WO2018038334A1 - 틸팅 스테이지 시스템 - Google Patents

틸팅 스테이지 시스템 Download PDF

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Publication number
WO2018038334A1
WO2018038334A1 PCT/KR2017/000891 KR2017000891W WO2018038334A1 WO 2018038334 A1 WO2018038334 A1 WO 2018038334A1 KR 2017000891 W KR2017000891 W KR 2017000891W WO 2018038334 A1 WO2018038334 A1 WO 2018038334A1
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WO
WIPO (PCT)
Prior art keywords
tilting
stopper
unit
moving
cam
Prior art date
Application number
PCT/KR2017/000891
Other languages
English (en)
French (fr)
Korean (ko)
Inventor
김상은
Original Assignee
한화테크윈주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한화테크윈주식회사 filed Critical 한화테크윈주식회사
Priority to CN201780052345.3A priority Critical patent/CN109643684B/zh
Publication of WO2018038334A1 publication Critical patent/WO2018038334A1/ko

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support

Definitions

  • the apparatus may further include a second stopper part disposed in the moving part so as to face the second tilting driving part.
  • the moving part may include a first stopper cam follower in contact with the first stopper part.
  • the second tilting driving part may include a second tilting cam adjusting part connected to the second tilting cam.
  • the first support 111 may support the entire tilting stage system 100.
  • the second support part 112 may be disposed to be spaced apart from the first support part 111.
  • a lifting linear guide 113 for guiding the moving part 120 when the moving part 120 moves may be disposed between the first support part 111 and the second support part 112.
  • the driver 130 may be installed on the first support part 111.
  • the driving unit 130 may be connected to the moving unit 120 to linearly move the moving unit 120 in a first direction (eg, Z direction of FIG. 2).
  • the driving unit 130 may reciprocate the moving unit 120 in the first direction.
  • the driving unit 130 may include a power generation unit 131, a linear guide unit 132, a first moving block 133, a connection bracket 134, a second moving block 135, and a lifting block 136. Can be.
  • the power generation unit 131 may include a motor or a cylinder. Hereinafter, for convenience of description, the power generating unit 131 will be described in detail with reference to the case of a motor.
  • the power generation unit 131 operates to rotate the linear guide unit 132, and the first moving block 133 may be spaced apart from the power generation unit 131.
  • the power generation unit 131 may operate in the reverse of the above.
  • the linear guide unit 132 may rotate to bring the first moving block 133 closer to the power generation unit 131.
  • the connection bracket 134 and the second moving block 135 together with the first moving block 133 may move in the moving direction of the first moving block 133.
  • the lifting block 136 on the second moving block 135 may descend.
  • the moving unit 120 and the seating stage 140 may descend with the lifting block 136.
  • the first tilting gear unit 152a may be connected to the first tilting power generating unit 151a to transmit power to the outside or change the rotation speed (or torque).
  • the first tilting gear unit 152a may include a speed reducer and may include a plurality of gears.
  • first stopper part 160a and the second stopper part 160b are the same or similar to each other, the first stopper part 160a will be described in detail with reference to the first stopper part 160a.
  • the first stopper part 160a includes a first stopper driving part 161a, a first stopper coupling 162a, a first stopper eccentric cam 163a, a first stopper brake 164a, and a first stopper cam follower guide part 161a. 165a).
  • the mounting stage body 142 may be connected to the mounting plate 141. Inside the seating stage body portion 142 may be provided with a separate heater (not shown). In this case, the heater may heat at least one of the seating stage body portion 142 and the seating plate 141.
  • connection part 144 may connect the moving part 120 and the seating stage body part 142. At this time, the connecting portion 144 may include a self-aligning bearing.
  • the elastic portion 181 may be provided in plurality.
  • the plurality of elastic parts 181 may form a pair, and the two elastic parts 181 constituting the pair may be disposed to face each other.
  • a first tilting cam follower 145, a second tilting cam follower 146, a first stopper cam follower 147, and a second stopper cam follower 148 may be disposed between the two elastic parts 181, respectively.
  • the elastic part 181 may always maintain contact between the first tilting cam 154a and the first tilting cam follower 145.
  • the seating stage 140 may set the initial position.
  • the preset position of the seating stage 140 may be checked through the sensor unit 182 or the like.
  • the second tilting cam adjustment of the first tilting cam adjusting unit 155a and the second tilting driving unit 150b of the first tilting driving unit 150a is performed.
  • the position of the mounting stage 140 may be finely adjusted through the unit 155b.
  • the lower surface of the seating stage body 142 may maintain the first tilting detection unit 171 and the second tilting detection unit 172 by fully pressing as described above.
  • the moving unit 120 may be raised or lowered or the lift unit 190 may be raised and lowered to seat the wafer on the seating plate 141. Thereafter, the wafer (not shown) may be fixed to the seating plate 141 through the suction hole 141a.
  • the first tilting detection unit 171 and the second tilting detection unit 172 may detect the flatness of the seating stage 140. Specifically, the first tilting detection unit 171 and the second tilting detection unit 172 may measure the degree of pressing the seating stage 140. For example, when the first tilting detection unit 171 initially sets the amount of pressing of the seating stage 140 to zero, the seating stage 140 indicates a negative value when pressed further than the initial stage, and the seating stage 140 If you press less than the initial value, it can represent a positive value.
  • the first stopper driver 161a may also operate to rotate the first stopper coupling 162a to rotate the first stopper eccentric cam 163a.
