WO2017092537A1 - 具有散热结构的视觉传感装置 - Google Patents

具有散热结构的视觉传感装置 Download PDF

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Publication number
WO2017092537A1
WO2017092537A1 PCT/CN2016/104231 CN2016104231W WO2017092537A1 WO 2017092537 A1 WO2017092537 A1 WO 2017092537A1 CN 2016104231 W CN2016104231 W CN 2016104231W WO 2017092537 A1 WO2017092537 A1 WO 2017092537A1
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Prior art keywords
heat
sensing device
housing
visual sensing
circuit board
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PCT/CN2016/104231
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English (en)
French (fr)
Inventor
张磊
李阳帆
周东旭
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SZ DJI Technology Co Ltd
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SZ DJI Technology Co Ltd
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Publication of WO2017092537A1 publication Critical patent/WO2017092537A1/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating

Definitions

  • the present invention relates to heat dissipation technology, and more particularly to a vision sensing device having a heat dissipation structure.
  • the integration degree of chips is getting higher and higher, the chip size is getting smaller and smaller, and the heat flux density of the chip is also getting higher and higher.
  • the narrow space structure inside the product is not conducive to the heat dissipation of the chip.
  • Temperature is a key factor affecting the reliability of the chip. As the temperature increases, the failure rate of the chip increases as a geometric multiple. Therefore, how to quickly and efficiently dissipate heat from the chip is an important factor in determining the reliability of the product.
  • An embodiment of the invention provides a visual sensing device, including:
  • circuit board having a first surface and a second surface opposite the first surface
  • a heating electronic component mounted on the first surface of the circuit board
  • thermally conductive element electrically connected to the first housing and the heat generating electronic component
  • a heat dissipation structure electrically connecting the circuit board and the second housing.
  • the heat conducting component is a thermal paste layer
  • connection area of the heat dissipation structure and the second surface of the circuit board corresponds to the heat-generating electronic component.
  • the first housing protrudes from the heat-generating electronic component with a bump, and the heat-conducting element thermally connects the heat-generating electronic component and the bump.
  • the heat conducting element further thermally connects the circuit board and the bump.
  • the heat dissipation structure includes another heat conduction element, which is a thermal conductive paste layer.
  • the heat conducting element and the other heat conducting element are respectively a layer of thermally conductive clay.
  • the heat dissipation structure further includes a heat sink located between the other heat conduction element and the second housing.
  • the heat sink is laterally provided with an arcuate recess for contacting the other thermally conductive element.
  • the heat sink includes a base and a plurality of fins extending from the base, the base contacting the other heat conducting element.
  • the heat sink contacts the second housing.
  • the heat sink further includes an extending portion extending outward from opposite ends of the base and the heat sink, the extending portion having a fixing member, and the fixing member is fixed to the circuit board.
  • the heat sink further includes a pressing structure extending from the extending portion, and the second housing protrudes toward the heat sink with a pressing plate, and the pressing plate faces the circuit board Pressing the compression structure.
  • the first housing is provided with a plurality of vent holes.
  • the visual sensing device further includes an image capturing component, and the second housing defines an opening corresponding to the image capturing component.
  • the heat dissipation structure is located on one side of the image pickup element.
  • An embodiment of the present invention further provides a visual sensing device, including:
  • circuit board having a first surface and a second surface opposite the first surface
  • a heating electronic component mounted on the first surface of the circuit board
  • a first heat dissipation channel coupled to the heat generating electronic component and located on a side of the first surface of the circuit board;
  • a second heat dissipation channel is coupled to the second surface of the circuit board.
  • the first heat dissipation channel includes a first heat conduction element coupled to the heat generating electronic component and a first housing thermally coupled to the first heat conduction element.
  • the bonding area of the second heat dissipation channel and the second surface of the circuit board corresponds to the heat-generating electronic component
  • the second heat dissipation channel includes a second heat conduction element coupled to the circuit board and The second heat conducting element is thermally coupled to the second housing.
  • first casing and the second casing surround the circuit board and the heat-generating electronic component, and the first casing and the second casing are a metal casing or an alloy casing.
  • first heat conduction element and the second heat conduction element are thermal conductive paste layers.
  • first heat conducting element and the second heat conducting element are layers of a thermally conductive clay.
  • the first housing protrudes from the heat-generating electronic component with a bump, and the first heat-conducting element thermally connects the heat-generating electronic component and the bump.
  • the heat conducting element further thermally connects the circuit board and the bump.
  • the second heat dissipation channel further includes a heat sink between the second heat conduction element and the second housing.
  • the heat sink is laterally provided with an arcuate recess for contacting the second heat conducting element.
