CN111630415A - Optical component and laser processing machine - Google Patents

Optical component and laser processing machine Download PDF

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Publication number
CN111630415A
CN111630415A CN201980008632.3A CN201980008632A CN111630415A CN 111630415 A CN111630415 A CN 111630415A CN 201980008632 A CN201980008632 A CN 201980008632A CN 111630415 A CN111630415 A CN 111630415A
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film
substrate
main surface
optical component
protection window
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CN111630415B (en
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福永圭佑
增田晓雄
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/14—Protective coatings, e.g. hard coatings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/16—Removal of by-products, e.g. particles or vapours produced during treatment of a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Physical Vapour Deposition (AREA)
  • Laser Beam Processing (AREA)

Abstract

The optical component includes: the multilayer film includes a substrate including a main surface and a second surface formed on a back surface side of the main surface, and a multilayer film formed on at least one of the main surface and the second surface, the substrate including at least Ge, and the multilayer film including at least 4 layers of an oxide film, a fluoride amorphous film, a Ge film, and a DLC film laminated in this order from a side close to the substrate. Thus, an optical component having improved heat resistance, exhibiting stable optical performance without deteriorating optical characteristics due to the influence of heat, and a method for manufacturing the optical component are provided.

Description

Optical component and laser processing machine
Technical Field
The present invention relates to an optical component that can exhibit stable optical performance even in a high-temperature environment, and a laser processing machine equipped with the optical component.
Background
Conventionally, a laser processing machine has been used for drilling holes in a printed wiring board stored in a smartphone or an electronic device such as a tablet PC, for example. The laser used for the laser processing machine is mainly CO of infrared light with oscillation wavelength of 9-11 μm2And (4) laser. CO 22The laser can oscillate with high output power and has high absorptivity in the resin.
In a laser beam machine for drilling, a condenser lens is disposed above a machining area. Therefore, the condenser lens may be damaged or deteriorated by dust and spatter generated during the hole forming process. Therefore, by disposing an optical member called a protection window between the object and the condenser lens, damage and deterioration of the condenser lens are prevented.
Dust and spatter generated during the hole forming process are likely to adhere to the protective window. In addition, it is in CO2Dust and sputtered material adhering to the optical path of the laser light absorb CO2The temperature rises due to the laser light, and therefore the protection window becomes high in temperature. Therefore, for the protection window, CO as infrared light is required2Laser light transmittance and environmental resistance. The environmental resistance means abrasion resistance that causes no damage to the surface even if the resin sputter or copper sputter is adhered and heat resistance that exhibits stable optical performance even when exposed to a high-temperature environment.
For example, as an optical component used in an infrared sensor or the like and excellent in wear resistance of coating and transmittance of infrared rays, it is known to form a ZnS (zinc sulfide) substrate on the front surface side of the substrate in the order from the substrate surface2O3(YF) layer, YF3(Yttrium fluoride) layer, second Y2O3An optical component having a multilayer film in which an (yttrium oxide) layer, a Ge (germanium) layer, and a DLC (diamond-like carbon) layer are laminated. The DLC layer forming the multilayer film has a compressive stress, and therefore a load is applied to the entire multilayer film, and the DLC layer in the multilayer film has a compressive stressAt the interface with low adhesion, the film may be peeled off. Therefore, in this optical member, the Ge layer is formed as an adhesion layer of the DLC layer, and further, the YF layer is formed as the YF3Adhesion layer of layer, Y formed by oxide2O3And a layer for securing adhesion of the multilayer film (see, for example, patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 2008-268277
Disclosure of Invention
Problems to be solved by the invention
However, the optical member described in patent document 1 does not consider heat resistance. Thus, YF in a multilayer film due to the influence of heat3Layer and Y2O3The layers undergo atomic interdiffusion at the interface and the film is deteriorated. Therefore, when the optical member described in patent document 1 is used as a protective window of a laser processing machine exposed to a high-temperature environment, there is a problem that stable optical characteristics cannot be obtained.
