodiments, the upper metal casing 11 may also have a circular shape, an elliptical shape, or the like.
  • the upper metal casing 11 includes a first surface 111, a second surface 112, a first end surface 113, and a second end surface 114.
  • the first surface 111, the first end surface 113, the second surface 112, and the second end surface 114 are sequentially connected end to end.
  • the first surface 111 and the second surface 112 are disposed opposite each other.
  • the first surface 111 faces away from the lower metal housing 12, and the second surface 112 faces the lower metal housing 12.
  • the first surface 111 is a top surface of the housing 1 .
  • the first end surface 113 and the second end surface 114 are disposed opposite to each other.
  • the first surface 111 of the upper metal casing 11 is provided with a glue filling hole 115 and a glue overflow hole 116.
  • the glue filling hole 115 and the overflow metal hole 116 penetrate through the upper metal casing 11 to be electrically connected to the cavity 13 of the casing 1 respectively.
  • the glue filling hole 115 is disposed adjacent to the first end surface 113 for filling the potting material.
  • the overflow hole 116 is disposed adjacent to the second end surface 114 for guiding wires, such as a throttle signal line and a communication line.
  • the overflow hole 116 is also used for exhausting during the filling of the glue to keep the glue filling smooth.
  • the heat dissipation structure 2 is integrally formed with the upper metal casing 11.
  • the heat dissipation structure 2 is disposed on the first surface 111 of the upper metal casing 11, but is not limited thereto. In other embodiments, the heat dissipation structure 2 may also be disposed on the upper surface. On the other surface of the metal casing 11. The heat dissipation structure 2 is located between the glue filling hole 115 and the overflow glue hole 116.
  • the heat dissipation structure 2 includes a plurality of heat dissipation fins 21 and a plurality of vents 22 .
  • the ventilation port 22 is disposed between the adjacent two heat dissipation fins 21 to isolate the adjacent heat dissipation fins 21 .
  • the vent 22 is recessed from the first surface 111 of the upper metal casing 11 toward the second surface 112 thereof.
  • Each of the heat dissipation fins 21 is perpendicular to the first surface 111.
  • the top surface of the heat dissipation fin 21 is flush with the first surface 111.
  • the plurality of the heat dissipation fins 21 are disposed in parallel with each other and are parallel to the first end surface 113 and the second end surface 114. It can be understood that in other embodiments, the plurality of the heat dissipation fins 21 may also adopt other arrangements, such as a concentric arrangement in a ring shape, a plurality of stripe arrangement in a matrix shape, and the like
  • the shape of the lower metal casing 12 is similar to the shape of the upper metal casing 11.
  • the lower metal casing 12 is substantially rectangular parallelepiped.
  • the lower metal casing 12 includes a third surface 121, a fourth surface 122, a third end surface 123, and a fourth end surface 124.
  • the third surface 121, the third end surface 123, the fourth surface 122, and the fourth end surface 124 are sequentially connected end to end.
  • the third surface 121 and the fourth surface 122 are disposed opposite each other.
  • the third surface 121 faces away from the upper metal casing 11
  • the fourth surface 122 faces the upper metal casing 11 .
  • the third surface 121 is a bottom surface of the housing 1 .
  • the third end surface 123 and the fourth end surface 124 are disposed opposite to each other.
  • a plurality of perforations are further provided on the surface of the housing 1.
  • the perforations are in communication with the cavity 13 for routing wires and capacitors.
  • the through holes are provided on opposite end faces of the casing 1.
  • At least one first escape hole 1131 is disposed on the first end surface 113 of the upper metal casing 11 .
  • the first end surface 113 of the upper metal casing 11 is provided with three first relief holes 1131.
  • the three first relief holes 1131 are arranged side by side and spaced apart from each other at a center position of the first end surface 113.
  • the first escape hole 1131 is recessed from the second surface 112 toward the first surface 111.
  • the first escape hole 1131 has a semicircular shape.
  • At least one second avoidance hole 1231 is defined in the third end surface 123 of the lower metal casing 12.
  • the third end surface 123 of the lower metal casing 12 is provided with three second relief holes 1231.
  • the three second relief holes 1231 are arranged side by side and spaced apart from each other at a center position of the third end surface 123.
  • the second escape hole 1231 is recessed from the fourth surface 122 toward the third surface 121 .
  • the second escape hole 1231 has a semicircular shape.
  • Each of the first relief holes 1131 and a corresponding second relief hole 1231 together form a first through hole 14 for threading a wire.
  • the first through hole 14 is used to thread a wire, such as a three-phase motor line.
  • the second end surface 114 of the upper metal casing 11 is provided with at least one third relief hole 1141 and a plurality of fifth relief holes 1142.
  • the number of the third escape hole 1141 and the fifth escape hole 1142 is two.
  • the two third relief holes 1141 are arranged side by side at a central position of the second end surface 114.
  • the third relief hole 1141 is recessed from the second surface 112 toward the first surface 111 .
  • the third escape hole 1141 has a semicircular shape.
  • Two of the fifth relief holes 1142 are respectively disposed at two sides of the two third relief holes 1141, that is, two of the third relief holes 1141 are located between the two of the fifth relief holes 1142.
  • the fifth escape hole 1142 is recessed from the second surface 112 toward the first surface 111.
  • the fifth escape hole 1142 has a semicircular shape.
  • the fourth end surface 124 of the lower metal casing 12 is provided with two fourth relief holes 1241 and two sixth relief holes 1242.
