WO2017175511A1 - Condensateur à film, film pour condensateur et procédé de production de condensateur à film - Google Patents

Condensateur à film, film pour condensateur et procédé de production de condensateur à film Download PDF

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Publication number
WO2017175511A1
WO2017175511A1 PCT/JP2017/007315 JP2017007315W WO2017175511A1 WO 2017175511 A1 WO2017175511 A1 WO 2017175511A1 JP 2017007315 W JP2017007315 W JP 2017007315W WO 2017175511 A1 WO2017175511 A1 WO 2017175511A1
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Prior art keywords
film
organic material
capacitor
dielectric
counter electrode
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PCT/JP2017/007315
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English (en)
Japanese (ja)
Inventor
智道 市川
智生 稲倉
小林　真一
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株式会社村田製作所
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Priority to JP2018510267A priority Critical patent/JP6627969B2/ja
Priority to DE212017000044.9U priority patent/DE212017000044U1/de
Publication of WO2017175511A1 publication Critical patent/WO2017175511A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40—High-molecular-weight compounds
    • C08G18/58—Epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/721—Two or more polyisocyanates not provided for in one single group C08G18/73 - C08G18/80
    • C08G18/725—Combination of polyisocyanates of C08G18/78 with other polyisocyanates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/74—Polyisocyanates or polyisothiocyanates cyclic
    • C08G18/76—Polyisocyanates or polyisothiocyanates cyclic aromatic
    • C08G18/7657—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings
    • C08G18/7664—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups
    • C08G18/7671—Polyisocyanates or polyisothiocyanates cyclic aromatic containing two or more aromatic rings containing alkylene polyphenyl groups containing only one alkylene bisphenyl group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72—Polyisocyanates or polyisothiocyanates
    • C08G18/77—Polyisocyanates or polyisothiocyanates having heteroatoms in addition to the isocyanate or isothiocyanate nitrogen and oxygen or sulfur
    • C08G18/78—Nitrogen
    • C08G18/79—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates
    • C08G18/797—Nitrogen characterised by the polyisocyanates used, these having groups formed by oligomerisation of isocyanates or isothiocyanates containing carbodiimide and/or uretone-imine groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose

