TWI815055B - Exposure apparatus, manufacturing method of flat panel display, device manufacturing method and projection optical modules - Google Patents

Abstract

An object of the present invention is to improve the degree of design freedom when manufacturing products using bonding exposure.

The exposure method includes a plurality of projection optical units that project the pattern of the mask M onto the substrate P, and moves the mask M and the substrate P relatively along the X direction to expose the pattern of the mask M to the substrate P, including: first exposure A step of projecting the pattern A onto the A area on the substrate P in a state where the end of the -Y side of the projection area projected onto the substrate P by the projection optical unit is shielded at a first tilt angle; step a moving step, which moves the substrate P; and a second exposure step, which projects the pattern B to at least partially overlap the area A while shielding the end of the +Y side of the projection area at a second tilt angle. Area B.

Description

Exposure device, flat panel display manufacturing method, component manufacturing method and projection optical module

The present invention relates to an exposure method, a flat panel display manufacturing method, an element manufacturing method, a light shielding device, and an exposure device. More specifically, the present invention relates to an exposure method that joins patterns formed on an object through a plurality of projection optical systems. Method, manufacturing method of flat panel display or device using the above exposure method.

It is known that in the lithography step of manufacturing electronic components (micro components) such as liquid crystal display components (LCD panels) and semiconductor components, a mask or photomask (hereinafter collectively referred to as "mask") and a glass plate or wafer are used. (hereinafter collectively referred to as "substrate") is a step-scan exposure device that moves synchronously along a predetermined scanning direction and uses an energy beam to transfer the pattern formed on the mask to the substrate (so-called scanning stepper exposure machine (also known as scanner)) etc.

As a method of forming a pattern on a substrate using such an exposure device, so-called bonding exposure is known, in which the mask pattern is bonded to the substrate by utilizing the periodicity of the pattern (mask pattern) formed on the mask (see patent document 1).

When the above-mentioned joint exposure is performed using a conventional exposure device, the degree of freedom of the above-mentioned joint is not sufficient.

[Prior technical literature]

[Patent Document]

[Patent Document 1] Japanese Patent Application Laid-Open No. 2004-335864

In a first embodiment, there is provided an exposure device that exposes an object by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern to an object, and is provided with a light shielding portion, In the projection area projected onto the object via the projection optical system, a predetermined area in which the amount of illumination on the object changes along the second direction intersecting the first direction according to the position in the first direction is shielded from light; and A driving unit drives the light shielding unit to change the amount of illumination.

In a second embodiment, a method for manufacturing a flat panel display is provided, which includes: exposing the above-mentioned substrate using the exposure device in the first embodiment; and developing the exposed above-mentioned substrate.

In a third embodiment, a device manufacturing method is provided, which includes: exposing the above-mentioned substrate using the exposure device in the first embodiment; and developing the exposed above-mentioned substrate.

In an embodiment of the fourth aspect, there is provided a light shielding device for an exposure device that performs scanning exposure by relatively moving the object in a first direction with respect to a projection optical system that projects a predetermined pattern onto an object. The device further includes: a light shielding portion that controls the amount of illumination on the object in the projection area projected onto the object via the projection optical system along the second direction that intersects with the first direction based on the position in the first direction. The light is shielded in a predetermined area where the direction changes; and a driving part drives the light shielding part in a manner to change the illumination amount.

In an embodiment of the fifth aspect, there is provided an exposure method in which the object is scanned by relatively moving it in a first direction with respect to a projection optical system that projects a predetermined pattern onto the object. The exposure method of exposure further includes: using a light-shielding portion to project onto the object through the projection optical system in a projection area, according to the position in the first direction, the illumination amount on the object is along a direction that intersects with the first direction. The predetermined area where the second direction changes is light-shielded; and the light-shielding portion is driven to change the illumination amount.

In an embodiment of the sixth aspect, a method for manufacturing a flat panel display is provided, which includes: exposing the substrate using the exposure method of the embodiment of the fifth aspect; and developing the exposed substrate.

In an embodiment of the seventh aspect, a device manufacturing method is provided, which includes: exposing the substrate using the exposure method of the embodiment of the fifth aspect; and developing the exposed substrate.

20:Field diaphragm

30: Shade

50: Projection area

60:Baffle device

80:Driving mechanism

CONT: control device

EX: Exposure device

A:Region

B:Area

M: mask

MST: Mask stage

K:Open your mouth

P:Substrate

PLa~PLg: Projection optical module

PN1:Panel

PN2:Panel

PST: Substrate mounting table

[Fig. 1] is a diagram schematically showing the structure of an exposure device according to an embodiment.

[Fig. 2] A diagram for explaining the structure of the illumination optical system and the projection optical system included in the exposure device of Fig. 1. [Fig.

[Fig. 3(a)] is a top view showing the arrangement of the field diaphragm and the light shielding plate of the projection optical system. [Fig. 3(b)] shows the positional relationship between the field diaphragm and the light shielding plate in the optical axis direction. picture.

[Fig. 4(a)] is a diagram showing the first oblique arrangement of the light shielding plate, and [Fig. 4(b)] is a diagram showing the second oblique arrangement of the light shielding plate.

[Fig. 5(a)] is a diagram showing a case where a light shielding plate is used to form a connection part in the center of the projection area, and [Fig. 5(b)] is a diagram showing a case where a light shielding plate is used to form a connection part near the end of the projection area. Picture of time.

[Fig. 6(a)] shows a case where two light shielding plates are used to form a connection part, and [Fig. 6(b)] shows a case where one light shielding plate is used to form the same connection part as in Fig. 6(a) Picture of time.

[Fig. 7(a)] is a diagram showing a conventional light shielding plate, and [Fig. 7(b)] is a diagram showing a light shielding plate according to an embodiment. The diagram [Fig. 7(c)] is a diagram showing a case where a plurality of light shielding plates according to the embodiment are provided.

[Fig. 8(a)~Fig. 8(d)] are diagrams for explaining the appearance of the opening formed by the field diaphragm and the light shielding plate (first mode to fourth mode).

[Fig. 9] is a top view showing the projection area produced on the substrate.

[Fig. 10] is a conceptual diagram showing joint exposure.

[Fig. 11(a)] is a diagram showing the relationship between the substrate and the mask in the first exposure method. [Fig. 11(b)] is a diagram showing the scanning exposure of area A using the first exposure method. [Fig. 11 (c)] is a diagram showing the scanning exposure of area B using the first exposure method.

[Fig. 12(a)] is a diagram showing the relationship between the substrate and the mask in the second exposure method. [Fig. 12(b)] is a diagram showing the scanning exposure of area A using the second exposure method. [Fig. 12 (c)] is a diagram showing the scanning exposure of area B using the second exposure method.

[Fig. 13(a)] is a diagram showing the relationship between the substrate and the mask in the third exposure method, and [Fig. 13(b)] is a diagram showing the scanning exposure of area A using the third exposure method.

[Fig. 14(a)] is a diagram showing the scanning exposure of area B using the third exposure method, and [Fig. 14(b)] is a diagram showing the scanning exposure of area C using the third exposure method.

[Fig. 15(a)] is a diagram showing the relationship between the substrate and the mask in the fourth exposure method, and [Fig. 15(b)] is a diagram showing the scanning exposure of area A using the fourth exposure method.

[Fig. 16] is a diagram showing the scanning exposure of area B using the fourth exposure method.

[Fig. 17(a)] is a diagram showing the relationship between the substrate and the mask in the fifth exposure method, and [Fig. 17(b)] is a diagram showing the scanning exposure of the A1 area using the fifth exposure method.

[Fig. 18(a)] is a diagram showing the scanning exposure of the B1 area using the fifth exposure method, and [Fig. 18(b)] is a diagram showing the scanning exposure of the A2 area using the fifth exposure method.

[Fig. 19] is a diagram showing the scanning exposure of the B2 area using the fifth exposure method.

[Fig. 20] is a flowchart showing the execution of joint exposure.

[Fig. 21] A diagram showing a modified example (Part 1) of the driving mechanism of the light shielding plate.

[Fig. 22] A diagram showing a modification (Part 2) of the driving mechanism of the light shielding plate.

[Fig. 23 (a) and Fig. 23 (b)] are diagrams (Parts 1 and 2) showing modifications (Part 3) of the driving mechanism of the light shielding plate.

[Fig. 24(a)] is a diagram showing a modified example of the light shielding plate. [Fig. 24(b)~Fig. 24(e)] is a diagram showing the operation of the light shielding plate in Fig. 24(a) (parts 1 to 4). ).

[Fig. 25] is a diagram showing the details of the driving mechanism of the light shielding plate.

[Fig. 26] is a diagram illustrating joint exposure using an optical filter.