The present invention has been made to solve the above problems, and an object of the present invention is to: an optical component capable of stably exhibiting optical performance even in a high-temperature environment is obtained.
Means for solving the problems
The optical member according to the present invention includes: a substrate having a main surface and a second surface formed on a back surface side of the main surface; and a multilayer film formed on at least the main surface of the main surface and the second surface, the substrate containing Ge (germanium), the multilayer film including: a film is formed by laminating an oxide film, a fluoride amorphous film, a Ge film and a DLC film in this order from the side close to the substrate.
ADVANTAGEOUS EFFECTS OF INVENTION
In the present invention, the heat resistance of the optical member can be improved by providing a layer in which an oxide film, a fluoride amorphous film, a Ge film, and a DLC film are laminated in this order from the side close to the substrate on the surface of the substrate containing Ge. Thus, an optical component which exhibits stable optical performance without deteriorating optical characteristics due to the influence of heat can be provided.
Drawings
Fig. 1 is a schematic view of a laser processing machine mounted with an optical component according to embodiment 1 of the present invention.
Fig. 2 is a schematic diagram showing a cross section of an optical member according to embodiment 1.
Fig. 3 is a diagram showing a modification of the optical member according to embodiment 1.
Fig. 4 is a schematic diagram showing a cross section of an optical member according to embodiment 2 of the present invention.
Detailed Description
Hereinafter, preferred embodiments of the optical member of the present invention will be described with reference to the drawings.
Embodiment 1.
Fig. 1 is a schematic view of a laser processing machine 1 mounted with a protection window 15 as an optical component according to embodiment 1 of the present invention. Fig. 2 is a schematic view showing a cross section of the protection window 15 of fig. 1.
As shown in fig. 1, the laser processing machine 1 includes: a laser oscillator 11, a condenser lens 13, and a protection window 15. In the laser oscillator 11, CO is used2And (4) laser. The CO is2The oscillation wavelength of the laser was 9.3 μm. The laser beam 11A emitted from the laser oscillator 11 is condensed by the condenser lens 13, passes through the protection window 15, and forms an image on the surface of the workpiece 100 such as a printed wiring board. Then, the workpiece 100 is subjected to drilling processing or the like by the laser beam 11A.
Use of CO2Optical materials for a light-collecting system of a laser beam machine often have a relatively high refractive index. Therefore, the condenser lens 13 is disposed at a position close to the workpiece 100. The protection window 15 is disposed between the condenser lens 13 and the workpiece 100, since it protects the condenser lens 13 from dust and spatters generated during the hole forming process. Therefore, the protection window 15 is disposed at a distance of about 100mm from the workpiece 100. Therefore, the protection window 15 is exposed to a severe environment of a large amount of dust and sputtered material during laser processing. As for the dust and spatter attached to the protection window 15,since the laser beam 11A is absorbed and generates heat, the protection window 15 is required to have heat resistance in addition to the transmittance of the laser beam 11A.
As shown in fig. 2, the protection window 15 has a substrate 150 having a main surface 150A formed on one surface and a second surface 150B formed on the back surface side of the main surface 150A. The main surface 150A is a surface facing the workpiece 100 on the machining space side, and the second surface 150B is a surface facing the condenser lens 13.
Conventionally, ZnS (zinc sulfide) has been mainly used as a substrate for an optical component, and the protective window 15 of embodiment 1 is formed of Ge (germanium) having an infrared laser transmittance higher than that of ZnS to form the substrate 150. Further, ZnS has low thermal conductivity, and therefore, when laser processing is continuously performed, a large temperature gradient is generated in the substrate. Due to the temperature gradient generated in the substrate, a distribution of refractive index is generated in the optical member. Then, a phenomenon called thermal lens effect occurs in the optical member, and the accuracy of laser processing is lowered. Therefore, ZnS is not suitable as a material of the substrate 150 of the protection window 15 of the laser processing machine 1. The thermal conductivity is higher than ZnS for Ge forming the substrate 150. Note that, in the material of the substrate 150, an element other than Ge may be added together with Ge.
