WO2017202130A1 - 掩膜版框架、掩膜版及制作方法 - Google Patents

掩膜版框架、掩膜版及制作方法 Download PDF

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Publication number
WO2017202130A1
WO2017202130A1 PCT/CN2017/078269 CN2017078269W WO2017202130A1 WO 2017202130 A1 WO2017202130 A1 WO 2017202130A1 CN 2017078269 W CN2017078269 W CN 2017078269W WO 2017202130 A1 WO2017202130 A1 WO 2017202130A1
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WO
WIPO (PCT)
Prior art keywords
mask
force
mask frame
frame
outer boundary
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PCT/CN2017/078269
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English (en)
French (fr)
Inventor
张健
黄俊杰
唐富强
Original Assignee
京东方科技集团股份有限公司
鄂尔多斯市源盛光电有限责任公司
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Application filed by 京东方科技集团股份有限公司, 鄂尔多斯市源盛光电有限责任公司 filed Critical 京东方科技集团股份有限公司
Priority to US15/574,455 priority Critical patent/US10510958B2/en
Publication of WO2017202130A1 publication Critical patent/WO2017202130A1/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04—Coating on selected surface areas, e.g. using masks
    • C23C16/042—Coating on selected surface areas, e.g. using masks using masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/164—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using vacuum deposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

Definitions

  • the present invention relates to the field of display technologies, and in particular, to a mask frame, a mask, and a manufacturing method for manufacturing a display panel.
  • a method of fabricating an AMOLED display panel includes a FMM Mask method in which an OLED material is evaporated to LTPS by an evaporation process using a FMM Mask (low temperature polysilicon, Low Temperature).
  • FMM Mask low temperature polysilicon, Low Temperature
  • the mask includes a mask frame and a strip mask body soldered to the mask frame.
  • the metal mask frame that is currently applied to AMOLEDs is a regular cuboid in the middle of the hollow, and the metal mask frame is susceptible to unstable deformation, when all the mask strips are stretched and all welded to the frame.
  • PPA pixel position precision
  • Embodiments of the present invention provide a mask frame and a body, a mask and a manufacturing method thereof, a substrate, and The display panel is at least used to enhance the stability of the mask frame.
  • a mask frame provided by an embodiment of the present invention includes: an annular frame body including an outer boundary and an inner boundary, the inner boundary defining a space accommodating the main body of the reticle; and
  • the mask frame has a force side that receives the tensile force of the mask body, and the non-stress side does not bear the force of the mask body; wherein the mask version
  • the thickness between the outer boundary of the force-receiving side of the frame and the corresponding inner boundary gradually decreases in the direction in which the intermediate position of the force-receiving side points toward the non-stressed side.
  • an inner boundary of the mask frame is formed in a rectangular shape.
  • the thickness between the outer boundary of the force receiving side and the corresponding inner boundary, and the force side is a constant thickness of the reference force side in a positive correlation after the same tensile force.
  • the positive correlation relationship may be expressed by the following formula (1):
  • ⁇ SD is the reference force side with a minimum thickness between the outer boundary of the force side and the corresponding inner boundary being a constant thickness after receiving the same tensile force
  • ⁇ D is the thickness between the outer boundary of the force side and the corresponding inner boundary.
  • the outer boundary of the force receiving side has a shape that is convex toward the outer portion of the mask frame.
  • the outer boundary of the force receiving side has a step shape.
  • the embodiment of the present invention further provides a mask plate, which comprises any mask frame provided by the embodiment of the invention and a plurality of mask body connected to the mask frame. .
  • the mask The outer boundary of the force receiving side of the plate frame has a stepped shape; the number of the stepped steps is the same as the number of the mask main bodies.
  • the embodiment of the present invention further provides a method for fabricating a mask provided by the above embodiment of the present invention, the method comprising:
  • a mask body having a retractive force is placed in the mask frame, and the mask body is welded.
  • FIG. 1 is a schematic structural view of a metal mask frame according to an embodiment of the present invention.
  • FIG. 2(a) to 2(c) are schematic diagrams showing the principle of fabricating a mask using the metal mask frame shown in FIG. 1;
  • FIG. 3 is a schematic structural diagram of a mask frame according to an embodiment of the present invention.
  • FIG. 4 is a schematic structural diagram of a second mask frame according to an embodiment of the present invention.
  • FIG. 5 is a schematic structural view showing a shape variable of a mask frame as a comparative example under the action of an external force
  • FIG. 6 is a schematic structural diagram of a third mask frame according to an embodiment of the present invention.
  • FIG. 7 is a schematic structural diagram of a fourth mask frame according to an embodiment of the present invention.
  • FIG. 8 is a schematic structural diagram of a fifth mask frame according to an embodiment of the present invention.
  • FIG. 9 is a schematic structural diagram of a mask according to an embodiment of the present invention.
  • FIG. 10 is a schematic structural diagram of another mask according to an embodiment of the present invention.
  • FIG. 11 is a schematic flow chart of a method for fabricating a mask according to an embodiment of the present invention.
  • Embodiments of the present invention provide a mask frame and a body, a mask and a manufacturing method thereof, a substrate, and a display panel for enhancing the stability of the mask frame.
  • FIG. 1 is a schematic structural view of a metal mask frame provided by an embodiment of the present invention.
  • 2(a) to 2(c) are schematic views showing the principle of fabricating a mask using the metal mask frame shown in Fig. 1.
  • the mask frame includes an inner boundary 16 and an outer boundary 15, wherein the outer boundary 15 encloses a rectangle and the inner boundary 16 has a rectangular shape.
  • the OLED material is vapor-deposited onto the LTPS back sheet by a vapor deposition method, referring to FIG. 2(a), it is necessary to apply a pulling force to the mask main body 1 so that the mask main body 1 is opposite to the pulling direction.
