WO2017104651A1 - Procédé de fabrication de corps électroconducteur transparent, et corps électroconducteur transparent - Google Patents

Procédé de fabrication de corps électroconducteur transparent, et corps électroconducteur transparent Download PDF

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Publication number
WO2017104651A1
WO2017104651A1 PCT/JP2016/087030 JP2016087030W WO2017104651A1 WO 2017104651 A1 WO2017104651 A1 WO 2017104651A1 JP 2016087030 W JP2016087030 W JP 2016087030W WO 2017104651 A1 WO2017104651 A1 WO 2017104651A1
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WO
WIPO (PCT)
Prior art keywords
undercoat layer
transparent conductor
producing
acid
line
Prior art date
Application number
PCT/JP2016/087030
Other languages
English (en)
Japanese (ja)
Inventor
正好 山内
大屋　秀信
直人 新妻
小俣　猛憲
圭一郎 鈴木
Original Assignee
コニカミノルタ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by コニカミノルタ株式会社 filed Critical コニカミノルタ株式会社
Priority to CN201680072661.2A priority Critical patent/CN108369836B/zh
Priority to JP2017556061A priority patent/JP6645515B2/ja
Publication of WO2017104651A1 publication Critical patent/WO2017104651A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
    • B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D167/00—Coating compositions based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C09D167/03—Polyesters derived from dicarboxylic acids and dihydroxy compounds the dicarboxylic acids and dihydroxy compounds having the carboxyl - and the hydroxy groups directly linked to aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal

