WO2017138564A1 - Corps de polymère, tampon de polissage et procédé de production de corps de polymère - Google Patents

Corps de polymère, tampon de polissage et procédé de production de corps de polymère Download PDF

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Publication number
WO2017138564A1
WO2017138564A1 PCT/JP2017/004579 JP2017004579W WO2017138564A1 WO 2017138564 A1 WO2017138564 A1 WO 2017138564A1 JP 2017004579 W JP2017004579 W JP 2017004579W WO 2017138564 A1 WO2017138564 A1 WO 2017138564A1
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Prior art keywords
polymer
hydroxy group
polishing pad
polyurethane resin
polymer body
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PCT/JP2017/004579
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English (en)
Japanese (ja)
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正敏 赤時
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ニッタ・ハース株式会社
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Publication of WO2017138564A1 publication Critical patent/WO2017138564A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00—Polymeric products of isocyanates or isothiocyanates
    • C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a polymer, a polishing pad, and a method for producing the polymer.
  • Polymers containing polyurethane resins are used for various applications.
  • such a polymer is used as a polishing pad for polishing an object to be polished (for example, a silicon wafer) (for example, Patent Document 1).
  • Examples of a method for polishing an object to be polished using the polishing pad include the following methods. First, a disk-shaped object to be polished is bonded to the lower surface of the upper surface plate of the polishing machine, and a disk-shaped polishing pad is bonded to the upper surface of the lower surface plate of the polishing machine. Then, the object to be polished is pressed against the polishing pad by the upper surface plate and the lower surface plate. Next, while the polishing object is pressed against the polishing pad, the polishing object is polished by rotating the upper platen and the lower platen while supplying polishing slurry onto the polishing pad. To do. As the polishing slurry, a polishing slurry containing water and abrasive grains is used.
  • the polishing pad is hard when polishing the object to be polished, the object to be polished is likely to be damaged.
  • a polishing method in which an object to be polished is less likely to be scratched may be required, and accordingly, a polishing pad with low hardness may be required.
  • a polishing pad with low hardness has a problem that it lacks handleability.
  • a disc-shaped polishing pad usually has a diameter of about 1000 to 2500 mm.
  • the polishing pad of such a size is too soft, it is easily deformed when transported. As a result, the polishing pad is polished from outside the polishing machine. There is a problem that it is difficult to carry to a predetermined position on the surface plate of the machine.
  • the method of sticking the polishing pad to the surface plate is usually the following method. That is, the polishing pad is attached to the surface plate by attaching one surface side of the double-sided tape to the polishing pad and then attaching the other surface side of the double-sided tape attached to the polishing pad to the surface plate.
  • the polishing pad is too soft, the handling property is low, so there is also a problem that the other surface side of the double-sided tape attached to the polishing pad sticks to the surface plate at a position shifted from a desired position.
  • the polishing pad is usually prepared by temporarily producing a polymer body larger than a desired size as a polishing pad, and then slicing the polymer body to prepare the polishing pad.
  • the polymer body has a problem that it is difficult to slice if it is too soft.
  • a polishing pad having a low hardness is desired when polishing an object to be polished, and a polishing pad having a high hardness is otherwise required.
  • a polymer suitable for a polishing pad or the like can be provided by providing a polymer having a low hardness under a specific situation.
  • the present invention provides a polymer body having low hardness under a specific situation, a polishing pad provided with the polymer body, and a polymer body for producing the polymer body It is an object to provide a manufacturing method.
  • the polymer according to the present invention is a polymer containing a polyurethane resin
  • the polyurethane resin comprises a first structural unit derived from a compound containing a hydroxy group and a second structural unit derived from a compound containing an isocyanate group, One or more of the first structural units are derived from at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • At least one of the first structural units is derived from an organic cation containing a hydroxy group.
  • the structural unit derived from the organic cation is preferably derived from an ionic liquid.
  • the polyurethane resin has a crosslinked structure.