  • the two fourth relief holes 1241 are arranged side by side at the center of the fourth end surface 124.
  • the fourth escape hole 1241 is recessed from the fourth surface 122 toward the third surface 121 .
  • the fourth escape hole 1241 has a semicircular shape.
  • the two sixth relief holes 1242 are respectively disposed at two sides of the two second relief holes 1241, that is, the two fourth relief holes 1241 are located between the two sixth relief holes 1242.
  • the sixth escape hole 1242 is recessed from the fourth surface 122 toward the third surface 121.
  • the sixth escape hole 1242 has a semicircular shape.
  • Each of the fourth relief holes 1241 and the corresponding third relief holes 1141 form a second through hole 15 .
  • the second through hole 15 is used to penetrate a capacitor.
  • Each of the sixth relief holes 1242 and a corresponding fifth relief hole 1142 together form a third through hole 16 for threading a wire.
  • the third through hole 16 is used to pass a wire, such as a power line.
  • the electronic governor 100 further includes a seal 3 .
  • the sealing member 3 is disposed between the upper metal casing 11 and the lower metal casing 12 for sealing a gap between the upper metal casing 11 and the lower metal casing 12, and a wire and a wire A gap between the perforations on the casing 1 to achieve sealing and shielding.
  • the seal 3 is made in one piece.
  • the specific shape of the seal 3 is made according to the housing 1 and a perforation formed in the housing 1.
  • the seal 3 is substantially rectangular.
  • the seal 3 includes a first seal segment 31, a second seal segment 32, a third seal segment 33, and a fourth seal segment 34.
  • the first sealing section 31, the second sealing section 32, the third sealing section 33 and the fourth sealing section 34 are connected end to end in sequence.
  • the first sealing segment 31 and the third sealing segment 33 are both annular sealing segments disposed opposite to each other for sealing the perforations on the casing 1.
  • the second sealing segment 32 and the fourth sealing segment 34 are linear sealing segments disposed opposite to each other for sealing a gap between the upper metal casing 11 and the lower metal casing 12.
  • the first sealing segment 31 includes at least one first sealing ring 311 and at least two connecting segments 312.
  • the first sealing segment 31 includes three first sealing rings 311 and four connecting segments 312.
  • the first sealing ring 311 and the connecting segment 312 are spaced apart from each other.
  • the first sealing ring 311 is used to seal the corresponding first through holes 14 .
  • the third sealing segment 33 includes at least one second sealing ring 331 and at least one third sealing ring 332.
  • the third sealing segment 33 includes two second sealing rings 331 and two third sealing rings 332.
  • Two of the second sealing rings 331 are arranged side by side at a central position of the third sealing segment 33 for sealing the corresponding second through holes 15.
  • Two third sealing rings 332 are respectively disposed on two sides of the two second sealing rings 331 to seal the corresponding third through holes 16 .
  • the upper metal casing 11 and the lower metal casing 12 are provided with a card slot 17 for receiving the sealing member 3.
  • the second surface 112 of the upper metal casing 11 is provided with a first groove 1121.
  • the first groove 1121 is formed to be recessed from the second surface 112 , the first escape hole 1131 , the third escape hole 1141 , and the fifth escape hole 1142 toward the first surface 111 .
  • the second surface 122 of the lower metal casing 12 is provided with a second groove 1221.
  • the second groove 1221 is formed to be recessed from the fourth surface 122 , the second escape hole 1231 , the fourth escape hole 1241 , and the sixth escape hole 1242 toward the third surface 121 .
  • the first groove 1121 and the second groove 1221 together constitute the card slot 17.
  • an electronic component such as a control circuit board is mounted and housed in the cavity 13 of the casing 1 , and the sealing member 3 is locked to the lower metal casing 12 .
  • the capacitance of the electronic governor 100 is passed through the second sealing ring 331, and a part of the wires are respectively passed out from the first sealing ring 311 and the third sealing ring 332 of the sealing member 3.
  • the upper metal casing 11 is fixed to the lower metal casing 12 such that the sealing member 3 is locked in the card slot 17; a part of the wires are passed out from the overflow hole 116.
  • the electronic governor 100 of the present invention integrally forms the heat dissipation structure 2 with the casing 1 to simplify assembly and increase the size of the heat dissipation fins 21 to dissipate heat. More efficient and easier to assemble.
  • the electronic governor 100 of the present invention adopts an integral sealing member 3, which seals the gap of the casing while sealing the wire, thereby enhancing the sealing and waterproof effect.
  • Fig. 5 is a cross-sectional view showing a portion of the electronic component of the electronic governor 100a according to the second embodiment of the present invention.
  • the electronic governor 100a in the second embodiment is similar to the electronic governor 100 in the first embodiment except that the electronic governor 100a further includes a potting structure 4.
  • the potting structure 4 is formed by solidification of a potting material 41 filled into the cavity 13 of the housing 1.
  • the potting material 41 is an insulating material.
  • the potting material 41 includes one or a combination of potting glue, thermal conductive gel, and thermal grease.
  • the potting material 41 can also be formed from other combinations of materials that are thermally and protective.
  • the electronic governor 100a injects the potting material 41 from the filling hole 115 of the upper metal casing 11 into the cavity 13 until the potting material 41 overflowing from the overflow hole 116 of the upper metal casing 11, at which time the potting material 41 fills the entire cavity 13, especially the gap between the casing 1 and the control circuit board 5; solidification
  • the potting material 41 forms a potting structure 4, and the control circuit board 5, the capacitor 6 and the wires 7 and the like housed in the cavity 13 are protected by the potting structure 4 therein.
