WO2017195603A1 - Optical component and laser processing device - Google Patents
Optical component and laser processing device Download PDFInfo
- Publication number
- WO2017195603A1 WO2017195603A1 PCT/JP2017/016545 JP2017016545W WO2017195603A1 WO 2017195603 A1 WO2017195603 A1 WO 2017195603A1 JP 2017016545 W JP2017016545 W JP 2017016545W WO 2017195603 A1 WO2017195603 A1 WO 2017195603A1
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- Prior art keywords
- film
- optical component
- thickness
- substrate
- transmittance
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/26—Deposition of carbon only
- C23C16/27—Diamond only
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
Definitions
- the present invention relates to an optical component and a laser processing machine equipped with the optical component.
- the CO 2 laser oscillated at a wavelength of 9 ⁇ m to 11 ⁇ m is capable of high-power oscillation and has a high absorption rate in resin, so it can be used for drilling holes in printed wiring boards built in electronic devices such as smartphones. Used.
- a protective window (protective window) is disposed between the condensing lens and the workpiece to prevent damage and deterioration of the condensing lens.
- the main performance required for the protective window is that it is highly transmissive to CO 2 laser, which is infrared light, and that it has wear resistance that can withstand wiping off adhered dust and spatter.
- Patent Document 1 a first Y 2 O 3 layer, a YF 3 layer, a second Y 2 O 3 layer, and a diamond-like carbon layer are laminated in this order from the substrate surface on the surface side of a ZnS substrate.
- An infrared transmission structure in which a diamond-like carbon layer having a thickness of 500 to 2000 nm is laminated has been proposed.
- Patent Document 1 it is said that an infrared transmission structure having excellent impact resistance and durability as compared with the conventional infrared transmission structure and having excellent peeling resistance and transmittance is realized.
- the infrared transmitting structure proposed in Patent Document 1 has good wear resistance because a diamond-like carbon layer is formed on the outermost layer, it is sufficiently optical when used as an optical component of a laser processing machine. There was a problem that performance could not be obtained.
- the optical component absorbs infrared light, a temperature distribution is generated on the ZnS substrate, and the laser transmission accuracy called the thermal lens effect. Decrease.
- the optical lens absorbs infrared light and a thermal lens effect occurs, making it impossible to achieve the desired hole position and hole shape. There was a problem that non-standard defective products occurred.
- the laser processing machine for drilling has achieved the required processing accuracy by limiting the speed of laser processing. End up.
- the present invention has been made to solve the above-described problems, and an object of the present invention is to provide an optical component having a high transmittance with respect to CO 2 laser light and excellent in wear resistance.
- the present invention is an optical component characterized in that a fluoride film, a Ge film, and a diamond-like carbon film (DLC film) are laminated in this order on at least one surface of a Ge substrate from the Ge substrate side.
- DLC film diamond-like carbon film
- the present invention it is possible to provide an optical component having excellent high transmittance has and abrasion resistance against CO 2 laser light. Moreover, the laser processing machine equipped with the optical component of the present invention can perform high-precision processing even during high-speed processing.
- FIG. 2 is a schematic cross-sectional view showing a configuration of an optical component according to Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing another configuration of the optical component according to Embodiment 1.
- FIG. 6 is a schematic cross-sectional view showing a configuration of an optical component according to Embodiment 2.
- FIG. 6 is a schematic diagram illustrating a configuration of a laser beam machine according to a third embodiment. It is a figure which shows the wavelength dependence of the transmittance
- FIG. It is a figure which shows the wavelength dependence of the transmittance
- Embodiment 1 FIG.
- the optical component according to Embodiment 1 of the present invention is characterized in that a fluoride film, a Ge film, and a diamond-like carbon film (DLC film) are laminated in this order on at least one surface of a Ge substrate from the Ge substrate side. It is what.
- FIG. 1 is a schematic cross-sectional view showing a configuration of an optical component according to Embodiment 1.
- the optical component includes a fluoride film 11 stacked on a Ge substrate 10, a Ge film 12 stacked on the fluoride film 11, and a DLC film stacked on the Ge film 12. 13 is provided on both sides of the Ge substrate 10.
- FIG. 2 is a schematic cross-sectional view showing another configuration of the optical component according to Embodiment 1.
- the optical component includes a fluoride film 11 stacked on the Ge substrate 10, a Ge film 12 stacked on the fluoride film 11, and a DLC film stacked on the Ge film 12. 13 is provided on one surface of the Ge substrate 10, and an antireflection film 15 different from the multilayer film 14 is provided on the other surface of the Ge substrate 10.
- the optical component of Patent Document 1 ZnS is used as a substrate.