Definitions

  • the present invention relates to a film capacitor, a capacitor film, and a method for manufacturing a film capacitor.
  • the film for capacitors of the present invention specifically relates to a film used as a dielectric resin film of a film capacitor.
  • a film capacitor having a structure in which a first counter electrode and a second counter electrode facing each other with a resin film interposed therebetween are arranged while using a flexible resin film as a dielectric.
  • the film capacitor usually has a substantially cylindrical shape formed by winding a resin film as a dielectric, and a first external terminal is provided on each of the first end surface and the second end surface facing each other of the column. An electrode and a second external terminal electrode are formed.
  • the first counter electrode is electrically connected to the first external terminal electrode
  • the second counter electrode is electrically connected to the second external terminal electrode.
  • Patent Document 1 describes using a dielectric resin film made of a thermosetting resin.
  • the resin composition constituting the dielectric resin film described in Patent Document 1 includes a first atom containing at least one functional group having a relatively low molar polarizability selected from a methylene group, an aromatic ring, and an ether group.
  • a second atomic group including at least one functional group having a relatively high molar polarizability selected from a hydroxyl group, an amino group, and a carbonyl group, and having an absorption band strength of the first atomic group
  • the condition that the value represented by (sum) / (sum of absorption band intensities of the second atomic group) is 1.0 or more is satisfied.
  • the resin composition is a cured product obtained by reacting at least two kinds of organic materials including a first organic material such as a phenoxy resin and a second organic material such as an isocyanate compound. It is described that it is preferable.
  • the film capacitor can be used at a high frequency without any problem. Furthermore, when the resin composition is a cured product obtained by reaction of at least two kinds of organic materials, the glass transition point can be set to 130 ° C. or higher, and thus the heat resistance of the dielectric resin film is increased. Has been.
  • the withstand voltage that is, the withstand voltage strength at a specific temperature is studied. It wasn't.
  • An object of the present invention is to provide a film capacitor including a capacitor film having high dielectric breakdown strength and excellent voltage resistance, a capacitor film, and a method for manufacturing the film capacitor.
  • the film capacitor of the present invention is a film capacitor comprising a dielectric resin film and a first counter electrode and a second counter electrode facing each other across the dielectric resin film, wherein the dielectric resin film It is the film for capacitors of the invention.
  • the capacitor film of the present invention is a capacitor film comprising a cross-linked product of a first organic material and a second organic material, wherein the second organic material is a polyisocyanate having a plurality of isocyanate groups, One organic material has a plurality of hydroxyl groups and has a branched structure.
  • the capacitor film of the present invention comprises a cross-linked product of a first organic material and a second organic material. That is, the capacitor film of the present invention is a cured product obtained by the reaction of the first organic material and the second organic material, and the hydroxyl group of the first organic material reacts with the isocyanate group of the second organic material. It has a crosslinked structure formed as described above. Therefore, as in Patent Document 1, the heat resistance of the film can be increased.
  • the capacitor film of the present invention is characterized by using a first organic material having a branched structure, whereby a film having high dielectric breakdown strength and excellent voltage resistance can be obtained.
  • a film obtained by crosslinking the first organic material and the second organic material is formed as compared with the case where the first organic material having a linear structure is used.
  • Molecular chains are intricately intertwined. Therefore, when a voltage is applied to the film from the outside, it is considered that stress is not concentrated locally and the film is hardly broken.
  • Patent Document 1 in the experimental example, a high molecular weight bisphenol A type epoxy resin having an epoxy group at the terminal is used as the first organic material, and tolylene diisocyanate (TDI) or diphenylmethane diisocyanate is used as the second organic material. A cured product obtained by reacting these using (MDI) is described.
  • TDI tolylene diisocyanate
  • MDI diphenylmethane diisocyanate
  • MDI diphenylmethane diisocyanate
  • the capacitor film of the present invention has high dielectric breakdown strength and excellent voltage resistance. Therefore, in the film capacitor of the present invention, the thickness of the dielectric resin film can be reduced while maintaining a predetermined dielectric breakdown strength. As a result, the film capacitor can be reduced in size.
  • the method for producing a film capacitor of the present invention includes a step of forming a dielectric resin film by forming a resin solution into a film shape and curing, a first counter electrode facing each other with the dielectric resin film interposed therebetween, and And a step of forming a second counter electrode, wherein the resin solution includes a first organic material and a second organic material, and the second organic material has a plurality of isocyanate groups.
  • Polyisocyanate wherein the first organic material has a plurality of hydroxyl groups and has a branched structure.
  • the dielectric breakdown strength is high and can provide the film capacitor provided with the film for capacitors which is excellent in withstand voltage property, the film for capacitors, and the manufacturing method of a film capacitor.
  • FIG. 1 is a cross-sectional view schematically showing an example of a film capacitor including the capacitor film of the present invention.
  • the film for capacitors of the present invention and the film capacitor including the film will be described.
  • the present invention is not limited to the following configurations, and can be applied with appropriate modifications without departing from the scope of the present invention.
