WO2017150388A1

WO2017150388A1 - Exposure device, flat panel display manufacturing method, device manufacturing method, light blocking device and exposure method

Info

Publication number: WO2017150388A1
Application number: PCT/JP2017/007186
Authority: WO
Inventors: 淳行青木; 謙介水橋; 貴中村; 仁西川; 宏和金子
Original assignee: 株式会社ニコン
Priority date: 2016-02-29
Filing date: 2017-02-24
Publication date: 2017-09-08
Also published as: JP2022106891A; KR20180100405A; KR20210025719A; CN108700825B; CN108700825A; TW202115508A; TW201935144A; JP7347578B2; KR102223791B1; TWI711893B; TWI663482B; TW201800867A; HK1256939A1; KR102538199B1; TWI815055B; JP2020173465A; JPWO2017150388A1

Abstract

Provided is an exposure method in which a plurality of projection optical units are provided that project the pattern of a mask (M) onto a substrate (P) and in which the pattern of the mask (M) is exposed onto the substrate (P) by moving the mask (M) and the substrate (P) relative to each other in an X direction. The exposure method includes: a first exposure step for projecting a pattern A onto an A region on the substrate (P) in a state where a -Y side end of a projection region that is projected onto the substrate (P) by the projection optical units is shielded from light at a first inclination angle; a step movement step for moving the substrate (P); and a second exposure step for projecting a pattern B onto a B region that at least partially overlaps the A region in a state where a +Y side end of the projection region is shielded from light at a second inclination angle.

Description

Exposure apparatus, flat panel display manufacturing method, device manufacturing method, shading apparatus, and exposure method

The present invention relates to an exposure apparatus, a flat panel display manufacturing method, a device manufacturing method, a light shielding apparatus, and an exposure method, and more specifically, an exposure apparatus and method for forming a predetermined pattern on an object via a projection optical system, The present invention relates to a light-shielding device used in an exposure apparatus that forms a predetermined pattern on an object via a projection optical system, and a flat panel display or device manufacturing method using the exposure apparatus or method.

Conventionally, in a lithography process for manufacturing an electronic device (microdevice) such as a liquid crystal display element (liquid crystal panel) or a semiconductor element, a mask or reticle (hereinafter collectively referred to as “mask”), a glass plate or a wafer (hereinafter referred to as “mask”). A step-and-scan type exposure apparatus that transfers a pattern formed on a mask onto a substrate by using an energy beam while synchronously moving a “substrate” together in a predetermined scanning direction. Scanning steppers (also called scanners)) are used.

As a method of forming a pattern on a substrate using this type of exposure apparatus, so-called splice exposure, in which the mask pattern is spliced on the substrate using the periodicity of the pattern (mask pattern) formed on the mask. It is known (see Patent Document 1).

When performing the above-described joint exposure with a conventional exposure apparatus, the degree of freedom of the joint is not sufficient.

JP 2004-335864 A

In the first embodiment, an exposure apparatus that performs exposure by moving the object in a first direction relative to a projection optical system that projects a predetermined pattern onto the object, the exposure apparatus performing the exposure on the object via the projection optical system. A light-shielding unit that shields a predetermined region in which the amount of illumination on the object changes along the second direction intersecting the first direction according to the position in the first direction An exposure apparatus is provided that includes a drive unit that drives the light shielding unit to change the amount of illumination.

In the second embodiment, a method of manufacturing a flat panel display, comprising: exposing the substrate using the exposure apparatus according to the first embodiment; and developing the exposed substrate. Is provided.

In the third embodiment, there is provided a device manufacturing method including exposing the substrate and developing the exposed substrate using the exposure apparatus according to the first embodiment.

In the fourth embodiment, the light shielding device is used in an exposure apparatus that scans and exposes the object by relatively moving the object in the first direction with respect to the projection optical system that projects a predetermined pattern onto the object. A predetermined area in which the amount of illumination on the object changes along the second direction intersecting the first direction according to the position in the first direction among the projection areas projected onto the object via Provided is a light shielding device including a light shielding unit that shields light and a driving unit that drives the light shielding unit to change the amount of illumination.

In the fifth embodiment, there is provided an exposure method in which scanning exposure is performed by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object. Of the projection area projected onto the object, the predetermined area where the illumination amount on the object changes along the second direction intersecting the first direction according to the position in the first direction is shielded by the light shielding unit. And an exposure method including driving the light-shielding portion to change the illumination amount is provided.

In the sixth embodiment, there is provided an exposure method in which scanning exposure is performed by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object. Of the projection area projected onto the object, the predetermined area where the illumination amount on the object changes along the second direction intersecting the first direction according to the position in the first direction is shielded by the light shielding unit. And an exposure method including driving the light-shielding portion to change the illumination amount is provided.

In the seventh embodiment, there is provided a method for manufacturing a flat panel display, which includes exposing the substrate using the exposure method according to the sixth embodiment and developing the exposed substrate. The

In the eighth embodiment, there is provided a device manufacturing method including exposing the substrate using the exposure method according to the sixth embodiment and developing the exposed substrate.

It is a figure which shows schematically the structure of the exposure apparatus which concerns on one Embodiment. It is a figure for demonstrating the structure of the illumination optical system which the exposure apparatus of FIG. 1 has, and a projection optical system. FIG. 3A is a plan view showing the arrangement of the field stop and the light shielding plate of the projection optical system, and FIG. 3B is a diagram showing the positional relationship between the field stop and the light shielding plate in the optical axis direction. FIG. 4A is a diagram showing a first inclined arrangement of the light shielding plates, and FIG. 4B is a diagram showing a second inclined arrangement of the light shielding plates. FIG. 5A is a diagram illustrating a case where a joint is formed in the center of the projection region using a light shielding plate, and FIG. 5B is a diagram illustrating a joint near the end of the projection region using a light shielding plate. It is a figure which shows the case where it forms. FIG. 6A is a diagram showing a case where a joint portion is formed using two light shielding plates, and FIG. 6B is a joint portion similar to FIG. 6A using one light shielding plate. It is a figure which shows the case where it forms. FIG. 7A is a diagram showing a conventional light shielding plate, FIG. 7B is a diagram showing the light shielding plate of the embodiment, and FIG. 7C is provided with a plurality of light shielding plates of the embodiment. It is a figure which shows a case. FIGS. 8A to 8D are views for explaining the mode of the opening (first mode to fourth mode) formed by the field stop and the light shielding plate. It is a top view which shows the projection area | region produced | generated on a board | substrate. It is a conceptual diagram of splicing exposure. FIG. 11A is a diagram showing the relationship between the substrate and the mask according to the first exposure method, and FIG. 11B is a diagram when the A region is scanned and exposed by the first exposure method. FIG. 11C is a diagram when the B area is scanned and exposed by the first exposure method. FIG. 12A is a diagram showing the relationship between the substrate and the mask according to the second exposure method, and FIG. 12B is a diagram when the A region is scanned and exposed by the second exposure method. FIG. 12C is a diagram when the B area is scanned and exposed by the second exposure method. FIG. 13A is a diagram showing the relationship between the substrate and the mask according to the third exposure method, and FIG. 13B is a diagram when the A region is scanned and exposed by the third exposure method. . FIG. 14A is a diagram when the B region is scanned and exposed by the third exposure method, and FIG. 14B is a diagram when the C region is scanned and exposed by the third exposure method. FIG. 15A is a diagram showing the relationship between the substrate and the mask according to the fourth exposure method, and FIG. 15B is a diagram when scanning exposure is performed on the area A by the fourth exposure method. . It is a figure at the time of carrying out scanning exposure of B area | region by the 4th exposure method. FIG. 17A is a diagram showing the relationship between the substrate and the mask according to the fifth exposure method, and FIG. 17B is a diagram when the A1 region is scanned and exposed by the fifth exposure method. . FIG. 18A is a diagram when the B1 region is scanned and exposed by the fifth exposure method, and FIG. 18B is a diagram when the A2 region is scanned and exposed by the fifth exposure method. It is a figure at the time of carrying out scanning exposure of B2 area | region by the 5th exposure method. It is a flowchart at the time of performing joint exposure. It is a figure which shows the modification (the 1) of the drive mechanism of a light-shielding plate. It is a figure which shows the modification (the 2) of the drive mechanism of a light-shielding plate. FIGS. 23A and 23B are views (No. 1 and No. 2) showing a modified example (No. 3) of the drive mechanism of the light shielding plate. FIG. 24A is a diagram showing a modification of the light shielding plate, and FIGS. 24B to 24E are diagrams showing the operation of the light shielding plate in FIG. 24A (parts 1 to 4). ). It is a figure which shows the detail of the drive mechanism of a light-shielding plate. It is a figure for demonstrating splice exposure using an optical filter.