The multilayer film 2 is formed on the main surface 150A and the second surface 150B of the substrate 150, respectively. The protection window 15 is disposed so that the main surface 150A of the substrate 150 faces the workpiece 100.
The multilayer film 2 includes a film in which 4 layers of an oxide film 21, a fluoride amorphous film 22, a Ge film 23, and a DLC film 24 are stacked in this order from the side close to the substrate 150. These films may be formed by covering the entire surfaces of the main surface 150A and the second surface 150B so that the substrate 150 is not exposed, or may be formed by covering a part of the surfaces so that a part of the substrate is exposed.
Examples of the material for forming the oxide film 21 include Y2O3(Yttrium oxide), HfO2(hafnium oxide), ZrO2(zirconium oxide), Ta2O3(tantalum oxide), TiO2(titanium oxide), SiO (silicon oxide), Al2O3(alumina), and the like. In the use of infrared CO2LaserIn the case of (2), Y having excellent infrared light transmittance is preferably used2O3、HfO2、ZrO2Any of the above. The thickness of the oxide film 21 is preferably 5nm or more in order to ensure the adhesion of the film. The thickness of the oxide film 21 is preferably 150nm or less in order to ensure the transmittance of infrared light.
Examples of the material for forming the fluoride amorphous film 22 include YF3(YbF) YbF3Ytterbium fluoride and MgF2(magnesium fluoride), BaF2(barium fluoride), CaF2(calcium fluoride) and the like. In the use of infrared CO2In the case of laser light, YF, which has excellent infrared light transmittance, is preferably used3、YbF3Or MgF2Any of the above. The thickness of the fluoride amorphous film 22 is preferably 500nm to 950nm in order to ensure the transmittance of infrared light.
The Ge film 23 has good adhesion to the DLC film 24. Therefore, by forming the Ge film 23, adhesion of the DLC film 24 to the substrate 150 can be ensured. The thickness of the Ge film 23 is preferably 50nm to 150nm in order to satisfy both the film adhesion and the infrared light transmittance.
The DLC film 24 has high hardness. Therefore, the wear resistance when wiping off the dirt adhering to the film is excellent. The DLC film 24 has high stability as a substance and is not easily reactive with other materials. Therefore, dust, metal spatters, and the like generated during the drilling of the printed board and the like are less likely to adhere to the DLC film 24. Therefore, the DLC film 24 can be formed to suppress the adhesion of dirt to the protection window 15. Further, by forming the DLC film 24, dirt adhering to the protection window 15 can be easily removed. The DLC film 24 is preferably 50nm or more in thickness to ensure abrasion resistance. The thickness of the DLC film 24 is preferably 300nm or less in order to ensure the transmittance of infrared light.
The oxide film 21 has excellent adhesion to the Ge substrate 150 and the fluoride amorphous film 22. Therefore, the oxide film 21 can ensure adhesion between the fluoride amorphous film 22 and the substrate 150. Note that, as long as the permeability and heat resistance of the multilayer film 2 are not reduced, there is no problem even if other elements are added to these 4 layers. Further, as long as the permeability and heat resistance of the multilayer film 2 are not lowered, there is no problem even if other thin films are formed in addition to the 4 layers.
Therefore, the protection window 15 of embodiment 1 includes, on its surface: a multilayer film 2 in which 4 layers of an oxide film 21, a fluoride amorphous film 22, a Ge film 23, and a DLC film 24 are laminated in this order from the side close to the substrate 150. Further, between the oxide film 21 and the Ge film 23, there are disposed: the structure of the fluoride is controlled to be an amorphous (noncrystalline) fluoride amorphous film 22. Further, the high-speed diffusion path such as the grain boundary of the fluoride is eliminated, and the atomic interdiffusion between the oxide film 21 and the fluoride amorphous film 22 is suppressed. Thus, even if the protection window 15 is heated to a high temperature during laser processing, the multilayer film 2 does not undergo a change in film quality due to atomic diffusion. Therefore, the protection window 15 can exhibit stable optical performance.