  • a combination of two or more of the individual desirable configurations of the present invention described below is also the present invention.
  • FIG. 1 is a cross-sectional view schematically showing an example of a film capacitor including the capacitor film of the present invention.
  • a film capacitor 1 shown in FIG. 1 is a wound type film capacitor, and includes a first dielectric resin film 11 and a second dielectric resin film 12 in a wound state, and a first dielectric resin film 11 or a second dielectric.
  • a first external terminal electrode that includes a first counter electrode 21 and a second counter electrode 22 that face each other with the body resin film 12 interposed therebetween, and that is electrically connected to the first counter electrode 21 and the second counter electrode 22, respectively. 31 and a second external terminal electrode 32 are provided.
  • the first counter electrode 21 is formed on the first dielectric resin film 11, and the second counter electrode 22 is formed on the second dielectric resin film 12.
  • the first counter electrode 21 is formed so as to reach one side edge of the first dielectric resin film 11 but not to the other side edge.
  • the second counter electrode 22 is formed so as not to reach one side edge of the second dielectric resin film 12 but to the other side edge.
  • the first counter electrode 21 and the second counter electrode 22 are made of, for example, an aluminum film.
  • the first dielectric resin film 11 and the second dielectric resin film 12 are in a stacked state by being wound. As shown in FIG. 1, the end of the first counter electrode 21 that reaches the side edge of the first dielectric resin film 11, and the side of the second dielectric resin film 12 in the second counter electrode 22 The first dielectric resin film 11 and the second dielectric resin film 12 are shifted from each other in the width direction so that both ends reaching the edge are exposed. Then, the first dielectric resin film 11 and the second dielectric resin film 12 are wound to obtain a substantially cylindrical capacitor body.
  • each of the first dielectric resin film 11 and the second dielectric resin film 12 is arranged so that the second dielectric resin film 12 is outside the first dielectric resin film 11. Is wound so that each of the first counter electrode 21 and the second counter electrode 22 faces inward.
  • the first external terminal electrode 31 and the second external terminal electrode 32 are formed by spraying, for example, zinc on each end face of the substantially cylindrical capacitor body obtained as described above.
  • the first external terminal electrode 31 is in contact with the exposed end portion of the first counter electrode 21, thereby being electrically connected to the first counter electrode 21.
  • the second external terminal electrode 32 is in contact with the exposed end of the second counter electrode 22, thereby being electrically connected to the second counter electrode 22.
  • the film capacitor may have a cylindrical winding shaft.
  • the winding axis is disposed on the central axis of the first dielectric resin film and the second dielectric resin film in the wound state, and the first dielectric resin film and the second dielectric resin film are wound around the winding axis. It becomes the winding axis when doing.
  • the wound body of the first dielectric resin film 11 and the second dielectric resin film 12 is like an ellipse or an ellipse. May be crushed so as to have a cross-sectional shape, resulting in a more compact shape.
  • the capacitor film of the present invention is used as the dielectric resin film provided in the film capacitor.
  • the capacitor film of the present invention comprises a cross-linked product of a first organic material and a second organic material. That is, the capacitor film of the present invention is a cured product obtained by the reaction of the first organic material and the second organic material, and the hydroxyl group of the first organic material reacts with the isocyanate group of the second organic material. It has a crosslinked structure formed as described above. In the capacitor film of the present invention, it is not necessary for all of the hydroxyl groups of the first organic material and the isocyanate groups of the second organic material to react, and some of the hydroxyl groups and isocyanate groups may remain. . In particular, it is preferable that the hydroxyl group residue is larger than the isocyanate group residue.
  • the hydroxyl group can be confirmed from a peak at 3400 to 3700 cm ⁇ 1
  • the isocyanate group can be confirmed from a peak at 2000 to 2400 cm ⁇ 1 .
  • the first organic material has a plurality of hydroxyl groups (OH groups) and has a branched structure. That is, the first organic material is composed of a plurality of molecular chains and has a plurality of hydroxyl groups as a whole molecule. As long as the first organic material has a plurality of hydroxyl groups as a whole molecule, the number of hydroxyl groups in each molecular chain is not limited, and the number of hydroxyl groups in each molecular chain may be different. Moreover, a molecular chain having no hydroxyl group may exist. Among them, it is preferable that all the molecular chains constituting the first organic material have one or more hydroxyl groups.
  • the first organic material preferably has an epoxy group.
  • the first organic material is preferably a phenoxy resin, and more preferably a high molecular weight bisphenol A type epoxy resin having an epoxy group at a terminal and a branched structure.
  • the first organic material may be a polyol such as a polyether polyol or a polyester polyol.
  • the molecular weight of the first organic material is preferably 20,000 or more from the viewpoint of obtaining the flexibility of the film.
  • the molecular weight of the first organic material means a weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) and calculated based on a polystyrene standard sample.
  • two or more organic materials having a plurality of hydroxyl groups and having a branched structure may be used in combination as the first organic material.
  • the second organic material is a polyisocyanate having a plurality of isocyanate groups (NCO groups).
  • the second organic material functions as a curing agent that cures the film by reacting with the hydroxyl group of the first organic material to form a crosslinked structure.
  • the polyisocyanate preferably has 2 or more and 6 or less isocyanate groups, and more preferably 2 or more and 3 or less isocyanate groups.