  • the retracting force when the mask main body 1 is placed on the mask frame for welding, the retracting force causes the mask frame to be deformed, wherein the mask main body 1 includes a plurality of corresponding to each pixel. Pixel unit 11. Therefore, in order to ensure the accuracy of pixel alignment, it is necessary to reduce the deformation of the frame. Therefore, referring to FIG.
  • the thrust is applied to the metal mask frame 2 in advance, so that the metal mask frame 2 generates an outwardly expanding deformation force; then the mask body having the retractive force is placed on the mask.
  • the net welding is performed on the plate frame.
  • the deformation amount of the mask frame is reduced, thereby reducing the mask position precision displacement (Mask PPA Shift) )degree.
  • the mask frame 2 and the mask main body 1 are in an equilibrium state, and the welding of the five mask main bodies is completed.
  • the reticle frame 10 is an annular frame body, and the annular frame body includes an outer boundary 11 and an inner boundary 12, wherein the inner frame
  • the boundary 12 defines a space that houses the main body of the reticle.
  • the mask frame has a force receiving side 13 and a non-stress side 14 , and the force receiving side 13 is subjected to a tensile force of the mask body, and the non-stress side 14 does not bear the mask body Force.
  • the left and right sides of the mask frame 10 are the force side 13
  • the upper and lower sides of the mask frame are the non-stress side 14 .
  • the thickness d between the outer boundary 11 of the force-receiving side 13 of the reticle frame 10 and the corresponding inner boundary 12 points to the non-stress side according to the intermediate position of the force-receiving side 13 (as indicated by the dashed arrow in FIG. 3)
  • the direction is gradually decreasing.
  • the mask frame provided by the embodiment of the present invention is not limited to only Take the shape of the mask frame shown in Figure 3.
  • the shape of the outer boundary and the inner boundary of the non-force side of the mask frame is not specifically limited herein.
  • the force receiving side in the embodiment of the present invention is subjected to the pulling force under the influence of the retracting force of the mask main body.
  • the force-receiving side in the embodiment of the present invention refers to the side of the mask frame that is subjected to the pulling force of the mask body.
  • the non-stressed side in the embodiment of the present invention refers to the mask-free version of the mask frame. The side of the body's force. .
  • the two sides are sequentially welded from the intermediate position of the mask frame, and the same pulling force is applied to the mask body each time the welding is performed.
  • Each mask body is caused to produce a retracting force of the same direction and size, which is the tensile force received by the force receiving side of the mask frame in the embodiment of the invention.
  • the inner boundary at the intermediate position has no large deformation due to the inner boundary of the non-stressed side, and the inner boundary on both sides of the intermediate position is The fixation effect of the inner boundary of the non-stress side is smaller when the tension is generated by the tension. For example, referring to Fig.
  • the direction of the dotted arrow is the direction from the middle of the force receiving side to the unstressed side. Therefore, in the embodiment of the present invention, the thickness between the outer boundary of the force receiving side and the corresponding inner boundary is from the largest to the smallest direction as shown by the dotted arrow in FIG. to.
  • the thickness between the outer boundary of the force-receiving side and the inner boundary corresponding to the outer boundary may gradually decrease according to the tendency of the intermediate position on the force-receiving side to gradually decrease toward the non-stress side. , or non-continuous reduction. 3 the variation trend of the thickness between the outer boundary of the force side and the inner boundary corresponding to the outer boundary is continuous, but is not limited to the manner shown in FIG. 3, and other variations are also in the present invention. The scope of protection. This is not specifically limited.
  • the mask frame provided by the embodiment of the invention can be applied to the fabrication process of various types of masks.
  • it can be applied to a metal mask frame for vapor deposition of a high-precision AMOLED, and can also be applied to a grid welding of a conventional etch mask and an electroplated mask. This is not specifically limited.
  • the mask frame provided by the embodiment of the present invention has a thickness between the outer boundary of the force side and the inner boundary corresponding to the outer boundary, and is directed according to the middle position of the force side, compared with the conventional mask frame.
  • the design of the non-stress side is gradually reduced, as shown in FIG. Therefore, the thickness of the intermediate position on the force receiving side of the mask frame provided by the embodiment of the present invention is the thickest, so that the force side has a strong resistance, and the thickness between the outer boundary and the inner boundary of the force side is thicker. The greater the resistance formed, the deformation of the mask frame is avoided, and the stability of the mask frame is increased.
  • the inner boundary 12 of the reticle frame 10 is shaped as a rectangle.
  • the inner boundary of the mask frame in the embodiment of the present invention is a rectangle for placing a plurality of mask main bodies.
  • the shape of the inner boundary of the mask is not limited to a rectangle, but includes other shapes for soldering the mask body.
  • the shape of the inner boundary of the mask frame of the mask body of the welding profile screen may not be rectangular. . This is not specifically limited.
  • the minimum thickness is the constant force of the reference force side to determine the thickness of the force side after being subjected to the tensile force.
  • the thickness between the outer boundary of the force side and the inner boundary corresponding to the outer boundary is the same as the minimum thickness between the outer boundary of the force side and the corresponding inner boundary.
  • the force side is proportional to the shape variable produced by the same pulling force.
  • the minimum thickness between the corresponding inner boundaries is the proportional relationship of the deformation force generated by the reference force side of constant thickness after receiving the same tensile force, specifically, the formula (1) is satisfied:
  • ⁇ D a+k* ⁇ SD (a, k, ⁇ SD are all greater than 0) (1)
  • a and k are constants
  • ⁇ SD is a shape variable generated by the reference force side whose constant thickness between the outer boundary of the force side and the corresponding inner boundary is a constant thickness
  • ⁇ D is the force side.
  • the deformation amount is, for example, the amount of displacement of the force side of the mask frame in the direction of the pulling force.
  • the values of a and k are determined according to different mask templates. Specifically, a is the minimum value of the thickness between the outer boundary of the force receiving side of the mask frame and the inner boundary corresponding to the outer boundary, and the force side of the thickness value is used as the reference force side, k and the mask
  • k is an empirical constant.
