WO2018001071A1 - 五金件通孔的成型方式、电子设备壳体及电子设备 - Google Patents

五金件通孔的成型方式、电子设备壳体及电子设备 Download PDF

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Publication number
WO2018001071A1
WO2018001071A1 PCT/CN2017/087798 CN2017087798W WO2018001071A1 WO 2018001071 A1 WO2018001071 A1 WO 2018001071A1 CN 2017087798 W CN2017087798 W CN 2017087798W WO 2018001071 A1 WO2018001071 A1 WO 2018001071A1
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Prior art keywords
hole
hardware
forming
side wall
convex hull
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English (en)
French (fr)
Inventor
许海平
成蛟
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES, PROFILES OR LIKE SEMI-MANUFACTURED PRODUCTS OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C23/00—Extruding metal; Impact extrusion
    • B21C23/02—Making uncoated products
    • B21C23/04—Making uncoated products by direct extrusion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D35/00—Combined processes according to or processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B21D35/002—Processes combined with methods covered by groups B21D1/00 - B21D31/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/10—Die sets; Pillar guides
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0217—Mechanical details of casings

Definitions

  • the present invention relates to the field of electronic device processing technology, and in particular, to a method for forming a through hole of a hardware, an electronic device housing prepared by the molding method, and an electronic device having the electronic device housing.
  • the metal shell side wall of electronic devices such as smart phones and tablet computers needs to be equipped with a power button, a volume button, a SIM card tray, etc., therefore, the metal shell side
  • the wall needs to be provided with a power button hole, a volume button hole, and a through hole such as a SIM card hole.
  • One of the objects of the present invention is to provide a method for forming a through hole of a hardware to solve the problem that the existing through hole processing method of the hardware causes damage to the strength of the hardware.
  • Another object of the present invention is to provide an electronic device housing for processing side holes by the above-described molding method.
  • a third object of the present invention is to provide an electronic device having the above-described electronic device housing.
  • the forming method of the through hole of the hardware firstly extrudes a convex hull structure at the opening position of the hardware, and then presses the convex hull structure in the opposite direction of the convex hull structure extrusion, and finally cuts off the end of the convex hull structure A through hole is formed in the portion.
  • An electronic device housing includes a side wall having a through hole formed therein, and the through hole is formed by forming a through hole of a hardware as described above.
  • An electronic device comprising an electronic device housing as described above.
  • FIG. 1 is a perspective view of a preform of a hardware according to a second embodiment of the present invention.
  • FIG. 2 is a perspective view of a preform of a hardware provided by Embodiment 2 of the present invention.
  • Figure 3 is a cross-sectional view of the first embodiment of the present invention when the preform is extruded
  • FIG. 4 is a cross-sectional view of the hardware semi-finished product according to the second embodiment of the present invention when it is backed up;
  • Figure 5 is a partial enlarged view of a portion A in Figure 4.
  • Figure 6 is a perspective view of the hardware after being pushed back according to the second embodiment of the present invention.
  • Figure 7 is a cross-sectional view of the back-wrapped hardware provided by the second embodiment of the present invention.
  • Figure 8 is a perspective view of the hardware of the milled through hole provided by the second embodiment of the present invention.
  • Figure 9 is a cross-sectional view showing the hardware of the milled through hole provided in the second embodiment of the present invention.
  • the present application proposes a forming method of the through hole of the hardware, the electronic device casing for processing the side hole by the forming method, and the housing of the electronic device
  • a forming method of the through hole of the hardware the electronic device casing for processing the side hole by the forming method
  • the housing of the electronic device For details of the electronic device, refer to the following embodiments.
  • a forming method of the first through hole of the hardware is proposed.
  • the forming method is: firstly forming a convex hull structure at the opening position of the hardware, and then pressing back in the opposite direction along the convex hull structure.
  • the package structure finally cuts the end of the convex hull structure to form a through hole.
  • the back extrusion processing causes the material to flow around the through hole before the through hole processing, which is equivalent to thickening the metal wall thickness around the through hole, thereby improving the strength of the through hole position hardware.