  • the heat sink includes a base and a plurality of fins extending from the base, the base contacting the second heat conducting element.
  • the heat sink contacts the second housing.
  • the heat sink further includes an extending portion extending outward from opposite ends of the base and the heat sink, the extending portion having a fixing member, and the fixing member is fixed to the circuit board.
  • the heat sink further includes a pressing structure extending from the extending portion, and the second housing protrudes toward the heat sink with a pressing plate, and the pressing plate faces the circuit board Pressing the compression structure.
  • the first housing is provided with a plurality of vent holes
  • the visual sensing device further includes an image capturing component, the second housing having an opening corresponding to the image capturing component;
  • first housing and the second housing are outer casings of the visual sensing device.
  • the heat-dissipating structure/channel is disposed on opposite sides of the heat-generating electronic component, so that heat generated when the heat-generating electronic component operates is dissipated through the two heat-dissipating channels, thereby improving heat dissipation efficiency.
  • FIG. 1 is a perspective view of a visual sensing device having a heat dissipation structure according to an embodiment of the present invention
  • FIG. 2 is a perspective assembled view of another angle of the visual sensing device shown in FIG. 1.
  • FIG. 3 is a perspective exploded view of the visual sensing device shown in FIG. 1.
  • FIG. 4 is a perspective exploded view of another angle of the visual sensing device of FIG. 1.
  • Figure 5 is a cross-sectional view taken along line I-I of the visual sensing device of Figure 1.
  • Figure 6 is an enlarged schematic view of a portion V of Figure 5.
  • Second substrate 210 Second substrate 210
  • a component when referred to as being “fixed” to another component, it can be directly on the other component or the component can be present.
  • a component When a component is considered to "connect” another component, it can be directly connected to another component or possibly a central component.
  • a component When a component is considered to be “set to” another component, it can be placed directly on another component or possibly with a centered component.
  • the terms “vertical,” “horizontal,” “left,” “right,” and the like, as used herein, are for illustrative purposes only.
  • an embodiment of the present invention provides a visual sensing device 1.
  • the visual sensing device 1 includes a first housing 10, a second housing 20 that mates with the first housing 10,
  • the circuit board 30, the electronic component 40, and the heat dissipation structure 50 are housed in a space surrounded by the first casing 10 and the second casing 20.
  • the first housing 10 and the second housing 20 are divided into two opposite sides of the circuit board 30.
  • the first housing 10 and the second housing 20 are outer casings of the visual sensing device 1 .
  • the first housing 10 includes a first substrate 110 and a first side plate 120 extending from a periphery of the first substrate 110 toward one side thereof.
  • the first substrate 110 is square.
  • the number of the first side plates 120 is four.
  • Two of the opposite first side plates 120 are provided with a plurality of vent holes 130.
  • the first housing 10 is a heat conductive housing, such as a metal housing, an alloy housing, a thermally conductive carbon nano housing, or the like.
  • the first housing 10 is an aluminum alloy housing.
  • the first housing 10 further includes a bump 150 protruding from an inner surface of the first substrate 110 toward the electronic component 40.
  • the second housing 20 includes a second substrate 210 and a second side plate 220 extending from a periphery of the second substrate 210 toward the first housing 10 .
  • the second substrate 210 is square.
  • the number of the second side plates 220 is four.
  • the two opposite second side plates 220 are respectively provided with the insertion holes 230.
  • the material of the second casing 20 is a heat conductive casing, such as a metal casing, an alloy casing, a heat conductive carbon nanoshell, or the like.
  • the second housing 20 is an aluminum alloy housing.
  • the second substrate 210 of the second housing 20 is provided with an opening 211.
  • the second housing 20 further includes a pressing plate 250 extending from the second substrate 210 toward the heat dissipation structure 50 .
  • the circuit board 30 is a plate-like structure having a first surface 310 facing the first housing 10 and a second surface 320 facing the second housing 20.
  • the circuit board 30 has a square shape corresponding to the first housing 10 and the second housing 20.
  • the electronic component 40 includes a chip 410 disposed on the first surface 310 of the circuit board 30.
  • the electronic component 40 also includes an image capture component 430 that is mounted to the second surface 320 of the circuit board 30.
  • the heat dissipation structure 50 includes a heat sink 510 and a plurality of heat conducting elements 520.
  • the thermally conductive element 520 is a thermally conductive paste layer.
  • the heat sink 510 is located on one side of the second surface 320 of the circuit board 30.
  • the heat sink 510 is provided with an arcuate recess 530 opposite to the lateral direction.
  • the heat sink 510 includes a main body portion 511 and an extending portion 513 extending outward from opposite side ends of the main body portion 511.