Hereinafter, an embodiment will be described with reference to FIGS. FIG. 1 is a perspective view showing a configuration of an exposure apparatus EX according to an embodiment. In FIG. 1, an exposure apparatus EX illuminates a mask stage MST that supports a mask M, a substrate stage PST that supports a photosensitive substrate P (hereinafter simply referred to as “substrate P”), and the mask M with exposure light EL. A projection image (hereinafter referred to as a pattern image) of a pattern formed on the illumination optical system IL and the mask M is transferred to the substrate P, and a transfer pattern as a latent image corresponding to the pattern image is formed on the substrate P. A projection optical system PL and a control device CONT (not shown in FIG. 1, refer to FIG. 2) for overall control of the operation of the exposure apparatus EX are provided. The substrate P is obtained by applying a photosensitive agent (photoresist) to a glass substrate, and a transfer pattern is formed in the photosensitive agent. The projection optical system PL is constituted by a plurality (seven in FIG. 1) of projection optical modules PLa to PLg arranged in parallel. The exposure apparatus EX in the present embodiment has a mask M and a substrate P with respect to the projection optical system PL. And the mask M is illuminated with the exposure light EL, and the pattern image of the mask M is transferred to the substrate P.

Here, in the following description, the synchronous movement direction (scanning direction) between the mask M and the substrate P is the X-axis direction, the direction orthogonal to the scanning direction in the horizontal plane is the Y-axis direction (non-scanning direction), the X-axis direction, and The direction orthogonal to the Y-axis direction is taken as the Z-axis direction. The directions around the X-axis, Y-axis, and Z-axis are the θX, θY, and θZ directions, respectively.

The mask stage apparatus of the present embodiment includes a mask stage MST that supports a mask M, a linear guide (not shown) having a long stroke in the X-axis direction, a linear motor, a voice coil motor (VCM), and the like. A stage drive unit MSTD. The mask stage drive unit MSTD can drive the mask stage MST having the mask M with a long stroke in the X-axis direction when the mask M and the substrate P are moved synchronously under the control of the control device CONT (see FIG. 2). In addition, in order to finely adjust the position of the mask M in the horizontal plane including the X axis direction and the Y axis direction, the mask stage MST can be driven in the X axis direction, the Y axis direction, the Z axis direction, and the θZ direction. . The position of the mask stage MST in the horizontal plane is measured using a laser interferometer, and is always detected with a resolution of about 0.5 to 1 nm, for example. The measurement value of the laser interferometer is sent to the control device CONT, and controls the position of the mask stage MST in the X-axis direction, Y-axis direction, Z-axis direction, and θZ direction.

The exposure light EL that has passed through the mask M is incident on the projection optical modules PLa to PLg, respectively. The projection optical modules PLa to PLg are supported by the surface plate 150 and form a pattern image corresponding to the irradiation area on the mask M by the exposure light EL on the substrate P. The projection optical modules PLa, PLc, PLe, and PLg and the projection optical modules PLb, PLd, and PLf are respectively arranged at predetermined intervals in the Y-axis direction. In addition, the rows of the projection optical modules PLa, PLc, PLe, and PLg and the rows of the projection optical modules PLb, PLd, and PLf are arranged apart from each other in the X axis direction, and are staggered as a whole along the Y axis direction. Is arranged. Each of the projection optical modules PLa to PLg has a plurality of optical elements (lenses and the like). The exposure light EL transmitted through the projection optical modules PLa to PLg forms a pattern image corresponding to the irradiation area on the mask M for each of the different projection areas 50a to 50g on the substrate P.

The substrate stage PST has a substrate holder PH, and holds the substrate P via the substrate holder PH. Similar to mask stage MST, substrate stage PST is movable in the X-axis direction, Y-axis direction, and Z-axis direction, and is also movable in the θX, θY, and θZ directions. The substrate stage PST is driven by a substrate stage drive unit PSTD configured by a linear motor or the like under the control of the control device CONT (see FIG. 2).

Further, the pattern surface of the mask M and the exposure surface of the substrate P are between the column of the projection optical modules PLa, PLc, PLe, and PLg on the −X side and the column of the projection optical modules PLb, PLd, and PLf on the + X side. A focus detection system 110 that detects the position in the Z-axis direction is arranged. The focus detection system 110 is configured by arranging a plurality of oblique incidence type focus detection systems. The detection result of the focus detection system 110 is output to the control device CONT (see FIG. 2). The control device CONT determines whether the pattern surface of the mask M and the exposure surface of the substrate P are based on the detection result of the focus detection system 110. It controls so that a predetermined space | interval and parallelism may be made.

The control device CONT is connected to the storage unit 120 (see FIG. 2 respectively), and monitors the positions of the mask stage MST and the substrate stage PST based on the recipe information stored in the storage unit 120 and the like. By controlling the stage drive unit PSTD and the mask stage drive unit MSTD, the mask M and the substrate P are synchronously moved in the X-axis direction.

FIG. 2 is a diagram showing the configuration of the illumination optical system IL and the projection optical system PL. As shown in FIG. 2, the illumination optical system IL includes a light source 1 composed of an ultrahigh pressure mercury lamp or the like, an elliptical mirror 1a that condenses the light emitted from the light source 1, and the elliptical mirror 1a. Of the light, dichroic mirror 2 that reflects light having a wavelength necessary for exposure and transmits light having other wavelengths, and among wavelengths reflected by dichroic mirror 2, wavelengths necessary for exposure (usually g, h, Wavelength selection filter 3 that passes light containing only at least one band of i-line) as exposure light, and exposure light from wavelength selection filter 3 is branched into a plurality (7 in this embodiment) and reflected. And a light guide 4 that is incident on each of the illumination system modules IMa to IMg via a mirror 5. Here, as the illumination system module IM constituting the illumination optical system IL, in this embodiment, seven illumination system modules IMa to IMg are provided corresponding to the seven projection optical modules PLa to PLg. However, in FIG. 2, only the illumination system module IMf corresponding to the projection optical module PLf is shown for convenience. Each of the illumination system modules IMa to IMg is arranged corresponding to each of the projection optical modules PLa to PLg with a predetermined interval in the X axis direction and the Y axis direction. The exposure light EL emitted from each of the illumination system modules IMa to IMg illuminates different irradiation areas on the mask M in correspondence with the projection optical modules PLa to PLg.

Each of the illumination system modules IMa to IMg includes an illumination shutter 6, a relay lens 7, a fly-eye lens 8 as an optical integrator, and a condenser lens 9. The illumination shutter 6 is disposed on the downstream side of the light path of the light guide 4 so as to be detachable from the light path. The illumination shutter 6 shields the exposure light when it is arranged in the optical path, and cancels the shielding when retracted from the optical path. A shutter drive unit 6 a is connected to the illumination shutter 6. The shutter driving unit 6a is controlled by the control device CONT.

Also, each of the illumination system modules IMa to IMg has a light amount adjustment mechanism 10. The light amount adjusting mechanism 10 adjusts the exposure amount by setting the illuminance of the exposure light for each optical path, and includes a half mirror 11, a detector 12, a filter 13, and a filter driving unit 14. . The half mirror 11 is disposed in the optical path between the filter 13 and the relay lens 7, and causes a part of the exposure light transmitted through the filter 13 to enter the detector 12. The detector 12 independently detects the illuminance of the incident exposure light, and outputs the detected illuminance signal to the control device CONT. The filter 13 is formed such that the transmittance gradually changes linearly in a predetermined range along the X-axis direction, and is disposed between the illumination shutter 6 and the half mirror 11 in each optical path. The filter drive unit 14 adjusts the exposure amount for each optical path by moving the filter 13 along the X-axis direction based on an instruction from the control device CONT.

The light beam that has passed through the light amount adjusting mechanism 10 reaches the fly-eye lens 8 through the relay lens 7. The fly-eye lens 8 forms a secondary light source on the exit surface side, and the exposure light EL from the secondary light source passes through the condenser lens 9 and includes a right-angle prism 16, a lens system 17, and a concave mirror 18. After passing through the catadioptric optical system 15, the irradiation area on the mask M is illuminated uniformly. The catadioptric optical system 15 may be omitted. In other words, the mask M may be directly irradiated with the light beam that has passed through the condenser lens 9. As a result, the illumination optical system IL and thus the exposure apparatus EX can be reduced in size.

Each of the projection optical modules PLa to PLg includes an image shift mechanism 19, a focus position adjustment mechanism 31, two sets of catadioptric

optical systems

21 and 22, a field stop 20, and a magnification adjustment mechanism 23. . The image shift mechanism 19 shifts the pattern image of the mask M in the X-axis direction or the Y-axis direction by rotating two parallel flat plate glasses in the θY direction or the θX direction, respectively. The focus position adjusting mechanism 31 includes a pair of wedge prisms, and changes the image plane position of the pattern image by changing the sum of the thicknesses of the wedge prisms in the optical path. The inclination angle of the image plane of the pattern image is changed by rotating it around. The exposure light EL that has passed through the mask M passes through the image shift mechanism 19 and the focus position adjustment mechanism 31 and then enters the first set of catadioptric optical system 21. The catadioptric optical system 21 forms an intermediate image of the pattern of the mask M, and includes a right-angle prism 24, a lens system 25, and a concave mirror 26. The right-angle prism 24 is rotatable in the θZ direction, and the pattern image of the mask M can be rotated.