  • the control circuit board 5 is provided with electronic components 51, such as MOS tubes, control chips, etc., in order to facilitate the realization of various functions of the electronic governor 100. To save space, no further details are provided herein.
  • the electronic component 51 can be abutted against the inner wall of the casing 1 by a thermal conductive adhesive 8, for example, a thermal conductive silicone or the like, so that the electronic component 51 can transfer heat to the casing 1 through the thermal conductive adhesive 8, accelerating the electron.
  • a thermal conductive adhesive 8 for example, a thermal conductive silicone or the like
  • the heat generated by the capacitor 6 is large.
  • the capacitor 6 protrudes from the second through hole 15 outside the casing 1 to more effectively dissipate heat.
  • a plurality of fixing posts 18 are further disposed in the housing 1 of the electronic governor 100a.
  • the fixing post 18 is a heat conductive and insulating material.
  • the fixing post 18 is fixed to the inner side of the housing 1 , and the control circuit board 5 is fixed on the fixing post 18 to be spaced apart from the inner wall of the housing 1 to prevent the control circuit board 5 from occurring. Short circuit.
  • the electronic governor 100a of the present invention fills the entire casing 1 with a potting material 41 to form the potting structure 4, and the potting structure 4 is realized together with the casing 1. Double protection for electronic components such as control circuit board 5.
  • the top surface of the casing 1 simultaneously opens the filling hole 115 and the overflowing hole 116, thereby realizing the balance of the air pressure inside and outside the casing 1 to facilitate the potting.
  • Fig. 6 is a schematic view showing the structure of an unmanned aerial vehicle 200 equipped with an electronic governor 100/100a of the present invention.
  • the unmanned aerial vehicle 200 includes a frame 210, a motor 220, and the above-described electronic governor 100/100a.
  • the motor 220 is mounted on the frame 210 for providing flight power to the UAV 200.
  • the electronic governor 100/100a is electrically coupled to the motor 220 to control the rotational speed of the motor 220.
  • Fig. 7 is a schematic view showing the structure of a pan/tilt head 300 including the electronic governor 100/100a of the present invention.
  • the pan/tilt head 300 includes a spindle mechanism 310, a motor 320, and the above-described electronic governor 100/100a.