  • polyisocyanate examples include aromatic polyisocyanates such as diphenylmethane diisocyanate (MDI) and tolylene diisocyanate (TDI), and aliphatic polyisocyanates such as hexamethylene diisocyanate (HDI).
  • aromatic polyisocyanate is preferable, MDI or TDI is more preferable, and MDI is more preferable.
  • the weight ratio between the first organic material and the second organic material is not particularly limited, but is preferably 10/90 or more, and more preferably 20/80 or more. More preferably, 30/70 or more is more preferable, 90/10 or less is preferable, 80/20 or less is more preferable, and 70/30 or less is more preferable.
  • the weight ratio of the first organic material is preferably higher than the weight ratio of the second organic material.
  • the capacitor film of the present invention can also contain additives for adding other functions.
  • smoothness can be imparted by adding a leveling agent.
  • the additive is more preferably a material that has a functional group that reacts with a hydroxyl group and / or an isocyanate group and forms a part of the crosslinked structure of the cured product.
  • a material include a resin having at least one functional group selected from the group consisting of an epoxy group, a silanol group, and a carboxyl group.
  • the capacitor film of the present invention is preferably obtained by forming a resin solution containing the first organic material and the second organic material into a film, and then heat-treating the resin solution.
  • the capacitor film of the present invention thus obtained is excellent in voltage resistance.
  • the dielectric breakdown strength of the capacitor film of the present invention is preferably 300 V / ⁇ m or more, and more preferably 340 V / ⁇ m or more.
  • the capacitor film of the present invention is also excellent in heat resistance.
  • the glass transition point (Tg) of the capacitor film of the present invention is preferably 130 ° C. or higher, more preferably 160 ° C. or higher, and further preferably 169 ° C. or higher.
  • Example 1 A phenoxy resin having a branched structure was prepared as the first organic material, and MDI (diphenylmethane diisocyanate) was prepared as the second organic material.
  • a high molecular weight bisphenol A type epoxy resin (molecular weight: 50,000) having an epoxy group at a terminal and having a branched structure was used. Specifically, 400 parts by weight of bisphenol A diglycidyl ether, 224 parts by weight of bisphenol A, 6 parts by weight of ⁇ , ⁇ -bis (4-hydroxyphenyl) -4- (4-hydroxy- ⁇ , ⁇ -dimethylbenzyl) -ethylbenzene Part, 1.48 parts by weight of tetramethylammonium hydroxide aqueous solution and 210 parts by weight of toluene are put into a pressure-resistant reaction vessel and subjected to a polymerization reaction at 135 ° C. for 6 hours in a nitrogen gas atmosphere to obtain the desired bisphenol A type. An epoxy resin was obtained.
  • the first organic material and the second organic material were mixed at a weight ratio shown in Table 1 to obtain a resin solution.
  • the phenoxy resin was dissolved in a methyl ethyl ketone solvent, and MDI dissolved in methyl ethyl ketone was mixed with the phenoxy resin solution.
  • the obtained resin solution was molded on a PET film by a doctor blade coater to obtain an uncured film having a thickness of 3 ⁇ m.
  • the film of Example 1 was obtained by heat-curing the film by heat treatment for 2 hours in a hot air oven set at 150 ° C.
  • Example 2 A film was prepared in the same manner as in Example 1 except that the molecular weight of the first organic material was changed to 40,000, and the film of Example 2 was obtained.
  • Example 3 A film was prepared in the same manner as in Example 1 except that the molecular weight of the first organic material was changed to 30,000, and the film of Example 3 was obtained.
  • Comparative Example 1 A film was produced in the same manner as in Example 1 except that a phenoxy resin having a linear structure was used as the first organic material, and a film of Comparative Example 1 was obtained.
  • a phenoxy resin having the above linear structure a high molecular weight bisphenol A type epoxy resin (molecular weight: 50,000) having an epoxy group at the terminal and having a linear structure was used.
  • the glass transition point (Tg) was measured by DMA (Dynamic viscoelasticity measuring apparatus, "RSA-III” manufactured by TA INSTRUMENTS). Measurement conditions were as follows: the temperature was raised from room temperature to 250 ° C. at a rate of temperature rise of 10 ° C./min, the wave number was 10 rad / sec, the strain was 0.1%, and the temperature at which the loss tangent (tan ⁇ ) showed the maximum peak value was determined . Table 1 shows the Tg of each film.
  • DMA Dynamic viscoelasticity measuring apparatus, "RSA-III” manufactured by TA INSTRUMENTS. Measurement conditions were as follows: the temperature was raised from room temperature to 250 ° C. at a rate of temperature rise of 10 ° C./min, the wave number was 10 rad / sec, the strain was 0.1%, and the temperature at which the loss tangent (tan ⁇ ) showed the maximum peak value was determined . Table 1 shows the Tg of each film.
  • the dielectric breakdown strength of each film after thermosetting was measured by the following method. Capacitance decreases due to film breakage under an electric field application method in which each electrode film is formed with vapor deposition electrodes on both surfaces and used as an evaluation sample, and the electric field intensity is maintained at 25 V / ⁇ m increments and each electric field intensity is maintained for 10 minutes. The electric field strength that was 0% of the initial value was defined as the dielectric breakdown strength. The measurement temperature was 125 ° C. In this measurement, the number of samples for evaluation was set to 5 for each film, and the value at which the failure frequency was 50% in the Weibull distribution was adopted as the average value of the dielectric breakdown strength. The dielectric breakdown strength of each film is shown in Table 1.
  • the molecular weight of the first organic material means a weight average molecular weight (Mw) measured by gel permeation chromatography (GPC) and calculated based on a polystyrene standard sample.
  • the glass transition point Tg was 165 ° C. and the dielectric breakdown strength was 250 V / ⁇ m.
  • the glass transition point Tg was about 170 ° C., and the dielectric breakdown strength was 340 V / ⁇ m or more. From the above results, it was confirmed that not only heat resistance but also voltage resistance can be increased by using a phenoxy resin having a branched structure as the first organic material.