  • this embodiment proposes a molding method of a through hole of a second hardware, and the molding method includes the following steps:
  • Step A includes the following steps:
  • A1 Produce sheet metal in accordance with the size of the hardware.
  • step A1 includes the following steps:
  • A11 Calculate the size of the required metal sheet according to the size of the hardware
  • A12 The metal plate raw material is cut out by a punching die to form a metal plate before press forming.
  • the metal plate in order to improve the wear resistance of the hardware, is made of stainless steel sheet metal or aluminum alloy sheet metal, which has high wear resistance and long service life.
  • the thickness of the metal plate is selected in the range of 0.4-1.2 mm.
  • A2 The metal sheet is integrally stretched by a press forming die to form a preform 4 having vertical side walls.
  • the punch 6 and the die 7 of the press forming die collectively press the metal sheet to form a vertical side wall of the metal sheet.
  • Extrusion processing of the opening position of the side wall by the mold is performed to process the hardware semi-finished product 5 having the convex hull structure 8 on the side wall.
  • the mold in the step B and the step C includes a female mold 2 and an inner insert 3, wherein the inner wall of the female mold 2 is provided with a projection 21, and the outer wall of the insert 3 is provided with a convex portion.
  • the groove 31, the projection 21, and the groove 31 of the mating 21 match the shape of the convex hull structure 8.
  • the cross-sectional shape of the protrusion 21 and the groove 31 may be one of an elliptical shape, a square shape, or a circular shape according to the shape of the through hole 1 of the hardware.
  • the insert 3 moves downward and then moves horizontally to the left.
  • the die 2 and the insert 3 co-extrude the preform 4 in the middle, and some of the material flows toward the inside of the side wall, thereby processing the side.
  • the wall has a hardware semi-finished product 5 with a convex hull structure 8. Since the stretching process of the convex hull structure 8 causes a change in the density of the material at the fillet 9 in FIGS. 4 and 5, the appearance of the product is affected, and at the same time, the rounded corner 9 is also large, which affects the fineness of the appearance of the product.
  • the convex hull structure 8 of the hardware semi-finished product 5 is subjected to back-squeezing in the opposite direction of extrusion molding, so that the material of the rounded corner 9 can be reflowed, which is equivalent to thickening the metal wall thickness around the through hole, and the material becomes denser.
  • the fillet 9 will also be correspondingly reduced, thereby increasing the strength of the through hole position of the hardware semi-finished product 5.
  • the above-mentioned hardware semi-finished product 5 can be post-processed to obtain the final hardware product.
  • Post-treatment includes polishing, polishing, anodizing, and protective film.
  • the hardware semi-finished product 5 is ground and polished by grinding and polishing to remove excess burrs around the button hole, and it is necessary to add water at any time during the grinding and polishing process to prevent overheating.
  • the metal can be plated on the outer surface of the metal shell semi-finished product 5 by anodizing treatment or other surface treatment methods, so that the hardware presents a variety of metallic colors, enhances the coolness and diversity of the appearance of the hardware, and improves the hardware products. Market competitiveness, to meet the different needs of users, improve user experience.
  • the protective film treatment method can prevent the hardware from being corroded by the external environment and further extend the service life of the hardware.
  • the embodiment of the present invention provides a housing for an electronic device, including a side wall, and a through hole 1 is formed in the sidewall, and the through hole 1 is processed by forming a through hole of the hardware according to the first embodiment or the second embodiment. to make.
  • This embodiment also provides an electronic device including the electronic device housing.
  • the electronic device may be an electronic product such as a mobile phone or a tablet computer, and the electronic device housing may be a battery cover or a casing.
  • the through hole of the side wall includes a power hole, a volume hole, a SIM card hole, and the like, which are provided for assembling a power button, a volume button, a SIM card, and the like.
  • the electronic device casing and the electronic device thereof of the invention have high structural strength and long service life.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Punching Or Piercing (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)

Abstract

一种电子设备壳体上的五金件的通孔（1）的成型方式，其中五金件通孔（1）的成型方式为：首先在五金件的开孔位置挤压成型一个凸包结构（8），然后沿凸包结构（8）挤压成型相反的方向回挤凸包结构（8），最后切除凸包结构（8）的端部形成通孔（1）。