  • the rotating shaft mechanism 310 is provided with a rotating shaft 311, and the motor 320 is drivingly coupled to the rotating shaft 311 for driving the rotating shaft 311 to rotate.
  • the electronic governor 100/100a is electrically coupled to the motor 220 to control the rotational speed of the motor 220.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

一种电子调速器(100,100a)，包括上金属壳体(11)；下金属壳体(12)，与上金属壳体(11)对接，以共同形成一壳体(1)；控制电路板(5)，安装于壳体(1)内，控制电路板(5)上设有电子元件(51)，电子元件(51)包括MOS管；以及灌封材料(41)，填充于壳体(1)与控制电路板(5)之间的间隙内；其中，控制电路板(5)上的电子元件(51)产生的热量通过灌封材料(41)传导到壳体(1)。电子调速器(100,100a)将整个壳体(1)中灌满灌封材料(41)，灌封材料(41)与壳体(1)一起实现了对控制电路板(5)的双重防护。

Description

电子调速器及具有该电子调速器的云台、无人飞行器 技术领域
本发明涉及一种电子调速器，以及具有该电子调速器的云台、无人飞行器。
背景技术
电子调速器主要应用在航模、车模、船模、飞碟、飞盘等模型上，这些模型通过电子调速器来驱动电机转动，这些模型的使用环境的复杂性使的电机的使用环境越来越恶劣，这也要求其配套的电子调速器也要能够承受这些恶劣环境的侵蚀，具备良好的防护功能。然而现有技术中对电子调速器、尤其是电子调速器的控制电路板的防水防尘防腐蚀等防护性能较为忽视。
发明内容
有鉴于此，有必要提供一种防护性能好的电子调速器，以及具有该电子调速器的云台、无人飞行器。
一种电子调速器，包括上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；其中，所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
一种无人飞行器，包括：机架；电机，安装在所述机架上，用于为所述无人飞行器提供飞行动力；以及电子调速器，与所述电机电连接，用于控制所述电机的转速；其中，所述电子调速器包括，上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
一种云台，包括：转轴机构，设有转轴；电机，与所述转轴传动连接，用于带动所述转轴转动；以及电子调速器，与所述电机电连接，用于控制所述电机的转速；其中，所述电子调速器包括，上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
相较于现有技术，本发明的所述电子调速器将整个壳体中灌满灌封材料，使得所述灌封材料包裹所述控制电路板，所述灌封材料与壳体一起实现了对控制电路板的双重防护。
 附图说明
图1为本发明的实施方式一提供的电子调速器的立体示意图。
图2为图1中所示电子调速器的分解图。
图3为图2中所示电子调速器的上金属壳体另一角度的立体示意图。
图4为图2中所示电子调速器的密封件的立体示意图。
图5为本发明的实施方式二提供的电子调速器的剖面示意图。
图6为具备本发明的电子调速器的无人飞行器的结构示意图。
图7为具备本发明的电子调速器的云台的结构示意图。
主要元件符号说明
电子调速器 100、100a
壳体 1
上金属壳体 11
第一表面 111
第二表面 112
第一凹槽 1121
第一端面 113
第一避让孔 1131
第二端面 114
第三避让孔 1141
第五避让孔 1142
灌胶孔 115
溢胶孔 116
下金属壳体 12
第三表面 121
第四表面 122
第二凹槽 1221
第三端面 123
第二避让孔 1231
第四端面 124
第四避让孔 1241
第六避让孔 1242
腔体 13
第一穿孔 14
第二穿孔 15
第三穿孔 16
卡槽 17
固定柱 18
散热结构 2
散热鳍片 21
通风口 22
密封件 3
第一密封段 31
第一密封圈 311
连接段 312
第二密封段 32
第三密封段 33
第二密封圈 331
第三密封圈 332
第四密封段 34
灌封结构 4
灌封材料 41
控制电路板 5
电子元件 51
电容 6
导线 7
导热胶 8
无人飞行器 200
机架 210
电机 220
云台 300
转轴机构 310
转轴 311
电机 320
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施方式中的附图，对本发明实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式仅仅是本发明一部分实施方式，而不是全部的实施方式。基于本发明中的实施方式，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施方式的目的，不是旨在于限制本发明。本文所使用的术语“或／及”包括一个或多个相关的所列项目的任意的和所有的组合。
本发明实施方式提供一种电子调速器，包括上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件，所述电子元件包括MOS管；以及灌封材料，填充于所述壳体与所述电路板之间的间隙内；其中，所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
所述电子调速器可以应用于云台、无人飞行器等设备中，用于控制、调节电机的转速、转向等参数。