  • the values of a and k are different for different mask frames. Both ⁇ D and ⁇ SD are on the order of microns.
  • the outer boundary 11 of the force-receiving side 13 has a shape that is convex toward the outside of the mask frame.
  • the size of the arc in the arc may be designed according to the above formula (1), or the arc may be designed by itself, and is not specifically limited herein.
  • the mask frame 2 as a reference comparative example is rectangular, and the outer boundary of the force side is parallel to the inner boundary of the force side, and the thickness between the outer and inner boundaries of the force side of the mask frame is All the same.
  • the mask body 1 is sequentially placed in the mask frame 2, and each mask is required before each placement before the mask body is placed in the mask frame. Version body applies the same
  • the pulling force causes each mask body to produce a retracting force of the same direction and size. Due to the retracting force generated by the mask main body 1, the mask frame 2 is deformed due to the structure of the mask frame.
  • the shape variable generated by the retracting force at the intermediate position on the force side is the largest, and the shape variable generated by the retraction force at the position on both sides of the intermediate position is gradually reduced. Therefore, under the action of the retracting force of the mask main body 1, the deformation amount generated on the force side of the mask frame 2 is gradually reduced from the middle to the edge, as shown in FIG. 5, according to the force side from the middle to the edge. In the direction, the resulting shape variables are ⁇ SD1, ⁇ SD2, and ⁇ SD3.
  • the value of the shape variable generated by the mask frame 2 varies according to the actual application, and is not specifically limited herein. Therefore, the present invention improves the structure of the mask frame according to the deformation amount of the mask frame 2 provided by the comparative example.
  • the mask frame provided by the embodiment of the present invention is improved based on the mask frame 2 of the comparative example shown in FIG. 5, that is, the outer boundary 11 of the force side is set to be convex to the outside of the mask frame.
  • the curved shape is such that the thickness between the outer boundary 11 of the force receiving side and the corresponding inner boundary 12 is the thickest at the intermediate position on the force side, and gradually decreases from the intermediate position toward the non-stress side to the minimum thickness a .
  • the force side having a constant thickness a between the outer boundary 11 and the inner boundary 12 of the force receiving side of the mask frame 2 is referred to as a reference force side. Referring to Fig.
  • the minimum value of the thickness between the outer boundary of the force-receiving side in the mask frame 10 and the inner boundary corresponding to the outer boundary is a.
  • the position of the mask main body corresponding to FIG. 5 is indicated by a horizontal dotted line in FIG. Referring to Fig. 5 and Fig. 6, at the position where the deformation amount on the force receiving side in Fig. 5 is ⁇ SD1, the thickness on the force receiving side in Fig. 6 is set to ⁇ D1, and the deformation amount on the force side in Fig. 5 At the position of ⁇ SD2, the thickness on the force side in Fig. 6 is set to ⁇ D2, and the thickness on the force side in Fig. 6 is set at the position where the deformation amount on the force side in Fig.
  • ⁇ SD3 ⁇ SD3.
  • ⁇ D1 a + k * ⁇ SD1
  • ⁇ D2 a + k * ⁇ SD2
  • ⁇ D3 a + k * ⁇ SD3
  • the appropriate a and k values are selected, and according to the embodiment of the invention shown in Fig. 6, the deformation of the force side of the mask frame can be reduced to zero.
  • the above structure of the mask frame 10 provided by the embodiment of the present invention can offset the deformation of the mask frame caused by the retractive force of the mask body, and the mask frame is added. stability.
  • the number of times of calculating ⁇ D can be increased, so that the force side of the mask frame is at any When the position is subjected to the same pulling force, the pulling force can be offset.
  • the number of times the ⁇ D is calculated is the same as the number of mask bodies that are soldered using the mask frame provided by the embodiment of the present invention.
  • ⁇ D and ⁇ SD a position corresponding to the center line of the mask main body can be selected.
  • the outer boundary 11 of the force receiving side 13 has a stepped shape.
  • the thickness of each step can be sequentially calculated according to the formula (1).
  • Each of them calculates a ⁇ D, which corresponds to one step.
  • the mask frame provided by the embodiment of the present invention has two force-bearing sides facing each other, and the outer boundaries of the two force-receiving sides are all curved, or the outer boundaries of the two force-receiving sides are It is stepped, or, referring to Fig. 8, the outer boundary 11 of one force side 13 is curved, and the outer boundary 11 of the other force side 13 is stepped. This is not specifically limited.
  • the thickness between the outer boundary of the force receiving side and the corresponding inner boundary of the mask frame provided by the embodiment of the present invention is gradually decreased according to the direction of the intermediate position of the force receiving side pointing to the non-stress side.
  • the shape of the outer boundary of the force side of the mask frame is curved, or the outer boundary of the force side of the mask frame is stepped, and the outer boundary at the intermediate position of the force side corresponds to The thickness between the inner boundaries is the thickest. Since the thickness between the outer boundary of the force side of the mask frame and the corresponding inner boundary is based on the minimum thickness between the outer boundary of the force side and the corresponding inner boundary, the reference force side is a constant thickness.
  • the deformation force generated by the same tensile force is determined correspondingly. Therefore, the force-receiving side of the mask frame provided by the embodiment of the present invention has strong resistance after being subjected to the external pulling force. The thicker the thickness between the outer and outer boundaries of the force side, the greater the resistance formed, thereby avoiding the deformation of the mask frame and increasing the stability of the mask frame.
  • an embodiment of the present invention further provides a mask body, including a mask body welded by any of the mask frames provided by the embodiments of the present invention.
  • the number of steps of the stepped outer boundary of the force receiving side of the mask frame and the mask provided by the embodiment of the present invention is the same.
  • the stepped outer boundary 11 on the force receiving side of the mask frame includes five steps of A1, A2, A3, A4, and A5.
  • FIG. 9 only the mask main body 22 is schematically illustrated in the mask, and in practical applications, a plurality of mask main bodies can be placed. This is for illustrative purposes only and does not represent the size and number of mask bodies in actual applications.