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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
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  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
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Abstract

Condensateur à film pourvu d'un film de résine diélectrique, et de première et seconde contre-électrodes qui se font face, la résine diélectrique étant intercalée entre elles, le condensateur à film étant caractérisé en ce que le film de résine diélectrique est un film pour condensateur comprenant une substance réticulée d'un premier matériau organique et d'un second matériau organique, le second matériau organique étant un polyisocyanate ayant une pluralité de groupes isocyanate, et le premier matériau organique ayant une pluralité de groupes hydroxyle et ayant une structure ramifiée.
PCT/JP2017/007315 2016-04-06 2017-02-27 Condensateur à film, film pour condensateur et procédé de production de condensateur à film WO2017175511A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2018510267A JP6627969B2 (ja) 2016-04-06 2017-02-27 フィルムコンデンサ、コンデンサ用フィルム、及び、フィルムコンデンサの製造方法
DE212017000044.9U DE212017000044U1 (de) 2016-04-06 2017-02-27 Filmkondensator sowie Film für Kondensator

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-076334 2016-04-06
JP2016076334 2016-04-06

Publications (1)

Publication Number Publication Date
WO2017175511A1 true WO2017175511A1 (fr) 2017-10-12

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JP (1) JP6627969B2 (fr)
DE (1) DE212017000044U1 (fr)
WO (1) WO2017175511A1 (fr)

Cited By (9)

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JP2021009924A (ja) * 2019-07-01 2021-01-28 株式会社村田製作所 フィルムコンデンサ用フィルム、フィルムコンデンサ用フィルムの製造方法、フィルムコンデンサ、及び、フィルムコンデンサの製造方法
WO2021131235A1 (fr) 2019-12-27 2021-07-01 株式会社村田製作所 Condensateur à film et film pour condensateurs à film
WO2021241151A1 (fr) * 2020-05-25 2021-12-02 株式会社村田製作所 Condensateur à film et film pour condensateurs à film
WO2022054615A1 (fr) * 2020-09-10 2022-03-17 日鉄ケミカル＆マテリアル株式会社 Résine phénoxy, composition de résine, produit durci, stratifié pour circuits électriques/électroniques, et procédé de production de résine phénoxy
WO2022065295A1 (fr) * 2020-09-23 2022-03-31 株式会社指月電機製作所 Condensateur à film
WO2022075357A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur à film, film et film métallisé
WO2022075362A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur au film, film et film métallisé
WO2022075359A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur au film et film métallisé
WO2023105931A1 (fr) * 2021-12-07 2023-06-15 株式会社村田製作所 Condensateur à film