Hereinafter, an embodiment will be described using FIGS. 1 to 20 . FIG. 1 is a perspective view showing the structure of an exposure device EX according to an embodiment. In FIG. 1 , the exposure device EX includes: a mask mounting table MST that supports the mask M; a substrate mounting table PST that supports a photosensitive substrate P (hereinafter referred to as "substrate P"); and an illumination optical system IL that utilizes The exposure light EL illuminates the mask M; the projection optical system PL transfers the projected image of the pattern formed on the mask M (hereinafter referred to as the pattern image) to the substrate P, and uses it as a projection image corresponding to the pattern image. The transfer pattern of the latent image is formed on the substrate P; and the control device CONT (not shown in Figure 1, refer to Figure 2), which collectively controls the operation of the exposure device EX. The substrate P is a glass substrate coated with a photosensitive agent (photoresist), and the transfer pattern is formed in the photosensitive agent. The projection optical system PL is composed of a plurality of (seven in Figure 1) projection optical modules PLa~PLg arranged in parallel. The exposure device EX in this embodiment causes the mask M and The substrate P moves synchronously (synchronous scanning), and the mask M is illuminated by the exposure light EL, and the pattern image of the mask M is transferred to the substrate P.

Here, in the following description, the synchronous movement direction (scanning direction) of the mask M and the substrate P is set as the X-axis direction, and the direction orthogonal to the scanning direction in the horizontal plane is set as the Y-axis direction (not the scanning direction). Scanning direction), set the direction orthogonal to the X-axis direction and the Y-axis direction as the Z-axis direction. In addition, let the directions of the axes around the X-axis, Y-axis, and Z-axis be θX, θY, and θZ directions respectively.

The mask stage device of this embodiment includes: a mask stage MST that supports the mask M; a linear guide (not shown) that has a long stroke in the X-axis direction; and a linear motor and a voice coil. The mask mounting table drive unit MSTD is composed of a motor (VCM), etc. The mask stage driving unit MSTD can drive the mask having the mask M with a long stroke in the X-axis direction when the mask M and the substrate P are moved synchronously under the control of the control device CONT (see Figure 2). Mounting table MST, and in order to finely adjust the position of the mask M in the horizontal plane including the X-axis direction and the Y-axis direction, the mask mounting table MST can be moved in the X-axis direction, the Y-axis direction, the Z-axis direction and the θZ direction. drive. In addition, the position of the mask mounting table MST in the horizontal plane is measured using a laser interference meter. For example, it is usually detected using a resolution capability of about 0.5 to 1 nm. The measurement value of the laser interference meter is transmitted to the control device CONT to control the positions of the mask mounting table MST in the X-axis direction, the Y-axis direction, the Z-axis direction and the θZ direction.

The exposure light EL passing through the mask M is incident on the projection optical modules PLa~PLg respectively. The projection optical modules PLa~PLg are supported on the fixed plate 150, and image the pattern image corresponding to the illumination area on the mask M formed by the exposure light EL on the substrate P. The projection optical modules PLa, PLc, PLe, and PLg and the projection optical modules PLb, PLd, and PLf are respectively arranged at predetermined intervals in the Y-axis direction. In addition, the rows of projection optical modules PLa, PLc, PLe, and PLg are spaced apart from the rows of projection optical modules PLb, PLd, and PLf in the X-axis direction, and are arranged in a staggered manner in the Y-axis direction as a whole. The projection optical modules PLa~PLg each have a plurality of optical elements (lenses, etc.). The exposure light EL passing through each projection optical module PLa~PLg causes the pattern image corresponding to the illumination area on the mask M to be imaged on the different projection areas 50a~50g on the substrate P.

The substrate mounting table PST has a substrate holder PH, and the substrate P is held via the substrate holder PH. The substrate mounting table PST, like the mask mounting table MST, is movable in the X-axis direction, the Y-axis direction, and the Z-axis direction, and is also movable in the θX, θY, and θZ directions. The substrate mounting table PST is controlled by Under the control of the device CONT (see FIG. 2 ), it is driven by the substrate mounting table driving unit PSTD composed of a linear motor or the like.

Furthermore, the pattern surface of the detection mask M and the substrate P are arranged between the rows of the projection optical modules PLa, PLc, PLe, and PLg on the -X side and the rows of the projection optical modules PLb, PLd, and PLf on the +X side. The focus detection system 110 determines the position of the exposure surface in the Z-axis direction. The focus detection system 110 is configured as a focus detection system equipped with a plurality of oblique incidence modes. The detection results of the focus detection system 110 are output to the control device CONT (refer to FIG. 2). The control device CONT forms a predetermined distance and parallelism between the pattern surface of the mask M and the exposure surface of the substrate P based on the detection results of the focus detection system 110. degree of control.

The control device CONT is connected to the memory unit 120 (refer to FIG. 2 respectively), and based on the recipe information stored in the memory unit 120, it monitors the positions of the mask stage MST and the substrate stage PST while controlling the substrate stage driving unit PSTD. and the mask stage driving unit MSTD, thereby causing the mask M and the substrate P to move synchronously in the X-axis direction.

FIG. 2 is a diagram showing the configuration of the illumination optical system IL and the projection optical system PL. As shown in FIG. 2, the illumination optical system IL includes: a light source 1, which is composed of an ultrahigh-pressure mercury lamp, etc.; an elliptical mirror 1a, which condenses the light emitted from the light source 1; and a dichroic mirror 2, which condenses the light emitted from the light source 1 through the ellipse. The mirror 1a reflects the light of the wavelength required for exposure in the condensed light and transmits the light of other wavelengths; the wavelength selective filter 3 makes the light reflected by the dichroic mirror 2 only contain the light required for further exposure. Light of a wavelength (usually at least one frequency band among g, h, and i rays) passes as exposure light; and a light guide 4 branches the exposure light from the wavelength selective filter 3 into multiple strips (in this embodiment 7 in the form), and make them incident to each lighting system module IMa~IMg through the reflector 5. Here, as the lighting system module IM constituting the lighting optical system IL, in this embodiment, seven lighting system modules IMa to IMg are provided corresponding to the seven projection optical modules PLa to PLg. However, in FIG. 2 , for convenience of explanation, only the lighting system module IMf corresponding to the projection optical module PLf is shown. Each lighting system module IMa~IMg has a predetermined interval in the X-axis direction and the Y-axis direction, and is arranged corresponding to each projection optical module PLa~PLg. Moreover, from each lighting system model The exposure light EL emitted by the groups IMa~IMg and the projection optical modules PLa~PLg illuminate different illumination areas on the mask M correspondingly.

Each illumination system module IMa~IMg is equipped with an illumination shutter 6, a relay lens 7, a fly-eye lens 8 as an optical integrator, and a condenser lens 9. The illumination shutter 6 is disposed on the downstream side of the optical path of the light guide 4 so as to be detachably inserted into the optical path. The illumination shutter 6 blocks the exposure light when it is arranged in the light path, and releases the light blocking when it retreats from the light path. The lighting shutter 6 is connected to a shutter driving unit 6a. The shutter driving section 6a is controlled by the control device CONT.

In addition, each of the lighting system modules IMa to IMg has a light amount adjustment mechanism 10 . The light amount adjustment mechanism 10 adjusts the exposure amount by setting the illuminance of the exposure light for each optical path, and includes a half mirror 11 , a detector 12 , a filter 13 , and a filter drive unit 14 . The half mirror 11 is disposed in the optical path between the filter 13 and the relay lens 7 , and allows a part of the exposure light that passes through the filter 13 to enter the detector 12 . The detector 12 independently detects the illumination of the incident exposure light, and outputs the detected illumination signal to the control device CONT. The filter 13 is formed in such a manner that the transmittance linearly and gradually changes within a predetermined range along the X-axis direction, and is arranged between the illumination shutter 6 and the half mirror 11 in each optical path. The filter driving unit 14 moves the filter 13 in the X-axis direction based on instructions from the control device CONT, thereby adjusting the exposure amount for each optical path.

The light beam passing through the light amount adjustment mechanism 10 reaches the fly-eye lens 8 via the relay lens 7 . The fly-eye lens 8 forms a secondary light source on the exit surface side, and the exposure light EL from the secondary light source passes through the condenser lens 9 and passes through the catadioptric optical system 15 including the right-angle lens 16, the lens system 17, and the concave mirror 18. Then, the illumination area on the mask M is evenly illuminated. Furthermore, the catadioptric optical system 15 may be omitted. That is, the light beam passing through the condenser lens 9 may be directly irradiated to the mask M. Thereby, the illumination optical system IL and further the exposure device EX can be miniaturized.