本发明实施方式还提供一种无人飞行器，包括：机架；电机，安装在所述机架上，用于为所述无人飞行器提供飞行动力；以及电子调速器，与所述电机电连接，用于控制所述电机的转速；其中，所述电子调速器包括，上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
本发明实施方式还提供一种云台，包括：转轴机构，设有转轴；电机，与所述转轴传动连接，用于带动所述转轴转动；以及电子调速器，与所述电机电连接，用于控制所述电机的转速；其中，所述电子调速器包括，上金属壳体；下金属壳体，与所述上金属壳体对接，以共同形成一壳体；控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
下面结合附图，对本发明的一些实施方式作详细说明。在不冲突的情况下，下述的实施方式及实施方式中的特征可以相互组合。
请参阅图1，本实用新型的实施方式一中的电子调速器100包括壳体1和形成于所述壳体1上的散热结构2。所述散热结构2构成该壳体1的一部分。所述散热结构2与所述壳体1一体成型。
本实施方式的所述电子调速器100还包括装设于壳体1中的控制电路板以及与控制电路板电连接的电容，该控制电路板安装在所述壳体1内，所述控制电路板上设有电子元件，如MOS管、控制芯片等，以利于实现电子调速器100的各项功能，为节省篇幅，在此不再一一赘述。
该电子元件可以通过导热胶，例如，导热硅胶等，与壳体1的内壁抵接，从而使得所述电子元件可以通过导热胶将热量传递到所述壳体1上。
请参阅图2和图3，所述壳体1包括上金属壳体11和下金属壳体12。所述上金属壳体11和所述下金属壳体12对接以共同形成所述壳体1，并与二者之间形成腔体13。所述腔体13用以收容所述电子调速器100的电子元件。所述上金属壳体11及所述下金属壳体12中的至少一个设有所述散热结构2。
在本实施方式中，所述上金属壳体11大致呈长方体，但不限于此，在其它实施方式中，所述上金属壳体11还可呈圆形、椭圆形等。所述上金属壳体11包括第一表面111、第二表面112、第一端面113和第二端面114。所述第一表面111、第一端面113、第二表面112和第二端面114依次首尾连接。所述第一表面111和第二表面112相互背对设置。所述第一表面111背向所述下金属壳体12，所述第二表面112朝向所述下金属壳体12。所述第一表面111为所述壳体1的顶面。所述第一端面113和所述第二端面114相互背对设置。
所述上金属壳体11的第一表面111上设有灌胶孔115和溢胶孔116。所述灌胶孔115和溢胶孔116贯穿所述上金属壳体11，以分别与所述壳体1的腔体13导通。所述灌胶孔115靠近所述第一端面113设置，用以灌入灌封材料。所述溢胶孔116靠近所述第二端面114设置，用以导出导线，如油门信号线和通讯线等。所述溢胶孔116还用于在灌胶时进行排气，保持灌胶顺畅。
在本实施方式中，所述散热结构2与所述上金属壳体11一体成型。在本实施方式中，所述散热结构2设于所述上金属壳体11的第一表面111上，但不限于此，在其它实施方式中，所述散热结构2也可设于所述上金属壳体11的其它表面上。所述散热结构2位于所述灌胶孔115和溢胶孔116之间。
具体地，所述散热结构2包括多个散热鳍片21和多个通风口22。所述通风22口设于相邻二散热鳍片21之间以隔离相邻的所述散热鳍片21。所述通风口22自所述上金属壳体11的第一表面111朝向其第二表面112凹陷形成的槽道。每一所述散热鳍片21垂直于所述第一表面111。所述散热鳍片21的顶面与所述第一表面111齐平。在本实施方式中，多个所述散热鳍片21相互平行设置，且平行于所述第一端面113和所述第二端面114。可以理解的，在其它实施方式中，多个所述散热鳍片21也可采用其它排列方式，如呈环形同心设置、多个条形排列呈矩阵状等。
所述下金属壳体12的形状与所述上金属壳体11的形状相似。在本实施方式中，所述下金属壳体12大致呈长方体。所述下金属壳体12包括第三表面121、第四表面122、第三端面123和第四端面124。所述第三表面121、第三端面123、第四表面122和第四端面124依次首尾连接。所述第三表面121和第四表面122相互背对设置。所述第三表面121背向所述上金属壳体11，所述第四表面122朝向所述上金属壳体11。所述第三表面121为所述壳体1的底面。所述第三端面123和所述第四端面124相互背对设置。
所述上金属壳体11和所述下金属壳体12相对固定时，所述上金属壳体11的第二表面112抵持所述下金属壳体12的第四表面122。
进一步地，所述壳体1的表面上还设有多个穿孔。该穿孔与所述腔体13相通，用以穿设导线和电容。在本实施方式中，该穿孔设于所述壳体1的相对两端面上。
具体地，所述上金属壳体11的第一端面113上设有至少一第一避让孔1131。在本实施方式中，所述上金属壳体11的第一端面113上设有三个第一避让孔1131。三个所述第一避让孔1131并排且间隔地设于所述第一端面113的中心位置。所述第一避让孔1131自所述第二表面112朝向所述第一表面111凹陷形成。在本实施方式中，所述第一避让孔1131呈半圆形。
对应地，所述下金属壳体12的第三端面123上设有至少一第二避让孔1231。在本实施方式中，所述下金属壳体12的第三端面123上设有三个第二避让孔1231。三个所述第二避让孔1231并排且间隔地设于所述第三端面123的中心位置。所述第二避让孔1231自所述第四表面122朝向所述第三表面121凹陷形成。在本实施方式中，所述第二避让孔1231呈半圆形。
每一所述第一避让孔1131与一对应的所述第二避让孔1231共同形成第一穿孔14，以穿设导线。在本实施方式中，所述第一穿孔14用以穿设导线，如电机三相线。
所述上金属壳体11的第二端面114上设有至少一第三避让孔1141和多个第五避让孔1142。在本实施方式中，所述第三避让孔1141和所述第五避让孔1142的数量均为两个。两个所述第三避让孔1141并排设于所述第二端面114的中心位置。所述第三避让孔1141自所述第二表面112朝向所述第一表面111凹陷形成。在本实施方式中，所述第三避让孔1141呈半圆形。两个所述第五避让孔1142分别设于两个所述第三避让孔1141的两侧，即，两个所述第三避让孔1141位于两个所述第五避让孔1142之间。所述第五避让孔1142自所述第二表面112朝向所述第一表面111凹陷形成。在本实施方式中，所述第五避让孔1142呈半圆形。