Description

五金件通孔的成型方式、电子设备壳体及电子设备 技术领域
本发明涉及电子设备加工技术领域，尤其涉及一种五金件通孔的成型方式、采用该成型方式制备的电子设备壳体及具有该电子设备壳体的电子设备。
背景技术
目前，五金件尤其是薄壁五金件往往在侧边需要开孔，例如智能手机、平板电脑等电子设备的金属壳侧壁需要布置电源按键、音量按键以及SIM卡托等，因此，金属壳侧壁需要开设电源按键孔、音量按键孔及SIM卡托孔等通孔。
发明内容
本发明的目的之一是提出一种五金件通孔的成型方式，以解决现有五金件通孔加工方式对五金件强度产生破坏的问题。
本发明的目的之二是提出一种采用上述成型方式加工侧孔的电子设备壳体。
本发明的目的之三是提出一种具有上述电子设备壳体的电子设备。
为达此目的，本发明采用以下技术方案：
一种五金件通孔的成型方式，首先在五金件的开孔位置挤压成型一个凸包结构，然后沿凸包结构挤压成型相反的方向回挤凸包结构，最后切除凸包结构的端部形成通孔。
一种电子设备壳体，包括侧壁，侧壁上开设有通孔，所述通孔采用如以上所述的五金件通孔的成型方式加工而成。
一种电子设备，包括如以上所述的电子设备壳体。
附图说明
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解，其中：
图1是本发明实施例二提供的五金件初坯成型时的立体图；
图2是本发明实施例二提供的五金件初坯的立体图；
图3是本发明实施例二提供的五金件初坯被挤压时的剖视图；
图4是本发明实施例二提供的五金件半成品被回挤时的剖视图；
图5是图4中A处的局部放大图；
图6是本发明实施例二提供的被回挤后的五金件的立体图；
图7是本发明实施例二提供的被回挤后的五金件的剖视图；
图8是本发明实施例二提供的铣出通孔的五金件的立体图；
图9是本发明实施例二提供的铣出通孔的五金件的剖视图。
附图标记：
1、通孔；2、凹模；3、镶件；4、五金件初坯；5、五金件半成品；6、冲头；7、凹模；8、凸包结构；9、圆角；
21、凸起；31、凹槽。
具体实施方式
为使本发明解决的技术问题、采用的技术方案和达到的技术效果更加清楚，下面将结合附图对本发明实施例的技术方案作进一步的详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为了解决现有五金件通孔加工方式对五金件强度产生破坏的问题，本申请提出一种五金件通孔的成型方式、采用该成型方式加工侧孔的电子设备壳体及具有该电子设备壳体的电子设备，具体参见以下实施例。
实施例一
本实施例提出第一种五金件通孔的成型方式，该成型方式为，首先在五金件的开孔位置挤压成型一个凸包结构，然后沿凸包结构挤压成型相反的方向回挤凸包结构，最后切除凸包结构的端部形成通孔。
本实施例在通孔加工过程中，回挤加工使得通孔加工前材料流向通孔四周，相当于增厚通孔四周金属壁厚，从而提高了通孔位置五金件的强度。
实施例二
如图1至图9所示，本实施例提出第二种五金件通孔的成型方式，该成型方式包括以下步骤：
A：对金属板材冲压加工，加工出具有侧壁的五金件初坯4。