  • the polymer according to the present invention is preferably a polyurethane resin foam containing the polyurethane resin.
  • the polymer according to the present invention is preferably used for a polishing pad, and is used as a part constituting at least a polishing surface of the polishing pad.
  • the polishing pad according to the present invention includes the polymer.
  • the method for producing a polymer according to the present invention is a method for producing a polymer that obtains a polymer containing a polyurethane resin,
  • the polymer is obtained by bonding a compound containing a hydroxy group and a compound containing an isocyanate group,
  • the compound containing a hydroxy group has at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • the compound containing a hydroxy group has an organic cation containing a hydroxy group,
  • the organic cation is derived from an ionic liquid;
  • the bonding is performed at a temperature equal to or higher than the melting point of the ionic liquid.
  • FIG. 4 is an SEM photograph of a cross section of the polymer body of Example 2.
  • FIG. 4 is an SEM photograph of a cross section of the polymer body of Comparative Example 2.
  • FIG. 4 is an SEM photograph of a cross section of the polymer body of Example 3.
  • the polymer according to the present embodiment will be described by taking as an example a polishing pad polymer that is a polyurethane resin foam containing a polyurethane resin.
  • the polymer body according to the present embodiment is used as a part constituting at least a polishing surface in the polishing pad.
  • the polymer body according to the present embodiment is a polymer body containing a polyurethane resin.
  • the polyurethane resin is derived from a first structural unit derived from a compound containing a hydroxy group (hereinafter also referred to as “hydroxy compound”) and a compound containing an isocyanate group (hereinafter also referred to as “isocyanate compound”).
  • One or more of the first structural units are derived from at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • the polyurethane resin is a resin in which a polyol as a hydroxy compound and a polyisocyanate as an isocyanate compound are combined.
  • the organic cation is taken into the molecule of the polyurethane resin by reacting the hydroxyl group with the isocyanate group of the isocyanate compound.
  • the organic cation may be a monol or a polyol. That is, the structural unit formed by the organic cation may be present at the terminal of the molecule of the polyurethane resin, or may be present inside the terminal rather than the terminal.
  • One or more of the first structural units are preferably derived from an organic cation containing a hydroxy group.
  • the structural unit derived from the organic cation is preferably derived from an ionic liquid.
  • the melting point of the ionic liquid is preferably 150 ° C. or less, and more preferably 100 ° C. or less.
  • fusing point of an ionic liquid can be calculated
  • DSC differential scanning calorimeter apparatus
  • the ionic liquid preferably includes a cation having two or more hydroxy groups.
  • the ionic liquid includes a cation having two or more hydroxy groups, the resulting polymer can be charged with more charges due to the cation.
  • the affinity with a liquid polar substance such as water
  • the difference in hardness between the state in contact with the liquid polar substance and the state not in contact with the liquid polar substance is further increased.
  • the ionic liquid having a cation having two or more hydroxy groups include ionic liquids represented by the following formulas (1) to (3).
  • the ionic liquid provided with the cation which has only one hydroxy group the ionic liquid of following formula (4) and (5) is mentioned, for example.
  • an ionic liquid including a cation having two or more hydroxy groups is preferable from the viewpoint that many charges can be imparted in the molecule.
  • the organic anion is taken into the molecule of the polyurethane resin by reacting the hydroxyl group with the isocyanate group of the isocyanate compound.
  • the organic anion may be a monol or a polyol. That is, the structural unit formed by the organic anion may be present at the end of the molecule of the polyurethane resin, or may be present inside the end rather than the end.
  • the organic anion is derived from 2,2-bis (hydroxymethyl) butyric acid (DMBA) (compound of the following formula (6)) and the like.
  • DMBA 2,2-bis (hydroxymethyl) butyric acid
  • the “COOH group” can be dissociated into “COO ⁇ ” and “H + ”.
  • polyol examples include a polyol monomer and a polyol prepolymer.