In embodiment 1, the multilayer film 2 is formed on both the main surface 150A and the second surface 150B of the substrate 150 of the protective window 15, but the multilayer film 2 may not be formed on the second surface 150B of the substrate 150. For example, as in the protection window 15A of modification 1 shown in fig. 3, the multilayer film 2 may be formed on the main surface 150A of the substrate 150, and the antireflection film 30 different from the multilayer film 2 may be formed on the second surface 150B.
Next, the results of comparing the characteristics of the protection window 15 as the optical member of embodiment 1 and the conventional optical member as comparative example 1 will be described.
As a method for forming a film on the surface of a substrate of an optical component, there is a generally known film forming method such as a PVD method (physical vapor deposition method) typified by a vacuum deposition method and a sputtering method, or a CVD method (chemical vapor deposition method) typified by a plasma CVD method. However, any method may be used as long as a film can be formed on a substrate.
First, the protection window 15 of embodiment 1 will be explained. The substrate 150 of the protection window 15 is formed of Ge. Of the substrate 150The shape is a disk shape having a diameter of 120mm and a thickness of 5 mm. Further, the multilayer film 2 is formed on the main surface 150A of the substrate 150. In the multilayer film 2, Y is used for the oxide film 212O3. In addition, in the multilayer film 2, YF is used in the fluoride amorphous film 223。
Further, on the main surface 150A of the substrate 150, there are formed: the oxide film 21 (Y) is formed in this order from the side close to the main surface 150A of the substrate 1502O3: film thickness 50nm), fluoride amorphous film 22 (YF)3: a film thickness of 570nm), a Ge film 23 (film thickness of 120nm), and a DLC film 24 (film thickness of 150 nm).
On the other hand, on the second surface 150B of the substrate 150, there are formed: and an antireflection film 30 having a transmittance of 99% or more at a wavelength of 9.3 [ mu ] m. The antireflection film 30 is provided with: YF is formed on the substrate 150 from the side close to the second surface 150B3Film (film thickness 670nm), Ge film (film thickness 130nm), MgF2The film (thickness 200nm) was laminated. The structure of the antireflection film 30 is not limited to this.
The fluoride amorphous film 22, the Ge film 23, and the antireflection film 30 are formed by a vacuum deposition method. The DLC film 24 is formed by sputtering.
Generally, if the film material is slowly cooled on a substrate by raising the film formation temperature, the structure becomes crystalline. On the other hand, if the film formation temperature is lowered and the film material is rapidly cooled on the substrate, the film becomes amorphous without a crystalline structure. In the formation of the fluoride amorphous film 22, YF is used3The structure of (1) is amorphous, YF in vacuum evaporation method is used3The film forming temperature of (2) was set to 150 ℃.
Next, the optical member of comparative example 1 will be described. In the optical member of comparative example 1, YF of the fluoride amorphous film 22 constituting the multilayer film 2 was formed3This is different from the protection window 15 of embodiment 1 in that it is crystalline instead of amorphous. The other structure is the same as that of the protection window 15 of embodiment 1. In the optical member of comparative example 1, YF was used3The structure of (2) is crystalline, and is obtained by vacuum evaporationYF3The film forming temperature of (2) was set to 210 ℃.
As described above, the multilayer film formed on the main surface of the substrate of the optical member of comparative example 1 includes: an oxide film (Y) is formed on the substrate in this order from the side close to the main surface of the substrate2O3: film thickness 50nm), fluoride crystal film (YF)3: 570nm thick), Ge film (120 nm thick), DLC film (150 nm thick). On the other hand, an antireflection film 30 similar to the protection window 15 of embodiment 1 is formed on the second surface of the substrate of the optical member of comparative example 1.
Next, YF of the main surface was applied to the protection window 15 of embodiment 1 and the optical member of comparative example 13Analysis of the structure of (1) and calculation of the infrared absorption rate.