The field stop 20 is disposed on the image plane of the intermediate image formed by the catadioptric optical system 21 or in the vicinity thereof. The field stop 20 sets a projection area on the substrate P. The exposure light EL transmitted through the field stop 20 enters the second set of catadioptric optical system 22. Similar to the catadioptric optical system 21, the catadioptric optical system 22 includes a right-angle prism 27, a lens system 28, and a concave mirror 29. The right-angle prism 27 is also rotatable in the θZ direction, and the pattern image of the mask M can be rotated.

The exposure light EL emitted from the catadioptric optical system 22 passes through the magnification adjusting mechanism 23 and forms a pattern image of the mask M on the substrate P at an erecting equal magnification. The magnification adjustment mechanism 23 has a first plano-convex lens, a biconvex lens, and a second plano-convex lens in this order along the Z axis. By moving the biconvex lens in the Z axis direction, the magnification of the pattern image of the mask M To change.

FIG. 3A is a diagram showing the field stop 20 provided in each of the projection optical modules PLa to PLg. The field stop 20 is disposed at a position substantially conjugate with the mask M and the substrate P. Each of the projection optical modules PLa to PLg has a field stop 20, and the projection regions 50 a to 50 g on the substrate P of each of the projection optical modules PLa to PLg are respectively openings K formed in the corresponding field stop 20. Set by In this embodiment, each opening K is formed in an isosceles trapezoidal shape having two sides parallel to the Y-axis direction, or a trapezoidal shape having two sides parallel to the Y-axis direction and one side parallel to the X-axis direction. The projection areas 50a to 50g are set in a trapezoidal shape having a conjugate relationship with the corresponding opening K.

In FIG. 3A, the field stop 20 is illustrated as a rectangular plate-like member having a trapezoidal opening and is actually shown in FIG. 3B. The aperture member 20y including an edge (end portion) for setting the width of the opening K in the Y-axis direction and the aperture member 20x including an edge (end portion) for setting the width of the aperture K in the X-axis direction are different members. Has been. Of the

diaphragm members

20y and 20x, the diaphragm member 20y is disposed on the conjugate plane CP with respect to the mask M and the substrate P, and the diaphragm member 20x is slightly closer to the exposure light EL incident side than the conjugate plane CP. It is arranged on the (+ Z side).

Returning to FIG. 3A, among the projection optical modules PLa to PLg, the projection optical module PLf has a light shielding plate 30. The light shielding plate 30 is a substantially rectangular plate member in plan view (viewed from the Z-axis direction), and as shown in FIG. 3B, exposure light is applied to the field stop 20 provided in the projection optical module PLf. It is arranged on the emission side (−Z side) of EL.

Returning to FIG. 3A, the light shielding plate 30 has a + Y side end portion on which the long side on the + Y side forms the opening K of the field stop 20 by a drive mechanism 80 (see FIG. 8A and the like) described later. A first inclined arrangement (see FIG. 4A) that is substantially parallel to (the oblique side), and a long side on the −Y side that forms an opening K of the field stop 20 and an end portion (the oblique side) on the −Y side. It is possible to drive between the second inclined arrangement (see FIG. 4B) that is substantially parallel. Thus, the light shielding member 30 is generated by the projection optical module PLf by moving between the first inclined arrangement (first inclination angle) and the second inclined arrangement (second inclination angle). It is possible to change the shape of the projected area 50f. The first tilt angle and the second tilt angle are determined by the tilt angle of the trapezoidal projection area. For example, the first inclination angle shown in FIG. 4A is such that the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the edge of the trapezoidal projection region 50f in the + Y-axis direction. Further, in the second inclination angle shown in FIG. 4B, the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the end of the trapezoidal projection area 50f in the −Y-axis direction. . That is, the inclination angle (the first inclination angle and the second inclination angle) of the light shielding plate 30 can be arbitrarily determined based on the shape of the projection region.

The light shielding plate 30 can be moved straight in the Y-axis direction by a drive mechanism 80 (see FIG. 8A and the like), and the width in the Y-axis direction of the projection region 50f generated by the projection optical module PLf is set. Settings can be changed. Further, the light shielding plate 30 can move to a position where it does not overlap the opening K, that is, a position where the opening K is set only by the field stop 20 by moving straight in the Y-axis direction.

Here, the difference between the example using the conventional light shielding plate and the present embodiment using the light shielding plate 30 will be described.

FIGS. 5 (a) to 6 (b) show diagrams showing the positional relationship between the projection area and the light-shielding portion when performing joint exposure. On the right side of FIG. 5 (a) to FIG. 6 (b), a part of the projection area (projection areas 50e to 50g) projected onto the substrate by the plurality of projection optical modules used in the above embodiment, and exposure are shown. A light shielding plate 30 that defines a projection region by shielding light is shown. In addition, on the left side of the page in FIGS. 5A to 6B, a form in which the projection areas are arranged in a line is shown.

As shown in FIG. 5A, when pattern joining is performed in a region where the projection width in the X-axis direction of the projection region 50e is substantially constant in the Y-axis direction, that is, in the central portion of the trapezoidal projection region 50e. By disposing the plate 30 at the center of the projection region 50e, it is possible to form an exposure amount inclined portion G (joint portion) whose projection width changes along the Y-axis direction.

However, as shown in FIG. 5B, pattern joining is performed in an area where the projection width in the X-axis direction of the projection area 50e changes along the Y-axis direction, that is, in an end area of the trapezoidal projection area. When it is performed, if it is attempted to form the inclined portion G of the exposure amount only by the light shielding portion 30 that defines the projection region 50e, the exposure amount becomes too large at the inclined portion G, and the pattern joining cannot be performed.

Therefore, as shown in FIG. 6A, if a similar light shielding plate 30A is arranged in the projection region 50f in addition to the light shielding plate 30 in the projection region 50e, an inclined portion G of the exposure amount can be formed. Pattern splicing can be performed. 30 A of light shielding plates are arrange | positioned so that a light shielding plate 30 and an inclination angle may become equal. The light shielding plate 30 and the light shielding plate 30A may be separate members or may be formed by a common member.

Further, as shown in FIG. 6A, even if the light shielding plate 30A is not disposed, the projection region 50e is changed by changing the inclination angle of the light shielding plate 30 as shown in FIG. 6B. The inclined portion G can be formed with only one light shielding plate 30 to be defined. The inclination angle of the light shielding plate 30 is changed to be parallel to the angle of the end region of the projection region 50e. That is, the inclination angle of the light shielding plate 30 is changed to be parallel to the angle of the end region of the projection region 50f. Thereby, the pattern joining between the end region of the projection region 50e and the end region of the projection region 50f can be performed. Pattern joining is performed as if the end region of the projection region 50f has been moved in the + Y direction. Accordingly, it is not necessary to increase the number of light shielding plates, and it is not necessary to synchronize the light shielding plates in the projection region 50e and the light shielding plate in the projection region 50f as compared with the case of FIG. Can be

Further, the difference between the example using the conventional light shielding plate and the present embodiment using the light shielding plate 30 can also be explained as follows.

As shown in FIG. 7A, in the conventional example, since the light shielding plate inclined in only one direction is used with respect to the projection region 50f, the T region, the α region, and the β region in the Y-axis direction are used. It was possible to set the scanning width in the Y-axis direction that can be exposed by only one scanning movement. For example, when performing joint exposure in the T region and β region, the scanning width can be set by moving the light shielding plate in the Y-axis direction, and when performing joint exposure in the α region or the γ region. The scanning width could be set by shielding the exposure light with the illumination shutter 6 (see FIG. 2) of the illumination system module IMf or the illumination system module IMg. However, when the light shielding plate is arranged in the region U, the exposure amount is not uniform, and there is a limit to the region where the joint exposure can be performed.

In contrast, in the present embodiment using the light shielding plate 30, the light shielding plate 30 can be moved between the first inclined arrangement and the second inclined arrangement as shown in FIG. 7B. Even when the light shielding plate 30 is arranged in the U region, it is possible to perform joint exposure with a uniform exposure amount. For example, when performing joint exposure in the T region, the light shielding plate 30 is used in the first inclined arrangement, and when performing joint exposure in the U region, the light shielding plate 30 is moved to the second inclined arrangement. Can be used.

Further, as shown in FIG. 7C, if the light shielding plate 30 is added to the projection area 50f and the projection area 50e and the projection area 50g are arranged so as to be shielded from light, the continuous exposure can be performed also in the S area. it can. That is, by using the light shielding plate 30 of the present embodiment, it is possible to perform joint exposure in any region in the Y-axis direction.

Next, a method of changing the setting of the opening K by moving the light shielding plate 30 of the present embodiment to the first inclined arrangement or the second inclined arrangement using the driving mechanism 80 will be described.