对应地，所述下金属壳体12的第四端面124上设有两个第四避让孔1241和两个第六避让孔1242。在本实施方式中，两个所述第四避让孔1241并排设于所述第四端面124的中心位置。所述第四避让孔1241自所述第四表面122朝向所述第三表面121凹陷形成。在本实施方式中，所述第四避让孔1241呈半圆形。两个所述第六避让孔1242分别设于两个所述第四避让孔1241的两侧，即，两个所述第四避让孔1241位于两个所述第六避让孔1242之间。所述第六避让孔1242自所述第四表面122朝向所述第三表面121凹陷形成。在本实施方式中，所述第六避让孔1242呈半圆形。
每一所述第四避让孔1241与一对应的所述第三避让孔1141共同形成第二穿孔15。在本实施方式中，所述第二穿孔15用以穿设电容。每一所述第六避让孔1242与一对应的所述第五避让孔1142共同形成第三穿孔16，用以穿设导线。在本实施方式中，所述第三穿孔16用以穿设导线，如电源线。
请参阅图2和图4，进一步地，所述电子调速器100还包括密封件3。所述密封件3设于所述上金属壳体11和所述下金属壳体12之间用以密封所述上金属壳体11和所述下金属壳体12之间的间隙，以及导线与所述壳体1上的穿孔之间的间隙，以达到密闭、防护作用。
所述密封件3一体制成。所述密封件3的具体形状是根据所述壳体1和形成于所述壳体1上的穿孔制造。在本实施方式中，所述密封件3大致呈矩形。所述密封件3包括第一密封段31、第二密封段32、第三密封段33和第四密封段34。所述第一密封段31、第二密封段32、第三密封段33和第四密封段34依次首尾连接。
所述第一密封段31和第三密封段33均为环状密封段，相对且平行设置，用以密封所述壳体1上的穿孔。所述第二密封段32和所述第四密封段34均为线状密封段，相对且平行设置，用以密封所述上金属壳体11和所述下金属壳体12之间的间隙。
具体地，所述第一密封段31包括至少一第一密封圈311和至少两个连接段312。在本实施方式中，所述第一密封段31包括三个第一密封圈311和四个连接段312。所述第一密封圈311和所述连接段312相互间隔设置。所述第一密封圈311用以密封相应的所述第一穿孔14。
所述第三密封段33包括至少一第二密封圈331和至少一第三密封圈332。在本实施方式中，所述第三密封段33包括二第二密封圈331和二第三密封圈332。两个所述第二密封圈331并排设于所述第三密封段33的中心位置，用以密封相应的所述第二穿孔15。两个所述第三密封圈332分别设于两个所述第二密封圈331的两侧，用以密封相应的所述第三穿孔16。
对应地，所述上金属壳体11及所述下金属壳体12上设有卡槽17，用以收纳所述密封件3。具体地，所述上金属壳体11的第二表面112上设有第一凹槽1121。所述第一凹槽1121自所述第二表面112、第一避让孔1131、第三避让孔1141和第五避让孔1142朝向所述第一表面111凹陷形成。对应地，所述下金属壳体12的第四表面122上设有第二凹槽1221。所述第二凹槽1221自所述第四表面122、第二避让孔1231、第四避让孔1241和第六避让孔1242朝向所述第三表面121凹陷形成。所述第一凹槽1121和所述第二凹槽1221共同构成所述卡槽17。
所述电子调速器100安装时，将控制电路板等电子元件安装并收容于所述壳体1的腔体13内，将所述密封件3卡设于所述下金属壳体12的第二凹槽1221内，使电子调速器100的电容从所述第二密封圈331中穿出，将部分导线分别从所述密封件3的第一密封圈311和第三密封圈332穿出；将所述上金属壳体11固定于所述下金属壳体12上，使所述密封件3卡设于所述卡槽17内；将部分导线从所述溢胶孔116穿出。
相较于现有技术，本发明的所述电子调速器100将所述散热结构2与所述壳体1一体制成，简化了装配，同时增大了散热鳍片21的大小，使散热效率更高，装配更加方便。本发明的所述电子调速器100采用一体式的密封件3，在密封导线的同时，也密封了所述壳体的间隙，增强了密封与防水效果。
图5为本发明的实施方式二中的电子调速器100a带有部分电子元件的剖面示意图。实施方式二中的电子调速器100a与实施方式一中的电子调速器100相似，其不同之处在于：所述电子调速器100a进一步包括灌封结构4。所述灌封结构4是由填充至所述壳体1的腔体13内的灌封材料41凝固形成。所述灌封材料41为绝缘的材料。具体地，所述灌封材料41包括灌封胶、导热凝胶和导热硅脂中的一种或几种的组合。所述灌封材料41也可由其它能导热和防护的材料组合形成。
所述电子调速器100a在形成所述灌封结构4时，将所述灌封材料41从所述上金属壳体11的灌胶孔115注入所述腔体13内直至所述灌封材料41从所述上金属壳体11的溢胶孔116溢出，此时所述灌封材料41填充整个腔体13，尤其是所述壳体1与所述控制电路板5之间的间隙；凝固所述灌封材料41形成灌封结构4，此时收容于所述腔体13内的所述控制电路板5、电容6和导线7等结构被所述灌封结构4保护其中。
所述控制电路板5上设有电子元件51，如MOS管、控制芯片等，以利于实现电子调速器100的各项功能，为节省篇幅，在此不再一一赘述。
该电子元件51可以通过导热胶8，例如，导热硅胶等，与壳体1的内壁抵接，从而使得所述电子元件51可以通过导热胶8将热量传递到所述壳体1上，加快电子元件51的散热效率。
需要说明的是，因电容6产生的热量较大，在本实施方式中，所述电容6自所述第二穿孔15部分凸出于所述壳体1外，以更加有效地进行散热。
进一步地，所述电子调速器100a的壳体1内还设有多个固定柱18。所述固定柱18为导热、绝缘的材料。所述固定柱18固定于所述壳体1的内侧，所述控制电路板5固定于所述固定柱18上，以与所述壳体1的内壁间隔设置，防止所述控制电路板5发生短路。