  • polyol monomer examples include 1,4-benzenedimethanol, 1,4-bis (2-hydroxyethoxy) benzene, ethylene glycol, propylene glycol 1,3-propanediol, 1,3-butanediol, 1, 5-pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol, diethylene glycol, triethylene glycol, tetraethylene glycol, dipropylene glycol, tripropylene glycol, polyethylene glycol having a molecular weight of 400 or less, 1, And linear aliphatic glycols such as 8-octanediol and 1,9-nonanediol, such as neopentyl glycol, 3-methyl-1,5-pentanediol, 2-methyl-1,3-propanediol, 2- Butyl-2-eth Branched aliphatic glycols such as 1,3-propaned
  • ethylene glycol and diethylene glycol are preferable in that the strength at the time of reaction tends to be higher, the rigidity of the produced polishing pad containing foamed polyurethane is likely to be higher, and the cost is relatively low.
  • polystyrene resin examples include polyether polyol, polyester polyol, polyester polycarbonate polyol, and polycarbonate polyol.
  • polyether polyol examples include polyether polyol, polyester polyol, polyester polycarbonate polyol, and polycarbonate polyol.
  • polyfunctional polyol prepolymer which has 3 or more of hydroxyl groups in a molecule
  • examples of the polyether polyol include polytetramethylene glycol (PTMG), polypropylene glycol (PPG), polyethylene glycol (PEG), and ethylene oxide-added polypropylene polyol.
  • PTMG polytetramethylene glycol
  • PPG polypropylene glycol
  • PEG polyethylene glycol
  • ethylene oxide-added polypropylene polyol examples include polytetramethylene glycol (PTMG), polypropylene glycol (PPG), polyethylene glycol (PEG), and ethylene oxide-added polypropylene polyol.
  • polyester polyol examples include polybutylene adipate, polyhexamethylene adipate, and polycaprolactone polyol.
  • polyester polycarbonate polyol examples include a reaction product of a polyester glycol such as polycaprolactone polyol and an alkylene carbonate, and a reaction mixture obtained by reacting ethylene carbonate with a polyhydric alcohol and further reacting with an organic dicarboxylic acid. Product etc. are mentioned.
  • polycarbonate polyol examples include diols such as 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, polyethylene glycol, polypropylene glycol, or polytetramethylene glycol, phosgene, diallyl carbonate ( For example, a reaction product with diphenyl carbonate) or cyclic carbonate (for example, propylene carbonate) can be used.
  • diols such as 1,3-propanediol, 1,4-butanediol, 1,6-hexanediol, diethylene glycol, polyethylene glycol, polypropylene glycol, or polytetramethylene glycol, phosgene, diallyl carbonate ( For example, a reaction product with diphenyl carbonate) or cyclic carbonate (for example, propylene carbonate) can be used.
  • polystyrene resin those having a number average molecular weight of 800 to 8000 are preferable in that an elastic foamed polyurethane can be easily obtained.
  • polytetramethylene glycol (PTMG), ethylene oxide Addition polypropylene polyol is preferred.
  • polyisocyanate examples include polyisocyanate and polyisocyanate prepolymer.
  • polyisocyanate examples include aromatic diisocyanates, aliphatic diisocyanates, and alicyclic diisocyanates.
  • aromatic diisocyanate examples include crude diphenylmethane diisocyanate (crude MDI) obtained by, for example, reacting an amine mixture obtained by condensing aniline and formaldehyde with phosgene in an inert solvent, and purifying the crude MDI.
  • Crude MDI crude diphenylmethane diisocyanate
  • polymethylene polyphenylene polyisocyanate polymeric MDI
  • modified products thereof can be used
  • tolylene diisocyanate (TDI) 1,5-naphthalene diisocyanate
  • xylylene diisocyanate 1,3-phenylene diisocyanate
  • 1,4-phenylene diisocyanate and the like can be used.
  • these aromatic diisocyanates can be used alone or in combination.
  • modified product of diphenylmethane diisocyanate examples include a carbodiimide modified product, a urethane modified product, an allophanate modified product, a urea modified product, a burette modified product, an isocyanurate modified product, and an oxazolidone modified product.