- ZnS having a low thermal conductivity is used as a substrate, temperature distribution occurs in the substrate when laser processing is continuously performed. When such a temperature distribution occurs, the processing accuracy decreases due to the thermal lens effect, so that ZnS is not suitable as a substrate for optical components for laser processing machines. Therefore, in the optical component of the present invention, Ge having high thermal conductivity is used for the substrate.
- the Ge substrate 10 may be doped with an element other than Ge as long as optical performance and mechanical properties are not affected.
- the shape of the Ge substrate 10 is not limited.
- the protective window for a laser beam machine is preferably a disc having a diameter of 80 mm to 140 mm and a thickness of 2 mm to 10 mm.
- the fluoride film 11 laminated on the Ge substrate 10 only needs to contain at least one of fluorides such as YF 3 , YbF 3 , MgF 2 , BaF 2 , CaF 2, and the like in the infrared region. From the viewpoint of excellent permeability, it is preferably made of at least one selected from the group consisting of YF 3 , YbF 3 and MgF 2 .
- the film thickness of the fluoride film 11 is preferably 500 nm to 950 nm from the viewpoint of realizing high transmittance with respect to infrared light while ensuring film adhesion.
- the adhesion of the DLC film 13 can be ensured by providing the Ge film 12.
- the Ge film 12 By disposing the Ge film 12 between the DLC film 13 having a compressive stress and the fluoride film 11 having a tensile stress, the stress balance in the entire multilayer film 14 is maintained, and a fluorine film which is an interface having a weak adhesive force. This prevents a load from being applied between the fluoride film 11 and the Ge film 12 and between the fluoride film 11 and the Ge substrate 10.
- the film thickness of the Ge film 12 is preferably 50 nm to 150 nm, more preferably 100 nm to 130 nm, from the viewpoint of realizing high transmittance for infrared light while ensuring film adhesion. preferable.
- the DLC film 13 laminated on the Ge film 12 is made of diamond-like carbon having high stability as a substance and low reactivity with other materials.
- diamond-like carbon has high hardness and adhesion of spatter to diamond-like carbon is weak, it is possible to easily remove spatter by cleaning the optical member without worrying about scratches.
- Optical parts can be easily recycled and reused.
- the film thickness of the DLC film 13 is preferably 50 nm to 300 nm.
- each of the above films may be doped with other elements, or a thin film other than the above films may be formed.
- the antireflection film 15 is not limited, but for example, a YF 3 film having a thickness of 600 nm to 800 nm, a Ge film having a thickness of 110 nm to 180 nm, and a thickness of 50 nm to 800 nm from the Ge substrate 10 side. MgF 2 films having the above are stacked in this order.
- a wavelength of 9.3 ⁇ m or a wavelength is obtained as compared with the case where the multilayer film 14 is provided on both surfaces of the Ge substrate 10.
- the transmittance at 10.6 ⁇ m can be improved.
- any method can be used as long as it can form a film on the Ge substrate 10.
- a physical vapor deposition method such as a vacuum vapor deposition method or a sputtering method
- CVD method chemical vapor deposition method
- the fluoride film 11, the Ge film 12, and the antireflection film 15 are preferably formed by a vacuum deposition method from the viewpoint of excellent production efficiency when a film is formed using a plurality of materials.
- the DLC film 13 is preferably formed by a plasma CVD method from the viewpoint that the composition and thickness of the film can be accurately adjusted.
- the first embodiment it is possible to provide an optical component that has a high transmittance with respect to a CO 2 laser beam having a wavelength of 9 ⁇ m to 11 ⁇ m and is excellent in wear resistance.
- Embodiment 2 In the optical component according to the second embodiment, a fluoride film, a Ge film, and a DLC film are laminated in this order on at least one surface of the Ge substrate from the Ge substrate side, and the fluoride film and the Ge film are exposed. It is characterized by being covered with a DLC film.
- FIG. 3 is a schematic cross-sectional view showing the configuration of the optical component according to the second embodiment.
- the fluoride film 11 laminated on the Ge substrate 10 the Ge film 12 laminated on the fluoride film 11, the fluoride film 11 and the Ge film 12 are exposed.
- the multilayer film 20 including the fluoride film 11 and the DLC film 13 covering the Ge film 12 is provided on one surface of the Ge substrate 10, and the antireflection film 15 described in the first embodiment is the Ge substrate. 10 is provided on the other surface.
- the multilayer film 20 is provided on one surface of the Ge substrate 10, but the multilayer film 20 may be provided on both surfaces of the Ge substrate 10.
- the Ge substrate 10 Since the Ge substrate 10, the fluoride film 11, the Ge film 12, and the antireflection film 15 are the same as those described in the first embodiment, their descriptions are omitted.