As shown in FIG. 8A, the driving mechanism 80 includes a pair of

actuators

82 and 84 with the opening K interposed therebetween (on the −X side and the + X side of the opening K). The actuator 82 is a so-called feed screw device including a motor (servo motor) 82a, a screw 82b driven by the motor 82a, and a cylindrical nut 82c screwed to the screw 82b. Reciprocating drive can be performed with a stroke longer than the opening K in the Y-axis direction. A U-shaped notch 30a in plan view is formed in the vicinity of the −X side end of the light shielding plate 30, and a nut 82c is inserted into the notch 30a. The actuator 84 is also a feed screw device having a configuration similar to that of the actuator 82 (motor 84a, screw 84b, nut 84c), but the nut 84c is in the vicinity of the + X side end of the light shielding plate 30 and θZ with respect to the light shielding plate 30. It is different in that it is mounted so as to be freely rotatable in the direction. The pair of

actuators

82 and 84 included in the drive mechanism 80 are independently controlled by the control device CONT (see FIG. 2).

As shown in FIG. 8A, the drive mechanism 80 has a + Y side edge (end) of the light shielding plate 30 at the field stop 20 (not shown in FIG. 8A, see FIG. 3A). By positioning the light shielding plate 30 at a position parallel to the + Y side edge among the edges (ends) forming the opening K of the light, and forming the optical path of the exposure light on the −Y side of the light shielding plate 30, the substrate The projection region 50f generated on P (see FIG. 1) can be a trapezoid (isosceles trapezoid) in plan view. The position and angle of the light shielding plate 30 are measured based on the output of a measurement device (not shown) (position measurement device, light amount measurement device, etc.) or input signals to the

actuators

82 and 84. At this time, a region on the + Y side of the light shielding plate 30 in the opening K is shielded by the movable blind device 60 so that the exposure light does not pass through. Hereinafter, as shown in FIG. 8A, an optical path of exposure light is formed on the −Y side of the light shielding plate 30, and a trapezoidal projection area 50f in plan view is formed on the substrate P by the exposure light that has passed through the optical path. The generated state will be described as a first mode of the light shielding plate 30.

Further, the drive mechanism 80 drives the nuts 82c and 84c of the pair of

actuators

82 and 84 in the Y-axis direction with the same stroke (movement amount) from the state shown in FIG. The area, that is, the width (area) of the projection region 50f (trapezoid in plan view) generated on the substrate P (see FIG. 1) can be changed. At this time, the blind device 60 is also driven in the Y-axis direction according to the position of the light shielding plate 30.

The blind device 60 described above is also provided corresponding to each of the projection optical modules PLa to PLe and PLg (see FIG. 1) not including the light shielding plate 30, and each of the projection optical modules PLa to PLe and PLg. Opening and shielding the opening K (see FIG. 3A) formed in the field stop 20 included in can be arbitrarily selected. In the present embodiment, the blind device 60 is included in the illumination optical system IL (see FIG. 1). However, the blind device 60 is not limited to this, and the blind device 60 is disposed at another position on the optical path of the exposure light EL. May be.

Further, the drive mechanism 80 starts from the first mode (see FIG. 8A as an example), and the nut 82c of the actuator 82 is + Y side of the nut 84c of the actuator 84 as shown in FIG. 8B. By controlling the Y position of each of the nuts 82c and 84c so that the -Y side edge (end portion) of the light shielding plate 30 is positioned at the field stop 20 (not shown in FIG. 8B). The light shielding plate 30 can be positioned at a position parallel to the edge on the −Y side among the edges (end portions) forming the opening K in (a). Thereby, the projection region 50f generated on the substrate P (see FIG. 1) can be made into a parallelogram in plan view. Hereinafter, as shown in FIG. 8B, an optical path of exposure light is formed on the −Y side of the light shielding plate 30, and a projection region having a parallelogram in plan view on the substrate P by the exposure light that has passed through the optical path. The state in which 50f is generated will be described as the second mode of the light shielding plate 30. Also in the second mode, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection region 50f generated on the substrate P (see FIG. 1) (in plan view). The width (area) of the (parallelogram) can be set and changed. Further, the region on the + Y side of the light shielding plate 30 in the opening K is appropriately shielded by the blind device 60 according to the position of the light shielding plate 30.

Further, the drive mechanism 80 moves the position of the blind device 60 from the second mode (see FIG. 8B as an example) to the −Y side of the light shielding plate 30 as shown in FIG. 8C. By doing so, the optical path of the exposure light can be formed on the + Y side of the light shielding plate 30. The + Y side edge (end portion) of the light shielding plate 30 is −Y among the edges (end portions) forming the opening K of the field stop 20 (not shown in FIG. 8C, see FIG. 3A). The projection region 50f generated on the substrate P by the exposure light that has passed through the optical path has a trapezoidal shape (isosceles trapezoidal shape) in plan view. Hereinafter, as shown in FIG. 8C, an optical path of exposure light is formed on the + Y side of the light shielding plate 30, and a trapezoidal projection area 50f in plan view is generated on the substrate P by the exposure light passing through the optical path. This state will be described as a third mode of the light shielding plate 30. Also in the third mode, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection region 50f generated on the substrate P (see FIG. 1) (in plan view) The width (area) of the trapezoid) can be changed. Further, a region on the −Y side of the light shielding plate 30 in the opening K is appropriately shielded by the blind device 60 according to the position of the light shielding plate 30.

Further, the drive mechanism 80 starts from the third mode (see FIG. 8C as an example) so that the nut 84c is positioned on the + Y side of the nut 82c as shown in FIG. 8D. By controlling the Y positions of 82c and 84c, the + Y side edge (end portion) of the light shielding plate 30 forms the opening K of the field stop 20 (not shown in FIG. 8B, see FIG. 3A). Of the edges (ends) to be formed, the light shielding plate 30 can be positioned at a position parallel to the + Y side edge. Thereby, the projection region 50f generated on the substrate P (see FIG. 1) can be made into a parallelogram in plan view. Hereinafter, as shown in FIG. 8D, the optical path of the exposure light is formed on the + Y side of the light shielding plate 30, and the projection area 50f having a parallelogram in plan view on the substrate P by the exposure light passing through the optical path. The state in which is generated will be referred to as a fourth mode of the light shielding plate 30. Also in the fourth mode, by driving the pair of nuts 82c and 84c synchronously in the Y-axis direction, the area of the opening K, that is, the projection region 50f generated on the substrate P (see FIG. 1) (in plan view). The width (area) of the (parallelogram) can be set and changed. Further, a region on the −Y side of the light shielding plate 30 in the opening K is appropriately shielded by the blind device 60 according to the position of the light shielding plate 30.

As described above, in this embodiment, the exposure light is transmitted in both the −Y direction (first and second modes) and the + Y direction (third and fourth modes) of the opening K with respect to the light shielding plate 30. An optical path can be formed, and the width of the opening K can be arbitrarily adjusted in each of the first to fourth modes. That is, the field stop 20, the light shielding plate 30, the drive mechanism 80, and the blind device 60 constitute a variable field stop device that arbitrarily changes the shape and position of the projection region 50f generated on the substrate P by the projection optical module PLf. is doing.

FIG. 9 is a plan view showing projection areas 50a to 50g generated on the substrate P. FIG. The projection areas 50a to 50g are adjacent to each other in the Y-axis direction, that is,

end parts

51a and 51b,

end parts

51c and 51d,

end parts

51e and 51f,

end parts

51g and 51h, and end

parts

51i and 51j. The end portions 51k and 51l are set so as to overlap in the Y-axis direction (so that the positions in the Y-axis direction overlap). For this reason, by performing exposure (scanning exposure) while scanning the substrate P in the X-axis direction with respect to the projection areas 50a to 50g, overlapping areas 52a to 52f that are overlapped (double exposure) (FIG. 9). In this case, a region sandwiched between two point difference lines is formed.

Further, as indicated by a broken line in FIG. 9, the light shielding plate 30 appropriately sets the effective size of the projection region 50f by the first and second positions and the movement in the Y-axis direction. Thereby, the light shielding plate 30 appropriately sets the width and shape in the Y-axis direction of the pattern image of the mask M transferred via the projection region 50f when scanning exposure is performed by scanning the substrate P in the X-axis direction. The pattern width in the Y-axis direction and the pattern shape of the transfer pattern formed on the substrate P as a latent image corresponding to the pattern image can be appropriately set.