  • the main body portion 511 includes a bottom plate 5111 and a plurality of holes extending from the bottom plate 5111 to one side. Hot film 5113.
  • the width of the middle portion of the bottom plate 5111 is smaller than the width of both ends thereof.
  • the middle portion of the bottom plate 5111 is recessed from the front and rear sides toward the middle.
  • the plurality of fins 5113 are spaced apart from each other, and an air flow passage is formed between the adjacent fins 5113.
  • the plurality of fins 5113 are curved in a lateral direction.
  • the length of the heat sink 5113 corresponding to the bottom plate 5111 is smaller than the length of the heat sink 5113 corresponding to the two ends of the bottom plate 5111.
  • the extending portion 513 has two opposite extending arms 5131 extending from the main body portion 511 and a plurality of fixing members 5133 located at one end of the extending arm 5131 away from the main body portion 511.
  • the heat sink 510 also includes a compression structure 540.
  • the pressing structure 540 extends from the corresponding extending portion 513 away from one end of the main body portion 511 toward the main body portion 511 .
  • the pressing structure 540 includes a positioning portion 541 fixed to an end portion of the extending portion 513 and an elastic portion 543 extending from the positioning portion 541 toward the main body portion 511.
  • the elastic portion 543 is a spring piece.
  • the elastic portion 543 of the pressing structure 540 corresponds to the pressing plate 250 of the second housing 20.
  • the plurality of thermally conductive elements 520 include a first thermally conductive element 521 and a second thermally conductive element 523.
  • the first heat conducting element 521 is located between the first surface 310 of the circuit board 30 and the first housing 10 .
  • the second heat conducting element 523 is located between the second surface 320 of the circuit board 30 and the bottom plate 5111 of the heat sink 510.
  • the plurality of thermally conductive elements 520 are thermally conductive clay layers.
  • the heat sink 510 and the second housing 20 are placed on the side of the second surface 320 of the circuit board 30 during assembly.
  • the second thermally conductive element 523 is disposed between the bottom plate 5111 of the heat sink 510 and the second surface 320 of the circuit board 30.
  • the arcuate recess 530 of the heat sink 510 corresponds to an image pickup component 430 (shown in FIG. 4) mounted to the circuit board 30.
  • the image pickup element 430 corresponds to the opening 211 of the second housing 20 (as shown in FIG. 4).
  • the heat sink 510 is fixed to the second surface 320 of the circuit board 30 by the fixing member 5133.
  • the heat sink 5113 of the heat sink 510 contacts the second substrate 210 of the second housing 20.
  • the pressing plate 250 of the second casing 20 presses against the pressing structure 540 of the heat sink 510 in the direction of the circuit board 30.
  • the second heat conducting element 523 is completely squeezed by the heat sink 510 to completely fill a gap between the bottom plate 5111 and the second surface of the circuit board 30.
  • a connection area of the second heat conduction element 523 and the second surface 320 of the circuit board 30 corresponds to the chip 410.
  • the first housing 10 and the first heat conducting component 521 are disposed on a side of the first surface 310 of the circuit board 30.
  • the first heat conducting component 521 is disposed on the bump 150 of the first housing 10 and on the circuit board 30 Between the chips 410 on the first surface 310.
  • the first housing 10 is fixed to the second housing 20 by a fastener (not shown), and the first heat conducting element 521 between the bump 150 and the chip 410 is squeezed completely Filling a gap between the bump 150 and the chip 410, and filling a gap between the first surface 310 of the circuit board 30 and the bump 150 on both sides of the chip 410, the chip 410
  • the first heat conducting element 521 is completely surrounded by the circuit board 30.
  • the chip 410 generates heat when the visual sensing device 1 is in operation. A portion of the heat is directly transmitted to the bump 150 of the first housing 10 via the first heat conducting element 521, thereby being emitted from the first housing 10 to the external environment, thereby the first heat conducting element 521,
  • the first housing 10 constitutes a first heat dissipation channel of the chip 410.
  • Another part of the heat is transferred to the circuit board 30, and then transmitted to the bottom plate 5111 and the heat sink 5113 of the heat sink 510 via the second heat conducting element 523, and part of the heat is directly radiated by the heat sink 5113, and part of the heat is
  • the heat sink 5113 is transmitted to the second housing 20 and is radiated to the external environment, so that the second heat conducting component 523, the heat sink 510 and the second housing 20 constitute the second of the chip 410. Cooling channel.
  • the heat generated by the chip 410 is transmitted to the first housing 10 through the first heat conducting element 521, and then is radiated to the external environment through the first housing 10 to form a first A heat dissipation channel.
  • heat generated by the chip 410 is also transmitted to the circuit board 30, and then connected to the heat sink 510 through a second heat conducting component 523, and the heat sink 510 is connected to the second housing 20.