- the film thickness of the DLC film 13 formed on the upper surface of the Ge film 12 is preferably 50 nm to 300 nm as in the first embodiment.
- the film thickness of the DLC film 13 formed so that the fluoride film 11 and the Ge film 12 are not exposed on the side surfaces of the fluoride film 11 and the Ge film 12 is a film in which the fluoride film 11 and the Ge film 12 are not exposed. It only needs to be thick.
- Such a DLC film 13 can be formed by adjusting the size of the opening of the mask when the film is formed by sputtering using the mask.
- the second embodiment it is possible to provide an optical component that has a high transmittance with respect to the CO 2 laser light, has excellent wear resistance, and does not corrode by a gas generated during processing.
- FIG. A laser beam machine according to Embodiment 3 includes the optical component according to Embodiment 1 or 2 described above.
- FIG. 4 is a schematic diagram showing the configuration of the laser processing machine according to the third embodiment.
- the laser processing machine includes a laser oscillator 30, a condensing lens 32 that condenses the laser light 31 emitted from the laser oscillator 30, and a workpiece such as the condensing lens 32 and a printed wiring board.
- a protective window 34 disposed in the middle of the optical path of the laser beam 31 with the object 33, and the optical component according to the first or second embodiment described above is used as the protective window 34.
- the protective window 34 is installed so that the multilayer film 14 described in the first embodiment or the multilayer film 20 described in the second embodiment faces the processing space side (the workpiece 33 side).
- the configuration of the laser processing machine shown in FIG. 4 is an example, and the configuration is not limited to this configuration as long as it includes a laser oscillator and an optical system.
- the laser beam 31 emitted from the laser oscillator 30 is condensed by the condenser lens 32, passes through the protective window 34, and is then irradiated to the workpiece 33 to form a hole. Is possible.
- the protective window 34 Since the optical component according to Embodiment 1 or 2 described above has a high transmittance with respect to the CO 2 laser beam, by using this as the protective window 34, the thermal lens effect caused by the absorption of the laser is prevented and processed. It is possible to realize a laser processing machine that can perform high-speed processing without causing a decrease in accuracy.
- the protective window 34 since the protective window 34 is installed so that the multilayer films 14 and 20 having the DLC film 13 formed on the outermost surface face the processing space, the protective window 34 can be used for a long time without worrying about the generation of scratches. Dust and spatter adhering to the surface can be easily removed.
- the protective window 34 can be separated from the workpiece 33 only by about 100 mm, the protective window 34 is exposed to a large amount of spatter and dust during processing. Since the optical component described in the second embodiment is also excellent in corrosion resistance, the life of the optical component of the laser beam machine can be improved by using it as the protective window 34.
- the third embodiment it is possible to provide a laser processing machine capable of improving the maintainability and performing high speed processing without causing a decrease in processing accuracy.
- Example 1 As an optical component, a multilayer film (from the Ge substrate side, MgF 2 film (thickness 500 nm) / Ge film (thickness 80 nm) / DLC film (thickness) is formed on one surface of the Ge substrate (surface to be a laser beam emission surface). 500 nm)), and an antireflection film (a YF 3 film (film thickness 650 nm) / Ge film (film thickness 130 nm) / MgF 2 film (from the Ge substrate side) on the other surface (the surface to which the laser beam is incident)) A protective window for a laser beam machine having a thickness of 200 nm)) was produced.
- the Ge substrate As the Ge substrate, a disk having a diameter of 90 mm and a thickness of 5 mm was used.
- the MgF 2 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by sputtering.
- the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
- the configuration of the optical component produced in Example 1 is as follows: DLC film (film thickness 500 nm) / Ge film (film thickness 80 nm) / MgF 2 film (film thickness 500 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 650 nm) / Ge film (thickness 130 nm) / MgF 2 film (thickness 200 nm).
- FIG. 5 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 1.
- the optical component of Example 1 was able to achieve a transmittance of 97.2% at a laser wavelength of 9.3 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- an MgF 2 film, a Ge film, and a DLC film are formed in this order from the Ge substrate side on one surface of the Ge substrate (the surface that is the laser light emission surface), and the MgF 2 film and the Ge film are exposed.
- the anti-reflection film (the YF 3 film (film thickness 650 nm from the Ge substrate side) / Ge film (film thickness 130 nm) / A protective window for a laser beam machine on which an MgF 2 film (thickness: 200 nm) was formed was produced.
- a disk having a diameter of 90 mm and a thickness of 5 mm was used as the Ge substrate.
