WO2017077966A1 - 微細多孔板の製造方法 - Google Patents

微細多孔板の製造方法 Download PDF

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Publication number
WO2017077966A1
WO2017077966A1 PCT/JP2016/082212 JP2016082212W WO2017077966A1 WO 2017077966 A1 WO2017077966 A1 WO 2017077966A1 JP 2016082212 W JP2016082212 W JP 2016082212W WO 2017077966 A1 WO2017077966 A1 WO 2017077966A1
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WO
WIPO (PCT)
Prior art keywords
plate
hole
unevenness
manufacturing
pressing
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Application number
PCT/JP2016/082212
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English (en)
French (fr)
Japanese (ja)
Inventor
伊知郎 山極
明男 杉本
善三 山口
Original Assignee
株式会社神戸製鋼所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 株式会社神戸製鋼所 filed Critical 株式会社神戸製鋼所
Priority to CN201680059543.8A priority Critical patent/CN108352154B/zh
Publication of WO2017077966A1 publication Critical patent/WO2017077966A1/ja

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    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general

Definitions

  • the present invention relates to a method for producing a fine porous plate used as a sound absorbing material.
  • the drilling method described in Patent Document 1 is a method of suitably making a fine hole of about ⁇ 0.1 mm in a metal foil (for example, aluminum foil) having a thickness of about 0.1 mm. While inserting the metal foil between the metal roll and the receiving roll, fine holes are made in the metal foil by the protrusions provided on the surface of the metal roll. In order to make fine holes, the height of the protrusion, the rising angle of the protrusion from the roll surface, and the like are defined. According to the drilling method described in Patent Document 1, a fine hole with a diameter of 0.1 mm or less can be suitably formed in a metal foil with a thickness of 0.1 mm or less.
  • fine holes with a diameter of 0.1 mm or less can be formed in a metal material.
  • it is a metal foil having a thickness of 0.1 mm or less that is suitably perforated by this method.
  • Perforated plate sound absorption is based on the principle that sound is attenuated in the process of sound propagation in the hole, and if the metal material is thin, the rigidity is low, so the manufactured micro perforated plate (micro perforated foil) absorbs sound. When used as a material, the sound absorption performance cannot be exhibited efficiently due to the vibration of the foil. Further, since the fine porous plate (fine porous foil) does not stand by itself, there is a problem that it is difficult to form a sound absorbing structure.
  • a fine porous plate described in Patent Document 2 obtained by embossing a metal plate having a thickness of 0.1 mm or more thicker than a so-called foil is suitably used as a sound absorbing material. This is because the microporous plate has higher plate rigidity.
  • the diameter of the hole obtained by the embossing method described in Patent Document 2 is about 0.1 mm, and the sound absorption performance is higher in the sound absorption of the perforated plate where the finer the hole, the higher the sound absorption rate. There is a limit.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a fine porous plate capable of forming finer holes than before in a plate material having a certain thickness of about 0.1 mm or more. It is to provide a manufacturing method.
  • the manufacturing method of the micro perforated plate according to the present invention is such that a porous plate having a plurality of holes and having unevenness is pressed in a direction intersecting with the direction in which the unevenness repeats, and the height of the unevenness is lower than before pressing. It is characterized in that the holes made in the perforated plate are made smaller by plastic deformation.
  • FIG. 3A shows one blade part of the outer peripheral surface of the embossing roller is shown together. It is a cross-sectional schematic diagram which shows a deformation
  • FIG. 3A It is a cross-sectional schematic diagram which shows a deformation
  • the embossing rollers 1 and 2 shown in FIG. 1 are, for example, one embossing roller 1 fixed in a state of being rotatable around an axis, and the other embossing roller 2 being opposed to the embossing roller 2 in a state of being rotatable around an axis. 1 is pressed against.
  • Concave and convex patterns 3 are formed on the outer peripheral surfaces of the embossing rollers 1 and 2, respectively.
  • corrugated pattern 3 is comprised by the some blade part 3a of a quadrangular pyramid shape.
  • FIG. 2B is a diagram linearly showing the meshing state of the blade portions 3 a constituting the concavo-convex pattern 3.
  • the shape of the blade part 3a is not limited to a quadrangular pyramid shape.
  • FIG. 3A is an enlarged schematic view of an A portion in FIG. 3A showing one blade portion 3a on the outer peripheral surface of the embossing rollers 1 and 2 together.
  • a hole 6 having an equivalent hole diameter Dmm is formed by embossing at the top 7a (vertex portion) of the convex portion 7 (which is also a concave portion when the vertical view is changed).
  • the equivalent hole diameter is a hole diameter when the hole is circular, and the equivalent hole diameter is calculated from the opening area of the hole.
  • the thickness t of the metal plate 4 is, for example, about 0.1 to 0.3 mm.
  • the plate thickness t of the metal plate 4 may be less than 0.1 mm, but the rigidity becomes low.
  • the metal plate 4 having a thickness t exceeding 0.3 mm may be used, but in this case, the pressing force between the embossing rollers 1 and 2, the material of the blade 3 a, and the sharpness of the tip thereof are considered. This is more necessary than when the thickness t is small.
  • the material of the metal plate 4 is, for example, aluminum, an aluminum alloy, or stainless steel.
  • the porous plate 5 is plastically deformed so that the height H of the unevenness (see FIG. 3A) becomes lower than before pressing by pressing the porous plate 5 in a direction intersecting with the direction D (see FIG. 3A) where the unevenness repeats. By doing so, the hole 6 opened in the top part 7a is made small. Thereby, a fine porous plate is formed.
  • the porous plate 5 shown in FIG. 3A is set between the molds 8 and 9 having a flat pressing surface, and the upper mold 9 is lowered to form the porous plate 5. Press.
  • the porous plate 5 is pressed in a direction orthogonal to the direction D in which the unevenness repeats (in a direction orthogonal to the porous plate 5 when the porous plate 5 is viewed in macro (not considering the unevenness))
  • the pressing direction may be an oblique direction instead of the orthogonal direction.
  • the height of the convex portion 7 (which is also a concave portion if the vertical direction is changed) becomes low, and the hole 6 becomes small accordingly.
  • the larger the amount of reduction by pressing (H1, H2, H3) the smaller the equivalent hole diameter (D1, D2, D3) of the hole 6.
  • the sound absorption performance can be controlled by adjusting the perforation pitch and the perforation diameter in the perforated plate forming step and adjusting the reduction amount in the subsequent pore reduction step.