  • the mask frame under the influence of the retractive force of the mask main body, the mask frame is subjected to the same tensile force of the same size, and each of the mask main bodies has the same retracting force, and the force receiving side receives
  • the number of pulls is the same as the number of mask bodies.
  • the mask frame In order for the mask frame to have a relatively stable structure when subjected to each pulling force, the mask frame is prevented from being deformed.
  • the number of steps and the inner boundary of the force side are subjected to tensile forces. The numbers are the same, and the size of each step is obtained by the formula (1).
  • an embodiment of the present invention further provides a mask.
  • the mask includes a mask body 22 and any mask frame 10 provided by the embodiment of the present invention.
  • the outer boundary of the force receiving side of the reticle frame 10 is an arc.
  • any reticle frame provided by the embodiment of the present invention may be used, and details are not described herein again.
  • the mask provided by the embodiment of the invention has the following beneficial effects:
  • the reticle frame provided by the embodiment of the present invention has a strong stability and is not easily deformed. Therefore, the reticle frame provided by the embodiment of the present invention has a mask formed by welding the mask body.
  • the strong stability ensures the accuracy of the pixel position and solves the color mixing problem caused by the instability of the mask.
  • the mask provided by the embodiment of the invention can be applied to the fabrication of various types of masks of different sizes and different degrees of clarity.
  • the mask provided by the embodiment of the invention provides a prerequisite for making a high-precision mask.
  • the mask provided by the embodiment of the invention only improves the structure of the mask frame, and does not add any external objects to the mask body, thereby improving the optimization of the mask plate. condition.
  • an embodiment of the present invention further provides a substrate, which is fabricated by using a mask provided by an embodiment of the present invention.
  • the substrate provided by the embodiment of the invention may be an array substrate, a color film substrate or the like.
  • an embodiment of the present invention further provides a display panel, including the substrate provided by the embodiment of the present invention.
  • an embodiment of the present invention further provides a method for fabricating a mask, the method comprising:
  • the thrust is determined according to the system simulation and production process experience, and then the production process experience varies in magnitude, so the thrust is not well mastered; finally, the mask body with retractive force is placed on the mask. Welding is performed in the version frame. Since the release of the thrust of the mask frame is dynamic, step by step Subtracted, therefore, the deformation of the reticle frame is in a different deformation state.
