WO2021132257A1 - Condensateur à film et film pour condensateurs à film - Google Patents
Condensateur à film et film pour condensateurs à film Download PDFInfo
- Publication number
- WO2021132257A1 WO2021132257A1 PCT/JP2020/047994 JP2020047994W WO2021132257A1 WO 2021132257 A1 WO2021132257 A1 WO 2021132257A1 JP 2020047994 W JP2020047994 W JP 2020047994W WO 2021132257 A1 WO2021132257 A1 WO 2021132257A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- film
- organic material
- linear expansion
- metal layer
- dielectric resin
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 70
- 229920005989 resin Polymers 0.000 claims abstract description 64
- 239000011347 resin Substances 0.000 claims abstract description 64
- 239000011368 organic material Substances 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims abstract description 47
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 claims abstract description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 8
- 229920000620 organic polymer Polymers 0.000 claims abstract description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 6
- HIFVAOIJYDXIJG-UHFFFAOYSA-N benzylbenzene;isocyanic acid Chemical class N=C=O.N=C=O.C=1C=CC=CC=1CC1=CC=CC=C1 HIFVAOIJYDXIJG-UHFFFAOYSA-N 0.000 claims abstract 3
- 229920006287 phenoxy resin Polymers 0.000 claims description 4
- 239000013034 phenoxy resin Substances 0.000 claims description 4
- 239000010408 film Substances 0.000 description 171
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 21
- 239000011104 metalized film Substances 0.000 description 17
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 14
- 230000015556 catabolic process Effects 0.000 description 12
- 238000004804 winding Methods 0.000 description 10
- 239000002904 solvent Substances 0.000 description 7
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 7
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- -1 isocyanate compound Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical group C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 125000005372 silanol group Chemical group 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000007751 thermal spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 238000000427 thin-film deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/32—Wound capacitors
Abstract
Condensateur à film (10) qui est pourvu : d'un film de résine diélectrique (par exemple, d'un premier film de résine diélectrique (13) qui est formé à partir d'un produit durci d'un premier matériau organique et d'un second matériau organique ; et d'une couche métallique (par exemple, une première couche métallique (15) qui est disposée sur au moins une surface du film de résine diélectrique. Le premier matériau organique est composé d'un polymère organique qui présente un groupe hydroxyle et un cycle benzène dans une unité répétitive. Le second matériau organique est composé de diisocyanate de diphénylméthane, d'un diisocyanate de diphénylméthane modifié ou d'un mélange de ceux-ci. Parmi les coefficients d'expansion linéaire du film décrit ci-dessus, sur la base de celui à 0 °C, si α40°C est le coefficient de dilatation linéaire à 40 °C, α80°C est le coefficient de dilatation linéaire à 80 °C et α120°C est le coefficient de dilatation linéaire à 120 °C, la valeur de α40°C/α80°C est de 1,05 ou plus, et la valeur α80°C/α120°C est de 1,1 ou plus.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202080048023.3A CN114051648B (zh) | 2019-12-27 | 2020-12-22 | 薄膜电容器以及薄膜电容器用薄膜 |
| JP2021567490A JP7136369B2 (ja) | 2019-12-27 | 2020-12-22 | フィルムコンデンサ、及び、フィルムコンデンサ用フィルム |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2019-237617 | 2019-12-27 | ||
| JP2019237617 | 2019-12-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2021132257A1 true WO2021132257A1 (fr) | 2021-07-01 |
Family
ID=76572987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2020/047994 WO2021132257A1 (fr) | 2019-12-27 | 2020-12-22 | Condensateur à film et film pour condensateurs à film |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP7136369B2 (fr) |
| CN (1) | CN114051648B (fr) |
| WO (1) | WO2021132257A1 (fr) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018142922A1 (fr) * | 2017-02-03 | 2018-08-09 | 株式会社村田製作所 | Condensateur à film, procédé de fabrication d'un condensateur à film, film de résine diélectrique et procédé de fabrication d'un film de résine diélectrique |
| WO2019097750A1 (fr) * | 2017-11-15 | 2019-05-23 | 株式会社村田製作所 | Condensateur à film et film métallisé |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102034608B (zh) * | 2009-09-24 | 2014-12-17 | 日立Aic株式会社 | 金属化薄膜电容器 |
| JP5734069B2 (ja) * | 2011-04-13 | 2015-06-10 | 小島プレス工業株式会社 | フィルムコンデンサ素子及びフィルムコンデンサ並びにフィルムコンデンサ素子の製造方法 |
| JP5794380B2 (ja) * | 2012-02-29 | 2015-10-14 | 株式会社村田製作所 | フィルムコンデンサ用誘電体樹脂組成物 |
| JP2016168833A (ja) * | 2015-03-12 | 2016-09-23 | 東レ株式会社 | 成型用積層フィルム及びそれを用いた成型品 |
| JP7278971B2 (ja) * | 2018-01-18 | 2023-05-22 | 日精エー・エス・ビー機械株式会社 | 容器 |
| WO2019146755A1 (fr) * | 2018-01-25 | 2019-08-01 | 株式会社村田製作所 | Condensateur à film, et boîtier externe pour condensateur à film |
-
2020
- 2020-12-22 JP JP2021567490A patent/JP7136369B2/ja active Active
- 2020-12-22 WO PCT/JP2020/047994 patent/WO2021132257A1/fr active Application Filing
- 2020-12-22 CN CN202080048023.3A patent/CN114051648B/zh active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018142922A1 (fr) * | 2017-02-03 | 2018-08-09 | 株式会社村田製作所 | Condensateur à film, procédé de fabrication d'un condensateur à film, film de résine diélectrique et procédé de fabrication d'un film de résine diélectrique |
| WO2019097750A1 (fr) * | 2017-11-15 | 2019-05-23 | 株式会社村田製作所 | Condensateur à film et film métallisé |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114051648A (zh) | 2022-02-15 |
| JPWO2021132257A1 (fr) | 2021-07-01 |
| CN114051648B (zh) | 2023-02-24 |
| JP7136369B2 (ja) | 2022-09-13 |
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