  • Forming a second heat dissipation channel Since the two heat dissipation channels sandwich the heat source in the middle, the heat dissipation efficiency is greatly improved. It is experimentally verified that the second heat dissipation channel can increase the heat dissipation efficiency by more than 50% than the first heat dissipation channel.
  • the heat sink 510 is connected to the second housing 20, heat is finally transmitted to the second housing 20 to be radiated to the external environment, and the second housing 20 is used as the heat sink 510. Part of it increases the heat dissipation area and improves the heat dissipation efficiency.
  • the heat conducting element 520 particularly when the heat conducting element 520 is a layer of thermally conductive clay, has a very high compression characteristic, and the chip 410, the circuit board 30 and the first housing 10 can be completely filled by extrusion.
  • the gap between the circuit board 30 and the heat sink 510 forms a complete envelopment between the chip 410 and other electronic components on the circuit board 30, thereby achieving the effect of immersion heat dissipation and further improving The heat dissipation efficiency.
  • Another heat sink can be disposed between the first heat conduction element 521 and the first housing 10 .
  • the heat conducting element 520 can also be a heat pipe or a heat conducting plate internally filled with a phase change medium.

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Studio Devices (AREA)

Abstract

一种视觉传感装置（1），包括电路板（30）、发热电子元件、第一壳体（10）、第二壳体（20）、导热元件（520）及散热结构（50）。所述电路板（30）具有第一表面（310）及与所述第一表面（310）相对的第二表面（320）。所述发热电子元件安装于所述电路板（30）的第一表面（310）。所述第一壳体（10）具有导热性，位于所述电路板（30）的第一表面（310）侧。所述第二壳体（20）具有导热性，位于所述电路板（30）的第二表面（320）侧。所述导热元件（520）导热性连接所述第一壳体（10）和所述发热电子元件。所述散热结构（50）导热性连接所述电路板（30）及所述第二壳体（20）。所述发热电子元件工作时产生的热量通过两条散热通道散发出去，提升了散热效率。

Description

具有散热结构的视觉传感装置 技术领域
本发明涉及散热技术，尤其涉及一种具有散热结构的视觉传感装置。
背景技术
随着电子技术的发展，芯片的集成化程度越来越高，芯片尺寸越来越小，芯片的热流密度也随之越来越高。当这些芯片应用到小型化的产品当中，产品内部狭小的空间结构，不利于芯片的散热。温度是影响芯片信赖性的关键因素，随着温度的升高，芯片的失效率会成几何倍数的关系增加。因此，如何快速有效地给芯片进行散热，是决定产品信赖性的重要因素。
目前，类似高热流密度、产品尺寸特别小的电子产品，如，视觉传感装置，受限于产品尺寸，无法使用风扇，而采用自然散热的方案，往往由于散热面积太小，散热效率不高。
发明内容
有鉴于此，有必要提供一种散热效率高的视觉传感装置。
本发明一实施例提供一种视觉传感装置，包括：
电路板，具有第一表面及与所述第一表面相对的第二表面；
发热电子元件，安装于所述电路板的第一表面；