  • the mask plate when the mask plate is provided by the mask frame provided by the present invention, first, a tensile force is applied to the mask body, so that the mask body generates an opposite reverse retractive force, as shown in FIG. 2 (a). ); then the mask body with retractive force is placed in the mask frame for soldering. Since the reticle frame provided by the embodiment of the present invention has strong stability and is affected by the retractive force of the reticle main body, the self structure can offset the influence of the retracting force on the reticle frame.
  • the method for fabricating the mask provided by the embodiment of the present invention not only simplifies a process, that is, it does not need to apply a thrust to the mask frame, and avoids the dynamic process of the release of the thrust to cause a deformation of the mask frame.
  • the method for fabricating the mask provided by the embodiment of the present invention improves the accuracy of the pixel position of the mask.
  • the mask frame and the main body, the mask and the manufacturing method, the substrate and the display panel provided by the embodiment of the present invention the outer boundary of the force side of the mask frame and the corresponding inner boundary
  • the thickness between the two gradually decreases in accordance with the direction in which the intermediate position of the force receiving side is directed to the non-stress side. Therefore, the embodiment of the present invention increases the thickness between the outer boundary and the inner boundary of the force side, so that the thicker force side is less susceptible to deformation when subjected to the tensile force.
  • the mask frame provided by the invention enhances the ability to resist the external pulling force, so that the mask frame is not easily deformed after being subjected to the pulling force, and the stability of the mask frame is improved.

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  • Engineering & Computer Science (AREA)
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Abstract

一种掩膜版框架(2,10)，包括：环状框架体，环状框架体包括外边界(11,15)和内边界(12,16)，内边界(12,16)限定容纳掩模板主体(1,22)的空间；并且，掩膜版框架(2,10)具有受力侧(13)和非受力侧(14)，受力侧(13)承受掩膜版主体(1,22)的拉力，非受力侧(14)不承受掩膜版主体(1,22)的作用力；其中，掩膜版框架(2,10)的受力侧(13)的外边界(11,15)与相对应的内边界(12,16)之间的厚度(d)，按照受力侧(13)的中间位置指向非受力侧(14)的方向逐渐减小。还公开了一种掩模板和一种掩模板的制作方法。

Description

掩膜版框架、掩膜版及制作方法
相关申请的交叉引用
本申请要求2016年5月27日提交中国专利局的专利申请201610366372.5的优先权，其全部内容通过引用合并于本申请中。
技术领域
本发明涉及显示技术领域，尤其涉及一种用于制作显示面板的掩膜版框架、掩膜版及制作方法。
背景技术
显示面板，特别是AMOLED显示面板的制作中，需要使用掩模版。例如，AMOLED显示面板的一种制作方式包括精细金属掩膜(FMM Mask)方式，其是利用精细金属掩膜版(FMM Mask)通过蒸镀工艺将OLED材料蒸镀到LTPS(低温多晶硅，Low Temperature Poly-silicon)背板上，利用FMM上的图形，在背板上形成红绿蓝像素单元。掩膜版包括掩膜版框架和焊接到掩膜版框架上的条状掩膜版主体。
现在应用于AMOLED的金属掩膜板框架，均为中间掏空的规则长方体，该金属掩膜版框架(Frame)易发生不稳定变形，当所有掩膜版条经过拉伸并全部焊接在框架上时，会使框架向内收缩，产生变形，从而带动焊接在框架上的掩膜版主体发生像素位置精度(PPA)移位(Shift)。
发明内容
本发明的实施例提供一种掩膜版框架及主体、掩膜版及制作方法、基板和 显示面板，至少用以增强掩膜版框架的稳定性。