Each of the projection optical modules PLa to PLg includes an image displacement mechanism 19 , a focus position adjustment mechanism 31 , two sets of catadioptric optical systems 21 and 22 , a field diaphragm 20 , and a magnification adjustment mechanism 23 . picture The displacement mechanism 19 displaces the pattern image of the mask M along the X-axis direction or the Y-axis direction by rotating two parallel plane glass plates in the θY direction or the θX direction respectively. In addition, the focus position adjustment mechanism 31 is provided with a pair of wedge-shaped mirrors, and changes the image plane position of the pattern image by changing the sum of the thicknesses of the wedge-shaped mirrors in the optical path. By winding at least one wedge-shaped mirror, The rotation of the optical axis causes the tilt angle of the image plane of the pattern image to change. The exposure light EL that has passed through the mask M passes through the image displacement mechanism 19 and the focus position adjustment mechanism 31, and then enters the first group of catadioptric optical system 21. The catadioptric optical system 21 forms an intermediate image of the pattern of the mask M, and is provided with a rectangular lens 24, a lens system 25 and a concave mirror 26. The right-angle lens 24 can rotate freely in the θZ direction, and can rotate the pattern image of the mask M.

The field diaphragm 20 is arranged on or near the image plane of the intermediate image formed by the catadioptric optical system 21 . The field diaphragm 20 sets the projection area on the substrate P. The exposure light EL passing through the field diaphragm 20 is incident on the second group of catadioptric optical systems 22 . Like the catadioptric optical system 21, the catadioptric optical system 22 includes a rectangular lens 27, a lens system 28, and a concave mirror 29. The right-angle lens 27 can also rotate freely in the θZ direction, and can rotate the pattern image of the mask M.

The exposure light EL emitted from the catadioptric optical system 22 passes through the magnification adjustment mechanism 23, and the pattern image of the mask M is imaged on the substrate P at an upright and equal magnification. The magnification adjustment mechanism 23 has a first plano-convex lens, two convex lenses and a second plano-convex lens in sequence along the Z-axis, and changes the magnification of the pattern image of the mask M by moving the two convex lenses along the Z-axis direction.

FIG. 3(a) is a diagram showing the field diaphragm 20 provided in each of the projection optical modules PLa to PLg. The field diaphragm 20 is arranged at a substantially conjugate position with respect to the mask M and the substrate P. Each projection optical module PLa~PLg has a field diaphragm 20 respectively, and the projection areas 50a~50g on the substrate P of each projection optical module PLa~PLg are set by the opening K formed in the corresponding field diaphragm 20. . In this embodiment, each opening K is formed into an isosceles trapezoid shape having two parallel sides along the Y-axis direction or a trapezoidal shape having two parallel sides along the Y-axis direction and one parallel side along the X-axis direction, and the projection area is 50a ~ 50g are set to a trapezoidal shape that is in a conjugate relationship with the corresponding opening K.

Furthermore, in FIG. 3(a) , the field diaphragm 20 is illustrated as a plate-like member that is rectangular in plan view and has a trapezoid-shaped opening. In fact, as shown in FIG. 3(b) , the field diaphragm 20 includes settings. The diaphragm member 20y at the edge (end portion) of the width of the opening K in the Y-axis direction and the diaphragm member 20x including the edge (end portion) that sets the width of the opening K in the X-axis direction are set as independent members. Moreover, among the above-described aperture members 20y and 20x, the aperture member 20y is disposed on the conjugate surface CP with respect to the mask M and the substrate P, and the aperture member 20x is disposed slightly closer to the exposure light EL than the conjugate surface CP. Incident side (+Z side).

Returning to FIG. 3(a) , among the projection optical modules PLa to PLg, the projection optical module PLf has a light shielding plate 30 . The light shielding plate 30 is a substantially rectangular plate member in plan view (viewed from the Z-axis direction), and as shown in FIG. 3(b) , it is arranged in the exposure position with respect to the field diaphragm 20 of the projection optical module PLf. The emission side (-Z side) of light EL.

Returning to FIG. 3(a) , the light shielding plate 30 can be moved between the long side of the +Y side and the +Y side of the opening K forming the field diaphragm 20 by the following driving mechanism 80 (refer to FIG. 8(a) etc.). The end (hypotenuse) is substantially parallel to the first oblique arrangement (see FIG. 4(a) ) and the long side on the -Y side and the end (hypotenuse) on the -Y side forming the opening K of the field diaphragm 20 The drive is performed between the second inclined arrangements (see FIG. 4(b) ) that are substantially parallel. In this way, the light shielding member 30 can change the projection area 50f generated by the projection optical module PLf by moving between the first tilted configuration (first tilt angle) and the second tilted configuration (second tilt angle). the shape. Furthermore, the first tilt angle and the second tilt angle depend on the tilt angle of the trapezoid-shaped projection area. For example, the first inclination angle shown in FIG. 4(a) is that the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the +Y-axis direction end edge of the trapezoid-shaped projection area 50f. In addition, the second inclination angle shown in FIG. 4(b) is that the inclination angle of the light shielding plate 30 with respect to the Y-axis direction is parallel to the inclination angle of the end edge in the −Y-axis direction of the trapezoid-shaped projection area 50f. That is, the inclination angle (the first inclination angle and the second inclination angle) of the light shielding plate 30 can be determined arbitrarily in consideration of the shape of the projection area.

In addition, the light shielding plate 30 can move linearly in the Y-axis direction by the driving mechanism 80 (see FIG. 8(a) and the like), and can set and change the Y-axis direction of the projection area 50f generated by the projection optical module PLf. The width. In addition, the light shielding plate 30 can also be moved linearly in the Y-axis direction to a position that does not coincide with the opening K, that is, a position where the opening K is set only by the field diaphragm 20 .

Here, the difference between the embodiment using a conventional light shielding plate and the present embodiment using the light shielding plate 30 will be described.

Figures 5(a) to 6(b) illustrate the positional relationship between the projection area and the light-shielding portion when joint exposure is performed. The right side of the paper in Figures 5(a) to 6(b) shows a part of the projection area (projection area 50e~50g) projected onto the substrate by the plurality of projection optical modules used in the above embodiment. The light-shielding plate 30 defines a projection area by blocking exposure light. In addition, the left side of the paper in FIGS. 5(a) to 6(b) shows a form in which the projection areas are arranged in a line.

As shown in FIG. 5(a) , when pattern bonding is performed in a region where the projection width in the X-axis direction of the projection area 50e is substantially constant in the Y-axis direction, that is, in the center of the trapezoid-shaped projection area 50e, by Arranging the light shielding plate 30 at the center of the projection area 50e can form a sloped portion G (connection portion) with an exposure amount whose projection width changes along the Y-axis direction.

However, as shown in FIG. 5(b) , when pattern bonding is performed in an area where the projection width in the X-axis direction of the projection area 50e changes along the Y-axis direction, that is, in the end area of the trapezoid-shaped projection area, if If the inclined portion G of the exposure amount is formed only by the light shielding portion 30 of the predetermined projection area 50e, the exposure amount in the inclined portion G will become too much and pattern bonding will not be possible.

Therefore, as shown in FIG. 6(a) , if the same light shielding plate 30A is arranged in the projection area 50f in addition to the light shielding plate 30 in the projection area 50e, the inclined portion G of the exposure amount can be formed, and pattern bonding can be performed. The light shielding plate 30A is arranged so that the inclination angle becomes equal to that of the light shielding plate 30 . Furthermore, the light-shielding plate 30 and the light-shielding plate 30A may be independent components, or may be formed from a common component.

Furthermore, even if the light shielding plate 30A is not arranged as shown in FIG. 6(a) , only one light shielding plate can be used to define the projection area 50e by changing the inclination angle of the light shielding plate 30 as shown in FIG. 6(b) . 30 forms the inclined portion G. The inclination angle of the light shielding plate 30 is at an angle with the end area of the projection area 50e. Make changes in a parallel manner. That is, the inclination angle of the light shielding plate 30 is changed so that it becomes parallel to the angle of the end region of the projection area 50f. Thereby, the end area of the projection area 50e and the end area of the projection area 50f can be pattern-joined. Pattern bonding is performed so that the end area of the projection area 50f moves exactly in the +Y direction. Thereby, there is no need to add a light shielding plate, and compared with the case of FIG. 6(a) , there is no need to synchronize the light shielding plate of the projection area 50e with the light shielding plate of the projection area 50f, so the exposure device can be simplified.

In addition, the difference between the embodiment using a conventional light shielding plate and the present embodiment using the light shielding plate 30 can also be explained as follows.

As shown in FIG. 7(a) , in the conventional embodiment, since a light shielding plate that is inclined in only one direction relative to the projection area 50f is used, it is possible to set only the T area and the α area in the Y-axis direction. , The scanning width in the Y-axis direction that can be exposed by one scan movement in the β area. For example, when joint exposure is performed in the T area and β area, the scan width can be set by moving the light shield along the Y-axis direction. When joint exposure is performed in the α area or γ area, the scan width can be set by using the illumination system model. The illumination shutter 6 (refer to FIG. 2 ) of the group IMf or the illumination system module IMg blocks the exposure light and sets the scan width. However, when a light shielding plate is arranged in the area U, the exposure amount becomes uneven and the area where joint exposure can be performed is limited.