  • the rotation direction, the degree of rotation, and the like of the first stopper eccentric cam 163a may be determined by the operation degree of the first stopper driver 161a preset in response to the operation of the first tilting power generation unit 151a.
  • the operation of the first tilting power generating unit 151a and the first stopper driving unit 161a is stopped. Can be. At this time, the first tilting power generating unit 151a may be prevented from operating through the brake provided in the first tilting power generating unit 151a.
  • the elastic part 181 may include the first tilting cam 154a, the first tilting cam follower 145, the second tilting cam 154b, the second tilting cam follower 146, and the first.
  • the stopper eccentric cam 163a, the first stopper cam follower 147, and the second stopper eccentric cam and the second stopper cam follower 148 may be prevented from falling from each other.
  • the tilting stage system 100 can adjust the balance of the mounting stage 140 through a simple structure by having a mounting stage 140 rotated to one center.
  • the first support 111 may support the entire tilting stage system 100.
  • the second support part 112 may be disposed to be spaced apart from the first support part 111.
  • a lifting linear guide 113 for guiding the moving part 120 when the moving part 120 moves may be disposed between the first support part 111 and the second support part 112.
  • the linear guide unit 132 may guide the movement of the first moving block 133 is seated on the first moving block 133.
  • the linear guide part 132 may be formed in various forms.
  • the linear guide unit 132 may include a linear motion guide.
  • the linear guide part 132 may include a ball screw.
  • the linear guide part 132 may be connected to the power generation unit 131 and rotate according to the operation of the power generation unit 131.
  • the linear guide unit 132 will be described in detail with reference to a case including a ball screw.
  • the first moving block 133 may be installed to linearly move in the linear guide part 132. In this case, the first moving block 133 may move as the linear guide part 132 rotates or the position thereof changes.
  • connection bracket 134 may connect the first moving block 133 and the second moving block 135.
  • a plurality of connection brackets 134 may be provided on both side surfaces of the first moving block 133.
  • the linear guide unit 132 may rotate to linearly move the first moving block 133.
  • the moving unit 120 may descend.
  • the moving unit 120 may move up and down.
  • the power generation unit 131 may operate in the reverse of the above.
  • the linear guide unit 132 may rotate to bring the first moving block 133 closer to the power generation unit 131.
  • the connection bracket 134 and the second moving block 135 together with the first moving block 133 may move in the moving direction of the first moving block 133.
  • the lifting block 136 on the second moving block 135 may descend.
  • the moving unit 120 and the seating stage 140 may descend with the lifting block 136.
  • the first lift body 191 may be formed with a hole such that the seating stage 140 is disposed therein.
  • the second lift body 192 may be connected to the first lift body 191 to be bent to the lower surface of the first lift body 191. In this case, the second lift body 192 may be partially bent to be parallel to the moving part 120.
  • the lift pin unit 193 may be disposed on the second lift body unit 192. In this case, the lift pin unit 193 may be disposed to protrude from the second lift body unit 192 to the lower side of the mounting stage 140 to penetrate the mounting stage 140.
  • the second lift body 192 and the lift pin 193 may be provided in plurality. In this case, the plurality of lift pins 193 may be arranged to form the same angle with each other.
  • the lift pin unit 193 as described above may be provided with a sensor to detect when the member is seated on the lift pin unit 193.
  • the sensor may generate a signal according to direct contact, and may be configured in the form of a dog sensor to detect a member.
  • FIG. 4 is a perspective view illustrating a moving part, a first tilting driver, a second tilting driver, a first stopper part, and a second stopper part shown in FIG. 1.
  • FIG. 5 is a perspective view illustrating the first tilting driver illustrated in FIG. 4.
  • FIG. 6 is a perspective view illustrating a first stopper unit illustrated in FIG. 4.
  • 7 is a perspective view showing the mounting stage shown in FIG.
  • FIG. 8 is a cross-sectional view illustrating a seating stage illustrated in FIG. 7.
  • the moving unit 120 may be provided with a lift driving unit 183 for raising and lowering the lift unit 190.
  • the lift driving unit 183 may include a motor or a cylinder.
  • the lift driving unit 183 will be described in detail with reference to a case including a motor for convenience of description.
  • the first tilting driver 150a and the second tilting driver 150b may tilt the seating stage 140.
  • the first tilting driving part 150a and the second tilting driving part 150b may form a predetermined angle with respect to the point where the seating stage 140 and the moving part 120 are connected to each other.
  • the first tilting driving part 150a and the second tilting driving part 150b may form a right angle with respect to the point where the seating stage 140 and the moving part 120 are connected.
  • the first tilting driver 150a and the second tilting driver 150b are the same or similar to each other, the first tilting driver 150a will be described in detail with reference to the first tilting driver 150a.
  • the elastic part 181 may be disposed between the moving part 120 and the seating stage body part 142 to connect the moving part 120 and the seating stage body part 142. At this time, the elastic portion 181 may be in a state in which a tensile force is applied to pull the moving portion 120 and the seating stage body portion 142 to each other.
  • the second tilting driving unit 150b and the second stopper unit 160b may also operate in the same or similar manner.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
PCT/KR2017/000891 2016-08-26 2017-01-25 틸팅 스테이지 시스템 WO2018038334A1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201780052345.3A CN109643684B (zh) 2016-08-26 2017-01-25 倾斜承载台系统