- the MgF 2 film and the Ge film constituting the multilayer film were formed by a vacuum deposition method, and the DLC film constituting the multilayer film was formed by a sputtering method using a mask having a predetermined opening. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
- the configuration of the optical component produced in Example 2 is as follows: DLC film (film thickness 500 mm) / Ge film (film thickness 80 nm) / MgF 2 film (film thickness 500 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 650 nm) / Ge film (thickness 130 nm) / MgF 2 film (thickness 200 nm).
- Example 2 In the optical component of Example 2, a transmittance of 97.2% was realized at a laser wavelength of 9.3 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- the multilayer film did not peel after the wear test (1), and was excellent in wear resistance. Further, as a result of the corrosion test (1), the multilayer film peeled off in the optical component of Example 1, whereas the multilayer film did not peel off in the optical component of Example 2, and the third multilayer film was not peeled off.
- the lifetime of the optical component in a corrosive environment could be improved by covering the first layer of MgF 2 film and the second layer of GeF film without exposing the first layer of DLC film.
- Comparative Example 1 optical analysis of an optical component corresponding to Patent Document 1 was performed.
- the configuration of the optical component of Comparative Example 1 is as follows: DLC film (film thickness 300 nm) / Ge film (film thickness 30 nm) / Y 2 O 3 film (film thickness 30 nm) / YF 3 film (film thickness 600 nm) / Y 2 O 3 Film (film thickness 30 nm) / ZnS substrate (thickness 5 mm) / Y 2 O 3 film (film thickness 80 nm) / YF 3 film (1300 nm) / MgF 2 film (film thickness 400 nm).
- FIG. 6 is a diagram illustrating the wavelength dependence of the transmittance when optical analysis is performed on the optical component of Comparative Example 1 using the optical thin film design software Essential Macleod.
- the optical component of Comparative Example 1 had a transmittance of 95% or less at a laser wavelength of 9.3 ⁇ m.
- this optical component is applied as a protective window for a laser beam machine, a thermal lens effect is generated, which causes a problem that the machining accuracy deteriorates during high-speed machining.
- Example 3 Laser processing machine protection with multilayer films (YF 3 film (film thickness: 660 nm) / Ge film (film thickness: 120 nm) / DLC film (film thickness: 80 nm)) formed on both sides of the Ge substrate as optical components A window was made.
- a disk having a diameter of 110 mm and a thickness of 5 mm was used as the Ge substrate.
- the MgF 2 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by plasma CVD.
- the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
- the configuration of the optical component produced in Example 3 is as follows: DLC film (film thickness 80 nm) / Ge film (film thickness 120 nm) / YF 3 film (film thickness 660 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 660 nm) / Ge film (film thickness 120 nm) / DLC film (film thickness 80 nm).
- FIG. 7 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 3. As can be seen from FIG. 7, in the optical component of Example 3, a transmittance of 99.0% was realized at a laser wavelength of 9.3 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- Example 4 The configuration of the optical component is as follows: DLC film (film thickness 130 nm) / Ge film (film thickness 110 nm) / YbF 3 film (film thickness 670 nm) / Ge substrate (thickness 5 mm) / YbF 3 film (film thickness 670 nm) / Ge film An optical component of Example 4 was fabricated in the same manner as Example 3 except that the film thickness was changed to (film thickness 110 nm) / DLC film (film thickness 130 nm).
- FIG. 8 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 4.
- FIG. 8 in the optical component of Example 4, a transmittance of 98.4% was realized at a laser wavelength of 9.3 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- Example 5 The configuration of the optical component is DLC film (film thickness 50 nm) / Ge film (film thickness 130 nm) / MgF 2 film (film thickness 640 nm) / Ge substrate (thickness 5 mm) / MgF 2 film (film thickness 640 nm) / Ge film (film)
- An optical component of Example 5 was fabricated in the same manner as Example 3 except that the thickness was changed to 130 nm) / DLC film (film thickness 50 nm).
- FIG. 9 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 5. As can be seen from FIG. 9, in the optical component of Example 5, a transmittance of 99.3% was realized at a laser wavelength of 9.3 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- a multilayer film (from the Ge substrate side: YF 3 film (film thickness: 700 nm) / Ge film (film thickness: 110 nm) / DLC film (film thickness) is formed on one surface of the Ge substrate (the surface to be a laser beam emission surface). 300 nm)) and an antireflection film (YF 3 film (thickness: 750 nm) from the Ge substrate side / Ge film (thickness: 150 nm) / MgF 2 film (from the Ge substrate side) A protective window for a laser beam machine having a thickness of 200 nm)) was produced.
- a disc having a diameter of 110 mm and a thickness of 5 mm was used as the Ge substrate.