On the other hand, in this embodiment using the light shielding plate 30, the light shielding plate 30 can be moved between the first tilted arrangement and the second tilted arrangement as shown in FIG. 7(b), so that it is suitable even in the U region. When the light shielding plate 30 is disposed inside, joint exposure can be performed to make the exposure amount uniform. For example, when the joint exposure is performed in the T region, the light shielding plate 30 can be used in the first tilted position. When the joint exposure is performed in the U region, the light shielding plate 30 can be moved to the second tilted position.

Moreover, as shown in FIG. 7(c) , if the light shielding plate 30 is arranged to shield the projection area 50e and the projection area 50g in addition to the projection area 50f, joint exposure can also be performed in the S area. That is, if the light shielding plate 30 of this embodiment is used, bonding can be performed in any area in the Y-axis direction. exposure.

Next, a method of changing the setting of the opening K by using the drive mechanism 80 to move the light shielding plate 30 of this embodiment to the first tilted configuration or the second tilted configuration will be described.

As shown in FIG. 8( a ), the driving mechanism 80 includes a pair of actuators 82 and 84 across the opening K (on the −X side and the +X side of the opening K). The actuator 82 is a so-called feed screw device and includes a motor (servo motor) 82a, a screw rod 82b driven by the motor 82a, and a cylindrical nut 82c screwed to the screw rod 82b, and can move the nut 82c to the screw rod 82b. The Y-axis direction is driven back and forth with a stroke longer than the opening K. A U-shaped notch 30a in plan view is formed near the -X side end of the light shielding plate 30, and the nut 82c is inserted into the notch 30a. The actuator 84 is also a feed screw device having the same configuration as the actuator 82 (motor 84a, screw 84b, nut 84c), but the nut 84c is mounted on the light shielding plate 30 so as to be rotatable in the θZ direction relative to the light shielding plate 30 The aspect near the end on the +X side is different. The pair of actuators 82 and 84 provided in the drive mechanism 80 are independently controlled by the control device CONT (see FIG. 2 ).

As shown in FIG. 8(a) , the driving mechanism 80 positions the light shielding plate 30 at the edge (end) of the +Y side of the light shielding plate 30 and forms the field diaphragm 20 (not shown in FIG. 8(a) ). Referring to the position of the edge (end) of the opening K in Figure 3(a) that is parallel to the edge on the +Y side, an optical path of the exposure light is formed on the -Y side of the light shielding plate 30, whereby the light path generated on the substrate P (refer to The projected area 50f in Figure 1) is a trapezoid (isosceles trapezoid) in plan view. The position and angle of the light shielding plate 30 are measured based on the output of a measuring device (not shown) (position measuring device, light quantity measuring device, etc.) or the input signal to the actuators 82 and 84 . At this time, the area of the opening K that is closer to the +Y side than the light shielding plate 30 is shielded from light by the movable baffle device 60 in a manner that prevents the exposure light from passing through. Next, as shown in FIG. 8(a) , an optical path of the exposure light is formed on the -Y side of the light shielding plate 30 , and a trapezoidal projection area 50f in plan view is generated on the substrate P by the exposure light passing through the optical path. A first mode called the light shielding plate 30 will be described.

In addition, the driving mechanism 80 can drive the nuts 82c and 84c of the pair of actuators 82 and 84 in the Y-axis direction with the same stroke (movement amount) from the state shown in FIG. 8(a) to open the opening. K's The area, that is, the width (area) of the projection area 50f (trapezoid in plan view) generated on the substrate P (see FIG. 1 ) is set and changed. At this time, the baffle device 60 is also driven in the Y-axis direction corresponding to the position of the light shielding plate 30 .

Furthermore, the above-mentioned baffle device 60 is also provided correspondingly to the projection optical modules PLa to PLe and PLg (refer to FIG. 1 ) that do not have the light shielding plate 30 , and the projection optical modules PLa to PLe and PLg formed on the projection optical modules PLa to PLg can be arbitrarily selected. The opening K (refer to FIG. 3(a) ) of the field diaphragm 20 provided by PLe and PLg is open and blocked. Furthermore, in this embodiment, the illumination optical system IL (see FIG. 1 ) has the baffle device 60 , but it is not limited to this and may be disposed at other positions as long as it is located on the optical path of the exposure light EL.

In addition, the driving mechanism 80 can be configured to position the nut 82c of the actuator 82 farther than the nut 84c of the actuator 84 as shown in FIG. 8(b) from the above-described first mode (see FIG. 8(a) as an example). The respective Y positions of the nuts 82c and 84c are controlled on the +Y side, thereby positioning the light shielding plate 30 at the edge (end) of the -Y side of the light shielding plate 30 and forming the field diaphragm 20 (see Figure 8(b) ), refer to the position where the edge (end) of the opening K in Figure 3(a) is parallel to the edge on the Y side. Thereby, the projection area 50f generated on the substrate P (see FIG. 1 ) can be made into a parallelogram in plan view. Next, as shown in FIG. 8(b), an optical path of exposure light is formed on the -Y side of the light shielding plate 30, and a projection area 50f of a parallelogram in plan view is generated on the substrate P by the exposure light passing through the optical path. This state is called the second mode of the light shielding plate 30 and will be described below. In this second mode, the area of the opening K, that is, the projected area 50f (top view) generated on the substrate P (refer to FIG. 1) can also be controlled by synchronously driving the pair of nuts 82c and 84c in the Y-axis direction. Change the setting for the width (area) of a parallelogram. In addition, the area of the opening K that is closer to the +Y side than the light shielding plate 30 also corresponds to the position of the light shielding plate 30 and is appropriately shielded from light by the baffle device 60 .

In addition, the driving mechanism 80 can move the position of the baffle device 60 along the −Y side of the light shielding plate 30 as shown in FIG. 8(c) from the second mode (as an example, see FIG. 8(b) ). An optical path of the exposure light is formed on the +Y side of the light shielding plate 30 . Since the edge (end) of the +Y side of the light shielding plate 30 is between the edge (end) of the opening K forming the field diaphragm 20 (not shown in FIG. 8(c), refer to FIG. 3(a)), -Y side The edges are parallel, so the projection area 50f generated on the substrate P by the exposure light passing through the above-mentioned optical path becomes a trapezoid (isosceles trapezoid) in plan view. Next, as shown in FIG. 8(c) , an optical path of the exposure light will be formed on the +Y side of the light shielding plate 30 , and a trapezoidal projection area in plan view will be generated on the substrate P by the exposure light passing through the optical path. The state of 50f is called the third mode of the light shielding plate 30 and will be described below. In this third mode, the area of the opening K, that is, the projected area 50f (top view) generated on the substrate P (refer to FIG. 1) can also be controlled by synchronously driving the pair of nuts 82c and 84c in the Y-axis direction. Change the setting for the width (area) of the trapezoid. In addition, the area of the opening K closer to the -Y side than the light shielding plate 30 corresponds to the position of the light shielding plate 30 and is appropriately shielded from light by the baffle device 60 .

In addition, the drive mechanism 80 can control the nut 82c and the nut 82c so that the nut 84c is located on the +Y side relative to the nut 82c as shown in FIG. 8(d) from the above-mentioned third mode (see FIG. 8(c) as an example). The Y position of 84c is used to position the light shielding plate 30 at the edge (end) of the +Y side of the light shielding plate 30 and form the field diaphragm 20 (not shown in Figure 8(b), refer to Figure 3(a) )) of the edge (end) of the opening K, the edge on the +Y side becomes a parallel position. Thereby, the projection area 50f generated on the substrate P (see FIG. 1 ) can be made into a parallelogram in plan view. Next, as shown in FIG. 8(d), an optical path of the exposure light is formed on the +Y side of the light shielding plate 30, and a projection of a parallelogram in plan view is generated on the substrate P by the exposure light passing through the optical path. The state of the region 50f is called the fourth mode of the light shielding plate 30 and will be described below. In this fourth mode, the area of the opening K, that is, the projected area 50f (top view) generated on the substrate P (refer to FIG. 1) can also be controlled by synchronously driving the pair of nuts 82c and 84c in the Y-axis direction. Change the setting for the width (area) of a parallelogram. In addition, the area of the opening K closer to the -Y side than the light shielding plate 30 corresponds to the position of the light shielding plate 30 and is appropriately shielded from light by the baffle device 60 .