Next, a description will be given of a splicing exposure method in which a plurality of scanning exposures are performed using the exposure apparatus EX (see FIG. 1), and a plurality of transfer patterns corresponding to the pattern image of the mask M are joined on the substrate P. In the following description, as shown in FIG. 10, of the pattern PPA formed on the mask M, a partial pattern PA having a length LA in the Y-axis direction and a portion having a length LB in the Y-axis direction. The pattern image of the two areas with the pattern PB is divided into two scanning exposures (first and second scanning exposures) and sequentially transferred onto the substrate P, and the transfer patterns MA and MB corresponding to these pattern images are transferred. It is assumed that pattern synthesis is performed by splicing on the substrate P. At that time, the joint portions MC are formed by overlappingly exposing the boundary portions of the transfer patterns MA and MB corresponding to the

boundary portions

45 and 46 of the partial patterns PA and PB, respectively. As a result, the entire transfer pattern MPA on the substrate P is a combination of the transfer pattern MA of the partial pattern PA and the transfer pattern MB of the partial pattern PB.

Here, in the present embodiment, the position and width in the Y-axis direction of the projection area 50f generated on the substrate P by the projection optical module PLf are appropriately changed using the first to fourth modes. can do. As a result, when the joint portion in the transfer pattern MA is formed using the projection optical module PLf in the first scanning exposure, the length LA and the end shape thereof are arbitrarily set in the Y-axis direction of the partial pattern PA. When the joint portion in the transfer pattern MB in the second scanning exposure is formed using the projection optical module PLf, the length LB in the Y-axis direction of the partial pattern PB and its end shape are arbitrarily set. be able to.

Here, in actuality, when manufacturing a plurality of liquid crystal panels as products from a single mother glass substrate using the exposure apparatus EX, various types of liquid crystal panel sizes and numbers are required. . For example, it is required to produce products of different sizes (circuit patterns such as liquid crystal panels) on a single glass substrate. Therefore, in practice, various modes are required for the number of splice exposures (number of splices MC), the lengths of the transfer patterns MA, MB, and the like depending on the design. Hereinafter, an exposure method when performing joint exposure using the light shielding plate 30 of the present embodiment will be specifically described. In the following first exposure method and second exposure method, a case where there are seven projection optical system modules will be described, and in the third to fifth exposure methods, a case where there are 11 projection optical system modules will be described. As will be described, the number of projection optical system modules can be changed as appropriate, and the concept and method of splice exposure are the same as the example described in FIG. 6 regardless of the number of projection optical system modules. .

FIG. 11A shows a substrate P and a mask M according to the first exposure method. In the first exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of the panels PN1 and PN2 are the same, and the mask patterns used are also the same. The first exposure method is the same as that described with reference to FIG. 10, and the exposure operation for each panel PN1 and PN2 can be completed by two exposure operations (one connection exposure operation).

In the first exposure method, as shown in FIG. 11B, the light shielding plate 30 is moved to the second inclined arrangement, and the light shielding plate 30 is formed so that the optical path of the exposure light is formed on the + Y axis side. Move. In this state, the mask M and the substrate P are moved relative to each other along the X-axis direction (first direction), so that the first scanning exposure for forming the pattern of the A region in the mask pattern on the substrate P is performed. Is called. Next, step movement is performed in which the substrate P is moved in the Y-axis direction (second direction) by the substrate stage drive unit PSTD. Then, as shown in FIG. 11C, the light shielding plate 30 is moved to the first inclined arrangement, and the light shielding plate 30 is moved in the Y axis direction so that the optical path of the exposure light is formed on the −Y axis direction side. Move along. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A region and the transfer pattern corresponding to the B region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are moved relative to each other along the X-axis direction, whereby second scanning exposure for forming the pattern of the B region in the mask pattern on the substrate P is performed. Thus, a panel having a size larger than the pattern area PPA (see FIG. 10) of the mask M can be formed on the substrate P.

FIG. 12A shows the substrate P and the mask M according to the second exposure method. In the second exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of the panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the second exposure method, a panel larger than that in the first exposure method can be manufactured. Further, similarly to the first exposure method, the exposure operation for each panel PN1 and PN2 can be completed by two exposure operations (one joint exposure operation).

In the second exposure method, as shown in FIG. 12B, the light shielding plate 30 that defines the projection region 50f generated by the projection optical module PLf (see FIG. 1) is moved to the second inclined arrangement. The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the + Y axis side. In this state, the mask M and the substrate P are relatively moved along the X-axis direction, whereby the first scanning exposure for forming the pattern of the A region in the mask pattern on the substrate P is performed. Next, step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 12C, the light shielding plate 30 that defines the projection region 50b generated by the projection optical module PLb (see FIG. 1) is moved to the first inclined arrangement, and the −Y axis side The light shielding plate 30 is moved so that the optical path of the exposure light is formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A region and the transfer pattern corresponding to the B region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are moved relative to each other along the X-axis direction, whereby second scanning exposure for forming the pattern of the B region in the mask pattern on the substrate P is performed. Thus, a panel having a size larger than the pattern area PPA of the mask M can be formed on the substrate P.

FIG. 13A shows the substrate P and the mask M according to the third exposure method. In the third exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The sizes of the panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the third exposure method, the length of the panels PN1 and PN2 in the Y-axis direction is almost twice the length of the mask M in the Y-axis direction. Unlike the case described with reference to FIG. In (one-time joint exposure operation), the exposure operation for each of the panels PN1 and PN2 is not completed. Therefore, the A region, the B region, and the C region are set on the mask M, and a total of three exposure operations (two joint exposure operations) are performed for one panel (product).

In the third exposure method, as shown in FIG. 13 (b), moves the light shielding plate 30 which defines the projected area 50 ₁₀ generated by the projection optical module PL ₁₀ to the first inclined arrangement, + Y-axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, the mask M and the substrate P are relatively moved along the X-axis direction, whereby the first scanning exposure for forming the pattern of the A region in the mask pattern on the substrate P is performed. Next, a first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage driving unit PSTD. Then, as shown in FIG. 14 (a), moves the light shielding plate 30 which defines the projected area 50 ₁₀ generated by the projection optical module PL ₁₀ to the second inclined arrangement, the exposure light on the + Y-axis side The light shielding plate 30 is moved so that the optical path is formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A region and the transfer pattern corresponding to the B region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are moved relative to each other along the X-axis direction, whereby second scanning exposure for forming the pattern of the B region in the mask pattern on the substrate P is performed. Further, a second step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 14 (b), moves the light shielding plate 30 which defines the projected area 50 ₄ generated by the projection optical module PL ₄ to the first inclined arrangement, exposure light -Y-axis side The light shielding plate 30 is moved so that the optical path is formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the B region and the transfer pattern corresponding to the C region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are relatively moved along the X-axis direction, whereby the third scanning exposure for forming the pattern of the C region in the mask pattern on the substrate P is performed. Thus, a panel having a size larger than the pattern area PPA of the mask M can be formed on the substrate P.

FIG. 15A shows a substrate P and a mask M according to the fourth exposure method. In the fourth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. The sizes of the panels PN1 to PN3 are the same, and the mask patterns used are also the same. In the fourth exposure method, the length of the panels PN1 to PN3 in the Y-axis direction is about 1.3 times the length of the mask M in the Y-axis direction. Unlike the third exposure method, the length is twice. The exposure operation for each of the panels PN1 to PN3 is completed by the exposure operation (one connection exposure operation). In the fourth exposure method, two areas of area A and area B are set on the mask M, and a total of two exposure operations (one splice exposure operation) per panel (product). I do.

In the fourth exposure method, as shown in FIG. 15 (b), moves the light shielding plate 30 which defines the projected area 50 ₁₀ generated by the projection optical module PL ₁₀ to the first inclined arrangement, + Y-axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, the mask M and the substrate P are relatively moved along the X-axis direction, whereby the first scanning exposure for forming the pattern of the A region in the mask pattern on the substrate P is performed. Next, step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, as shown in FIG. 16 moves the light shielding plate 30 which defines the projected area 50 ₇ generated by the projection optical module PL ₇ to the second inclined arrangement, the optical path of the exposure light -Y axis side The light shielding plate 30 is moved so as to be formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A region and the transfer pattern corresponding to the B region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are moved relative to each other along the X-axis direction, whereby second scanning exposure for forming the pattern of the B region in the mask pattern on the substrate P is performed. Thus, a panel having a size larger than the pattern area PPA (see FIG. 10) of the mask M can be formed on the substrate P.

FIG. 17A shows a substrate P and a mask M according to the fifth exposure method. In the fifth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. The panel PN1 is smaller in size than the panels PN2 and PN3 and has a shorter length in the Y-axis direction. The mask pattern MP1 formed on the mask M is used for the exposure of the panel PN1, and the mask pattern MP2 different from the mask pattern MP1 is used for the exposure of the panels PN2 and PN3.