- the YF 3 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by plasma CVD. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
- the configuration of the optical component produced in Example 6 is as follows: DLC film (film thickness 300 nm) / Ge film (film thickness 110 nm) / YF 3 film (film thickness 700 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 750 nm) / Ge film (thickness 150 nm) / MgF 2 film (thickness 200 nm).
- FIG. 10 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 6. As can be seen from FIG. 10, in the optical component of Example 6, a transmittance of 98.4% was realized at the laser wavelength of 10.6 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- Example 7 The configuration of the optical component is as follows: DLC film (film thickness 50 nm) / Ge film (film thickness 110 nm) / YbF 3 film (film thickness 950 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film thickness 750 nm) / Ge film An optical component of Example 7 was produced in the same manner as Example 6 except that the thickness was changed to (film thickness 150 nm) / MgF 2 film (film thickness 200 nm).
- FIG. 11 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 7. As can be seen from FIG. 11, in the optical component of Example 7, a transmittance of 98.2% was realized at the laser wavelength of 10.6 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
- Example 8 The configuration of the optical component is as follows: DLC film (thickness 170 nm) / Ge film (thickness 150 nm) / MgF 2 film (thickness 600 nm) / Ge substrate (thickness 5 mm) / YF 3 film (thickness 750 nm) / Ge film An optical component of Example 8 was produced in the same manner as Example 6 except that the film thickness was changed to (film thickness 150 nm) / MgF 2 film (film thickness 200 nm).
- FIG. 12 is a diagram showing the wavelength dependence of the transmittance in the optical component of Example 8. As can be seen from FIG. 12, in the optical component of Example 8, a transmittance of 98.3% was realized at the laser wavelength of 10.6 ⁇ m. This is sufficient optical performance as a protective window for a laser beam machine that desirably has a transmittance of 97% or more.
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Abstract
Description
本発明の実施の形態1に係る光学部品は、Ge基板の少なくとも片面に、該Ge基板側から、フッ化物膜、Ge膜及びダイヤモンドライクカーボン膜(DLC膜)がこの順に積層されたことを特徴とするものである。 Embodiment 1 FIG.
The optical component according to Embodiment 1 of the present invention is characterized in that a fluoride film, a Ge film, and a diamond-like carbon film (DLC film) are laminated in this order on at least one surface of a Ge substrate from the Ge substrate side. It is what.
そこで、本発明の光学部品では、熱伝導率が高いGeを基板に用いている。Ge基板10には、光学性能や機械特性に影響が出なければ、Ge以外の元素がドープされていてもよい。また、Ge基板10の形状は限定されるものではないが、例えばレーザ加工機用保護ウィンドウとしては、80mm~140mmの直径及び2mm~10mmの厚さを有する円板であることが好ましい。 In the optical component of Patent Document 1, ZnS is used as a substrate. However, when ZnS having a low thermal conductivity is used as a substrate, temperature distribution occurs in the substrate when laser processing is continuously performed. When such a temperature distribution occurs, the processing accuracy decreases due to the thermal lens effect, so that ZnS is not suitable as a substrate for optical components for laser processing machines.
Therefore, in the optical component of the present invention, Ge having high thermal conductivity is used for the substrate. The
実施の形態2に係る光学部品は、Ge基板の少なくとも片面に、該Ge基板側から、フッ化物膜、Ge膜及びDLC膜がこの順に積層されており、フッ化物膜及びGe膜が露出することなくDLC膜で覆われていることを特徴とするものである。 Embodiment 2. FIG.
In the optical component according to the second embodiment, a fluoride film, a Ge film, and a DLC film are laminated in this order on at least one surface of the Ge substrate from the Ge substrate side, and the fluoride film and the Ge film are exposed. It is characterized by being covered with a DLC film.
実施の形態3に係るレーザ加工機は、上記した実施の形態1又は2による光学部品を備えることを特徴とするものである。 Embodiment 3 FIG.
A laser beam machine according to Embodiment 3 includes the optical component according to Embodiment 1 or 2 described above.