As described above, in this embodiment, the exposure light can be formed in both the −Y direction (first and second modes) and the +Y direction (third and fourth modes) of the opening K with respect to the light shielding plate 30 . optical path, and the width of the opening K can be adjusted arbitrarily in the 1st to 4th modes respectively. That is, the field diaphragm 20, the light shielding plate 30, the driving mechanism 80, and the baffle device 60 constitute the projection that the projection optical module PLf produces on the substrate P. A variable field diaphragm device in which the shape and position of the area 50f can be changed arbitrarily.

FIG. 9 is a top view showing the projection areas 50a to 50g generated on the substrate P. The projection areas 50a to 50g are the ends of the projection areas adjacent to each other in the Y-axis direction, that is, the ends 51a and 51b, the ends 51c and 51d, the ends 51e and 51f, the ends 51g and 51h, and the end 51i It is set so that it overlaps with 51j, and the end part 51k and 51l in the Y-axis direction (the position in the Y-axis direction repeats). Therefore, with respect to the projection areas 50a to 50g, the substrate P is exposed while scanning in the scribed clamping area).

In addition, as shown by the dotted line in FIG. 9 , the light shielding plate 30 appropriately sets the effective size of the projection area 50f by moving to the first and second positions and the Y-axis direction. Thereby, when the light shielding plate 30 scans the substrate P in the X-axis direction and performs scanning exposure, the width and shape of the pattern image of the mask M transferred through the projection area 50f can be appropriately set in the Y-axis direction, and can The pattern width and pattern shape in the Y-axis direction of the transfer pattern formed on the substrate P as a latent image corresponding to the pattern image are appropriately set.

Next, a bonding exposure method in which multiple transfer patterns corresponding to the pattern image of the mask M are bonded to the substrate P by performing multiple scanning exposures using the exposure device EX (see FIG. 1 ) will be described. In the following description, as shown in Figure 10, the partial patterns PA and Y having the length LA in the Y-axis direction of the pattern PPA formed on the mask M are divided into two scanning exposures (the first and second scanning exposures). The pattern images of the two areas of the partial pattern PB with length LB in the axial direction are sequentially transferred to the substrate P, and the transfer patterns MA and MB corresponding to the pattern images are joined on the substrate P to perform pattern synthesis. . At this time, the boundary portions of the transfer patterns MA and MB corresponding to the boundary portions 45 and 46 of the partial patterns PA and PB are repeatedly exposed, thereby forming the connection portion MC. Thereby, the entire transfer pattern MPA on the substrate P becomes a combination of the transfer pattern MA of the partial pattern PA and the transfer pattern MB of the partial pattern PB.

Here, in this embodiment, the above-mentioned first to fourth modes can be used to appropriately set the position and width of the projection area 50f generated on the substrate P by the projection optical module PLf in the Y-axis direction. change. Thereby, the transfer pattern is formed using the projection optical module PLf in the first scanning exposure. In the case of the connection portion in MA, the length LA in the Y-axis direction of the partial pattern PA and its end shape can be set arbitrarily, or the projection optical module PLf is used to form the transfer pattern MB in the second scanning exposure. In the case of the connecting portion, the length LB in the Y-axis direction of the partial pattern PB and the shape of its end portion can be set arbitrarily.

Here, when actually using the exposure apparatus EX to manufacture a plurality of liquid crystal panels as products from one plain glass substrate, various sizes, number of pieces, etc. of the liquid crystal panels are required. For example, it is required to produce products of different sizes (circuit patterns for liquid crystal panels, etc.) on a single glass substrate. Therefore, in reality, the number of joint exposures (the number of connecting portions MC), the lengths of the transfer patterns MA and MB, and the like are required in various ways depending on the design. Hereinafter, the exposure method when performing joint exposure using the light shielding plate 30 of this embodiment will be specifically described. Furthermore, the case where the number of projection optical system modules is 7 in the following first and second exposure methods will be explained, and the case where the number of projection optical system modules in the third to fifth exposure methods will be 11 will be explained. , the number of projection optical system modules can be appropriately changed, and the concept, method, etc. of joint exposure are the same as the example illustrated in FIG. 6 regardless of the number of projection optical system modules.

FIG. 11(a) illustrates the substrate P and the mask M of the first exposure method. In the first exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The dimensions of panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the first exposure method, as in the case explained in FIG. 10 , the exposure operation for each panel PN1 and PN2 can be completed using two exposure operations (one joint exposure operation).

In the first exposure method, as shown in FIG. 11(b) , the light shielding plate 30 is moved to the second tilted position and the light path of the exposure light is formed on the +Y-axis side. In this state, the first scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction (first direction) to form the pattern of the A region in the mask pattern on the substrate P. Then, the substrate P is moved stepwise in the Y-axis direction (second direction) by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 11(c) , the light shielding plate 30 is moved in the Y-axis direction so that the light-shielding plate 30 is moved to the first tilted position and an optical path of the exposure light is formed on the -Y-axis direction side. At this time, in each panel area on the substrate P, and in the area A A connection portion is formed between the corresponding transfer pattern and the transfer pattern corresponding to the B region. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a second scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B region in the mask pattern on the substrate P. Thereby, a panel with a size larger than the pattern area PPA (see FIG. 10 ) of the mask M can be formed on the substrate P.

FIG. 12(a) illustrates the substrate P and the mask M of the second exposure method. In the second exposure method, two panels PN1 and PN2 are manufactured from one substrate P. The dimensions of panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the second exposure method, a panel larger than that in the first exposure method can be produced. In addition, similarly to the first exposure method, the exposure operation for each panel PN1 and PN2 can be completed using two exposure operations (one joint exposure operation).

In the second exposure method, as shown in FIG. 12(b) , the light shielding plate 30 defining the projection area 50f generated by the projection optical module PLf (see FIG. 1 ) is moved to the second tilted position, and The +Y-axis side forms the light path of the exposure light so that the light shielding plate 30 moves. In this state, the first scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction to form the pattern of the A region in the mask pattern on the substrate P. Then, the substrate P is moved stepwise in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 12(c) , the light shielding plate 30 defining the projection area 50b generated by the projection optical module PLb (see FIG. 1 ) is moved to the first tilted position, and is positioned on the -Y axis side. The light shielding plate 30 is moved in such a way that the light path of the exposure light is formed. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a second scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B region in the mask pattern on the substrate P. Thereby, a panel with a size larger than the pattern area PPA of the mask M can be formed on the substrate P.

FIG. 13(a) illustrates the substrate P and the mask M of the third exposure method. Exposed on 3rd In the method, two panels PN1 and PN2 are manufactured from one substrate P. The dimensions of panels PN1 and PN2 are the same, and the mask patterns used are also the same. In the third exposure method, the length of the panels PN1 and PN2 in the Y-axis direction is approximately twice the length of the mask M in the Y-axis direction, and unlike the situation illustrated in Figure 10, two exposure operations (one The joint exposure action) has not completed the exposure action for each panel PN1 and PN2. Therefore, the A area, the B area, and the C area are set on the mask M, and a total of three exposure operations (two joint exposure operations) are performed on one panel (product).

In the third exposure method, as shown in FIG. 13(b) , the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first tilted configuration, and positioned along the +Y axis. The light shielding plate 30 is moved to form a light path of the exposure light. In this state, the first scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction to form the pattern of the A region in the mask pattern on the substrate P. Next, the first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 14(a) , the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the second tilted position, and the exposure light is formed on the +Y-axis side. The light shield 30 is moved in a light path. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a second scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B region in the mask pattern on the substrate P. Furthermore, a second step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 14(b) , the light shielding plate 30 defining the projection area 50 ₄ generated by the projection optical module PL ₄ is moved to the first tilted configuration, and the exposure light is formed on the -Y axis side. The light shield 30 is moved in a light path. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the B area and the transfer pattern corresponding to the C area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a third scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the C region in the mask pattern on the substrate P. Thereby, a panel with a size larger than the pattern area PPA of the mask M can be formed on the substrate P.

Moreover, the substrate P and the mask M of the 4th exposure method are shown in FIG. 15(a). In the fourth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. The dimensions of panels PN1~PN3 are the same, and the mask patterns used are also the same. In the fourth exposure method, the length of the panels PN1 to PN3 in the Y-axis direction is about 1.3 times the length of the mask M in the Y-axis direction. Different from the above-mentioned third exposure method, two exposure operations (one bonding operation) are used. Exposure action) Complete the exposure action for each panel PN1~3. In the fourth exposure method, two areas, area A and area B, are set on the mask M, and a total of two exposure operations (one joint exposure operation) are performed on one panel (product).