相较于现有技术，本发明的所述电子调速器100a将整个壳体1中灌满灌封材料41形成所述灌封结构4，所述灌封结构4与壳体1一起实现了对控制电路板5等电子元件的双重防护。同时所述壳体1的顶面同时开设灌胶孔115和溢胶孔116，实现了壳体1内外气压平衡，便于灌封的进行。
图6为具备本发明的电子调速器100/100a的无人飞行器200的结构示意图。如图6所示，所述无人飞行器200包括机架210、电机220和上述电子调速器100/100a。所述电机220安装在所述机架210上，用于为所述无人飞行器200提供飞行动力。所述电子调速器100/100a与所述电机220电连接，以控制所述电机220的转速。
图7为具备本发明的电子调速器100/100a的云台300的结构示意图。如图7所示，所述云台300包括转轴机构310、电机320和上述电子调速器100/100a。所述转轴机构310设有转轴311，所述电机320与所述转轴311传动连接，用于带动所述转轴311转动。所述电子调速器100/100a与所述电机220电连接，以控制所述电机220的转速。
以上实施方式仅用以说明本发明的技术方案而非限制，尽管参照以上较佳实施方式对本发明进行了详细说明，本领域的普通技术人员应当理解，可以对本发明的技术方案进行修改或等同替换都不应脱离本发明技术方案的精神和范围。本领域技术人员还可在本发明精神内做其它变化等用在本发明的设计，只要其不偏离本发明的技术效果均可。这些依据本发明精神所做的变化，都应包含在本发明所要求保护的范围之内。

Claims (57)

  1. 一种电子调速器，其特征在于，所述电子调速器包括
    上金属壳体；
    下金属壳体，与所述上金属壳体对接，以共同形成一壳体；
    控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及
    灌封材料，填充于所述壳体与所述控制电路板之间的间隙内；
    其中，所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
  2. 如权利要求1所述的电子调速器，其特征在于，所述上金属壳体上设有一灌胶孔，所述灌胶孔贯穿所述上金属壳体，用以向所述壳体内灌入所述灌封材料。
  3. 如权利要求2所述的电子调速器，其特征在于，所述上金属壳体上还设一溢胶孔，所述灌胶孔贯穿所述上金属壳体，用以导出部分导线和在灌胶时进行排气。
  4. 如权利要求3所述的电子调速器，其特征在于，所述灌胶孔和所述溢胶孔形成于所述上金属壳体背向所述下金属壳体的表面上，且分别靠近所述上金属壳体的两端。
  5. 如权利要求1所述的电子调速器，其特征在于，所述电子调速器还包括一密封件，所述密封件设于所述上金属壳体和所述下金属壳体之间用以密封所述上金属壳体和所述下金属壳体之间的间隙。
  6. 如权利要求1所述的电子调速器，其特征在于，所述壳体上还设有多个穿孔，所述穿孔用以穿设导线或/及电子元器件。
  7. 如权利要求6所述的电子调速器，其特征在于，所述上金属壳体的朝向所述下金属壳体的表面上设有第一凹槽，所述下金属壳体朝向所述上金属壳体的表面设有第二凹槽，所述第一凹槽和所述第二凹槽共同构成所述穿孔。
  8. 如权利要求7所述的电子调速器，其特征在于，所述电子调速器还包括一密封件，所述密封件包括设于所述上金属壳体和所述下金属壳体之间、用以密封所述上金属壳体和所述下金属壳体之间的间隙的线状密封段，以及设于所述穿孔内的环状密封段。
  9. 如权利要求8所述的电子调速器，其特征在于，所述密封件一体制成。
  10. 如权利要求6所述的电子调速器，其特征在于，其中一部分所述穿孔供所述导线穿过，另外一部分所述穿孔供电容穿过，所述电容与所述控制电路板电连接。
  11. 如权利要求1所述的电子调速器，其特征在于，所述上金属壳体及所述下金属壳体中的至少一个设有散热结构。
  12. 如权利要求11所述的电子调速器，其特征在于，所述散热结构与所述上金属壳体或所述下金属壳体一体成型。
  13. 如权利要求12所述的电子调速器，其特征在于，所述散热结构包括多个散热鳍片，所述多个散热鳍片间隔设置。
  14. 如权利要求13所述的电子调速器，其特征在于，所述散热鳍片的顶面与所述上金属壳体或所述下金属壳体的表面齐平。
  15. 如权利要求14所述的电子调速器，其特征在于，多个所述散热鳍片相互平行设置，且平行于所述壳体的端面。
  16. 如权利要求14所述的电子调速器，其特征在于，多个所述散热鳍片呈环形同心设置。
  17. 如权利要求14所述的电子调速器，其特征在于，多个所述散热鳍片为多个条形排列呈矩阵状。
  18. 如权利要求1所述的电子调速器，其特征在于，所述灌封材料包括灌封胶、导热凝胶和导热硅脂中的一种或几种的组合。
  19. 如权利要求1所述的电子调速器，其特征在于，所述壳体的内壁还固定有多个固定柱，所述电路板固定于所述固定柱上，以与所述壳体的内壁间隔设置。
  20. 一种无人飞行器，其特征在于，包括：
    机架；
    电机，安装在所述机架上，用于为所述无人飞行器提供飞行动力；以及
    电子调速器，与所述电机电连接，用于控制所述电机的转速；
    其中，所述电子调速器包括，
    上金属壳体；
    下金属壳体，与所述上金属壳体对接，以共同形成一壳体；
    控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及
    灌封材料，填充于所述壳体与所述电路板之间的间隙内；
    所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
  21. 如权利要求20所述的无人飞行器，其特征在于，所述上金属壳体上设有一灌胶孔，所述灌胶孔贯穿所述上金属壳体，用以向所述壳体内灌入所述灌封材料。
  22. 如权利要求21所述的无人飞行器，其特征在于，所述上金属壳体上还设一溢胶孔，所述灌胶孔贯穿所述上金属壳体，用以导出部分导线和在灌胶时进行排气。