In the fifth exposure method, as shown in FIG. 17 (b), moves the light shielding plate 30 which defines the projected area 50 ₁₀ generated by the projection optical module PL ₁₀ to the second inclined arrangement, + Y-axis The light shielding plate 30 is moved so that the optical path of the exposure light is formed on the side. In this state, the first scanning exposure for forming the pattern of the A1 region of the mask pattern on the substrate P is performed by relatively moving the mask M and the substrate P along the X-axis direction. Next, a first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage driving unit PSTD. Then, as shown in FIG. 18 (a), moves the light shielding plate 30 which defines the projected area 50 ₇ generated by the projection optical module PL ₇ to the second inclined arrangement, exposure light -Y-axis side The light shielding plate 30 is moved so that the optical path is formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A1 region and the transfer pattern corresponding to the B1 region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are relatively moved along the X-axis direction, whereby the second scanning exposure for forming the pattern of the B1 region in the mask pattern on the substrate P is performed. Accordingly, the mask pattern MP1 can be transferred to the substrate P, and the panel PN1 can be formed on the substrate P.

Further, in order to form the panel PN2 on the substrate P, a second step movement is performed in which the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate stage driving unit PSTD. Further, in the second step movement, in order to transfer the mask pattern MP2 to the substrate P, the mask M is moved by the mask stage driving unit MSTD. Then, as shown in FIG. 18 (b), moves the light shielding plate 30 which defines the projected area 50 ₁₀ generated by the projection optical module PL ₁₀ to the first inclined arrangement, the exposure light on the + Y-axis side The light shielding plate 30 is moved so that the optical path is formed. In this state, by moving the mask M and the substrate P relative to each other along the X-axis direction, the third scanning exposure for forming the pattern of the A2 region of the mask pattern on the substrate P is performed. Next, a third step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage driving unit PSTD. Then, as shown in FIG. 19 moves the light shielding plate 30 which defines the projected area 50 ₇ generated by the projection optical module PL ₇ to the second inclined arrangement, the optical path of the exposure light -Y axis side The light shielding plate 30 is moved so as to be formed. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A2 region and the transfer pattern corresponding to the B2 region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the mask M and the substrate P are moved relative to each other along the X-axis direction to perform the fourth scanning exposure for forming the B2 region pattern of the mask pattern on the substrate P. Accordingly, the mask pattern MP2 can be transferred to the substrate P, and the panel PN2 can be formed on the substrate P.

Hereinafter, although not shown, in order to form the panel PN3 on the substrate P, a fourth step movement is performed in which the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate stage driving unit PSTD. . Then, the light shielding plate 30 that defines the projection region 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first inclined arrangement, and the light shielding plate 30 is formed so that the optical path of the exposure light is formed on the + Y axis side. Move. In this state, by moving the mask M and the substrate P relative to each other along the X-axis direction, the fifth scanning exposure for forming the pattern of the A2 region of the mask pattern on the substrate P is performed. Next, a fifth step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate stage drive unit PSTD. Then, it moves the light shielding plate 30 which defines the projected area 50 ₇ generated by the projection optical module PL ₇ to the second inclined arrangement, the light shielding plate 30 so that the optical path of the exposure light on the -Y-axis side is formed Move. At this time, in each panel region on the substrate P, a joint portion is formed between the transfer pattern corresponding to the A2 region and the transfer pattern corresponding to the B2 region. At the joint portion, the light shielding plate 30 and the blind device 60 are positioned so that the exposure amount is uniform. Thereafter, the sixth scanning exposure for forming the pattern of the B2 region of the mask pattern on the substrate P is performed by relatively moving the mask M and the substrate P along the X-axis direction. Thereby, the mask pattern MP3 can be transferred to the substrate P, and the panel PN3 can be formed on the substrate P. Thus, the panel PN1, the panel PN2, and the panel PN3 can be formed on the substrate P.

Note that the first to fifth exposure methods are merely examples, and besides these, various modes are conceivable for splice exposure performed in the exposure apparatus EX. Therefore, it is necessary to design each time how to divide the mask pattern into a plurality of areas and perform joint exposure according to the required panel size.

However, there are various restrictions on the design of the mask pattern divisions. That is, in the exposure apparatus EX, since the relative position in the step (Y axis) direction between the mask stage MST (mask M) and each projection optical system module is unchanged, the length of each transfer pattern in the Y axis direction is The base is an integral multiple of the length of the projection area formed by each projection optical system module, and the total length is adjusted by the light shielding plate 30. On the other hand, the projection optical module having the light shielding plate 30 is only a part (in this embodiment, the projection optical system module PLf), which is a limitation in designing the total length of the projection area in the Y-axis direction. . Further, in the panel manufacturing process, each panel has a lead-out line (referred to as a tab area) for connecting each panel and the drive circuit to the peripheral portion separately from the liquid crystal display surface on which a repeated pattern is formed. Is formed. Since the lead lines formed in the tab area are not repetitive patterns, they become a restriction when performing joint exposure. Also, from the viewpoint of throughput, it is preferable that the number of splice exposures is small, and this is also a limitation when the mask pattern is divided into a plurality of regions. Further, since the mask size is physically limited depending on the size of the mask stage MST, this point also becomes a restriction when the mask pattern is divided into a plurality of regions.

On the other hand, in the exposure apparatus EX of the present embodiment, a joint portion is formed when joint exposure is performed by the variable diaphragm device configured by the field diaphragm 20, the light shielding plate 30, the drive mechanism 80, and the blind device 60. Of the pair of projection areas, the length and end shape of one projection area (in this embodiment, the projection area 50f) are determined by using the light shielding plate 30 in any of the first to fourth modes. Can be adjusted arbitrarily. Therefore, design for manufacturing products by splicing exposure (which part of the circuit pattern formed on the mask is to be formed on the glass substrate using splicing exposure, on the circuit pattern on which splicing exposure processing is performed) The degree of freedom of the position and the arrangement of the plurality of types of circuit patterns on the mask used when exposing a plurality of types of circuit patterns of different sizes on the glass substrate is improved, and the above various restrictions Can be relaxed. For example, if the inclination direction of the light shielding plate 30 is fixed, the light shielding plate 30 is formed so that a trapezoidal opening K as shown in FIG. 4A or 4C can be formed. 4 (b) or 4 (d), the parallelogram-shaped and slit-shaped opening K cannot be formed (the oblique side of the light shielding plate 30 and the edge where the opening K is formed). However, in this embodiment, the degree of freedom of design described above is improved.

When joint exposure is performed using the exposure apparatus EX of the present embodiment, the position of the light-shielding plate 30 and the position of the light-shielding plate 30 according to the required product design (see the first to fifth exposure methods above), and The inclination (any one of the first to fourth modes) is determined. For example, as shown in FIG. 20, in step S10, the panel (product) size, the mask size, the width (position) of the tab area, and the position of the light shielding plate 30 (in this embodiment, the position corresponding to the projection area 50f). A plurality of areas (A and B areas of the first exposure method, areas A to C of the third exposure method, etc.) are set on the mask M according to various conditions such as the number of times of the best scanning exposure. . In step S12, the position of the light shielding plate 30 in the Y-axis direction is determined according to the length in the Y-axis direction of the region on the mask M determined in step S10.

In step S14, it is determined whether or not the position of the light shielding plate 30 determined in step S12 satisfies a desired splice exposure condition. For example, it is determined whether or not the total exposure amount of the joint portion MC (see FIG. 10) formed on the substrate P satisfies a desired exposure condition when joint exposure is performed in the inclination direction of the current light shielding plate 30. To do. If the determination in step S14 is yes, the process proceeds to step S16 to perform splice exposure. If the determination in step S14 is No, the process proceeds to step S18, and mode switching of the light shielding plate 30 (switching between the first mode and the second mode or switching between the third mode and the fourth mode) is performed. After adding the above process (the mode of the light shielding plate 30 is actually switched during the Y step operation of the substrate P), the process proceeds to step S16 to perform splice exposure.

Note that the position of the light shielding plate 30 can be determined if the exposure conditions for performing joint exposure are known in advance based on the panel (product) size, the mask size, the width (position) of the tab region, the number of scanning exposures, and the like. It may be configured to be switchable between the first scanning exposure and the second scanning exposure. As a result, the above-described steps (steps S14 and S18) can be omitted, so that the exposure process can be simplified.

As described above, in the present embodiment, one of the pair of edges (+ Y side or −Y side) spaced apart in the Y axis direction that forms the opening K and the pair of edges in the Y axis direction of the light shielding plate 30. The light path of the exposure light is formed on one side or the other side (+ Y side or −Y side) of the light shielding plate 30 by one (+ Y side or −Y side) of the light, and the exposure light that has passed through the optical path On the substrate P, a planar trapezoidal or parallelogram-shaped projection region 50f is generated. And the width | variety regarding the Y-axis direction of the projection area | region 50f of the said planar view trapezoid or a parallelogram can be suitably set and changed with the Y position of the light-shielding plate 30. FIG.

Thus, since the position and shape of the projection region 50f can be changed by switching the mode of the light shielding plate 30, the projection region formed on the substrate P by the plurality of projection optical modules including the projection region 50f can be changed. The length in the Y-axis direction and the end shape (inclination direction) can be arbitrarily set. Therefore, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10) formed on the substrate P by splice exposure is improved, and a liquid crystal panel having an arbitrary width is formed on one mother glass substrate. It becomes possible to do.