In the fourth exposure method, as shown in FIG. 15(b) , the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first tilted configuration, and is positioned along the +Y axis. The light shielding plate 30 is moved to form a light path of the exposure light. In this state, the first scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction to form the pattern of the A region in the mask pattern on the substrate P. Then, the substrate P is moved stepwise in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 16 , the light shielding plate 30 defining the projection area 50 ₇ generated by the projection optical module PL ₇ is moved to the second tilted position, and an optical path of the exposure light is formed on the -Y axis side. The light-shielding plate 30 is moved in this way. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A area and the transfer pattern corresponding to the B area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a second scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B region in the mask pattern on the substrate P. Thereby, a panel with a size larger than the pattern area PPA (see FIG. 10 ) of the mask M can be formed on the substrate P.

In addition, the substrate P and the mask M of the fifth exposure method are illustrated in FIG. 17(a) . In the fifth exposure method, three panels PN1 to PN3 are manufactured from one substrate P. Compared with panels PN2 and PN3, panel PN1 is smaller in size and has a shorter length in the Y-axis direction. In addition, the mask pattern MP1 formed on the mask M is used for the exposure of the panel PN1, and the masks different from the above-mentioned mask pattern MP1 are used for the exposure of the panels PN2 and PN3. Pattern MP2.

In the fifth exposure method, as shown in FIG. 17(b) , the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the second tilted configuration, and is positioned along the +Y axis. The light shielding plate 30 is moved to form a light path of the exposure light. In this state, the first scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction to form the pattern of the A1 region in the mask pattern on the substrate P. Next, the first step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 18(a) , the light shielding plate 30 defining the projection area 50 ₇ generated by the projection optical module PL ₇ is moved to the second tilted configuration, and the exposure light is formed on the -Y axis side. The light shield 30 is moved in a light path. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A1 area and the transfer pattern corresponding to the B1 area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, a second scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B1 region in the mask pattern on the substrate P. Thereby, the mask pattern MP1 can be transferred to the substrate P, so that the panel PN1 can be formed on the substrate P.

Furthermore, in order to form the panel PN2 on the substrate P, a second step movement is performed in which the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate mounting table driving unit PSTD. Moreover, in the second step movement, in order to transfer the mask pattern MP2 to the substrate P, the mask M is moved by the mask mounting table driving unit MSTD. Next, as shown in FIG. 18(b) , the light shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first tilted position, and the exposure light is formed on the +Y-axis side. The light shield 30 is moved in a light path. In this state, the third scanning exposure is performed by relatively moving the mask M and the substrate P in the X-axis direction to form the pattern of the A2 area in the mask pattern on the substrate P. Then, the third step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, as shown in FIG. 19 , the light shielding plate 30 defining the projection area 50 ₇ generated by the projection optical module PL ₇ is moved to the second tilted position, and an optical path of the exposure light is formed on the -Y axis side. The light-shielding plate 30 is moved in this way. At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A2 area and the transfer pattern corresponding to the B2 area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, the fourth scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B2 area in the mask pattern on the substrate P. Thereby, the mask pattern MP2 can be transferred to the substrate P, so that the panel PN2 can be formed on the substrate P.

Although not shown in the figure, similarly, in order to form the panel PN3 on the substrate P, the substrate P is moved in the X-axis direction and the Y-axis direction by the substrate mounting table driving unit PSTD in the fourth step movement. Next, the light-shielding plate 30 defining the projection area 50 ₁₀ generated by the projection optical module PL ₁₀ is moved to the first tilted position, and the light-shielding plate 30 is moved so as to form an optical path of the exposure light on the +Y-axis side. . In this state, the fifth scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the A2 area in the mask pattern on the substrate P. Next, the fifth step movement is performed in which the substrate P is moved in the Y-axis direction by the substrate mounting table driving unit PSTD. Next, the light-shielding plate 30 defining the projection area 50 ₇ generated by the projection optical module PL ₇ is moved to the second tilted position, and the light-shielding plate 30 is moved so as to form an optical path of the exposure light on the -Y-axis side. . At this time, in each panel area on the substrate P, a connection portion is formed between the transfer pattern corresponding to the A2 area and the transfer pattern corresponding to the B2 area. The light shielding plate 30 and the baffle device 60 are positioned so that the exposure amount becomes uniform at the connection portion. Thereafter, the sixth scanning exposure is performed by relatively moving the mask M and the substrate P along the X-axis direction to form the pattern of the B2 area in the mask pattern on the substrate P. Thereby, the mask pattern MP3 can be transferred to the substrate P, so that the panel PN3 can be formed on the substrate P. Through the above, the panel PN1, the panel PN2, and the panel PN3 can be formed on the substrate P.

In addition, the above-mentioned first to fifth exposure methods are examples, and in addition to these, various aspects of joint exposure performed in the exposure device EX are also conceivable. Therefore, it is necessary to design how to divide the mask pattern into multiple areas and conduct joint exposure each time according to the required panel size.

However, there are various restrictions on the design of the divided parts of the mask pattern. That is, in the exposure device EX, the relative position of the mask mounting table MST (mask M) and the step (Y-axis) direction of each projection optical system module does not change, so with respect to the Y-axis direction of each transfer pattern length, through each projection optical system The integral multiple of the length of the projection area formed by the system module is used as the basis, and the total length is adjusted by using the light shielding plate 30 . On the other hand, the projection optical module including the light shielding plate 30 is only a part (in this embodiment, the projection optical system module PLf), which is a restriction in designing the total length of the projection area in the Y-axis direction. In addition, in the panel manufacturing step, lead lines (referred to as lead plate areas) for connecting each panel to the drive circuit are formed in the peripheral portion of each panel separately from the liquid crystal display surface on which the repeating pattern is formed. The lead lines formed in the lead plate area are not repeating patterns, so this becomes a constraint during bonding exposure. In addition, from the viewpoint of throughput, the number of splicing exposures is preferably small, which also becomes a restriction when dividing the mask pattern into a plurality of areas. In addition, the mask size is also physically limited by the size of the mask stage MST. Therefore, this point also becomes a restriction when dividing the mask pattern into a plurality of areas.

On the other hand, in the exposure apparatus EX of this embodiment, when joint exposure is performed using the variable diaphragm device composed of the above-mentioned field diaphragm 20, light shielding plate 30, drive mechanism 80, and shutter device 60, The length and end of one of the pair of projection areas forming the connection portion (in this embodiment, the projection area 50f) can be arbitrarily adjusted by using any of the first to fourth modes of the light shielding plate 30. part shape. Therefore, the design when manufacturing products using bonding exposure (which part of the circuit pattern formed on the mask is formed on the glass substrate using bonding exposure, or the position on the circuit pattern where the bonding exposure process is performed, or the size of The degree of freedom in the arrangement of the various circuit patterns on the mask used when exposing the different circuit patterns to the glass substrate is increased, thereby alleviating the above various constraints. As an example, assuming that the inclination direction of the light shielding plate 30 is fixed, if the light shielding plate 30 is arranged in such a manner that a trapezoidal opening K can be formed as shown in Figure 4(a) or Figure 4(c) , then it is impossible to form the parallelogram-shaped and slit-shaped opening K as shown in Figure 4(b) or Figure 4(d) (the hypotenuse of the light shielding plate 30 intersects with the end (hypotenuse) forming the opening K), Therefore, it becomes a design restriction, and in this embodiment, the degree of freedom of the above-mentioned design is improved.

When the exposure device EX of this embodiment is used for joint exposure, the position and position of the light shielding plate 30 are determined according to the design of the required product (refer to the first to fifth exposure methods mentioned above). Inclination (any one of the 1st to 4th modes above). For example, as shown in FIG. 20 , in step S10 , based on the size of the panel (product), the mask size, the width (position) of the lead plate area, and the position of the light shielding plate 30 (corresponding to the projection area 50f in this embodiment) position), the optimal number of scanning exposures, and other conditions, set multiple areas on the mask M (areas A and B for the first exposure method mentioned above, areas A~C for the third exposure method, etc.). Furthermore, in step S12, the position of the light shielding plate 30 in the Y-axis direction corresponding to the Y-axis direction length of the area on the mask M determined in the above-mentioned step S10 is determined.

Next, in step S14, it is determined whether the position of the light shielding plate 30 determined in step S12 meets the required joint exposure conditions. For example, it is determined whether the total exposure amount of the connection portion MC (see FIG. 10 ) formed on the substrate P satisfies the required exposure conditions when joint exposure is performed in the tilt direction of the existing light shielding plate 30 . When the determination in step S14 is Yes, the process proceeds to step S16 and joint exposure is performed. Moreover, when it is determined as No in step S14, the process proceeds to step S18, and the mode switching of the light shielding plate 30 (switching between the first mode and the second mode or the switching between the third mode and the fourth mode) is added to After the joint exposure step (actually, the mode switching of the light shielding plate 30 is performed during the Y step movement of the substrate P), step S16 is entered, and the joint exposure is performed.