步骤A包括以下步骤：
A1：制得符合五金件尺寸的金属板材。
进一步的，步骤A1包括以下步骤：
A11：根据五金件尺寸计算所需金属板材的尺寸；
A12：将金属板原材料通过冲裁模具裁剪出冲压成型前的金属板材。
在本实施例中，为了提高五金件的耐磨度，金属板材选用不锈钢钣金或铝合金钣金，不仅耐磨度高，而且使用寿命长。为了使五金件更加轻薄化，金属板材的厚度选择0.4-1.2mm的范围。
A2：将金属板材通过冲压成型模具一体拉伸形成具有竖直侧壁的五金件初坯4。
如图1所示，该冲压成型模具的冲头6和凹模7共同挤压金属板材，使金属板材形成竖直侧壁。
B：通过模具对侧壁的开孔位置进行挤压加工，加工出侧壁具有凸包结构8的五金件半成品5。
C：通过模具对五金件半成品5的凸包结构8沿挤压成型相反的方向进行回挤加工。
如图3和图4所示，步骤B和步骤C中的模具包括凹模2及内部的镶件3，其中，凹模2的内壁设置有凸起21，镶件3的外壁设置有与凸起21配合的凹槽31，凸起21、凹槽31与凸包结构8的形状相匹配。其中，凸起21和凹槽31的横截面形状可根据五金件通孔1的形状来选择椭圆形、方形或圆形中的一种。
当模具合模时，镶件3先向下运动后向左水平运动，凹模2与镶件3共同挤压位于中间的五金件初坯4，部分材料向侧壁内侧流动，从而加工出侧壁具有凸包结构8的五金件半成品5。由于凸包结构8的拉伸过程会导致图4和图5中圆角9处材料密度的变化，影响产品的外观效果，同时，圆角9也会较大，影响产品外观精细度。因此，对五金件半成品5的凸包结构8沿挤压成型相反的方向进行回挤加工，能够使圆角9位置材料回流，相当于增厚通孔四周金属壁厚，材料变得更加致密，圆角9也会相应减小，从而提高五金件半成品5通孔位置的强度。
D：对步骤C中五金件半成品5的凸包结构8的端部进行CNC加工，铣出通孔1(参见图8和图9)。
最后，可对上述五金件半成品5进行后期处理，获得最终的五金件产品。
后期处理包括打磨、抛光、阳极氧化及贴保护膜等工序。例如，对五金件半成品5通过打磨和抛光处理方式将上述按键孔周边多余厚度尺寸的毛刺进行打磨并抛光，在打磨和抛光过程中需要随时加水冲洗防止过热。可以在金属壳半成品5的外表面通过阳极氧化处理方式或其他表面处理方式电镀不同的金属，使五金件呈现多种金属色，增强五金件外观的酷炫性及多样性，提高五金件产品的市场竞争力，满足用户的不同需要，提高用户体验。通过贴保护膜处理方式能够防止五金件被外界环境所腐蚀，进一步延长五金件的使用寿命。
实施例三
本实施例提出一种电子设备壳体，包括侧壁，侧壁上开设有通孔1，所述通孔1采用如实施例一或实施例二所述的五金件通孔的成型方式加工而成。本实施例还提出一种电子设备，包括该电子设备壳体。其中，电子设备可以为手机、平板电脑等电子产品，电子设备壳体可以为电池盖或外壳。侧壁的通孔包括为装配电源按键、音量按键、SIM卡托等按键开设的电源孔、音量孔、SIM卡托孔等按键孔。本发明的电子设备壳体及其电子设备的结构强度高，使用寿命长。
以结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。

