WO2018025683A1 - プローブカード、及び検査方法 - Google Patents

プローブカード、及び検査方法 Download PDF

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Publication number
WO2018025683A1
WO2018025683A1 PCT/JP2017/026606 JP2017026606W WO2018025683A1 WO 2018025683 A1 WO2018025683 A1 WO 2018025683A1 JP 2017026606 W JP2017026606 W JP 2017026606W WO 2018025683 A1 WO2018025683 A1 WO 2018025683A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrode
battery
planar
electrical connection
connection body
Prior art date
Application number
PCT/JP2017/026606
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
誠 菊田
秀憲 安藤
Original Assignee
株式会社日本マイクロニクス
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日本マイクロニクス filed Critical 株式会社日本マイクロニクス
Priority to KR1020197004274A priority Critical patent/KR102143306B1/ko
Priority to EP17836789.2A priority patent/EP3495828A4/en
Priority to CN201780048540.9A priority patent/CN109564245A/zh
Priority to CA3032264A priority patent/CA3032264C/en
Priority to US16/322,461 priority patent/US20210373049A1/en
Publication of WO2018025683A1 publication Critical patent/WO2018025683A1/ja

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/0675—Needle-like
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/36—Arrangements for testing, measuring or monitoring the electrical condition of accumulators or electric batteries, e.g. capacity or state of charge [SoC]
    • G01R31/364—Battery terminal connectors with integrated measuring arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M50/00—Constructional details or processes of manufacture of the non-active parts of electrochemical cells other than fuel cells, e.g. hybrid cells
    • H01M50/20—Mountings; Secondary casings or frames; Racks, modules or packs; Suspension devices; Shock absorbers; Transport or carrying devices; Holders
    • H01M50/204—Racks, modules or packs for multiple batteries or multiple cells
    • H01M50/207—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape
    • H01M50/209—Racks, modules or packs for multiple batteries or multiple cells characterised by their shape adapted for prismatic or rectangular cells
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06744—Microprobes, i.e. having dimensions as IC details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07385—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using switching of signals between probe tips and test bed, i.e. the standard contact matrix which in its turn connects to the tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M10/00—Secondary cells; Manufacture thereof
    • H01M10/04—Construction or manufacture in general
    • H01M10/0436—Small-sized flat cells or batteries for portable equipment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • three positive terminals 40 a to 40 c are attached to the second electrode 22 of the battery 10.
  • the three positive terminals 40 a to 40 c are attached to different positions of the second electrode 22.
  • the positive terminal 40a is attached to the + Y side end of the second electrode 22
  • the positive terminal 40b is attached to the + X side end
  • the positive terminal 40c is attached to the ⁇ Y side end. It is attached.
  • one negative terminal 41 is attached to the first electrode 14 which is a negative electrode.
  • test I the discharge currents from the three positive terminals 40a to 40c are equal. A current can be taken out uniformly from all the positive terminals 40a to 40c. Further, the discharge current is substantially constant until the end of discharge. As described above, the current value D is stably extracted from the positive terminals 40a to 40c. Further, the discharge voltages of the positive terminals 40a to 40c change equally.
  • FIG. 7 is a cross-sectional view showing a configuration example 1 for connecting the battery 10 and the electrical connection body 30B.
  • a probe card 100 ⁇ / b> B is shown in which the battery 10 and the electrical connection body 30 ⁇ / b> B are connected via a conductive adhesive 35.
  • the conductive adhesive 35 is a sheet-like member having approximately the same size as the electrical connection body 30B, and bonds the battery 10 and the electrical connection body 30B.
  • the second electrode 22 and the conducting portion 34 are conducted through the conductive adhesive 35. By doing so, the current output from the battery 10 is supplied to the pad 51 via the conductive adhesive 35. Therefore, an electrical inspection can be performed appropriately.
  • FIG. 1 is a cross-sectional view schematically showing the configuration of the battery 10.
  • the battery 10 has a stacked structure in which a first electrode 14, an n-type oxide semiconductor layer 16, a charging layer 18, a p-type oxide semiconductor layer 20, and a second electrode 22 are stacked in this order (hereinafter, referred to as “the first electrode 14,” A state in which the first electrode 14 and the second electrode 22 are removed from the battery 10 is referred to as a “battery element”).
  • the second electrode 22 has a structure in which wiring can be drawn from any battery element.
  • the n-type oxide semiconductor is formed of silicon oxide and titanium dioxide.
  • the n-type oxide semiconductor material that can be used in the charge layer 18 titanium dioxide (TiO 2 ), tin oxide (SnO 2 ), or zinc oxide (ZnO) is suitable. It is also possible to use materials that combine two or all of titanium dioxide, tin oxide, and zinc oxide.
  • the charging layer 18 includes a mixture in which an insulating material and an n-type oxide semiconductor material are mixed.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
PCT/JP2017/026606 2016-08-02 2017-07-24 プローブカード、及び検査方法 WO2018025683A1 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020197004274A KR102143306B1 (ko) 2016-08-02 2017-07-24 프로브 카드 및 검사 방법
EP17836789.2A EP3495828A4 (en) 2016-08-02 2017-07-24 PROBE CARD AND INSPECTION PROCEDURE
CN201780048540.9A CN109564245A (zh) 2016-08-02 2017-07-24 探针卡和检查方法
CA3032264A CA3032264C (en) 2016-08-02 2017-07-24 Probe card and inspection method
US16/322,461 US20210373049A1 (en) 2016-08-02 2017-07-24 Probe card and inspection method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-151786 2016-08-02
JP2016151786A JP2018021779A (ja) 2016-08-02 2016-08-02 プローブカード、及び検査方法