Furthermore, if the exposure conditions for joint exposure are known in advance based on the panel (product) size, mask size, width (position) of the lead plate area, number of scan exposures, etc., then the first scan exposure and the second scan exposure can also be performed. 2. Switch the position of the light shield 30 during scanning exposure. Thereby, the above steps (steps S14 and S18) can be omitted, so the exposure process can be simplified.

As described above, in this embodiment, the opening K is formed by forming one of a pair of edges (+y side or -Y side) spaced apart in the Y-axis direction and the light shielding plate 30 in the Y-axis direction. One of a pair of edges in the direction (+Y side or -Y side) forms an optical path of the exposure light on one side or the other side (+Y side or -Y side) of the light shielding plate 30, and by passing through the optical path The exposure light generates a projection area 50f that is a trapezoid or a parallelogram in plan view on the substrate P. Furthermore, the width in the Y-axis direction of the projection area 50f, which is a trapezoid or a parallelogram in plan view, can be appropriately set and changed according to the Y position of the light shielding plate 30.

In this way, by switching the mode of the light shielding plate 30, the position and shape of the projection area 50f can be changed. Therefore, the projection area formed on the substrate P by a plurality of projection optical modules including the projection area 50f can be arbitrarily set. The length in the Y-axis direction and its end shape (inclined direction). Therefore, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10 ) formed on the substrate P by joint exposure is increased, so that a liquid crystal panel of any width can be formed on a single plain glass substrate.

In addition, the structure of one embodiment described above is an example and can be changed suitably. That is, in the above embodiment, only one light shielding plate 30 (variable field diaphragm device) is provided, but the invention is not limited to this, and a plurality of light shielding plates 30 (variable field diaphragm devices) may be provided. In addition, the number and position of the projection optical modules provided with the light shielding plate 30 (variable field diaphragm device) are not particularly limited. In this case, the degree of freedom in designing the width of the transfer pattern MPA or MPB (see FIG. 10 ) formed on the substrate P by joint exposure is further improved.

In addition, the mechanism for driving the light shielding plate 30 can also be appropriately changed. That is, as in the modification shown in FIG. 21 , two light shielding plates 30 may be provided for one opening K (field diaphragm 20 (see FIG. 3 )). The driving mechanism 80A for independently driving the two light shielding plates 30 has a pair of actuators 82A and 84A, and is fixed to the respective nuts 82c and 84c of the pair of actuators 82A and 84A. Shade 30. In the above embodiment, the angle of one light shielding plate 30 is changed by rotationally driving it. However, in this modification, the ends of the two light shielding plates 30 are spaced apart from each other in the Y-axis direction to form the opening K. The installation angle is preset so that a pair of edges are parallel, and any one of the pair of ends of the field diaphragm 20 is combined with any one of the total four ends of the two light shielding plates 30, so that it can be combined with The above embodiment implements the first to fourth modes in the same manner. In addition, FIG. 21 is a schematic diagram, and FIG. 25 shows the details of this modification. In the driving mechanism shown in FIG. 25 , each light shielding plate 30 is independently driven back and forth within a predetermined movable range (refer to the dotted arrow in FIG. 25 ) along a pair of arms 88 extending along the Y-axis direction. This type of driving mechanism that reciprocates the arm 88 can also be used as the driving mechanism of the light shielding plate 30 in the above embodiment.

Moreover, like the driving mechanism 80B of the modified example shown in FIG. 22, the nut 84c of the actuator 84B may be provided with a rotation motor 84d for rotationally driving the light shielding plate 30. Rotary motor 84d rotary drive shield The light plate 30 is abutted against a pair of stoppers 84e fixed to the nuts 84c, thereby positioning the light shielding plate 30. The drive mechanism 80 (see FIG. 4(a) and the like) of the above-mentioned embodiment has a pair of linear actuators. However, in this modification, only one linear actuator can be provided, thereby simplifying the structure.

Moreover, like the driving mechanism 80C of the modified example shown in FIG. 23(a), the light shielding plate 30 may be rotatably supported with respect to the nut 84c of the actuator 84C via the shaft 84f. The driving mechanism 80C has a pair of butt legs 84h fixed in position relative to the opening K. The nut 84c is moved in the Y-axis direction while the light shielding plate 30 is in contact with one of the pair of legs 84h, thereby shielding the light. The plate 30 rotates (refer to Fig. 23(b)). Furthermore, the nut 84c has a leaf spring 84g that presses the light shielding plate 30 against one of the pair of stoppers 84e, so that the light shielding plate 30 is always kept in contact with any one of the pair of stoppers 84e. In this modification, there is no need for an actuator to rotate the light shielding plate 30 , and the structure of the driving mechanism 80C is simple.

Furthermore, the light shielding plate 30 in the above embodiment is formed into a rectangular shape (rectangle) in plan view, and the angle is changed by rotation, but the shape of the light shielding plate is not limited to this. That is, the light shielding plate 130 of the modified example shown in FIG. 24(a) may be formed into a U-shape (inverted C-shape) in plan view, opening toward the +X side. The light shielding plate 130 is composed of a plate-shaped member extending in the Y-axis direction, and the end on the +Y side is parallel to the end on the +Y side of the ends of the opening K forming the field diaphragm 20 (see FIG. 3 ). ground formation. In addition, the -Y side end of the light shielding plate 130 is formed in parallel with the -Y side end of the ends forming the opening K of the field diaphragm 20 . In addition, the notch 132 forming the opening toward the +X side of the light shielding plate 130 is spaced in the Y-axis direction between the end on the +Y side and the end forming the opening K of the field diaphragm 20. The +Y side end of the light shielding plate 130 is formed parallel to the +Y side end of the light shielding plate 130 . In addition, the -Y side end of a pair of ends spaced apart in the Y-axis direction forming the notch 132 is parallel to the -Y side end of the ends forming the opening K of the field diaphragm 20 (i.e. is formed parallel to the -Y side end of the light shielding plate 130).

The light shielding plate 130 of the modified example shown in FIG. 24(a) is driven in the Y-axis direction by the actuator 86. Thereby, as shown in FIGS. 24(b) to 24(e) , the first to fourth modes can be realized in the same manner as the above-described embodiment. Furthermore, similarly to the above-mentioned embodiment, the light in the opening K that does not form the exposure light Part of the road is shielded from light by a movable baffle device 60 . According to this modification, the first to fourth modes can be realized by linearly driving the light shielding plate 130 using only one actuator 86, so the structure is simple.

Furthermore, in the above embodiment, the optical path (opening K) of the exposure light is formed by the cooperation of the field diaphragm 20 and the light shielding plate 30 composed of a plate-shaped member. However, the optical path (opening K) of the exposure light is formed in cooperation with the field diaphragm 20 . The components of the light path of the exposure light are not limited to this. That is, as shown in FIG. 26 , optical filters 230a and 230b may be used to shield part of the opening K from light. The optical filter 230a is set so that the light transmittance decreases from the end on the +Y side toward the -Y side. The optical filter 230b is configured to be bilaterally symmetrical with respect to the optical filter 230a. The optical filters 230a and 230b can be driven in the Y-axis direction independently, and the shielding range of the exposure light and the position of the optical path of the exposure light can be set arbitrarily. According to this modification, the same joint exposure as the above-mentioned embodiment can also be performed. Furthermore, the optical filters 230a and 230b can be arranged so that the minute dots forming the light shielding portions (filter portions) of the optical filters 230a and 230b are not transferred to the substrate P, so as to be arranged relative to the mask M and The position of the conjugate surface of the substrate P slightly shifted along the optical axis direction.

Furthermore, in the above-mentioned embodiment (and its modification), the case where the feed screw device is used as the driving mechanism for driving the light shielding plate 30 has been described, but the structure of the driving mechanism is not limited to this. That is, as the actuator for driving the light shielding plate 30, a known shaft motor or the like can also be used. The shaft motor can independently drive a plurality of movable elements with respect to one stator, and is therefore suitable for a type that independently controls the position of a pair of light shielding plates 30 as in the modification shown in FIG. 21 . Furthermore, as the actuator, an electromagnetic motor such as a linear motor or an ultrasonic motor, or a mechanical actuator such as a cylinder can also be used.

Furthermore, in the modification shown in FIG. 21 , the pair of light shielding plates 30 are each driven by an independent actuator, but part of the actuator may be shared. That is, a pair of light shielding plates 30 may be placed on a common first mounting table (coarse motion mounting table), and a controller capable of independently controlling each of the pair of light shielding plates 30 may be placed on the first mounting table. The structure of the second mounting platform (micro-motion mounting platform).

In addition, the actuator for driving the light shielding plate 30 is arranged along the Y-axis direction in the above embodiment, but it is not limited to this and may also be arranged along other directions (X-axis direction, Z-axis direction, etc.).