  • modified products include carbodiimide-modified diphenylmethane diisocyanate (carbodiimide-modified MDI).
  • aliphatic diisocyanate examples include ethylene diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, and 1,6-hexamethylene diisocyanate.
  • polyisocyanate prepolymer examples include a prepolymer formed by bonding a polyol and at least one of an aromatic diisocyanate, an aliphatic diisocyanate, and an alicyclic diisocyanate.
  • diphenylmethane diisocyanate diphenylmethane diisocyanate (pure MDI), polymeric MDI, or a modified product thereof is preferable in terms of easy control of the working environment because of its lower vapor pressure and less volatilization.
  • carbodiimide-modified MDI, polymeric MDI, or a mixture of these with MDI is preferred in that it has a lower viscosity and is easy to handle.
  • the polyurethane resin preferably has a crosslinked structure.
  • the cross-linked structure is preferably derived from a polyfunctional compound having at least one functional group of an isocyanate group and a hydroxy group and having a total of three or more isocyanate groups and hydroxy groups.
  • the compound of following formula (7) etc. are mentioned, for example.
  • the polyfunctional compound may be a compound of the above formula (1) which is an ionic liquid.
  • the crosslinking concentration in the polyurethane resin is preferably 0.06 to 0.80 mmol / g.
  • the cross-linking concentration represents the amount of cross-linking points in 1 g of polyurethane resin in terms of mole unit.
  • the polymer body according to this embodiment is configured as described above. Next, a method for producing the polymer body according to this embodiment will be described.
  • a polymer having a polyurethane resin is obtained.
  • the polymer is obtained by bonding a compound containing a hydroxy group and a compound containing an isocyanate group.
  • a compound containing a hydroxy group, a compound containing an isocyanate group, and a foaming agent are mixed to obtain a mixture, and the mixture is polymerized and foamed.
  • the compound containing a hydroxy group has at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • the compound containing a hydroxy group has an organic cation containing a hydroxy group, the organic cation is derived from an ionic liquid, and the bond is bonded to the ion. Perform at a temperature above the melting point of the liquid.
  • the foaming agent is not particularly limited as long as the foamed polyurethane is molded so as to generate gas to form bubbles, and bubbles are formed in the foamed polyurethane.
  • the foaming agent is decomposed by heating.
  • an organic chemical foaming agent that generates gas a low-boiling hydrocarbon having a boiling point of ⁇ 5 to 70 ° C., a halogenated hydrocarbon, water, liquefied carbon dioxide, or the like can be used alone or in combination.
  • organic chemical foaming agent examples include azo compounds (azodicarbonamide, azobisisobutyronitrile, diazoaminobenzene, barium azodicarboxylate, etc.), nitroso compounds (N, N′-dinitrosopentamethylenetetramine, N, N′-dinitroso-N, N′-dimethylterephthalamide and the like), sulfonyl hydrazide compounds [p, p′-oxybis (benzenesulfonyl hydrazide), p-toluenesulfonyl hydrazide and the like] and the like.
  • the low boiling point hydrocarbon examples include butane, pentane, cyclopentane, and mixtures thereof.
  • halogenated hydrocarbon examples include methylene chloride and HFC (hydrofluorocarbons).
  • the foaming agent may be a heat-expandable microsphere.
  • the particle size of the heat-expandable microsphere is, for example, 20 to 30 ⁇ m.
  • the heat-expandable microsphere includes a hollow body formed of a thermoplastic resin and a liquid hydrocarbon provided in a hollow portion of the hollow body. Examples of the heat-expandable microspheres include Expandel (registered trademark) manufactured by Nippon Philite Co., Ltd., and thermally expandable microcapsules manufactured by Matsumoto Yushi Seiyaku Co., Ltd.
  • the polishing pad according to the present embodiment includes the polymer body according to the present embodiment.
  • the polymer body, the polishing pad, and the polymer body manufacturing method according to the present embodiment are configured as described above, they have the following advantages.