Publications (1)

Publication Number Publication Date
WO2018025683A1 true WO2018025683A1 (ja) 2018-02-08

Family

ID=61072665

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2017/026606 WO2018025683A1 (ja) 2016-08-02 2017-07-24 プローブカード、及び検査方法

Country Status (8)

Country Link
US (1) US20210373049A1 (ko)
EP (1) EP3495828A4 (ko)
JP (1) JP2018021779A (ko)
KR (1) KR102143306B1 (ko)
CN (1) CN109564245A (ko)
CA (1) CA3032264C (ko)
TW (1) TWI632377B (ko)
WO (1) WO2018025683A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019230216A1 (ja) * 2018-05-28 2019-12-05 株式会社日本マイクロニクス 二次電池、及びその製造方法

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240047580A (ko) 2022-10-05 2024-04-12 주식회사 엘지에너지솔루션 용접이 없는 전지모듈

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10319038A (ja) * 1997-05-14 1998-12-04 Sony Corp 接触ピン
JP2007024555A (ja) * 2005-07-13 2007-02-01 Tokyo Electron Ltd プローブカード
JP2009081140A (ja) * 2008-11-10 2009-04-16 Toshiba Corp 二次電池及び二次電池の製造方法
US20130099812A1 (en) * 2011-10-21 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Probe Cards for Probing Integrated Circuits
JP2015014556A (ja) * 2013-07-08 2015-01-22 株式会社日本マイクロニクス 電気的接続装置

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ITMI20062497A1 (it) * 2006-12-22 2008-06-23 St Microelectronics Srl Cartuccia di collaudo con generazione interna dei segnali di collaudo
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CN201349212Y (zh) * 2008-12-22 2009-11-18 康佳集团股份有限公司 一种移动终端
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JP5947647B2 (ja) * 2012-07-25 2016-07-06 株式会社日本マイクロニクス プローブカード、及び検査装置
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Publication number Priority date Publication date Assignee Title
JPH10319038A (ja) * 1997-05-14 1998-12-04 Sony Corp 接触ピン
JP2007024555A (ja) * 2005-07-13 2007-02-01 Tokyo Electron Ltd プローブカード
JP2009081140A (ja) * 2008-11-10 2009-04-16 Toshiba Corp 二次電池及び二次電池の製造方法
US20130099812A1 (en) * 2011-10-21 2013-04-25 Taiwan Semiconductor Manufacturing Company, Ltd. Probe Cards for Probing Integrated Circuits
JP2015014556A (ja) * 2013-07-08 2015-01-22 株式会社日本マイクロニクス 電気的接続装置

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019230216A1 (ja) * 2018-05-28 2019-12-05 株式会社日本マイクロニクス 二次電池、及びその製造方法
JP2019207907A (ja) * 2018-05-28 2019-12-05 株式会社日本マイクロニクス 二次電池、及びその製造方法

Also Published As

Publication number Publication date
CA3032264A1 (en) 2018-02-08
KR20190029662A (ko) 2019-03-20
KR102143306B1 (ko) 2020-08-10
TW201809687A (zh) 2018-03-16
CA3032264C (en) 2020-10-20
TWI632377B (zh) 2018-08-11
CN109564245A (zh) 2019-04-02
JP2018021779A (ja) 2018-02-08
EP3495828A1 (en) 2019-06-12
EP3495828A4 (en) 2020-08-05
US20210373049A1 (en) 2021-12-02

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