XRD analysis was used in the analysis of the structure. Also, results of XRD analysis: will appear from YF3The diffraction peak due to the crystallization of (2) is regarded as a crystalline substance, and YF does not appear3The diffraction peak due to the crystal of (2) is amorphous.
For the calculation of the infrared absorption, the transmittance and reflectance of a laser beam having a wavelength λ of 9.3 μm were used. In addition, a fourier transform infrared spectrophotometer is used for measuring the transmittance and reflectance of laser light.
The infrared absorption rate is calculated by the following equation based on the transmittance and reflectance of the laser beam measured by using a fourier transform type infrared spectrophotometer.
(infrared absorptivity) ═ 100% - (transmittance) - (reflectance)
The calculation of the infrared absorption rate was performed 2 times before and after the heat treatment of the protective window 15 of embodiment 1 and the optical member of comparative example 1. The heat treatment was carried out at 200 ℃ for 12 hours in the atmosphere.
Table 1 shows YF on the main surface of the protection window 15 of embodiment 1 and the optical member of comparative example 13The analysis result of the structure of (1) and the calculation result of the infrared absorption rate.
[ Table 1]
Figure BDA0002585997710000081
As shown in the XRD analysis results of table 1, YF is the protective window 15 of embodiment 13The structure of (a) becomes amorphous. In contrast, YF was the optical member of comparative example 13The structure of (A) is crystalline.
From table 1, the calculation results of the infrared absorption rate of the protection window 15 of embodiment 1 are 2.2% before the heat treatment and 2.1% after the heat treatment. On the other hand, the infrared absorption of the optical member of comparative example 1 was calculated to be 2.8% before the heat treatment and 4.1% after the heat treatment.
The protection window of the laser beam machine preferably has an infrared absorption rate of 3.0% or less, and is preferably as low as possible. The protection window 15 of embodiment 1 has sufficient optical performance as the protection window 15 of the laser beam machine 1 because the infrared absorption rate is less than 3.0% before and after the heat treatment. Further, the protection window 15 of embodiment 1 has an infrared absorption rate after heat treatment of about half of that of comparative example 1 which is a conventional optical member. From the above results, it was confirmed that: the protection window 15 of embodiment 1 has improved heat resistance compared to conventional optical members.
Therefore, according to the protection window 15 of embodiment 1, the oxide film 21, the fluoride amorphous film 22, the Ge film 23, and the DLC film 24 are formed in this order from at least the side close to the main surface 150A of the substrate 150, using Ge as the substrate 150. Thus, the protection window 15 of embodiment 1 has high transmittance, heat resistance, and abrasion resistance. Therefore, the protection window 15 of embodiment 1 can reduce the loss of the laser beam of the laser processing machine. The protection window 15 of embodiment 1 can exhibit stable optical performance even when exposed to high heat during laser processing.
Embodiment 2.
Next, the protection window 15B of embodiment 2 will be described with reference to fig. 4. The protection window 15B of embodiment 2 is different from the protection window 15 of embodiment 1 in the configuration of the multilayer film 2B formed on the main surface 150A of the substrate 150. The other structures are the same as those in embodiment 1.
The multilayer film 2 of embodiment 1 is formed by stacking 4 oxide film 21, fluoride amorphous film 22, Ge film 23, and DLC film 24 in this order from the side close to the substrate 150. In contrast, the multilayer film 2B of embodiment 2 includes, as shown in fig. 4, a film in which 5 layers of an oxide film 21, a fluoride amorphous film 22, a 2 nd oxide film 25, a Ge film 23, and a DLC film 24 are laminated in this order from the side close to the substrate 150.
The 2 nd oxide film 25 has: the weakest interface in the multilayer film 2B, that is, the fluoride amorphous film 22 and the Ge film 23, is brought into close contact with each other, and peeling of the multilayer film 2B is suppressed.