Definitions

  • Patent Document 2 uses a liquid flow in a droplet applied on a substrate to form a ring having a fine width made of conductive fine particles, and a plurality of these rings are connected to form a transparent conductive film. It is disclosed to form. However, in this method, the number of intersections of rings increases to form a conductive path, and it is difficult to improve transparency.
  • the polyester resin preferably has a naphthalene ring in the main chain. It is particularly preferable to introduce a naphthalene ring into the main chain of the polyester resin by including 2,6-naphthalenedicarboxylic acid as a dicarboxylic acid component constituting the polyester resin.
  • the polyester resin is preferably crosslinked by a crosslinking agent.
  • a crosslinking agent is preferably crosslinked by an acrylic resin crosslinking agent having an oxazoline group and / or a polyalkylene oxide chain.
  • the fatty acid amide is preferably used for a coating solution containing water as a solvent (also referred to as an aqueous coating solution).
  • the fatty acid amide can be added to the coating solution as an aqueous dispersion in which the fatty acid amide is dispersed in water.
  • the high boiling point solvent is a high boiling point solvent having a boiling point higher than that of water, which is contained in the ink used for forming the conductive thin wire.
  • two or more types of high-boiling solvents are contained in the ink, two or more types of high-boiling solvents similar to those contained in the ink are blended at the same weight ratio as the high-boiling solvents in the above contact angle conditions.
  • “water and the high boiling point solvent are used in the measurement of the contact angle A of the above contact angle condition.
  • the effect of the present invention can be exhibited, and the coffee stain phenomenon can be stably expressed to form a thin line.
  • the conductive polymer more preferably comprises the above-described ⁇ -conjugated conductive polymer and polyanion.
  • a conductive polymer can be easily produced by chemical oxidative polymerization of a precursor monomer that forms a ⁇ -conjugated conductive polymer in the presence of an appropriate oxidizing agent, an oxidation catalyst, and a polyanion.
  • the ink may contain various additives such as a surfactant.
  • a surfactant for example, when forming a line-shaped liquid 3 on a substrate using an inkjet head, it is possible to stabilize the discharge by adjusting the surface tension and the like.
  • the surfactant is not particularly limited, but a silicon surfactant or the like can be used. Silicon-based surfactants are those in which the side chain or terminal of dimethylpolysiloxane is polyether-modified, such as “KF-351A”, “KF-642” manufactured by Shin-Etsu Chemical, and “BYK347” manufactured by Big Chemie. “BYK348” and the like are commercially available.
  • a printing method can be preferably used, and an inkjet method is particularly preferable.
  • an inkjet method is particularly preferable.
  • a liquid containing a conductive material is ejected as droplets from the nozzles of the inkjet head while moving the inkjet head relative to the substrate, and the ejected droplets are combined on the substrate.
  • a line-like liquid can be formed.
  • the droplet discharge method of the inkjet head is not particularly limited, and for example, a piezo method or a thermal method can be used.
  • the line width of the conductive thin wire 4 is preferably 10 ⁇ m or less, and more preferably 8 ⁇ m or less.
  • the lower limit of the line width of the conductive thin wire 4 is not particularly limited, but is preferably 1 ⁇ m or more from the viewpoint of imparting stable conductivity.
  • a plurality of further line-shaped liquids 3 are formed with ink containing a conductive material in a direction intersecting with the previously formed parallel lines 5.
  • the line-shaped liquids 3 are arranged in parallel at a predetermined interval.
  • the line-shaped liquid 3 is dried to form further parallel lines 5 composed of two conductive thin wires 4 and 4 parallel to each other.
  • the metal constituting the metal film is preferably different from the conductive material constituting the conductive thin wire.
  • the conductive thin wire can be made of silver, and the metal film can be made of copper, nickel, chromium, or the like.
  • the transparent conductor of the present invention can be suitably manufactured by the above-described method for manufacturing a transparent conductor of the present invention.
  • Electrolytic copper plating Copper sulfate pentahydrate 60g, sulfuric acid 19g, 1N hydrochloric acid 2g, gloss imparting agent ("ST901C" manufactured by Meltex Co., Ltd.) 5g, conductivity immersed in a copper plating bath prepared in a formulation to finish 1000ml with ion-exchanged water Electric power was supplied to the fine line pattern and electrolytic copper plating was performed. A copper plate for plating was used for the anode.
  • Table 1 shows the contact angle conditions (values of contact angle A, contact angle B, and B / A) of the undercoat layer 2 described above.
  • Example 4 In Example 1, a transparent conductor was obtained in the same manner as in Example 1 except that the undercoat layer 1 was replaced with the undercoat layer 4 described below.
  • a water-dispersible polyester resin D having the following composition ratio was adjusted to a solid content concentration of 5% by weight with pure water to prepare a coating solution 4.
  • Table 1 shows the contact angle conditions (contact angle A, contact angle B, and B / A values) of the undercoat layer 4 described above.
  • Example 6 In Example 1, a transparent conductor was obtained in the same manner as in Example 1 except that the undercoat layer 1 was replaced with the undercoat layer 6 described below.
  • Table 1 shows the contact angle conditions (contact angle A, contact angle B, and B / A values) in the undercoat layer 8 described above.
  • Example 9 In Example 1, a transparent conductor was obtained in the same manner as in Example 1 except that the undercoat layer 1 was replaced with the undercoat layer 9 described below.
  • ⁇ Undercoat layer 9> The following coating solution 9 is applied to the surface of the substrate subjected to corona discharge treatment with a wire bar so that the wet film thickness is 3 ⁇ m (the dry film thickness is 0.15 ⁇ m), and then dried at 100 ° C. for 3 minutes. Thus, the undercoat layer 9 was formed. By drying at 100 ° C. for 3 minutes, the polyester resin was crosslinked with an acrylic resin crosslinking agent.
  • a mixture of 3 parts by weight and 2 parts by weight of oleic acid amide (fatty acid amide) was adjusted to a solid content concentration of 5% by weight with pure water. Thus, a coating solution 9 was obtained.
  • Table 1 shows the contact angle conditions (values of contact angle A, contact angle B, and B / A) of the undercoat layer 11 described above.

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Inks, Pencil-Leads, Or Crayons (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Electric Cables (AREA)

Abstract

Le problème décrit par l'invention est de pourvoir à un corps électroconducteur et un procédé de fabrication d'un corps électroconducteur transparent permettant de former de façon stable un fil mince électroconducteur en utilisant l'effet tache de café, et présentant une excellente adhérence dans le fil mince électroconducteur. Le problème est résolu selon l'invention par un procédé de fabrication d'un corps électroconducteur transparent dans lequel : une sous-couche (2) est formée sur un matériau de base (1) ; un liquide linéaire est ensuite formé sur la sous-couche (2) à l'aide d'une encre contenant un matériau électroconducteur ; lorsque le liquide linéaire est séché, le fil mince électroconducteur (4) est ensuite formé par dépôt sélectif du matériau électroconducteur au niveau des deux extrémités latérales du liquide linéaire de manière à former le fil mince électroconducteur (4) ; et un corps électroconducteur transparent présentant un motif comprenant le fil mince électroconducteur (4) est fabriqué. L'encre comprend un solvant qui contient de l'eau et une solution à point d'ébullition élevé ayant un point d'ébullition supérieur à celui de l'eau, et un matériau électroconducteur. Le matériau électroconducteur est contenu en une concentration inférieure à 5 % en poids par rapport au poids total de l'encre, et la sous-couche (2) contient une résine de polyester spécifique.
PCT/JP2016/087030 2015-12-17 2016-12-13 Procédé de fabrication de corps électroconducteur transparent, et corps électroconducteur transparent WO2017104651A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201680072661.2A CN108369836B (zh) 2015-12-17 2016-12-13 透明导电体的制造方法及透明导电体
JP2017556061A JP6645515B2 (ja) 2015-12-17 2016-12-13 透明導電体の製造方法及び透明導電体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-246516 2015-12-17
JP2015246516 2015-12-17