Claims (22)

  1. 一种五金件通孔的成型方式，其特征在于，首先在五金件的开孔位置挤压成型一个凸包结构(8)，然后沿凸包结构(8)挤压成型相反的方向回挤凸包结构(8)，最后切除凸包结构(8)的端部形成通孔(1)。
  2. 根据权利要求1所述的五金件通孔的成型方式，其特征在于，包括以下步骤：
    A：对金属板材冲压加工，加工出具有侧壁的五金件初坯(4)；
    B：通过模具对侧壁的开孔位置进行挤压加工，加工出侧壁具有凸包结构(8)的五金件半成品(5)；
    C：通过模具对五金件半成品(5)的凸包结构(8)沿挤压成型相反的方向进行回挤加工；
    D：对步骤C中五金件半成品(5)的凸包结构(8)的端部进行CNC加工，铣出通孔(1)。
  3. 根据权利要求2所述的五金件通孔的成型方式，其特征在于，所述步骤A包括以下步骤：
    A1：制得符合五金件尺寸的金属板材；
    A2：将金属板材通过冲压成型模具一体拉伸形成具有侧壁的五金件初坯(4)。
  4. 根据权利要求3所述的五金件通孔的成型方式，其特征在于，所述侧壁为竖直侧壁。
  5. 根据权利要求4所述的五金件通孔的成型方式，其特征在于，所述冲压成型模具包括冲头(6)和凹槽(7)，所述冲头(6)和凹槽(7)共同挤压金属板材，使金属板材形成竖直侧壁。
  6. 根据权利要求3所述的五金件通孔的成型方式，其特征在于，所述步骤A1包括以下步骤：
    A11：根据五金件尺寸计算所需金属板材的尺寸；
    A12：将金属板原材料通过冲裁模具裁剪出冲压成型前的金属板材。
  7. 根据权利要求2所述的五金件通孔的成型方式，其特征在于，所述步骤B和步骤C中的模具包括凹模(2)和镶件(3)，所述凹模(2)与镶件(3)共同挤压五金件初坯(4)形成侧壁具有凸包结构(8)的五金件半成品(5)。
  8. 根据权利要求7所述的五金件通孔的成型方式，其特征在于，所述凹模(2)的内壁设置有凸起(21)，所述镶件(3)的外壁设置有与凸起(21)配合的凹槽(31)，所述凸起(21)、凹槽(31)与凸包结构(8)的形状相匹配。
  9. 根据权利要求8所述的五金件通孔的成型方式，其特征在于，所述凸起(21)和凹槽(31)的横截面形状为椭圆形、方形或圆形。
  10. 根据权利要求8所述的五金件通孔的成型方式，其特征在于，所述镶件(3)先向下运动后向左水平运动，所述凹模(2)与所述镶件(3)共同挤压位于中间的所述五金件初坯(4)，部分材料向侧壁内侧流动以加工出侧壁具有所述凸包结构(8)的所述五金件半成品(5)。
  11. 根据权利要求10所述的五金件通孔的成型方式，其特征在于，在所述凸包结构(8)的拉伸过程中，所述凸包结构(8)与所述侧壁之间形成圆角(9)。
  12. 根据权利要求11所述的五金件通孔的成型方式，其特征在于，在所述步骤C中，所述圆角(9)位置材料回流，所述通孔(1)四周壁厚增加。
  13. 根据权利要求2所述的五金件通孔的成型方式，其特征在于，还包括步骤：
    E：对所述五金件半成品(5)进行打磨、抛光、阳极氧化及贴保护膜处理。
  14. 根据权利要求13所述的五金件通孔的成型方式，其特征在于，在所述打磨和所述抛光处理过程中，对所述通孔(1)周边多余厚度尺寸的毛刺进行打磨和抛光。
  15. 根据权利要求14所述的五金件通孔的成型方式，其特征在于，在所述打磨和所述抛光过程中随时加水冲洗以防止过热。
  16. 根据权利要求13所述的五金件通孔的成型方式，其特征在于，在所述金属壳半成品(5)的外表面通过所述阳极氧化处理方式电镀不同的金属，使五金件呈现多种金属色。
  17. 根据权利要求2所述的五金件通孔的成型方式，其特征在于，所述金属板材为不锈钢钣金或铝合金钣金。
  18. 一种电子设备壳体，包括侧壁，侧壁上开设有通孔(1)，其特征在于，所述通孔(1)采用如权利要求1至17任一项所述的五金件通孔的成型方式加工而成。
  19. 根据权利要求18所述的电子设备壳体，其特征在于，所述通孔包括为装配电源按键、音量按键、SIM卡托开设的电源孔、音量孔、SIM卡托孔。
  20. 一种电子设备，其特征在于，包括如权利要求18或19所述的电子设备壳体。
  21. 根据权利要求20所述的电子设备，其特征在于，所述电子设备为手机或平板电脑。
  22. 根据权利要求20所述的电子设备，其特征在于，所述电子设备的壳体为电池盖或外壳。
PCT/CN2017/087798 2016-06-27 2017-06-09 五金件通孔的成型方式、电子设备壳体及电子设备 Ceased WO2018001071A1 (zh)

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