本发明的实施例提供的一种掩膜版框架，包括：环状框架体，所述环状框架体包括外边界和内边界，所述内边界限定容纳掩模板主体的空间；并且，所述掩膜版框架具有受力侧和非受力侧，所述受力侧承受掩膜版主体的拉力，所述非受力侧不承受掩膜版主体的作用力；其中，所述掩膜版框架的受力侧的外边界与相对应的内边界之间的厚度，按照所述受力侧的中间位置指向非受力侧的方向逐渐减小。
在一种可能的实施方式中，本发明实施例提供的上述掩膜版框架中，所述掩膜版框架的内边界组成的形状为矩形。
在一种可能的实施方式中，本发明的实施例提供的上述掩膜版框架中，所述受力侧的外边界与相对应的内边界之间的厚度，与以所述受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量成正相关关系。
在一种可能的实施方式中，所述正相关关系可以用以下公式(1)表示：
ΔD＝a+k*ΔSD   (1)
其中，a、k、ΔSD均大于0，a和k为常数，ΔSD为以受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量，ΔD为受力侧的外边界与相对应的内边界之间的厚度。
在一种可能的实施方式中，本发明实施例提供的上述掩膜版框架中，所述受力侧的外边界的形状为朝向掩膜版框架的外部凸起的弧形。
在一种可能的实施方式中，本发明实施例提供的上述掩膜版框架中，所述受力侧的外边界的形状为阶梯状。
相应地，本发明实施例还提供了一种掩膜版，所述掩膜版包括本发明实施例提供的任一种掩膜版框架和连接在掩膜版框架上的多个掩膜板主体。
在一种可能的实施方式中，本发明实施例提供的上述掩膜版中，所述掩模 板框架的所述受力侧的外边界的形状为阶梯状；所述阶梯状的阶梯个数与所述掩膜版主体的个数相同。
相应地，本发明实施例还提供了一种本发明上述实施例提供的掩膜版的制作方法，该方法包括：
对所述掩膜版主体施加拉力，使得所述掩膜版主体产生与拉力方向相反方向的回缩力；
将具有回缩力的掩膜版主体放在所述掩膜版框架中，并对所述掩膜版主体进行焊接。
附图说明
图1为本发明实施例提供的一种金属掩膜版框架的结构示意图；
图2(a)-图2(c)为采用图1所示的金属掩膜版框架制作掩膜版的原理示意图；
图3为本发明实施例提供的一种掩膜版框架的结构示意图；
图4为本发明实施例提供的第二种掩膜版框架的结构示意图；
图5为作为比较例的一种掩膜版框架在受到外界力的作用下的形变量的结构示意图；
图6为本发明实施例提供的第三种掩膜版框架的结构示意图；
图7为本发明实施例提供的第四种掩膜版框架的结构示意图；
图8为本发明实施例提供的第五种掩膜版框架的结构示意图；
图9为本发明实施例提供的一种掩膜版的结构示意图；
图10为本发明实施例提供的另一种掩膜版的结构示意图；以及
图11为本发明实施例提供的一种掩膜版的制作方法的流程示意图。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发 明作进一步地详细描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例，都属于本发明保护的范围。
本发明实施例提供了一种掩膜版框架及主体、掩膜版及制作方法、基板和显示面板，用以增强掩膜版框架的稳定性。
下面结合附图，对本发明提供的掩膜版框架及主体、掩膜版及制作方法、基板和显示面板的具体实施方式进行详细地说明。
图1为本发明的一种实施例提供的一种金属掩膜版框架的结构示意图。图2(a)-图2(c)为采用图1所示的金属掩膜版框架制作掩膜版的原理示意图。如图1所示，掩膜版框架包括内边界16和外边界15，其中外边界15围成的图形为矩形，内边界16围成的图形也为矩形。
在通过蒸镀方式将OLED材料按照预定程序蒸镀到LTPS背板上时，参见图2(a)，需要先对掩膜版主体1施加拉力，使得掩膜版主体1产生与拉力方向相反方向的回缩力，当将掩膜版主体1放置在掩膜版框架上进行焊接时，回缩力会使得掩膜版框架产生变形，其中掩膜版主体1中包括多个与每一像素对应的像素单元11。因此为了保证像素对位的精准度，需要减轻框架变形。因此，参见图2(b)，预先向金属掩膜版框架2施加推力，使得金属掩膜版框架2产生向外扩张的变形力；然后将具有回缩力的掩膜版主体放置在掩膜版框架上进行张网焊接。利用掩膜版框架上向外扩张的力与掩膜版向内的收缩力相互抵消的原理，减小掩膜版框架的变形量，从而减小掩膜版像素位置精度移位(Mask PPA Shift)程度。参见图2(c)，掩膜版框架2与掩膜版主体1处于平衡状态，完成了五个掩膜版主体的焊接。
参见图3，示出了本发明实施例提供的一种掩膜版框架10，掩膜版框架10为环状框架体，所述环状框架体包括外边界11和内边界12，所述内边界12限定容纳掩模板主体的空间。所述掩膜版框架具有受力侧13和非受力侧14，所述受力侧13承受掩膜版主体的拉力，所述非受力侧14不承受掩膜版主体的 作用力。如图3所示，掩膜版框架10的左右两侧均为受力侧13，掩膜版框架的上下两侧均为非受力侧14。
掩膜版框架10的受力侧13的外边界11与相对应的内边界12之间的厚度d，按照受力侧13的中间位置指向非受力侧(如图3中虚线箭头的方向)的方向逐渐减小。
其中，图3中仅以受力侧的外边界与内边界之间的厚度在增厚的过程中，外边界具有外凸的效果为例进行示意，当然，也可以受力侧的外边界与内边界之间的厚度在增厚的过程中，内边界具有凸起的效果，同样适用于焊接掩膜版主体的掩膜版框架，因此，本发明实施例提供的掩膜版框架不限于仅以图3所示的掩膜版框架的形状。另外，掩膜版框架的非受力侧的外边界和内边界的形状在此不作具体限定。
在将掩膜版主体放置在掩膜版框架中前，需要对掩膜版主体施加拉力，使得掩膜版主体具有与拉力方向相反方向的回缩力。由于掩膜版主体的回缩力，会影响掩膜版框架的内侧受到由外向内的拉力。因此，本发明实施例中的受力侧会在掩膜版主体的回缩力的影响下受到拉力。本发明实施例中的受力侧是指掩膜版框架的受到掩膜版主体的拉力作用的一侧，本发明实施例中的非受力侧是指掩膜版框架的没有受到掩膜版主体的作用力的一侧。。
另外，将掩膜版主体在掩膜版框架中进行焊接时，是按照从掩膜版框架的中间位置依次向两边进行焊接，且每次焊接时均需要给掩膜版主体施加相同的拉力，使得每个掩膜版主体产生方向和大小均相同的回缩力，该回缩力为本发明实施例中掩膜版框架的受力侧受到的拉力。掩膜版框架的受力侧受到相同拉力作用后，位于中间位置的内边界由于没有非受力侧的内边界的支撑作用，因此受到的形变量较大，位于中间位置两侧的内边界由于存在非受力侧的内边界的固定作用受到拉力后产生的形变量较小。例如，参见图3，虚线箭头的方向为从受力侧的中间向非受力侧的指示方向。因此，本发明实施例中受力侧的外边界与相对应的内边界之间的厚度从大到小的方向也如图3虚线箭头所指的方 向。
需要说明的是，受力侧的外边界与该外边界相对应的内边界之间的厚度，按照受力侧的中间位置指向非受力侧的方向逐渐减小的趋势，可以为连续减小，或者非连续减小。如图3，受力侧的外边界与该外边界相对应的内边界之间的厚度的变化趋势为连续的，但不限于如图3所示的方式进行变化，其他变化方式也属于本发明的保护范围。在此不做具体限定。