In addition, the light shielding plate 30 and its driving mechanism 80 are provided to define the projection area (exposure area) generated on the substrate P, but are not limited to this, and may also be provided in the baffle device of the illumination optical system IL as described above. A light shielding plate and its driving mechanism having the same structure are implemented.

In addition, the light shielding plate 30 is provided in the projection optical module constituting the projection optical system PL. However, as long as it is on the optical path of the exposure light EL, the placement position is not particularly limited, and it may also be provided in the illumination optical system IL or the like.

Furthermore, in the above embodiment, the light shielding plate 30 and the driving mechanism 80 constitute a part of the exposure apparatus EX, but the invention is not limited to this. The light shielding plate 30 and the driving mechanism 80 (including software such as a driver) may also be used as a device. A light shielding device (variable field diaphragm device) is additionally provided to the existing exposure device.

Furthermore, in the above embodiment, the position and shape of the projection area formed on the substrate P are changed by the variable field diaphragm device including the light shielding plate 30, but the invention is not limited to this, and the mask M and The projection optical system PL is configured to be relatively movable in the Y-axis direction, and the position and shape of the projection area are changed by the relative movement of the mask M and the projection optical system PL in the Y-axis direction.

In addition, the illumination light may be ultraviolet light such as ArF excimer laser light (wavelength 193 nm), KrF excimer laser light (wavelength 248 nm), or vacuum ultraviolet light such as F ₂ laser light (wavelength 157 nm). Furthermore, as the illumination light, for example, a single wavelength laser in the infrared region or visible light region oscillated from a DFB semiconductor laser or fiber laser can be used using a fiber amplifier doped with erbium (or both erbium and ytterbium). The incident light is amplified and the wavelength is converted into harmonics of ultraviolet light using nonlinear optical crystals. In addition, solid laser (wavelength: 355nm, 266nm), etc. can also be used.

Furthermore, the case where the projection optical system PL is a multi-lens type projection optical system including a plurality of projection optical modules has been described. However, the number of projection optical modules is not limited to this, as long as it is one or more. . In addition, the projection optical system PL may be an expansion system or a reduction system.

In addition, the use of the exposure device is not limited to transferring the liquid crystal display element pattern. Exposure equipment for liquid crystals with square glass plates, for example, can also be widely used in exposure equipment for organic EL (Electro-Luminescence, electroluminescence) panel manufacturing, exposure equipment for semiconductor manufacturing, and for manufacturing thin films. Exposure devices for magnetic heads, micromachines and DNA chips. In addition, it can also be applied to transfer circuit patterns to masks or photomasks used in manufacturing not only micro-components such as semiconductor components but also light exposure devices, EUV exposure devices, X-ray exposure devices, and electron beam exposure devices. Exposure equipment to glass substrates or silicon wafers.

In addition, the object to be exposed is not limited to the glass plate, but may also be other objects such as a wafer, a ceramic substrate, a film member, or a blank mask. In addition, when the object to be exposed is a substrate for a flat panel display, the thickness of the substrate is not particularly limited, and may include, for example, film-like (flexible sheet-like members). Furthermore, the exposure device of this embodiment is particularly effective when the object to be exposed is a substrate with a length of one side or a diagonal length of 500 mm or more.

Electronic components such as liquid crystal display components (or semiconductor components) are processed through the steps of designing the function and performance of the component, the steps of manufacturing a mask (or photomask) based on the design steps, and the steps of manufacturing a glass substrate (or wafer). The exposure apparatus and the exposure method of each of the above embodiments are used to transfer the pattern of the mask (photomask) to the photolithography step of the glass substrate, the development step of developing the exposed glass substrate, and the etching to remove the remaining resist. It is manufactured by an etching step to remove exposed parts other than the etchant, a resist removal step to remove useless resist after etching, a component assembly step, and an inspection step. In this case, in the photolithography step, the exposure apparatus of the above embodiment is used to perform the above exposure method, and the device pattern is formed on the glass substrate. Therefore, high-density devices can be manufactured with good productivity.

[Industrial availability]

As described above, the exposure method of the present invention is suitable for exposing the pattern of the mask to the substrate. In addition, the manufacturing method of the flat panel display and the component manufacturing method of the present invention are suitable for manufacturing flat panel displays and micro components respectively. In addition, the light shielding device and the exposure device of the present invention are suitable for exposing the pattern of the mask to substrate.

30: Shade

60:Baffle device

A:Region

B:Area

M: mask

MST: Mask stage

P:Substrate

PN1:Panel

PN2:Panel

PST: Substrate mounting table

Claims (21)

An exposure device that moves an object relative to illumination light in a scanning direction and exposes it. It is provided with a field diaphragm, which is provided in a projection optical system and formed to set the illumination light to be projected onto the object. an opening of the projection area; a light-shielding portion that is provided in the projection optical system independently of the field diaphragm and changes the shape of the projection area by blocking a portion of the illumination light; and a driving portion that drives The above-mentioned light shielding part; the above-mentioned driving part, based on the positional relationship between the above-mentioned field diaphragm and the above-mentioned light shielding part, is parallel to one side or the other side of the non-scanning direction orthogonal to the above-mentioned scanning direction of the above-mentioned opening at an angle of the above-mentioned light-shielding part. The shape of the end edge causes the light-shielding portion to rotate, thereby changing the orientation of the boundary between the light-shielding portion and the opening to drive the light-shielding portion so as to change the amount of illumination. The exposure apparatus according to claim 1, wherein the driving unit rotates the light shielding unit about a vertical direction orthogonal to the scanning direction as an axis. The exposure device according to claim 2, wherein the driving unit uses the vertical direction as an axis to drive the light shielding part to switch an angle of the light shielding part with respect to the projection area. The exposure device according to claim 1, wherein the driving section drives the light shielding section in the non-scanning direction. The exposure device according to claim 1, wherein the light shielding portion shields an end of the projection area in the non-scanning direction. The exposure device according to claim 1, further comprising: a movable body that holds the object and is movable; and a control unit that controls the movable body based on the position of the light shielding portion in the non-scanning direction. Movement in the above non-scanning direction. The exposure device according to claim 6, wherein the driving unit is the light shielding unit that shields one end of the projection area from light when the moving body is moved in the non-scanning direction by the control unit. The other end is driven in a light-shielding manner. The exposure device according to claim 6, wherein the control unit is configured to project a second pattern in which a part of the area overlaps with the first pattern on the object on which the first pattern among the predetermined patterns is projected by the projection optical system. In a pattern, the moving body is moved in the non-scanning direction. The exposure device according to claim 8, wherein the light shielding portion shields the partial area. The exposure device according to claim 1, wherein a plurality of the projection optical systems are provided in the scanning direction, and the light shielding portion is provided in each of the projection optical systems provided at different positions in the scanning direction. The exposure device according to claim 10, wherein the projection optical system is installed at different positions in the scanning direction, and the projection area is partially different in the non-scanning direction. The exposure device according to claim 10, wherein a plurality of the projection optical systems provided in the scanning direction illuminate a predetermined area where the projection areas overlap. The exposure device according to any one of claims 1 to 12, wherein the object system is used to manufacture a substrate for a flat panel display. The exposure device according to claim 13, wherein the length or diagonal length of at least one side of the substrate is 500 mm or more. A method of manufacturing a flat panel display, which includes: exposing the above-mentioned substrate using the exposure device according to claim 13; and developing the exposed above-mentioned substrate. A device manufacturing method, which includes: exposing the above-mentioned substrate using the exposure device according to claim 13; and developing the exposed above-mentioned substrate. A projection optical module, which is a projection optical module of an exposure device that moves an object relative to illumination light in a scanning direction and exposes it. It is provided with: a field diaphragm, which is provided in the projection optical system and is formed to set the above-mentioned an opening of a projection area where illumination light is projected on the above-mentioned object; a light-shielding portion that is provided in the above-mentioned projection optical system independently of the above-mentioned field diaphragm and changes the shape of the above-mentioned projection area by blocking a part of the above-mentioned illumination light ; and a driving part that drives the light-shielding part; the driving part, based on the positional relationship between the field diaphragm and the light-shielding part, drives the non-scanning direction orthogonal to the scanning direction of the opening at an angle of the light-shielding part parallel to the opening. The light shielding part is rotated according to the shape of one or the other end edge, thereby driving the light shielding part in a manner to change the orientation of the boundary between the light shielding part and the opening. The projection optical module according to claim 17, wherein the driving unit rotates the light shielding unit with a vertical direction orthogonal to the scanning direction as an axis. The projection optical module according to claim 18, wherein the driving unit uses the vertical direction as an axis to drive the light shielding part in a manner to switch an angle of the light shielding part relative to the projection area. The projection optical module according to claim 17, wherein the driving part drives the light shielding part in the non-scanning direction. The projection optical module according to claim 17, wherein the light shielding portion shields the end of the projection area in the non-scanning direction.