Note that the configuration of the embodiment described above is an example, and can be changed as appropriate. That is, in the above embodiment, only one light shielding plate 30 (variable field stop device) is provided. However, the present invention is not limited to this, and a plurality of light shielding plates 30 may be provided. The number and position of the projection optical module provided with the light shielding plate 30 (variable field stop device) are not particularly limited. In this case, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10) formed on the substrate P by splicing exposure is further improved.

Also, the mechanism for driving the light shielding plate 30 can be changed as appropriate. That is, as in the modification shown in FIG. 21, two light shielding plates 30 may be provided for one opening K (field stop 20 (see FIG. 3)). The drive mechanism 80A for independently driving the two light shielding plates 30 includes a pair of

actuators

82A and 84B, as in the above embodiment, and the nuts 82c and 84c of the pair of

actuators

82A and 84A are provided. The light shielding plate 30 is fixed. In the above embodiment, the angle of the light shielding plate 30 is changed by rotationally driving the light shielding plate 30. However, in this modification, the end portions of the two light shielding plates 30 are in the Y-axis direction in which the opening K is formed. The mounting angle is set in advance so as to be parallel to the pair of spaced edges, and one of the pair of end portions of the field stop 20 and one of the four end portions of the two light shielding plates 30 are combined. By combining them, the first to fourth modes can be realized as in the above embodiment. FIG. 21 is a schematic diagram, and FIG. 25 shows details of this modification. In the drive mechanism shown in FIG. 25, each light shielding plate 30 is reciprocally driven independently within a predetermined movable range (see the broken line arrow in FIG. 25) along a pair of arms 88 extending in the Y-axis direction. Such a drive mechanism that reciprocates the arm 88 can also be used as the drive mechanism of the light shielding plate 30 of the above embodiment.

Further, like the drive mechanism 80B of the modification shown in FIG. 22, the nut 84c of the actuator 84B may have a rotation motor 84d for driving the light shielding plate 30 to rotate. The rotation motor 84d positions the light shielding plate 30 by rotating the light shielding plate 30 and bringing it into contact with a pair of stoppers 84e fixed to the nut 84c. In this modification, the drive mechanism 80 (see FIG. 4A, etc.) of the above embodiment has a pair of linear actuators, whereas only one linear actuator is required, and the configuration is simple.

Further, as in a modified drive mechanism 80C shown in FIG. 23A, the light shielding plate 30 may be rotatably supported via a shaft 84f with respect to the nut 84c of the actuator 84C. The drive mechanism 80C has a pair of pins 84h whose positions with respect to the opening K are fixed, and moves the nut 84c in the Y-axis direction with the light shielding plate 30 in contact with one of the pair of pins 84h. Thus, the light shielding plate 30 is rotated (see FIG. 23B). The nut 84c has a leaf spring 84g that presses the light shielding plate 30 against one of the pair of stoppers 84e, and the light shielding plate 30 is always kept in contact with one of the pair of stoppers 84e. It is. In the present modification, an actuator that rotationally drives the light shielding plate 30 is unnecessary, and the configuration of the drive mechanism 80C is simple.

Further, although the light shielding plate 30 of the above embodiment is formed in a rectangular shape (rectangular) in plan view and the angle is changed by rotation, the shape of the light shielding plate is not limited to this. That is, like the light shielding plate 130 of the modified example shown in FIG. 24A, it may be formed in a U shape (reverse C shape) in a plan view that opens to the + X side. The light shielding plate 130 is made of a plate-like member extending in the Y-axis direction, and the + Y side end portion is formed in parallel with the + Y side end portion of the end portions forming the aperture K of the field stop 20 (see FIG. 3). Has been. Further, the light shielding plate 130 is formed in parallel with the −Y side end portion of the end portions where the −Y side end portion forms the opening K of the field stop 20. Of the pair of end portions separated in the Y-axis direction that form the notch 132 that opens to the + X side of the light shielding plate 130, the + Y side end portion is the end portion that forms the opening K of the field stop 20. , And parallel to the + Y side end (that is, parallel to the + Y side end of the light shielding plate 130). Of the pair of end portions spaced apart in the Y-axis direction forming the notch 132, the −Y side end portion is the end portion forming the opening K of the field stop 20 and the −Y side end portion. They are formed in parallel (that is, parallel to the end of the light shielding plate 130 on the -Y side).

The light shielding plate 130 according to the modification shown in FIG. 24A is driven in the Y-axis direction by the actuator 86. Accordingly, as shown in FIGS. 24B to 24E, the first to fourth modes can be realized as in the above embodiment. As in the above embodiment, the portion of the opening K that does not form the optical path of the exposure light is shielded by the movable blind device 60. According to the present modification, the first to fourth modes can be realized only by linearly driving the light shielding plate 130 by the single actuator 86, so that the configuration is simple.

In the above embodiment, the optical path (opening K) of the exposure light is formed by the cooperation of the field stop 20 and the light shielding plate 30 made of a plate-like member. The member that forms the optical path is not limited to this. That is, as shown in FIG. 26, a part of the opening K may be shielded from light using the

optical filters

230a and 230b. The optical filter 230a is set so that the light transmittance decreases from the + Y side end toward the −Y side. The optical filter 230b is configured symmetrically on the paper surface with respect to the optical filter 230a. The

optical filters

230a and 230b can be driven independently in the Y-axis direction, and the light shielding range of the exposure light and the position of the optical path of the exposure light can be arbitrarily set. Also according to this modification, splice exposure similar to that in the above embodiment can be performed. The

optical filters

230a and 230b are arranged in the optical axis direction from the conjugate plane with respect to the mask M and the substrate P so that the minute dots forming the light shielding portions (filter portions) in the

optical filters

230a and 230b are not transferred onto the substrate P. It is better to place it at a slightly shifted position.

In the above-described embodiment (and its modifications), the case where the feed screw device is used as the drive mechanism for driving the light shielding plate 30 has been described, but the configuration of the drive mechanism is not limited to this. That is, a known shaft motor or the like may be used as an actuator for driving the light shielding plate 30. Since the shaft motor can independently drive a plurality of movers with respect to one stator, it is suitable for the type in which the position of the pair of light shielding plates 30 is independently controlled as in the modification shown in FIG. It is. Further, as the actuator, an electromagnetic motor such as a linear motor, or a mechanical actuator such as an ultrasonic motor or an air cylinder may be used.

Further, in the modification shown in FIG. 21, each of the pair of light shielding plates 30 is driven by an independent actuator, but a part of the actuator may be common. In other words, the pair of light shielding plates 30 is placed on a common first stage (coarse movement stage), and the second stage (fine movement) capable of independently controlling the positions of the pair of light shielding plates 30 on the first stage. The stage may be configured to be placed.

In the above embodiment, the actuator for driving the light shielding plate 30 is arranged along the Y-axis direction. However, the actuator is not limited to this, and along other directions (X-axis direction, Z-axis direction, etc.). It may be arranged.

Further, the light shielding plate 30 and its driving mechanism 80 are provided to define the projection area (exposure area) generated on the substrate P, but the present invention is not limited to this, and the blind device of the illumination optical system IL is not limited to the above. You may provide the light-shielding plate of the structure similar to embodiment, and its drive mechanism.

Further, although the light shielding plate 30 is provided in the projection optical module constituting the projection optical system PL, the arrangement position is not particularly limited as long as it is on the optical path of the exposure light EL, and may be provided in the illumination optical system IL or the like. .

In the above embodiment, the light shielding plate 30 and its driving mechanism 80 are devices that constitute a part of the exposure apparatus EX. However, the light shielding plate 30 and the driving mechanism 80 (such as a driver) are not limited thereto. It is also possible to additionally provide an existing exposure apparatus as a light-shielding device (variable field stop device).

In the above embodiment, the position and shape of the projection region formed on the substrate P are changed by the variable field stop device including the light shielding plate 30. However, the present invention is not limited to this, and the mask M and the projection optical system PL are provided. It may be configured to be relatively movable in the Y-axis direction, and the position and shape of the projection region may be changed by relative movement of the mask M and the projection optical system PL in the Y-axis direction.

The illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). As the illumination light, for example, a single wavelength laser beam oscillated from a DFB semiconductor laser or a fiber laser is amplified by a fiber amplifier doped with, for example, erbium (or both erbium and ytterbium). In addition, harmonics converted into ultraviolet light using a nonlinear optical crystal may be used. A solid laser (wavelength: 355 nm, 266 nm) or the like may be used.

Further, the case where the projection optical system PL is a multi-lens type projection optical system including a plurality of projection optical modules has been described, but the number of projection optical modules is not limited to this, and one or more projection optical modules may be used. Further, the projection optical system PL may be an enlargement system or a reduction system.