  • the polymer body according to the present embodiment is a polymer body containing a polyurethane resin.
  • the polyurethane resin includes a first structural unit derived from a compound containing a hydroxy group and a second structural unit derived from a compound containing an isocyanate group.
  • One or more of the first structural units are derived from at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • the polyurethane resin according to such a polymer has a chemical structure having at least one of a cation and an anion, and as a result, has a chemical structure excellent in affinity with a liquid polar substance (such as water). .
  • this polyurethane resin comes into contact with a liquid polar substance, polar molecules (such as H 2 O molecules) easily enter between the polymer molecules of the polyurethane resin.
  • polar molecules such as H 2 O molecules
  • this polyurethane resin has a lower hardness when in contact with the liquid polar substance than when not in contact with the liquid polar substance. Therefore, such a polymer body is a polymer body having a lower hardness when in contact with a liquid polar substance than when not in contact with a liquid polar substance. That is, such a polymer body is a polymer body having a low hardness under a specific situation.
  • the polyurethane resin has a crosslinked structure.
  • the polyurethane resin since the polyurethane resin has a cross-linked structure, it can be prevented from being expanded by the liquid polar substance when it comes into contact with the liquid polar substance (water or the like). There is an advantage that deformation due to contact with a liquid polar substance can be suppressed.
  • the polishing pad according to this embodiment includes the polymer.
  • the method for producing a polymer according to this embodiment is a method for producing a polymer that obtains a polymer containing a polyurethane resin.
  • the manufacturing method of the high molecular body which concerns on this embodiment obtains the said high molecular body by combining the compound containing a hydroxyl group, and the compound containing an isocyanate group.
  • the compound containing a hydroxy group has at least one of an organic cation containing a hydroxy group and an organic anion containing a hydroxy group.
  • the compound containing a hydroxy group has an organic cation containing a hydroxy group.
  • the organic cation is derived from an ionic liquid.
  • the bonding is performed at a temperature equal to or higher than the melting point of the ionic liquid.
  • the bonding since the bonding is performed at a temperature equal to or higher than the melting point of the ionic liquid, it is easy to uniformly mix the ionic liquid and other materials before the bonding, and the uniformity is excellent. There is an advantage that a high polymer can be obtained.
  • a polymer body having low hardness under a specific situation is provided, and a polishing pad including the polymer body and a polymer body for producing the polymer body are provided. Can be provided.
  • the polymer body, the polishing pad, and the polymer body manufacturing method according to the present invention are not limited to the above-described embodiment. Further, the polymer, the polishing pad, and the method for producing the polymer according to the present invention are not limited to the above-described effects.
  • the polymer body, the polishing pad, and the method for producing the polymer body according to the present invention can be variously modified without departing from the gist of the present invention.
  • the polymer according to the present embodiment is formed by adding a foaming agent to the mixture, but may be formed by mixing air into the mixture by stirring.
  • the polymer body which concerns on this embodiment is a polyurethane resin foam
  • the polymer body which impregnated the polyurethane resin to the nonwoven fabric may be sufficient as the polymer body which concerns on this invention.
  • the polymer polyurethane resin according to the present invention may be formed by adding a micro hollow body to the mixture.
  • the polymer according to the present embodiment is a polymer for a polishing pad, but the polymer according to the present invention may be used for other applications, for example, cosmetic materials, office use. It may be used as a sponge, a cleaning sponge, a filler for resin modification, or the like.
  • Example 1 A main agent was prepared by mixing a urethane prepolymer obtained by reacting tolylene diisocyanate (TDI), polypropylene glycol (PPG), and diethylene glycol (DEG) with a trimer of hexamethylene diisocyanate. Further, a curing agent was prepared by mixing an ionic liquid of the following formula (1), 1,4-benzenedimethanol and 1,4-bis (2-hydroxyethoxy) benzene. And the polymer was obtained by mixing the said main ingredient, the said hardening
  • Example 1 Water absorption test
  • the water absorption rate of the polymer of Example 1 was 20%.