第一壳体，具有导热性，其位于所述电路板的第一表面侧；
第二壳体，具有导热性，其位于所述电路板的第二表面侧；
导热元件，导热性连接所述第一壳体和所述发热电子元件；及
散热结构，导热性连接所述电路板及所述第二壳体。
进一步地，所述导热元件为导热膏层；
或/及，所述散热结构与所述电路板的第二表面的连接区域对应所述发热电子元件。
进一步地，所述第一壳体向所述发热电子元件方向凸伸有凸块，所述导热元件导热性连接所述发热电子元件和所述凸块。
进一步地，所述导热元件还导热性连接所述电路板和所述凸块。
进一步地，所述散热结构包括另一导热元件，所述另一导热元件为导热膏层。
进一步地，所述导热元件及所述另一导热元件分别为导热黏土层。
进一步地，所述散热结构还包括散热器，所述散热器位于所述另一导热元件和所述第二壳体之间。
进一步地，所述散热器侧向设有用于与所述另一导热元件接触的弧形凹口。
进一步地，所述散热器包括底座及从所述底座延伸出的多个散热片，所述底座接触所述另一导热元件。
进一步地，所述散热片接触所述第二壳体。
进一步地，所述散热器还包括从所述底座及所述散热片相对两端向外延伸的延伸部，所述延伸部具有固定件，所述固定件固定至所述电路板。
进一步地，所述散热器还包括从所述延伸部延伸出的压紧结构，所述第二壳体向所述散热器方向凸伸有出抵压板，所述抵压板向所述电路板方向抵压所述压紧结构。
进一步地，所述第一壳体开设有多个通气孔。
进一步地，所述视觉传感装置还包括图像摄取元件，所述第二壳体对应所述图像摄取元件开设有开口。
进一步地，所述散热结构位于所述图像摄取元件一侧。
本发明一实施例还提供一种视觉传感装置，包括：
电路板，具有第一表面及与所述第一表面相对的第二表面；
发热电子元件，安装于所述电路板的第一表面；
第一散热通道，结合至所述发热电子元件，且位于所述电路板第一表面的一侧；及
第二散热通道，结合至所述电路板的第二表面。
进一步地，所述第一散热通道包括结合至所述发热电子元件的第一导热元件及与所述第一导热元件导热性连接的第一壳体。
进一步地，所述第二散热通道与所述电路板的第二表面的结合区域对应所述发热电子元件；
或/及，所述第二散热通道包括结合至所述电路板的第二导热元件及与所 述第二导热元件导热性连接的第二壳体。
进一步地，所述第一壳体与所述第二壳体所述电路板及发热电子元件围绕其间，所述第一壳体及所述第二壳体为金属壳体或合金壳体。
进一步地，所述第一导热元件及所述第二导热元件为导热膏层。
进一步地，所述第一导热元件及所述第二导热元件为导热黏土层。
进一步地，所述第一壳体向所述发热电子元件方向凸伸有凸块，所述第一导热元件导热性连接所述发热电子元件和所述凸块。
进一步地，所述导热元件还导热性连接所述电路板和所述凸块。
进一步地，所述第二散热通道还包括位于所述第二导热元件与所述第二壳体之间的散热器。
进一步地，所述散热器侧向设有用于接触所述第二导热元件的弧形凹口。
进一步地，所述散热器包括底座及从所述底座延伸出的多个散热片，所述底座接触所述第二导热元件。
进一步地，所述散热片接触所述第二壳体。
进一步地，所述散热器还包括从所述底座及所述散热片相对两端向外延伸的延伸部，所述延伸部具有固定件，所述固定件固定至所述电路板。
进一步地，所述散热器还包括从所述延伸部延伸出的压紧结构，所述第二壳体向所述散热器方向凸伸有出抵压板，所述抵压板向所述电路板方向抵压所述压紧结构。
进一步地，所述第一壳体开设有多个通气孔；
或/及，所述视觉传感装置还包括图像摄取元件，所述第二壳体对应所述图像摄取元件开设有开口；
或/及，所述第一壳体及所述第二壳体为所述视觉传感装置的外壳。
相对于现有技术，所述发热电子元件的相对两侧都设有散热结构/通道，使得发热电子元件工作时产生的热量通过两条散热通道散发出去，提升了散热效率。
附图说明
图1是本发明一实施方式提供的具有散热结构的视觉传感装置的一立体 组装示意图。
图2是图1所示的视觉传感装置的另一角度的立体组装示意图。
图3是图1所示的视觉传感装置的立体分解示意图。
图4是图1所述的视觉传感装置的另一角度的立体分解示意图。
图5是图1所示的视觉传感装置的沿I-I线的剖面示意图。
图6是图5中V部分的放大示意图。
主要元件符号说明
第一壳体                       10
第一基板                       110
第一侧板                       120
通气孔                         130
凸块                           150
第二壳体                       20
第二基板                       210
开口                           211
第二侧板                       220
插孔                           230
抵压板                         250
电路板                         30
第一表面                       310
第二表面                       320
电子元器件                     40
芯片                           410
图像摄取元件                   430