光学部品として、Ge基板の一方の面(レーザ光の出射面となる面)に多層膜(Ge基板側からMgF2膜(膜厚500nm)/Ge膜(膜厚80nm)/DLC膜(膜厚500nm))を形成し、他方の面(レーザ光の入射面となる面)に反射防止膜(Ge基板側からYF3膜(膜厚650nm)/Ge膜(膜厚130nm)/MgF2膜(膜厚200nm))を形成したレーザ加工機用保護ウィンドウを作製した。Ge基板としては、直径90mm及び厚さ5mmの円板を使用した。多層膜を構成するMgF2膜及びGe膜並びに反射防止膜は、真空蒸着法により形成し、多層膜を構成するDLC膜は、スパッタリング法により形成した。また、作製した光学部品の透過率は、フーリエ変換型赤外分光光度計を使用して評価した。
実施例1で作製した光学部品の構成は、DLC膜(膜厚500nm)/Ge膜(膜厚80nm)/MgF2膜(膜厚500nm)/Ge基板(厚さ5mm)/YF3膜(膜厚650nm)/Ge膜(膜厚130nm)/MgF2膜(膜厚200nm)であった。 [Example 1]
As an optical component, a multilayer film (from the Ge substrate side, MgF 2 film (thickness 500 nm) / Ge film (thickness 80 nm) / DLC film (thickness) is formed on one surface of the Ge substrate (surface to be a laser beam emission surface). 500 nm)), and an antireflection film (a YF 3 film (film thickness 650 nm) / Ge film (film thickness 130 nm) / MgF 2 film (from the Ge substrate side) on the other surface (the surface to which the laser beam is incident)) A protective window for a laser beam machine having a thickness of 200 nm)) was produced. As the Ge substrate, a disk having a diameter of 90 mm and a thickness of 5 mm was used. The MgF 2 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by sputtering. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
The configuration of the optical component produced in Example 1 is as follows: DLC film (film thickness 500 nm) / Ge film (film thickness 80 nm) / MgF 2 film (film thickness 500 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 650 nm) / Ge film (thickness 130 nm) / MgF 2 film (thickness 200 nm).
光学部品として、Ge基板の一方の面(レーザ光の出射面となる面)に、Ge基板側から、MgF2膜、Ge膜及びDLC膜をこの順に形成し且つMgF2膜及びGe膜が露出することなくDLC膜で覆われていて、他方の面(レーザ光の入射面となる面)に反射防止膜(Ge基板側からYF3膜(膜厚650nm)/Ge膜(膜厚130nm)/MgF2膜(膜厚200nm))を形成したレーザ加工機用保護ウィンドウを作製した。Ge基板としては、直径90mm及び厚さ5mmの円板を使用した。多層膜を構成するMgF2膜及びGe膜は、真空蒸着法により形成し、多層膜を構成するDLC膜は、所定の開口部を有するマスクを用いてスパッタリング法により形成した。また、作製した光学部品の透過率は、フーリエ変換型赤外分光光度計を使用して評価した。
実施例2で作製した光学部品の構成は、DLC膜(膜厚500mm)/Ge膜(膜厚80nm)/MgF2膜(膜厚500nm)/Ge基板(厚さ5mm)/YF3膜(膜厚650nm)/Ge膜(膜厚130nm)/MgF2膜(膜厚200nm)であった。 [Example 2]
As an optical component, an MgF 2 film, a Ge film, and a DLC film are formed in this order from the Ge substrate side on one surface of the Ge substrate (the surface that is the laser light emission surface), and the MgF 2 film and the Ge film are exposed. The anti-reflection film (the YF 3 film (film thickness 650 nm from the Ge substrate side) / Ge film (film thickness 130 nm) / A protective window for a laser beam machine on which an MgF 2 film (thickness: 200 nm) was formed was produced. As the Ge substrate, a disk having a diameter of 90 mm and a thickness of 5 mm was used. The MgF 2 film and the Ge film constituting the multilayer film were formed by a vacuum deposition method, and the DLC film constituting the multilayer film was formed by a sputtering method using a mask having a predetermined opening. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
The configuration of the optical component produced in Example 2 is as follows: DLC film (film thickness 500 mm) / Ge film (film thickness 80 nm) / MgF 2 film (film thickness 500 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 650 nm) / Ge film (thickness 130 nm) / MgF 2 film (thickness 200 nm).
比較例1では、特許文献1に対応する光学部品の光学解析を実施した。
比較例1の光学部品の構成は、DLC膜(膜厚300nm)/Ge膜(膜厚30nm)/Y2O3膜(膜厚30nm)/YF3膜(膜厚600nm)/Y2O3膜(膜厚30nm)/ZnS基板(厚さ5mm)/Y2O3膜(膜厚80nm)/YF3膜(1300nm)/MgF2膜(膜厚400nm)とした。
図6は、比較例1の光学部品について、光学薄膜設計ソフトEssential Macleodを使用して光学解析を実施した際の、透過率の波長依存性を示す図である。図6から分かるように、比較例1の光学部品では、レーザ波長である9.3μmにおいて、95%以下の透過率であった。この光学部品をレーザ加工機用保護ウィンドウとして適用した場合、熱レンズ効果が生じるため、高速加工時に加工精度が悪化するという問題が生じる。 [Comparative Example 1]
In Comparative Example 1, optical analysis of an optical component corresponding to Patent Document 1 was performed.