  • the water absorption of the polymer of Comparative Example 1 was 5%. Therefore, it can be seen that the polymer of Example 1 has a higher water absorption than the polymer of Comparative Example 1, and has a structure that easily absorbs water.
  • Example 2 A main agent was prepared by mixing a urethane prepolymer obtained by reacting tolylene diisocyanate (TDI), polypropylene glycol (PPG), and diethylene glycol (DEG) with a trimer of hexamethylene diisocyanate. Further, a curing agent was prepared by mixing an ionic liquid of the following formula (3) and 1,4-bis (2-hydroxyethoxy) benzene. And the said main ingredient, the said hardening
  • Example 2 A polymer was obtained in the same manner as in Example 2 except that triethanolamine (TEOA) was used instead of the ionic liquid.
  • TEOA triethanolamine
  • Example 3 A polymer was obtained in the same manner as in Example 2 except that 2,2-bis (hydroxymethyl) butyric acid (DMBA) was used instead of the ionic liquid.
  • DMBA 2,2-bis (hydroxymethyl) butyric acid
  • the density was determined by measuring the length, width, and thickness of a rectangular parallelepiped test piece of the polymer and measuring the mass of the test piece.
  • the hardness (JIS-A) was measured at 23 ° C. according to a hardness test according to JIS K7312-1996 type A.
  • the hardness when wet means the hardness of a polymer obtained by immersing the polymer in warm water at 40 ° C. for 24 hours.
  • Hardness (Asker-C) Hardness (Asker-C) was measured at 23 ° C. according to SRIR0101. The hardness when wet means the hardness of a polymer obtained by immersing the polymer in warm water at 40 ° C. for 24 hours.
  • the hardness of the polymer of Example 2 was significantly reduced by contact with water compared to the polymer of Example 3. Therefore, it can be seen that the polymer body of Example 2 is a polymer body having a lower hardness under specific circumstances than the polymer body of Example 3. This result is presumed to be due to the following reason.
  • the polymer of Example 3 has a structure containing a carboxylic acid in the structural unit. Carboxylic acid has a pKa of about 4, and when it comes into contact with water at pH 7, it is considered that the carboxyl group becomes an anion of about 0.01%. On the other hand, most ionic liquids can be present as cations when in contact with water. As a result, it is considered that the hardness of the polymer of Example 2 was significantly reduced by contact with water compared to the polymer of Example 3.
  • the polymer of Example 2 had smaller bubbles than those of Comparative Example 2 and Example 3.

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Polymers & Plastics (AREA)
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
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Abstract

La présente invention concerne un corps de polymère ou similaire contenant une résine de polyuréthane qui est pourvue de premiers motifs constitutifs d'un composé contenant un groupe hydroxyle, de deuxièmes motifs constitutifs d'un composé contenant un groupe isosonate, un ou plusieurs des premiers motifs constitutifs étant dérivés d'un cation organique contenant un groupe hydroxyle et/ou d'un anion organique contenant un groupe hydroxyle.
PCT/JP2017/004579 2016-02-12 2017-02-08 Corps de polymère, tampon de polissage et procédé de production de corps de polymère WO2017138564A1 (fr)

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JP2016024739A JP6639939B2 (ja) 2016-02-12 2016-02-12 研磨パッド、および、研磨パッドの製造方法
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Cited By (3)

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US10464188B1 (en) 2018-11-06 2019-11-05 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
US10569384B1 (en) 2018-11-06 2020-02-25 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad and polishing method
CN114787225A (zh) * 2019-12-13 2022-07-22 株式会社可乐丽 聚氨酯、抛光层、抛光垫及抛光方法

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WO2023036801A1 (fr) * 2021-09-07 2023-03-16 Basf Se Mousses de polyuréthane à base de monomère ionique et leur utilisation dans des barrages de tranchée ou des coussins de support de canalisation ou un matériau thermiquement isolant

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