散热结构                       50
散热器                         510
主体部                         511
底板                           5111
散热片                         5113
延伸部                         513
延伸臂                         5131
固定件                         5133
导热元件                       520
第一导热元件                   521
第二导热元件                   523
凹口                           530
压紧结构                       540
定位部                         541
弹性部                         543
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
需要说明的是，当组件被称为“固定于”另一个组件，它可以直接在另一个组件上或者也可以存在居中的组件。当一个组件被认为是“连接”另一个组件，它可以是直接连接到另一个组件或者可能同时存在居中组件。当一个组件被认为是“设置于”另一个组件，它可以是直接设置在另一个组件上或者可能同时存在居中组件。本文所使用的术语“垂直的”、“水平的”、“左”、“右”以及类似的表述只是为了说明的目的。
除非另有定义，本文所使用的所有的技术和科学术语与属于本发明的技术领域的技术人员通常理解的含义相同。本文中在本发明的说明书中所使用的术语只是为了描述具体的实施例的目的，不是旨在于限制本发明。本文所使用的术语“及/或”包括个或多个相关的所列项目的任意的和所有的组合。
请参阅图1至图4，本发明一实施方式提供一种视觉传感装置1。所述视觉传感装置1包括第一壳体10、与所述第一壳体10配合的第二壳体20、 电路板30、安装于所述电路板30的电子元器件40及用于为所述电子元器件40散热的散热结构50。所述电路板30、所述电子元器件40及所述散热结构50收容在所述第一壳体10及所述第二壳体20围绕的空间内。所述第一壳体10及所述第二壳体20分为位于所述电路板30的二相对两侧。一实施方式中，所述第一壳体10及所述第二壳体20为所述视觉传感装置1的外壳。
所述第一壳体10包括第一基板110及从所述第一基板110周缘向其一侧延伸的第一侧板120。本实施例中，所述第一基板110为方形。所述第一侧板120的数量为四个。其中二相对的第一侧板120开设有多个通气孔130。所述第一壳体10的为导热壳体，如金属壳体、合金壳体、导热碳纳米壳体等。本实施例中，所述第一壳体10的为铝合金壳体。所述第一壳体10还包括从所述第一基板110内表面朝向所述电子元器件40方向凸伸有凸块150。
所述第二壳体20包括第二基板210及从所述第二基板210周缘朝向所述第一壳体10延伸的第二侧板220。本实施例中，所述第二基板210为方形。所述第二侧板220的数量为四个。其中二相对的第二侧板220各开设有插孔230。所述第二壳体20的材料为导热壳体，如金属壳体、合金壳体、导热碳纳米壳体等。本实施例中，所述第二壳体20的为铝合金壳体。所述第二壳体20的第二基板210设有开口211。所述第二壳体20还包括从所述第二基板210向所述散热结构50方向延伸的抵压板250。
所述电路板30为板状结构，其具有朝向所述第一壳体10的第一表面310及朝向所述第二壳体20的第二表面320。本实施例中，所电路板30对应所述第一壳体10及第二壳体20的形状呈方形。
所述电子元器件40包括设于所述电路板30第一表面310上的芯片410。所述电子元器件40还包括图像摄取元件430，所述图像摄取元件430安装至所述电路板30的第二表面320。
所述散热结构50包括散热器510及多个导热元件520。一实施方式中，所述导热元件520为导热膏层。
所述散热器510位于所述电路板30第二表面320的一侧。所述散热器510二相对侧向各设一弧形凹口530。所述散热器510包括主体部511及从所述主体部511相对两侧端向外延伸出的延伸部513。
所述主体部511包括底板5111及从所述底板5111向一侧延伸的多个散 热片5113。一实施方式中，所述底板5111的中部的宽度小于其两端的宽度。本实施例中，所述底板5111的中部从前后两侧向中间凹入。
所述多个散热片5113相互间隔，相邻散热片5113间形成气流通道。所述多个散热片5113侧向呈弯弧形。对应所述底板5111中的散热片5113的长度小于对应所述底板5111两端的散热片5113的长度。
所述延伸部513具有从所述主体部511延伸出的二相对的延伸臂5131及位于所述延伸臂5131远离所述主体部511一端的多个固定件5133。
所述散热器510还包括压紧结构540。所述压紧结构540从对应的延伸部513远离所述主体部511一端延伸向所述主体部511。所述压紧结构540包括固定于所述延伸部513端部的定位部541及从所述定位部541向所述主体部511方向延伸的弹性部543。所述弹性部543为一弹片。所述压紧结构540的弹性部543与所述第二壳体20的抵压板250相对应。