本发明实施例提供的掩膜版框架可以适用于各种类型掩膜版的制作过程中。例如，可以应用在用于蒸镀高精度AMOLED的金属掩膜版框架，也可以应用在现有刻蚀掩膜版和电镀掩膜版的张网焊接中。在此不做具体限定。
本发明实施例提供的掩膜版框架，与传统的掩膜版框架相比，将受力侧的外边界与该外边界相对应的内边界之间的厚度，按照受力侧的中间位置指向非受力侧的方向逐渐减小的方式进行设计，如图3所示。因此，本发明实施例提供的掩膜版框架的受力侧的中间位置的厚度最厚，使得受力侧具有较强的抵抗力，受力侧中外边界与内边界之间的厚度越厚，形成的抵抗力越大，从而避免了掩膜版框架的变形，增加了掩膜版框架的稳定性。
在具体实施例中，参见图3，掩膜版框架10的内边界12组成的形状为矩形。
本发明实施例中的掩膜版框架的内边界为矩形，用于放置多个掩膜版主体。当然，掩膜版内边界组成的形状不仅限于矩形，还包括用于焊接掩膜版主体的其他形状，例如焊接异型屏的掩膜版主体的掩膜版框架的内边界的形状可以不为矩形。在此不做具体限定。
在具体实施例中，本发明实施例提供的上述掩膜版框架中，为了进一步提高掩膜版框架的稳定性，可以根据掩膜版的受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到拉力后的形变量来确定受力侧的厚度。具体地，受力侧的外边界与该外边界相对应的内边界之间的厚度，与以受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受 力侧在受到相同拉力后产生的形变量成正比相关关系。
在具体实施例中，本发明实施例提供的上述掩膜版框架中，为了进一步确定掩膜版框架中受力侧的外边界与内边界之间的厚度与以受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量的比例关系，具体地，满足公式(1)：
ΔD＝a+k*ΔSD(a、k、ΔSD均大于0)     (1)
a和k为常数，ΔSD为以受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量，ΔD为受力侧的外边界与相对应的内边界之间的厚度。所述形变量例如为掩膜版框架的受力侧在拉力方向上的位移量。
其中，a和k的值是根据不同型号的掩膜版框架决定的。具体地，a为掩膜版框架受力侧的外边界与该外边界所对应的内边界之间的厚度的最小值，以该厚度值的受力侧作为参考受力侧，k与掩膜版框架的材质以及掩膜版框架的形状保持性能有关，因此，k为经验常数。不同的掩膜版框架，a和k的值均不同。ΔD和ΔSD均为微米数量级。
在一个示例的实施例中，本发明实施例提供的上述掩膜版框架中，参见图4，受力侧13的外边界11的形状为朝向掩膜版框架外部凸起的弧形。
其中弧形中弧度的大小可以根据上述公式(1)进行设计，也可以自行设计弧度的大小，在此不做具体限定。
下面通过具体实施例，且以受力侧的外边界为弧形为例详细描述公式(1)的计算原理。
首先，为了更清楚地描述ΔSD的形变量，我们通过图示的形式进行解释。参见图5，作为参考比较例的掩膜版框架2为矩形，且受力侧的外边界与受力侧的内边界平行，掩膜版框架受力侧的外边界与内边界之间的厚度均相同。在对掩膜版进行焊接时，掩膜版主体1依次放置在掩膜版框架2中，在将掩膜版主体放置在掩膜版框架之前，需要在每次放置前，对每条掩膜版主体施加相同 的拉力，使得每条掩膜版主体产生方向和大小均相同的回缩力，由于掩膜版主体1产生的回缩力，会使得掩膜版框架2产生形变，由于掩膜版框架的结构，使得位于受力侧的中间位置处受到回缩力后产生的形变量最大，位于中间位置两侧的位置受到回缩力后产生的形变量逐渐减小。因此，在掩膜版主体1的回缩力的作用下，使得掩膜版框架2受力侧产生的形变量从中间向边缘逐渐减小，如图5，按照受力侧从中间向边缘的方向，产生的形变量依次为ΔSD1、ΔSD2和ΔSD3。其中，掩膜版框架2产生的形变量的数值根据实际应用的不同而不同，在此不做具体限定。因此，本发明根据比较例提供的掩膜版框架2的形变量来改进掩膜版框架的结构。
参见图6，本发明实施例提供的掩膜版框架是基于图5所示的比较例的掩膜版框架2进行的改进，即将受力侧的外边界11设为向掩膜版框架外部凸出的弧形形状，使得受力侧的外边界11和对应内边界12之间的厚度在受力侧的中间位置处最厚，并从中间位置朝向非受力侧逐渐减小至最小厚度a。为描述方便起见，将掩膜版框架2的受力侧的外边界11与内边界12之间具有恒定厚度a的受力侧，作为参考受力侧。参见图6，掩膜版框架10中受力侧的外边界与该外边界所对应的内边界之间的厚度的最小值为a。与图5所对应的掩膜版主体的位置，在图6中以水平虚线表示。参考图5和图6，在图5中的受力侧的变形量为ΔSD1的位置处，在图6中的受力侧的厚度设定为ΔD1，在图5中的受力侧的变形量为ΔSD2的位置处，在图6中的受力侧的厚度设定为ΔD2，在图5中的受力侧的变形量为ΔSD3的位置处，在图6中的受力侧的厚度设定为ΔD3。按照上述计算公式(1)，可以得到ΔD1＝a+k*ΔSD1，ΔD2＝a+k*ΔSD2，ΔD3＝a+k*ΔSD3。选取合适的a和k值，根据图6所示的本发明的实施例可以使掩膜版框架受力侧的形变量减小至零。
如上所述，本发明实施例提供的掩膜版框架10的上述结构可以抵消由于掩膜版框架在受到掩膜版主体的回缩力的情况下产生的形变量，增加了掩膜版框架的稳定性。
为了进一步增加掩膜版框架的稳定性，在根据公式(1)设计掩膜版框架的受力侧的外边界形状时，可以增加计算ΔD的次数，使得掩膜版框架的受力侧在任何位置受到相同拉力作用时，均能抵消该拉力。
根据一个示例，，计算ΔD的次数与利用本发明实施例提供的掩膜版框架焊接的掩膜版主体的个数相同。
需要说明的是，在计算ΔD和ΔSD时，可以选取与掩膜版主体的中心线对应的位置。
在示例实施例中，本发明实施例提供的上述掩膜版框架中，参见图7，受力侧13的外边界11的形状为阶梯状。
根据一个示例，为了进一步增强掩膜版框架的稳定性，受力侧的外边界设计为阶梯状时，可以根据公式(1)依次计算每一阶梯的厚度。其中每计算一个ΔD，则对应一个阶梯。
需要说明的是，本发明实施例提供的掩膜版框架均有相向而置的两个受力侧，两个受力侧的外边界均为弧形，或者两个受力侧的外边界均为阶梯状，或者，参见图8，一个受力侧13的外边界11为弧形，另一个受力侧13的外边界11为阶梯状。在此不做具体限定。
综上，本发明实施例提供的掩膜版框架的受力侧的外边界与相对应的内边界之间的厚度，按照受力侧的中间位置指向非受力侧的方向逐渐减小，具体地，掩膜版框架的受力侧的外边界的形状为弧形，或掩膜版框架的受力侧的外边界的形状为阶梯状，且受力侧中间位置处的外边界与相对应的内边界之间的厚度最厚。由于掩膜版框架的受力侧的外边界与相对应的内边界之间的厚度是根据受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量而对应地确定的，因此，本发明实施例提供的掩膜版框架的受力侧在受到外界拉力的作用后，加厚的受力侧具有较强的抵抗力，受力侧中外边界与内边界之间的厚度越厚，形成的抵抗力越大，从而避免了掩膜版框架的变形，增加了掩膜版框架的稳定性。