Further, the use of the exposure apparatus is not limited to the exposure apparatus for liquid crystal that transfers the liquid crystal display element pattern onto the square glass plate. For example, the exposure apparatus for manufacturing an organic EL (Electro-Luminescence) panel, the semiconductor manufacture The present invention can also be widely applied to an exposure apparatus for manufacturing an exposure apparatus, a thin film magnetic head, a micromachine, a DNA chip, and the like. Moreover, in order to manufacture not only microdevices such as semiconductor elements but also masks or reticles used in light exposure apparatuses, EUV exposure apparatuses, X-ray exposure apparatuses, electron beam exposure apparatuses, etc., glass substrates, silicon wafers, etc. The present invention can also be applied to an exposure apparatus that transfers a circuit pattern.

The object to be exposed is not limited to the glass plate, but may be another object such as a wafer, a ceramic substrate, a film member, or a mask blank. Moreover, when the exposure target is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and includes, for example, a film-like (flexible sheet-like member). The exposure apparatus of the present embodiment is particularly effective when a substrate having a side length or diagonal length of 500 mm or more is an exposure target.

For electronic devices such as liquid crystal display elements (or semiconductor elements), the step of designing the function and performance of the device, the step of producing a mask (or reticle) based on this design step, and the step of producing a glass substrate (or wafer) A lithography step for transferring a mask (reticle) pattern to a glass substrate by the exposure apparatus and the exposure method of each embodiment described above, a development step for developing the exposed glass substrate, and a portion where the resist remains. It is manufactured through an etching step for removing the exposed member of the portion by etching, a resist removing step for removing a resist that has become unnecessary after etching, a device assembly step, an inspection step, and the like. In this case, in the lithography step, the above-described exposure method is executed using the exposure apparatus of the above embodiment, and a device pattern is formed on the glass substrate. Therefore, a highly integrated device can be manufactured with high productivity. .

It should be noted that the disclosure of all publications (including international publications) related to the exposure apparatus cited in the above description is incorporated into the description of this specification.

As described above, the exposure apparatus and method of the present invention are suitable for exposing a mask pattern onto a substrate. The flat panel display manufacturing method and device manufacturing method of the present invention are suitable for manufacturing flat panel displays and micro devices, respectively. The light-shielding device of the present invention is suitable for exposing a mask pattern onto a substrate.

20 ... Field stop, 30 ... Shading plate, 50 ... Projection area, 80 ... Drive mechanism, CONT ... Control device, EX ... Exposure device, K ... Aperture, P ... Substrate, PLa-PLg ... Projection optical module.

Claims

An exposure apparatus that performs exposure by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object,
Of the projection area projected onto the object via the projection optical system, the illumination amount on the object is along the second direction intersecting the first direction according to the position in the first direction. A light-shielding portion that shields a predetermined region that changes, and
An exposure apparatus comprising: a drive unit that drives the light shielding unit to change the amount of illumination.
2. The exposure apparatus according to claim 1, wherein the driving unit drives the light shielding unit so as to change a position of the predetermined region with respect to the second direction.
3. The exposure apparatus according to claim 1, wherein the light shielding unit shields a part of the projection area so that an illumination amount on the object continuously changes in the second direction.
4. The exposure apparatus according to claim 1, wherein the driving unit rotates the light shielding unit around a third direction intersecting the first and second directions.
5. The exposure apparatus according to claim 4, wherein the driving unit drives the light shielding unit so as to switch an angle of the light shielding unit with respect to the projection region with the third direction as an axis.
6. The exposure apparatus according to claim 1, wherein the driving unit drives the light shielding unit in the second direction.
The exposure apparatus according to any one of claims 1 to 6, wherein the light shielding unit shields an end of the projection region with respect to the second direction.
A movable body that holds the object and is movable;
The exposure apparatus according to claim 1, further comprising a control unit that controls movement of the moving body in the second direction according to a position of the light shielding unit with respect to the second direction. .
9. The drive unit according to claim 8, wherein when the moving body is moved in the second direction by the control unit, the drive unit drives the light shielding unit that shields one end of the projection region to shield the other end. The exposure apparatus described.
The control unit is configured to project the second pattern on the object on which the first pattern of the predetermined pattern is projected by the projection optical system so that the second pattern partially overlaps the first pattern. The exposure apparatus according to claim 8, wherein the exposure apparatus is moved in the second direction.
The exposure apparatus according to claim 10, wherein the light shielding unit shields the predetermined area which is the partial area.
A plurality of the projection optical systems are provided in the first direction,
The exposure apparatus according to any one of claims 1 to 11, wherein the light shielding unit is provided in each of the projection optical systems provided at different positions in the first direction.
13. The exposure apparatus according to claim 12, wherein the projection optical system provided at a different position in the first direction is partially different in the projection area in the second direction.
14. The exposure apparatus according to claim 12, wherein a plurality of the projection optical systems provided in the first direction irradiate the predetermined area where the projection areas overlap.
The exposure apparatus according to any one of claims 1 to 14, wherein the object is a substrate used for manufacturing a flat panel display.
The exposure apparatus according to any one of claims 1 to 15, wherein the object has a length of at least one side or a diagonal length of 500 mm or more.
Using the exposure apparatus of claim 15 to expose the substrate;
Developing the exposed substrate. A method of manufacturing a flat panel display.
Using the exposure apparatus according to any one of claims 1 to 16, exposing the substrate;
Developing the exposed substrate. A device manufacturing method.
A light-shielding device used in an exposure apparatus that scans and exposes the object by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object,
Of the projection area projected onto the object via the projection optical system, the illumination amount on the object is along the second direction intersecting the first direction according to the position in the first direction. A light-shielding portion that shields a predetermined region that changes, and
A light-shielding device comprising: a drive unit that drives the light-shielding unit to change the amount of illumination.
20. The light shielding device according to claim 19, wherein the driving unit drives the light shielding unit so as to change a position of the predetermined region with respect to the second direction.
21. The light shielding device according to claim 19 or 20, wherein the light shielding unit shields a part of the projection region so that an illumination amount on the object continuously changes in the second direction.
The light shielding device according to any one of claims 19 to 21, wherein the driving unit rotates the light shielding unit around a third direction intersecting the first and second directions.
23. The light shielding device according to claim 22, wherein the driving unit is driven so as to switch an angle of the light shielding unit with respect to the projection region with the third direction as an axis.
The light shielding device according to any one of claims 19 to 23, wherein the driving unit drives the light shielding unit in the second direction.
The light-shielding device according to any one of claims 19 to 24, wherein the light-shielding part shields one end of the projection region with respect to the second direction.
26. The light-shielding device according to claim 25, wherein the light-shielding unit shields the other end of the projection region with respect to the second direction.
The light-shielding device according to any one of claims 19 to 26, wherein the light-shielding portion is detachably provided on the exposure apparatus.
The light-shielding device according to any one of claims 19 to 27, wherein the light-shielding portion is detachably provided on the projection optical system.
An exposure method for performing scanning exposure by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object,
Of the projection area projected onto the object via the projection optical system, the illumination amount on the object is along the second direction intersecting the first direction according to the position in the first direction. Shielding the predetermined area to be changed by the light shielding portion;
Driving the light-shielding portion to change the amount of illumination.
30. The exposure method according to claim 29, wherein in the driving, the light shielding unit is driven to change a position of the predetermined area in the second direction.
31. The exposure method according to claim 29 or 30, wherein in the shielding, a part of the projection area is shielded so that an illumination amount on the object continuously changes in the second direction.
The exposure method according to any one of claims 29 to 31, wherein in the driving, the light shielding portion is rotated around a third direction intersecting the first and second directions.
33. The exposure method according to claim 32, wherein the driving is performed so that the angle of the light shielding portion with respect to the projection region is switched with the third direction as an axis.
The exposure method according to any one of claims 29 to 33, wherein in the driving, the light shielding portion is driven in the second direction.
The exposure method according to any one of claims 29 to 34, wherein in the shielding, the end of the projection region is shielded with respect to the second direction.
The exposure according to any one of claims 29 to 35, further comprising: moving a moving body that holds the object in the second direction according to a position of the light shielding unit with respect to the second direction. Method.
37. The driving unit according to claim 36, wherein when the movable body is moved in the second direction by the driving, the light shielding unit that shields one end portion of the projection region is driven so as to shield the other end portion. Exposure method.
In the movement, the movement is performed so that a second pattern in which a part of the first pattern overlaps the first pattern is projected onto the object on which the first pattern of the predetermined pattern is projected by the projection optical system. 38. The exposure method according to claim 36 or 37, wherein a body is moved in the second direction.
39. The exposure method according to claim 38, wherein the shading shields the predetermined area as the partial area.
Exposing the substrate using the exposure method according to any one of claims 29 to 39;
Developing the exposed substrate. A method of manufacturing a flat panel display.
The method for manufacturing a flat panel display according to claim 40, wherein the substrate is a substrate having a length of at least one side or a diagonal length of 500 mm or more.
Exposing the substrate using the exposure method according to any one of claims 29 to 39;
Developing the exposed substrate. A device manufacturing method.