所述多个导热元件520包括第一导热元件521及第二导热元件523。所述第一导热元件521位于所述电路板30的第一表面310与所述第一壳体10之间。所述第二导热元件523位于所述电路板30的第二表面320与所述散热器510的底板5111之间。一实施方式中，所述多个导热元件520为导热黏土层。
请参阅图5和图6，组装时，所述散热器510及所述第二壳体20置于所述电路板30的第二表面320一侧。所述第二导热元件523置于所述散热器510的底板5111和所述电路板30的第二表面320之间。所述散热器510的弧形凹口530对应安装于所述电路板30的图像摄取元件430(如图4所示)。所述图像摄取元件430对应所述第二壳体20的开口211(如图4所示)。所述散热器510通过所述固定件5133固定至所述电路板30的第二表面320。所述散热器510的散热片5113接触所述第二壳体20的第二基板210。所述第二壳体20的抵压板250向所述电路板30方向抵压所述散热器510的压紧结构540。所述第二导热元件523受所述散热器510的挤压而完全填充所述底板5111和所述电路板30的第二表面之间的间隙。所述第二导热元件523与所述电路板30的第二表面320的连接区域对应所述芯片410。所述第一壳体10及所述第一导热元件521置于所述电路板30的第一表面310一侧。所述第一导热元件521置于所述第一壳体10的凸块150与位于所述电路板30的 第一表面310上的芯片410之间。所述第一壳体10通过锁固件(图未示)固定到所述第二壳体20上，位于所述凸块150与所述芯片410之间的第一导热元件521受到挤压而完全填充所述凸块150与所述芯片410之间的间隙，且填充至所述芯片410两旁的所述电路板30的第一表面310与所述凸块150之间的间隙，所述芯片410被所述第一导热元件521完全包围在所述电路板30上。
当所述视觉传感装置1工作时，所述芯片410产生热量。一部分热量直接经由所述第一导热元件521传递至所述第一壳体10的凸块150，从而由所述第一壳体10散发到外界环境，从而，所述第一导热元件521、所述第一壳体10构成所述芯片410的第一散热通道。另一部分热量传递至所述电路板30，再经由所述第二导热元件523传递至所述散热器510的底板5111及散热片5113，部分热量直接由所述散热片5113散发出去，部分热量由所述散热片5113传递至所述第二壳体20而散发到外界环境，从而所述第二导热元件523、所述散热器510及所述第二壳体20构成所述芯片410的第二散热通道。
相对于现有技术，所述芯片410产生的热量一方面通过所述第一导热元件521一传导至第一壳体10上，然后通过所述第一壳体10散发到外界环境中，形成第一散热通道。另外，所述芯片410产生的热量也会传导至所述电路板30上，然后通过第二导热元件523跟所述散热器510连接，所述散热器510跟所述第二壳体20连接，形成第二散热通道。由于两条散热通道将热源夹在中间，极大的提高了散热效率，实验验证增加第二条散热通道之后可以比只有第一条散热通道提高散热效率50％以上。
另外，因为所述散热器510跟所述第二壳体20相连，热量最终传导至所述第二壳体20上面而散发到外界环境，将所述第二壳体20作为所述散热器510的一部分，增大了散热面积，提高了散热效率。
另外，所述导热元件520，特别当所述导热元件520为导热黏土层时，具备非常高的压缩特性，通过挤压可以完全填充所述芯片410、电路板30与所述第一壳体10之间、所述电路板30与所述散热器510之间存在的间隙，对所述芯片410和所述电路板30上面的其他电子元件形成完全的包围，达到浸入式散热的效果，进一步提高了散热效率。
可以理解地，所述第一导热元件521与所述第一壳体10之间还可设置另一散热器。
可以理解地，所述电路板30上的其他芯片也可采用所述的第一散热通道及第二散热通道进行散热。
可以理解地，所述导热元件520也可为内部填充有相变化介质的热管或导热板。
另外，对于本领域的普通技术人员来说，可以根据本发明的技术构思做出其它各种相应的改变与变形，而所有这些改变与变形都应属于本发明权利要求的保护范围。

Claims (30)

  1. 一种视觉传感装置，包括：
    电路板，具有第一表面及与所述第一表面相对的第二表面；
    发热电子元件，安装于所述电路板的第一表面；
    其特征在于：还包括：
    第一壳体，具有导热性，其位于所述电路板的第一表面侧；
    第二壳体，具有导热性，其位于所述电路板的第二表面侧；
    导热元件，导热性连接所述第一壳体和所述发热电子元件；及
    散热结构，导热性连接所述电路板及所述第二壳体。
  2. 如权利要求1所述的视觉传感装置，其特征在于：所述导热元件为导热膏层；
    或/及，所述散热结构与所述电路板的第二表面的连接区域对应所述发热电子元件。
  3. 如权利要求1所述的视觉传感装置，其特征在于：所述第一壳体向所述发热电子元件方向凸伸有凸块，所述导热元件导热性连接所述发热电子元件和所述凸块。
  4. 如权利要求3所述的视觉传感装置，其特征在于：所述导热元件还导热性连接所述电路板和所述凸块。
  5. 如权利要求1所述的视觉传感装置，其特征在于：所述散热结构包括另一导热元件，所述另一导热元件为导热膏层。