  • FIG. 5 shows the sound absorption coefficient of a perforated plate (comparative example) in which many small holes are made by embossing, and the fine perforated plate (example) in which the perforated plate according to the comparative example is pressed to reduce the holes. It is a graph which shows a sound absorption coefficient.
  • the hole diameter of the porous plate according to the comparative example is ⁇ 0.1 mm, and the aperture ratio is 1.2%.
  • the fine porous plate according to the example has a hole diameter of ⁇ 0.08 mm and an aperture ratio of 0.79%.
  • the plate thickness was 0.1 mm, and the thickness of the back air layer was 40 mm.
  • the fine perforated plate ( ⁇ 0.08 mm-0.79%) in which the perforated plate ( ⁇ 0.1 mm-1.2%) according to the comparative example is pressed to reduce the pores is 315 Hz. Sound absorption performance is improved in all frequency bands up to 3150 Hz.
  • FIG. 6 shows the sound absorption coefficient of a perforated plate (comparative example) in which a large number of small holes are formed by embossing, and a plurality of fine pores that are made smaller by pressing the perforated plate according to the comparative example while changing the amount of reduction. It is a graph which shows the sound absorption rate of a perforated panel (Example).
  • the hole diameter of the perforated plate according to the comparative example is ⁇ 0.14 mm, and the aperture ratio is 2.06%.
  • the pore diameter of the fine porous plate according to the example and the aperture ratio are ⁇ 0.11 mm, 1.13%, ⁇ 0.09 mm, 0.86%, ⁇ 0.08 mm, 0.55% in order from the smallest reduction amount. It is.
  • the plate thickness was 0.1 mm, and the thickness of the back air layer was 40 mm.
  • a micro perforated plate ( ⁇ 0.11 mm—1.13%, ⁇ 0.09 mm-0) in which the perforated plate according to the comparative example ( ⁇ 0.14 mm ⁇ 2.06%) was pressed to reduce the pores. .86%, ⁇ 0.08 mm-0.55%) improves the sound absorption performance over the perforated plate according to the comparative example in all frequency bands of 315 Hz to 3150 Hz. Moreover, the sound absorption performance is higher when the amount of reduction is larger and the holes are made finer.
  • a perforated plate is formed by forming holes in the top and bottom of the unevenness by forming an unevenness in the plate material by embossing while locally breaking the plate material. Then, by forming a hole in the plate with a needle having a pointed tip (needle-like object), the porous plate may be formed by forming holes in the plate and simultaneously forming holes in the apex portions of the bumps. In this case, unevenness is formed on the plate material by the force of pressing the needle-like object against the plate material. Using a drilling tool such as a sword mountain in which a plurality of needle-like objects are arranged vertically and horizontally at a drilling pitch, the drilling is relatively easy.
  • the irregularities formed on the porous plate are staggered irregularities.
  • “corrugated” irregularities may be used.
  • As a processing method for forming “corrugated” irregularities there is a method called corrugating.
  • the holes are formed at the same time as the irregularities are formed in the plate material.
  • the holes may be formed in the plate material after the holes are formed in the plate material, or the holes may be formed in the plate material after the irregularities are formed in the plate material. May be.
  • a hole 6 may be formed in the oblique portion 7b of the convex portion 7 (which is a concave portion if the vertical view is changed). Even if the hole 6 is made in the oblique portion 7b, the hole 6 becomes smaller when the perforated plate 5 is pressed in the direction intersecting the direction D (see FIG. 3A) where the unevenness repeats and the convex portion 7 is crushed.
  • the press surfaces of the molds 8 and 9 partially shown in FIGS. 4A and 4B are assumed to be flat surfaces (the entire perforated plate 5 is pressed with a uniform reduction amount)
  • a step is provided on one press surface of the molds 8 and 9, and a portion where the distance between the press surface of the mold 8 and the press surface of the mold 9 facing the mold 8 is different is provided.
  • the pressing amount may be varied in the porous plate.
  • a plurality of perforated plates 5 may be stacked and pressed together (pressing). By doing so, the productivity of the fine porous plate is improved.
  • the perforated plate 5 As a method of pressing the perforated plate 5, the perforated plate 5 is sandwiched between a pair of rollers, in addition to the above-described pressing process in which the perforated plate 5 is sandwiched between the molds 8 and 9 and pressed. There is a method of pressing while feeding.
  • a porous plate having a plurality of holes and having unevenness is pressed in a direction intersecting with the direction in which the unevenness is repeated, so that the height of the unevenness is lower than before pressing. In this way, the hole 6 formed in the perforated plate is made small by plastic deformation.
  • a plate material having a certain thickness can be easily processed (hole refinement processing). That is, according to the present invention, a finer hole can be easily formed in a plate material having a certain thickness of about 0.1 mm or more.
  • the embossing while locally cleaving the plate material or the needle punching process of making a hole in the plate material with a needle-like material forms the irregularities in the plate material and at the same time opens the holes at the apex portions of the irregularities, and the porous A perforated plate forming step for forming a plate, and pressing the perforated plate in a direction intersecting with the direction in which the unevenness repeats and plastically deforming so that the height of the unevenness is lower than before pressing, thereby opening the apex portion. It is preferable to provide a hole reduction step for reducing the formed holes.
  • the reduction amount of the hole can be predicted more easily than when the holes made at other parts are made smaller. This makes it easy to control the sound absorption performance.
  • the plate material around the hole is partially overlapped in the hole reduction step.
  • the rigidity around the hole is increased, the structural damping performance of the porous plate is improved, and the plate is less likely to vibrate.
  • the sound absorption efficiency in the porous portion is improved. That is, the sound absorbing performance of the fine porous plate is improved.
  • the perforated plate In order to make it easier to overlap the plate material around the holes, it is preferable to press the perforated plate in a direction orthogonal to the direction in which the unevenness is repeated in the hole reduction step.
  • the amount of pressing may be varied in the porous plate.
  • the equivalent hole diameter of the holes can be easily made different in one porous plate 5, and noise in a wide frequency band can be reduced.
  • the sound absorbing characteristics can be enhanced by making the pores of the porous sound absorbing plate smaller, and it can also be applied to a thick plate material having a thickness of 0.1 mm or more.
PCT/JP2016/082212 2015-11-05 2016-10-31 微細多孔板の製造方法 WO2017077966A1 (ja)