基于同一发明思想，本发明实施例还提供了一种掩膜版主体，包括利用本发明实施例提供的任一种掩膜版框架焊接的掩膜版主体。
在具体实施例中，本发明实施例提供的上述掩膜版主体中，参见图9，掩膜版框架的受力侧的阶梯状的外边界的阶梯个数与本发明实施例提供的掩膜版主体22的个数相同。例如，在图9中示出了5个掩膜版主体22的情况下，掩膜版框架的受力侧的阶梯状的外边界11包括A1、A2、A3、A4、A5共5个阶梯。
其中，图9中仅示意性的画出了掩膜版中包括5个掩膜版主体22，在实际应用中，可以用于放置多个掩膜版主体。在此仅是作为示意，不代表实际应用中掩膜版主体的大小和数量。
具体地，掩膜版框架在掩膜版主体的回缩力的影响下，使得受力侧受到大小相同的拉力，每一个掩膜版主体均具有相同的回缩力，则受力侧受到的拉力个数与掩膜版主体的个数相同。为了掩膜版框架在受到每一次拉力时，均有相对稳定的结构避免掩膜版框架不产生形变，根据一个实施例，阶梯状的阶梯个数与受力侧的内边界受到的拉力的个数相同，且每一阶梯的大小均通过公式(1)得到。
基于同一发明思想，本发明实施例还提供了一种掩膜版，参见图10，掩膜版包括掩膜版主体22和本发明实施例提供的任一种掩膜版框架10。其中，图10中，仅以掩膜版框架10的受力侧的外边界为弧形为例，当然也可以采用本发明实施例提供的任何一种掩膜版框架，在此不再赘述。
相比现有技术，本发明实施例提供的掩膜版具有以下有益效果：
1、由于本发明实施例提供的掩膜版框架具有较强的稳定性，不容易变形，因此根据本发明实施例提供的掩膜版框架对掩膜版主体进行焊接形成的掩膜版具有较强的稳定性，确保了像素位置的精度，解决了因掩膜版不稳定造成的混色问题。
2、本发明实施例提供的掩膜版，可以适用于不同尺寸、不同清晰程度的各种型号的掩膜版的制作。本发明实施例提供的掩膜版，为制作高精度的掩膜版提供了先决条件。
3、本发明实施例提供的掩膜版，仅对掩膜版框架的结构进行改进，并未在掩膜版主体上增加任何外置物体，因此为掩膜版的制作提高了更好的优化条件。
基于同一发明思想，本发明实施例还提供了一种基板，所述基板是利用本发明实施例提供的掩膜版制作的。
通过采用本发明实施例提供的掩膜版制作基板，可以进一步避免基板中的混色现象。本发明实施例提供的基板可以为阵列基板，或者彩膜基板等。
基于同一发明思想，本发明实施例还提供了一种显示面板，包括本发明实施例提供的基板。
基于同一发明思想，参见图11，本发明实施例还提供了一种掩膜版的制作方法，该方法包括：
S101、对掩膜版主体施加拉力，使得掩膜版主体产生与拉力方向相反方向的回缩力；
S102、将具有回缩力的掩膜版主体放在所述掩膜版框架中，并对所述掩膜版主体进行焊接。
现有技术中，在采用图1所示的掩膜版框架进行掩膜版的制作时，首先对掩膜版主体施加拉力，使得掩膜版主体产生相反反向的回缩力，如图2(a)所示；其次向掩膜版框架施加推力，使得金属掩膜版框架产生向外扩张的变形力，如图2(b)所示，其中由于施加的推力需要抵消每一掩膜版主体焊接时施加的拉力的作用，因此推力的大小需要根据每次焊接掩膜版主体时进行调节。一般地，推力是根据系统仿真以及生产工艺经验进行确定，然后生产工艺经验的幅度也各不相同，因此推力的大小不好掌握；最后，将具有回缩力的掩膜版主体放在掩膜版框架中进行焊接。由于掩膜版框架的推力的释放是动态的，逐级递 减的，因此，掩膜版框架的变形处于不同的变形状态中。
而本发明实施例采用本发明提供的掩膜版框架进行掩膜版的制作时，首先对掩膜版主体施加拉力，使得掩膜版主体产生相反反向的回缩力，如图2(a)所示；然后将具有回缩力的掩膜版主体放在掩膜版框架中进行焊接。由于本发明实施例提供的掩膜版框架的稳定性较强，且受到掩膜版主体的回缩力的影响时，自身结构可以抵消该回缩力对掩膜版框架的影响。因此，本发明实施例提供的掩膜版的制作方法，不仅简化了一道工序，即无需对掩膜版框架施加推力，又避免了推力的释放的动态过程造成对掩膜版框架的形变量。总之，本发明实施例提供的掩膜版的制作方法提高了掩膜版像素位置的精准度。
综上，本发明实施例提供的一种掩膜版框架及主体、掩膜版及制作方法、基板和显示面板，所述掩膜版框架的受力侧的外边界与相对应的内边界之间的厚度，按照所述受力侧的中间位置指向非受力侧的方向逐渐减小。因此，本发明实施例通过增加受力侧的外边界与内边界之间的厚度，使得较厚的受力侧在受到拉力的作用时，不容易发生形变。可见，本发明提供的掩膜版框架增强了抵抗外界拉力作用的能力，使得掩膜版框架在受到拉力作用后，不容易产生形变，提高了掩膜版框架的稳定性。
显然，本领域的技术人员可以对本发明进行各种改动和变型而不脱离本发明的精神和范围。这样，倘若本发明的这些修改和变型属于本发明权利要求及其等同技术的范围之内，则本发明也意图包含这些改动和变型在内。

Claims (9)

  1. 一种掩膜版框架，包括：
    环状框架体，所述环状框架体包括外边界和内边界，所述内边界限定容纳掩模板主体的空间；并且，
    所述掩膜版框架具有受力侧和非受力侧，所述受力侧承受掩膜版主体的拉力，所述非受力侧不承受掩膜版主体的作用力；
    其中，所述掩膜版框架的受力侧的外边界与相对应的内边界之间的厚度，按照所述受力侧的中间位置指向非受力侧的方向逐渐减小。
  2. 根据权利要求1所述的掩膜版框架，其特征在于，所述掩膜版框架的内边界组成的形状为矩形。
  3. 根据权利要求1所述的掩膜版框架，其特征在于，所述受力侧的外边界与相对应的内边界之间的厚度，与以所述受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量成正相关关系。
  4. 根据权利要求3所述的掩膜版框架，其特征在于，所述正相关关系用以下公式(1)表示：
    ΔD＝a+k*ΔSD   (1)
    其中，a、k、ΔSD均大于0，a和k为常数，ΔSD为以受力侧的外边界与相对应的内边界之间的最小厚度为恒定厚度的参考受力侧在受到相同拉力后产生的形变量，ΔD为受力侧的外边界与相对应的内边界之间的厚度。
  5. 根据权利要求4所述的掩膜版框架，其特征在于，所述受力侧的外边界的形状为朝向掩膜版框架的外部凸起的弧形。
  6. 根据权利要求4所述的掩膜版框架，其特征在于，所述受力侧的外边界的形状为阶梯状。
  7. 一种掩膜版，包括权利要求1-6任一权项所述的掩膜版框架；和
    连接在掩模板框架上的多个掩模板主体。
  8. 根据权利要求7所述的掩膜版，其特征在于，所述掩模板框架的所述受力侧的外边界的形状为阶梯状；所述阶梯状的阶梯个数与所述掩膜版主体的个数相同。
  9. 一种权利要求7所述的掩膜版的制作方法，其特征在于，该方法包括：
    对所述掩膜版主体施加拉力，使得所述掩膜版主体产生与拉力方向相反方向的回缩力；以及
    将具有回缩力的掩膜版主体放在所述掩膜版框架中，并对所述掩膜版主体进行焊接。
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