  6. 如权利要求5所述的视觉传感装置，其特征在于：所述导热元件及所述另一导热元件分别为导热黏土层。
  7. 如权利要求5所述的视觉传感装置，其特征在于：所述散热结构还包括散热器，所述散热器位于所述另一导热元件和所述第二壳体之间。
  8. 如权利要求7所述的视觉传感装置，其特征在于：所述散热器侧向设有用于与所述另一导热元件接触的弧形凹口。
  9. 如权利要求7所述的视觉传感装置，其特征在于：所述散热器包括底座及从所述底座延伸出的多个散热片，所述底座接触所述另一导热元件。
  10. 如权利要求9所述的视觉传感装置，其特征在于：所述散热片接触所 述第二壳体。
  11. 如权利要求9所述的视觉传感装置，其特征在于：所述散热器还包括从所述底座及所述散热片相对两端向外延伸的延伸部，所述延伸部具有固定件，所述固定件固定至所述电路板。
  12. 如权利要求11所述的视觉传感装置，其特征在于：所述散热器还包括从所述延伸部延伸出的压紧结构，所述第二壳体向所述散热器方向凸伸有出抵压板，所述抵压板向所述电路板方向抵压所述压紧结构。
  13. 如权利要求1所述的视觉传感装置，其特征在于：所述第一壳体开设有多个通气孔。
  14. 如权利要求1所述的视觉传感装置，其特征在于：所述视觉传感装置还包括图像摄取元件，所述第二壳体对应所述图像摄取元件开设有开口。
  15. 如权利要求14所述的视觉传感装置，其特征在于：所述散热结构位于所述图像摄取元件一侧。
  16. 一种视觉传感装置，包括：
    电路板，具有第一表面及与所述第一表面相对的第二表面；
    发热电子元件，安装于所述电路板的第一表面；
    其特征在于：还包括：
    第一散热通道，结合至所述发热电子元件，且位于所述电路板第一表面的一侧；及
    第二散热通道，结合至所述电路板的第二表面。
  17. 如权利要求16所述的视觉传感装置，其特征在于：所述第一散热通道包括结合至所述发热电子元件的第一导热元件及与所述第一导热元件导热性连接的第一壳体。
  18. 如权利要求17所述的视觉传感装置，其特征在于：
    所述第二散热通道与所述电路板的第二表面的结合区域对应所述发热电子元件；
    或/及，所述第二散热通道包括结合至所述电路板的第二导热元件及与所述第二导热元件导热性连接的第二壳体。
  19. 如权利要求18所述的视觉传感装置，其特征在于：所述第一壳体与所述第二壳体所述电路板及发热电子元件围绕其间，所述第一壳体及所述第 二壳体为金属壳体或合金壳体。
  20. 如权利要求19所述的视觉传感装置，其特征在于：所述第一导热元件及所述第二导热元件为导热膏层。
  21. 如权利要求20所述的视觉传感装置，其特征在于：所述第一导热元件及所述第二导热元件为导热黏土层。
  22. 如权利要求19所述的视觉传感装置，其特征在于：所述第一壳体向所述发热电子元件方向凸伸有凸块，所述第一导热元件导热性连接所述发热电子元件和所述凸块。
  23. 如权利要求22所述的视觉传感装置，其特征在于：所述导热元件还导热性连接所述电路板和所述凸块。
  24. 如权利要求19所述的视觉传感装置，其特征在于：所述第二散热通道还包括位于所述第二导热元件与所述第二壳体之间的散热器。
  25. 如权利要求24所述的视觉传感装置，其特征在于：所述散热器侧向设有用于接触所述第二导热元件的弧形凹口。
  26. 如权利要求24所述的视觉传感装置，其特征在于：所述散热器包括底座及从所述底座延伸出的多个散热片，所述底座接触所述第二导热元件。
  27. 如权利要求26所述的视觉传感装置，其特征在于：所述散热片接触所述第二壳体。
  28. 如权利要求24所述的视觉传感装置，其特征在于：所述散热器还包括从所述底座及所述散热片相对两端向外延伸的延伸部，所述延伸部具有固定件，所述固定件固定至所述电路板。
  29. 如权利要求28所述的视觉传感装置，其特征在于：所述散热器还包括从所述延伸部延伸出的压紧结构，所述第二壳体向所述散热器方向凸伸有出抵压板，所述抵压板向所述电路板方向抵压所述压紧结构。
  30. 如权利要求19所述的视觉传感装置，其特征在于：所述第一壳体开设有多个通气孔；
    或/及，所述视觉传感装置还包括图像摄取元件，所述第二壳体对应所述图像摄取元件开设有开口；
    或/及，所述第一壳体及所述第二壳体为所述视觉传感装置的外壳。
PCT/CN2016/104231 2015-11-30 2016-11-01 具有散热结构的视觉传感装置 Ceased WO2017092537A1 (zh)

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CN112804812A (zh) * 2020-12-28 2021-05-14 西南技术物理研究所 一种对插式电路板的锥角接触散热结构
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CN117881077A (zh) * 2024-03-12 2024-04-12 北京钧天航宇技术有限公司 一种一体化热控结构及有源设备
CN117881077B (zh) * 2024-03-12 2024-05-28 北京钧天航宇技术有限公司 一种一体化热控结构及有源设备

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