The configuration of the optical component of Comparative Example 1 is as follows: DLC film (film thickness 300 nm) / Ge film (
FIG. 6 is a diagram illustrating the wavelength dependence of the transmittance when optical analysis is performed on the optical component of Comparative Example 1 using the optical thin film design software Essential Macleod. As can be seen from FIG. 6, the optical component of Comparative Example 1 had a transmittance of 95% or less at a laser wavelength of 9.3 μm. When this optical component is applied as a protective window for a laser beam machine, a thermal lens effect is generated, which causes a problem that the machining accuracy deteriorates during high-speed machining.
光学部品として、Ge基板の両面に、多層膜(Ge基板側からYF3膜(膜厚660nm)/Ge膜(膜厚120nm)/DLC膜(膜厚80nm))を形成したレーザ加工機用保護ウィンドウを作製した。Ge基板としては、直径110mm及び厚み5mmの円板を使用した。多層膜を構成するMgF2膜及びGe膜並びに反射防止膜は、真空蒸着法により形成し、多層膜を構成するDLC膜は、プラズマCVD法により形成した。また、作製した光学部品の透過率は、フーリエ変換型赤外分光光度計を使用して評価した。
実施例3で作製した光学部品の構成は、DLC膜(膜厚80nm)/Ge膜(膜厚120nm)/YF3膜(膜厚660nm)/Ge基板(厚さ5mm)/YF3膜(膜厚660nm)/Ge膜(膜厚120nm)/DLC膜(膜厚80nm)であった。 [Example 3]
Laser processing machine protection with multilayer films (YF 3 film (film thickness: 660 nm) / Ge film (film thickness: 120 nm) / DLC film (film thickness: 80 nm)) formed on both sides of the Ge substrate as optical components A window was made. As the Ge substrate, a disk having a diameter of 110 mm and a thickness of 5 mm was used. The MgF 2 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by plasma CVD. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
The configuration of the optical component produced in Example 3 is as follows: DLC film (film thickness 80 nm) / Ge film (film thickness 120 nm) / YF 3 film (film thickness 660 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 660 nm) / Ge film (film thickness 120 nm) / DLC film (film thickness 80 nm).
光学部品の構成を、DLC膜(膜厚130nm)/Ge膜(膜厚110nm)/YbF3膜(膜厚670nm)/Ge基板(厚さ5mm)/YbF3膜(膜厚670nm)/Ge膜(膜厚110nm)/DLC膜(膜厚130nm)に変更したこと以外は、実施例3と同様にして実施例4の光学部品を作製した。 [Example 4]
The configuration of the optical component is as follows: DLC film (film thickness 130 nm) / Ge film (film thickness 110 nm) / YbF 3 film (film thickness 670 nm) / Ge substrate (thickness 5 mm) / YbF 3 film (film thickness 670 nm) / Ge film An optical component of Example 4 was fabricated in the same manner as Example 3 except that the film thickness was changed to (film thickness 110 nm) / DLC film (film thickness 130 nm).
光学部品の構成を、DLC膜(膜厚50nm)/Ge膜(膜厚130nm)/MgF2膜(膜厚640nm)/Ge基板(厚さ5mm)/MgF2膜(膜厚640nm)/Ge膜(膜厚130nm)/DLC膜(膜厚50nm)に変更したこと以外は、実施例3と同様にして実施例5の光学部品を作製した。 [Example 5]
The configuration of the optical component is DLC film (film thickness 50 nm) / Ge film (film thickness 130 nm) / MgF 2 film (film thickness 640 nm) / Ge substrate (thickness 5 mm) / MgF 2 film (film thickness 640 nm) / Ge film (film) An optical component of Example 5 was fabricated in the same manner as Example 3 except that the thickness was changed to 130 nm) / DLC film (film thickness 50 nm).