Publications (1)

Publication Number Publication Date
WO2017104651A1 true WO2017104651A1 (fr) 2017-06-22

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PCT/JP2016/087030 WO2017104651A1 (fr) 2015-12-17 2016-12-13 Procédé de fabrication de corps électroconducteur transparent, et corps électroconducteur transparent

Country Status (3)

Country Link
JP (1) JP6645515B2 (fr)
CN (1) CN108369836B (fr)
WO (1) WO2017104651A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018043046A1 (fr) * 2016-08-31 2018-03-08 コニカミノルタ株式会社 Substrat à ligne fine fonctionnelle et procédé de formation de ligne fine fonctionnelle
JP2019181730A (ja) * 2018-04-04 2019-10-24 コニカミノルタ株式会社 機能性細線付き基材の製造方法、及び、インクと基材のセット
CN112640590A (zh) * 2018-08-27 2021-04-09 柯尼卡美能达株式会社 导电细线的形成方法、透明导电体的制造方法、器件的制造方法以及导电性油墨与基材的组合

Citations (2)

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JP2005095787A (ja) * 2003-09-25 2005-04-14 Seiko Epson Corp 膜形成方法、デバイス製造方法および電気光学装置
JP2015155086A (ja) * 2014-02-20 2015-08-27 コニカミノルタ株式会社 塗膜形成方法、透明導電膜付き基材、デバイス及び電子機器

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KR101218133B1 (ko) * 2010-04-27 2013-01-18 엘지디스플레이 주식회사 마이크로 렌즈의 제조방법 및 마이크로 렌즈를 구비한 태양전지
KR101792585B1 (ko) * 2012-08-20 2017-11-02 코니카 미놀타 가부시키가이샤 도전성 재료를 포함하는 평행선 패턴, 평행선 패턴 형성 방법, 투명 도전막을 구비한 기재, 디바이스 및 전자 기기

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005095787A (ja) * 2003-09-25 2005-04-14 Seiko Epson Corp 膜形成方法、デバイス製造方法および電気光学装置
JP2015155086A (ja) * 2014-02-20 2015-08-27 コニカミノルタ株式会社 塗膜形成方法、透明導電膜付き基材、デバイス及び電子機器

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018043046A1 (fr) * 2016-08-31 2018-03-08 コニカミノルタ株式会社 Substrat à ligne fine fonctionnelle et procédé de formation de ligne fine fonctionnelle
JPWO2018043046A1 (ja) * 2016-08-31 2019-06-24 コニカミノルタ株式会社 機能性細線付き基材及び機能性細線の形成方法
EP3508340A4 (fr) * 2016-08-31 2019-09-04 Konica Minolta, Inc. Substrat à ligne fine fonctionnelle et procédé de formation de ligne fine fonctionnelle
US11001687B2 (en) 2016-08-31 2021-05-11 Konica Minolta, Inc. Substrate with functional fine line and method for forming functional fine line
JP2019181730A (ja) * 2018-04-04 2019-10-24 コニカミノルタ株式会社 機能性細線付き基材の製造方法、及び、インクと基材のセット
JP7073860B2 (ja) 2018-04-04 2022-05-24 コニカミノルタ株式会社 機能性細線付き基材の製造方法、及び、インクと基材のセット
CN112640590A (zh) * 2018-08-27 2021-04-09 柯尼卡美能达株式会社 导电细线的形成方法、透明导电体的制造方法、器件的制造方法以及导电性油墨与基材的组合
EP3846599A4 (fr) * 2018-08-27 2021-08-11 Konica Minolta, Inc. Procédé de formation de fil conducteur fin, procédé de production de conducteur transparent, procédé de production de dispositif, et ensemble d'encre conductrice et de matériau de base

Also Published As

Publication number Publication date
JP6645515B2 (ja) 2020-02-14
CN108369836A (zh) 2018-08-03
CN108369836B (zh) 2020-04-14
JPWO2017104651A1 (ja) 2018-10-04

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