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JPS63268727A (ja) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH03246813A (ja) * 1990-02-23 1991-11-05 Toshiba Chem Corp フィルムコンデンサ用樹脂組成物
WO2013128726A1 (fr) * 2012-02-29 2013-09-06 株式会社村田製作所 Composition de résine diélectrique pour condensateur en film et condensateur v

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JP4893396B2 (ja) * 2007-03-16 2012-03-07 株式会社村田製作所 誘電体フィルムおよびそれを用いた電子部品
EP2214716B1 (fr) * 2007-10-23 2021-11-17 Nektar Therapeutics Polymères branchés ciblant l'hydroxyapatite et conjugués préparés à partir de ces polymères
JP5945480B2 (ja) * 2012-09-07 2016-07-05 ナミックス株式会社 銀ペースト組成物及びその製造方法
JP6664147B2 (ja) * 2013-04-02 2020-03-13 国立大学法人大阪大学 異方性導電フィルム及び異方性導電接続体

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JPS63268727A (ja) * 1987-04-24 1988-11-07 Matsushita Electric Works Ltd エポキシ樹脂組成物
JPH03246813A (ja) * 1990-02-23 1991-11-05 Toshiba Chem Corp フィルムコンデンサ用樹脂組成物
WO2013128726A1 (fr) * 2012-02-29 2013-09-06 株式会社村田製作所 Composition de résine diélectrique pour condensateur en film et condensateur v

Cited By (17)

* Cited by examiner, † Cited by third party
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JP7234831B2 (ja) 2019-07-01 2023-03-08 株式会社村田製作所 フィルムコンデンサ用フィルム、フィルムコンデンサ用フィルムの製造方法、フィルムコンデンサ、及び、フィルムコンデンサの製造方法
WO2021131235A1 (fr) 2019-12-27 2021-07-01 株式会社村田製作所 Condensateur à film et film pour condensateurs à film
JPWO2021131235A1 (fr) * 2019-12-27 2021-07-01
JP7348960B2 (ja) 2019-12-27 2023-09-21 株式会社村田製作所 フィルムコンデンサ、及び、フィルムコンデンサ用フィルム
CN114902360B (zh) * 2019-12-27 2024-03-19 株式会社村田制作所 薄膜电容器以及薄膜电容器用薄膜
CN114902360A (zh) * 2019-12-27 2022-08-12 株式会社村田制作所 薄膜电容器以及薄膜电容器用薄膜
US11948748B2 (en) 2019-12-27 2024-04-02 Murata Manufacturing Co., Ltd. Film capacitor, and film for film capacitors
WO2021241151A1 (fr) * 2020-05-25 2021-12-02 株式会社村田製作所 Condensateur à film et film pour condensateurs à film
WO2022054615A1 (fr) * 2020-09-10 2022-03-17 日鉄ケミカル＆マテリアル株式会社 Résine phénoxy, composition de résine, produit durci, stratifié pour circuits électriques/électroniques, et procédé de production de résine phénoxy
JP7463539B2 (ja) 2020-09-23 2024-04-08 株式会社指月電機製作所 フィルムコンデンサ
WO2022065295A1 (fr) * 2020-09-23 2022-03-31 株式会社指月電機製作所 Condensateur à film
DE112021004211T5 (de) 2020-09-23 2023-06-01 Murata Manufacturing Co., Ltd. Folienkondensator
WO2022075359A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur au film et film métallisé
WO2022075362A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur au film, film et film métallisé
WO2022075357A1 (fr) * 2020-10-09 2022-04-14 株式会社村田製作所 Condensateur à film, film et film métallisé
WO2023105931A1 (fr) * 2021-12-07 2023-06-15 株式会社村田製作所 Condensateur à film

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