In the protection window 15B shown in fig. 4, a multilayer film 2B is formed on the main surface 150A of the substrate 150, and an antireflection film 30 different from the multilayer film 2B is formed on the second surface 150B. The multilayer film 2B formed on the main surface 150A of the substrate 150 is formed by, for example, sequentially forming the oxide film 21 (Y) from the side close to the main surface 150A of the substrate 1502O3: film thickness 25nm), fluoride amorphous film 22 (YF)3: film thickness 570nm), 2 nd oxide film 25 (Y)2O3: film thickness 25nm), Ge film 23 (film thickness 120nm), and DLC film 24 (film thickness 150 nm).
On the other hand, an antireflection film 30 having a transmittance of 99% or more at a wavelength of 9.3 μm is formed on the second surface 150B of the substrate 150. The antireflection film 30 is configured as follows: YF is formed on the substrate 150 from the side close to the second surface 150B3Film (film thickness 670nm), Ge film (film thickness 130nm), MgF2The film (thickness 200nm) was laminated. The structure of the antireflection film 30 is not limited to this.
Here, other elements may be added to the layers constituting the multilayer film 2B as long as there is no influence of degrading the optical performance and mechanical properties of the multilayer film 2B. Further, as long as there is no influence of deterioration of the optical performance and mechanical properties of the multilayer film 2B, other thin films may be formed in the layers other than the layers constituting the multilayer film 2B. Further, the oxide film 21 and the 2 nd oxide film 25 may be films formed using the same oxide or films formed using different types of oxides.
Therefore, the multilayer film 2B of embodiment 2 is formed by stacking 5 layers of the oxide film 21, the fluoride amorphous film 22, the 2 nd oxide film 25, the Ge film 23, and the DLC film 24 in this order from the side close to the substrate 150. Accordingly, the protection window 15B of embodiment 2 has excellent heat resistance and can stably exhibit optical performance even in a high-temperature environment.
Further, in the protection window 15B according to embodiment 2, by providing the 2 nd oxide film 25 between the fluoride amorphous film 22 and the Ge film 23, the fluoride amorphous film 22 and the Ge film 23 can be closely adhered to each other, and peeling of the multilayer film 2B can be suppressed.
Description of reference numerals
1, laser processing machine; 11a laser oscillator; 11A laser; 13 condenser lenses, 15A, 15B protection windows (optical members); 2. 2B a multilayer film; 21 an oxide film; 22 a fluoride amorphous film; a 23Ge film; 24 a DLC film; 25 a 2 nd oxide film; 30 an antireflection film; 100 of a workpiece; 150a substrate; 150A major face; 150B second side.

Claims (6)

1. An optical component, comprising:
a substrate including a main surface and a second surface formed on a back surface side of the main surface; and
a multilayer film formed on at least the main surface of the main surface and the second surface,
the substrate is formed to contain Ge and is,
the multilayer film comprises: and a film in which at least 4 layers of an oxide film, a fluoride amorphous film, a Ge film, and a DLC film are laminated in this order from the side close to the substrate.
2. The optical component of claim 1,
the oxide film contains Y2O3、HfO2And ZrO2Any of the above-mentioned materials may be used,
the fluoride amorphous film comprises YF3、YbF3And MgF2Any of the above.
3. The optical component of claim 2,
the thickness of the oxide film is 5 to 150nm,
the thickness of the fluoride amorphous film is 500 to 950nm,
the thickness of the Ge film is 50-150 nm,
the DLC film has a thickness of 50 to 300 nm.
4. The optical component of claim 3,
a 2 nd oxide film between the fluoride amorphous film and the Ge film,
the 2 nd oxide film contains Y2O3、HfO2And ZrO2Any of the above.
5. The optical member according to claim 4, wherein the thickness of the 2 nd oxide film is 5 to 150 nm.
6. A laser beam machine having a laser oscillator and an optical system of laser beam irradiated from the laser oscillator,
the optical system having an optical component as claimed in claim 3 or claim 5,
the optical member is disposed so that the main surface faces a processing space side.
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CN111630415B (en) 2022-03-01
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