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020160109549A KR102563272B1 (ko) 2016-08-26 2016-08-26 틸팅 스테이지 시스템
KR10-2016-0109549 2016-08-26

Publications (1)

Publication Number Publication Date
WO2018038334A1 true WO2018038334A1 (ko) 2018-03-01

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ID=61245116

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Application Number Title Priority Date Filing Date
PCT/KR2017/000891 WO2018038334A1 (ko) 2016-08-26 2017-01-25 틸팅 스테이지 시스템

Country Status (3)

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KR (1) KR102563272B1 (zh)
CN (1) CN109643684B (zh)
WO (1) WO2018038334A1 (zh)

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Publication number Priority date Publication date Assignee Title
CN113629001B (zh) * 2020-05-09 2024-05-14 长鑫存储技术有限公司 一种载台装置
CN113830700A (zh) * 2020-06-24 2021-12-24 拓荆科技股份有限公司 水平自动调整的升降系统及方法
KR102600460B1 (ko) * 2021-08-24 2023-11-10 (주)에스에스피 캠 모듈을 이용하여 높이 조절이 가능한 웨이퍼 스테이지 장치
KR102422225B1 (ko) * 2022-01-04 2022-07-18 주식회사 블루로봇 밸런스 스테이지
WO2024014847A1 (ko) * 2022-07-12 2024-01-18 주식회사 블루로봇 밸런스 스테이지
KR102463976B1 (ko) 2022-07-12 2022-11-07 주식회사 블루로봇 수동 조정 밸런스 스테이지
KR102454629B1 (ko) 2022-07-12 2022-10-14 주식회사 블루로봇 자동 조정 밸런스 스테이지

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JPH05291382A (ja) * 1992-04-14 1993-11-05 Hitachi Techno Eng Co Ltd 薄板収納装置
KR100355878B1 (ko) * 1999-12-31 2002-10-12 아남반도체 주식회사 레티클 스테이지의 자동 기울기 조정장치
KR100381763B1 (ko) * 1993-12-28 2004-05-03 가부시키가이샤 니콘 경사조정장치,면위치조정장치,이면위치조정장치를구비한노광장치,및이들장치를이용하여제조된디바이스
KR101293273B1 (ko) * 2013-05-21 2013-08-09 최대용 웨이퍼 프리얼라이너
KR20150089491A (ko) * 2014-01-28 2015-08-05 세메스 주식회사 스테이지 유닛 및 이를 갖는 다이 본딩 장치

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KR101090333B1 (ko) * 2009-06-03 2011-12-07 주식회사 쎄믹스 척의 능동적 기울기 제어가 가능한 웨이퍼 프로브 스테이션 및 그 제어방법
KR102238998B1 (ko) 2014-07-22 2021-04-12 세메스 주식회사 스테이지 수평 조절 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05291382A (ja) * 1992-04-14 1993-11-05 Hitachi Techno Eng Co Ltd 薄板収納装置
KR100381763B1 (ko) * 1993-12-28 2004-05-03 가부시키가이샤 니콘 경사조정장치,면위치조정장치,이면위치조정장치를구비한노광장치,및이들장치를이용하여제조된디바이스
KR100355878B1 (ko) * 1999-12-31 2002-10-12 아남반도체 주식회사 레티클 스테이지의 자동 기울기 조정장치
KR101293273B1 (ko) * 2013-05-21 2013-08-09 최대용 웨이퍼 프리얼라이너
KR20150089491A (ko) * 2014-01-28 2015-08-05 세메스 주식회사 스테이지 유닛 및 이를 갖는 다이 본딩 장치

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Publication number Publication date
KR102563272B1 (ko) 2023-08-03
KR20180023739A (ko) 2018-03-07
CN109643684B (zh) 2022-11-22
CN109643684A (zh) 2019-04-16

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