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CN201680059543.8A CN108352154B (zh) 2015-11-05 2016-10-31 微细多孔板的制造方法

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JP2015217280A JP6560593B2 (ja) 2015-11-05 2015-11-05 微細多孔板の製造方法
JP2015-217280 2015-11-05

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KR20210073642A (ko) * 2019-12-10 2021-06-21 현대자동차주식회사 타공판재 및 이를 이용한 흡차음 복합판재
JP2021165774A (ja) * 2020-04-06 2021-10-14 株式会社ヒロタニ 車両用遮熱防音材

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JPH10303355A (ja) * 1997-04-28 1998-11-13 Mitsui High Tec Inc 半導体装置
JP2002332073A (ja) * 2001-05-08 2002-11-22 Rootarii Kk 微小穿孔シート
JP2008138505A (ja) * 2006-11-02 2008-06-19 Kobe Steel Ltd 吸音構造体

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EP1111441B1 (en) * 1997-06-12 2009-12-02 Sharp Kabushiki Kaisha Vertically-aligned (VA) liquid crystal display device
JP2001009883A (ja) * 1999-06-29 2001-01-16 Kuraray Co Ltd 射出成形法
JP4117740B2 (ja) * 2002-12-17 2008-07-16 日立マクセル株式会社 金属多孔体とその製造方法
JP4291760B2 (ja) * 2003-09-05 2009-07-08 株式会社神戸製鋼所 吸音構造体およびその製造方法
CN101027184B (zh) * 2004-09-29 2011-07-06 大日本印刷株式会社 低光泽金属光泽装饰板及对其叠层而成的叠层物
JP5498474B2 (ja) * 2011-12-14 2014-05-21 花王株式会社 積層不織布の製造方法
CN104411494B (zh) * 2012-06-20 2016-06-08 三菱丽阳株式会社 层叠体的制造方法、层叠体、微细凹凸结构体以及保护薄膜

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10303355A (ja) * 1997-04-28 1998-11-13 Mitsui High Tec Inc 半導体装置
JP2002332073A (ja) * 2001-05-08 2002-11-22 Rootarii Kk 微小穿孔シート
JP2008138505A (ja) * 2006-11-02 2008-06-19 Kobe Steel Ltd 吸音構造体

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CN108352154A (zh) 2018-07-31
CN108352154B (zh) 2022-04-08
JP6560593B2 (ja) 2019-08-14

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