  23. 如权利要求22所述的无人飞行器，其特征在于，所述灌胶孔和所述溢胶孔形成于所述上金属壳体背向所述下金属壳体的表面上，且分别靠近所述上金属壳体的两端。
  24. 如权利要求20所述的无人飞行器，其特征在于，所述电子调速器还包括一密封件，所述密封件设于所述上金属壳体和所述下金属壳体之间用以密封所述上金属壳体和所述下金属壳体之间的间隙。
  25. 如权利要求20所述的无人飞行器，其特征在于，所述壳体上还设有多个穿孔，所述穿孔用以穿设导线或/及电子元器件。
  26. 如权利要求25所述的无人飞行器，其特征在于，所述上金属壳体的朝向所述下金属壳体的表面上设有第一凹槽，所述下金属壳体朝向所述上金属壳体的表面设有第二凹槽，所述第一凹槽和所述第二凹槽共同构成所述穿孔。
  27. 如权利要求26所述的无人飞行器，其特征在于，所述电子调速器还包括一密封件，所述密封件包括设于所述上金属壳体和所述下金属壳体之间、用以密封所述上金属壳体和所述下金属壳体之间的间隙的线状密封段，以及设于所述穿孔内的环状密封段。
  28. 如权利要求27所述的无人飞行器，其特征在于，所述密封件一体制成。
  29. 如权利要求25所述的无人飞行器，其特征在于，其中一部分所述穿孔供所述导线穿过，另外一部分所述穿孔供电容穿过，所述电容与所述控制电路板电连接。
  30. 如权利要求20所述的无人飞行器，其特征在于，所述上金属壳体及所述下金属壳体中的至少一个设有散热结构。
  31. 如权利要求30所述的无人飞行器，其特征在于，所述散热结构与所述上金属壳体或所述下金属壳体一体成型。
  32. 如权利要求31所述的无人飞行器，其特征在于，所述散热结构包括多个散热鳍片，所述多个散热鳍片间隔设置。
  33. 如权利要求32所述的无人飞行器，其特征在于，所述散热鳍片的顶面与所述上金属壳体或所述下金属壳体的表面齐平。
  34. 如权利要求33所述的无人飞行器，其特征在于，多个所述散热鳍片相互平行设置，且平行于所述壳体的端面。
  35. 如权利要求33所述的无人飞行器，其特征在于，多个所述散热鳍片呈环形同心设置。
  36. 如权利要求33所述的无人飞行器，其特征在于，多个所述散热鳍片为多个条形排列呈矩阵状。
  37. 如权利要求20所述的无人飞行器，其特征在于，所述灌封材料包括灌封胶、导热凝胶和导热硅脂中的一种或几种的组合。
  38. 如权利要求20所述的无人飞行器，其特征在于，所述壳体的内壁还固定有多个固定柱，所述电路板固定于所述固定柱上，以与所述壳体的内壁间隔设置。
  39. 一种云台，其特征在于，包括：
    转轴机构，设有转轴；
    电机，与所述转轴传动连接，用于带动所述转轴转动；以及
    电子调速器，与所述电机电连接，用于控制所述电机的转速；
    其中，所述电子调速器包括，
    上金属壳体；
    下金属壳体，与所述上金属壳体对接，以共同形成一壳体；
    控制电路板，安装于所述壳体内，所述控制电路板上设有电子元件；以及
    灌封材料，填充于所述壳体与所述电路板之间的间隙内；
    所述控制电路板上的电子元件产生的热量通过所述灌封材料传导到所述壳体。
  40. 如权利要求39所述的云台，其特征在于，所述上金属壳体上设有一灌胶孔，所述灌胶孔贯穿所述上金属壳体，用以向所述壳体内灌入所述灌封材料。
  41. 如权利要求40所述的云台，其特征在于，所述上金属壳体上还设一溢胶孔，所述灌胶孔贯穿所述上金属壳体，用以导出部分导线和在灌胶时进行排气。
  42. 如权利要求41所述的云台，其特征在于，所述灌胶孔和所述溢胶孔形成于所述上金属壳体背向所述下金属壳体的表面上，且分别靠近所述上金属壳体的两端。
  43. 如权利要求39所述的云台，其特征在于，所述电子调速器还包括一密封件，所述密封件设于所述上金属壳体和所述下金属壳体之间用以密封所述上金属壳体和所述下金属壳体之间的间隙。
  44. 如权利要求39所述的云台，其特征在于，所述壳体上还设有多个穿孔，所述穿孔用以穿设导线或/及电子元器件。
  45. 如权利要求44所述的云台，其特征在于，所述上金属壳体的朝向所述下金属壳体的表面上设有第一凹槽，所述下金属壳体朝向所述上金属壳体的表面设有第二凹槽，所述第一凹槽和所述第二凹槽共同构成所述穿孔。
  46. 如权利要求45所述的云台，其特征在于，所述电子调速器还包括一密封件，所述密封件包括设于所述上金属壳体和所述下金属壳体之间、用以密封所述上金属壳体和所述下金属壳体之间的间隙的线状密封段，以及设于所述穿孔内的环状密封段。
  47. 如权利要求46所述的云台，其特征在于，所述密封件一体制成。
  48. 如权利要求44所述的云台，其特征在于，其中一部分所述穿孔供所述导线穿过，另外一部分所述穿孔供电容穿过，所述电容与所述控制电路板电连接。
  49. 如权利要求39所述的云台，其特征在于，所述上金属壳体及所述下金属壳体中的至少一个设有散热结构。
  50. 如权利要求49所述的云台，其特征在于，所述散热结构与所述上金属壳体或所述下金属壳体一体成型。
  51. 如权利要求50所述的云台，其特征在于，所述散热结构包括多个散热鳍片，所述多个散热鳍片间隔设置。
  52. 如权利要求51所述的云台，其特征在于，所述散热鳍片的顶面与所述上金属壳体或所述下金属壳体的表面齐平。
  53. 如权利要求52所述的云台，其特征在于，多个所述散热鳍片相互平行设置，且平行于所述壳体的端面。
  54. 如权利要求52所述的云台，其特征在于，多个所述散热鳍片呈环形同心设置。
  55. 如权利要求52所述的云台，其特征在于，多个所述散热鳍片为多个条形排列呈矩阵状。
  56. 如权利要求39所述的云台，其特征在于，所述灌封材料包括灌封胶、导热凝胶和导热硅脂中的一种或几种的组合。
  57. 如权利要求39所述的云台，其特征在于，所述壳体的内壁还固定有多个固定柱，所述电路板固定于所述固定柱上，以与所述壳体的内壁间隔设置。
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