光学部品として、Ge基板の一方の面(レーザ光の出射面となる面)に多層膜(Ge基板側からYF3膜(膜厚700nm)/Ge膜(膜厚110nm)/DLC膜(膜厚300nm))を形成し、他方の面(レーザ光の入射面となる面)に反射防止膜(Ge基板側からYF3膜(膜厚750nm)/Ge膜(膜厚150nm)/MgF2膜(膜厚200nm))を形成したレーザ加工機用保護ウィンドウを作製した。Ge基板としては、直径110mm及び厚さ5mmの円板を使用した。多層膜を構成するYF3膜及びGe膜並びに反射防止膜は、真空蒸着法により形成し、多層膜を構成するDLC膜は、プラズマCVD法により形成した。また、作製した光学部品の透過率は、フーリエ変換型赤外分光光度計を使用して評価した。
実施例6で作製した光学部品の構成は、DLC膜(膜厚300nm)/Ge膜(膜厚110nm)/YF3膜(膜厚700nm)/Ge基板(厚さ5mm)/YF3膜(膜厚750nm)/Ge膜(膜厚150nm)/MgF2膜(膜厚200nm)であった。 [Example 6]
As an optical component, a multilayer film (from the Ge substrate side: YF 3 film (film thickness: 700 nm) / Ge film (film thickness: 110 nm) / DLC film (film thickness) is formed on one surface of the Ge substrate (the surface to be a laser beam emission surface). 300 nm)) and an antireflection film (YF 3 film (thickness: 750 nm) from the Ge substrate side / Ge film (thickness: 150 nm) / MgF 2 film (from the Ge substrate side) A protective window for a laser beam machine having a thickness of 200 nm)) was produced. As the Ge substrate, a disc having a diameter of 110 mm and a thickness of 5 mm was used. The YF 3 film and Ge film constituting the multilayer film and the antireflection film were formed by vacuum deposition, and the DLC film constituting the multilayer film was formed by plasma CVD. Moreover, the transmittance of the produced optical component was evaluated using a Fourier transform infrared spectrophotometer.
The configuration of the optical component produced in Example 6 is as follows: DLC film (film thickness 300 nm) / Ge film (film thickness 110 nm) / YF 3 film (film thickness 700 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film) The thickness was 750 nm) / Ge film (thickness 150 nm) / MgF 2 film (thickness 200 nm).
光学部品の構成を、DLC膜(膜厚50nm)/Ge膜(膜厚110nm)/YbF3膜(膜厚950nm)/Ge基板(厚さ5mm)/YF3膜(膜厚750nm)/Ge膜(膜厚150nm)/MgF2膜(膜厚200nm)に変更したこと以外は、実施例6と同様にして実施例7の光学部品を作製した。 [Example 7]
The configuration of the optical component is as follows: DLC film (film thickness 50 nm) / Ge film (film thickness 110 nm) / YbF 3 film (film thickness 950 nm) / Ge substrate (thickness 5 mm) / YF 3 film (film thickness 750 nm) / Ge film An optical component of Example 7 was produced in the same manner as Example 6 except that the thickness was changed to (film thickness 150 nm) / MgF 2 film (film thickness 200 nm).
光学部品の構成を、DLC膜(膜厚170nm)/Ge膜(膜厚150nm)/MgF2膜(膜厚600nm)/Ge基板(厚さ5mm)/YF3膜(膜厚750nm)/Ge膜(膜厚150nm)/MgF2膜(膜厚200nm)に変更したこと以外は、実施例6と同様にして実施例8の光学部品を作製した。 [Example 8]
The configuration of the optical component is as follows: DLC film (thickness 170 nm) / Ge film (thickness 150 nm) / MgF 2 film (thickness 600 nm) / Ge substrate (thickness 5 mm) / YF 3 film (thickness 750 nm) / Ge film An optical component of Example 8 was produced in the same manner as Example 6 except that the film thickness was changed to (film thickness 150 nm) / MgF 2 film (film thickness 200 nm).
Claims (5)
- Ge基板の少なくとも片面に、該Ge基板側から、フッ化物膜、Ge膜及びダイヤモンドライクカーボン膜(DLC膜)がこの順に積層されたことを特徴とする光学部品。 An optical component comprising a fluoride film, a Ge film, and a diamond-like carbon film (DLC film) laminated in this order on at least one surface of a Ge substrate from the Ge substrate side.
- 前記フッ化物膜が、YF3、YbF3及びMgF2からなる群から選択される少なくとも一種からなることを特徴とする請求項1に記載の光学部品。 The optical component according to claim 1, wherein the fluoride film is made of at least one selected from the group consisting of YF 3 , YbF 3, and MgF 2 .
- 前記フッ化物膜及び前記Ge膜が露出することなく前記ダイヤモンドライクカーボン膜で覆われていることを特徴とする請求項1又は2に記載の光学部品。 3. The optical component according to claim 1, wherein the fluoride film and the Ge film are covered with the diamond-like carbon film without being exposed.
- 前記フッ化物膜の膜厚が500nm~950nmであり、前記Ge膜の膜厚が50nm~150nmであり、前記DLC膜の膜厚が50nm~300nmであることを特徴とする請求項1~3のいずれか一項に記載の光学部品。 The film thickness of the fluoride film is 500 nm to 950 nm, the film thickness of the Ge film is 50 nm to 150 nm, and the film thickness of the DLC film is 50 nm to 300 nm. The optical component as described in any one.
- 請求項1~4のいずれか一項に記載の光学部品を備えることを特徴とするレーザ加工機。 A laser processing machine comprising the optical component according to any one of claims 1 to 4.
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